Silicon wafer edge wrapping mechanism and method

Abstract

The present application relates to the technical field of silicon wafer processing, and particularly relates to a silicon wafer edge coating mechanism and method, aiming to solve the problems of low efficiency of silicon wafer edge coating ink and complex equipment structure. The silicon wafer edge coating mechanism provided by the present application comprises an ink coating assembly and a driving assembly. The ink coating assembly comprises an ink coating roller and a scraper. The surface of the ink coating roller is adhered with ink to form an ink layer. The cutting edge of the scraper is directed to the surface of the ink coating roller to control the thickness of the ink layer. The driving assembly is connected with the ink coating assembly to drive the ink coating assembly to move close to the silicon wafer, so that the edge of the silicon wafer is inserted into the ink layer. The silicon wafer edge coating mechanism moves the ink coating roller with the surface adhered with ink to the silicon wafer, so that the edge of the silicon wafer is inserted into the ink to realize coating of three surfaces of the edge of the silicon wafer. The thickness of the ink is controlled by the scraper in an accurate and efficient manner and the structure is simple. Compared with the point coating and moving mode of the dispensing head, the silicon wafer edge coating mechanism has high coating efficiency, the mechanical structure is greatly simplified, and the complexity of the equipment is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon wafer processing, and particularly relates to a silicon wafer edge coating mechanism and method. BACKGROUND

[0002] With the development of economy and the progress of society, the photovoltaic industry is in full swing in China, and the demand for silicon wafer production equipment is also increasing, and higher requirements for the production capacity of the equipment are put forward. In the etching and printing process of the silicon wafer, the edge of the silicon wafer is coated with ink, which is a necessary process before electroplating.

[0003] The common way of coating the edge of the silicon wafer with ink is usually to use a dispensing head to coat a circle around the edge of the silicon wafer. This way is slow and requires the ink supply system to accurately provide the accurate amount of ink within the specified time, and the controller is needed to accurately control the ink output of the dispensing head. This way not only requires high control of the ink output, but also needs to move the dispensing head along the edge of the silicon wafer, which is complex and has a long stroke, so the production efficiency is low and the mechanical structure is complex. SUMMARY

[0004] The purpose of the present application is to provide a silicon wafer edge coating mechanism and method to solve the problems of low efficiency and complex structure of the equipment.

[0005] In order to solve the above technical problems, the technical scheme provided by the present application is as follows:

[0006] The present application provides a silicon wafer edge coating mechanism, which comprises an ink coating assembly and a driving assembly. The ink coating assembly comprises an ink coating roller and a scraper. The surface of the ink coating roller is coated with ink to form an ink layer, and the cutting edge of the scraper is directed to the surface of the ink coating roller to control the thickness of the ink layer. The driving assembly is connected with the ink coating assembly to drive the ink coating assembly to approach the silicon wafer, so that the edge of the silicon wafer is inserted into the ink layer.

[0007] Further, the silicon wafer edge coating mechanism comprises two ink coating assemblies symmetrically arranged about a vertical plane. The driving assembly comprises left and right screw rods, and the left and right screw rods are respectively connected with the two ink coating assemblies to drive the two ink coating assemblies to move synchronously towards or away from each other.

[0008] Further, the ink coating assembly further comprises an ink tank, and the ink tank is arranged below the ink coating roller. The ink coating roller can rotate around its own axis to pick up ink from the ink tank.

[0009] Further, the ink coating assembly further comprises a moving frame and a knife holder. The ink coating roller is rotatably installed on the moving frame, and the moving frame is connected with the driving assembly and can move along the axis direction parallel to the left and right screw rods. The knife holder is installed on the moving frame, and the scraper is installed on the knife holder.

[0010] Further, the ink coating assembly further comprises a micrometer, the micrometer is installed on the tool holder to measure the distance between the scraper and the ink roller.

