Semiconductor stack production line

Abstract

The application provides a semiconductor laminating production line, which comprises a supporting frame, a conveying mechanism, a glue sticking device, a pressing mechanism, a turnover conveying mechanism, a film tearing mechanism and a discharging mechanism, the conveying mechanism, the glue sticking device, the pressing mechanism, the turnover conveying mechanism, the film tearing mechanism and the discharging mechanism are fixedly connected to the upper surface of the supporting frame, the glue sticking device and the pressing mechanism are arranged side by side, the glue sticking device and the pressing mechanism are located at one end of the conveying mechanism and are connected with the conveying mechanism, the turnover conveying mechanism is located at one side of the pressing mechanism and is connected with the pressing mechanism, the film tearing mechanism is located at one end of the turnover conveying mechanism and is connected with the turnover conveying mechanism, and the discharging mechanism is located at one side of the film tearing mechanism and is connected with the film tearing mechanism. The semiconductor laminating production line can automatically laminate semiconductor plates, saves the production cost of labor, solves the uncertainty caused by manual production, improves the production efficiency of the production line through automatic production, and is favorable for popularization.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, in particular to a semiconductor laminating production line. BACKGROUND

[0002] Semiconductor refers to the material with the electrical conductivity between conductor and insulator at room temperature, and the semiconductor is applied in the fields of integrated circuit, consumer electronics, communication system, photovoltaic power generation, illumination, high-power power conversion, etc.

[0003] When processing some specific semiconductor products, two pieces of semiconductor plate materials need to be laminated to form a double-layer semiconductor product. During the laminating production of the semiconductor plate materials, the semiconductor plate materials are first glued and then laminated, and then are placed on a hot press for hot pressing, and finally the surface protective film is torn off. Such a process is time-consuming and laborious if completed manually, and the quality and efficiency of completion also depend on the proficiency of workers, and the automation degree is not high. For enterprises, high labor cost and unstable production efficiency are not conducive to long-term development of enterprises.

[0004] Therefore, it is necessary to provide a semiconductor laminating production line to improve the automation degree of the semiconductor plate materials during the laminating production. SUMMARY

[0005] In order to solve the above problems, the present application provides a semiconductor laminating production line to improve the automation degree of the semiconductor plate materials during the laminating production.

[0006] The present application is realized by the following technical scheme:

[0007] The present application provides a semiconductor laminating production line, which comprises a supporting frame, a conveying mechanism, a glue sticking device, a pressing mechanism, a turnover conveying mechanism, a film tearing mechanism and a discharging mechanism. The conveying mechanism, the glue sticking device, the pressing mechanism, the turnover conveying mechanism, the film tearing mechanism and the discharging mechanism are all fixedly connected to the upper surface of the supporting frame. The glue sticking device and the pressing mechanism are arranged side by side. The glue sticking device and the pressing mechanism are located at one end of the conveying mechanism and are connected to the conveying mechanism. The turnover conveying mechanism is located at one side of the pressing mechanism and is connected to the pressing mechanism. The film tearing mechanism is located at one end of the turnover conveying mechanism and is connected to the turnover conveying mechanism. The discharging mechanism is located at one side of the film tearing mechanism and is connected to the film tearing mechanism.

[0008] Further, the conveying mechanism comprises a first conveying device and a second conveying device, the first conveying device and the second conveying device are arranged side by side on the upper surface of the support frame, the adhesive device is located at one end of the first conveying device and is connected with the first conveying device, and the pressing mechanism is located at one end of the second conveying device and is connected with the second conveying device.

[0009] Further, the length of the first conveying device is less than the length of the second conveying device.

[0010] Further, the pressing mechanism comprises a stacking device and a hot pressing device, the stacking device is located on one side of the hot pressing device and is connected with the hot pressing device, the stacking device is located at one end of the second conveying device and is located on one side of the adhesive device, the stacking device is connected with the second conveying device and the adhesive device respectively, and the hot pressing device is connected with the turnover conveying mechanism.

[0011] Further, the stacking device comprises an adsorption transportation station and a stacking station, the adsorption transportation station is located on one side of the stacking station, the adsorption transportation station is located on one side of the adhesive device and is connected with the adhesive device, and the stacking station is located between the second conveying device and the hot pressing device.

[0012] Further, the adsorption transportation station comprises an adsorption mechanical arm and a first conveying platform, the adsorption mechanical arm is located above the first conveying platform, and the first conveying platform is connected with the adhesive device.

