A device for polishing the inner wall of a semiconductor graphite tube

Abstract

This invention relates to a device for polishing the inner wall of a semiconductor graphite tube, comprising a support frame, a rotating assembly on the support frame, a turntable with a hollow structure, a feeding assembly and a discharging assembly on the left and right sides of the turntable respectively, several bearing plates fixedly mounted on the turntable, and clamping assemblies slidably mounted on each bearing plate, a guide assembly fixedly mounted inside the turntable, a polishing assembly above the turntable, and a dust collection assembly inside the turntable. The feeding assembly is used to transport the semiconductor graphite tube, the rotating assembly is used to drive the clamping assembly to rotate, and the clamping assembly is used to clamp or release the semiconductor graphite tube in cooperation with the guide assembly during rotation, the polishing assembly is used to polish the inner wall of the semiconductor graphite tube, the dust collection assembly is used to collect the waste generated during the polishing process, and the discharging assembly is used to output the polished semiconductor graphite tube. This invention improves work efficiency and eliminates the need for manual loading and unloading of semiconductor graphite tubes.

Description

Technical Field

[0001] This invention relates to the field of semiconductor graphite tube processing technology, and more specifically to a device for grinding the inner wall of a semiconductor graphite tube. Background Technology

[0002] In the processing of semiconductor graphite tubes, it is usually necessary to polish the inner wall of the semiconductor graphite tube. However, due to the small inner diameter of the semiconductor graphite tube and the long polishing depth, there are certain difficulties in the polishing process.

[0003] A Chinese utility model with publication number CN201820165374.2 discloses a grinding device for the inner hole of a graphite tube, including a horizontal lathe and a three-jaw chuck of the horizontal lathe to hold the grinding device. This utility model solves the problem that the existing tube inner wall grinding device requires real-time and precise control of the movement of the longitudinal feed mechanism and the transverse feed mechanism, and its movement mechanism is complex in structure and movement mode, making it difficult to operate. However, it requires manual loading or unloading of graphite tubes during use, resulting in low work efficiency and long manual time consumption. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a grinding device for the inner wall of semiconductor graphite tubes. By setting up a turntable loading and unloading assembly, the device enables automatic loading and unloading of semiconductor graphite tubes. The turntable drives the clamping assembly and the semiconductor graphite tube to rotate, completing the loading, grinding, and unloading processes during rotation. This achieves continuous grinding operations and improves work efficiency.

[0005] The technical solution of the present invention is as follows:

[0006] A device for polishing the inner wall of a semiconductor graphite tube includes a support frame with a rotating assembly. The rotating assembly includes a turntable with a hollow structure. A feeding assembly and a discharging assembly are respectively arranged on the left and right sides of the turntable. Several support plates are fixedly arranged on the turntable, and clamping assemblies are slidably arranged on each of the support plates. A guide assembly is fixedly arranged inside the turntable, and a polishing assembly is arranged above the turntable. A dust collection assembly is also arranged inside the turntable. The feeding assembly is used to transport the semiconductor graphite tube. The rotating assembly is used to drive the clamping assembly to rotate. The clamping assembly is used to cooperate with the guide assembly to clamp or release the semiconductor graphite tube during rotation. The polishing assembly is used to polish the inner wall of the semiconductor graphite tube. The dust collection assembly is used to collect the waste generated during polishing. The discharging assembly is used to output the polished semiconductor graphite tube.

[0007] As a preferred embodiment, the rotating assembly further includes a fixed seat fixedly mounted on a support frame, a rotating shaft rotatably mounted within the fixed seat, a motor base fixedly mounted on the fixed seat, and a motor a fixedly mounted on the motor base. The output shaft of the motor a is fixedly connected to the rotating shaft. A support rod is also fixedly mounted on the support frame, and a rotating seat is fixedly mounted on the support rod. The turntable is rotatably mounted on the rotating seat, and the turntable is fixedly mounted on the rotating shaft. The rotating shaft is rotatably mounted within the rotating seat.

[0008] As a preferred embodiment, the feeding assembly includes a fixed frame a, a conveyor belt a rotatably mounted on the fixed frame a, a feeding box fixedly mounted on the fixed frame a, and a limiting plate a fixedly mounted on the fixed frame a, wherein the feeding box is located above the conveyor belt a.

