A TWS earphone system based on a digital sound production chip

Abstract

The application discloses a TWS earphone system based on a digital sound production chip, and relates to the technical field of digital sound production, and aims to solve the problem that a single loudspeaker unit is difficult to realize wide sound frequency response in the prior art. The earphone system comprises a main earphone and an auxiliary earphone, and the main earphone and the auxiliary earphone each comprise a control module and a sound production module. The control module at least comprises an antenna. The sound production module at least comprises a digital sound production chip. The digital sound production chip at least comprises a sound production pixel unit and an ASIC module. The pixel array corresponding to the sound production pixel unit is arranged in a symmetrical surround mode, and the ASIC module is arranged in a stacking mode. The main earphone receives an original digital audio signal and sends the original digital audio signal to the auxiliary earphone and a microcontroller. The digital sound production chip realizes stereo surround sound production based on a plurality of quantized digital pulse signals obtained by the microcontroller. The panoramic reconstruction of sound can be accurately realized in a specific audio range, including stereo sound, surround sound, panoramic sound and other sound effects.

Description

Technical Field

[0001] This invention relates to the field of digital sound technology, and more particularly to a TWS earphone system based on a digital sound chip. Background Technology

[0002] Currently, TWS earphones on the market mainly use two methods for sound generation: dynamic drivers and balanced armature drivers. A single speaker unit is difficult to achieve a wide frequency response. In pursuit of better sound quality, many high-end earphones choose to configure multiple drivers. However, with the increase in drivers, the overall size of the earphone cannot be made very small; or, when multiple drivers cannot be accommodated, a combination solution such as dual balanced armature or hybrid driver modules is chosen to compensate for the lack of sound quality. In addition, a single speaker unit is still unable to achieve a wide frequency response.

[0003] Therefore, we continue to provide a more reliable TWS earphone system based on a digital sound chip. Summary of the Invention

[0004] The purpose of this invention is to provide a TWS earphone system based on a digital sound chip, which solves the problem that a single speaker unit in the prior art cannot achieve a wide sound frequency response.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] In a first aspect, the present invention provides a TWS earphone system based on a digital sound chip, wherein the earphones in the TWS earphone system include a main earphone and a secondary earphone, and both the main earphone and the secondary earphone include:

[0007] A control module and a sound-generating module; the control module includes at least an antenna; the sound-generating module includes at least a digital sound-generating chip;

[0008] The digital sound chip includes at least a sound-emitting pixel unit and an ASIC module. The pixel array corresponding to the sound-emitting pixel unit is arranged in a symmetrical surrounding manner, and the ASIC module is arranged in a stacked manner.

[0009] The main earphone receives the original digital audio signal and sends it to the secondary earphone and the microcontroller; the digital sound chip realizes stereo surround sound based on multi-channel quantized digital pulse signals; the multi-channel quantized digital pulse signals are obtained by the microcontroller after processing the original digital audio signal.

[0010] Optionally, the digital sound chip further includes:

[0011] Substrate and solder joints;

[0012] The substrate is used to connect and support the various components, and the solder joints are used to communicate with external devices;

[0013] The sound-emitting pixel unit is circular; the digital sound-emitting chip consists of multiple sound-emitting pixel units cascaded into a sound-emitting pixel unit array, which converts electrical pulse signals into sound energy pulse signals and uses superimposed sound waves to emit sound.

[0014] The ASIC module is located at the center of the back side of the pixel unit array; it is used to receive multiple quantized digital pulse signals and distribute the multiple quantized digital pulse signals to each sound-emitting pixel unit.

[0015] Optionally, multiple sets of sound-emitting pixel unit groups are provided on the end face of the substrate. Each set of sound-emitting pixel unit groups includes multiple sound-emitting pixel units. Each set of sound-emitting pixel unit groups is arranged along the center of the substrate toward the edge of the substrate, and each sound-emitting pixel unit in each set of sound-emitting pixel unit groups is arranged along the circumference of the substrate to form a ring-shaped sound-emitting pixel unit array, which is used to convert electrical pulse signals into sound energy pulse signals.

[0016] Optionally, the main earpiece of the earphone includes a first antenna, a first microcontroller, and a first digital sound chip; the secondary earpiece of the earphone includes a second antenna, a second microcontroller, and a second digital sound chip.

[0017] The main earphone receives the raw digital audio signal via Bluetooth and sends the raw digital audio signal to the first microcontroller and to the secondary earphone via Bluetooth. The secondary earphone sends the received raw digital audio signal to the second microcontroller.

