Substrate carrier, substrate peeling device, film forming device and substrate peeling method

Abstract

The present invention provides a substrate carrier, a substrate peeling device, a film forming device and a substrate peeling method capable of reducing the force required when peeling a substrate. The force required when peeling a substrate from the adsorption pad (211) can be reduced by providing an adsorption pad (211) having an adsorption surface for adsorbing the substrate and a partial structure or the entire structure of a rotating mechanism for causing the adsorption pad (211) to rotate forward and reverse with the normal line of the adsorption surface as the central axis.

Description

Technical Field

[0001] The present invention relates to a substrate carrier for holding a substrate, a substrate peeling device, a film forming device and a substrate peeling method. Background Art

[0002] In a film forming device such as a vacuum evaporation device, a substrate carrier is moved while holding a substrate, and various processes such as film forming process are performed on the substrate. In addition, a substrate peeling device is provided in the film forming device, and the substrate is peeled off from the substrate carrier after the film forming process is performed on the substrate. As a method of holding a substrate on a substrate carrier, there is known a technology of providing a plurality of adsorption pads on a substrate carrier to adsorb the substrate. In this case, when peeling off the substrate, a large force is required to peel off the substrate in the normal direction of the adsorption surface of the adsorption pad. In this regard, Patent Document 1 discloses a technology of reducing the force required for peeling by tilting the adsorption pad.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-39185 Summary of the invention

[0006] Problems to be solved by the invention

[0007] As the size of the substrate increases, the adsorption force generated by the adsorption pad tends to become stronger and stronger. Therefore, it is required to further reduce the force required when peeling the substrate.

[0008] An object of the present invention is to provide a substrate carrier, a substrate peeling device, a film forming device, and a substrate peeling method that can reduce the force required when peeling a substrate.

[0009] Solutions to Solve Problems

[0010] The substrate carrier of the present invention comprises a plurality of adsorption pads, each of which has an adsorption surface for adsorbing the substrate.

[0011] At least a portion of the plurality of adsorption pads rotates with the normal line of the adsorption surface as a central axis.

[0012] The substrate peeling device of the present invention comprises:

[0013] a supporting member that supports the substrate carrier; and

[0014] A plurality of peeling pins are provided for peeling a substrate held on the substrate carrier from the substrate carrier in a state where the substrate carrier is supported by the supporting member.

[0015] The film forming device of the present invention comprises:

[0016] A film forming source that forms a thin film on a substrate held by a substrate carrier; and the above-mentioned substrate peeling device that peels the substrate after the film formation from the substrate carrier.

[0017] Effects of the Invention

[0018] As described above, according to the present invention, it is possible to reduce the force required when peeling the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is an operation explanation diagram of the substrate lifting device of Example 1.

[0020] Figure 2 This is a schematic structural diagram of the film forming processing chamber of Example 1.

[0021] Figure 3 This is an operation explanation diagram of the substrate peeling device of Example 1.

[0022] Figure 4 This is a main structural diagram of the substrate carrier and substrate peeling device of Example 1.

[0023] Figure 5 This is an operation explanation diagram of the rotating mechanism of Example 1.

[0024] Figure 6 This is a top view of the substrate carrier of Example 1.

[0025] Figure 7 This is a diagram showing the main structures of the substrate carrier and substrate peeling device of Example 2.

[0026] Figure 8 This is a diagram showing the main structures of the substrate carrier and substrate peeling device of Example 3.

[0027] Fig. 9 It is an explanatory diagram of an organic EL display device.

[0028] Description of Reference Numerals

[0029] 200…substrate carrier 201, 202…through hole 210…rotating unit 211…adsorption pad 211X…non-rotating adsorption pad 211a…adhesion member 212…swing rod 212a…cam 213…holding member 214…torsion spring 220…lifting mechanism 221…pressing member 230…reciprocating mechanism 231…pressing member 231a…curved surface 400…substrate peeling device 410…chamber 420…support member 430…lifting mechanism 431…support pin 440…lifting mechanism 441…pressing member. DETAILED DESCRIPTION

[0030] Hereinafter, the method for implementing the present invention will be described in detail based on the embodiments with reference to the accompanying drawings. The dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention to these unless otherwise specified.

[0031] (Example 1)

[0032] Reference Figure 1 to Figure 6 , a substrate carrier, a substrate peeling device for peeling a substrate from a substrate carrier, and a film forming device having the substrate peeling device according to Embodiment 1 of the present invention are described. In this embodiment, a vacuum evaporation device using a vacuum evaporation method is used as an example of a film forming device. However, the present invention can also be applied to a film forming device using a sputtering method.