[0009] As a preferred embodiment, the support plate has a through groove, and both sides of the through groove have sliding grooves a. The inner wall of the turntable has a sliding groove b. The clamping assembly includes a slider a slidably disposed in the sliding groove a, a slider b slidably disposed in the sliding groove a, a clamping plate a fixedly disposed on the slider a, a clamping plate b fixedly disposed on the slider b, a connecting rod a hingedly disposed at the bottom of the slider a, a connecting rod b hingedly disposed at the bottom of the slider b, a connecting shaft slidably disposed in the sliding groove b, and a spring fixedly connected between the connecting shaft and the sliding groove b. The bottoms of the connecting rod a and the connecting rod b are rotatably disposed on the connecting shaft. The clamping plates a and b are both configured as arc-shaped structures.

[0010] As a preferred embodiment, the guide assembly includes a connecting column fixedly mounted on the rotating seat and a cam fixedly mounted on the connecting column, the cam being coaxial with the rotating shaft.

[0011] As a preferred embodiment, the grinding assembly includes a fixed plate fixedly mounted on a support frame, a cylinder fixedly mounted on the fixed plate, a piston rod driven by the cylinder, a rotating rod rotatably mounted at the bottom of the piston rod, a grinding rod fixedly mounted at the bottom of the rotating rod, a motor b fixedly mounted on the piston rod, a pulley a fixedly mounted on the rotating rod, a pulley b fixedly mounted on the output shaft of the motor b, and a belt connecting pulley a and pulley b. A slide rail is also fixedly mounted on the fixed plate, and the motor b is slidably mounted on the slide rail. The outer diameter of the grinding rod is consistent with the inner diameter of the semiconductor graphite tube.

[0012] As a preferred embodiment, the vacuuming assembly includes several vacuuming holes opened on the top of the rotating base, a vacuuming pipe fixedly connected to the rotating base, a baffle fixedly installed on the rotating base, and a vacuum cleaner fixedly installed on the support frame. The baffle has a notch at the top, the vacuuming pipe is connected to the vacuuming holes, and the other end of the vacuuming pipe is fixedly connected to the vacuum cleaner.

[0013] As a preferred embodiment, the feeding assembly includes a fixed frame b, a conveyor belt b rotatably mounted on the fixed frame b, and limiting plates b fixedly mounted on both sides of the fixed frame b.

[0014] As a preferred embodiment, the inner surfaces of both clamping plate a and clamping plate b are fixedly provided with a number of rubber protrusions.

[0015] As another preferred embodiment, one side of the baffle is in contact with the inner wall of the turntable, and the other side is in contact with the surface of the cam.

[0016] The beneficial effects of this invention are as follows:

[0017] 1. This invention is equipped with a feeding component and a discharging component. The semiconductor graphite tube is transported to the clamping component by a conveyor belt a, and the polished semiconductor graphite tube is unloaded by a conveyor belt b, realizing automatic feeding and unloading operations and improving work efficiency.

[0018] 2. This invention includes a rotating component, a clamping component, and a guiding component. A turntable drives the clamping component to rotate. On the path from the feeding component to the grinding component, the clamping component cooperates with the cam, causing clamping plate a and clamping plate b to gradually close and fix the semiconductor graphite tube. On the path from the grinding component to the unloading component, the clamping component cooperates with the cam, causing clamping plate a and clamping plate b to gradually separate and release the semiconductor graphite tube, thus realizing automatic clamping and releasing operations.

[0019] 3. The present invention also includes a dust collection component. By setting up a dust collector, a dust collection hole, and a dust collection pipe, when grinding the semiconductor graphite tube, the waste generated during grinding is sucked into the dust collection hole by the dust collector and then enters the dust collector through the dust collection pipe for collection, thus avoiding the dust from being scattered on the ground and polluting the working environment. In addition, the waste from the dust collector can be cleaned up regularly.

[0020] In summary, this invention has the advantages of high work efficiency and high degree of automation, and is suitable for the field of semiconductor graphite tube processing technology. Attached Figure Description

[0021] The invention will be further described below with reference to the accompanying drawings:

[0022] Figure 1 A device for polishing the inner wall of a semiconductor graphite tube;

[0023] Figure 2 for Figure 1 Enlarged view of point A;

[0024] Figure 3 This is a schematic diagram of the rotating assembly.

[0025] Figure 4This is a frontal cross-sectional view of the turntable;

[0026] Figure 5 This is a side sectional view of the turntable;

[0027] Figure 6 This is a schematic diagram showing the state of a semiconductor graphite tube during polishing.