[0018] The first microcontroller and the second microcontroller process the original digital audio signal to obtain multiple quantized digital pulse signals, and send the multiple quantized digital pulse signals to the first digital sound chip and the second digital sound chip respectively; the ASIC modules of the first digital sound chip and the second digital sound chip distribute the multiple quantized digital pulse signals to each sound pixel unit, and each pixel unit converts the multiple quantized digital pulse signals into sound pulse signals for output.

[0019] Optionally, the main earpiece of the headset includes a first antenna and a first digital sound chip; the secondary earpiece of the headset includes a second antenna and a second digital sound chip; the microcontroller is located in the terminal, and the microcontroller communicates with the headset wirelessly.

[0020] Optionally, the control module also includes a power supply, a microcontroller, and peripheral circuitry. The microcontroller is used to control the digital chip to produce sound, perform wireless connections, audio processing, and power management.

[0021] The sound-generating module is a digital sound-generating chip used to achieve digital sound generation.

[0022] Optionally, the sound-emitting pixel unit converts the electrical pulse signal into an acoustic energy pulse signal, specifically including:

[0023] After receiving an electrical signal, the sound-generating pixel unit applies a potential difference between the electrode and the diaphragm to generate an electrostatic force, and the diaphragm and the electrode are attracted to each other to generate pulsed sound waves.

[0024] Optionally, the sound-emitting pixel unit converts the electrical pulse signal into an acoustic energy pulse signal, specifically including:

[0025] After receiving an electrical signal, the sound-generating pixel unit applies a pulse voltage to the surface of the piezoelectric material to generate displacement deformation and thus produce sound.

[0026] Optionally, the headphones also include:

[0027] The earphone shell is used to carry the internal circuitry and structure. The main board is placed in the cavity formed by the earphone shell. The main board may be one or more pieces, and it carries the substrate or wiring that enables electrical connections between the digital sound chip and other devices. When there are two main boards, the digital sound chip is mounted on the first main board, which is installed in the earphone shell near the earbud. The microcontroller, the antenna, and the power module are integrated on the second main board, which is installed on the side of the earphone shell away from the earbud.

[0028] Optionally, for TWS earbuds in dual master earbud mode, the microcontrollers of the left and right earbuds simultaneously receive the raw digital audio signals sent by the terminal device. The microcontrollers of the left and right earbuds process the raw digital audio signals to obtain multi-channel quantized digital pulse signals, and send the multi-channel quantized digital pulse signals to the digital sound chip. The sound-generating pixel unit of the digital sound chip converts each electrical signal into sound energy signals, which are superimposed to achieve sound generation.

[0029] Compared with existing technologies, this invention provides a TWS earphone system based on a digital sound chip. The earphones in the TWS earphone system include a main earphone and a secondary earphone. Both the main earphone and the secondary earphone include a control module and a sound-generating module. The control module includes at least an antenna; the sound-generating module includes at least a digital sound-generating chip; the digital sound-generating chip includes at least sound-generating pixel units and an ASIC module. The pixel arrays corresponding to the sound-generating pixel units are arranged in a symmetrical surround pattern, and the ASIC modules are arranged in a stacked manner. The main earphone receives the raw digital audio signal and sends it to the secondary earphone and a microcontroller. The digital sound-generating chip achieves stereo surround sound based on the multi-channel quantized digital pulse signals obtained from the microcontroller. By replacing traditional speaker units with a digital sound-generating chip, the digital audio stream is directly converted into sound waves, realizing the digitization of the sound-generating unit. Furthermore, it can accurately reproduce sound within a specific audio range, solving the problem that a single speaker unit cannot achieve a wide sound frequency response. In addition, the synthesis of the sound wavefront of the earphone based on the digital sound chip is achieved by superimposing thousands of speaker unit arrays. By calling these units through algorithms, a panoramic reconstruction of sound can be achieved, including stereo, surround sound, immersive sound, and other sound effects. In addition, the digital sound chip is small in size, thin and light, saves space and is easy to install, making it very suitable for the small size application requirements of in-ear headphones. Attached Figure Description

[0030] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0031] Figure 1 A block diagram of a TWS earphone system based on a digital sound chip provided by the present invention;

[0032] Figure 2 A schematic diagram illustrating the workflow of a TWS earphone system based on a digital sound chip provided by this invention;

[0033] Figure 3 A front view of the digital sound-generating chip in the TWS earphone system based on the digital sound-generating chip provided by the present invention;

[0034] Figure 4 A schematic diagram of the back of the digital sound chip in the TWS earphone system based on the digital sound chip provided by the present invention;

[0035] Figure 5 A schematic diagram of a TWS earphone based on a digital sound chip provided by the present invention;

[0036] Figure 6 The present invention provides a block diagram of a TWS earphone system when the microcontroller is set in the terminal.