[0013] Further, the turnover conveying mechanism comprises a turnover device and a receiving device, one end of the turnover device is located at one end of the receiving device and is connected with the receiving device, the other end of the turnover device is close to the pressing mechanism and is connected with the pressing mechanism, and the other end of the receiving device extends below the film tearing mechanism.

[0014] Further, the discharging mechanism comprises a tape cutting device, an adsorption stacking device and a detection mechanism, the tape cutting device is located on one side of the film tearing mechanism, the adsorption stacking device is connected with the tape cutting device, the line connecting the tape cutting device and the adsorption stacking device is perpendicular to the line connecting the tape cutting device and the film tearing mechanism, and the detection mechanism is located on one side of the tape cutting device and is connected with the tape cutting device.

[0015] Further, the tape cutting device comprises a fixing frame, a second conveying platform and a cutting device, the fixing frame is located on one side of the film tearing mechanism, the cutting device is fixedly connected above the fixing frame, and the second conveying platform is located below the cutting device and is connected with the film tearing mechanism.

[0016] Further, the detection mechanism comprises a laser engraving machine, a code scanning detection device and a parking box, which are arranged in sequence and connected at the ends.

[0017] The present application has the following advantages:

[0018] The semiconductor laminating production line comprises a supporting frame, a conveying mechanism, a glue sticking device, a pressing mechanism, a turnover conveying mechanism, a film tearing mechanism and a discharging mechanism, which are fixedly connected to the upper surface of the supporting frame, the glue sticking device and the pressing mechanism are arranged side by side, the glue sticking device and the pressing mechanism are located at one end of the conveying mechanism and are connected with the conveying mechanism, the turnover conveying mechanism is located at one side of the pressing mechanism and is connected with the pressing mechanism, the film tearing mechanism is located at one end of the turnover conveying mechanism and is connected with the turnover conveying mechanism, and the discharging mechanism is located at one side of the film tearing mechanism and is connected with the film tearing mechanism. When the semiconductor laminating production is carried out, two semiconductor plates are placed side by side on the conveying mechanism, one semiconductor plate is sent into the glue sticking device for glue sticking, another semiconductor plate and the semiconductor plate with glue are sent into the pressing mechanism for contact stacking and hot pressing, when the two semiconductor plates are hot-pressed into a double-layer semiconductor, the turnover conveying mechanism turns over by 180 degrees and sends the double-layer semiconductor to below the film tearing mechanism, the film tearing mechanism tears off the protective film originally attached to the double-layer semiconductor, the discharging mechanism cuts the adhesive tape on the outer frame fixing the double-layer semiconductor, the original form is that the outer frame fixes the semiconductor plate in the center by the adhesive tape, after the adhesive tape is cut, the double-layer semiconductor only has a center part, then the outer frame is adsorbed and stacked, the double-layer semiconductor is laser coded, and after code scanning detection, the double-layer semiconductor is discharged and placed. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a whole schematic view of the semiconductor laminating production line.

[0020] Figure 2 It is another angle schematic view of the semiconductor laminating production line.

[0021] Figure 3 It is a three-dimensional schematic view of the semiconductor laminating production line.

[0022] Figure 4 It is Figure 1A partial enlarged view of the reference sign A;

[0023] Figure 5 For Figure 1 A partial enlarged view of the reference sign B. DETAILED DESCRIPTION

[0024] In order to more clearly and completely illustrate the technical solutions of the present application, the present application will be further described below with reference to the drawings.

[0025] Please refer to Figures 1-5 The present application provides a semiconductor laminating production line, which comprises a support frame 1, a conveying mechanism 2, a glue sticking device 3, a pressing mechanism 4, a turnover conveying mechanism 5, a film tearing mechanism 6, and a discharging mechanism 7. The conveying mechanism 2, the glue sticking device 3, the pressing mechanism 4, the turnover conveying mechanism 5, the film tearing mechanism 6, and the discharging mechanism 7 are all fixedly connected to the upper surface of the support frame 1. The glue sticking device 3 and the pressing mechanism 4 are arranged side by side. The glue sticking device 3 and the pressing mechanism 4 are both located at one end of the conveying mechanism 2 and are both connected to the conveying mechanism 2. The turnover conveying mechanism 5 is located at one side of the pressing mechanism 4 and is connected to the pressing mechanism 4. The film tearing mechanism 6 is located at one end of the turnover conveying mechanism 5 and is connected to the turnover conveying mechanism 5. The discharging mechanism 7 is located at one side of the film tearing mechanism 6 and is connected to the film tearing mechanism 6.

