Casing, preparation method thereof and electronic device

Abstract

The present application provides a shell, a preparation method thereof and an electronic device. The shell of the present application comprises: a shell body, the raw material components of the shell body include inorganic powder, thermoplastic resin and photoexpansion agent; the photoexpansion agent is dispersed in part of the shell body. The shell of the present application has light weight, high hardness and wear resistance.

Description

Technical Field

[0001] The present application relates to the field of electronics, and in particular to a housing, a preparation method thereof, and an electronic device. Background Art

[0002] Ceramics have a warm feel and a high-gloss texture, so they are often used in high-end electronic equipment housings, middle frames, decorative parts and other exterior structural parts. However, ceramics have high density, harsh processing conditions and high processing costs, which greatly limits their application. Therefore, resin is added to ceramics to reduce the processing performance of ceramics, but this greatly reduces the hardness and wear resistance of the housing. Summary of the invention

[0003] In view of the above problems, an embodiment of the present application provides a shell having light weight, high hardness and wear resistance.

[0004] The present application embodiment provides a housing comprising:

[0005] The shell body is made of inorganic powder, thermoplastic resin and photoexpansion agent, and the photoexpansion agent is dispersed in part of the shell body.

[0006] Based on the same inventive concept, an embodiment of the present application further provides a method for preparing a shell, wherein the shell includes a shell body, and the method includes:

[0007] Mixing inorganic powder with thermoplastic resin and molding to obtain an embryonic body;

[0008] Introducing a photoexpansion agent into the surface layer of the embryo body; and

[0009] Irradiation is performed to expand the volume of the photoexpansion agent to obtain a shell body, wherein the photoexpansion agent is dispersed in a portion of the shell body.

[0010] Based on the same inventive concept, an embodiment of the present application further provides an electronic device, including:

[0011] Display component, used for display;

[0012] The housing of the embodiment of the present application has a containing space; and

[0013] A circuit board assembly is disposed in the accommodating space and is electrically connected to the display assembly for controlling the display assembly to display.

[0014] The raw material components of the shell body of the shell of the present application include inorganic powder, thermoplastic resin and photoexpansion agent. The thermoplastic resin makes the shell have better processing performance and lighter weight. After being exposed to light, the photoexpansion agent inside the shell body will expand in volume, generate internal stress and make the molecules more dense, thereby improving the hardness and wear resistance of the shell body, thereby making the shell have better processing performance and lighter weight, while having higher hardness and wear resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 It is a structural schematic diagram of a shell according to an embodiment of the present application.

[0017] Figure 2 It is a structural schematic diagram of a shell of another embodiment of the present application.

[0018] Figure 3 It is a structural schematic diagram of a shell of another embodiment of the present application.

[0019] Figure 4 It is a schematic diagram of the process of a method for preparing a shell provided in one embodiment of the present application.

[0020] Figure 5 It is a schematic flow chart of a method for preparing a shell provided in yet another embodiment of the present application.

[0021] Figure 6 It is a schematic flow chart of a method for preparing a shell provided in yet another embodiment of the present application.

[0022] Figure 7 It is a schematic flow chart of a method for preparing a shell provided in yet another embodiment of the present application.

[0023] Figure 8 It is a schematic diagram of the exploded structure of the electronic device according to an embodiment of the present application.

[0024] Fig. 9 It is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0025] Description of reference numerals:

[0026] 100-housing 600-electronic equipment

[0027] 101- bottom plate 610- display component

[0028] 103-side panel 601-accommodation space

[0029] 10-housing body 630-circuit board assembly

[0030] 11-First layer 631-Processor

[0031] 13-Middle layer 633-Memory

[0032] 15-Second floor 635-Power supply

[0033] 30-Protection layer DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0036] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0037] It should be noted that, for the convenience of explanation, in the embodiments of the present application, the same figure marks represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0038] Ceramics have a warm feel and a high-gloss texture, so they are often used as exterior structural parts of high-end electronic equipment such as housings, middle frames, and decorative parts. However, ceramics have a high density, and the resulting electronic equipment exterior structural parts are heavy, and have a high pencil hardness, are easy to break, and are difficult to process. In addition, the processing cost of ceramics is high, which greatly limits the application of ceramics. In order to improve the performance and cost of ceramics, the related art uses a thermoplastic resin and a ceramic powder (inorganic powder) to mix and make the housing of the electronic equipment by injection molding. However, when injection molding is used, the content of the ceramic powder is difficult to reach more than 90%. When the content of the ceramic powder exceeds 90% of the total weight of the ceramic and thermoplastic resin, the mixed thermoplastic resin / ceramic powder has poor fluidity, and the injection molding process has large resistance and obvious flow marks. Therefore, during injection molding, the content of the ceramic powder is usually less than 90%. However, when the content of the ceramic powder is less than 90%, the hardness of the housing of the electronic equipment is low and the wear resistance is poor, thereby reducing the life of the housing of the electronic equipment.

[0039] See also Figure 1 The shell 100 provided in the embodiment of the present application includes a shell body 10, and the raw material components of the shell body 10 include inorganic powder, thermoplastic resin and photoexpansion agent.

[0040] Optionally, the housing 100 of the present application may be a housing, a middle frame, a decorative piece, etc. of an electronic device. The housing 100 of the embodiment of the present application may be a 2D structure, a 2.5D structure, a 3D structure, etc.

[0041] Optionally, the housing 100 includes a bottom plate 101 and a side plate 103 connected to the bottom plate 101 by bending.

[0042] The term "photoexpansion agent" in this application refers to a material that can expand in volume under the action of light. Optionally, the photoexpansion agent can undergo a molecular isomerization reaction (for example, a cis structure becomes a trans structure), a ring-opening reaction, or other reactions that increase the size of the photoexpansion agent molecules under the irradiation of light such as ultraviolet light, visible light, near-infrared light, etc., thereby causing the volume of the material to expand.

[0043] Optionally, when in use, the housing 100 is first placed under a light source (such as ultraviolet light, visible light or near infrared light) for illumination to expand the volume of the photoexpansion agent in the housing body 10. In other words, when in use, the photoexpansion agent in the housing body 10 of the housing 100 is an expanded photoexpansion agent.

[0044] The shell body 10 of the shell 100 of the present application is made of raw material components including inorganic powder, thermoplastic resin and photoexpansion agent. The thermoplastic resin enables the shell 100 to have better processing performance and lighter weight. After being exposed to light, the photoexpansion agent inside the shell body 10 will expand in volume, generate internal stress and make the molecular arrangement in the shell body 10 more dense, thereby improving the hardness and wear resistance of the shell body 10, thereby enabling the shell 100 to have better processing performance and lighter weight while having higher hardness and wear resistance.

[0045] See also Figure 2 In some embodiments, the shell body 10 includes a first layer 11, an intermediate layer 13 and a second layer 15 which are stacked in sequence. The raw material components of the first layer 11 and the second layer 15 both include inorganic powder, thermoplastic resin and photoexpansion agent; the raw material components of the intermediate layer 13 include inorganic powder and thermoplastic resin. Photoexpansion agent is added to the first layer 11 and the second layer 15, and the intermediate layer 13 does not have photoexpansion agent. When the first layer 11 and the second layer 15 are exposed to light, the photoexpansion agent in the first layer 11 and the second layer 15 expands in volume, so that the first layer 11 and the second layer 15 respectively generate tensile stress on the intermediate layer 13 and are subjected to compressive stress of the intermediate layer 13. In this way, the hardness of the shell body 10 can be improved without reducing the toughness of the shell body 10, so that the shell body 10 has both high hardness and high toughness.