[0011] Further, the ink coating assembly further comprises a driving wheel, a driven wheel, a transmission belt and a first motor, the driving wheel is connected with the output end of the first motor, the driven wheel is connected with the ink roller, and the transmission belt is connected with the driving wheel and the driven wheel.

[0012] Further, the driving assembly further comprises a second motor, a left-handed screw nut and a right-handed screw nut, the output end of the second motor is connected with the left-handed screw rod and the right-handed screw rod, and the left-handed screw nut and the right-handed screw nut are connected with the two ink coating assemblies respectively and are screwed with the left-handed screw rod and the right-handed screw rod.

[0013] Further, the driving assembly further comprises a fixing frame and a linear guide rail, the second motor and the left-handed screw rod and the right-handed screw rod are installed on the fixing frame, and the guide rail of the linear guide rail is installed on the fixing frame, and the sliding block of the linear guide rail is connected with the moving frame.

[0014] Further, the ink roller is a rubber-coated roller.

[0015] In another aspect of the present application, a silicon wafer edge coating method is provided, which uses the above-mentioned silicon wafer edge coating mechanism and comprises the following steps:

[0016] The ink roller rotates around its own axis to make the scraper remove the excess ink and form an ink layer on the surface of the ink roller, and then the ink roller stops rotating;

[0017] The driving assembly drives the ink roller to move towards the silicon wafer to make the edge of the silicon wafer inserted into the ink layer.

[0018] The technical effects that can be achieved by the present application are as follows:

[0019] The silicon wafer edge coating mechanism provided by the present application comprises an ink coating assembly and a driving assembly, the ink coating assembly comprises an ink roller and a scraper, the surface of the ink roller is adhered with ink to form an ink layer, and the cutting edge of the scraper is directed to the surface of the ink roller to control the thickness of the ink layer; the driving assembly is connected with the ink coating assembly to drive the ink coating assembly to move close to the silicon wafer, so that the edge of the silicon wafer is inserted into the ink layer.

[0020] The silicon wafer edge coating mechanism provided by the present application moves the ink roller with the surface adhered with ink towards the silicon wafer to make the edge of the silicon wafer inserted into the ink to realize the coating of the three surfaces of the edge of the silicon wafer. Compared with the existing point coating moving mode using a dispensing head, the silicon wafer edge coating mechanism provided by the present application only needs one linear motion to complete the coating of the edge, and the coating efficiency is greatly improved. Correspondingly, due to the reduction of the action direction, the mechanical structure of the silicon wafer edge coating mechanism can be greatly simplified, and the complexity of the equipment is reduced.

[0021] In addition, by matching the scraper and the ink roller, the thickness of the ink layer on the ink roller can be accurately controlled by setting the gap between the scraper and the ink roller, and then the thickness of the ink coated on the silicon wafer is accurately controlled. Compared with the glue dispensing head, the accuracy and simplicity are better, and a complex and precise ink amount control device is not needed, so that the complexity and cost of the equipment are controlled. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the specific embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0023] Figure 1 The structure schematic diagram of the silicon wafer edge wrapping mechanism provided by the embodiment of the present application is shown in the figure.

[0024] Figure 2 The rear view of the silicon wafer edge wrapping mechanism provided by the embodiment of the present application is shown in the figure.

[0025] Figure 3 The schematic diagram of the long edge wrapping of the silicon wafer edge wrapping mechanism provided by the embodiment of the present application is shown in the figure.

[0026] Figure 4 The other schematic diagram of the long edge wrapping of the silicon wafer edge wrapping mechanism provided by the embodiment of the present application is shown in the figure.

[0027] Figure 5 The schematic diagram of the ink coating of the ink roller is shown in the figure.

[0028] Figure 6 The structure schematic diagram of the ink roller is shown in the figure.

[0029] Figure 7 The schematic diagram of the short edge wrapping of the silicon wafer edge wrapping mechanism provided by the embodiment of the present application is shown in the figure.

[0030] Figure 8 The other structure schematic diagram of the silicon wafer edge wrapping mechanism provided by the embodiment of the present application is shown in the figure.

