Arc plate stone grinding and polishing method and device based on dual-channel eight-axis machine

Abstract

The present invention discloses a circular arc plate stone grinding and polishing method and device based on a dual-channel eight-axis machine, by obtaining characteristic parameters of circular arc plate grinding and polishing; inputting the characteristic parameters into a CAM algorithm, and executing two loop bodies in the CAM algorithm, namely an outer loop about grinding and polishing depth and an inner loop about grinding and polishing trajectory planning of different grinding and polishing positions at the same grinding and polishing depth; according to the loop variables of the outer loop and the inner loop, the corresponding unit trajectory and the corresponding G code parameters are obtained; different grinding and polishing conditions are determined according to the grinding and polishing mode and grinding and polishing direction, and the corresponding trajectory planning and G code processing program generation are performed in combination with the unit trajectory and the corresponding G code parameters, and the dual-channel eight-axis machine is driven by the G code processing program to complete the circular arc plate stone grinding and polishing. The present invention solves the problem of automatic grinding and polishing of circular arc plate stone, improves the grinding and polishing efficiency and quality of circular arc plate stone, and reduces the grinding and polishing cost of circular arc plate stone.

Description

Technical Field

[0001] The invention relates to the field of arc plate stone grinding and polishing, and in particular to a circular arc plate stone grinding and polishing method and device based on a dual-channel eight-axis machine. Background Art

[0002] With the development of economy and the continuous improvement of people's living standards, the modernization, personalization and artistry of decoration have become the trend. The demand for arc-shaped stone is increasing, and it is widely used in architectural and decoration scenes such as spiral staircases, curved columns, curved walls, and curved vertical panels. At present, the processing of arc-shaped stones, especially the final grinding and polishing process, is still mostly done by manual processing, which has low processing efficiency, high cost, poor processing quality and consistency, and a harsh processing environment that endangers the health of workers.

[0003] Therefore, how to improve the automation and intelligence of arc plate stone grinding and polishing in stone processing and reduce its processing cost has become a problem to be solved urgently. Summary of the invention

[0004] In view of the technical problems mentioned above, the purpose of the embodiments of the present application is to propose a method and device for grinding and polishing arc plate stone based on a dual-channel eight-axis machine to solve the technical problems mentioned in the above background technology part.

[0005] In a first aspect, the present invention provides a method for grinding and polishing a circular arc plate stone based on a dual-channel eight-axis machine, comprising the following steps:

[0006] S1, obtaining characteristic parameters of arc plate grinding and polishing, the characteristic parameters include grinding and polishing mode, grinding and polishing direction, arc feature point coordinates, grinding and polishing length, grinding and polishing direction feed amount, grinding and polishing total removal amount, grinding and polishing single removal amount, feed speed, spindle speed;

[0007] S2, inputting the characteristic parameters into the CAM algorithm, and executing two loop bodies in the CAM algorithm, namely an outer loop about the grinding depth and an inner loop about the grinding trajectory planning of different grinding positions at the same grinding depth;

[0008] S3, according to the loop variables of the outer loop and the inner loop, the corresponding unit trajectory and the parameters of the corresponding G code are obtained;

[0009] S4, determine different grinding and polishing processing conditions according to the grinding and polishing method and grinding and polishing direction, and perform corresponding trajectory planning and G code processing program generation in combination with the unit trajectory and the corresponding G code parameters, and drive the dual-channel eight-axis machine through the G code processing program to complete the arc plate stone grinding and polishing.

[0010] Preferably, the outer loop is executed in each cycle, and the grinding depth increases by the single grinding removal amount h until the grinding depth reaches the total grinding removal amount H. The inner loop is executed at the grinding depth corresponding to the current outer loop process. In each cycle, the grinding position feed increases the grinding direction feed amount d until the grinding position reaches the boundary of the grinding area, that is, the grinding length L is reached.

[0011] Preferably, when the grinding and polishing direction is the X-axis direction, the unit trajectory is a spatial arc, and when the grinding and polishing direction is the Y-axis direction, the unit trajectory is a spatial straight line.

[0012] As a preferred option, different grinding and polishing conditions and corresponding trajectory planning are as follows:

[0013] In the case of reciprocating grinding and polishing along the X-axis direction, the main trajectory is a series of spatial arc unit trajectories with the center of the circle feeding along the Y-axis direction and alternating clockwise and counterclockwise cutting. There is a trajectory that directly feeds along the Y-axis direction between two adjacent arcs.

[0014] The processing situation of unidirectional grinding and polishing along the X-axis direction is that the main trajectory is a series of spatial arc unit trajectories of clockwise unidirectional cutting with the center of the circle distributed along the Y-axis direction. There are retracting, lifting, positioning and feeding trajectories between two adjacent arcs.

[0015] In the case of reciprocating grinding and polishing along the Y-axis direction, the main trajectory is a series of spatial straight line unit trajectories that alternately move the tool in the positive and negative directions of the Y-axis along the arc feed distribution, and there is a trajectory that directly feeds along the circumferential direction between two adjacent straight lines;

[0016] For the one-way grinding and polishing along the Y-axis direction, the main trajectory is a series of spatial arc unit trajectories of one-way tool movement in the positive direction of the Y-axis distributed along the arc direction, and there are retracting, lifting, positioning, and feeding trajectories between two adjacent straight lines.

[0017] As a preferred method, the problem of the total amount of polishing removal and the amount of single polishing removal being divisible by the polishing depth is considered. Through boundary condition processing, the trajectory planning of the layer that reaches the boundary polishing depth for the last time is extracted from the loop body and processed separately. The boundary processing of the outer loop is as follows:

[0018]

[0019] Among them, H is the total amount of grinding and polishing removal, h is the amount of grinding and polishing removed in a single time, floor function is a rounding function, i is the loop variable of the outer loop about the grinding and polishing depth, indicating that the current grinding and polishing is the i-th layer, that is, the current grinding and polishing depth is i*h;

[0020] Considering the problem of the integer divisibility of the feed amount in the grinding direction at the boundary of the grinding area at the same grinding depth, the unit trajectory planning of the last arrival at the boundary of the grinding area under the outer loop of each grinding depth is extracted from the inner loop body through boundary condition processing and processed separately. The boundary processing of the inner loop is as follows:

[0021]

[0022] Among them, L is the grinding length, d is the feed amount in the grinding direction, floor function is the floor rounding function, j is the loop variable of the inner loop of the grinding trajectory planning at the same grinding depth, indicating that the current one is the jth unit trajectory, that is, the total feed amount in the current grinding direction is j*d.