[0028] Reference numerals: 1-Support frame; 11-Bearing plate; 12-Semiconductor graphite tube; 13-Through groove; 14-Slide a; 15-Slide b; 2-Rotating assembly; 21-Turntable; 22-Fixed seat; 23-Rotating shaft; 24-Motor seat; 25-Motor a; 26-Support rod; 27-Rotating seat; 3-Feeding assembly; 31-Fixed frame a; 32-Conveyor belt a; 33-Feeding box; 34-Limiting plate a; 4-Unloading assembly; 41-Fixed frame b; 42-Conveyor belt b; 43-Limiting plate b; 5-Clamping assembly; 51-Slider a; 52-Slider b; 53-Clamping plate a; 54-Clamping plate b; 55-Connecting rod a; 56-Connecting rod b; 57-Connecting shaft; 58-Spring; 6-Guide assembly; 61-Connecting column; 62-Cam; 7-Grinding assembly; 71-Fixing plate; 72-Cylinder; 73-Piston rod; 74-Rotating rod; 75-Grinding rod; 76-Motor b; 77-Pulley a; 78-Pulley b; 79-Belt; 8-Dust collection assembly; 81-Dust collection hole; 82-Dust collection pipe; 83-Baffle; 84-Vacuum cleaner; 85-Notch; 9-Rubber protrusion; 91-Slide rail. Detailed Implementation

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0030] Example 1

[0031] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0032] like Figures 1 to 6As shown, a semiconductor graphite tube inner wall polishing device includes a support frame 1, a rotating assembly 2 on the support frame 1, a turntable 21 with a hollow structure, a feeding assembly 3 and a discharging assembly 4 on the left and right sides of the turntable 21 respectively, a plurality of bearing plates 11 fixedly mounted on the turntable 21, a clamping assembly 5 slidably mounted on each of the bearing plates 11, a guide assembly 6 fixedly mounted inside the turntable 21, a polishing assembly 7 above the turntable 21, and a dust collection assembly 8 inside the turntable 21. The feeding assembly 3 is used to transport the semiconductor graphite tube 12, the rotating assembly 2 is used to drive the clamping assembly 5 to rotate, the clamping assembly 5 is used to cooperate with the guide assembly 6 to clamp or release the semiconductor graphite tube 12 during rotation, the polishing assembly 7 is used to polish the inner wall of the semiconductor graphite tube 12, the dust collection assembly 8 is used to collect the waste generated during the polishing process, and the discharging assembly 4 is used to output the polished semiconductor graphite tube 12.

[0033] like Figure 3 As shown, the rotating assembly 2 also includes a fixed seat 22 fixedly mounted on the support frame 1, a rotating shaft 23 rotatably mounted in the fixed seat 22, a motor seat 24 fixedly mounted on the fixed seat 22, and a motor a25 fixedly mounted on the motor seat 24. The output shaft of the motor a25 is fixedly connected to the rotating shaft 23. A support rod 26 is also fixedly mounted on the support frame 1, and a rotating seat 27 is fixedly mounted on the support rod 26. The turntable 21 is rotatably mounted on the rotating seat 27 and fixedly mounted on the rotating shaft 23. The rotating shaft 23 is rotatably mounted in the rotating seat 27. In use, the motor a25 is turned on to drive the turntable 21 to rotate. During the rotation, the operations of feeding, grinding, and unloading are realized, which greatly improves the work efficiency.

[0034] like Figure 1 As shown, the feeding assembly 3 includes a fixed frame a31, a conveyor belt a32 rotatably mounted on the fixed frame a31, a feeding box 33 fixedly mounted on the fixed frame a31, and a limiting plate a34 fixedly mounted on the fixed frame a31. The feeding box 33 is located above the conveyor belt a32. In use, several semiconductor graphite tubes 12 are stacked inside the feeding box 33. The bottom semiconductor graphite tube 12 falls onto the conveyor belt a32 and is transported to the clamping assembly 5, realizing automatic feeding operation and improving work efficiency.