[0037] Figure label:

[0038] 301-Substrate, 302-Sound-emitting pixel unit, 401-Solder joint, 402-ASIC module, 501-Earphone shell, 502-Digital sound-emitting chip, 503-Main board, 504-Earplug. Detailed Implementation

[0039] To facilitate a clear description of the technical solutions in the embodiments of the present invention, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. For example, the first threshold and the second threshold are merely used to distinguish different thresholds and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" are not necessarily different.

[0040] It should be noted that in this invention, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0041] In this invention, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a combination of a and b, a combination of a and c, a combination of b and c, or a, b, and c, where a, b, and c can be single or multiple.

[0042] Next, the solutions provided in the embodiments of this specification will be described in conjunction with the accompanying drawings:

[0043] Figure 1 The block diagram of the TWS earphone system based on the digital sound chip provided by the present invention is as follows: Figure 1 As shown,

[0044] The earphones in a TWS earphone system include a main earphone and a secondary earphone. Both the main earphone and the secondary earphone include a control module and a sound-generating module. The control module includes at least an antenna. The sound-generating module includes at least a digital sound-generating chip. The digital sound-generating chip includes at least sound-generating pixel units and an ASIC module. The pixel arrays corresponding to the sound-generating pixel units are arranged in a symmetrical surround manner, and the ASIC module is arranged in a stacked manner. The main earphone receives the raw digital audio signal and sends it to the secondary earphone and the microcontroller. The digital sound-generating chip achieves stereo surround sound based on multi-channel quantized digital pulse signals.

[0045] Figure 1 The external input can be the raw digital audio signal generated by the electronic terminal; the antenna can be a wireless communication device used to send and receive audio signals. The microcontroller can be used to control the digital chip's sound output, establish wireless connections, process audio, and manage headphone power. The digital sound chip can be used to convert electrical signals into sound energy signals, enabling digital sound output.

[0046] Figure 1 This solution replaces traditional speaker units with digital sound-generating chips, directly converting digital audio streams into sound waves. This digitizes the sound-generating units and accurately reproduces sound within a specific audio range, solving the problem of a single speaker unit's inability to achieve a wide frequency response. Furthermore, in headphones based on digital sound-generating chips, the synthesis of sound wavefronts is achieved by superimposing arrays of thousands of speaker units. Algorithms can utilize these units to achieve panoramic sound reconstruction, including stereo, surround sound, and immersive sound effects. Additionally, digital sound-generating chips are small, thin, and lightweight, saving space and facilitating installation, making them ideal for the compact application requirements of in-ear headphones.

[0047] based on Figure 1 In addition to the above solutions, this specification also provides some specific implementation methods of the system, which will be described below.

[0048] Optional, such as Figure 1 As shown, the main earpiece of the earphone includes a first antenna, a first microcontroller, and a first digital sound chip; the secondary earpiece of the earphone includes a second antenna, a second microcontroller, and a second digital sound chip.

[0049] The workflow of a TWS earphone system based on a digital sound chip is as follows: Figure 2 As shown:

[0050] The main earphone receives audio signals via Bluetooth and sends them to the secondary earphone via Bluetooth. Each earphone then sends the received audio signals to its respective microcontroller.

[0051] The microcontroller processes the audio signal to obtain multiple quantized digital pulse signals, and sends the pulse signals to the digital sound chip;

[0052] The ASIC of the digital sound chip distributes multi-channel quantized digital pulse signals to each sound-producing pixel unit;

[0053] Each sound-emitting pixel unit converts the digital pulse signal into an acoustic pulse signal for output;

[0054] Sound is produced by the superposition of sound waves generated by the M*N cascaded array of sound-producing pixel units on a digital sound chip.