[0023] Preferably, when the grinding and polishing method is reciprocating grinding and polishing, the first unit trajectory planning with positioning and feed operations under each grinding and polishing depth outer loop is extracted from the inner loop body, and the corresponding positioning and feed trajectory planning is added based on the algorithm and code of the general unit trajectory planning.

[0024] Preferably, when the polishing direction is the X-axis, the spacing between two adjacent space arc unit trajectories along the Y-axis is the set polishing direction feed amount d. According to the loop variable j of the inner loop and the polishing direction feed amount compensation, the coordinate parameters (x0 s ,y0 s , z0 s )、(i s , j s , k s )、(x1 s , y1 s , z1 s ), the formula is as follows:

[0025]

[0026] Among them, (x0, y0, z0), (i0, j0, k0), (x1, y1, z1) are the coordinates of the three characteristic points of the arc, j is the loop variable of the inner loop, and d is the feed amount in the grinding and polishing direction;

[0027] The coordinates of the three feature points of the initial trajectory of the unit arc (x0 s ,y0 s , z0 s )、(i s , j s , k s )、(x1 s , y1 s , z1 s), according to the current polishing depth obtained by the outer loop, radial trajectory compensation is performed to obtain the three actual feature point coordinate parameters (x0 c ,y0 c , z0 c )、(i c , j c , k c )、(x1 c , y1 c , z1 c ), and the scalar radian parameter a of the rotation axis A axis deflection angle corresponding to the start and end points of the space arc G code G02.4, thereby generating the space arc G02.4 processing G code with corresponding parameters, where the three actual feature point coordinate parameters and the rotation axis A axis deflection angle parameters are as follows:

[0028]

[0029] Among them, a1 is the center angle of the left half of the arc, a2 is the center angle of the right half of the arc, and a is half of the opening angle corresponding to the actual unit space arc, which is obtained by taking the average of the center angles of the left and right half arcs, and corresponds to the rotation axis A-axis angle of the start and end points of the space arc G code G02.4;

[0030] When the polishing direction is the Y axis, the arc length on the arc corresponding to the current polishing depth is the polishing feed amount d, and the increase in the polishing depth of the adjacent two layers of polishing trajectory planning is the polishing single removal amount h. According to the loop variable j of the inner loop and the polishing direction feed amount compensation and the loop variable i of the outer loop and the polishing depth radial compensation, the coordinate parameters of the two feature points of each unit straight line initial trajectory (x1 s , y1 s , z1 s )、(x2 s , y2 s , z2 s ), and the vector radian parameter a of the deflection angle of the rotation axis A axis of each unit space straight line trajectory that remains unchanged for the initial trajectory of the space straight line and the actual trajectory of the space straight line, the formula is as follows:

[0031]

[0032] Among them, (x0, y0, z0), (i0, j0, k0), (x1, y1, z1) are the coordinates of the three characteristic points of the arc, r is the initial arc radius before grinding and polishing obtained according to the coordinates of the three characteristic points of the arc, b is the opening angle corresponding to the arc obtained by taking the average value of the center angles of the left and right semicircular arcs, i is the loop variable of the outer loop, h is the single removal amount of grinding and polishing, j is the loop variable of the inner loop, and d is the feed amount in the grinding and polishing direction;

[0033] The coordinates of the two feature points of the initial trajectory of the unit straight line (x1 s , y1 s , z1 s )、(x2 s , y2 s , z2 s ), radial trajectory compensation is performed according to the current polishing depth obtained by the outer loop, and the coordinate parameters of the two actual feature points of each unit space straight line trajectory under the current polishing depth (x1 c , y1 c , z1 c )、(x2 c , y2 c , z2 c ), combined with the rotation axis A axis deflection angle parameter a of each unit space linear trajectory, the space linear G01 machining G code with corresponding parameters is generated, where the coordinate parameters of the two actual feature points are as follows:

[0034]

[0035] Among them, a is the vector radian value of the deflection angle of the rotation axis A axis of each unit space straight line trajectory, which remains unchanged for the initial trajectory of the space straight line and the actual trajectory of the space straight line, and corresponds to the rotation axis A axis angle of the space straight line G code G01.

[0036] In a second aspect, the present invention provides a circular arc plate stone grinding and polishing device based on a dual-channel eight-axis machine, comprising:

[0037] A parameter acquisition module is configured to acquire characteristic parameters of arc plate grinding and polishing, wherein the characteristic parameters include grinding and polishing mode, grinding and polishing direction, coordinates of arc characteristic points, grinding and polishing length, feed amount in grinding and polishing direction, total grinding and polishing removal amount, single grinding and polishing removal amount, feed speed, and spindle speed;

[0038] A loop module is configured to input the characteristic parameters into the CAM algorithm and execute two loop bodies in the CAM algorithm, namely an outer loop about the grinding depth and an inner loop about the grinding trajectory planning of different grinding positions at the same grinding depth;

[0039] The unit trajectory acquisition module is configured to obtain the corresponding unit trajectory and the parameters of the corresponding G code according to the loop variables of the outer loop and the inner loop;

[0040] The execution module is configured to determine different grinding and polishing processing conditions according to the grinding and polishing method and grinding and polishing direction, and perform corresponding trajectory planning and G-code processing program generation in combination with the unit trajectory and the corresponding G-code parameters, and drive the dual-channel eight-axis machine through the G-code processing program to complete the arc plate stone grinding and polishing.

[0041] In a third aspect, the present invention provides an electronic device comprising one or more processors; a storage device for storing one or more programs, wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the method described in any implementation manner in the first aspect.

[0042] In a fourth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method described in any implementation manner in the first aspect.

[0043] Compared with the prior art, the present invention has the following beneficial effects:

[0044] (1) The present invention designs and develops a CAM algorithm for arc plate stone grinding and polishing based on a dual-channel eight-axis machine, and integrates it into a numerical control system. By setting processing-related characteristic parameters including grinding and polishing mode, grinding and polishing direction, grinding and polishing length, grinding and polishing direction feed amount, total grinding and polishing removal amount, single grinding and polishing removal amount, feed speed, spindle speed, etc. in the arc plate grinding and polishing processing interface of the numerical control system, and using calibration to obtain or manually input standardized arc feature point coordinates, the CAM algorithm is used to perform automatic trajectory planning and automatically generate a G code processing program. After the dual-channel eight-axis machine performs a series of compensations such as tool radius and tool length, the arc plate stone grinding and polishing processing is realized.