[0046] Optionally, the content of the photoexpansion agent in the first layer 11 gradually decreases from the surface of the first layer 11 away from the intermediate layer 13 to the surface of the first layer 11 close to the intermediate layer 13; in this way, after the shell body 10 is exposed to light, the volume expansion degree of the photoexpansion agent in the first layer 11 gradually decreases from the surface of the first layer 11 away from the intermediate layer 13 to the surface of the first layer 11 close to the intermediate layer 13, thereby achieving a more uniform stress distribution and enhanced hardness and wear resistance in the first layer 11, which can avoid excessive compressive stress in the layer (the surface of the first layer 11 away from the intermediate layer 13) and tensile stress in the inner layer (the surface of the first layer 11 close to the intermediate layer 13) due to excessive volume change differences in adjacent areas. If these stresses exceed the intrinsic yield and fracture strength of the material, they will cause material failure.

[0047] Optionally, the content of the photoexpansion agent in the second layer 15 gradually decreases from the surface of the second layer 15 far from the intermediate layer 13 to the surface of the second layer 15 close to the intermediate layer 13; in this way, after the shell body 10 is exposed to light, the volume expansion degree of the photoexpansion agent in the second layer 15 gradually decreases from the surface of the second layer 15 far from the intermediate layer 13 to the surface of the second layer 15 close to the intermediate layer 13, thereby achieving a more uniform stress distribution and enhanced hardness and wear resistance in the second layer 15, which can avoid excessive compressive stress in the layer (the surface of the second layer 15 far from the intermediate layer 13) and tensile stress in the inner layer (the surface of the second layer 15 close to the intermediate layer 13) due to excessive volume change differences in adjacent areas. If these stresses exceed the intrinsic yield and fracture strength of the material, they will cause material failure.

[0048] Optionally, there is no phase interface between the first layer 11, the middle layer 13 and the second layer 15. It should be understood that the first layer 11, the middle layer 13 and the second layer 15 have the same substrate, and the substrate is formed in the same process (such as injection molding). In this way, the integrity of the shell 100 obtained can be better, and it is not easy to produce stratification after long-term use, and has a higher service life. The term "phase interface" in this application refers to the transition zone between two phases of a substance in close contact, or the interface between phases of a substance. The phase interface includes five different interfaces: gas-liquid, gas-solid, liquid-liquid, liquid-solid and solid-solid.

[0049] Optionally, along the stacking direction of the first layer 11, the middle layer 13 and the second layer 15, the thickness of the first layer 11 is 5% to 10% of the thickness of the shell body 10; specifically, it can be but not limited to 5%, 6%, 7%, 8%, 9%, 10%. When the thickness of the first layer 11 is too thin, the compressive stress generated by the first layer 11 is too small, so that the hardness of the shell body 10 is slightly improved; when the thickness of the first layer 11 is too thick, the compressive stress generated by the first layer 11 is too large, so that the overall toughness of the shell body 10 is reduced; in addition, when at least one of the compressive stress on the first layer 11, the compressive stress on the second layer 15, or the tensile stress on the middle layer 13 is greater than the limit of the shell body 10 to withstand the compressive stress, the first layer 11, the second layer 15, or the middle layer 13 will have internal defects, damage or fracture.

[0050] Optionally, the volume expansion rate of the photoexpansion agent is 10% to 100%. In other words, the volume of the photoexpansion agent after light expansion is 1.1 to 2 times the volume before light. In other words, the volume of the photoexpansion agent after light expansion is expanded by 10% to 100% compared with that before light. Specifically, the volume expansion rate of the photoexpansion agent can be, but is not limited to, 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, 100%, etc. If the volume expansion rate of the photoexpansion agent is too small, the expansion degree of the photosensitive material in the shell body 10 is small after illumination, the internal stress is small, and the pencil hardness enhancement effect of the shell body 10 is not obvious. If the volume expansion rate of the photoexpansion agent is too large, the expansion degree of the photosensitive material in the shell body 10 is too large after illumination. When at least one of the compressive stress on the first layer 11, the compressive stress on the second layer 15, or the tensile stress on the middle layer 13 is greater than the compressive stress limit of the shell body 10, the first layer 11, the second layer 15, or the middle layer 13 will have internal defects, damage or fracture.

[0051] Optionally, the photoexpanding agent may be, but is not limited to, one or more of compounds, derivatives, polymers, mixtures, or copolymers containing one or more of a cis-azobenzene group, a cinnamic acid group, or a benzospiropyran group.

[0052] Optionally, the compound containing azobenzene groups may be, but is not limited to, azobenzene, azobenzene derivatives, etc. Under the action of light, the compound, derivative, polymer, mixture, or copolymer containing azobenzene groups may undergo molecular isomerization reactions, such as the cis structure changing to the trans structure. When the azobenzene group changes from the cis structure to the trans structure, the length of the azobenzene group changes from 0.55 nm to 0.90 nm, thereby causing volume expansion. The molecular isomerization reaction equation of the compound containing cis azobenzene groups is as follows:

[0053]

[0054] Optionally, the copolymer containing cinnamic acid groups may be, but is not limited to, one or more of a copolymer of acryloyl-cinnamoyl-ethylene glycol and butyl acrylate, a copolymer of acryloyl-cinnamoyl-ethylene glycol and hydroxyethyl methacrylate, etc. Compounds, derivatives, polymers, mixtures, or copolymers containing cinnamic acid group copolymers may undergo a ring-opening reaction under light, thereby causing volume expansion. The ring-opening reaction equation of the compound containing cinnamic acid groups is as follows:

[0055]

[0056] Optionally, the derivative containing benzospiropyran group may be, but not limited to, benzospiropyran indole. The mixture containing benzospiropyran group may be, but not limited to, a mixture of benzospiropyran indole and polymethyl methacrylate. When the compound, derivative, polymer, mixture, or copolymer containing benzospiropyran group is exposed to light, the benzospiropyran group will undergo a ring-opening reaction, thereby causing volume expansion. The ring-opening reaction equation of the compound containing benzospiropyran group is as follows:

[0057]

[0058] Optionally, the weight content of the photoexpansion agent is 0.005% to 0.15% of the total weight of the shell body 10. Specifically, it can be, but not limited to, 0.005%, 0.01%, 0.03%, 0.05%, 0.08%, 0.1%, 0.12%, 0.15%, etc. When the content of the photoexpansion agent is lower than 0.005%, after illumination, the expansion degree of the photosensitive variable material in the shell body 10 is small, the internal stress is small, and the pencil hardness enhancement effect of the shell body 10 is not obvious. When the content of the photoexpansion agent is higher than 0.15%, after illumination, the expansion degree of the photosensitive variable material in the shell body 10 is too large. When at least one of the compressive stress on the first layer 11, the compressive stress on the second layer 15, or the tensile stress on the intermediate layer 13 is greater than the limit of the shell body 10 to withstand the compressive stress, the first layer 11, the second layer 15, or the intermediate layer 13 will have internal defects, damage or fracture.

[0059] Optionally, the weight ratio of the inorganic powder to the thermoplastic resin is 1:1 to 10:1. Specifically, the weight ratio of the inorganic powder to the thermoplastic resin can be, but is not limited to, 1:1, 2:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, 9:1, 10:1, and the like. When the content of the inorganic powder is too small, the wear resistance of the shell 100 obtained is poor, which reduces the life of the shell 100. At the same time, the glossiness of the surface is poor, which affects the ceramic texture of the shell 100. When the content of the inorganic powder is too large, the shell body 10 is difficult to form, and the toughness of the shell 100 obtained is poor and easy to break. When the weight ratio of the inorganic powder to the thermoplastic resin is 1:1 to 10:1, the shell 100 obtained has a better ceramic texture and feel, and has a higher pencil hardness, and at the same time has higher toughness and is not easy to break.

