Wafer iron ring double-arm alternate carrying mechanism
By designing a double-arm alternating conveying mechanism for wafer iron rings, and utilizing a PLC-controlled lateral movement mechanism and a suction cup mechanism to achieve the cyclic transfer of metal rings, the problem of low efficiency in existing equipment is solved, production efficiency is improved, and costs are reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 上海宏轶电子科技有限公司
- Filing Date
- 2025-05-06
- Publication Date
- 2026-04-21
AI Technical Summary
In existing wafer manufacturing, electric metal ring transfer equipment has low production efficiency due to structural and functional limitations, and can only transfer one metal ring at a time, which increases the burden of manual operation and production costs.
A wafer iron ring double-arm alternating handling mechanism was designed, including a PLC, a frame board, an air compressor, a negative pressure pump, a transverse mechanism, and a suction cup mechanism. The metal ring is circulated and transferred through two sets of transverse mechanisms and four sets of vacuum nozzles. The PLC control enables the double-arm alternating handling, thereby improving efficiency.
It improves the transfer efficiency of metal rings, reduces the burden of manual operation, expands the application range of the equipment, is suitable for the transfer of various types of metal rings, and reduces production costs.
Smart Images
Figure CN224147153U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer production auxiliary equipment technology, and in particular to a wafer iron ring double-arm alternating transport mechanism. Background Technology
[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon. In the production process, high-purity polycrystalline silicon is dissolved and doped with silicon seed crystals, then slowly pulled out to form a cylindrical single silicon ingot. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. Wafers then undergo dicing, bonding, and packaging processes. Before these processes, backthinning is required to reduce the package mounting height, thereby reducing the chip package size, improving the chip's thermal diffusion efficiency, electrical performance, mechanical properties, and reducing the amount of dicing work.
[0003] After wafer thinning, to ensure stable production in the next process, its lower end needs to be glued to the inside of a processing metal ring (the inner diameter of the processing ring is slightly larger than the outer diameter of the wafer). After the next process is completed, the wafer is removed from the ring. A protective film is glued to the outer edge of the upper part of the wafer. Before the next production process, the protective film is peeled off, allowing for processes such as dicing, bonding, and packaging. In current production technology, before bonding the wafer to the inside of the processing metal ring (wafer iron ring), it is generally done manually or electrically from the metal ring placement station to the wafer bonding station, removing the uppermost metal ring. Manual operation is inconvenient for workers and increases production costs. Electric metal ring handling typically involves a PLC or host computer controlling an electric linear slide to control a vacuum nozzle that continuously delivers metal rings via an electric conveyor line, or sequentially adsorbs and transfers stacked metal rings from top to bottom to the wafer bonding station. Compared to manual metal ring handling, electric methods (electric metal ring transfer equipment) have relatively higher production efficiency and lower production costs. However, due to structural limitations, only one metal ring can be picked up and placed at the wafer bonding station at a time, resulting in relatively low production efficiency. Utility Model Content
[0004] To overcome the shortcomings of existing electric metal ring transfer equipment used in wafer production, which has limitations in structure and function as described in the background art, this utility model provides a wafer iron ring double-arm alternating transport mechanism based on existing mature PLC or host computer control technology for different electrical equipment. Under the joint action of related structures, two metal rings can be cyclically transferred from relevant positions to wafer bonding and other work stations, thereby bringing convenience to the staff and improving work efficiency.