[0045] (2) The present invention determines trajectory planning according to different grinding and polishing methods and directions and generates a G-code processing program through a CAM algorithm, thereby realizing processing automation, which is more convenient and efficient.

[0046] (3) The present invention provides a method for grinding and polishing arc plate stone based on a dual-channel eight-axis machine, which improves the grinding and polishing efficiency and processing quality of the arc plate stone, reduces manual labor costs, and further reduces the grinding and polishing costs of the arc plate stone. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0048] Figure 1 is an exemplary device architecture diagram to which an embodiment of the present application may be applied;

[0049] Figure 2 A schematic diagram of the process of a circular arc plate stone grinding and polishing method based on a dual-channel eight-axis machine according to an embodiment of the present application;

[0050] Figure 3 A schematic diagram of a dual-channel eight-axis machine used in the arc plate stone grinding and polishing method based on a dual-channel eight-axis machine according to an embodiment of the present application;

[0051] Figure 4 A schematic diagram of the trajectory of the circular arc plate stone grinding and polishing method based on a dual-channel eight-axis machine in the embodiment of the present application under the conditions of reciprocating grinding and polishing mode and X-axis grinding and polishing direction;

[0052] Figure 5 It is a schematic diagram of the trajectory of the arc plate stone grinding and polishing method based on the dual-channel eight-axis machine in the embodiment of the present application under the processing conditions of unidirectional grinding and polishing mode and X-axis grinding and polishing direction;

[0053] Figure 6 A schematic diagram of the trajectory of the circular arc plate stone grinding and polishing method based on a dual-channel eight-axis machine in the embodiment of the present application under the conditions of reciprocating grinding and polishing mode and Y-axis grinding and polishing direction;

[0054] Figure 7 A schematic diagram of the trajectory of the arc plate stone grinding and polishing method based on a dual-channel eight-axis machine in the embodiment of the present application in the case of a unidirectional grinding and polishing mode and a Y-axis grinding and polishing direction;

[0055] Figure 8 It is a schematic diagram of a circular arc plate stone grinding and polishing device based on a dual-channel eight-axis machine according to an embodiment of the present application;

[0056] Fig. 9 It is a schematic diagram of the structure of a computer device suitable for implementing the electronic device of the embodiment of the present application. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0058] Figure 1 An exemplary device architecture 100 is shown to which the arc plate stone grinding and polishing method based on a dual-channel eight-axis machine or the arc plate stone grinding and polishing device based on a dual-channel eight-axis machine according to the embodiment of the present application can be applied.

[0059] like Figure 1As shown, the device architecture 100 may include terminal devices 101, 102, 103, a network 104 and a server 105. The network 104 is used to provide a medium for communication links between the terminal devices 101, 102, 103 and the server 105. The network 104 may include various connection types, such as wired, wireless communication links or optical fiber cables, etc.

[0060] Users can use terminal devices 101, 102, 103 to interact with server 105 through network 104 to receive or send messages, etc. Various applications, such as data processing applications, file processing applications, etc., can be installed on terminal devices 101, 102, 103.

[0061] Terminal devices 101, 102, 103 can be hardware or software. When terminal devices 101, 102, 103 are hardware, they can be various electronic devices, including but not limited to smart phones, tablet computers, laptop computers, desktop computers, etc. When terminal devices 101, 102, 103 are software, they can be installed in the electronic devices listed above. They can be implemented as multiple software or software modules (for example, software or software modules used to provide distributed services), or they can be implemented as a single software or software module. No specific limitation is made here.

[0062] The server 105 may be a server that provides various services, such as a background data processing server that processes files or data uploaded by the terminal devices 101, 102, and 103. The background data processing server may process the acquired files or data and generate processing results.

[0063] It should be noted that the arc plate stone grinding and polishing processing method based on a dual-channel eight-axis machine provided in the embodiment of the present application can be executed by the server 105, and can also be executed by the terminal devices 101, 102, and 103. Accordingly, the arc plate stone grinding and polishing processing device based on a dual-channel eight-axis machine can be set in the server 105, and can also be set in the terminal devices 101, 102, and 103.

[0064] It should be understood that Figure 1 The number of terminal devices, networks and servers in the embodiment is only for illustration. Any number of terminal devices, networks and servers may be provided as required. In the case where the processed data does not need to be obtained remotely, the above device architecture may not include a network, but only a server or a terminal device.

[0065] Figure 2 The embodiment of the present application shows a method for grinding and polishing a circular arc plate stone based on a dual-channel eight-axis machine, comprising the following steps:

[0066] S1, obtaining characteristic parameters of arc plate grinding and polishing, the characteristic parameters include grinding and polishing method, grinding and polishing direction, arc feature point coordinates, grinding and polishing length, grinding and polishing direction feed amount, grinding and polishing total removal amount, grinding and polishing single removal amount, feed speed, and spindle speed.

[0067] Specifically, refer to Figure 3 The dual-channel eight-axis machine used in the embodiment of the present application is a vertical gantry structure, and its motion can be divided into spindle rotation grinding and polishing motion, X1-axis feed motion, X2-axis feed motion, Y1-axis feed motion, Y2-axis feed motion, Z1-axis feed motion, Z2-axis feed motion, A1-axis rotation motion, and A2-axis rotation motion. Among them, the CNC dual-channel eight-axis machine adopts a dual-channel shared Y-axis structure and control method, that is, the Y1-axis and the Y2-axis adopt a synchronous follow-up function, and it is impossible to realize the dual-channel independent feed servo control, and therefore it is impossible to realize the dual-channel independent tool compensation function.

[0068] The X1 / X2 axis feed motion is driven by a servo motor fixed on a horizontal linear guide frame on the gantry through a reduction gear, and then the lead screw drives the left and right spindle head slides to perform linear feed motion along the X-axis direction respectively.

[0069] The Y1 / Y2 axis feed motion is driven by a servo motor fixed on a lateral linear guide frame on the support frame through a reduction gear, and then the lead screw drives the left and right gantry slide blocks to perform synchronous linear feed motion along the Y axis direction.