[0060] Compared with a ceramic matrix prepared using thermosetting resin or thermosetting resin + thermoplastic resin, the shell 100 of the embodiment of the present application uses thermoplastic resin to prepare the shell body 10 during preparation, so that the shell body 10 can be prepared by injection molding, thereby reducing the preparation cost of the shell body 10; while the ceramic substrate including thermosetting resin cannot be prepared by injection molding during preparation, and can only be prepared by other methods except injection molding, and the preparation cost is relatively high.

[0061] In some embodiments, the inorganic powder is an inorganic powder modified by a surfactant. Modifying the inorganic powder with a surface modifier can increase the compatibility between the inorganic powder and the thermoplastic resin, improve the bonding force between the inorganic powder and the thermoplastic resin, and make the inorganic powder and the thermoplastic resin mix more evenly, and the mixed system is more stable, thereby improving the mechanical properties of the housing body 10, and further improving the mechanical properties of the housing 100.

[0062] Optionally, the inorganic powder may be, but is not limited to, a ceramic powder, and the ceramic powder includes one or more of aluminum oxide, silicon dioxide, titanium dioxide, silicon nitride, silicon, magnesium oxide, chromium oxide, beryllium oxide, vanadium pentoxide, boron trioxide, spinel, zinc oxide, calcium oxide, mullite, and barium titanate.

[0063] Optionally, the surface modifier may be, but is not limited to, one or more of a silane coupling agent, a borate coupling agent, and a titanate coupling agent. Optionally, the amount of the surface modifier added is 0.5% to 3% of the weight of the inorganic powder. Specifically, the amount of the surface modifier added may be, but is not limited to, 0.5%, 0.8%, 1.0%, 1.5%, 1.8%, 2.0%, 2.3%, 2.8%, 3.0%, etc. When the amount of the surface modifier added is less than 0.5%, the modification of the inorganic powder is incomplete. In other words, part of the inorganic powder is not modified, which affects the bonding force between the inorganic powder and the thermoplastic resin. When the amount of the surface modifier added is greater than 3%, too many surface modifier molecules are deposited on the surface of the inorganic powder, making the obtained inorganic powder easy to agglomerate and difficult to be evenly dispersed in the thermoplastic resin, which is not conducive to improving the mechanical properties of the shell 100.

[0064] Alternatively, the inorganic powder can be prepared by the following steps:

[0065] 1) dissolving the surface modifier in alcohol, or water, or an alcohol-water mixed solvent and mixing them evenly; and optionally, the alcohol may be, but is not limited to, ethanol, propanol, etc., which is not specifically limited in the present application.

[0066] 2) Add inorganic powder, mix evenly at room temperature, and dry to obtain inorganic powder.

[0067] Specifically, after the inorganic powder is added, it can be placed at room temperature, mixed by mechanical stirring or ultrasonic wave, and then dried by flash evaporation or in a vacuum drying oven at 60° C. to 80° C. to obtain the inorganic powder.

[0068] In some embodiments, the thermoplastic resin may be, but is not limited to, one or more of polyphenylenesulfide (PPS), polysulfone (PSU), polyethersulfone (PES), polyetherketone (PEK), polycarbonate, polyamide, and polymethyl methacrylate. When the thermoplastic resin is one or more of polyphenylenesulfide, polysulfone, polyethersulfone, or polyetherketone, after the shell body 10 is formed, the thermoplastic resin may be chain extended and cross-linked at a temperature higher than the melting temperature of the thermoplastic resin to improve the crystallinity and cross-linking degree of the thermoplastic resin, and the inorganic powder may be better bound in the cross-linking network of the thermoplastic resin, which is beneficial to improve the bonding force between the thermoplastic resin and the inorganic powder, and improve the pencil hardness and toughness of the shell 100.

[0069] In some embodiments, the raw material components of the shell body 10 also include a dispersant, which is used to make the thermoplastic resin and the inorganic powder more evenly mixed, and the mixed system after mixing is more stable. The dispersant can be, but is not limited to, liquid paraffin, etc. The added amount of the dispersant can be 2% to 6% of the total weight of the thermoplastic resin and the inorganic powder, specifically, it can be, but is not limited to, 2%, 3%, 4%, 5%, 6%, etc.

[0070] In some embodiments, the raw material components of the shell body 10 further include a plasticizer, which is used to enhance the plasticity of the thermoplastic resin and the fluidity of the molten state, thereby reducing the processing temperature of the shell body 10 and improving the processing performance of the shell 100. The plasticizer may be, but is not limited to, dioctyl oxalate, and the amount of the plasticizer added may be 2% to 6% of the total weight of the thermoplastic resin and the inorganic powder, specifically, but not limited to, 2%, 3%, 4%, 5%, 6%, etc.

[0071] In some embodiments, the raw material components of the shell body 10 also include pigments, and the pigments are used to make the shell body 10 have a color pattern or color, so that the shell 100 has a color pattern or color, such as the pattern and color of blue and white porcelain. By controlling the color and ratio of the pigment, the shell body 10 can present different appearance effects, so that the shell 100 can present different appearance effects. Optionally, the added amount of the pigment can be 0.5% to 5% of the total weight of the thermoplastic resin and the inorganic powder, specifically, it can be but not limited to 0.5%, 1%, 2%, 3%, 4%, 5%, etc.

[0072] Optionally, the thickness of the shell body 10 is 0.3 mm to 1 mm; specifically, the thickness of the shell body 10 may be, but is not limited to, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, etc. When the shell body 10 is too thin, it cannot play a good supporting and protective role, and the mechanical strength cannot meet the requirements of the electronic device shell 100. When the shell body 10 is too thick, the weight of the electronic device is increased, the feel of the electronic device is affected, and the user experience is not good.

[0073] Optionally, the surface roughness of the shell body 10 is Ra 0.02 to Ra 0.08, specifically, but not limited to, Ra 0.02, Ra 0.03, Ra 0.04, Ra 0.05, Ra 0.06, Ra0.07, Ra 0.08, etc. If the roughness is too large, the ceramic texture of the shell 100 will be affected, and if the roughness is too small, the process requirements are too strict and the preparation cost is high.

[0074] Optionally, the pencil hardness of the shell body 10 is 2H to 9H; specifically, it can be, but not limited to, 2H, 3H, 4H, 5H, 6H, 7H, 8H, 9H, etc. If the pencil hardness of the shell body 10 is too low, the wear resistance of the shell 100 is poor, and after a period of use, the glossiness and ceramic texture of the surface of the shell 100 are affected.

[0075] See also Figure 3 In some embodiments, the shell 100 of the embodiment of the present application further includes a protective layer 30 , which is disposed on the surface of the shell body 10 . The protective layer 30 is used for anti-fouling and anti-fingerprint purposes to improve the user experience of the shell 100 .

[0076] In some embodiments, the water contact angle of the protective layer 30 is greater than 105°. Specifically, it can be but is not limited to 106°, 110°, 115°, 120°, 125°, 130°, 140°, 150°, etc. The larger the water contact angle, the better the anti-fingerprint effect of the protective layer 30.

[0077] Optionally, the protective layer 30 is light-transmissive, and the optical transmittance of the protective layer 30 is greater than or equal to 80%, specifically, it can be but not limited to 80%, 82%, 85%, 88%, 90%, 92%, 95%, 96%, 97%, etc. The protective layer 30 has a high light transmittance, so it will not block the ceramic texture and texture color of the shell body 10, thereby affecting the appearance of the shell 100.