[0026] In the present embodiment:

[0027] The support frame 1 is used to provide a stable support structure for the conveying mechanism 2, the glue sticking device 3, the pressing mechanism 4, the turnover conveying mechanism 5, the film tearing mechanism 6, and the discharging mechanism 7.

[0028] The conveying mechanism 2 is used to continuously convey two semiconductor plate materials. One semiconductor plate material is first sent to the glue sticking device 2, and after the glue sticking of the semiconductor plate material is completed, the other semiconductor plate material is then sent to the pressing mechanism 4.

[0029] The glue sticking device 3 is used to uniformly glue the surface of the semiconductor plate material.

[0030] The pressing mechanism 4 is used to stack and hot-press one semiconductor plate material that has been glued with another semiconductor plate material into a double-layer semiconductor.

[0031] The turnover conveying mechanism 5 is used to turn the double-layer semiconductor that has been hot-pressed by 180 degrees and send it to below the film tearing mechanism 6.

[0032] The film tearing mechanism 6 is used to tear off the protective film on the upper surface of the double-layer semiconductor that has been turned over.

[0033] The discharging mechanism 7 is used to discharge and arrange the finished double-layer semiconductor.

[0034] Specifically, when the semiconductor plate material is laminated and produced, two semiconductor plate materials are placed side by side on the conveying mechanism 2, the conveying mechanism 2 sends one semiconductor plate material to the adhesive device 3 for gluing, after the semiconductor plate material is glued, the other semiconductor plate material and the glued plate material are sent to the pressing mechanism 4 for contact stacking and hot pressing, when the two semiconductor plate materials are hot-pressed into a double-layer semiconductor, the turnover conveying mechanism 5 is turned over by 180 degrees and conveyed to the film tearing mechanism 6 below, the film tearing mechanism 6 tears off the protective film originally attached to the double-layer semiconductor, and then the adhesive tape cutting device 71 in the discharging mechanism 7 cuts the adhesive tape on the outer frame that fixes the double-layer semiconductor, the original form is that the outer frame fixes the semiconductor plate material in the center by adhesive tape, after the adhesive tape is cut, the double-layer semiconductor only has the center part, then the adsorption stacking device 72 adsorbs and stacks the outer frame, and the laser engraving machine 731 laser marks the double-layer semiconductor, and after code scanning detection, the double-layer semiconductor can be discharged and placed in the parking box 733;

[0035] In summary, the semiconductor laminated production line can automatically laminate and produce semiconductor plate materials, save labor costs, solve the uncertainty brought by manual production, and improve the production efficiency of the production line through automatic production, which is conducive to promotion.

[0036] Further, the conveying mechanism 2 includes a first conveying device 21 and a second conveying device 22, the first conveying device 21 and the second conveying device 22 are arranged side by side on the upper surface of the support frame 1, the adhesive device 3 is located at one end of the first conveying device 21 and connected with the first conveying device 22, and the pressing mechanism 4 is located at one end of the second conveying device 22 and connected with the second conveying device 22; the length of the first conveying device 21 is less than the length of the second conveying device 22.

[0037] In the embodiment:

[0038] The first conveying device 21 is used to continuously convey one semiconductor plate material to the adhesive device 3;

[0039] The second conveying device 22 is used to continuously convey one semiconductor plate material to the pressing mechanism 4.

[0040] Further, the pressing mechanism 4 comprises a stacking device 41 and a hot-pressing device 42. The stacking device 41 is located on one side of the hot-pressing device 42 and is connected with the hot-pressing device 42. The stacking device 41 is located on one end of the second conveying device 22 and is located on one side of the glue sticking device 3. The stacking device 41 is connected with the second conveying device 22 and the glue sticking device 3 respectively. The hot-pressing device 42 is connected with the turnover conveying mechanism 5. The stacking device 41 comprises a suction conveying station 411 and a stacking station 412. The suction conveying station 411 is located on one side of the stacking station 412. The suction conveying station 411 is located on one side of the glue sticking device 3 and is connected with the glue sticking device 3. The stacking station 412 is located between the second conveying device 22 and the hot-pressing device 42. The suction conveying station 411 comprises a suction mechanical arm 4111 and a first conveying platform 4112. The suction mechanical arm 4111 is located above the first conveying platform 4112. The first conveying platform 4112 is connected with the glue sticking device 3.