[0070] The Z1 / Z2 axis feed motion is driven by a servo motor fixed on the vertical linear guide frame on the left and right spindle heads respectively, which drives the lead screw through a reduction gear. The lead screw then drives the left and right spindle heads to perform linear feed motion along the Z axis direction relative to their respective sliders on the transverse guide rails.

[0071] The A1 / A2 axis rotation movement is controlled by the controllers fixed on the left and right spindle heads to control their respective servo motors, which drive their respective turntables to rotate mechanically through belt transmission. The drive rod running through the turntable follows the mechanical rotation and drives the mounting plate fixedly connected thereto and the spindle tool on the mounting plate to rotate along the A-axis direction respectively.

[0072] In a specific embodiment, a circular plate grinding and polishing processing interface is designed in the numerical control system, providing parameter setting and circular plate feature point coordinate calibration functions. Specifically, in the numerical control system, a set of processing interfaces for circular plate stone grinding and polishing based on a dual-channel eight-axis machine is developed and designed, which can select different specific grinding and polishing methods and display the corresponding grinding and polishing schematic diagram, so that users can set processing parameters including processing technology, shape and size, and provide circular plate feature point coordinates, i.e., the automatic calibration function of the X, Y, and Z axis coordinates of the starting point, middle point, and end point, and the numerical control system completes the calculation, reading, and storage of data.

[0073] In addition, according to the grinding and polishing parameters, processing requirements and machine tool structural characteristics, the corresponding CAM algorithm is developed. Specifically, a set of CAM algorithms for arc plate stone grinding and polishing based on a dual-channel eight-axis machine is developed and integrated into the CNC system, which is called by the above-mentioned related grinding and polishing interface. The CAM algorithm takes into account the processing related parameters, machine tool structural characteristic parameters, shape and size and other path information parameters, etc. It can automatically generate the corresponding processing G code program according to the setting parameters in the processing interface, and has high calculation efficiency.

[0074] Furthermore, relevant characteristic parameters of the arc plate grinding and polishing are set. Specifically, the user sets relevant characteristic parameters in the arc plate grinding and polishing interface of the CNC system, including the grinding and polishing method, grinding and polishing direction, arc feature point coordinates, grinding and polishing length, grinding and polishing direction feed amount, total grinding and polishing removal amount, single grinding and polishing removal amount, feed speed, spindle speed, etc., wherein the arc feature point coordinates can be manually input or automatically generated through calibration.

[0075] S2, inputting the characteristic parameters into the CAM algorithm, and executing two loop bodies in the CAM algorithm, namely an outer loop about the grinding depth and an inner loop about the grinding trajectory planning of different grinding positions at the same grinding depth.

[0076] In a specific embodiment, the outer loop is executed in each cycle, and the grinding depth increases by the single grinding removal amount h until the grinding depth reaches the total grinding removal amount H. The inner loop is executed at the grinding depth corresponding to the current outer loop process. In each cycle, the grinding position feed increases the grinding direction feed amount d until the grinding position reaches the boundary of the grinding area, that is, the grinding length L is reached.

[0077] Specifically, according to the setting parameters of the processing interface, the designed and developed CAM algorithm automatically generates the G code processing program. The CAM algorithm is compiled in C++ programming language, and its overall framework uses two nested loop statements, namely the outer loop about the grinding depth and the inner loop about the grinding trajectory planning of different grinding positions at the same grinding depth.

[0078] S3, according to the loop variables of the outer loop and the inner loop, the corresponding unit trajectory and the parameters of the corresponding G code are obtained.

[0079] In a specific embodiment, when the polishing direction is the X-axis direction, the unit trajectory is a spatial arc, and when the polishing direction is the Y-axis direction, the unit trajectory is a spatial straight line.

[0080] Specifically, the core of the algorithm is the general solution of the unit trajectory, that is, according to the loop variables of the outer loop about the grinding depth and the inner loop about the grinding trajectory feed, the corresponding unit trajectory and the parameters of the corresponding G code are obtained. When the grinding direction is the X-axis direction, the unit trajectory is a spatial arc, and when the grinding direction is the Y-axis direction, the unit trajectory is a spatial straight line.

[0081] S4, determine different grinding and polishing processing conditions according to the grinding and polishing method and grinding and polishing direction, and perform corresponding trajectory planning and G code processing program generation in combination with the unit trajectory and the corresponding G code parameters, and drive the dual-channel eight-axis machine through the G code processing program to complete the arc plate stone grinding and polishing.

[0082] In a specific embodiment, different grinding and polishing conditions and corresponding trajectory planning are as follows:

[0083] In the case of reciprocating grinding and polishing along the X-axis direction, the main trajectory is a series of spatial arc unit trajectories with the center of the circle feeding along the Y-axis direction and alternating clockwise and counterclockwise cutting. There is a trajectory that directly feeds along the Y-axis direction between two adjacent arcs.

[0084] The processing situation of unidirectional grinding and polishing along the X-axis direction is that the main trajectory is a series of spatial arc unit trajectories of clockwise unidirectional cutting with the center of the circle distributed along the Y-axis direction. There are trajectories such as retracting, lifting, positioning and feeding between two adjacent arcs.

[0085] In the case of reciprocating grinding and polishing along the Y-axis direction, the main trajectory is a series of spatial straight line unit trajectories that alternately move the tool in the positive and negative directions of the Y-axis along the arc feed distribution, and there is a trajectory that directly feeds along the circumferential direction between two adjacent straight lines;

[0086] For the one-way grinding and polishing along the Y-axis direction, the main trajectory is a series of spatial arc unit trajectories of one-way tool movement in the positive direction of the Y-axis distributed along the arc direction. Trajectories such as retracting, lifting, positioning, and feeding are set between two adjacent straight lines.

[0087] Specifically, by setting the identifier of the grinding and polishing method and the identifier of the grinding and polishing direction, the corresponding two characteristic parameter values ​​(the values ​​are 1 or 0) are obtained from the arc plate grinding and polishing processing interface of the CNC system. The values ​​of the two identifiers are judged by using the if judgment statement in the CAM algorithm, and the sub-algorithm function body corresponding to different grinding and polishing processing conditions is selected to perform corresponding trajectory planning and G code generation. Corresponding to the above four grinding and polishing processing conditions, the trajectory planning main structure of the CAM algorithm is the above four types respectively.