[0033] <Overview of film forming equipment>

[0034] The outline of the film forming device is described. In the film forming device, first, the substrate is held on the substrate carrier by the substrate lifting device. The substrate carrier holding the substrate is flipped by the flipping device and transported to the film forming processing chamber. When the substrate carrier is set in the film forming processing chamber, the film forming surface of the substrate is in a state facing downward in the vertical direction. Then, in the film forming processing chamber, the film forming process is carried out in a state where a mask is arranged on the film forming surface side of the substrate. Thereafter, the substrate and the substrate carrier are flipped by the flipping device and then transported to the substrate stripping device to strip the substrate from the substrate carrier. The following is a more detailed description.

[0035] <Substrate lifting device>

[0036] Reference Figure 1 , the substrate lifting device 100 and the operation of holding the substrate S on the substrate carrier 200 using the substrate lifting device 100 are described. The substrate lifting device 100 includes: a chamber 110 whose interior is configured to be in a state close to vacuum (reduced pressure environment); and a support member 120 disposed in the chamber 110 and supporting the substrate carrier 200. In addition, the substrate lifting device 100 includes: a plurality of support pins 131 for lifting the substrate S in a state where the substrate S is placed; and a lifting mechanism 130 for lifting the plurality of support pins 131. Furthermore, the substrate lifting device 100 includes: a plurality of pressing pins 141 for pressing the substrate S in order to make the substrate carrier 200 adsorb the substrate S; and a lifting mechanism 140 for lifting the plurality of pressing pins 141. As the lifting mechanism 130 and the lifting mechanism 140, various known technologies such as a ball screw mechanism and a rack and pinion method can be applied.

[0037] First, in a standby state where the plurality of support pins 131 are lowered and the plurality of pressing pins 141 are raised, the substrate carrier 200 is introduced into the chamber 110 and supported by the support member 120 (see Figure 1 Then, the substrate S is introduced into the chamber 110 while the plurality of support pins 131 are raised by the lifting mechanism 130, and the substrate S is placed on the plurality of support pins 131 (see Figure 1 (b)). In addition, the substrate carrier 200 is provided with a plurality of through holes through which the plurality of support pins 131 can pass, so as not to hinder the lifting and lowering movement of the plurality of support pins 131. Then, the plurality of support pins 131 are lowered by the lifting mechanism 130, and the substrate S is placed on the substrate carrier 200 (refer to Figure 1 (c)). A plurality of adsorption pads are provided on the substrate carrier 200, and the substrate S is adsorbed by the plurality of adsorption pads. However, if only the substrate S is placed on the substrate carrier 200, the adsorption of the substrate S by the plurality of adsorption pads may not be sufficient. Therefore, in the present embodiment, the plurality of pressing pins 141 are lowered by the lifting mechanism 140, and the substrate S is pressed toward the substrate carrier 200, and the substrate S is more reliably adsorbed by the plurality of adsorption pads (refer to Figure 1 (d)). In addition, the plurality of pressing pins 141 are respectively provided in a manner corresponding to the configuration positions of the plurality of suction pads, and the substrate S is clamped by the suction pads and the pressing pins 141 at various positions.

[0038] The plurality of support pins 131 and the plurality of pressing pins 141 are inserted into the chamber 110, but the lifting mechanism 130 and the lifting mechanism 140 are arranged outside the chamber 110. Thus, it is possible to suppress the lubricant, abrasion powder, and the like from entering the chamber 110.

[0039] After the substrate S is held on the substrate carrier 200 , the plurality of pressing pins 141 are raised by the lifting mechanism 140 , and the substrate carrier 200 and the substrate S are sent out of the chamber 110 . Thereafter, the substrate carrier 200 and the substrate S are reversed by a reversing device (not shown) and then transported to the film forming processing chamber 300 .

[0040] <Film forming treatment>

[0041] Reference Figure 2 , the film forming process in the film forming processing chamber 300 is described in more detail. The film forming processing chamber 300 includes: a chamber 310 whose interior is configured to be in a state close to a vacuum state (reduced pressure environment); and an evaporation source 320 as a film forming source arranged in the chamber 310. In the chamber 310, the substrate carrier 200 and the substrate S are supported in a state in which the substrate S is positioned in the chamber 310 and held on the substrate carrier 200 and faces downward. In addition, a mask M is also arranged on the lower side of the substrate S in a state in which it is positioned relative to the substrate S. In the mask M, an opening is provided at a position corresponding to the position where a thin film is to be formed on the substrate S. Thus, film formation is performed on the substrate S held on the substrate carrier 200 via the mask M.

[0042] In this embodiment, film formation (evaporation) using vacuum evaporation is performed. Specifically, the film-forming material evaporates or sublimates from the evaporation source 320 as a film-forming source, and the film-forming material is evaporated onto the substrate S to form a thin film on the substrate S. As the evaporation source 320 is a well-known technology, its detailed description is omitted. For example, the evaporation source 320 can be composed of a container such as a crucible for accommodating the film-forming material and a heating device for heating the container. In addition, the film-forming source is not limited to the evaporation source 320, and the film-forming source can also be a sputtering cathode for forming a film by sputtering.