[0041] In the embodiment,

[0042] The stacking device 41 is used for stacking two semiconductor plate materials. The side with the glue is used as the sticking side.

[0043] The suction conveying station 411 is used for sucking and moving the semiconductor plate material with glue to the stacking device 41.

[0044] The suction mechanical arm 4111 is used for sucking and placing the semiconductor plate material with glue in the glue sticking device 3 on the first conveying platform 4112.

[0045] The first conveying platform 4112 is used for conveying the semiconductor plate material with glue to the stacking device 41.

[0046] The stacking station 412 is used for stacking one semiconductor plate material with glue and another semiconductor plate material without glue. After stacking, the semiconductor plate materials are moved to the hot-pressing device 42.

[0047] The hot-pressing device 42 is used for hot-pressing two stacked semiconductor plate materials into a double-layer semiconductor.

[0048] Specifically, after the glue is stuck on one semiconductor plate material, the suction mechanical arm 4111 sucks and places the semiconductor plate material with glue on the first conveying platform 4112. The first conveying platform 4112 conveys the semiconductor plate material with glue to the stacking device 41. The stacking station 412 stacks one semiconductor plate material with glue and another semiconductor plate material without glue. After stacking, the semiconductor plate materials are moved to the hot-pressing device 42. The hot-pressing device 42 hot-presses two stacked semiconductor plate materials into a double-layer semiconductor.

[0049] Further, the turnover conveying mechanism 5 comprises a turnover device 51 and a receiving device 52, one end of the turnover device 51 is located at one end of the receiving device 52 and is connected with the receiving device 52, the other end of the turnover device 51 is close to the pressing mechanism 4 and is connected with the pressing mechanism 4, and the other end of the receiving device 52 extends to below the film tearing mechanism 6.

[0050] In the embodiment,

[0051] The turnover device 51 is used for turning over the double-layer semiconductor by 180 degrees, and turning over the bottom with the protective film to the upper surface;

[0052] The receiving device 52 is used for conveying the double-layer semiconductor turned over by 180 degrees to below the film tearing mechanism 6.

[0053] Further, the blanking mechanism 7 comprises a tape cutting device 71, an adsorption stacking device 72 and a detection mechanism 73, the tape cutting device 71 is located at one side of the film tearing mechanism 6, the adsorption stacking device 72 is connected with the tape cutting device 71, the line connecting the tape cutting device 71 and the adsorption stacking device 72 is perpendicular to the line connecting the tape cutting device 71 and the film tearing mechanism 6, and the detection mechanism 73 is located at one side of the tape cutting device 71 and is connected with the tape cutting device 71; the tape cutting device 71 comprises a fixed frame 711, a second conveying platform 712 and a cutting device 713, the fixed frame 711 is located at one side of the film tearing mechanism 6, the cutting device 713 is fixedly connected above the fixed frame 711, and the second conveying platform 712 is located below the cutting device 713 and is connected with the film tearing mechanism 6; the detection mechanism 73 comprises a laser engraving machine 731, a code scanning detection device 732 and a parking box 733, the laser engraving machine 731, the code scanning detection device 732 and the parking box 733 are arranged in sequence and connected at the ends, and the laser engraving machine 731 is located at one side of the tape cutting device 71 and is connected with the tape cutting device 71.

[0054] In the embodiment,

[0055] The tape cutting device 71 is used for cutting the tape outside the double-layer semiconductor and inside the outer frame;

[0056] The fixed frame 711 is used for providing a stable support structure for the cutting device 713;

[0057] The second conveying platform 712 is used for conveying the double-layer semiconductor after the film is torn in the film tearing mechanism 6 to below the cutting device 713;

[0058] The cutting device 713 is used for cutting the tape for fixing the double-layer semiconductor;

[0059] The adsorption stacking device 72 is used for adsorbing and carrying the outer frame of the double-layer semiconductor to a stacking area for stacking;

[0060] The detection mechanism 73 is used for detecting the double-layer semiconductor after the adhesive tape is cut;

[0061] The laser engraving machine 731 is used for laser coding on the surface of the double-layer semiconductor;

[0062] The code scanning detection device 732 is used for detecting the double-layer semiconductor after laser coding and counting into the inventory data;

[0063] The parking box 733 is used for parking the double-layer semiconductor after code scanning detection;

[0064] Specifically, after the film of the double-layer semiconductor is torn, the adhesive tape cutting device 71 cuts the adhesive tape on the periphery of the double-layer semiconductor and inside the outer frame. After the adhesive tape is cut, the double-layer semiconductor is separated from the outer frame. The adsorption and stacking device 72 adsorbs and carries the outer frame of the double-layer semiconductor to the stacking area for stacking. The laser engraving machine 731 performs laser coding on the surface of the double-layer semiconductor. The code scanning detection device 732 detects the double-layer semiconductor after laser coding and counts into the inventory data. The double-layer semiconductor after code scanning into the warehouse is transported to the parking box 733 to wait for unloading.