[0031] Figure 9 The still another schematic diagram of the silicon wafer edge wrapping mechanism provided by the embodiment of the present application is shown in the figure.

[0032] Figure 10 The structure schematic diagram of the bearing assembly is shown in the figure.

[0033] Figure 11 The structure schematic diagram of the limiting assembly is shown in the figure.

[0034] Figure 12 The structure schematic diagram of the glue dispensing head is shown in the figure.

[0035] Figure 13 Figure 1 is a structural schematic diagram of a three-axis dispensing mechanism.

[0036] Figure: 100-ink coating assembly; 200-driving assembly; 300-limiting assembly; 400-bearing assembly; 110-ink roller; 120-blade; 130-ink tank; 140-moving frame; 150-blade holder; 160-dial gauge; 170-driving wheel; 180-following wheel; 190-first motor; 1110-first telescopic rod; 1120-limiting baffle; 210-left and right screw; 220-second motor; 230-left screw nut; 240-right screw nut; 250-fixed frame; 260-linear guide rail; 310-second telescopic rod; 320-first baffle; 330-limiting support; 410-vacuum conveying belt; 111-linear segment; 112-circular table segment; 151-long hole; 152-arc-shaped hole; 251-mounting support plate; 252-connecting plate; 253-fixed plate; a-ink layer; 10-ink tank; 20-valve; 30-dispensing head. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0038] Some embodiments of the present application will be described in detail below with reference to the drawings. The following embodiments and features in the embodiments can be combined with each other without conflict.

[0039] The common way of coating ink on the edge of a silicon wafer in the prior art is to coat a circle of ink around the edge of the silicon wafer by using a dispensing head. This way is slow and requires the ink supply system to accurately provide the accurate amount of ink within the specified time, which needs to be accurately controlled by a controller. This way not only requires high control of the amount of ink, but also needs to move the dispensing head along the edge of the silicon wafer, which is complex in action and long in stroke, thus low in production efficiency and complex in mechanical mechanism.

[0040] Therefore, the present application provides a silicon wafer edge coating mechanism, which comprises an ink coating assembly 100 and a driving assembly 200. The ink coating assembly 100 comprises an ink roller 110 and a blade 120. The surface of the ink roller 110 is adhered with ink to form an ink layer a. The blade edge of the blade 120 is directed to the surface of the ink roller 110 to control the thickness of the ink layer a. The driving assembly 200 is connected with the ink coating assembly 100 to drive the ink coating assembly 100 to approach the silicon wafer, so that the edge of the silicon wafer is inserted into the ink layer a.

[0041] The silicon wafer edge coating mechanism provided by the present application realizes the coating of three surfaces of the edge of the silicon wafer by moving the silicon wafer to the ink roller 110 with the ink on the surface so that the edge of the silicon wafer is inserted into the ink. Compared with the existing point coating moving mode using the dispensing head, the silicon wafer edge coating mechanism provided by the present application only needs one linear motion to complete the coating of the edge, the coating efficiency is greatly improved, and accordingly, due to the reduction of the action direction, the mechanical structure of the silicon wafer edge coating mechanism can be greatly simplified, and the complexity of the equipment is reduced.

[0042] In addition, by the cooperation of the scraper 120 and the ink roller 110, the thickness of the ink layer a on the ink roller 110 can be accurately controlled by only setting the gap between the scraper 120 and the ink roller 110, and then the thickness of the ink coated on the silicon wafer is accurately controlled. Compared with the dispensing head which needs to control the ink output, the accuracy and simplicity are better, and a complex and precise ink output control device is not needed, so that the complexity and cost of the equipment are controlled.