[0055] Optionally, in the technical solution provided by this invention, the shape of the digital sound-generating chip can be set according to actual needs, such as rectangular, circular, square, etc. The digital sound-generating unit can also be circular or other shapes; this invention does not specifically limit this. When setting it, such as... Figure 3 as well as Figure 4 As shown, the digital sound chip may further include:

[0056] Substrate 301 and solder joint 401;

[0057] The substrate 301 is used to connect and support various components, and the solder joint 401 is used to communicate with external devices;

[0058] The sound-emitting pixel unit 302 is circular; the digital sound-emitting chip consists of multiple sound-emitting pixel units 302 cascaded into a sound-emitting pixel unit array, which converts electrical pulse signals into acoustic pulse signals and uses superimposed sound waves to emit sound; the ASIC module 402 is located in the middle of the back side of the pixel unit array; it is used to receive multiple quantized digital pulse signals and distribute the multiple quantized digital pulse signals to each sound-emitting pixel unit 302; multiple sets of sound-emitting pixel unit groups are arranged on the end face of the substrate 301, each set of sound-emitting pixel unit groups includes multiple sound-emitting pixel units 302, each set of sound-emitting pixel unit groups is arranged along the center of the substrate 301 towards the edge of the substrate 301, and each sound-emitting pixel unit 302 in each set of sound-emitting pixel unit groups is arranged along the circumference of the substrate 301 to form a ring sound-emitting pixel unit array, which is used to convert electrical pulse signals into acoustic pulse signals.

[0059] Figure 3 and Figure 4In the structure, the sound-generating pixel unit 302 of the digital sound chip is circular. Considering the miniaturization requirements of in-ear headphones, the ASIC module 402 is stacked and placed on the back of the pixel array to increase area utilization efficiency. To achieve sound effects including stereo, surround sound, and immersive sound, a symmetrical design is adopted. The pixel array can be designed as a ring, with the ASIC module 402 placed in the middle of the ring. Different pixel units are used for different sound effects.

[0060] The structural diagram of the TWS earphone based on the above structural design is as follows: Figure 5 As shown, the headphones may include:

[0061] The device comprises a digital sound chip 502, an earphone shell 501, a motherboard 503, and an earbud 504. The earphone shell 501 houses the internal circuitry and structure. The motherboard 503 is placed within the cavity formed by the earphone shell 501. One or more motherboards 503 may be present, serving as substrates or wiring for electrical connections between the digital sound chip 502 and other components. When there are two motherboards 503, the digital sound chip 502 is mounted on a first motherboard, which is installed near the earbud 504 on the earphone shell 501. The microcontroller, antenna, and power module are integrated on a second motherboard, which is installed on the side of the earphone shell 501 furthest from the earbud 504. Alternatively, as another implementation, the digital sound chip can be directly installed in the earphone shell without a separate motherboard.

[0062] The earphone shell 501 is the main body of the earphone, and the main board 503 can be one or more pieces, carrying the various electronic components (including digital sound chips) used to realize the earphone functions, as well as the substrate or wiring for electrical connections between the components. The main board 503 is fixed in the earphone shell by clips, screws, glue, etc. The earplugs are mainly for easy wearing.

[0063] Since TWS earbuds communicate wirelessly between the left and right earbuds and between the earbuds and the terminal, all components of the main and secondary earbuds must be configured in pairs, including at least a digital sound chip, a microcontroller for controlling the entire system, and a Bluetooth antenna for communication.

[0064] During operation, the microcontroller of the main earphone receives audio signals sent by terminal devices such as computers and mobile phones through the antenna and forwards them to the microcontroller of the secondary earphone. The microcontrollers of the main and secondary earphones process the input signals to obtain multiple quantized digital pulse signals. Then, the quantized pulse signals are sent to the digital sound chip. The sound pixel unit of the digital sound chip converts the electrical signals into sound energy signals and superimposes them to produce sound.

[0065] The solution provided by this invention is also applicable to TWS earbuds in dual-host mode, i.e., true TWS earbuds that directly send audio signals to both the left and right ears simultaneously. In dual-host mode, the microcontrollers of the left and right earbuds simultaneously receive audio signals sent by terminal devices such as computers and mobile phones. Then, each microcontroller processes the input signals to obtain multiple quantized digital pulse signals. The quantized pulse signals are then sent to the digital sound chip. The sound-generating pixel unit of the digital sound chip converts the various electrical signals into sound energy signals, which are then superimposed to achieve sound generation.

[0066] Optionally, to further achieve miniaturization, a microcontroller used to control the digital chip's sound output, perform wireless connectivity, and handle audio processing can be located in the terminal. The system block diagram of the microcontroller in the terminal is as follows: Figure 6 As shown, the headphones only need to include basic components such as a digital sound chip, power supply, and antenna. The microcontroller and headphones communicate wirelessly. The Bluetooth antenna inside the headphones receives processed digital pulse signals, which are then sent to the digital sound chip. The digital sound chip converts the digital pulse signals into sound signals and emits them.

