Wafer bonder

Abstract

This invention provides a wafer bonding machine, including a stage, three first alignment units, three second alignment units, a pressing plate, and two flat-edge alignment units. The stage's bearing surface has a placement area for placing a first wafer, with the first alignment units, second alignment units, and flat-edge alignment units arranged around the placement area. The first alignment units position the first wafer and support a second wafer. The second alignment units position the second wafer, while the flat-edge alignment units contact the flat edges of the first and second wafers to align their angles. The pressing plate faces the bearing surface of the stage and presses the aligned first and second wafers onto the bearing surface, while the flat-edge alignment units move up and down relative to the stage with the pressing plate.

Description

Technical Field

[0001] The present invention relates to a wafer bonding machine that can quickly and accurately align the positions and angles of a first and a second wafer, and bond the aligned first and second wafers. Background Technology

[0002] With advancements in semiconductor technology, wafer thickness has been continuously reduced to facilitate subsequent wafer dicing and packaging processes. Furthermore, wafer thinning offers advantages such as smaller chip size, lower resistance, faster instruction cycles, and extended lifespan. However, thinned wafers are structurally more fragile and prone to warping or breakage during subsequent processes, leading to lower product yields.

[0003] To avoid the aforementioned problems, it is generally recommended to temporarily bond the wafer to a carrier wafer and use the carrier wafer to support the thinned wafer, so as to prevent the thinned wafer from warping or breaking during the manufacturing process.

[0004] Specifically, an adhesive can be applied to the surface of the carrier wafer and the wafer itself. Then, the carrier wafer and the wafer are moved to a wafer bonding machine for alignment, and the temperature of the carrier wafer and the wafer is increased for bonding. After bonding, the wafer can undergo processes such as thinning, etching, and metallization. Finally, the wafer is peeled off from the carrier wafer.

[0005] Although the above steps can complete the bonding between the wafer and the carrier wafer, the alignment mechanism of a typical wafer bonding machine still suffers from poor accuracy and low alignment efficiency, which has a certain impact on the efficiency and yield of the process. Summary of the Invention

[0006] To address the aforementioned problems, this invention proposes a wafer bonding machine that can align multiple wafers by position and angle, and then press the aligned wafers together through a pressing mechanism to complete the bonding of multiple wafers, thereby effectively improving the alignment and bonding efficiency of multiple wafers.

[0007] One objective of this invention is to provide a wafer bonding machine, which mainly comprises three first alignment units, three second alignment units, and at least two flat-edge alignment units arranged on a carrier. The flat-edge alignment units are used to contact the flat edges of the first and second wafers, and the first and second alignment units are used to align the first and second wafers respectively, so that the first wafer is aligned with the second wafer.

[0008] The pressing mechanism faces the bearing surface of the stage and can be displaced relative to the stage. The pressing plate of the pressing mechanism can be used to press the first and second wafers placed on the stage after alignment, while the flat edge alignment unit will rise and fall with the pressing plate of the pressing mechanism relative to the bearing surface of the stage.

[0009] The flat edge alignment unit or notched corner alignment unit can be an alignment rod, wherein the alignment rod can extend and retract along the bearing surface of the parallel stage and is used to contact and align the flat edges of the first and second wafers of different sizes, so that the wafer bonding machine is suitable for aligning the first and second wafers of different sizes.

[0010] The flat-edge alignment unit or notched-corner alignment unit can also be an alignment pin, wherein two or more sets of alignment pins can be provided on the bearing surface of the stage. One set of alignment pins is located on the inner side of the bearing surface of the stage and is suitable for aligning the flat edges of the first and second wafers with smaller dimensions. The other set of alignment pins is located on the outer side of the bearing surface of the stage and is suitable for aligning the flat edges of the first and second wafers with larger dimensions.

[0011] One objective of this invention is to provide a wafer bonding machine, which mainly comprises three first alignment units, three second alignment units, and at least one notched alignment unit arranged on a carrier platform. The notched alignment unit is used to contact the notched corners of the first and second wafers, while the first and second alignment units are used to align the first and second wafers respectively, so that the first wafer is aligned with the second wafer.

[0012] To achieve the above objectives, the present invention provides a wafer bonding machine, comprising: a stage including a bearing surface for supporting a first wafer, wherein the bearing surface has a placement area, and the first wafer includes a first angle identification feature, wherein the first angle identification feature is a first flat edge or a first notch; three first alignment units, arranged around the placement area on the bearing surface, for moving closer to or further away from the placement area to position the first wafer and support a second wafer, wherein the second wafer includes a second angle identification feature, wherein the second angle identification feature is a second flat edge or a second notch, and wherein each first alignment unit includes a protrusion and a bottom, the protrusion facing the placement area. The first alignment unit protrudes from the bottom, with the protruding portion of the bottom closer to the bearing surface of the stage, and positions the first wafer at the bottom of the first alignment unit; three second alignment units are arranged around the placement area of ​​the bearing surface and are used to move closer to or further away from the placement area to position the second wafer carried by the first alignment unit; a pressing plate faces the bearing surface of the stage and is displaced relative to the stage, wherein the pressing plate is used to press the first wafer and the second wafer stacked on the stage; and a plurality of flat-edge alignment units are located around the placement area of ​​the bearing surface and are used to contact the first flat edge of the first wafer and the second flat edge of the second wafer, wherein the flat-edge alignment units move up and down with the pressing plate relative to the bearing surface of the stage.