[0043] After the film forming process is completed, the substrate S and the substrate carrier 200 are sent out from the chamber 310, turned over by a turning device not shown in the figure, and then transported to the substrate peeling device 400. In addition, with respect to the substrate lifting device 100 described above, the basic structure of the substrate peeling device 400 is the same except that the lifting mechanism 140 and the pressing pin 141 are not required, and the pressing member 441 described later is required in this embodiment. Therefore, if a pressing member 441 and other structures are provided in the substrate lifting device 100, it can also be used as a substrate peeling device 400. In other words, the substrate S and the substrate carrier 200 can also be sent to the above-mentioned substrate lifting device 100 to perform the substrate peeling action. In addition, in the case of the structures shown in Examples 2 and 3, since the pressing member 441 and other structures are not required, the above-mentioned substrate lifting device 100 can also be directly used as the substrate peeling device 400.

[0044] <Substrate peeling device>

[0045] Reference Figure 3 , the substrate peeling device 400 and the action of peeling the substrate S from the substrate carrier 200 using the substrate peeling device 400 are described. The substrate peeling device 400 includes: a chamber 410 whose interior is configured to be in a state close to vacuum (reduced pressure environment); and a supporting member 420 arranged in the chamber 410 and supporting the substrate carrier 200. In addition, the substrate peeling device 400 includes: a plurality of supporting pins 431 for lifting and lowering the substrate S in a state where the substrate S is placed; and a lifting mechanism 430 for lifting and lowering the plurality of supporting pins 431. As the lifting mechanism 430, various well-known technologies such as a ball screw mechanism and a rack and pinion method can be applied. In addition, the supporting pins 431 serve as peeling pins for peeling the substrate S from the substrate carrier 200.

[0046] First, in a standby state where the plurality of support pins 431 are lowered, the substrate carrier 200 holding the substrate S is introduced into the chamber 410, and the substrate carrier 200 is supported by the support member 420 (see Figure 3 Then, the plurality of support pins 431 are raised by the lifting mechanism 430, so that the substrate S is peeled off from the substrate carrier 200 (see Figure 3 (b)). The peeled substrate S is sent out from the chamber 410.

[0047] Here, when the substrate S is peeled off from the substrate carrier 200 by simply raising the plurality of support pins 431, the substrate S will be peeled off in the normal direction of the adsorption surface in the adsorption pad, and the force required to peel off the substrate S will increase. Therefore, in the substrate carrier 200 and the substrate peeling device 400 of the present embodiment, a structure that can reduce the force required to peel off the substrate S is adopted. For this structure and mechanism, refer to Figure 4 as well as Figure 5 Provide explanation. Figure 4 This is a main structural diagram of the substrate carrier and substrate peeling device of this embodiment. The main structure is appropriately divided into an appearance diagram, a schematic cross-sectional view and a simplified diagram. Figure 5 It is an operation explanation diagram of the rotating mechanism of this embodiment.

[0048] In the present embodiment, a plurality of adsorption pads 211 having an adsorption surface for adsorbing the substrate S are provided on the substrate carrier 200. An adhesive member 211a having adhesiveness is provided at the front end of the adsorption pad 211, and the surface of the adhesive member 211a becomes the adsorption surface. In addition, the adsorption surface of the adsorption pad 211 is configured to be slightly protruding than the surface of the substrate carrier 200 that holds the substrate S. In the present embodiment, at least a portion of the plurality of adsorption pads 211 is configured to be rotatable with the normal line of the adsorption surface as the central axis. Moreover, the substrate carrier 200 has a part of the structure of a rotating mechanism (also referred to as a rotating mechanism) that enables the adsorption pad 211 that can rotate with the normal line of the adsorption surface of the adsorption pad 211 as the central axis to rotate forward and reverse. More specifically, the adhesive member 211a is a disc-shaped member, and is configured so that the adsorption pad 211 rotates forward and reverse with its central axis as the center. Hereinafter, the rotation center (rotation center) of the adsorption pad 211 is referred to as the "central axis". In addition, other structures in the rotating mechanism are provided in the main body of the substrate peeling device. In the present embodiment, a unit composed of a plurality of structures provided on the substrate carrier 200 in the rotating mechanism is referred to as a rotating unit 210. This will be described in more detail below.

[0049] The substrate carrier 200 is provided with a plurality of through holes 201 through which the support pins 431 of the substrate peeling device 400 can pass. In addition, through holes 201 are provided at positions corresponding to the plurality of support pins 431. An elastic body 432 is provided at the front end of the support pin 431, and the elastic body 432 is used to suppress damage to the substrate S and to suppress sliding of the substrate S. In addition, the substrate carrier 200 is also provided with a plurality of through holes 202 for holding the rotating unit 210.