[0043] The structure and shape of the silicon wafer edge coating mechanism provided by the present embodiment are described in detail below. Figures 1-13

[0044] In an optional scheme of the present embodiment, the silicon wafer edge coating mechanism comprises a driving assembly 200 and two ink coating assemblies 100 which are symmetrically arranged about a vertical plane, as shown in Figure 1 Figure 2 The driving assembly 200 comprises left and right screw rods 210 which are respectively connected with the two ink coating assemblies 100 to drive the two ink coating assemblies 100 to move synchronously towards or away from each other, so as to drive the two ink rollers 110 to move close to or away from the edge of the silicon wafer to complete the ink coating of the two mutually parallel edges of the silicon wafer.

[0045] In an optional scheme of the present embodiment, the ink coating assembly 100 further comprises an ink groove 130, a moving frame 140 and a knife frame 150, as shown in Figure 4 The ink groove 130 is arranged below the ink roller 110 and is open above, the axis of the ink roller 110 is horizontally arranged and partially immersed in the ink, the ink roller 110 is rotatably installed on the moving frame 140, the moving frames 140 of the two ink coating assemblies 100 are respectively connected with the driving assembly 200 and can move synchronously towards or away from each other along the direction parallel to the axes of the left and right screw rods 210; the knife frame 150 is installed on the moving frame 140, and the scraper 120 is installed on the knife frame 150 and can move in the vertical direction, so as to adjust the distance between the scraper 120 and the ink roller 110 to adjust the thickness of the ink layer a.

[0046] ​​Specifically, the ink tank 130 not only supplies ink but also recycles ink, that is, the scraper 120 scrapes off the excess ink from the ink roller 110 and then falls back into the ink tank 130. The knife holder 150 is provided with a long hole 151, the scraper 120 is screwed with the knife holder 150 through the long hole 151, so that the distance between the scraper 120 and the ink roller 110 is adjusted through the long hole 151. In addition, the knife holder 150 is also provided with an arc-shaped hole 152 and a circular hole, which are used to connect with the moving frame 140. The circular hole is coaxial with the ink roller 110, and the knife holder 150 can swing around the axis of the ink roller 110 through the arc-shaped hole 152 to adjust the angle of the scraper 120. In order to facilitate adjustment, the plane where the scraper 120 is located passes through the axis of the ink roller 110. The ink roller 110 can rotate around its own axis to stick ink from the ink tank 130, and form an ink layer a of a predetermined thickness under the cooperation of the scraper 120.

[0047] Further, the ink applying assembly 100 further comprises a micrometer 160, as shown in Figure 3 、 Figure 4 The micrometer 160 is installed on the knife holder 150 to measure the distance between the scraper 120 and the ink roller 110.

[0048] In an optional solution of the embodiment, the ink applying assembly 100 further comprises a driving wheel 170, a driven wheel 180, a transmission belt and a first motor 190, as shown in Figure 4 The driving wheel 170 is connected with the output end of the first motor 190, the driven wheel 180 is connected with the ink roller 110, and the transmission belt is connected with the driving wheel 170 and the driven wheel 180. The first motor 190 drives the driving wheel 170 to rotate and transmits power to the driven wheel 180 through the transmission belt, so that the driven wheel 180 drives the ink roller 110 to rotate around its own axis. Further, the first motor 190 is a step motor, the driving wheel 170 and the driven wheel 180 are synchronous pulleys, and the transmission belt is a synchronous belt. The step motor and the synchronous belt transmission ensure the smooth rotation of the ink roller 110, thereby ensuring the uniform distribution of ink on the ink roller 110.

[0049] In an optional solution of the embodiment, the driving assembly 200 further comprises a second motor 220, a left-handed nut 230 and a right-handed nut 240. The output end of the second motor 220 is connected with the left and right screw rods 210. The left-handed nut 230 and the right-handed nut 240 are respectively connected with the two ink applying assemblies 100 and are screwed with the left and right screw rods 210, so as to drive the ink applying assemblies 100 to move synchronously towards each other or away from each other through the second motor 220. Further, the second motor 220 is a servo motor to ensure accurate operation and accurately control the distance between the ink roller 110 and the silicon wafer, thereby ensuring the quality of ink coating. In addition, the left and right screw rods 210 are ball screw rods to ensure smooth operation.