[0078] In some embodiments, the raw material components of the protective layer 30 may include but are not limited to one or more of perfluoropolyether, perfluoropolyether derivatives, etc. The protective layer 30 is formed by evaporating a layer of glue composed of the raw material components of the protective layer 30 on the surface of the shell body 10. Perfluoropolyether and perfluoropolyether derivatives have excellent fingerprint resistance and can play a good anti-fingerprint and anti-fouling role. Optionally, the thickness of the protective layer 30 is 5nm to 20nm, specifically, it can be but not limited to 5nm, 6nm, 8nm, 10nm, 12nm, 14nm, 16nm, 18nm, 20nm, etc. If the thickness of the protective layer 30 is too thin, it will not play an anti-fouling and anti-fingerprint role. If the protective layer 30 is too thick, the preparation cost of the shell 100 will be increased, and the feel of the shell 100 will be affected.

[0079] Please also see Figure 2 and Figure 4 The present application also provides a method for preparing a housing 100, which can be applied to prepare the housing 100 of the above embodiment. The housing 100 includes a housing body 10, and the method for preparing the housing 100 includes:

[0080] S201, mixing inorganic powder with thermoplastic resin, and molding to obtain an embryonic body.

[0081] Optionally, the mixing may be performed by, but not limited to, one or more of dry mixing and wet mixing. The term "dry mixing" in this application refers to a method in which each solid component is mixed by, for example, ball milling, sand milling, mechanical blending, etc. The term "wet mixing" in this application refers to a method in which each solid component is mixed by, for example, ball milling, sand milling, mechanical blending, etc. under the action of water or other liquids.

[0082] Optionally, the molding may be, but is not limited to, one or more of injection molding, high temperature compression molding, hot pressing molding, and the like.

[0083] Optionally, when the molding is injection molding, the temperature of the injection molding is Tm to Tm+80°C, wherein Tm is the melting temperature of the thermoplastic resin. The term "melting temperature" in this application refers to the temperature at which the thermoplastic resin is completely converted from a high elastic state to a molten state. Specifically, the temperature of the injection molding may be, but is not limited to, Tm, Tm+10°C, Tm+20°C, Tm+30°C, Tm+40°C, Tm+50°C, Tm+60°C, Tm+70°C, Tm+80°C, etc. When the injection molding temperature is too low, the viscosity of the thermoplastic resin is too large and the fluidity is poor, so that the shell body 10 obtained has obvious flow marks, the appearance is not beautiful enough, and the porosity is large, the pencil hardness and toughness are low. When the injection molding temperature is too high, the thermoplastic resin may be partially decomposed, which will also affect the mechanical properties of the obtained shell body 10. In some embodiments, the injection molding temperature is 200°C to 350°C, specifically, but not limited to, 200°C, 220°C, 240°C, 250°C, 270°C, 290°C, 310°C, 330°C, 350°C, 360°C, etc. In a specific embodiment, when the thermoplastic resin is polyphenylene sulfide, and the Tm of the polyphenylene sulfide is 295°C, the injection molding temperature ranges from 300°C to 360°C. The injection molding temperature of the present application refers to the temperature of the injection molding machine head.

[0084] In a specific embodiment, the thermoplastic resin is polyphenylene sulfide, and the following temperature sections are used in the injection molding machine to gradually increase the temperature for injection molding: the first temperature section 270°C to 290°C, the second temperature section 290°C to 310°C, the third temperature section 310°C to 330°C, the fourth temperature section 330°C to 350°C, and the head temperature 330°C to 350°C; mold temperature: 160°C.

[0085] In this embodiment, the thermoplastic resin may be, but is not limited to, one or more of polyphenylene sulfide, polysulfone, polyether sulfone, polyether ketone, polycarbonate, polyamide, and polymethyl methacrylate.

[0086] For detailed description of the inorganic powder and the thermoplastic resin, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0087] When the raw material components of the shell body 10 further include one or more of a dispersant, a plasticizer and a pigment, step S201 further includes mixing one or more of the dispersant, the plasticizer and the pigment with the inorganic powder and the thermoplastic resin.

[0088] In some embodiments, after mixing the inorganic powder with the thermoplastic resin and before molding, the method further comprises:

[0089] The mixed inorganic powder and thermoplastic resin are subjected to banburying granulation, and the banburying granulation process is in a negative pressure state (in other words, a vacuum state) or an inert atmosphere, and the temperature of the banburying granulation is Tm to Tf, wherein Tf is the decomposition temperature of the thermoplastic resin, in other words, TF is the temperature at which the thermoplastic resin begins to decompose. Banburying is performed above the melting temperature of the thermoplastic resin, at which time the thermoplastic resin is in a molten state, and the clustered inorganic powder can be better broken up during the banburying process, so that the inorganic powder can be more evenly dispersed in the thermoplastic resin, thereby improving the mechanical properties of the obtained shell 100. In addition, during banburying, the thermoplastic resin begins to melt and flow, and the molecular chains of each thermoplastic resin move and entangle together to form a three-dimensional through network structure, so that the binding force between the thermoplastic resin molecules and between the thermoplastic resin and the inorganic powder is increased. At the same time, the inorganic powder can be wrapped in the network structure formed by the thermoplastic resin, which is conducive to increasing the pencil hardness and toughness of the formed shell body 10. The mixing process is in a negative pressure state, which can better prevent the thermoplastic resin from being oxidized. In addition, it can also better discharge the gas generated by the side reactions during the mixing process, preventing the gas generated by the side reactions from staying in the system to form pores and affecting the mechanical properties of the shell body 10.

[0090] In some embodiments, the temperature of the banburying granulation is 200°C to 350°C, specifically, but not limited to, 200°C, 220°C, 240°C, 250°C, 270°C, 290°C, 310°C, 330°C, 350°C, etc. In a specific embodiment, when the thermoplastic resin is polyphenylene sulfide, and the Tm of the polyphenylene sulfide is 295°C, the temperature of the banburying granulation ranges from 300°C to 360°C.

[0091] Optionally, the gas pressure of the banburying process is less than 0.01Mpa, for example, it can be but not limited to 0.008Mpa, 0.005Mpa, 0.001Mpa, 0.0008Mpa, 0.0005Mpa, 0.0001Mpa, etc. The smaller the gas pressure of the banburying process is, the less likely the thermoplastic resin is to be oxidized, and the more conducive to the discharge of the gas produced by the side reaction is. However, the smaller the gas pressure is, the higher the requirements for the reaction equipment are, and the operating risk factor increases. In addition, the banburying process can also be in an inert atmosphere. In other words, the banburying process is carried out under the protection of an inert gas such as nitrogen or argon.

[0092] Optionally, the banburying time is 2 hours to 12 hours, specifically, it can be but not limited to 2 hours, 4 hours, 6 hours, 8 hours, 9 hours, 10 hours, 12 hours, etc. If the banburying time is too short, the inorganic powder and the thermoplastic resin cannot be fully mixed (uneven mixing), and if the banburying time is too long, the mixing uniformity between the inorganic powder and the thermoplastic resin will not be greatly changed.

[0093] S202, introducing a photoexpansion agent into the surface layer of the embryo body.

[0094] In some embodiments, the introducing the photoexpanding agent into the surface layer of the embryo body comprises: coating a photoexpanding agent solution on the surface of the embryo body so that the photoexpanding agent enters the surface layer of the embryo body.

[0095] Specifically, the photoexpansion agent is dissolved in a solvent to form a photoexpansion agent solution, which is then sprayed, spin-coated, or coated on the surface of the embryo, and then placed in a vacuum drying oven for drying, for example, at any temperature below the boiling point of the solvent and at an air pressure of less than 0.1 MPa for 12 to 24 hours.