[0050] The rotating mechanism includes a rotating unit 210 provided on the substrate carrier 200 and a pressing member 441 provided on the main body of the substrate peeling device. The pressing member 441 is configured to reciprocate in the vertical direction (the direction along the central axis) by the lifting mechanism 440 provided on the main body of the substrate peeling device. As the lifting mechanism 440, various known technologies such as a ball screw mechanism and a rack and pinion method can be applied.

[0051] The rotating unit 210 includes the above-mentioned adsorption pad 211, a swing rod 212 as a supporting body for supporting the adsorption pad 211, a cam 212a provided on the swing rod 212, and a holding member 213 fixed to the through hole 202 of the substrate carrier 200. The adsorption pad 211 is fixed to the swing rod 212, and they operate as a whole. In addition, the holding member 213 includes a cylindrical portion 213a and a pair of flat plate portions 213b provided at the ends of the cylindrical portion 213a. In a state where the cylindrical portion 213a is embedded in the through hole 202 of the substrate carrier 200, the pair of flat plate portions 213b are fixed to the substrate carrier 200. Moreover, the adsorption pad 211 is arranged inside the cylinder of the cylindrical portion 213a. A gap is provided between the outer circumferential surface of the adsorption pad 211 and the inner circumferential surface of the cylindrical portion 213a, and the adsorption pad 211 is configured to be allowed to rotate and reciprocate in the cylinder of the cylindrical portion 213a. Furthermore, the rotating unit 210 includes a torsion spring 214 as a biasing member having one end fixed to the swing lever 212 and the other end fixed to the holding member 213 .

[0052] Furthermore, a pressing member 441 constituting a rotating mechanism and a lifting mechanism 440 for lifting and lowering the pressing member 441 are provided in the apparatus body (substrate peeling apparatus body) of the substrate peeling apparatus 400 .

[0053] In the cam 212a, at least the pressed surface pressed by the pressing member 441 is composed of a cylindrical surface whose center is orthogonal to the central axis that is the rotation center of the adsorption pad 211. In the illustrated example, the case where the cam 212a is composed of a cylindrical member is shown, but as mentioned above, it is sufficient as long as the pressed surface pressed by the pressing member 441 is composed of a cylindrical surface as described above. Therefore, for example, the cam can also be composed of a semi-cylindrical member. In addition, the pressing surface 441a of the pressing member 441 that presses the cam 212a is composed of an inclined surface that is inclined relative to a surface perpendicular to the central axis that is the rotation center of the adsorption pad 211.

[0054] The mechanism of the rotation mechanism constructed as described above is described. The swing lever 212 is rotated in the positive rotation direction (in the first rotation direction) relative to the holding member 213 by the torsion spring 214. Figure 5Thus, when the pressing member 441 is separated from the cam 212a, the swing lever 212 remains stationary relative to the retaining member 213. Then, when the pressing member 441 is lifted by the lifting mechanism 440 and the pressing member 441 presses the cam 212a, the swing lever 212 overcomes the force of the torsion spring 214 and rotates in the opposite direction. That is, Figure 5 As shown in (b), the swing lever 212 rotates (turns) in the counterclockwise direction (the second rotation direction opposite to the first rotation direction) in the figure. In addition, when the pressing member 441 is lowered by the lifting mechanism 440, the swing lever 212 rotates (turns) in the forward rotation direction by the force of the torsion spring 214 and returns to the original position. As described above, the cam 212a has the function of converting the reciprocating movement of the pressing member 441 into the forward and reverse rotation movement of the swing lever 212.

[0055] By providing the rotating mechanism as described above, the substrate S can be peeled off from the suction pad 211 by rotating (turning) the suction pad 211 by the rotating mechanism while the substrate S is adsorbed on the suction pad 211. Therefore, after the substrate S is peeled off from the suction pad 211 by rotating (turning) the suction pad 211, the support pins 431 can be raised to separate the substrate S from the substrate carrier 200. In this case, after the pressing member 441 is raised by the lifting mechanism 440, the support pins 431 can be raised by the lifting mechanism 430. In addition, the substrate S can be peeled off from the suction pad 211 by rotating (turning) the suction pad 211 by the rotating mechanism. In this case, the pressing member 441 can be raised by the lifting mechanism 440 and the support pins 431 can be raised by the lifting mechanism 430. In addition, the suction pad 211 can be rotated (turned) while the support pins 431 apply a force to separate the substrate S from the substrate carrier 200. In this case, the pressing member 441 can be raised by the lifting mechanism 440 and the support pins 431 can be raised by the lifting mechanism 430 at the same time.