[0050] In the embodiment, the axis of the left and right screw rods 210 is perpendicular to the axis of the ink applicator roller 110, and the axis of the ink applicator roller 110 is parallel to the conveying direction of the silicon wafer, so that the generatrix of the ink applicator roller 110 is parallel to the edge of the silicon wafer; and the horizontal bisector of the silicon wafer passes through the axis of the ink applicator roller 110, so that the ink thickness on the upper and lower sides of the silicon wafer is equal, thereby ensuring the edge covering quality.

[0051] Further, the driving assembly 200 further comprises a fixing frame 250 and a linear guide rail 260, the second motor 220 and the left and right screw rods 210 are installed on the fixing frame 250; the guide rail of the linear guide rail 260 is installed on the fixing frame 250, and the sliding block of the linear guide rail 260 is connected with the moving frame 140. Specifically, the fixing frame 250 comprises an installation branch plate 251, a connecting plate 252 and a fixing plate 253, as shown in Figure 3 、 Figure 4 The installation branch plate 251 is connected with the connecting plate 252 and used for installing the left and right screw rods 210; the guide rail of the linear guide rail 260 is installed on the connecting plate 252; and the fixing plate 253 is an L-shaped plate, one side of which is connected with the connecting plate 252, and the other side is connected with the main body of the equipment to realize the installation and fixation of the silicon wafer edge covering mechanism.

[0052] In an optional solution of the embodiment, the driving form of the driving assembly 200 can also adopt the gear and rack cooperation to drive the ink applicator assembly 100 to move, and the conventional structure will not be described herein again, and the driving mode of the left and right screw rods 210 can ensure the synchronization of the movement of the two ink applicator assemblies 100, ensure the ink application effect, and make the operation more stable and smooth.

[0053] In an optional solution of the embodiment, the ink applicator roller 110 is provided as a rubber-coated roller, and the rubber coating is provided to make the ink applicator roller 110 deformable. When the width size of the silicon wafer is too large or the edge of the silicon wafer is not parallel, the edge of the silicon wafer can extrude the rubber coating to complete the ink application, thereby avoiding damage to the silicon wafer caused by extrusion of the ink applicator roller 110. In an ideal state, the edge of the silicon wafer just contacts the ink applicator roller 110, as shown in Figure 5 The edge of the silicon wafer contacts the ink on three sides to complete the coating.

[0054] In an optional solution of the embodiment, when the silicon wafer is provided with a chamfer, the ink applicator roller 110 comprises a straight line segment 111 and a circular truncated cone segment 112, as shown in Figure 6 The diameter of the circular truncated cone segment 112 gradually decreases along the axis, and the end with the small diameter is connected with the straight line segment 111 and has the same diameter, so that the circular truncated cone segment 112 coats the chamfer of the silicon wafer.

[0055] In an optional solution of the embodiment, to ensure the accurate position of the silicon wafer, the ink applicator assembly 100 further comprises a first telescopic rod 1110 and a limiting baffle 1120, as shown in Figure 9As shown, the first telescopic rod 1110 is installed on the moving frame 140, and the limiting baffle 1120 is vertically arranged and parallel to the axis of the ink roller 110. The extending end of the first telescopic rod 1110 is connected with the limiting baffle 1120 to drive the limiting baffle 1120 to move in the vertical direction. Specifically, the limiting baffle 1120 is arranged as an L-shaped plate to facilitate the connection with the first telescopic rod 1110. When the silicon wafer moves to the ink applying station, the first telescopic rod 1110 extends and drives the limiting baffle 1120 to move upward. At the same time, the driving assembly 200 drives the limiting baffle 1120 to move close to the silicon wafer, so that the distance between the limiting baffles 1120 in the two ink applying assemblies 100 is equal to the width of the silicon wafer, to ensure that the edge of the silicon wafer is parallel to the axis of the ink roller 110, to avoid the deflection of the silicon wafer, and thus to ensure the uniformity of the ink applying.