[0065] Of course, the present application can have other various embodiments. Based on the embodiments, other embodiments obtained by those skilled in the art without any creative labor fall within the scope of the present application.

Claims

1. A semiconductor stack production line, characterized by, The application relates to a supporting frame, a conveying mechanism, a glue sticking device, a pressing mechanism, a turnover conveying mechanism, a film tearing mechanism and a discharging mechanism, wherein the conveying mechanism, the glue sticking device, the pressing mechanism, the turnover conveying mechanism, the film tearing mechanism and the discharging mechanism are fixedly connected to the upper surface of the supporting frame, the glue sticking device and the pressing mechanism are arranged side by side, the glue sticking device and the pressing mechanism are located at one end of the conveying mechanism and are connected with the conveying mechanism, the turnover conveying mechanism is located at one side of the pressing mechanism and is connected with the pressing mechanism, the film tearing mechanism is located at one end of the turnover conveying mechanism and is connected with the turnover conveying mechanism, and the discharging mechanism is located at one side of the film tearing mechanism and is connected with the film tearing mechanism; the conveying mechanism comprises first conveying devices and second conveying devices, the first conveying devices and the second conveying devices are arranged side by side on the upper surface of the supporting frame, the glue sticking device is located at one end of the first conveying device and is connected with the first conveying device, and the pressing mechanism is located at one end of the second conveying device and is connected with the second conveying device; the pressing mechanism comprises a superposition device and a hot pressing device, the superposition device is located at one side of the hot pressing device and is connected with the hot pressing device, the superposition device is located at one end of the second conveying device and is located at one side of the glue sticking device, the superposition device is connected with the second conveying device and the glue sticking device respectively, and the hot pressing device is connected with the turnover conveying mechanism; the superposition device comprises an adsorption conveying station and a stacking station, the adsorption conveying station is located at one side of the stacking station, the adsorption conveying station is located at one side of the glue sticking device and is connected with the glue sticking device, and the stacking station is located between the second conveying device and the hot pressing device.

2. The semiconductor laminate production line according to claim 1, characterized by The length of the first conveying device is smaller than the length of the second conveying device.

3. The semiconductor laminate production line according to claim 1, wherein The adsorption conveying station comprises an adsorption mechanical arm and a first conveying platform, the adsorption mechanical arm is located above the first conveying platform, and the first conveying platform is connected with the glue sticking device.

4. The semiconductor laminate production line according to claim 1, wherein The turnover conveying mechanism comprises a turnover device and a receiving device, one end of the turnover device is located at one end of the receiving device and is connected with the receiving device, the other end of the turnover device is close to the pressing mechanism and is connected with the pressing mechanism, and the other end of the receiving device extends to below the film tearing mechanism.

5. The semiconductor laminate production line according to claim 1, wherein The discharging mechanism comprises a glue tape cutting device, an adsorption stacking device and a detection mechanism, the glue tape cutting device is located at one side of the film tearing mechanism, the adsorption stacking device is connected with the glue tape cutting device, the connecting lines of the glue tape cutting device and the adsorption stacking device are perpendicular to the connecting lines of the glue tape cutting device and the film tearing mechanism, and the detection mechanism is located at one side of the glue tape cutting device and is connected with the glue tape cutting device.

6. The semiconductor laminate production line according to claim 5, wherein The glue tape cutting device comprises a fixing frame, a second conveying platform and a cutting device, the fixing frame is located at one side of the film tearing mechanism, the cutting device is fixedly connected above the fixing frame, and the second conveying platform is located below the cutting device and is connected with the film tearing mechanism.

7. The semiconductor laminate production line according to claim 5, wherein The detection mechanism comprises a laser engraving machine, a code scanning detection device and a parking box, the laser engraving machine, the code scanning detection device and the parking box are arranged in sequence and connected at the head and tail, and the laser engraving machine is located on one side of the adhesive tape cutting device and connected with the adhesive tape cutting device.

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