[0035] like Figure 4As shown, a through groove 13 is provided on the bearing plate 11, and sliding grooves a14 are provided on both sides of the through groove 13. A sliding groove b15 is provided on the inner wall of the turntable 21. The clamping assembly 5 includes a slider a51 slidably disposed in the sliding groove a14, a slider b52 slidably disposed in the sliding groove a14, a clamping plate a53 fixedly disposed on the slider a51, a clamping plate b54 fixedly disposed on the slider b52, a connecting rod a55 hinged to the bottom of the slider a51, a connecting rod b56 hinged to the bottom of the slider b52, a connecting shaft 57 slidably disposed in the sliding groove b15, and a spring 58 fixedly connected between the connecting shaft 57 and the sliding groove b15. The bottoms of the connecting rods a55 and b56 are rotatably disposed on the connecting shaft 57. The clamping plates a53 and b54 are both designed with an arc-shaped structure. In use, when the clamping assembly 5 is located at the feeding assembly 3, the spring 58 is compressed, and the feeding assembly 3 holds the semiconductor. When the graphite tube 12 is conveyed between the clamping plate a53 and the clamping plate b54, driven by the turntable 21, the clamping plates a53 and b54 gradually close under the action of the cam 62 during the rotation of the semiconductor graphite tube 12 to the grinding component 7, clamping and fixing the semiconductor graphite tube 12. At this time, the connecting shaft 57 slides in the slide groove b15, and the spring 58 is released, so that the semiconductor graphite tube 12 is fixed when it is located below the grinding component 7. After the semiconductor graphite tube 12 is ground, driven by the turntable 21, the clamping plates a53 and b54 gradually separate under the action of the cam 62 during the rotation of the semiconductor graphite tube 12 to the unloading component 4, releasing the semiconductor graphite tube 12. At this time, the connecting shaft 57 slides in the slide groove b15, and the spring 58 is compressed, realizing the automatic fixing of the semiconductor graphite tube 12 without manual fixing.

[0036] like Figure 4 and Figure 5 As shown, the guide assembly 6 includes a connecting post 61 fixedly mounted on the rotating seat 27 and a cam 62 fixedly mounted on the connecting post 61. The cam 62 is coaxial with the rotating shaft 23. In use, the clamping plate a53 and the clamping plate b54 are closed and opened by setting the cam 62.

[0037] like Figure 2As shown, the polishing assembly 7 includes a fixed plate 71 fixedly mounted on the support frame 1, a cylinder 72 fixedly mounted on the fixed plate 71, a piston rod 73 driven by the cylinder 72, a rotating rod 74 rotatably mounted at the bottom of the piston rod 73, a polishing rod 75 fixedly mounted at the bottom of the rotating rod 74, a motor b76 fixedly mounted on the piston rod 73, a pulley a77 fixedly mounted on the rotating rod 74, a pulley b78 fixedly mounted on the output shaft of the motor b76, and a belt 79 connecting the pulley a77 and the pulley b78. A slide rail 91 is also fixedly mounted on the fixed plate 71, and the motor b76 is slidably mounted on the slide rail 91. The outer diameter of the polishing rod 75 is perpendicular to the inner diameter of the semiconductor graphite tube 12. In operation, when the turntable 21 rotates the clamping assembly 5 and the semiconductor graphite tube 12 to directly below the polishing assembly 7, the clamping assembly 5 has already fixed the semiconductor graphite tube 12. The cylinder 72 starts working, and the piston rod 73 moves downward, driving the rotating rod 74 and the polishing rod 75 downward until the polishing rod 75 is fully inserted into the semiconductor graphite tube 12. At this time, the outer wall of the polishing rod 75 is in contact with the inner wall of the semiconductor graphite tube 12. The motor b76 is turned on, driving the output shaft of the motor b76 to rotate, thereby driving the rotating rod 74 and the polishing rod 75 to rotate. During the rotation of the polishing rod 75, the inner wall of the semiconductor graphite tube 12 is polished, improving the polishing accuracy and efficiency.

[0038] like Figure 3 and Figure 4 As shown, the vacuuming assembly 8 includes several vacuuming holes 81 opened on the top of the rotating base 27, a vacuuming pipe 82 fixedly connected to the rotating base 27, a baffle 83 fixedly installed on the rotating base 27, and a vacuum cleaner 84 fixedly installed on the support frame 1. The baffle 83 has a notch 85 on its top. The vacuuming pipe 82 is connected to the vacuuming holes 81. The other end of the vacuuming pipe 82 is fixedly connected to the vacuum cleaner 84. When in use, the vacuum cleaner 84 is turned on. When polishing the semiconductor graphite tube 12, the polishing waste generated by the vacuum cleaner 84 is sucked into the vacuuming holes 81 and then enters the vacuum cleaner 84 through the vacuuming pipe 82 for collection. The waste of the vacuum cleaner 84 can be cleaned regularly to prevent the polishing waste from scattering on the ground and polluting the working environment.