[0096] Optionally, the mass concentration of the photoexpanding agent in the photoexpanding agent solution is 0.1 mg / mL to 5 mg / mL, specifically, it can be but is limited to 0.1 mg / mL, 0.5 mg / mL, 1 mg / mL, 2 mg / mL, 3 mg / mL, 4 mg / mL, 5 mg / mL, etc. When the mass concentration of the photoexpanding agent in the photoexpanding agent solution is too small, the amount of the photoexpanding agent entering the surface layer of the embryo body is small, so that the pencil hardness and wear resistance of the shell 100 are not significantly improved. When the mass concentration of the photoexpanding agent in the photoexpanding agent solution is too large, the expansion degree of the photosensitive material in the shell body 10 is too large after illumination. When at least one of the compressive stress on the first layer 11, the compressive stress on the second layer 15, or the tensile stress on the intermediate layer 13 is greater than the limit of the shell body 10 to withstand the compressive stress, the first layer 11, the second layer 15, or the intermediate layer 13 will cause internal defects, damage or fracture.

[0097] Optionally, the solvent may be, but is not limited to, one or more of ethanol, acetone, ethyl acetate, benzene, toluene, dichloromethane, and the like.

[0098] Optionally, after the photoexpansion agent solution is coated on the surface of the embryo, it is first placed for 1 to 5 minutes and then placed in a vacuum drying oven for drying. Specifically, the placement time can be, but is not limited to, 1 minute, 2 minutes, 3 minutes, 4 minutes, 5 minutes, etc. If the placement time is too short, the photoexpansion agent only stays in a very thin layer on the surface. After illumination, the compressive stress generated by the first layer 11 and the second layer 15 is too small, so that the hardness of the shell body 10 obtained is slightly improved; if the placement time is too long, the thickness of the photoexpansion agent entering the embryo is relatively thick, and the thickness of the first layer 11 and the second layer 15 in the formed shell body 10 is relatively thick, and the compressive stress generated by the first layer 11 and the second layer 15 is too large, so that the overall toughness of the shell body 10 obtained is reduced. In addition, when at least one of the compressive stress on the first layer 11, the compressive stress on the second layer 15, or the tensile stress on the intermediate layer 13 is greater than the limit of the shell body 10 to withstand the compressive stress, the first layer 11, the second layer 15, or the intermediate layer 13 will have internal defects, damage or fracture.

[0099] In some other embodiments, the introducing the photo-swelling agent into the surface layer of the embryo body comprises: immersing the embryo body in a solution of the photo-swelling agent so that the photo-swelling agent enters the surface layer of the embryo body.

[0100] Specifically, the photoexpansion agent is dissolved in a solvent to form a photoexpansion agent solution, and then the embryo is immersed in the photoexpansion agent solution, and then placed in a vacuum drying oven for drying, for example, at any temperature below the boiling point of the solvent and an air pressure of less than 0.1 MPa for 12 to 24 hours. Optionally, the solvent may be, but is not limited to, one or more of ethanol, acetone, ethyl acetate, benzene, toluene, dichloromethane, and the like.

[0101] Optionally, the embryo is immersed in the photoexpansion agent solution for 1 to 5 minutes and then placed in a vacuum drying oven for drying. Specifically, the immersion time may be, but is not limited to, 1 minute, 2 minutes, 3 minutes, 4 minutes, 5 minutes, etc. If the immersion time is too short, the photoexpansion agent only stays in a very thin layer on the surface. After illumination, the compressive stress generated by the first layer 11 and the second layer 15 is too small, so that the hardness of the shell body 10 obtained is slightly improved; if the immersion time is too long, the thickness of the photoexpansion agent entering the embryo is relatively thick, and the thickness of the first layer 11 and the second layer 15 in the shell body 10 formed is relatively thick. The compressive stress generated by the first layer 11 and the second layer 15 is too large, so that the overall toughness of the shell body 10 obtained is reduced. In addition, when at least one of the compressive stress on the first layer 11, the compressive stress on the second layer 15, or the tensile stress on the intermediate layer 13 is greater than the limit of the shell body 10 to withstand the compressive stress, the first layer 11, the second layer 15, or the intermediate layer 13 will have internal defects, damage, or fracture.

[0102] Compared with the coating method, the immersion method for introducing the photoexpansion agent can make the distribution of the photoexpansion agent on the surface of the embryo more uniform, so that the overall mechanical properties of the prepared shell body 10 are more uniform.

[0103] Compared with other methods of introducing the photoexpansion agent, the photoexpansion agent in the shell body 10 prepared in the embodiment of the present application is introduced by coating or immersion, so that the distribution of the photoexpansion agent in the shell body 10 gradually decreases from the surface of the first layer 11 or the second layer 15 away from the middle layer 13 to the surface of the first layer 11 or the second layer 15 close to the middle layer 13, so that the prepared shell 100 has better surface pencil hardness and wear resistance.

[0104] In other embodiments, when the photoexpanding agent is liquid at room temperature, the embryo body can be directly immersed in the liquid photoexpanding agent; or the liquid photoexpanding agent can be directly coated on the surface of the embryo body.

[0105] For the description of other features of the photoexpanding agent, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0106] S203 , irradiating with light to expand the volume of the photoexpansion agent, thereby obtaining the shell body 10 .

[0107] Specifically, ultraviolet light, visible light, near infrared light, etc. are used to irradiate the embryo with the photoexpansion agent introduced into the surface layer, so that the photoexpansion agent in the embryo undergoes molecular isomerization reaction, ring opening reaction, etc. to enlarge the molecular size of the photoexpansion agent, thereby expanding the volume of the photoexpansion agent. The light source of the irradiation can be, but is not limited to, ultraviolet light, visible light, near infrared light, etc.

[0108] Optionally, the intensity of the illumination is 5m 2 Up to 50W / m 2 Specifically, it can be but not limited to 5m 2 、10W / m 2 、15m 2 , 20W / m 2 、25m 2 、30W / m 2 、35m 2 , 40W / m 2 、45m 2 、50W / m 2If the light intensity is too low, the volume expansion rate of the photoexpansion agent is too small, the compressive stress generated in the shell body 10 is too small, and the hardness of the shell body 10 is not significantly improved; if the light intensity is too high, the photoexpansion agent expands too fast, the volume expansion rate of the photoexpansion agent is too large, and it is easy to exceed the compressive stress limit of the shell body 10, thereby causing internal defects, damage or fracture of the shell body 10.

[0109] Optionally, the illumination time is 5S to 10min; specifically, it can be but not limited to 5S, 20S, 40S, 1min, 2min, 3min, 4min, 5min, 6min, 7min, 8min, 9min, 10min, etc. If the illumination time is too short, the volume expansion rate of the photoexpansion agent is too small, the compressive stress generated in the shell body 10 is too small, and the hardness of the shell body 10 is not significantly improved; if the illumination time is too long, the volume expansion rate of the photoexpansion agent is too large, which is easy to exceed the compressive stress limit of the shell body 10, thereby causing internal defects, damage or fracture of the shell body 10.

[0110] The preparation method of the shell 100 of the embodiment of the present application uses thermoplastic resin and inorganic powder to prepare the embryo, and then introduces a photoexpansion agent into the surface layer of the embryo. The photoexpansion agent expands in volume after being exposed to light, so that the prepared shell 100 has a lighter weight, high gloss ceramic texture, low processing conditions, and low cost, while making the shell 100 have higher hardness and wear resistance. At the same time, the photoexpansion agent is introduced after the embryo is prepared, and the substrates between the first layer 11, the middle layer 13, and the second layer 15 are the same, and the substrates are all formed in the same process (such as injection molding), so that there is no interface between the first layer 11, the middle layer 13, and the second layer 15, so that the shell 100 has better integrity, is not easy to be delaminated after long-term use, and has a longer service life.