[0005] The technical solution adopted by this utility model to solve its technical problem is:
[0006] A wafer ring alternating double-arm handling mechanism includes a PLC, a frame plate, an air compressor, and a negative pressure pump. It also includes a transverse movement mechanism and a suction cup mechanism. There are at least two sets of each transverse movement mechanism and suction cup mechanism. Each transverse movement mechanism includes an electric linear screw slide and a cylinder. A support base is fixedly installed on the front end of the sliding block of the electric linear screw slide, and the cylinder body is fixedly installed on the front end of the support base. The housings of the electric linear screw slides of the two transverse movement mechanisms are horizontally distributed with a vertical spacing and fixedly installed on the front end of the frame plate. The two ends of the frame plate are respectively fixedly installed on the frame at the rear end of the wafer bonding station and the wafer ring feeding station. Each suction cup mechanism includes an upper connecting plate, a support plate, and an adsorption mechanism. The equipment includes a support plate with guide grooves and at least two identical sets of adsorption devices. Each set of adsorption devices includes a vacuum nozzle, a horizontal plate, a limiting seat, and a fixed sub-device. The upper end of the vacuum nozzle is fixedly installed on the lower side of the horizontal plate, and a limiting rod is fixedly installed on the lower end of the horizontal plate. The middle part of the horizontal plate and the limiting seat of the two sets of adsorption devices are respectively installed on the upper and lower sides of the front and rear ends of the support plate, and the limiting rods of the horizontal plates of the two sets of adsorption devices are respectively located in the guide grooves of the support plate. The fixed sub-devices of the two sets of adsorption devices are respectively installed on the side ends of the limiting seats, and the front end of the upper connecting plate is fixedly installed on the outer end of the support plate. The rear ends of the upper connecting plates of the two sets of suction cup mechanisms and the lower ends of the piston rods of the cylinders of the two sets of transverse movement mechanisms are fixedly installed together.
[0007] Furthermore, the support base of the upper set of transverse movement mechanisms on the frame plate is longer than the front-to-back length of the support base of the lower set of transverse movement mechanisms, and the piston rod stroke of the cylinder of the upper set of transverse movement mechanisms on the frame plate is longer than the piston rod stroke of the cylinder of the lower set of transverse movement mechanisms.
[0008] Furthermore, the distance between the rear outer side of the cylinder body of the upper set of transverse movement mechanism cylinder and the front outer side of the cylinder body of the lower set of transverse movement mechanism cylinder is as follows.
[0009] Furthermore, the lower end of the upper connecting plate and the upper end of the horizontal plate are spaced apart.
[0010] Furthermore, the outer diameter of the limiting rod is smaller than the width of the guide groove of the support plate.
[0011] Furthermore, the fixing device includes a spring and a steel ball. Each limiting seat has a through hole, and the side of the support plate has multiple limiting holes. The spring and the steel ball are sequentially movably sleeved in the through hole, and one side of the steel ball is located in one of the limiting holes.
[0012] Compared with the prior art, the advantages of this utility model are: (1) This utility model is based on the existing mature PLC or host computer control of different electrical equipment working mode technology. It is not limited to the use of metal rings in wafer production and the process of transferring metal rings after wafer bonding inside the processing metal ring. It can also be applied to other processes of transferring metal rings in wafer production. Under the joint action of related structures, the two sets of transverse mechanisms can cyclically transfer the two metal rings from the relevant positions to the wafer bonding station through the vacuum nozzle, which brings convenience to the staff and improves the work efficiency accordingly; (2) Since the four sets of adsorption equipment can move back and forth along the support plate, it can be used for the displacement of various types of metal rings, and the application range is wider. Attached Figure Description
[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0014] Figure 1 This is a schematic diagram of the overall frontal three-dimensional structure of this utility model.
[0015] Figure 2 , 3 This is a top-view three-dimensional structural diagram of the suction cup structure of this utility model.
[0016] Figure 4 This is a schematic diagram of the planar structure of the fixed distribution device of this utility model. Detailed Implementation