[0039] like Figure 1As shown, the unloading assembly 4 includes a fixed frame b41, a conveyor belt b42 rotatably mounted on the fixed frame b41, and limiting plates b43 fixedly mounted on both sides of the fixed frame b41. In use, after the semiconductor graphite tube 12 is polished, as the turntable 21 rotates, the clamping assembly 5 drives the semiconductor graphite tube 12 to rotate to the conveyor belt b42. At this time, the clamping assembly 5 has released its grip on the semiconductor graphite tube 12, and the bottom of the semiconductor graphite tube 12 is in contact with the top surface of the conveyor belt b42, so that the conveyor belt b42 drives the semiconductor graphite tube 12 to unload and output, realizing automatic unloading operation without manual unloading, saving time and effort, and improving work efficiency.

[0040] like Figure 5 As shown, one side of the baffle 83 is in contact with the inner wall of the turntable 21, and the other side is in contact with the surface of the cam 62. By setting the baffle 83, when the dust suction hole 81 sucks up the grinding waste, the baffle 83 plays a guiding role in the waste, guiding the waste into the dust suction hole 81.

[0041] Example 2

[0042] like Figure 3 As shown, the components that are the same as or corresponding to those in Embodiment 1 are marked with the same reference numerals as those in Embodiment 1. For the sake of simplicity, only the differences from Embodiment 1 will be described below. The difference between Embodiment 2 and Embodiment 1 is that several rubber protrusions 9 are fixedly provided on the inner surfaces of clamping plate a53 and clamping plate b54.

[0043] Here, in this embodiment, by providing rubber protrusions 9 on the inner surfaces of clamping plate a53 and clamping plate b54, the friction between clamping plate a53 and clamping plate b54 and semiconductor graphite tube 12 can be increased. On the one hand, this makes clamping plate a53 and clamping plate b54 clamp semiconductor graphite tube 12 more firmly, and on the other hand, it prevents semiconductor graphite tube 12 from rotating during polishing, thus affecting the polishing quality.

[0044] Work process

[0045] First, the workers stack the semiconductor graphite tubes 12 into the loading box 33. The conveyor belt a32 starts operating, carrying the semiconductor graphite tubes 12 that have fallen onto the conveyor belt a32 to the space between the clamping plates a53 and b54. Driven by the turntable 21, as the semiconductor graphite tubes 12 rotate onto the path of the grinding assembly 7, the clamping plates a53 and b54 gradually close under the action of the cam 62 during rotation, clamping and fixing the semiconductor graphite tubes 12. At this time, the connecting shaft 57 slides in the slide groove b15, and the spring 58 is released, so that the semiconductor graphite tubes 12 are fixed when they are below the grinding assembly 7. When the semiconductor graphite tubes 12 rotate to the space below the grinding assembly 7, the cylinder 72 starts working, and the piston rod 73 moves downward, driving the rotating rod 74 and the grinding rod 75 to move downward until... The polishing rod 75 is fully inserted into the interior of the semiconductor graphite tube 12. At this time, the outer wall of the polishing rod 75 is in contact with the inner wall of the semiconductor graphite tube 12. The motor b76 is turned on, which drives the output shaft of the motor b76 to rotate, thereby driving the rotating rod 74 and the polishing rod 75 to rotate. The polishing rod 75 polishes the inner wall of the semiconductor graphite tube 12. After the semiconductor graphite tube 12 is polished, under the drive of the turntable 21, the semiconductor graphite tube 12 rotates to the path of the feeding assembly 4. During the rotation, the clamping plate a53 and the clamping plate b54 gradually separate under the action of the cam 62 to release the semiconductor graphite tube 12. At this time, the connecting shaft 57 slides in the slide groove b15, and the spring 58 is compressed. When it rotates to the conveyor belt b42, the conveyor belt b42 outputs the semiconductor graphite tube 12.

[0046] In the description of this invention, it should be understood that the terms "front and back", "left and right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention.

[0047] Of course, those skilled in the art should understand that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. The term "a" should not be understood as a limitation on the quantity.

[0048] The above description, in conjunction with the accompanying drawings, represents only preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. It should be noted that those skilled in the art can make various modifications and improvements without departing from the structure of the present invention. These modifications and improvements should also be considered within the scope of protection of the present invention and will not affect the effectiveness and practicality of the present invention.