[0111] Please also see Figure 2 and Figure 5 The present application also provides a method for preparing a housing 100, which can be applied to prepare the housing 100 of the above embodiment. The housing 100 includes a housing body 10, and the method for preparing the housing 100 includes:

[0112] S301, mixing an inorganic powder with a thermoplastic resin to obtain a mixture;

[0113] When the raw material components of the shell body 10 further include one or more of a dispersant, a plasticizer and a pigment, step S301 further includes mixing one or more of the dispersant, the plasticizer and the pigment with the inorganic powder and the thermoplastic resin.

[0114] S302, performing banburying and granulation on the mixture;

[0115] S303, performing injection molding to obtain an embryo body;

[0116] S304, introducing a photoexpansion agent into the surface layer of the embryo body;

[0117] S305, irradiating with light to cause the photoexpansion agent to expand in volume;

[0118] For detailed descriptions of steps S302 to S305 , please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0119] S306 , performing warm isostatic pressing on the embryo to obtain a shell body 10 .

[0120] Specifically, the embryo is placed in a sleeve, the sleeve is evacuated to remove the gas adsorbed on the surface of the embryo, the internal gap of the embryo and the sleeve, and the embryo is vacuum sealed. After vacuum sealing, the embryo is placed in a pressure vessel with a heating furnace for warm isostatic pressing. Usually, the injection molding time is usually short, and there is not enough time for the thermoplastic resin molecular chains to move and entangle with each other. The porosity of the formed embryo is large, which is not conducive to the improvement of the pencil hardness and toughness of the shell body 10 obtained. Warm isostatic pressing of the embryo can allow the segments in the thermoplastic resin molecular chains to have enough time to move, which can improve the density between the thermoplastic resin and the inorganic powder in the obtained shell 100, help eliminate the pores of the thermoplastic resin and the inorganic powder system, and enhance the interaction between the thermoplastic resin and the inorganic powder, thereby improving the mechanical properties of the shell 100, such as pencil hardness, toughness, bending strength, etc.

[0121] Optionally, the temperature range of the warm isostatic pressing is Tg+20°C to Tg+60°C, wherein Tg is the glass transition temperature of the thermoplastic resin. Specifically, the temperature range of the warm isostatic pressing may be, but is not limited to, Tg+20°C, Tg+30°C, Tg+40°C, Tg+50°C, Tg+60°C, etc. In this temperature range, the thermoplastic resin is in a highly elastic state, and the segments in the thermoplastic resin molecular chain can move. At the same time, under the action of pressure, the thermoplastic resin and the inorganic powder can be made denser, which helps to eliminate the pores of the thermoplastic resin and the inorganic powder system, and enhance the interaction between the thermoplastic resin and the inorganic powder, thereby improving the mechanical properties of the shell 100, such as pencil hardness, toughness, bending strength, etc.

[0122] The term "glass transition temperature" in the present application refers to the temperature at which the thermoplastic resin is completely transformed from a glassy state to a highly elastic state.

[0123] In some embodiments, the temperature of the warm isostatic pressing ranges from 80°C to 300°C; specifically, it may be, but is not limited to, 80°C, 100°C, 120°C, 150°C, 180°C, 200°C, 230°C, 250°C, 280°C, 300°C, etc. In a specific embodiment, when the thermoplastic resin is polyphenylene sulfide, and the Tg of the polyphenylene sulfide is 95°C, the temperature of the warm isostatic pressing ranges from 115°C to 155°C.

[0124] The pressure of the warm isostatic pressing is in the range of 50Mpa to 500Mpa; specifically, it can be, but is not limited to, 50Mpa, 80Mpa, 100Mpa, 150Mpa, 200Mpa, 250Mpa, 300Mpa, 350Mpa, 400Mpa, 450Mpa, 500Mpa, etc. When the pressure is in this range, the movement of the segments in the thermoplastic resin molecular chain can be accelerated, so that the combination between the thermoplastic resin segments and between the thermoplastic resin molecules and the inorganic powder is further densified, and at the same time, it is beneficial to eliminate the pores in the system, and it is beneficial to further improve the pencil hardness and toughness of the shell body 10, thereby improving the pencil hardness and toughness of the shell 100. When the pressure is too small, it is difficult to compact the thermoplastic resin and the inorganic powder, which is not conducive to the densification of the embryo. When the pressure is too large, it contributes little to the further densification of the embryo, but it places harsh requirements on the equipment.

[0125] Optionally, the warm isostatic pressing time is 0.5h to 3h, specifically, it can be but not limited to 0.5h, 0.8h, 1h, 1.2h, 1.5h, 2h, 3h, etc. When the warm isostatic pressing time is too short, the segments of the thermoplastic resin molecular chain do not have sufficient time to move and deform, which is not conducive to the densification between the thermoplastic resin and the inorganic powder, is not conducive to eliminating the pores of the thermoplastic resin and the inorganic powder system, and is not conducive to enhancing the interaction between the thermoplastic resin and the inorganic powder. When the warm isostatic pressing time is too long, the thermoplastic resin and the inorganic powder in the embryo are difficult to further densify, and the performance of the shell body 10 obtained is less affected.

[0126] In some embodiments, after the shell body 10 is manufactured, the shell 100 is processed by computer numerical control precision machining (CNC machining), and the surface is ground and polished to obtain a shell 100 that meets the specifications of the electronic device.

[0127] Please also see Figure 2 and Figure 6 The present application also provides a method for preparing a housing 100, which can be applied to prepare the housing 100 of the above embodiment. The housing 100 includes a housing body 10, and the method for preparing the housing 100 includes:

[0128] S401, mixing an inorganic powder with a thermoplastic resin to obtain a mixture;

[0129] In this embodiment, the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, and polyetherketone. For the description of other characteristic parts, please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0130] S402, performing banburying and granulation on the mixture;

[0131] S403, performing injection molding to obtain an embryonic body;

[0132] S404, introducing a photoexpansion agent into the surface layer of the embryo body;

[0133] S405, irradiating with light to cause the photoexpansion agent to expand in volume;

[0134] S406, performing warm isostatic pressing on the embryo body;

[0135] For detailed descriptions of steps S402 to S406, please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0136] S407, performing heat treatment to obtain the shell body 10.

[0137] Optionally, the embryo body after the warm isostatic pressing treatment is placed in air or oxygen atmosphere and heat treated under high temperature and high pressure to obtain the shell body 10 .

[0138] Optionally, the temperature of the heat treatment ranges from Tm to Tm+70°C, specifically, but not limited to, Tm, Tm+10°C, Tm+20°C, Tm+30°C, Tm+35°C, Tm+40°C, Tm+45°C, Tm+50°C, Tm+55°C, Tm+60°C, Tm+65°C, Tm+70°C, etc. When the temperature is in this range, a chain extension reaction will occur between the molecules of the thermoplastic resin (e.g., polyphenylene sulfide). In addition, under the action of oxygen, the thermoplastic resin molecules will also undergo an oxidative cross-linking reaction, thereby increasing the molecular weight and cross-linking degree of the thermoplastic resin, and better binding the inorganic powder in the cross-linking network of the thermoplastic resin, which is beneficial to improving the bonding force between the thermoplastic resin and the inorganic powder, thereby improving the pencil hardness and toughness of the obtained shell 100. At the same time, the temperature of the heat treatment is controlled below Tm+70°C, so that the chain extension reaction and the cross-linking reaction will not occur too quickly, thereby controlling the degree of cross-linking within a certain range, effectively controlling the crystallinity and cross-linking degree of the thermoplastic resin in the formed shell body 10, and preventing the toughness of the shell body 10 from decreasing due to excessive cross-linking.