[0013] This invention proposes another wafer bonding machine, comprising: a stage including a bearing surface for supporting a first wafer, wherein the bearing surface has a placement area, and the first wafer includes a first notch; three first alignment units, arranged around the placement area on the bearing surface, for moving closer to or away from the placement area to position the first wafer and support a second wafer, the second wafer including a second notch, wherein each first alignment unit includes a protrusion and a bottom, the protrusion protruding beyond the bottom in the direction of the placement area, and the bottom being closer to the bearing surface of the stage than the protrusion. The first alignment unit positions the first wafer at its bottom; three second alignment units are arranged around the placement area of ​​the support surface and are used to move closer to or further away from the placement area to position the second wafer carried by the first alignment unit; a pressing plate faces the support surface of the stage and is displaced relative to the stage, wherein the pressing plate is used to press the first wafer and the second wafer stacked on the stage; and at least one notched alignment unit is used to contact the first notch of the first wafer and the second notch of the second wafer, wherein the notched alignment unit moves up and down with the pressing plate relative to the support surface of the stage.

[0014] This invention proposes another wafer bonding machine, comprising: a stage including a bearing surface for supporting a first wafer, wherein the bearing surface has a placement area, and the first wafer includes a first angle identification feature, wherein the first angle identification feature is a first flat edge or a first notch; three alignment units, arranged around the placement area of ​​the bearing surface, for moving closer to or away from the placement area to position the first wafer and a second wafer, wherein the second wafer includes a second angle identification feature, wherein the second angle identification feature is a second flat edge or a second notch; and three bearing units, arranged around the placement area of ​​the bearing surface, for moving closer to or away from the placement area to support... A carrier unit is used to carry a second wafer, wherein an alignment unit is displaced toward the placement area to position the second wafer carried by the carrier unit. The carrier unit includes a protrusion and a bottom, the protrusion protruding toward the placement area and the bottom being closer to the bearing surface of the stage than the protrusion; a pressing plate facing the bearing surface of the stage and displaced relative to the stage, wherein the pressing plate is used to press the first wafer and the second wafer stacked on the stage; and a plurality of flat-edge alignment units located around the placement area of ​​the bearing surface to contact the first flat edge of the first wafer and the second flat edge of the second wafer, wherein the flat-edge alignment units move up and down with the pressing plate relative to the bearing surface of the stage.

[0015] The wafer bonding machine includes at least one notch alignment unit for contacting a first notch of a first wafer and a second notch of a second wafer, wherein the notch alignment unit moves up and down with the laminating plate relative to the bearing surface of the stage.

[0016] The wafer bonding machine includes a flat-edge alignment unit comprising two first flat-edge alignment pins and two second flat-edge alignment pins disposed on the bearing surface of the stage, and a notched-corner alignment unit comprising a first notched-corner alignment pin and a second notched-corner alignment pin disposed on the bearing surface of the stage. The first notched-corner alignment pin is located between the two first flat-edge alignment pins, and the second notched-corner alignment pin is located between the two first flat-edge alignment pins. The first flat-edge alignment pin and the first notched-corner alignment pin are close to the inner side of the bearing surface of the stage, while the second flat-edge alignment pin and the second notched-corner alignment pin are close to the outer side of the bearing surface of the stage.

[0017] The wafer bonding machine includes a lifting unit that connects two flat-edge alignment units or notched-corner alignment units, and drives the two flat-edge alignment units or notched-corner alignment units to rise and fall relative to the bearing surface of the stage.

[0018] The wafer bonding machine includes at least one elastic unit connecting two flat-edge alignment units or notched-corner alignment units. When the pressing plate contacts the two flat-edge alignment units or notched-corner alignment units and moves closer to the bearing surface of the stage, the elastic unit will deform and drive the two flat-edge alignment units, notched-corner alignment units and the pressing plate to move up and down synchronously relative to the bearing surface of the stage.

[0019] The wafer bonding machine includes a notched alignment unit comprising a first notched alignment pin and a second notched alignment pin disposed on the bearing surface of the stage. The first notched alignment pin is located near the inner side of the bearing surface of the stage, while the second notched alignment pin is located near the outer side of the bearing surface of the stage.

[0020] The beneficial effects of the present invention are: it provides a novel wafer bonding machine that can be used to align multiple wafers in terms of position and angle, and then press the aligned wafers through a pressing mechanism to complete the bonding of multiple wafers, which can effectively improve the alignment and bonding efficiency of multiple wafers. Attached Figure Description

[0021] Figure 1 This is a three-dimensional schematic diagram of an embodiment of the wafer bonding machine of the present invention.