[0056] <Advantages of the substrate carrier, substrate peeling device, and film forming device of this embodiment>

[0057] As described above, according to the present embodiment, the suction pad 211 is rotated (rotated) by the rotating mechanism, so that the force required when peeling the substrate S can be reduced. Therefore, even if the substrate is enlarged, the substrate S can be properly peeled from the substrate carrier 200. In addition, the load acting on the suction pad 211 and the substrate S when peeling the substrate S can be suppressed.

[0058] Here, among the plurality of adsorption pads 211, the force (equivalent to the adsorption force) required to peel the substrate S from the adsorption pads 211 is not uniform, but varies depending on the position where the adsorption pads 211 are arranged. Therefore, it is not necessary to configure all adsorption pads 211 to be able to rotate forward and reverse using a rotation mechanism. Figure 6 Provide explanation.

[0059] Generally speaking, after a plurality of film formations are performed on a substrate, the substrate is cut into a plurality of sheets to obtain a final product. Figure 6 In the substrate carrier 200 shown, the thick dotted line C in the figure corresponds to the position corresponding to the cutting line after the film forming process in the held substrate S. In addition, the area surrounded by the dotted line I in the figure corresponds to the position corresponding to the image display part (display element area) when the substrate S is used for a display.

[0060] The through holes 201 and 202 are arranged at positions avoiding the area corresponding to the image display part so as to prevent the support pins 131 and 431 and the suction pad 211 from contacting the image display part. That is, the through holes 201 through which the support pins 131 and 431 pass and the through holes 202 of the holding rotation unit 210 are arranged along the outer periphery of the substrate carrier 200 and at positions corresponding to the cutting line C. Thus, it is possible to prevent the image display part from being adversely affected when the substrate S is raised or lowered and when the substrate S is peeled off from the substrate carrier 200.

[0061] Furthermore, when the substrate S is raised by the plurality of support pins 431 in order to peel the substrate S, the closer to the center of gravity O of the substrate S, the greater the load, and the farther away from the center of gravity O, the smaller the load. Therefore, among the plurality of suction pads 211, the suction pad 211 disposed closer to the center of gravity O of the substrate S will have a greater load applied. Therefore, the closer the suction pad 211 is disposed to the center of gravity O of the substrate S, the greater the force required to peel the substrate S. Therefore, it is preferred to dispose the suction pad 211 that rotates by the above-mentioned rotating mechanism at a position close to the center of gravity O of the substrate S, and to dispose the non-rotating suction pad 211X at a position away from the center of gravity O.

[0062] For example, it is possible to Figure 6 A rotating unit 210 having an adsorption pad 211 is installed within a certain distance from the center of gravity O (within the range of the central area A), and a non-rotating adsorption pad 211X is installed in the peripheral area except the central area A. The non-rotating adsorption pad 211X can be a general adsorption pad without a rotating mechanism. For example, the non-rotating adsorption pad can be configured to be fixed relative to the substrate carrier 200, or can be configured to be allowed to move up and down and swing to a certain extent relative to the substrate carrier 200.

[0063] By adopting the above structure, the number of rotating mechanisms can be suppressed to the minimum necessary, so that the mechanisms of the substrate carrier 200 and the substrate peeling device 400 can be suppressed from becoming complicated. In addition, it is also possible to suppress the increase in cost. In addition, in the case of adopting such a structure, for the multiple suction pads 211 configured to be able to rotate, it is also possible to rotate (rotate) the suction pads 211 to peel the substrate S from the suction pads 211, and then raise the support pins 431 to separate the substrate S from the substrate carrier 200. In addition, it is also possible to rotate (rotate) the suction pad 211 while applying a force to separate the substrate S from the substrate carrier 200 through the support pins 431 to peel the substrate S from the suction pad 211. In addition, the following substrate peeling method can also be adopted. That is, first, the substrate S is peeled from the non-rotating suction pad (non-rotating suction pad 211X) among the multiple suction pads (first peeling step). That is, when the multiple support pins 431 are raised, the substrate S is peeled from the non-rotating suction pad 211X provided at a location where the force required for peeling is weak. Then, the substrate S is peeled off from the rotating suction pad 211 among the plurality of suction pads (second peeling step). In this case, the plurality of support pins 431 may be raised after the suction pad 211 is rotated, or the plurality of support pins 431 may be raised while the suction pad 211 is rotated. By such a peeling method, the force required when peeling the substrate S can be reduced.

[0064] (Example 2)

[0065] Reference Figure 7 , a substrate carrier and a substrate peeling device for peeling a substrate from a substrate carrier according to a second embodiment of the present invention are described. In the first embodiment, a structure in which the substrate carrier has a part of the structure of a rotating mechanism for rotating the adsorption pad forward and reverse is shown, but in this embodiment, a structure in which the substrate carrier has the entire structure of the rotating mechanism is shown. As other structures and functions are the same as those in the first embodiment, the same reference numerals are given to the same components and their description is omitted.