[0067] At this point, the TWS earphone workflow is as follows:

[0068] The terminal's microcontroller receives and processes audio signals to obtain quantized digital pulse signals;

[0069] The headphones receive processed digital pulse signals via Bluetooth and send them to the digital sound chip;

[0070] The ASIC of the digital sound chip distributes multi-channel quantized digital pulse signals to each sound-producing pixel unit;

[0071] Each sound-emitting pixel unit converts the digital pulse signal into an acoustic pulse signal for output;

[0072] Sound is produced by the superposition of sound waves generated by the M*N cascaded array of sound-producing pixel units on a digital sound chip.

[0073] In the solution provided by this invention, the sound generation principle of the digital sound generation chip is as follows: the microcontroller calculates the number and position of the required working pixels based on the input digital audio signal, splits the audio signal into multiple quantized digital audio streams, and outputs them to the ASIC module of the digital sound generation chip. The ASIC distributes the multiple quantized digital pulse signals to each sound generation pixel unit. Each sound generation pixel unit generates pulse sound waves based on the received digital signal, and the sound waves emitted by multiple pixel units are superimposed to achieve sound generation.

[0074] There are several ways for a sound-generating pixel unit to convert an electrical signal into a sound signal. For example, the following two methods will be illustrated:

[0075] Method 1: Electrostatic Mode

[0076] The sound-emitting pixel unit converts electrical pulse signals into acoustic energy pulse signals, specifically including:

[0077] After receiving an electrical signal, the sound-generating pixel unit applies a potential difference between the electrode and the diaphragm to generate an electrostatic force, and the diaphragm and the electrode are attracted to each other to generate pulsed sound waves.

[0078] Method 2: Piezoelectric mode

[0079] The sound-emitting pixel unit converts electrical pulse signals into acoustic energy pulse signals, specifically including:

[0080] After receiving an electrical signal, the sound-generating pixel unit applies a pulse voltage to the surface of the piezoelectric material to generate displacement deformation and thus produce sound.

[0081] The in-ear TWS earphone system based on a digital sound chip provided by this invention replaces the traditional speaker unit with a digital sound chip, directly converting the digital audio stream into sound waves, realizing the digitization of the sound unit, and accurately reproducing sound within the 20Hz to 20000Hz audio range, solving the problem that a single speaker unit cannot achieve a wide sound frequency response. In addition, the synthesis of the sound wavefront of the earphone based on the digital sound chip is achieved by superimposing an array of thousands of speaker units. By calling these units through algorithms, a panoramic reconstruction of sound can be achieved, including stereo, surround sound, immersive sound and other sound effects, giving people an immersive music experience.

[0082] In addition, the digital sound chip is small in size, thin and light, saves space and is easy to install, making it very suitable for the small size application requirements of in-ear headphones.

[0083] The foregoing descriptions include module descriptions, introducing the solutions provided by the embodiments of the present invention from the perspective of the interaction between various modules. It is understood that each module, in order to achieve the above functions, includes corresponding hardware structures and / or software units for executing those functions. Those skilled in the art should readily recognize that, in conjunction with the units and algorithm steps of the examples described in the embodiments disclosed herein, the present invention can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed by hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of the present invention.

[0084] The embodiments of the present invention can divide functional modules according to the above method examples. For example, each function can be divided into its own functional module, or two or more functions can be integrated into one processing module. The integrated module can be implemented in hardware or as a software functional module. It should be noted that the module division in the embodiments of the present invention is illustrative and only represents one logical functional division; other division methods may be used in actual implementation.

[0085] Although the invention has been described herein in conjunction with various embodiments, those skilled in the art will understand and implement other variations of the disclosed embodiments by reviewing the accompanying drawings, the disclosure, and the appended claims in carrying out the claimed invention. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit can implement several functions listed in the claims. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.

[0086] Although the invention has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made therein without departing from the spirit and scope of the invention. Accordingly, this specification and drawings are merely exemplary descriptions of the invention as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. Clearly, those skilled in the art can make various alterations and modifications to the invention without departing from its spirit and scope. Thus, if such modifications and modifications of the invention fall within the scope of the claims and their equivalents, the invention is also intended to include such modifications and modifications.