[0022] Figure 2 This is a perspective view of an embodiment of the alignment mechanism of the wafer bonding machine of the present invention.

[0023] Figure 3 This is a three-dimensional schematic diagram of an embodiment of the alignment mechanism of the wafer bonding machine of the present invention for positioning a first wafer.

[0024] Figure 4 This is a cross-sectional schematic diagram of an embodiment of the first alignment unit of the present invention.

[0025] Figure 5 This is a three-dimensional schematic diagram of an embodiment of the alignment mechanism of the wafer bonding machine of the present invention for positioning a second wafer.

[0026] Figure 6 This is a three-dimensional schematic diagram of an embodiment of the notched corner alignment unit of the alignment mechanism of the present invention aligning a notched corner of a wafer.

[0027] Figure 7 This is a perspective schematic diagram of another embodiment of the alignment mechanism of the wafer bonding machine of the present invention.

[0028] Figure 8 This is a perspective schematic diagram of an embodiment of the alignment mechanism of the present invention, in which the flat edge alignment unit aligns with the flat edge of a wafer.

[0029] Figure 9 This is a three-dimensional schematic diagram of another embodiment of the notched corner alignment unit of the alignment mechanism of the present invention aligning a notched corner of a wafer.

[0030] Explanation of reference numerals in the attached drawings: 10-Wafer bonding machine; 100-Alignment mechanism; 11-Stage; 111-Bearing surface; 113-Placement area; 115-Groove; 117-First through hole; 119-Second through hole; 121-First wafer; 1211-First flat edge; 123-Second wafer; 1231-Second flat edge; 13-First alignment unit; 131-First connecting pin; 132-Bottom; 133-First alignment rod; 134-Protrusion; 141-Elastic unit; 143-Lifting unit; 145-Drive unit; 15-Second... Alignment unit; 151-Second connecting pin; 153-Second alignment rod; 161-Box; 163-Cover; 171-Flat edge alignment unit; 173-Cornered alignment unit; 181-First flat edge alignment pin; 183-First cornered alignment pin; 185-Second flat edge alignment pin; 187-Second cornered alignment pin; 19-Pressure mechanism; 191-Pressure plate; 193-Connecting rod; 195-Linear actuator; 197-Drive rod; 2211-First corner notch; 2231-Second corner notch; 23-Bearing unit; 25-Alignment unit. Detailed Implementation

[0031] Please see Figure 1 and Figure 2 Figures show a perspective view of an embodiment of the wafer bonding machine and a perspective view of an embodiment of the alignment mechanism of the wafer bonding machine, respectively. As shown in the figures, the wafer bonding machine 10 mainly includes an alignment mechanism 100 and a pressing mechanism 19. The alignment mechanism 100 includes a stage 11, at least three first alignment units 13, at least three second alignment units 15, and at least two flat-edge alignment units 171. The pressing mechanism 19 is located above the alignment mechanism 100 and faces the bearing surface 111 of the stage 11 of the alignment mechanism 100.

[0032] like Figure 1 and Figure 2As shown, the first alignment unit 13, the second alignment unit 15, and the flat-edge alignment unit 171 are disposed in the region near the edge or periphery of the stage 11. For example, a placement area 113 can be defined on a bearing surface 111 of the stage 11. The bearing surface 111 and the placement area 113 are used to place the wafer, and the placement area 113 is located in the central region of the bearing surface 111. The first alignment unit 13, the second alignment unit 15, and the flat-edge alignment unit 171 are disposed around the placement area 113.

[0033] like Figure 2 As shown, the first alignment unit 13 and the second alignment unit 15 are alternately spaced around the placement area 113 of the bearing surface 111. The component with the cross-section shown is the first alignment unit 13, which is arranged around the placement area 113. The first and second alignment units 13 / 15 can move closer to or further away from the placement area 113; for example, the first and second alignment units 13 / 15 can be radially displaced along the bearing surface 111.

[0034] The alignment mechanism 100 positions a first wafer 121 and a second wafer 123 above the stage 11 through the first alignment unit 13 and the second alignment unit 15, respectively, so that the first wafer 121 and the second wafer 123 overlap, wherein the second wafer 123 is aligned with the first wafer 121.

[0035] The minimum spacing between each first alignment unit 13 and the minimum spacing between each second alignment unit 15 can be adjusted according to the dimensions of the first wafer 121 and the second wafer 123, respectively. Specifically, the first wafer 121 and the second wafer 123 are approximately disk-shaped, wherein the circle formed by the three first alignment units 13 in the alignment state is similar in size to the first wafer 121, and the circle formed by the three second alignment units 15 in the alignment state is similar in size to the second wafer 123.