[0017] Figure 1 , 2As shown in Figures 3 and 4, a wafer iron ring double-arm alternating transport mechanism includes a PLC (not shown in the figure), a frame plate 1, an air compressor (not shown in the figure), and a negative pressure pump (not shown in the figure). It also has a transverse movement mechanism 2 and a suction cup mechanism 3. There are at least two sets of the transverse movement mechanism 2 and the suction cup mechanism 3. Each set of transverse movement mechanism 2 includes an electric linear screw slide 21 and a dual-axis cylinder 22. A support base 23 is fixedly installed on the front end of the sliding block of the electric linear screw slide 21. The cylinder body of the dual-axis cylinder 22 is vertically distributed and fixed on the outer rear side. The electric linear screw slides 21 of the two sets of transverse movement mechanisms are installed on the front end of the support base 23. The slides are horizontally distributed at intervals on the rear ends of the housings and are fixedly installed on the front end of the frame plate 1. The rear ends of the frame plate 1 are respectively fixedly installed on the frame at the rear ends of the wafer bonding station (not shown in the figure) and the wafer iron ring feeding station (not shown in the figure). Each suction cup mechanism includes an upper connecting plate 31, a support plate 32, and an adsorption device 33. The support plate 32 has a guide groove 321 in the middle of its front and rear ends. The adsorption device 33 has two identical guide grooves. Each adsorption unit comprises two vacuum nozzles 331, a horizontal plate 332, a limiting seat 333, and a fixing device 334. The upper end of the limiting seat 333 has a rectangular open structure serving as a limiting groove 3331, and the upper parts of both sides have multiple screw holes. The upper ends of the fixing seats of the two vacuum nozzles 331 are respectively fixedly installed on the lower parts of both sides of the horizontal plate 332, with the suction cup surface of the vacuum nozzles 331 horizontally positioned at the lower part. A vertically distributed limiting rod 3321 is welded to the lower center of the horizontal plate 332. The horizontal plates 332 of the two adsorption units... The lower middle side and the upper ends of the two limiting seats 332 are respectively installed on the upper and lower ends of the front and rear ends of the support plate 32, and the limiting rods 3321 of the horizontal plates of the two sets of adsorption devices are respectively located in the front and rear end guide grooves 321 of the support plate; the fixed sub-devices 34 of the two sets of adsorption devices are respectively installed on the left side of the limiting seat 333, and the lower front end of the upper connecting plate 31 is fixedly installed on the middle of the outer end of the support plate 32; the upper rear end of the upper connecting plate 31 of the two sets of suction cup mechanisms and the lower end of the piston rod of the cylinder 22 of the two sets of transverse movement mechanisms are respectively fixedly installed together.
[0018] Figure 1 , 2As shown in Figures 3 and 4, the support base 32 of the upper set of transverse movement mechanism on the frame plate 1 is longer than the front-to-back length of the support base 32 of the lower set of transverse movement mechanism. The piston rod stroke of the dual-axis cylinder 22 of the upper set of transverse movement mechanism on the frame plate 1 is longer than the piston rod stroke of the dual-axis cylinder 22 of the lower set of transverse movement mechanism. The distance between the rear outer side of the cylinder body of the dual-axis cylinder 22 of the upper set of transverse movement mechanism and the front outer side of the cylinder body of the dual-axis cylinder 22 of the lower set of transverse movement mechanism. The distance between the lower end of the upper connecting plate 31 and the upper end of the horizontal plate 332. The outer diameter of the limiting rod 3321 is slightly smaller than the width of the guide groove 321 of the support plate (the horizontal plate can drive the two vacuum nozzles 331 to move back and forth along the guide groove 321 of the support plate). The height and width of the limiting groove 3331 of the limiting seat are slightly larger than the height and width of the support plate 32. The fixed device includes a spring 3341 and a steel ball 3342. Each limiting seat has a horizontally distributed through hole 3332 from the middle of the left end to the right side. The left front and rear of the support plate 32 have three semi-circular limiting holes 322 (with an inner diameter smaller than the radius of the steel ball) at intervals. The spring 3341 and the steel ball 3342 are sequentially movably sleeved in the through hole 3332, and the right third of the steel ball 3342 is located in one of the limiting holes 322. The electric linear screw slides 21 of the two sets of transverse mechanisms, the inlet and outlet solenoid valves of the upper and lower cylinders of the two sets of dual-axis cylinders 22, the solenoid valves connected to the exhaust ends of the eight vacuum nozzles 331 of the two sets of suction cup mechanisms, the power input terminal of the negative pressure pump and the 15 power output terminals of the PLC are connected by wires respectively. The other end of the solenoid valve of the eight vacuum nozzles 331 and the air inlet end of the negative pressure pump are connected in parallel by eight strong hoses respectively. The air inlet end of the inlet and outlet solenoid valve of the upper and lower cylinders of the two sets of dual-axis cylinders 22 and the exhaust pipe of the air compressor's air tank are connected in parallel by four strong hoses respectively.