[0088] In a specific embodiment, considering the problem of the integer division of the total amount of polishing removal and the amount of single polishing removal at the polishing depth, the CAM algorithm extracts the trajectory planning of the layer that reaches the boundary polishing depth for the last time from the loop body through boundary condition processing and processes it separately. The boundary processing of the outer loop is as follows:

[0089]

[0090] Among them, H is the total amount of grinding and polishing removal, h is the amount of grinding and polishing removed in a single time, floor function is the rounding-down function, and i is the loop variable of the outer loop about the grinding and polishing depth, indicating that the current layer is the i-th layer, that is, the current grinding and polishing depth is i*h.

[0091] Therefore, the corresponding grinding depth radial compensation is performed by the unit initial trajectory, and the parameters of the actual grinding space trajectory of each layer are calculated. In the trajectory planning of the last layer processed separately, the grinding depth is H, instead of i*h in the loop body, which means that the grinding depth has reached the set grinding removal amount H at this time, and all other calculations and codes remain unchanged.

[0092] Considering the problem of the integer divisibility of the feed amount in the grinding direction at the boundary of the grinding area at the same grinding depth, the CAM algorithm processes the boundary conditions and extracts the unit trajectory planning of the last arrival at the boundary of the grinding area under each grinding depth outer loop from the inner loop body and processes it separately. The boundary processing of the inner loop is as follows:

[0093]

[0094] Among them, L is the grinding length, d is the feed amount in the grinding direction, floor function is the floor rounding function, j is the loop variable of the inner loop of the grinding trajectory planning at the same grinding depth, indicating that the current one is the jth unit trajectory, that is, the total feed amount in the current grinding direction is j*d.

[0095] Therefore, according to the compensation of the grinding direction feed, each unit trajectory under the same grinding depth is obtained, and combined with the radial compensation of the grinding depth of the outer loop, the parameters of each unit trajectory of the actual grinding space are calculated. In the unit trajectory planning of the last time reaching the boundary of the grinding area, the total feed in the grinding direction is L, instead of j*d in the loop body, which means that the feed in the grinding direction has reached the set grinding length L at this time, and all other calculations and codes remain unchanged.

[0096] In a specific embodiment, when the grinding and polishing method is reciprocating grinding and polishing, the first unit trajectory planning with positioning and feed operations under each grinding and polishing depth outer loop is extracted from the inner loop body, and the corresponding positioning and feed trajectory planning is added based on the algorithm and code of the general unit trajectory planning.

[0097] In a specific embodiment, when the polishing direction is the X-axis, the spacing between two adjacent space arc unit trajectories along the Y-axis is the set polishing direction feed amount d. According to the loop variable j of the inner loop and the polishing direction feed amount compensation, the coordinate parameters (x0 s ,y0 s , z0 s )、(i s , j s , k s )、(x1 s , y1 s , z1 s ), the formula is as follows:

[0098]

[0099] Among them, (x0, y0, z0), (i0, j0, k0), (x1, y1, z1) are the coordinates of the three characteristic points of the arc, j is the loop variable of the inner loop, and d is the feed amount in the grinding and polishing direction;

[0100] The coordinates of the three feature points of the initial trajectory of the unit arc (x0 s ,y0 s , z0 s )、(i s , j s , k s )、(x1 s , y1 s , z1 s ), according to the current polishing depth obtained by the outer loop, radial trajectory compensation is performed to obtain the three actual feature point coordinate parameters (x0 c ,y0 c , z0 c )、(i c, j c , k c )、(x1 c , y1 c , z1 c ), and the scalar radian parameter a of the rotation axis A axis deflection angle corresponding to the start and end points of the space arc G code G02.4, thereby generating the space arc G02.4 processing G code with corresponding parameters, where the three actual feature point coordinate parameters and the rotation axis A axis deflection angle parameters are as follows:

[0101]

[0102] Among them, a1 is the center angle of the left half of the arc, a2 is the center angle of the right half of the arc, and a is half of the opening angle corresponding to the actual unit space arc, which is obtained by taking the average of the center angles of the left and right half arcs, and corresponds to the rotation axis A-axis angle of the start and end points of the space arc G code G02.4;

[0103] When the polishing direction is the Y axis, the arc length on the arc corresponding to the current polishing depth is the polishing feed amount d, and the increase in the polishing depth of the adjacent two layers of polishing trajectory planning is the polishing single removal amount h. According to the loop variable j of the inner loop and the polishing direction feed amount compensation and the loop variable i of the outer loop and the polishing depth radial compensation, the coordinate parameters of the two feature points of each unit straight line initial trajectory (x1 s , y1 s , z1 s )、(x2 s , y2 s , z2 s ), and the vector radian parameter a of the deflection angle of the rotation axis A axis of each unit space straight line trajectory that remains unchanged for the initial trajectory of the space straight line and the actual trajectory of the space straight line, the formula is as follows:

[0104]

[0105] Among them, (x0, y0, z0), (i0, j0, k0), (x1, y1, z1) are the coordinates of the three characteristic points of the arc, r is the initial arc radius before grinding and polishing obtained according to the coordinates of the three characteristic points of the arc, b is the opening angle corresponding to the arc obtained by taking the average value of the center angles of the left and right semicircular arcs, i is the loop variable of the outer loop, h is the single removal amount of grinding and polishing, j is the loop variable of the inner loop, and d is the feed amount in the grinding and polishing direction;

[0106] The coordinates of the two feature points of the initial trajectory of the unit straight line (x1 s , y1 s , z1 s )、(x2 s , y2 s, z2 s ), radial trajectory compensation is performed according to the current polishing depth obtained by the outer loop, and the coordinate parameters of the two actual feature points of each unit space straight line trajectory under the current polishing depth (x1 c , y1 c , z1 c )、(x2 c , y2 c , z2 c ), combined with the rotation axis A axis deflection angle parameter a of each unit space linear trajectory, the space linear G01 machining G code with corresponding parameters is generated, where the coordinate parameters of the two actual feature points are as follows:

[0107]

[0108] Among them, a is the vector radian value of the deflection angle of the rotation axis A axis of each unit space straight line trajectory, which remains unchanged for the initial trajectory of the space straight line and the actual trajectory of the space straight line, and corresponds to the rotation axis A axis angle of the space straight line G code G01.