[0066] The film forming apparatus having the substrate peeling device for peeling a substrate from a substrate carrier of this embodiment is as described in the above-mentioned embodiment 1, and therefore the description thereof is omitted. The substrate peeling device 400 of this embodiment has the same structure as the substrate peeling device 400 shown in embodiment 1, except that the pressing member 441 constituting the rotating mechanism and the lifting mechanism 440 for lifting the pressing member 441 are not required.

[0067] Figure 7This is a main structural diagram of the substrate carrier and the substrate peeling device of the present embodiment, and the main structures are appropriately divided into an appearance diagram, a schematic cross-sectional view and a simplified diagram. In the present embodiment, the rotating unit 210 shown in the above-mentioned embodiment 1 is also provided on the substrate carrier 200. In addition, in the present embodiment, the substrate carrier 200 has a pressing member 221 and a lifting mechanism 220 for lifting and lowering the pressing member 221. As the lifting mechanism 220, various well-known technologies such as a ball screw mechanism and a rack and pinion method can be applied. The pressing surface 221a of the pressing member 221 that presses the cam 212a is composed of an inclined surface that is inclined relative to a surface perpendicular to the central axis that becomes the rotation center of the adsorption pad 211, similarly to the pressing member 441 in the embodiment 1.

[0068] It goes without saying that the mechanism of the rotating mechanism configured as above is the same as that of the above-mentioned embodiment 1. Therefore, when the substrate carrier 200 and the substrate peeling device 400 of this embodiment are used, the same effects as those of the above-mentioned embodiment 1 can be obtained.

[0069] (Example 3)

[0070] Reference Figure 8 , a substrate carrier and a substrate peeling device for peeling a substrate from a substrate carrier according to a third embodiment of the present invention are described. In the first embodiment, a structure in which the substrate carrier has a part of the structure of a rotating mechanism for rotating the adsorption pad forward and reverse is shown, but in this embodiment, a structure in which the substrate carrier has the entire structure of the rotating mechanism is shown. As other structures and functions are the same as those in the first embodiment, the same reference numerals are given to the same components, and their description is omitted.

[0071] The film forming apparatus having the substrate peeling device for peeling a substrate from a substrate carrier of this embodiment is as described in the above-mentioned embodiment 1, and therefore the description thereof is omitted. The substrate peeling device 400 of this embodiment has the same structure as the substrate peeling device 400 shown in embodiment 1, except that the pressing member 441 constituting the rotating mechanism and the lifting mechanism 440 for lifting the pressing member 441 are not required.

[0072] Figure 8 (a) is a main structural diagram of the substrate carrier and substrate peeling device of this embodiment, and the main structure is appropriately divided into an appearance diagram, a schematic cross-sectional view and a simplified diagram. Figure 8 (b) is an operation explanation diagram of the rotating mechanism of this embodiment.

[0073] In this embodiment, the substrate carrier 200 is also provided with the rotating unit 210 shown in the above-mentioned embodiment 1. In addition, in this embodiment, the substrate carrier 200 has a pressing member 231 and a reciprocating mechanism 230 for reciprocating the pressing member 231. As the reciprocating mechanism 230, various known technologies such as a ball screw mechanism and a rack and pinion method can be applied. In this embodiment, the pressing member 231 is reciprocated in the horizontal direction by the reciprocating mechanism 230. Thus, when the pressing member 231 is reciprocated by the reciprocating mechanism 230, Figure 8 When the cam 212a is pressed in the right direction in (b), the swing lever 212 overcomes the force of the torsion spring 214 and rotates in the reverse direction. Figure 8 As shown in (b), the swing lever 212 rotates counterclockwise in the figure. In addition, when the pressing member 231 is moved to the left by the reciprocating mechanism 230, Figure 8 When the swing lever 212 moves to the left in (b), the swing lever 212 rotates in the positive rotation direction and returns to the original position due to the force of the torsion spring 214. Therefore, when the substrate carrier 200 and the substrate peeling device 400 of this embodiment are used, the same effect as in the above-mentioned embodiment 1 can be obtained.

[0074] <Method for manufacturing electronic device>

[0075] An example of a method for manufacturing an electronic device using a film forming apparatus having a substrate peeling apparatus for peeling a substrate from a substrate carrier as described in the above embodiments is described. Hereinafter, as an example of an electronic device, the structure of an organic EL display device is described, and a method for manufacturing the organic EL display device is described.

[0076] First, the organic EL display device to be manufactured will be described. Fig. 9 (a) shows an overall view of an organic EL display device 800. Fig. 9 (b) shows the cross-sectional structure of one pixel.