Claims

1. A TWS earphone system based on a digital sound chip, characterized in that, The TWS earphone system includes a main earphone and a secondary earphone. Both the main earphone and the secondary earphone include a control module and a sound-generating module. The control module includes at least an antenna. The sound-generating module includes at least a digital sound-generating chip. The digital sound-generating chip includes at least sound-generating pixel units, an ASIC module, a substrate, and solder joints. The pixel unit array corresponding to the sound-generating pixel unit is arranged in a symmetrical surrounding manner, and the ASIC module is arranged in a stacked manner. The ASIC module is located in the middle of the back side of the pixel unit array. It is used to receive multiple quantized digital pulse signals and distribute the multiple quantized digital pulse signals to each sound-generating pixel unit. The sound-generating pixel unit is circular. The digital sound-generating chip is composed of multiple sound-generating pixel units cascaded into a sound-generating pixel unit array, which converts electrical pulse signals into sound energy pulse signals and uses superimposed sound waves to generate sound. Multiple sets of sound-emitting pixel unit groups are arranged on the end face of the substrate. Each set of sound-emitting pixel unit groups includes multiple sound-emitting pixel units. Each set of sound-emitting pixel unit groups is arranged from the center of the substrate to the edge of the substrate, and each sound-emitting pixel unit in each set of sound-emitting pixel unit groups is arranged along the circumference of the substrate to form a ring sound-emitting pixel unit array, which is used to convert electrical pulse signals into sound energy pulse signals. The system also includes a microcontroller, which is located in the terminal and communicates wirelessly with the earphone. The microcontroller receives and processes audio signals to obtain quantized digital pulse signals. The earphone receives the processed digital pulse signals via Bluetooth and sends them to the digital sound chip. The ASIC of the digital sound chip distributes the multiple quantized digital pulse signals to each sound-emitting pixel unit. Each sound-emitting pixel unit converts the digital pulse signals into sound pulse signals for output. The M on the digital sound chip... The sound waves generated by N cascaded arrayed sound-producing pixel units are superimposed to each other to produce sound; Alternatively, the main earpiece of the headphones includes a first antenna, a first microcontroller, and a first digital sound chip; the secondary earpiece of the headphones includes a second antenna, a second microcontroller, and a second digital sound chip; the main earpiece receives raw digital audio signals via Bluetooth and sends the raw digital audio signals to the first microcontroller and the secondary earpiece via Bluetooth, and the secondary earpiece sends the received raw digital audio signals to the second microcontroller; the first and second microcontrollers process the raw digital audio signals to obtain multiple quantized digital pulse signals, and send the multiple quantized digital pulse signals to the first and second digital sound chips respectively; the ASIC modules of the first and second digital sound chips distribute the multiple quantized digital pulse signals to each sound-emitting pixel unit, and each pixel unit converts the multiple quantized digital pulse signals into sound pulse signals for output.

2. The system according to claim 1, characterized in that, The substrate is used to connect and support the various components, and the solder joints are used to communicate with external devices.

3. The system according to claim 1, characterized in that, The control module also includes a power supply, a microcontroller, and peripheral circuits. The microcontroller is used to control the digital sound chip to produce sound, perform wireless connection, audio processing, and power management. The sound-generating module is a digital sound-generating chip used to achieve digital sound generation.

4. The system according to claim 1, characterized in that, The sound-emitting pixel unit converts electrical pulse signals into acoustic energy pulse signals, specifically including: After receiving an electrical signal, the sound-generating pixel unit applies a potential difference between the electrode and the diaphragm to generate an electrostatic force, and the diaphragm and the electrode are attracted to each other to generate pulsed sound waves.

5. The system according to claim 1, characterized in that, The sound-emitting pixel unit converts electrical pulse signals into acoustic energy pulse signals, specifically including: After receiving an electrical signal, the sound-generating pixel unit applies a pulse voltage to the surface of the piezoelectric material to generate displacement deformation and thus produce sound.

6. The system according to claim 1, characterized in that, The headphones also include: The device comprises an earphone shell, a motherboard, and an earbud. The earphone shell houses the internal circuitry and structure. The motherboard is placed within a cavity formed by the earphone shell. The motherboard may consist of one or more boards and serves as a substrate or wiring for electrical connections between the digital sound chip and other components. When there are two motherboards, the digital sound chip is mounted on a first motherboard, which is installed near the earbud in the earphone shell. The microcontroller, the antenna, and the power module are integrated on a second motherboard, which is installed on the side of the earphone shell furthest from the earbud.

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