[0036] like Figure 2 As shown, in one embodiment of the present invention, the first alignment unit 13 includes three first connecting pins 131 and three first alignment rods 133. The first alignment rods 133 are connected to the first connecting pins 131 and are moved along the bearing surface 111 of the stage 11, parallel and perpendicular to it. The second alignment unit 15 includes three second connecting pins 151 and three second alignment rods 153, wherein the second alignment rods 153 are fixed on the second connecting pins 151. In practical applications, different lengths of the first alignment rods 133 and second alignment rods 153 can be selected according to the dimensions of the first wafer 121 and the second wafer 123, and the selected first and second alignment rods 133 / 153 are respectively fitted onto the first and second connecting pins 131 / 151.

[0037] like Figure 3 , Figure 4 and Figure 5 As shown, the first wafer 121 and the second wafer 123 can be wafers, and the first wafer 121 and the second wafer 123 respectively have first and second angle identification features, wherein the first and second angle identification features can be flat edges or notches on the wafers. Figure 3 and Figure 5 As shown, the first wafer 121 has a first flat edge 1211, while the second wafer 123 has a second flat edge 1231, and the angles of the first wafer 121 and the second wafer 123 can be known through the first flat edge 1211 and the second flat edge 1231.

[0038] like Figure 3 and Figure 5 As shown, the flat edge alignment unit 171 is disposed around the placement area 113. Two flat edge alignment units 171 contact and abut against the first flat edge 1211 of the first wafer 121 and the second flat edge 1231 of the second wafer 123 to align the angles or orientations of the first wafer 121 and the second wafer 123. Through the use of the first alignment unit 13, the second alignment unit 15, and the flat edge alignment unit 171, the positions and angles of the first and second wafers 121 / 123 can be determined.

[0039] like Figure 3 As shown, during the alignment and bonding of the first wafer 121 and the second wafer 123, the first wafer 121 can be placed on the bearing surface 111 of the stage 11, with the first flat edge 1211 of the first wafer 121 facing the flat edge alignment unit 171. The first alignment unit 13 moves closer to the placement area 113 along a direction parallel to the bearing surface 111 to position the first wafer 121 placed on the bearing surface 111 or placement area 113 of the stage 11. For example, a positioning center can be defined in the bearing surface 111 and / or placement area 113 of the stage 11, and the first alignment unit 13 can be radially displaced toward the positioning center and move closer to or away from the placement area 113 to position the first wafer 121.

[0040] Specifically, after the first wafer 121 is placed in the placement area 113 of the stage 11, the first wafer 121 is not usually precisely positioned within the placement area 113. The three first alignment units 13 can move synchronously or asynchronously toward the placement area 113 and contact the first wafer 121 within the placement area 113. At this time, the first flat edge 1211 of the first wafer 121 will contact the flat edge alignment unit 171 to position the angle and location of the first wafer 121, ensuring that the first wafer 121 is accurately placed within the placement area 113.

[0041] In one embodiment of the present invention, such as Figure 4As shown, the first alignment unit 13 includes a bottom 132 and a protrusion 134, wherein the bottom 132 is closer to the bearing surface 111 of the stage 11 than the protrusion 134, and the protrusion 134 protrudes from the bottom 132 toward the placement area 113 of the stage 11. When the first alignment unit 13 approaches the placement area 113 and the first wafer 121, the bottom 132 of the first alignment unit 13 pushes against and positions the first wafer 121.

[0042] like Figure 5 As shown, after the first wafer 121 is positioned, the second wafer 123 can be placed above the placement area 113, with the second flat edge 1231 of the second wafer 123 facing the flat edge alignment unit 171. At this time, the first alignment unit 13 will remain in the position where the first wafer 121 is positioned, and at the same time be used to support the second wafer 123, for example, by supporting the second wafer 123 with the protrusion 134 of the first alignment unit 13.

[0043] like Figure 5 As shown, the second alignment unit 15 then approaches the placement area 113 and the second wafer 123, and pushes and positions the second wafer 123 carried by the first alignment unit 13. For example, the second alignment unit 15 can be radially displaced along the bearing surface 111. At this time, the second flat edge 1231 of the second wafer 123 will contact the flat edge alignment unit 171 to position the angle and position of the second wafer 123, so that the first wafer 121 is aligned with the second wafer 123. In practical applications, the second alignment unit 15 is not used to carry the wafer, so the second alignment unit 15 can be a columnar body of any geometric shape, without the need to provide a protrusion 134 like the first alignment unit 13.

[0044] After the alignment steps described above, the second wafer 123 will be aligned with the first wafer 121, while the second wafer 123 will still be placed on the first alignment unit 13. Then the first alignment unit 13 will move away from the first wafer 121, the second wafer 123 and / or the placement area 113, for example, by moving away radially along the stage 11, while the second wafer 123 will fall from the first alignment unit 13 and be placed on the first wafer 121.

[0045] In practical applications, the three first alignment units 13 can move away from the second wafer 123 asynchronously. For example, one of the first alignment units 13 can move away from the second wafer 123 firstly, while the other two first alignment units 13 remain stationary, so that the second wafer 123 is placed obliquely on the first wafer 121. Then the other two first alignment units 13 will move away from the second wafer 123 to place the second wafer 123 flat on the first wafer 121.