[0077] like Fig. 9As shown in (a), a plurality of pixels 802 having a plurality of light-emitting elements are arranged in a matrix in a display area 801 of an organic EL display device 800. The details will be described later, but the light-emitting elements each have a structure having an organic layer clamped by a pair of electrodes. In addition, the pixel mentioned here refers to the smallest unit that can display a desired color in the display area 801. In the case of the organic EL display device of this embodiment, a pixel 802 is composed of a combination of a first light-emitting element 802R, a second light-emitting element 802G, and a third light-emitting element 802B that display different light. The pixel 802 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but it can also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and there is no particular limitation as long as it is at least one color.

[0078] Fig. 9 (b) is Fig. 9 Schematic diagram of a partial cross-section along the V-V line of (a). The pixel 802 is composed of a plurality of light-emitting elements, each of which has a first electrode (anode) 804, a hole transport layer 805, any one of the light-emitting layers 806R, 806G, and 806B, an electron transport layer 807, and a second electrode (cathode) 808 on a substrate 803. Among them, the hole transport layer 805, the light-emitting layers 806R, 806G, 806B, and the electron transport layer 807 are equivalent to organic layers. In addition, in the present embodiment, the light-emitting layer 806R is an organic EL layer that emits red, the light-emitting layer 806G is an organic EL layer that emits green, and the light-emitting layer 806B is an organic EL layer that emits blue. The light-emitting layers 806R, 806G, and 806B are formed into patterns corresponding to light-emitting elements (sometimes also described as organic EL elements) that emit red, green, and blue, respectively.

[0079] In addition, the first electrode 804 is formed separately for each light-emitting element. The hole transport layer 805, the electron transport layer 807, and the second electrode 808 can be formed in common with the plurality of light-emitting elements 802R, 802G, and 802B, or can be formed for each light-emitting element. In addition, in order to prevent the first electrode 804 and the second electrode 808 from short-circuiting due to foreign matter, an insulating layer 809 is provided between the first electrode 804. In addition, since the organic EL layer is degraded by moisture and oxygen, a protective layer 810 is provided to protect the organic EL element from moisture and oxygen.

[0080] exist Fig. 9In (b), the hole transport layer 805 and the electron transport layer 807 are shown as one layer, but they can also be formed by multiple layers including a hole blocking layer and an electron blocking layer according to the structure of the organic EL display element. In addition, a hole injection layer having an energy band structure can be formed between the first electrode 804 and the hole transport layer 805 so that holes can be smoothly injected from the first electrode 804 to the hole transport layer 805. Similarly, an electron injection layer can also be formed between the second electrode 808 and the electron transport layer 807.

[0081] Next, an example of a method for manufacturing an organic EL display device will be described in detail.

[0082] First, a substrate (base glass) 803 on which a circuit (not shown) for driving the organic EL display device and a first electrode 804 are formed is prepared.

[0083] Acrylic resin is formed by spin coating on the substrate 803 having the first electrode 804 formed thereon, and the acrylic resin is patterned by photolithography to form an opening in the first electrode 804, thereby forming an insulating layer 809. The opening corresponds to a light emitting region where the light emitting element actually emits light.

[0084] The substrate 803 with the patterned insulating layer 809 is placed on a substrate carrier provided with an adhesive member. The substrate 803 is held by the adhesive member. The substrate 803 is sent to the first organic material film forming device, and after being turned over, a hole transport layer 805 is formed as a common layer on the first electrode 804 of the display area. The hole transport layer 805 is formed by vacuum evaporation. In fact, the hole transport layer 805 is formed to a size larger than the display area 801, so a high-precision mask is not required.

[0085] Next, the substrate 803 formed with the hole transport layer 805 is introduced into the second organic material film forming apparatus. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light emitting layer 806R is formed on the portion of the substrate 803 where the red light emitting element is arranged.

[0086] Similar to the film formation of the light-emitting layer 806R, the green light-emitting layer 806G is formed by the third organic material film-forming device, and then the blue light-emitting layer 806B is formed by the fourth organic material film-forming device. After the film formation of the light-emitting layers 806R, 806G, and 806B is completed, the electron transport layer 807 is formed in the entire display area 801 by the fifth film-forming device. The electron transport layer 807 is formed as a common layer in the three-color light-emitting layers 806R, 806G, and 806B.

[0087] The substrate on which the electron transport layer 807 has been formed is moved in a metallic vapor deposition material film forming apparatus to form a film of the second electrode 808 .

[0088] After that, the substrate 803 is moved to a plasma CVD device to form a protective layer 810, thereby completing the film forming process on the substrate 803. After turning over, the adhesive member is peeled off from the substrate 803 as described in the above embodiment, thereby separating the substrate 803 from the substrate carrier. After that, the organic EL display device 800 is completed by cutting.