[0056] In an optional solution of the embodiment, when the edge of the silicon wafer has a chamfer, the ink roller 110 is provided with a corresponding frustum segment 112. The silicon wafer edge covering mechanism further comprises a limiting assembly 300. The limiting assembly 300 comprises a second telescopic rod 310, a first baffle 320 and a limiting support 330, as shown. Figure 8 、 Figure 11 The first baffle 320 is connected with the extending end of the second telescopic rod 310, for driving the first baffle 320 to move in the vertical direction. The second telescopic rod 310 is installed on the limiting support 330. Specifically, the first baffle 320 is vertically arranged and perpendicular to the limiting baffle 1120, to limit the position of the silicon wafer in the conveying direction, to ensure the relative position of the edge of the silicon wafer and the ink roller 110, to avoid the non-uniformity of the ink applying or the damage of the silicon wafer due to the deviation of the position of the silicon wafer. Further, to avoid the abrasion between the first baffle 320 and the silicon wafer, one side of the first baffle 320 in contact with the silicon wafer is arranged as an inclined surface. When the first baffle 320 moves downward, the inclined surface gradually approaches the edge of the silicon wafer, and finally contacts the upper edge line of the edge of the silicon wafer, to limit the silicon wafer so that the chamfer of the silicon wafer accurately contacts the frustum segment 112, to apply the ink to the chamfer.

[0057] Further, the limiting assembly 300 further comprises a third telescopic rod. The third telescopic rod can drive the second telescopic rod 310 and the first baffle 320 to move along the conveying direction of the silicon wafer, to ensure that the second telescopic rod 310 does not scratch the silicon wafer when driving the first baffle 320 to move. At this time, the first baffle 320 can not need the inclined surface, and the contact with the silicon wafer is surface contact, which is more conducive to the stability of the silicon wafer. Further, the limiting assembly 300 can be arranged only in front of the conveying direction of the silicon wafer to block the forward conveying of the silicon wafer, or two limiting assemblies 300 can be arranged on the front and rear sides along the conveying direction of the silicon wafer.

[0058] In an optional solution of the embodiment, the first telescopic rod 1110 and the second telescopic rod 310 can each adopt a driving assembly 200 such as a pneumatic cylinder or an electric cylinder and cooperate with a guide such as a linear guide rail 260 to ensure the verticality and stable operation of the limiting baffle 1120 and the first baffle 320, and the third telescopic rod should adopt an electric telescopic rod or the like to ensure the accuracy of the running distance, and can also adopt other driving forms such as a structure of a lead screw and a guide rail.

[0059] The working process of the silicon wafer edge covering mechanism provided in the embodiment is as follows:

[0060] Correcting the silicon wafer: After the silicon wafer moves to the ink coating station and stops moving, the first telescopic rod 1110 drives the limiting baffle 1120 to move upward, the driving assembly 200 drives the two ink coating assemblies 100 to approach the silicon wafer until the distance between the two limiting baffles 1120 is equal to the width dimension of the silicon wafer, and the deflection state of the silicon wafer can be eliminated under the limiting action of the limiting baffles 1120; then the driving assembly 200 drives the two ink coating assemblies 100 to move away from the silicon wafer, and the first telescopic rod 1110 is retracted to make the limiting baffle 1120 move downward, so as to avoid the ink coating roller 110, and the ink coating roller 110 can be in contact with the edge of the silicon wafer.

[0061] Sticking ink: the first motor 190 drives the ink coating roller 110 to rotate around its own axis to stick ink from the ink tank 130, and forms an ink layer a of a set thickness under the action of the scraper 120.

[0062] Coating ink: after the silicon wafer is corrected, the second motor 220 drives the left and right rotating lead screws 210 to make the ink coating assembly 100 approach the silicon wafer, the first motor 190 stops rotating when the ink coating roller 110 approaches the silicon wafer to stop the self-rotation of the ink coating roller 110, and the silicon wafer is inserted into the ink layer a when the silicon wafer is in contact with the ink coating roller 110, the coating of the ink is completed, then the second motor 220 drives the left and right rotating lead screws 210 to make the ink coating assembly move away from the silicon wafer, and the first motor 190 is started to continue the rotation of the ink coating roller 110.