[0109] Specifically, when the grinding and polishing mode is reciprocating grinding and polishing, there is no need to consider whether the grinding and polishing direction is the X-axis or the Y-axis. At the same grinding and polishing depth, due to alternating tool movement, there is no need for feed, retract and lift operations between two adjacent unit trajectories. Instead, at the end point of each unit trajectory, it directly feeds along the corresponding grinding and polishing direction to reach the starting point of the next unit trajectory. However, due to the particularity of the first unit trajectory and the last unit trajectory, that is, the additional trajectory of the feed operation before the first unit trajectory and the retract operation after the last unit trajectory, the planning of the first unit trajectory is also extracted from the inner loop body and processed separately, that is, the first unit trajectory planning with positioning and feed operations under the outer loop of each grinding and polishing depth is extracted from the inner loop body, and on the basis of the general unit trajectory planning algorithm and code, the corresponding positioning and feed trajectory planning are added, and the corresponding G code is generated.

[0110] Compared with unidirectional grinding and polishing, reciprocating grinding and polishing adds an identifier indicating the current trajectory direction because the grinding and polishing trajectory alternates between forward and reverse directions to achieve the reverse operation after each arc or straight line unit trajectory ends. That is, the starting and ending sequence of each unit trajectory is determined based on the judgment statement of the identifier value, and the identifier is reversed after the corresponding G code is generated according to the compensated actual space unit trajectory parameters.

[0111] When the polishing direction is the X-axis, the unit trajectory is a spatial arc. It does not matter whether the polishing method is reciprocating or unidirectional. The arc parameters are universal solutions. The spacing between two adjacent spatial arc unit trajectories along the Y-axis is the set polishing direction feed amount d. When the polishing direction is the Y-axis, the unit trajectory is a spatial straight line. It does not matter whether the polishing method is reciprocating or unidirectional. The straight line parameters are universal solutions. The spacing between two adjacent spatial straight line unit trajectories is the polishing depth increase.

[0112] According to the preferred specific implementation of the CAM algorithm provided by the present invention, when the grinding and polishing situation is reciprocating along the X-axis direction, please refer to the trajectory planning Figure 4 ; When the polishing is unidirectional along the X-axis, please refer to Figure 5 ; When the polishing situation is reciprocating along the Y axis, please refer to the trajectory planning Figure 6 ; When the polishing is unidirectional along the Y axis, please refer to Figure 7 .

[0113] On the dual-channel eight-axis machine, the structural dimension parameters of the machine tool and the compensation of the tool radius, length, etc. are considered to complete the grinding and polishing process. Specifically, according to the G code processing program generated above, the processing trajectory on the workpiece coordinate system under the Cartesian space of the machine tool is transmitted to the CNC system of the dual-channel eight-axis machine, and the corresponding grinding and polishing process is completed by the CNC system. The functions of this part of the CNC system are relatively complete and do not belong to the focus of the present invention. Its internal essence is roughly that the G code is interpreted by the interpreter and interpolated by the interpolator, considering the structural dimension parameters of the machine tool and the tool parameters such as the tool radius and length, and the coordinate values ​​of each servo axis of the machine tool are obtained through the forward and inverse solution calculation of kinematics, and are transmitted to the drivers of each servo motor through the corresponding offset and compensation, so as to control the movement of the machine tool to complete the corresponding grinding and polishing process.

[0114] Further references Figure 8 As an implementation of the methods shown in the above figures, the present application provides an embodiment of a circular arc plate stone grinding and polishing device based on a dual-channel eight-axis machine. Figure 2 Corresponding to the method embodiment shown, the device can be specifically applied to various electronic devices.

[0115] The embodiment of the present application provides a circular arc plate stone grinding and polishing device based on a dual-channel eight-axis machine, comprising:

[0116] The parameter acquisition module 1 is configured to acquire characteristic parameters of the arc plate grinding and polishing process, wherein the characteristic parameters include the grinding and polishing mode, the grinding and polishing direction, the coordinates of the arc characteristic points, the grinding and polishing length, the feed amount in the grinding and polishing direction, the total grinding and polishing removal amount, the single grinding and polishing removal amount, the feed speed, and the spindle speed;

[0117] The loop module 2 is configured to input the characteristic parameters into the CAM algorithm and execute two loop bodies in the CAM algorithm, namely an outer loop about the grinding depth and an inner loop about the grinding trajectory planning of different grinding positions at the same grinding depth;

[0118] The unit trajectory acquisition module 3 is configured to obtain the corresponding unit trajectory and the parameters of the corresponding G code according to the loop variables of the outer loop and the inner loop;

[0119] The execution module 4 is configured to determine different grinding and polishing processing conditions according to the grinding and polishing method and grinding and polishing direction, and perform corresponding trajectory planning and G-code processing program generation in combination with the unit trajectory and the corresponding G-code parameters, and drive the dual-channel eight-axis machine through the G-code processing program to complete the arc plate stone grinding and polishing.

[0120] Reference below Fig. 9 , which shows an electronic device (eg Figure 1 A schematic diagram of the structure of a computer device 900 (a server or terminal device as shown). Fig. 9 The electronic device shown is merely an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0121] like Fig. 9 As shown, the computer device 900 includes a central processing unit (CPU) 901 and a graphics processing unit (GPU) 902, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 903 or a program loaded from a storage part 909 to a random access memory (RAM) 904. In the RAM 904, various programs and data required for the operation of the device 900 are also stored. The CPU 901, GPU 902, ROM 903 and RAM 904 are connected to each other through a bus 905. An input / output (I / O) interface 906 is also connected to the bus 905.

[0122] The following components are connected to the I / O interface 906: an input section 907 including a keyboard, a mouse, etc.; an output section 908 including a display such as a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 909 including a hard disk, etc.; and a communication section 910 including a network interface card such as a LAN card, a modem, etc. The communication section 910 performs communication processing via a network such as the Internet. A drive 911 can also be connected to the I / O interface 906 as needed. A removable medium 912, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 911 as needed, so that a computer program read therefrom is installed into the storage section 909 as needed.

[0123] In particular, according to an embodiment of the present disclosure, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present disclosure includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication part 910, and / or installed from a removable medium 912. When the computer program is executed by a central processing unit (CPU) 901 and a graphics processing unit (GPU) 902, the above-mentioned functions defined in the method of the present application are executed.

[0124] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium or a computer-readable medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor device, device or component, or any combination of the above. More specific examples of computer-readable media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution device, device or device. In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, which carries a computer-readable program code. This propagated data signal may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. The computer-readable signal medium may also be any computer-readable medium other than a computer-readable medium that can send, propagate or transmit a program for use by or in conjunction with an instruction execution device, apparatus or device. The program code contained on the computer-readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, optical cable, RF, etc., or any suitable combination of the above.