[0046] In one embodiment of the present invention, when the first alignment unit 13 moves away from the second wafer 123, the second alignment unit 15 can remain stationary, which can prevent the second wafer 123 from shifting relative to the first wafer 121 when the first alignment unit 13 shifts relative to the second wafer 123.

[0047] like Figure 1 As shown, the pressing mechanism 19 includes a pressing plate 191, a connecting rod 193, and at least one linear actuator 195, such as a pneumatic cylinder or a motor. The pressing plate 191 faces the bearing surface 111 of the stage 11, and the linear actuator 195 is connected to the pressing plate 191 through the connecting rod 193, and drives the pressing plate 191 to move towards the bearing surface 111 of the stage 11, so as to press the stacked first wafer 121 and second wafer 123 together through the pressing plate 191. In practical applications, a heater may be provided on the stage 11 and / or the pressing plate 191, wherein the heater is used to heat the first wafer 121 and the second wafer 123 and the adhesive between them.

[0048] The flat-edge alignment unit 171 described in this invention moves up and down relative to the bearing surface 111 of the stage 11 as the pressing mechanism 19 moves. The bearing surface 111 of the stage 11 also has a corresponding groove 115 for the flat-edge alignment unit 171. For example, when the linear actuator 195 drives the pressing plate 191 to move closer to the bearing surface 111 of the stage 11, the flat-edge alignment unit 171 moves down relative to the bearing surface 111 of the stage 11 and enters the groove 115. The height of the alignment unit 171 will be lower than the bearing surface 111, allowing the pressing plate 191 to press the aligned first wafer 121 and second wafer 123 on the stage 11.

[0049] like Figure 6 As shown, in different embodiments, the angle recognition feature on the wafer can be a notch, wherein the first wafer 121 has a first notch 2211, and the second wafer 123 has a second notch 2231. In this embodiment, the flat edge alignment unit 171 is replaced by a notch alignment unit 173. When the notch alignment unit 173 contacts the first wafer 121 and the second wafer 123, it embeds the first notch 2211 and the second notch 2231 to locate the angle or orientation of the first and second wafers 121 / 123, wherein the notch alignment unit 173 moves up and down with the movement of the laminating plate 191 relative to the bearing surface 111 of the stage 11.

[0050] In one embodiment of the present invention, such as Figure 2As shown, the flat edge alignment unit 171 and / or the notched corner alignment unit 173 can be connected to an elastic unit 141, such as a spring. When the pressing plate 191 approaches and contacts the flat edge alignment unit 171 on the bearing surface 111 of the stage 11, the elastic unit 141 will be deformed by an external force, causing the flat edge alignment unit 171 and / or the notched corner alignment unit 173 to descend relative to the bearing surface 111 of the stage 11 as the pressing plate 191 descends. When the pressing plate 1941 is disengaged, and the flat edge alignment unit 171 and / or the notched corner alignment unit 173 are not subjected to external force, the restoring force of the elastic unit 141 will cause the flat edge alignment unit 171 and / or the notched corner alignment unit 173 to protrude from the bearing surface 111 of the stage 11. This allows the flat edge alignment unit 171 to be used to align the first and second flat edges 1211 / 1231 of the first and second wafers 121 / 123, while the notched corner alignment unit 173 can be used to align the first and second notched corners 2211 / 2231 of the first and second wafers 121 / 123.

[0051] In another embodiment of the present invention, the flat edge alignment unit 171 and / or the notched corner alignment unit 173 may be connected to a lifting unit 143, such as a pneumatic cylinder or a motor, and used to drive the flat edge alignment unit 171 and / or the notched corner alignment unit 173 to rise or fall relative to the bearing surface 111 of the platform 11. Specifically, when the pressing plate 191 approaches or contacts the flat edge alignment unit 171 and / or the notched corner alignment unit 173 toward the bearing surface 111 of the platform 11, the lifting unit 143 will drive the flat edge alignment unit 171 and / or the notched corner alignment unit 173 to fall relative to the bearing surface 111 of the platform 11. The lifting unit 143 can drive the flat edge alignment unit 171 and / or the corner-cut alignment unit 173 to descend at a speed that is synchronized with the pressing plate 191. In different embodiments, the lifting unit 143 can first drive the flat edge alignment unit 171 and / or the corner-cut alignment unit 173 to descend, and then the pressing plate 191 will approach and press the first and second wafers 121 / 123.

[0052] In one embodiment of the present invention, the flat edge alignment unit 171 and / or the notched corner alignment unit 173 may be an elongated alignment rod, and a plurality of grooves 115, such as elongated grooves, are provided on the platform 11. The flat edge alignment unit 171 and / or the notched corner alignment unit 173 are disposed in the grooves 115 and can move up and down along the grooves 115 relative to the bearing surface 111 of the platform 11.