[0019] Figure 1 , 2As shown in 3 and 4, this new invention is based on the existing mature PLC or host computer control technology for different electrical equipment. It is not limited to the use of metal rings in wafer production and the process of transferring metal rings when wafers are bonded to the inner side of the processing metal rings. It can also be applied to other metal ring transfer processes in wafer production. The practical process of this invention is as follows: (1): The operator adjusts the two sets of adsorption devices 33 of the two sets of suction cup mechanisms 3 to the front and rear positions of the support plate according to the required displacement of the outer diameter of the metal ring 4. When the outer diameter of the metal ring 4 is large, the rear set and the front set of adsorption devices 33 are adjusted backward and forward respectively (the distance between the vacuum nozzles 331 of the two sets of adsorption devices 33 becomes larger). When the outer diameter of the metal ring 4 is small, the rear set and the front set of adsorption devices 33 are adjusted forward and backward respectively (the distance between the vacuum nozzles 331 of the two sets of adsorption devices 33 becomes smaller). When the operator moves the adsorption separator 33 forward or backward, the steel ball 3342 will overcome the elastic force of the spring 3341 and dislodge from the limiting hole 322 to the left. After adjusting to the corresponding position, the elastic force of the spring 3341 will push the steel ball 3342 to the right and enter the corresponding limiting hole 322. This achieves the position adjustment of the adsorption separator 33. The adsorption separator 33 will not be displaced when there is no large external force moving forward or backward. (Since the four sets of adsorption devices can move forward and backward along the support plate, they can be used for the displacement of various types of metal rings, and the application range is wider.) (2) During operation, the PLC controls the sliding block of the upper set of electric screw slide 21 to drive the upper suction cup mechanism to move to the right and stop at the upper end of the wafer iron ring feeding station. Then, the PLC controls the piston rod of the upper set of cylinder 22 to drive the four vacuum nozzles 331 to descend. The suction cup surfaces at the lower ends of the four vacuum nozzles 331 contact the upper part of the uppermost wafer iron ring 4 at the wafer iron ring feeding station. Then, the PLC controls the vacuum pump and the corresponding solenoid valves of the four vacuum nozzles 331 to be energized and work. The four vacuum nozzles 331 generate negative pressure suction to attract the uppermost wafer iron ring 4. The PLC controls the piston rod of the upper set of cylinder 22 to drive the four vacuum nozzles 331 to ascend. The PLC controls the sliding block of the upper set of electric screw slide 21 to drive the upper suction cup mechanism to move to the left and stop at the upper end of the wafer bonding station. The PLC-controlled vacuum pump and the corresponding solenoid valves of the four vacuum nozzles 331 lose power and stop working. The suction cups at the lower end of the four vacuum nozzles 331 no longer exert suction on the wafer iron ring 4, so the wafer iron ring 4 is placed at the wafer bonding station.(3) The PLC controls the sliding block of the upper set of electric screw slide 21 to drive the upper suction cup mechanism to move to the upper end of the wafer bonding station. At the same time, the PLC controls the sliding block of the lower set of electric screw slide 21 to drive the lower suction cup mechanism to move to the upper end of the wafer iron ring feeding station and stop. Then, the PLC controls the piston rod of the lower set of cylinder 22 to drive the four vacuum nozzles 331 to move down. The suction cup surfaces of the lower ends of the four vacuum nozzles 331 contact the upper part of the uppermost wafer iron ring at the wafer iron ring feeding station. Then, the PLC controls the vacuum pump and the corresponding solenoid valves of the four vacuum nozzles 331 to be energized and work. The four vacuum nozzles 331 generate negative pressure suction to attract the uppermost wafer iron ring 4. The PLC controls the piston rod of the lower set of cylinder 22 to drive the four vacuum nozzles 331 to move up. The PLC controls the sliding block of the lower set of electric screw slide 21 to drive the lower suction cup mechanism to move to the left and stop at the upper end of the wafer bonding station. The PLC controls the vacuum pump and the solenoid valves of the corresponding four vacuum nozzles 331 to lose power and stop working. The suction cup surfaces at the lower end of the four vacuum nozzles 331 no longer generate suction force on the wafer iron ring 4, so the wafer iron ring 4 is placed at the wafer bonding station. (4) While the PLC controls the sliding block of the lower set of electric screw slide 21 to drive the lower suction cup mechanism to move to the left and stop at the upper end of the wafer bonding station, the PLC controls the sliding block of the upper set of electric screw slide 21 to drive the upper suction cup mechanism to move to the right and stop at the upper end of the wafer iron ring feeding station. Then, in the same process as above, the displacement of the uppermost wafer iron ring at the wafer iron ring feeding station begins again. Similarly, the PLC controls the sliding block of the upper set of electric screw slide 21 to drive the upper suction cup mechanism to move to the right and stop at the upper end of the wafer iron ring feeding station. While the upper suction cup mechanism moves to the left to the upper end of the wafer bonding station, the PLC controls the sliding block of the lower electric lead screw slide 21 to drive the lower suction cup mechanism to the right to the upper end of the wafer iron ring feeding station and then stop. This process is repeated continuously. Under the combined action of the relevant structures, the two sets of transverse mechanisms can continuously transfer the two metal rings 4 from the relevant positions to the wafer bonding station through the vacuum nozzle, thereby bringing convenience to the workers and improving work efficiency. It should be noted that the PLC, cylinder, electric lead screw slide, vacuum nozzle, etc. involved in this invention are all mature technologies (including the working method of PLC controlling the cylinder, electric lead screw slide, vacuum pump, vacuum nozzle, etc., and solenoid valves). This application does not elaborate on the above technical solutions, nor does it protect the above technical solutions in any way. This application protects the above components and application solutions, and the technology of continuously transferring the two metal rings from the relevant positions to the wafer bonding station through the vacuum nozzle.