[0089] From the time when the substrate 803 with the patterned insulating layer 809 is sent into the film forming apparatus until the film forming of the protective layer 810 is completed, if the substrate is exposed to an environment containing moisture and oxygen, the light-emitting layer composed of the organic EL material may be degraded by moisture and oxygen. Therefore, in this embodiment, the substrate is sent in and out of the film forming apparatus in a vacuum environment or an inert gas environment.

[0090] (other)

[0091] The rotating mechanism for rotating the adsorption pad forward and reverse is not limited to the mechanism shown in the above embodiment, and various known technologies can be used. For example, in the above embodiment, a mechanism for converting reciprocating motion into rotational motion is shown, but a mechanism for directly rotating the adsorption pad forward and reverse using a motor or the like can also be used.

[0092] In addition, as described above, the adsorption surface of the adsorption pad 211 is configured to protrude slightly from the surface of the substrate carrier 200 that holds the substrate S. However, it is also possible to adopt a structure in which the adsorption pad 211 is lowered after the substrate S is peeled off or simultaneously with the action of peeling the substrate S so that the adsorption surface retreats to a position below the surface that holds the substrate S. In this case, in addition to the rotating mechanism that rotates the adsorption pad 211, a known mechanism that moves the adsorption pad 211 up and down may be provided. In addition, a mechanism that moves the adsorption pad 211 up and down while rotating it may also be adopted. For example, in the structure of Example 3, the front end of the pressing member 231 may be composed of a curved surface 231a (refer to Figure 8 (a)). Thus, when the cam 212a is pressed by the curved surface 231a at the front end of the pressing member 231, the suction pad 211 and the swing lever 212 rotate and descend together. Therefore, the rotation of the suction pad 211 and the action of the suction surface sinking into the substrate carrier 200 are performed simultaneously.

Claims

1. A substrate carrier, characterized in that: The substrate carrier comprises a plurality of adsorption pads, each of which has an adsorption surface for adsorbing the substrate. The substrate is peeled off from the plurality of adsorption pads by rotating at least a part of the plurality of adsorption pads about a normal line of the adsorption surface as a central axis.

2. The substrate carrier according to claim 1, characterized in that The substrate carrier comprises: a supporting body, which rotates together with the adsorption pad and supports the adsorption pad; and The cam is pressed by the pressing member moving along the central axis, and converts the movement of the pressing member into the rotation of the support body.

3. The substrate carrier according to claim 2, characterized in that: The substrate carrier includes a biasing member for biasing the support body in a first rotation direction. When the cam is pressed by the pressing member, the support body rotates in a second rotation direction opposite to the first rotation direction against the urging force of the urging member.

4. The substrate carrier according to claim 2 or 3, characterized in that: In the cam, at least a pressed surface pressed by the pressing member is composed of a cylindrical surface whose center is orthogonal to the central axis. A pressing surface of the pressing member that presses the cam is formed of an inclined surface that is inclined relative to a surface that is perpendicular to the central axis.

5. The substrate carrier according to claim 1, 2 or 3, characterized in that: The adsorption pad disposed in the central area of ​​the substrate among the plurality of adsorption pads rotates, The adsorption pads among the plurality of adsorption pads disposed in the outer peripheral area of ​​the substrate do not rotate.

6. The substrate carrier according to claim 1, 2 or 3, characterized in that: A force for peeling the substrate from a rotating adsorption pad among the plurality of adsorption pads is greater than a force for peeling the substrate from a non-rotating adsorption pad among the plurality of adsorption pads.

7. A substrate peeling device, characterized in that: The substrate peeling device comprises: A supporting member that supports the substrate carrier according to any one of claims 1 to 6; and A plurality of peeling pins are provided for peeling a substrate held on the substrate carrier from the substrate carrier in a state where the substrate carrier is supported by the supporting member.

8. A substrate peeling device, characterized in that: The substrate peeling device comprises: A supporting member that supports the substrate carrier according to any one of claims 2 to 4; and a plurality of peeling pins for peeling a substrate held on the substrate carrier from the substrate carrier in a state where the substrate carrier is supported by the supporting member; and The pressing member.

9. A film forming device, characterized in that: The film forming device comprises: a film forming source that forms a thin film on a substrate held by a substrate carrier; and The substrate peeling device according to claim 7 or 8 peels the substrate after film formation from the substrate carrier.

10. A substrate peeling method, the substrate peeling method being a method for peeling a substrate from a substrate carrier according to any one of claims 1 to 6, characterized in that: The substrate peeling method comprises: A first peeling step of peeling the substrate from a non-rotating adsorption pad among the plurality of adsorption pads; and After the first peeling step, a second peeling step of peeling the substrate from the rotating suction pad among the plurality of suction pads is performed.

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