[0063] It should be noted that, except when the ink coating roller 110 and the ink layer a are in contact with the silicon wafer, the ink coating roller 110 is kept rotating to ensure the stability of the ink layer a and avoid uneven thickness or condensation of the ink layer a.

[0064] The silicon wafer edge covering mechanism provided in the embodiment uses the ink layer a formed by sticking ink on the ink coating roller 110 to cover the edges of the silicon wafer, which greatly improves the efficiency of coating ink. When the two edges of the silicon wafer parallel to each other are coated with ink, the silicon wafer edge covering mechanism provided in the embodiment only needs 0.45 seconds for one round trip, while the method of moving a dispensing head along the edge of the silicon wafer at least needs 5 seconds.

[0065] The embodiment ensures the synchronism of ink coating, the accuracy of the position of the ink roller 110 and the smooth operation, ensures the ink coating quality and efficiency, and saves the power source.

[0066] In order to realize the ink coating of the four edges of the silicon wafer, two silicon wafer edge covering mechanisms can be used in cooperation with the conveying device, two edges are coated each time, and the corresponding ink roller 110 is selected according to the edge shape. One edge covering mechanism can also be used to cooperate with the rotary table device to rotate the silicon wafer, but when the length-width difference of the silicon wafer is large, this structure will cause the idle stroke of the ink roller 110 to be long, which affects the production efficiency.

[0067] In an optional solution of the embodiment, the silicon wafer edge covering mechanism further includes a bearing assembly 400, and the bearing assembly 400 includes two parallel vacuum conveying belts 410 for conveying and bearing the silicon wafer, and can also adsorb the silicon wafer to avoid the situation that the silicon wafer is deviated by the ink roller 110 due to the adhesion of the ink layer a on the ink roller 110, and the silicon wafer is damaged and the ink is unevenly coated under the rotation of the ink roller 110, as shown in Figure 10 . Specifically, the vacuum conveying belt 410 can adsorb the silicon wafer after the two limiting baffles 1120 are moved to a distance equal to the width of the silicon wafer, without waiting for the limiting baffles 1120 to be separated from the silicon wafer, so as to maximize the accuracy of the position of the silicon wafer.

[0068] In comparison, the mechanism using the dispensing head is shown in Figure 12 、 Figure 13 A dispensing head is arranged on a three-axis dispensing machine, the three-axis dispensing machine can complete the movement in XYZ three directions to synthesize the running track of the dispensing head, and then realize the coating of the edge of the silicon wafer. The dispensing head includes an ink tank 10, a valve 20 and a dispensing head 30, and the control of the valve 20 is required to realize the control of the ink output, which is difficult to control and has a complex structure. Due to the viscosity and tension of the ink itself, it is difficult to ensure that the point-shaped output ink is uniformly distributed to the edge of the silicon wafer. The silicon wafer edge covering mechanism provided by the present application only needs a horizontal straight line movement and a rotation movement to perform the glue coating, and the thickness of the ink layer a is realized by the ink roller 110 and the scraper 120. The line contact between the ink layer a and the silicon wafer can improve the coating efficiency and avoid the problem of uneven distribution of the point contact, greatly improve the production efficiency and coating quality, and the mechanical mechanism and motion control are also simpler. In particular, the control of the ink amount is simple and accurate in structure.

[0069] Based on the silicon wafer edge covering mechanism provided by the embodiment, a silicon wafer edge covering method is provided, including the following steps:

[0070] The ink roller 110 rotates around its own axis to make the scraper 120 remove the excess ink and form an ink layer a on the surface of the ink roller 110, and then the ink roller 110 stops rotating.