Claims

1. A device for polishing the inner wall of a semiconductor graphite tube, comprising a support frame, characterized in that: The support frame is equipped with a rotating assembly, which includes a turntable with a hollow structure. A feeding assembly and a discharging assembly are respectively located on the left and right sides of the turntable. Several support plates are fixedly mounted on the turntable, and clamping assemblies are slidably mounted on each support plate. A guide assembly is fixedly mounted inside the turntable. A grinding assembly is located above the turntable, and a dust extraction assembly is also located inside the turntable. The feeding assembly is used to transport the semiconductor graphite tube. The rotating assembly drives the clamping assembly to rotate. The clamping assembly, in cooperation with the guide assembly, clamps or releases the semiconductor graphite tube during rotation. The grinding assembly grinds the inner wall of the semiconductor graphite tube. The dust extraction assembly collects the waste generated during grinding. The discharging assembly outputs the ground semiconductor graphite tube. The bearing plate has a through groove, and both sides of the through groove have sliding grooves a. The inner wall of the turntable has a sliding groove b. The clamping assembly includes a slider a slidably disposed in the sliding groove a, a slider b slidably disposed in the sliding groove a, a clamping plate a fixedly disposed on the slider a, a clamping plate b fixedly disposed on the slider b, a connecting rod a hingedly disposed at the bottom of the slider a, a connecting rod b hingedly disposed at the bottom of the slider b, a connecting shaft slidably disposed in the sliding groove b, and a spring fixedly connected between the connecting shaft and the sliding groove b. The bottoms of the connecting rod a and the connecting rod b are rotatably disposed on the connecting shaft. The clamping plates a and b are both configured as arc-shaped structures. The guide assembly includes a connecting column fixedly mounted on the rotating seat and a cam fixedly mounted on the connecting column, wherein the cam is coaxial with the rotating shaft. The grinding assembly includes a fixed plate fixedly mounted on a support frame, a cylinder fixedly mounted on the fixed plate, a piston rod driven by the cylinder, a rotating rod rotatably mounted at the bottom of the piston rod, a grinding rod fixedly mounted at the bottom of the rotating rod, a motor b fixedly mounted on the piston rod, a pulley a fixedly mounted on the rotating rod, a pulley b fixedly mounted on the output shaft of the motor b, and a belt connecting pulley a and pulley b. A slide rail is also fixedly mounted on the fixed plate, and the motor b is slidably mounted on the slide rail. The outer diameter of the grinding rod is the same as the inner diameter of the semiconductor graphite tube.

2. The semiconductor graphite tube inner wall polishing device according to claim 1, characterized in that: The rotating assembly further includes a fixed seat fixedly mounted on a support frame, a rotating shaft rotatably mounted within the fixed seat, a motor base fixedly mounted on the fixed seat, and a motor a fixedly mounted on the motor base. The output shaft of the motor a is fixedly connected to the rotating shaft. A support rod is also fixedly mounted on the support frame, and a rotating seat is fixedly mounted on the support rod. The turntable is rotatably mounted on the rotating seat, and the turntable is fixedly mounted on the rotating shaft. The rotating shaft is rotatably mounted within the rotating seat.

3. The semiconductor graphite tube inner wall polishing device according to claim 1, characterized in that: The feeding assembly includes a fixed frame a, a conveyor belt a rotatably mounted on the fixed frame a, a feeding box fixedly mounted on the fixed frame a, and a limiting plate a fixedly mounted on the fixed frame a, wherein the feeding box is located above the conveyor belt a.

4. The semiconductor graphite tube inner wall polishing device according to claim 1, characterized in that: The vacuuming assembly includes several vacuuming holes on the top of the rotating base, a vacuuming pipe fixedly connected to the rotating base, a baffle fixedly mounted on the rotating base, and a vacuum cleaner fixedly mounted on the support frame. The baffle has a notch on its top, the vacuuming pipe is connected to the vacuuming holes, and the other end of the vacuuming pipe is fixedly connected to the vacuum cleaner.

5. The semiconductor graphite tube inner wall polishing device according to claim 1, characterized in that: The feeding assembly includes a fixed frame b, a conveyor belt b rotatably mounted on the fixed frame b, and limiting plates b fixedly mounted on both sides of the fixed frame b.

6. The semiconductor graphite tube inner wall polishing device according to claim 1, characterized in that: The inner surfaces of both clamping plate a and clamping plate b are fixedly provided with several rubber protrusions.

7. The semiconductor graphite tube inner wall polishing device according to claim 4, characterized in that: One side of the baffle is in contact with the inner wall of the turntable, and the other side is in contact with the surface of the cam.

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