[0020] Those skilled in the art should understand that although this specification describes embodiments, the embodiments do not necessarily contain only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art. Therefore, the scope of protection of this invention is defined by the claims.
Claims
1. A wafer iron ring double-arm alternating carrying mechanism, comprising a PLC, a rack plate, an air compressor and a negative pressure pump, characterized in that, It also includes a traversing mechanism and a suction cup mechanism, each with at least two sets. Each traversing mechanism includes an electric linear screw slide and a cylinder. A support base is fixedly installed on the front end of the sliding block of the electric linear screw slide, and the cylinder body is fixedly installed on the front end of the support base. The housings of the electric linear screw slides of the two traversing mechanisms are horizontally distributed with a vertical gap and fixedly installed on the front end of the frame plate. The two ends of the frame plate are respectively fixedly installed on the frame at the rear end of the wafer bonding station and the wafer iron ring feeding station. Each suction cup mechanism includes an upper connecting plate, a support plate, and an adsorption device. The support plate has a guide groove, and the adsorption device has… At least two identical sets of adsorption devices are provided. Each set includes a vacuum nozzle, a horizontal plate, a limiting seat, and a fixed sub-device. The upper end of the vacuum nozzle is fixedly installed on the lower side of the horizontal plate, and a limiting rod is fixedly installed on the lower end of the horizontal plate. The middle part of the horizontal plate and the limiting seat of the two sets of adsorption devices are respectively installed on the upper and lower sides of the front and rear ends of the support plate, and the limiting rods of the horizontal plates of the two sets of adsorption devices are respectively located in the guide grooves of the support plate. The fixed sub-devices of the two sets of adsorption devices are respectively installed on the side of the limiting seat, and the front end of the upper connecting plate is fixedly installed on the outer end of the support plate. The rear end of the upper connecting plate of the two sets of suction cup mechanisms and the lower end of the piston rod of the cylinder of the two sets of transverse movement mechanisms are fixedly installed together.
2. The dual-arm wafer ring transfer mechanism of claim 1, wherein The support base of the upper set of transverse movement mechanisms on the frame plate is longer than the front-to-back length of the support base of the lower set of transverse movement mechanisms, and the piston rod stroke of the cylinder of the upper set of transverse movement mechanisms on the frame plate is longer than the piston rod stroke of the cylinder of the lower set of transverse movement mechanisms.
3. The dual-arm wafer ring transfer mechanism of claim 1, wherein The distance between the rear outer side of the cylinder body of the upper set of transverse movement mechanism cylinders and the front outer side of the cylinder body of the lower set of transverse movement mechanism cylinders.
4. The dual-arm wafer ring transfer mechanism of claim 1, wherein The distance between the lower end of the upper connecting plate and the upper end of the horizontal plate.
5. The dual-arm wafer ring transfer mechanism of claim 1, wherein, The outer diameter of the limiting rod is smaller than the width of the guide groove of the support plate.
6. The dual-arm wafer ring transfer mechanism of claim 1, wherein The fixed device includes a spring and a steel ball. Each limiting seat has a through hole, and the side of the support plate has multiple limiting holes. The spring and the steel ball are sequentially movably sleeved in the through hole, and one side of the steel ball is located in one of the limiting holes.