[0071] The driving assembly 200 drives the inking roller 110 to move towards the silicon wafer so that the edge of the silicon wafer is inserted into the ink layer a.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A silicon wafer edge-wrapping mechanism, characterized in that, Includes an ink coating assembly (100) and a drive assembly (200); The ink coating assembly (100) includes an ink coating roller (110) and a doctor blade (120). The surface of the ink coating roller (110) is coated with ink to form an ink layer (a). The blade of the doctor blade (120) points towards the surface of the ink coating roller (110) to control the thickness of the ink layer (a). The axis of the ink coating roller (110) is parallel to the transport direction of the silicon wafer. The drive assembly (200) is connected to the ink coating assembly (100) to drive the ink coating roller (110) in the ink coating assembly (100) which has stopped rotating to approach the silicon wafer that is stopped at the ink coating station, thereby causing the edge of the silicon wafer to be inserted into the ink layer (a).

2. The silicon wafer edge-wrapping mechanism according to claim 1, characterized in that, Includes two ink coating components (100) arranged symmetrically about a vertical plane; The drive assembly (200) includes left and right lead screws (210), which are respectively connected to the two ink coating assemblies (100) to drive the two ink coating assemblies (100) to move synchronously towards each other or away from each other.

3. The silicon wafer edge-wrapping mechanism according to claim 2, characterized in that, The ink coating assembly (100) also includes an ink tank (130) disposed below the ink coating roller (110), which is rotatable about its own axis to pick up ink from the ink tank (130).

4. The silicon wafer edge-wrapping mechanism according to claim 3, characterized in that, The ink coating assembly (100) also includes a movable frame (140) and a blade holder (150). The ink roller (110) is rotatably mounted on the movable frame (140), which is connected to the drive assembly (200) and can move along the axis parallel to the left and right screws (210). The blade holder (150) is mounted on the movable frame (140), and the scraper (120) is mounted on the blade holder (150).

5. The silicon wafer edge-wrapping mechanism according to claim 4, characterized in that, The ink coating assembly (100) also includes a dial indicator (160) mounted on the blade holder (150) to measure the distance between the doctor blade (120) and the ink coating roller (110).

6. The silicon wafer edge-wrapping mechanism according to claim 5, characterized in that, The ink coating assembly (100) also includes a drive wheel (170), a driven wheel (180), a transmission belt, and a first motor (190). The drive wheel (170) is connected to the output end of the first motor (190), the driven wheel (180) is connected to the ink roller (110), and the transmission belt is connected to the drive wheel (170) and the driven wheel (180).

7. The silicon wafer edge-wrapping mechanism according to claim 6, characterized in that, The drive assembly (200) also includes a second motor (220), a left-handed nut (230), and a right-handed nut (240). The output end of the second motor (220) is connected to the left and right lead screws (210); the left lead screw nut (230) and the right lead screw nut (240) are respectively connected to the two ink coating components (100) and engaged with the left and right lead screws (210).

8. The silicon wafer edge-wrapping mechanism according to claim 7, characterized in that, The drive assembly (200) also includes a mounting bracket (250) and a linear guide rail (260), and the second motor (220) and the left and right helical screws (210) are mounted on the mounting bracket (250). The linear guide (260) is mounted on the fixed frame (250), and the slider of the linear guide (260) is connected to the movable frame (140).

9. The silicon wafer edge-wrapping mechanism according to claim 1, characterized in that, The ink-coating roller (110) is a rubber-coated roller.

10. A method for edge-wrapping a silicon wafer, characterized in that, Using the silicon wafer edge-wrapping mechanism as described in any one of claims 1-9 includes the following steps: The silicon wafer stops moving after it reaches the ink coating station. The ink coating roller (110) rotates about its own axis so that the doctor blade (120) scrapes off excess ink and forms the ink layer (a) on the surface of the ink coating roller (110), and then the ink coating roller (110) stops rotating; The drive assembly (200) drives the ink roller (110) to move toward the silicon wafer so that the edge of the silicon wafer is inserted into the ink layer (a).

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