[0125] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0126] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the devices, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart and the combination of boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based device that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0127] The modules involved in the embodiments described in this application may be implemented by software or hardware, and the modules described may also be set in a processor.

[0128] As another aspect, the present application also provides a computer-readable medium, which may be included in the electronic device described in the above embodiment; or it may exist independently and not be assembled into the electronic device. The above computer-readable medium carries one or more programs, and when the above one or more programs are executed by the electronic device, the electronic device: obtains characteristic parameters of arc plate grinding and polishing, the characteristic parameters include grinding and polishing mode, grinding and polishing direction, arc feature point coordinates, grinding and polishing length, grinding and polishing direction feed amount, grinding and polishing total removal, grinding and polishing single removal amount, feed speed, spindle speed; inputs the characteristic parameters into the CAM algorithm, and executes two loop bodies in the CAM algorithm, namely, an outer loop about grinding and polishing depth and an inner loop about grinding and polishing trajectory planning for different grinding and polishing positions at the same grinding and polishing depth; obtains the corresponding unit trajectory and the corresponding G code parameters according to the loop variables of the outer loop and the inner loop; determines different grinding and polishing processing conditions according to the grinding and polishing mode and grinding and polishing direction, and performs corresponding trajectory planning and G code processing program generation in combination with the unit trajectory and the corresponding G code parameters, and drives the dual-channel eight-axis machine through the G code processing program to complete the arc plate stone grinding and polishing.

[0129] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above invention concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other to form a technical solution.

Claims

1. A method for grinding and polishing arc plate stone based on a dual-channel eight-axis machine, characterized in that: The following steps are involved: S1, obtaining characteristic parameters of arc plate grinding and polishing, wherein the characteristic parameters include grinding and polishing mode, grinding and polishing direction, coordinates of arc feature points, grinding and polishing length, feed amount in grinding and polishing direction, total grinding and polishing removal amount, single grinding and polishing removal amount, feed speed, and spindle speed; S2, inputting the characteristic parameters into a CAM algorithm, and executing two loops in the CAM algorithm, namely an outer loop for grinding and polishing depth and an inner loop for planning grinding and polishing trajectories for different grinding and polishing positions at the same grinding and polishing depth; S3, obtaining corresponding unit trajectory and parameters of corresponding G code according to loop variables of the outer loop and the inner loop; S4, determining different grinding and polishing conditions according to the grinding and polishing method and grinding and polishing direction, the different grinding and polishing conditions and corresponding trajectory planning are as follows: In the case of reciprocating grinding and polishing along the X-axis direction, the main trajectory is a series of spatial arc unit trajectories with the center of the circle feeding along the Y-axis direction and alternating clockwise and counterclockwise cutting. There is a trajectory that directly feeds along the Y-axis direction between two adjacent arcs. The processing situation of unidirectional grinding and polishing along the X-axis direction is that the main trajectory is a series of spatial arc unit trajectories of clockwise unidirectional cutting with the center of the circle distributed along the Y-axis direction. There are retracting, lifting, positioning and feeding trajectories between two adjacent arcs. In the case of reciprocating grinding and polishing along the Y-axis direction, the main trajectory is a series of spatial straight line unit trajectories that alternately move the tool in the positive and negative directions of the Y-axis along the arc feed distribution, and there is a trajectory that directly feeds along the circumferential direction between two adjacent straight lines; The processing situation of unidirectional grinding and polishing along the Y-axis direction is that the main trajectory is a series of spatial arc unit trajectories of unidirectional cutting in the positive direction of the Y-axis distributed along the arc direction, and there are retracting, lifting, positioning and feeding trajectories between two adjacent straight lines; The corresponding trajectory planning and G code processing program generation are carried out in combination with the unit trajectory and the corresponding G code parameters, and the dual-channel eight-axis machine is driven by the G code processing program to complete the arc plate stone grinding and polishing processing.

2. The arc plate stone grinding and polishing method based on a dual-channel eight-axis machine according to claim 1 is characterized in that: The outer loop is executed in each cycle, and the grinding depth increases by the single grinding removal amount h until the grinding depth reaches the total grinding removal amount H. The inner loop is executed at the grinding depth corresponding to the current outer loop process. In each cycle, the grinding position feed increases the grinding direction feed amount d until the grinding position reaches the boundary of the grinding area, that is, the grinding length L is reached.

3. The arc plate stone grinding and polishing method based on a dual-channel eight-axis machine according to claim 1 is characterized in that: When the polishing direction is the X-axis direction, the unit trajectory is a spatial arc, and when the polishing direction is the Y-axis direction, the unit trajectory is a spatial straight line.

4. The arc plate stone grinding and polishing method based on a dual-channel eight-axis machine according to claim 1 is characterized in that: Considering the problem of the total amount of grinding and polishing removal and the single removal amount being divisible by the grinding and polishing depth, the trajectory planning of the layer that reaches the boundary grinding and polishing depth for the last time is extracted from the loop body through boundary condition processing and processed separately. The boundary processing of the outer loop is as follows: Among them, H is the total amount of grinding and polishing removal, h is the amount of grinding and polishing removed in a single time, floor function is a rounding function, i is the loop variable of the outer loop about the grinding and polishing depth, indicating that the current grinding and polishing is the i-th layer, that is, the current grinding and polishing depth is i*h; Considering the problem of the integer divisibility of the feed amount in the grinding direction at the boundary of the grinding area at the same grinding depth, the unit trajectory planning of the last arrival at the boundary of the grinding area under the outer loop of each grinding depth is extracted from the inner loop body through boundary condition processing and processed separately. The boundary processing of the inner loop is as follows: Among them, L is the grinding length, d is the feed amount in the grinding direction, floor function is the floor rounding function, j is the loop variable of the inner loop of the grinding trajectory planning at the same grinding depth, indicating that the current one is the jth unit trajectory, that is, the total feed amount in the current grinding direction is j*d.

5. The arc plate stone grinding and polishing method based on a dual-channel eight-axis machine according to claim 1 is characterized in that: When the grinding and polishing method is reciprocating grinding and polishing, the first unit trajectory planning with positioning and feed operations under each grinding and polishing depth outer loop is extracted from the inner loop body, and the corresponding positioning and feed trajectory planning is added based on the algorithm and code of the general unit trajectory planning.