[0053] The elastic unit 141 and the lifting unit 143 are disposed on the side of the stage 11 and connected to the flat edge alignment unit 171 and / or the notched corner alignment unit 173. Furthermore, flat edge alignment units 171 and / or notched corner alignment units 173 of different lengths can be fixed to the elastic unit 141 and the lifting unit 143, making the flat edge alignment units 171 and / or notched corner alignment units 173 suitable for aligning the flat edges of wafers of different sizes. In different embodiments, the flat edge alignment units 171 and / or notched corner alignment units 173 can be provided with a plurality of fixing holes or elongated through holes, wherein the flat edge alignment units 171 and / or notched corner alignment units 173 can be connected to the elastic unit 141 and the lifting unit 143 through different fixing holes, allowing the flat edge alignment units 171 and / or notched corner alignment units 173 to extend and retract along the direction parallel to the bearing surface 111 of the stage 11, similarly making the flat edge alignment units 171 and / or notched corner alignment units 173 suitable for positioning wafers of different sizes.

[0054] like Figure 1 As shown, the wafer bonding machine 10 may include a housing 161 and a cover 163. The cover 163 faces the housing 161 and can be used to connect the housing 161, forming a sealed space between the two. The alignment mechanism 100 is disposed inside the housing 161, while the bonding plate 191 is located inside the cover 163.

[0055] When the cover 163 is connected to the box 161, the alignment mechanism 100 and the pressing plate 191 are located within the sealed space formed by the box 161 and the cover 163. The box 161 or the cover 163 can be connected to an air extraction device, such as a pump, and the gas in the sealed space formed by the box 161 and the cover 163 can be extracted through the air extraction device.

[0056] like Figure 1 As shown, in one embodiment of the present invention, the linear actuator 195 can be connected to the cover 163 via the drive rod 197, and drive the cover 163 toward the box 161 via the drive rod 197, so that the cover 163 connects to the box 161. For example, the drive rod 197 can be a hollow cylinder, and the connecting rod 193 is disposed inside the drive rod 197. In different embodiments, the connecting rod 193 may not be disposed inside the drive rod 197, and the connecting rod 193 and the drive rod 197 can be driven by different linear actuators 195 respectively.

[0057] In practical applications, the cover 163 can be driven to connect to the box 161 first, and the sealed space between the cover 163 and the box 161 can be evacuated before the alignment and bonding steps of the first wafer 121 and the second wafer 123 are performed.

[0058] When the flat-edge alignment unit 171 and the notched-corner alignment unit 173 are elongated alignment rods, three grooves 115 can be provided in the area near the edge of the bearing surface 111 of the platform 11. Two of the flat-edge alignment units 171 are respectively disposed in the two outer grooves 115. Figure 2 As shown, the notched alignment unit 173 is disposed in the groove 115 located in the middle, as... Figure 6 As shown.

[0059] When replacing two flat-edge alignment units 171 with a notched-corner alignment unit 173, one of the flat-edge alignment units 171 can be removed, and the other flat-edge alignment unit 171 can be adjusted to the central groove 115 to become the notched-corner alignment unit 173. In practical applications, the elastic unit 141 or the lifting unit 143 can be mounted on the slide rail, and a drive unit 145 can be connected to the elastic unit 141 or the lifting unit 143 to drive the flat-edge alignment unit 171 and / or the notched-corner alignment unit 173 to move between the three grooves 115.

[0060] In different embodiments, the bearing surface 111 of the stage 11 may also have only two grooves 115, which are used to accommodate two flat-edge alignment units 171, respectively. One groove 115 and one flat-edge alignment unit 171 are aligned with the center of the first flat edge 1211 of the first wafer 121. When switching the flat-edge alignment unit 171 to the notched alignment unit 173, it is only necessary to remove the flat-edge alignment unit 171 that is not aligned with the center of the first flat edge 1211, so that the flat-edge alignment unit 171 that was originally aligned with the center of the first flat edge 1211 can become the notched alignment unit 173.

[0061] like Figure 7 , Figure 8 and Figure 9 As shown, in another embodiment of the present invention, the flat-edge alignment unit 171 and the notched-corner alignment unit 173 can be a flat-edge alignment pin and a notched-corner alignment pin, respectively. Two sets of through holes can be provided on the bearing surface 111 of the stage 11, namely three first through holes 117 and a third second through hole 119. The three first through holes 117 are closer to the inner side of the bearing surface 111, while the three second through holes 119 are closer to the outer side of the bearing surface 111. An alignment pin is provided in each of the three first through holes 117 and the three second through holes 119, wherein the alignment pin can extend and retract relative to the bearing surface 111 along the first through holes 117 and the second through holes 119.

[0062] like Figure 8 As shown, two first flat-edge alignment pins 181 can be provided in the two first through holes 117 on both sides. When the two first flat-edge alignment pins 181 protrude from the bearing surface 111 of the stage 11, they can be used to contact and align the first flat edge 1211 of the first wafer 121 and / or the second flat edge 1231 of the second wafer 123.