[0139] In some embodiments, the heat treatment temperature is 100°C to 360°C, specifically, but not limited to, 100°C, 130°C, 150°C, 180°C, 200°C, 220°C, 240°C, 250°C, 270°C, 290°C, 310°C, 330°C, 360°C, etc.

[0140] Taking the thermoplastic resin as polyphenylene sulfide (PPS) as an example, when the thermoplastic resin is polyphenylene sulfide (PPS), the temperature of the heat treatment ranges from 320°C to 360°C; specifically, it can be but not limited to 320°C, 325°C, 330°C, 335°C, 340°C, 345°C, 350°C, 360°C, etc. At this time, the main chemical reaction equations occurring between the molecular chains of the thermoplastic resin are as follows:

[0141] ■ Chain expansion

[0142]

[0143] ■ Oxidative crosslinking

[0144]

[0145] Optionally, the heat treatment pressure is 0 MPa to 100 MPa; specifically, it can be, but not limited to, 0 MPa, 10 MPa, 20 MPa, 30 MPa, 40 MPa, 50 MPa, 55 MPa, 60 MPa, 65 MPa, 70 MPa, 75 MPa, 80 MPa, 85 MPa, 90 MPa, 100 MPa, etc. The pressure is conducive to maintaining the shape of the embryo, and can accelerate the movement between the thermoplastic resin molecular chains, so that the combination between the thermoplastic resin molecular chains and between the thermoplastic resin molecules and the inorganic powder is further densified, which is conducive to further improving the pencil hardness and toughness of the manufactured shell body 10, thereby improving the pencil hardness and toughness of the manufactured shell 100.

[0146] Optionally, the heat treatment time ranges from 1 hour to 12 hours, specifically, but not limited to, 1 hour, 2 hours, 3 hours, 4 hours, 5 hours, 6 hours, 7 hours, 8 hours, 9 hours, 10 hours, 11 hours, 12 hours, etc. If the heat treatment time is too short, the chain extension reaction and cross-linking reaction degree of the thermoplastic resin are too low, and the toughness of the formed shell body 10 decreases; if the heat treatment time is too long, the cross-linking degree of the thermoplastic resin is too high, and the formed shell body 10 is too brittle and insufficient in toughness.

[0147] It should be understood that the above-mentioned mixing granulation, injection molding, warm isostatic pressing and heat treatment can be carried out at a certain temperature point in the respective temperature range, and each stage can also be generated by gradually increasing the temperature within a temperature interval. When the temperature meets the above-mentioned interval range, the specific method to be adopted is not specifically limited in this application.

[0148] In some embodiments, after the shell body 10 is manufactured, the shell 100 is processed by computer numerical control precision machining (CNC machining), and the surface is ground and polished to obtain a shell 100 that meets the specifications of the electronic device.

[0149] Please also see Figure 2 and Figure 7 The present application also provides a method for preparing a housing 100, which can be applied to prepare the housing 100 of the above embodiment. The housing 100 includes a housing body 10 and a protective layer 30, wherein the protective layer 30 is disposed on the surface of the housing body 10. The method for preparing the housing 100 includes:

[0150] S501, mixing an inorganic powder with a thermoplastic resin to obtain a mixture;

[0151] In this embodiment, the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, and polyetherketone. For the description of other characteristic parts, please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0152] S502, performing banburying and granulation on the mixture;

[0153] S503, performing injection molding to obtain an embryonic body;

[0154] S504, introducing a photoexpansion agent into the surface layer of the embryo body;

[0155] S505, irradiating with light to cause the photoexpansion agent to expand in volume;

[0156] S506, performing warm isostatic pressing on the embryo body;

[0157] S507, performing heat treatment to obtain the shell body 10.

[0158] For detailed descriptions of steps S502 to S507 , please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0159] In some embodiments, after the shell body 10 is manufactured, the shell 100 is processed by computer numerical control precision machining (CNC machining), and the surface is ground and polished to obtain a shell 100 that meets the specifications of the electronic device.

[0160] S508 , forming the protective layer 30 on the surface of the shell body 10 .

[0161] Specifically, a glue composed of one or more raw material components of the protective layer 30, such as perfluoropolyether, perfluoropolyether derivatives, etc., is evaporated on the surface of the housing body 10 to form the protective layer 30. The protective layer 30 is used for anti-fouling and anti-fingerprint to improve the user experience of the housing 100.

[0162] The housing 100 prepared in the embodiment of the present application is further described below through specific embodiments and comparative examples.

[0163] Example 1 to Example 6

[0164] The housing 100 of Embodiments 1 to 6 is manufactured by the following steps:

[0165] 1) Weighing modified alumina and polyphenylene sulfide in a weight ratio of 1:1 respectively, wherein the alumina is modified with 2 wt % of a silane coupling agent, and wherein the Tg of the polyphenylene sulfide is 95° C. and the Tm is 295° C.;

[0166] 2) mixing the modified alumina and polyphenylene sulfide to obtain a mixture;

[0167] 3) kneading and granulating the mixture at 330° C. under the protection of an inert gas to obtain pellets;

[0168] 4) injection molding the pellets at 350° C. to obtain an embryo body having a thickness of 0.8 mm;

[0169] 5) preparing a photoexpandable agent solution: dissolving a mixture of benzospiropyranoline and polymethyl methacrylate in ethanol to obtain a photoexpandable solution, wherein the molar content of benzospiropyranoline is 5.1% of the total molar content of benzospiropyranoline and polymethyl methacrylate;

[0170] 6) soaking the embryos of 4) in the photoexpansion agent solution of 5), and after soaking for a period of time, vacuum drying in a vacuum drying oven at 55° C. for 24 hours to obtain four embryos containing the photoexpansion agent;

[0171] 7) Irradiate the embryo containing the photoexpanding agent with ultraviolet light at an intensity of 30 W / m 2 , illumination time 5min;

[0172] 8) performing warm isostatic pressing of the embryo at 120° C. and 200 MPa pressure for 1 hour;

[0173] 9) Heat treatment is performed at 330° C. for 3 hours to obtain the shell 100 .

[0174] Comparative Example 1

[0175] The shell of Comparative Example 1 was prepared by the following steps:

[0176] 1) Weighing modified alumina and polyphenylene sulfide in a weight ratio of 1:1 respectively, wherein the alumina is modified with 2 wt % of a silane coupling agent, and wherein the Tg of the polyphenylene sulfide is 95° C. and the Tm is 295° C.;

[0177] 2) mixing the modified alumina and polyphenylene sulfide to obtain a mixture;

[0178] 3) kneading and granulating the mixture at 330° C. under the protection of an inert gas to obtain pellets;

[0179] 4) injection molding the pellets at 350° C. to obtain an embryo body having a thickness of 0.8 mm;

[0180] 5) performing warm isostatic pressing of the embryo at 120° C. and 200 MPa pressure for 1 hour;

[0181] 6) Heat treatment is performed at 330° C. for 3 h to obtain a shell.

[0182] The pencil hardness, abrasion resistance and ball drop height of the shells prepared in the above embodiments and comparative examples were tested in the following manner:

[0183] 1) Pencil hardness test: GB / T 6739-1996.

[0184] 2) Wear resistance test: Use GB10810.5-2012 standard and rub the shell surface until there are obvious scratches.

[0185] 3) Drop ball impact test: The shell is made into a flat sheet with a size of 150mm×73mm×0.8mm; the samples of the above embodiments and comparative examples are supported on a jig (the four sides of the shell are supported by a 3mm high jig, and the middle is suspended), and a stainless steel ball weighing 32g is freely dropped from a certain height to the surface of the shell to be tested, and the four corners and the center of the shell are measured respectively. A total of five points, each point is measured 5 times until the shell is broken. The height when the shell is broken is the drop ball height. The higher the drop ball height, the better the toughness of the shell, and the less likely it is to break.