6. The arc plate stone grinding and polishing method based on a dual-channel eight-axis machine according to claim 1 is characterized in that: When the grinding and polishing direction is the X-axis, the spacing between two adjacent space arc unit trajectories along the Y-axis is the set grinding and polishing direction feed amount d. According to the loop variable j of the inner loop and the grinding and polishing direction feed amount compensation, the coordinate parameters (x0 s ,y0 s ,z0 s )、(i s ,j s ,k s )、(x1 s ,y1 s ,z1 s ), the formula is as follows: Among them, (x0, y0, z0), (i0, j0, k0), (x1, y1, z1) are the coordinates of the three characteristic points of the arc, j is the loop variable of the inner loop, and d is the feed amount in the grinding and polishing direction; The coordinates of the three feature points of the initial trajectory of the unit arc (x0 s ,y0 s ,z0 s )、(i s ,j s ,k s )、(x1 s ,y1 s ,z1 s ), according to the current polishing depth obtained by the outer loop, radial trajectory compensation is performed to obtain the three actual feature point coordinate parameters (x0 c ,y0 c ,z0 c )、(i c ,j c ,k c )、(x1 c ,y1 c ,z1 c ), and the scalar radian parameter a of the rotation axis A axis deflection angle corresponding to the start and end points of the space arc G code G02.4, thereby generating the space arc G02.4 processing G code with corresponding parameters, where the three actual feature point coordinate parameters and the rotation axis A axis deflection angle parameters are as follows: Among them, a1 is the center angle of the left half of the arc, a2 is the center angle of the right half of the arc, and a is half of the opening angle corresponding to the actual unit space arc, which is obtained by taking the average of the center angles of the left and right half arcs, and corresponds to the rotation axis A-axis angle of the start and end points of the space arc G code G02.4; When the polishing direction is the Y axis, the arc length on the arc corresponding to the current polishing depth is the polishing feed amount d, and the increase in the polishing depth of the adjacent two layers of polishing trajectory planning is the polishing single removal amount h. According to the loop variable j of the inner loop and the polishing direction feed amount compensation and the loop variable i of the outer loop and the polishing depth radial compensation, the coordinate parameters of the two feature points of each unit straight line initial trajectory (x1 s ,y1 s ,z1 s )、(x2 s ,y2 s ,z2 s ), and the vector radian parameter a of the deflection angle of the rotation axis A axis of each unit space straight line trajectory that remains unchanged for the initial trajectory of the space straight line and the actual trajectory of the space straight line, the formula is as follows: Among them, (x0, y0, z0), (i0, j0, k0), (x1, y1, z1) are the coordinates of the three characteristic points of the arc, r is the initial arc radius before grinding and polishing obtained according to the coordinates of the three characteristic points of the arc, b is the opening angle corresponding to the arc obtained by taking the average value of the center angles of the left and right semicircular arcs, i is the loop variable of the outer loop, h is the single removal amount of grinding and polishing, j is the loop variable of the inner loop, and d is the feed amount in the grinding and polishing direction; The coordinates of the two feature points of the initial trajectory of the unit straight line (x1 s ,y1 s ,z1 s )、(x2 s ,y2 s ,z2 s ), radial trajectory compensation is performed according to the current polishing depth obtained by the outer loop, and the coordinate parameters of the two actual feature points of each unit space straight line trajectory under the current polishing depth (x1 c ,y1 c ,z1 c )、(x2 c ,y2 c ,z2 c ), combined with the rotation axis A axis deflection angle parameter a of each unit space linear trajectory, the space linear G01 machining G code with corresponding parameters is generated, where the coordinate parameters of the two actual feature points are as follows: Among them, a is the vector radian value of the deflection angle of the rotation axis A axis of each unit space straight line trajectory, which remains unchanged for the initial trajectory of the space straight line and the actual trajectory of the space straight line, and corresponds to the rotation axis A axis angle of the space straight line G code G01.

7. A circular arc plate stone grinding and polishing device based on a dual-channel eight-axis machine, characterized in that: include: A parameter acquisition module is configured to acquire characteristic parameters of arc plate grinding and polishing, wherein the characteristic parameters include grinding and polishing mode, grinding and polishing direction, arc feature point coordinates, grinding and polishing length, grinding and polishing direction feed amount, grinding and polishing total removal amount, grinding and polishing single removal amount, feed speed, and spindle speed; A loop module is configured to input the characteristic parameters into a CAM algorithm and execute two loop bodies in the CAM algorithm, namely an outer loop about the grinding depth and an inner loop about the grinding trajectory planning of different grinding positions at the same grinding depth; A unit trajectory acquisition module is configured to obtain the corresponding unit trajectory and the parameters of the corresponding G code according to the loop variables of the outer loop and the inner loop; The execution module is configured to determine different grinding and polishing conditions according to the grinding and polishing method and grinding and polishing direction. The different grinding and polishing conditions and corresponding trajectory planning are as follows: In the case of reciprocating grinding and polishing along the X-axis direction, the main trajectory is a series of spatial arc unit trajectories with the center of the circle feeding along the Y-axis direction and alternating clockwise and counterclockwise cutting. There is a trajectory that directly feeds along the Y-axis direction between two adjacent arcs. The processing situation of unidirectional grinding and polishing along the X-axis direction is that the main trajectory is a series of spatial arc unit trajectories of clockwise unidirectional cutting with the center of the circle distributed along the Y-axis direction. There are retracting, lifting, positioning and feeding trajectories between two adjacent arcs. In the case of reciprocating grinding and polishing along the Y-axis direction, the main trajectory is a series of spatial straight line unit trajectories that alternately move the tool in the positive and negative directions of the Y-axis along the arc feed distribution, and there is a trajectory that directly feeds along the circumferential direction between two adjacent straight lines; For the unidirectional grinding and polishing along the Y-axis direction, the main trajectory is a series of spatial arc unit trajectories for unidirectional tool movement in the positive direction of the Y-axis distributed along the arc direction. There are retracting, lifting, positioning and feeding trajectories between two adjacent straight lines. The corresponding trajectory planning and G-code processing program are generated in combination with the unit trajectory and the corresponding G-code parameters. The dual-channel eight-axis machine is driven by the G-code processing program to complete the arc plate stone grinding and polishing.

8. An electronic device comprising: one or more processors; a storage device for storing one or more programs, When the one or more programs are executed by the one or more processors, the one or more processors implement the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the method according to any one of claims 1 to 6 is implemented.

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