[0063] like Figure 9 As shown, a first notch alignment pin 183 can be disposed in a first through hole 117 located in the middle. The first notch alignment pin 183 is located between two first flat-edge alignment pins 181. When the first notch alignment pin 183 protrudes from the bearing surface 111 of the stage 11, it can be used to contact and align the first notch 2211 of the first wafer 121 and / or the second notch 2231 of the second wafer 123.

[0064] like Figure 7 As shown, two second flat-edge alignment pins 185 can be installed in the two second through holes 119 on both sides, while a second notched alignment pin 187 can be installed in the second through hole 119 in the middle. The second notched alignment pin 187 is located between the two second flat-edge alignment pins 185. The first flat-edge alignment pin 181 and the first notched alignment pin 183 are close to the inner side of the bearing surface 111 of the platform 11, while the second flat-edge alignment pin 185 and the second notched alignment pin 187 are close to the outer side of the bearing surface 111 of the platform 11.

[0065] The first flat-edge alignment pin 181, the first notched-corner alignment pin 183, the second flat-edge alignment pin 185, and the second notched-corner alignment pin 187 can be connected to the elastic unit and the lifting unit disposed inside or below the platform 11, so that the first flat-edge alignment pin 181, the first notched-corner alignment pin 183, the second flat-edge alignment pin 185, and the second notched-corner alignment pin 187 can be raised and lowered synchronously with the pressing plate 191 relative to the bearing surface 111 of the platform 11.

[0066] In another embodiment of the present invention, Figures 1 to 9 The first alignment unit 13 can be a carrier unit 23, and the second alignment unit 15 can be an alignment unit 25, wherein the number, location and structure of the carrier unit 23 and the alignment unit 25 are similar to the first and second alignment units 13 / 15.

[0067] Three carrier units 23 and three alignment units 25 are arranged around the placement area 113 of the carrier surface 111 and are used to move closer to or further away from the placement area 113. In this embodiment of the invention, the first wafer 121 and the second wafer 123 are aligned by the alignment units 25, and the second wafer 123 is carried by the carrier unit 23.

[0068] In practical applications, the first wafer 121 can be placed in the placement area 113 of the bearing surface 111 of the stage 11, and then the three alignment units 25 will move closer to the first wafer 121 and the placement area 113, so that the first wafer 121 is aligned with the placement area 113 of the stage 11.

[0069] After the first wafer 121 is positioned, the three carrier units 23 move closer to the first wafer 121 and the placement area 113, while the three alignment units 25 move away from the first wafer 121. Then, the second wafer 123 is placed on the carrier unit 23, whereby the second wafer 123 is supported by the carrier unit 23 and does not contact the first wafer 121. Specifically, the carrier unit 23 has a similar structure to the first alignment unit 13 and can be used to support the second wafer 123.

[0070] Then the alignment unit 25 will move closer to the second wafer 123, and the three alignment units 25 will contact and position the second wafer 123 carried by the carrier unit 23, so that the second wafer 123 is aligned with the first wafer 121 and / or the placement area 113 of the stage 11.

[0071] Advantages of this invention:

[0072] A novel wafer bonding machine is provided, which can be used to align multiple wafers in terms of position and angle, and then press the aligned wafers together through a pressing mechanism to complete the bonding of multiple wafers, which can effectively improve the alignment and bonding efficiency of multiple wafers.

[0073] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A wafer bonding machine, characterized in that, include: A stage includes a support surface for supporting a first wafer, wherein the support surface has a placement area, and the first wafer includes a first angle identification feature, wherein the first angle identification feature is a first flat edge or a first notch. Three first alignment units are arranged around the placement area on the support surface to move closer to or further away from the placement area to position the first wafer and support a second wafer. The second wafer includes a second angle identification feature, which is a second flat edge or a second notch. Each first alignment unit includes a protrusion and a bottom. The protrusion protrudes from the bottom in the direction of the placement area. The bottom is closer to the support surface of the stage than the protrusion. The first wafer is positioned by the bottom of the first alignment unit. Three second alignment units are arranged around the placement area on the support surface and are used to move closer to or further away from the placement area to position the second wafer carried by the first alignment unit; A pressing plate faces the bearing surface of the stage and is displaced relative to the stage, wherein the pressing plate is used to press the first wafer and the second wafer stacked on the stage; and A plurality of flat-edge alignment units are located around the placement area on the bearing surface to contact the first flat edge of the first wafer and the second flat edge of the second wafer, wherein the flat-edge alignment units move up and down with the laminating plate relative to the bearing surface of the stage.

2. The wafer bonding machine according to claim 1, characterized in that, It includes at least one notch alignment unit for contacting the first notch of the first wafer and the second notch of the second wafer, wherein the notch alignment unit moves up and down with the laminating plate relative to the bearing surface of the stage.