[0186] The test results are shown in Table 1 below.

[0187] Table 1 Forming conditions, pencil hardness and ball drop height of the shells of various embodiments and comparative examples

[0188]

[0189] It can be seen from Table 1 that when the concentration of the photoexpansion agent solution is the same, the longer the immersion time, the higher the content of the photoexpansion agent in the shell body, the thicker the thickness of the first layer and the second layer of the shell body, and the better the pencil hardness and wear resistance of the shell body; when the content of the photoexpansion agent in the shell body is within a certain range, the toughness of the shell body will not decrease with the increase of the content of the photoexpansion agent, but when the content of the photoexpansion agent in the shell body increases to a certain extent, the toughness of the shell body decreases, so the content of the photoexpansion agent should be controlled within a certain range. When the immersion time is the same and the concentration of the photoexpansion agent solution is different, the higher the concentration of the photoexpansion agent solution, the thicker the thickness of the first layer 11 and the second layer 15 of the shell body 10, and the better the pencil hardness and wear resistance of the shell body.

[0190] See also Figure 8 The embodiment of the present application also provides an electronic device 600, which includes: a display component 610 for display; a shell 100 described in the embodiment of the present application, wherein the shell 100 and the display component 610 enclose a receiving space 601; and a circuit board component 630, wherein the circuit board component 630 is disposed in the receiving space 601 and is electrically connected to the display component 610 for controlling the display component 610 to display.

[0191] The electronic device 600 of the embodiment of the present application may be, but is not limited to, a portable electronic device such as a mobile phone, a tablet, a laptop computer, a desktop computer, a smart bracelet, a smart watch, an e-reader, a game console, etc.

[0192] For a detailed description of the housing 100 , please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0193] Optionally, the display component 610 may be, but is not limited to, one or more of a liquid crystal display component, a light emitting diode display component (LED display component), a micro light emitting diode display component (Micro LED display component), a sub-millimeter light emitting diode display component (Mini LED display component), an organic light emitting diode display component (OLED display component), etc.

[0194] Please also see Fig. 9 Optionally, the circuit board assembly 630 may include a processor 631, a memory 633, and a power supply 635. The processor 631 is electrically connected to the display assembly 610, the memory 633, and the power supply 635, respectively. The processor 631 is used to control the display assembly 610 to display, and the memory 633 is used to store the program code required for the operation of the processor 631, the program code required to control the display assembly 610, the display content of the display assembly 610, etc. The power supply 635 is used to provide power for the operation of the processor 631.

[0195] Optionally, the processor 631 includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The processor 631 is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory 633, which enables the computing device to provide a wide variety of services.

[0196] Optionally, the memory 633 may include a volatile memory (Volatile Memory), such as a random access memory (Random Access Memory, RAM); the memory 633 may also include a non-volatile memory (NVM), such as a read-only memory (Read-Only Memory, ROM), a flash memory (Flash Memory, FM), a hard disk drive (Hard Disk Drive, HDD) or a solid-state drive (SSD). The memory 633 may also include a combination of the above-mentioned types of memory.

[0197] Optionally, the power supply 635 may be, but is not limited to, a battery, a power supply circuit, etc.

[0198] References to "embodiments" and "implementations" herein mean that a particular feature, structure, or characteristic described in conjunction with an embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various locations in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments that are mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0199] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A housing, characterized in that: include: The shell body is composed of inorganic powder, thermoplastic resin and photoexpansion agent; the photoexpansion agent is dispersed in part of the shell body; in the shell body, the content of the photoexpansion agent gradually decreases from the surface of the shell body to the inside of the shell body.

2. The housing according to claim 1, characterized in that The volume of the photoexpansion agent after illumination is greater than the volume of the photoexpansion agent before illumination, and the light source of the illumination is ultraviolet light, visible light or near infrared light.

3. The housing according to claim 2, characterized in that: The volume of the photoexpanding agent after expansion by light exposure is 1.1 to 2 times the volume before light exposure.

4. The housing according to any one of claims 1 to 3, characterized in that: The weight content of the photoexpansion agent is 0.005% to 0.15% of the total weight of the shell body.

5. The housing according to claim 1, characterized in that The shell body includes a first layer, a second layer and an intermediate layer arranged between the first layer and the second layer, the raw material components of the first layer and the second layer both include inorganic powder, thermoplastic resin and photoexpanding agent; the raw material components of the intermediate layer include inorganic powder and thermoplastic resin.

6. The housing according to claim 5, characterized in that The content of the photoexpansion agent in the first layer gradually decreases from the surface of the first layer far from the middle layer to the surface of the first layer close to the middle layer; the content of the photoexpansion agent in the second layer gradually decreases from the surface of the second layer far from the middle layer to the surface of the second layer close to the middle layer.

7. The housing according to claim 5, characterized in that Along the stacking direction of the first layer, the middle layer and the second layer, the thickness of the first layer is 5% to 10% of the thickness of the shell body; the thickness of the second layer is 5% to 10% of the thickness of the shell body.

8. The housing according to any one of claims 5 to 7, characterized in that: There is no interface between the first layer, the intermediate layer and the second layer.

9. The housing according to any one of claims 1-3 and 5-7, characterized in that: The photoexpanding agent is one or more of compounds, derivatives, polymers, mixtures or copolymers containing one or more of cis-azobenzene groups, cinnamic acid groups or benzospiropyran groups.

10. A method for preparing a shell, characterized in that: The housing comprises a housing body, and the method comprises: Mixing inorganic powder with thermoplastic resin and molding to obtain an embryonic body; Introducing a photoexpansion agent into the surface layer of the embryo body; and Irradiating the shell body with light to expand the volume of the photoexpansion agent, thereby obtaining a shell body, wherein the photoexpansion agent is dispersed in a portion of the shell body; in the shell body, the content of the photoexpansion agent gradually decreases from the surface of the shell body to the inside of the shell body.

11. The method for preparing the housing according to claim 10, characterized in that: The step of introducing a photoexpansion agent into the surface layer of the embryo body comprises: Coating a photoexpanding agent solution on the surface of the embryo body so that the photoexpanding agent enters the surface layer of the embryo body; or The step of introducing the photoexpansion agent into the surface layer of the embryo body comprises: immersing the embryo body in the photoexpansion agent solution so that the photoexpansion agent enters the surface layer of the embryo body.

12. The method for preparing the housing according to claim 11, characterized in that: The mass concentration of the photoexpansion agent solution is 0.1 mg / mL to 5 mg / mL.

13. The method for preparing a housing according to claim 10, characterized in that: The light source of the illumination is ultraviolet light, visible light or near infrared light; the intensity of the illumination is 5W / m 2 Up to 50W / m 2 The illumination time is 5s to 10min.

14. The method for preparing a housing according to claim 10, characterized in that: After the illumination, the method further comprises: Warm isostatic pressing is performed, wherein the temperature range of the warm isostatic pressing is Tg+20° C. to Tg+60° C., and the pressure range of the warm isostatic pressing is 50 MPa to 500 MPa, wherein Tg is the glass transition temperature of the thermoplastic resin.

15. The method for preparing the housing according to claim 14, characterized in that: The thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, and polyetherketone. After the warm isostatic pressing, the method further comprises: A heat treatment is performed, wherein the temperature of the heat treatment ranges from Tm to Tm+70° C., wherein Tm is the melting temperature of the thermoplastic resin.

16. An electronic device, characterized in that: include: Display component, used for display; The housing according to any one of claims 1 to 9, wherein the housing has a receiving space; as well as A circuit board assembly is disposed in the accommodating space and is electrically connected to the display assembly for controlling the display assembly to display.

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