3. The wafer bonding machine according to claim 2, characterized in that, The flat-edge alignment unit includes two first flat-edge alignment pins and two second flat-edge alignment pins disposed on the bearing surface of the platform, while the notched-corner alignment unit includes a first notched-corner alignment pin and a second notched-corner alignment pin disposed on the bearing surface of the platform. The first notched-corner alignment pin is located between the two first flat-edge alignment pins, and the second notched-corner alignment pin is located between the two second flat-edge alignment pins. The first flat-edge alignment pin and the first notched-corner alignment pin are close to the inner side of the bearing surface of the platform, while the second flat-edge alignment pin and the second notched-corner alignment pin are close to the outer side of the bearing surface of the platform.

4. The wafer bonding machine according to claim 1, characterized in that, It includes a lifting unit that connects the two flat-edge alignment units and drives the two flat-edge alignment units to rise and fall relative to the bearing surface of the platform.

5. The wafer bonding machine according to claim 1, characterized in that, The device includes at least one elastic unit connecting the two flat-edge alignment units. When the pressing plate contacts the two flat-edge alignment units and moves closer to the bearing surface of the platform, the elastic unit deforms, causing the two flat-edge alignment units and the pressing plate to move up and down synchronously relative to the bearing surface of the platform.

6. A wafer bonding machine, characterized in that, include: A stage includes a support surface for supporting a first wafer, wherein the support surface has a placement area and the first wafer includes a first notch; Three first alignment units are arranged around the placement area on the support surface to move closer to or further away from the placement area to position the first wafer and support a second wafer. The second wafer includes a second notch. Each first alignment unit includes a protrusion and a bottom. The protrusion protrudes from the bottom in the direction of the placement area. The bottom is closer to the support surface of the stage than the protrusion. The first wafer is positioned by the bottom of the first alignment unit. Three second alignment units are arranged around the placement area on the support surface and are used to move closer to or further away from the placement area to position the second wafer carried by the first alignment unit; A pressing plate faces the bearing surface of the stage and is displaced relative to the stage, wherein the pressing plate is used to press the first wafer and the second wafer stacked on the stage. and At least one notch alignment unit is provided for contacting the first notch of the first wafer and the second notch of the second wafer, wherein the notch alignment unit moves up and down with the laminating plate relative to the bearing surface of the stage.

7. The wafer bonding machine according to claim 6, characterized in that, It includes a lifting unit connected to the notched alignment unit, and drives the notched alignment unit to rise and fall relative to the bearing surface of the platform.

8. The wafer bonding machine according to claim 6, characterized in that, The assembly includes at least one elastic unit connected to the notch alignment unit. When the pressing plate contacts the notch alignment unit and moves toward the bearing surface of the platform, the elastic unit deforms, causing the notch alignment unit and the pressing plate to move up and down synchronously relative to the bearing surface of the platform.

9. The wafer bonding machine according to claim 6, characterized in that, The notched alignment unit includes a first notched alignment pin and a second notched alignment pin disposed on the bearing surface of the platform. The first notched alignment pin is close to the inner side of the bearing surface of the platform, while the second notched alignment pin is close to the outer side of the bearing surface of the platform.

10. A wafer bonding machine, characterized in that, include: A stage includes a support surface for supporting a first wafer, wherein the support surface has a placement area, and the first wafer includes a first angle identification feature, wherein the first angle identification feature is a first flat edge or a first notch. Three alignment units are arranged around the placement area on the support surface to move closer to or further away from the placement area to position the first wafer and a second wafer, wherein the second wafer includes a second angle identification feature, which is a second flat edge or a second notch. Three carrier units are arranged around the placement area on the carrier surface to move closer to or further away from the placement area. The carrier units are used to carry the second wafer. The alignment unit is displaced in the direction of the placement area to position the second wafer carried by the carrier unit. The carrier unit includes a protrusion and a bottom. The protrusion protrudes from the bottom in the direction of the placement area. The bottom is closer to the carrier surface of the stage than the protrusion. A pressing plate faces the bearing surface of the stage and is displaced relative to the stage, wherein the pressing plate is used to press the first wafer and the second wafer stacked on the stage; and A plurality of flat-edge alignment units are located around the placement area on the bearing surface to contact the first flat edge of the first wafer and the second flat edge of the second wafer, wherein the flat-edge alignment units move up and down with the laminating plate relative to the bearing surface of the stage.

11. The wafer bonding machine according to claim 10, characterized in that, It includes at least one notch alignment unit for contacting the first notch of the first wafer and the second notch of the second wafer, wherein the notch alignment unit moves up and down with the laminating plate relative to the bearing surface of the stage.

12. The wafer bonding machine according to claim 10, characterized in that, The device includes at least one elastic unit connecting the two flat-edge alignment units. When the pressing plate contacts the two flat-edge alignment units and moves closer to the bearing surface of the platform, the elastic unit deforms, causing the two flat-edge alignment units and the pressing plate to move up and down synchronously relative to the bearing surface of the platform.

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