A redundant constant temperature maintenance system for a robot joint module with a high power density ratio

Abstract

The present invention provides a redundant constant temperature maintenance system for a robot joint module with a high power density ratio. This constant temperature system adopts an independent redundant heat dissipation module composed of an electronically controlled heat dissipation module and a flat plate phase change heat pipe module. Among them, the electronically controlled heat dissipation module uses a fan backup cold redundant drive circuit for precise temperature regulation. The fan backup cold redundant drive circuit consists of a level shift chip circuit, a DC discrete gate drive circuit, and a cold redundant power supply circuit; for the flat plate phase change heat pipe module, multi-layer serpentine pulsating heat pipes with a sandwich structure and heat sink fins with an arc-shaped wedge structure are used for temperature conduction. These two sets of heat dissipation modules are based on different heat dissipation principles, dissipating heat independently of each other, but being functionally redundant with each other, and jointly maintaining a relatively constant temperature environment for the normal operation of the robot joint module in a radiation environment.

Description

Technical Field

[0001] The present invention belongs to the field of special robots, and more particularly to a redundant constant temperature maintenance system for a high power density ratio robot joint module. Background Art

[0002] For the radiation environment, the types of rays in the space radiation environment are 85% protons, 14% alpha particles, and 1% heavy ions, and the energy spectra of these rays are very wide, usually in the range of (0.1 - 10e14) MeV. Although the energies of these ray types are very high, the beam intensities are not large, resulting in a relatively low total dose per unit time. In the nuclear radiation environment, especially in nuclear emergency and nuclear decommissioning environments, the beam intensity is large, the dose rate is high, and the radiation environment ray types are a mixed radiation field of neutrons, alpha particles, and gamma rays with energy segments of 0.66 MeV, 1.17 MeV, and 1.33 MeV. By comparing the service environments of robotic equipment, it can be found that the nuclear radiation environment is far more severe than the space radiation environment. The special nuclear irradiation environment causes the most core and important component unit in the robot - the joint module - to mainly produce three major radiation effects in the nuclear environment: displacement damage effect, total dose effect, single - particle effect, and more than two kinds of synergistic effects. The particles (high - energy gamma, alpha, neutrons) in the nuclear irradiation environment elastically collide with the atomic nuclei in the semiconductor and mechanical structure materials of the micro - electronic system in the joint module, resulting in the displacement of lattice atoms and the generation of Frenkel defects. The displacement damage effect caused by these defects has two main aspects: On the one hand, for the structural materials of the robot joint module, it mainly causes changes in mechanical strength, hardness, wear resistance, and corrosion resistance at the macroscopic level, thereby leading to failure and affecting the structural reliability of the joint module. On the other hand, it causes a reduction in the minority carriers in the silicon material of the integrated electronic circuit system in the robot joint module, a decrease in doping concentration, and a reduction in the mobility of carriers, resulting in a decrease in the gain of power analog circuits, an increase in leakage current, and logic flip - flop phenomena in digital circuits. In addition, when the gamma rays (in the above - mentioned energy segments) in the nuclear irradiation environment interact with semiconductor materials such as silicon in the integrated electronic circuit system of the robot joint module, Compton effect and pair - production effect mainly occur, generating a large number of electron - hole pairs. Under the action of the electric field voltage, electrons quickly transition from the valence band to the conduction band, usually in the picosecond order of magnitude, while holes jump and transport to the interface state at local energy levels, which is a relatively slow process, usually in the millisecond or second order of magnitude. Eventually, it leads to the bending of the energy band of the component, and macroscopically, it is manifested as an increase in the threshold voltage. For the power supply and power inverter modules in the joint module, nuclear radiation causes an increase in the bus reference voltage, a deterioration of the three - phase current waveform, an increase in the enable current, and a decrease in the driving ability. Macroscopically, the total dose effect is manifested as a decrease in the driving ability of the power supply load and the inverter power module under the condition of constant total load. For the MCU, mainly Flash storage and reading failures occur, and the transceiver communication module causes abnormal message sending and receiving. In addition, in the nuclear environment, it will also cause various soft errors and hardware errors such as single - particle logic flip - flop, single - particle transient current, single - particle latch - up, and single - particle burnout in the integrated electronic circuit system of the robot joint module. In short, the radiation effects of the robot joint module are complex, and it is currently very difficult for the academic and engineering circles to accurately describe and quantitatively analyze them, and the internal effect mechanisms compete and couple with each other.Regardless of the internal effect mechanism, as long as the robot joint module is in a normal working condition in a radiation environment, the final macroscopic effect is manifested as the thermal effect of the radiation effect. In addition, when the servo drive system inside the robot joint module is working normally, it involves the conversion of mechanical and electrical energy and there is thermal power loss.

[0003] The robot joint module has the characteristics of small volume, compact structure, large driving power, and high internal mechanical and electrical integration. These characteristics make the corresponding circuit heat flux density higher. However, the electronic circuit system inside the robot joint module has a normal operating temperature. On the one hand, an increase in temperature will cause thermal self-locking of components, and on the other hand, it will also increase the hardware thermal stress of the electronic circuit system. Thermal stress will damage the interfaces and electrical connections between the semiconductor components of the electronic circuit, affect the expected life, and in severe cases, thermal failure will occur. In addition, the engineering community generally believes that thermal effects often accompany electronic circuit failures, and thermal failure has exceeded electrical failure to become one of the main failures of electronic devices. A large number of data and literature show that a decrease in temperature will cause the reliability and expected life of semiconductor devices to increase exponentially. It also shows that when the operating temperature of the electronic circuit exceeds 60 °C, for every 10 °C increase in the operating temperature thereafter, the probability of failure of the equipment composed of the electronic circuit system will increase by 50%. Therefore, in order to ensure the reliable and stable operation of the robot joint module in a radiation environment, not only the radiation protection and reinforcement problems need to be solved, but also a relatively stable temperature range needs to be provided for and maintained for the robot joint module. Summary of the Invention

[0004] In view of the above problems, aiming at the radiation effect heat and loss heat during normal operation of the high power density ratio robot joint module in a radiation environment, at the same time, based on the principles of independence, diversification, and redundancy of radiation-resistant design and the principle that similar redundancy cannot suppress common mode failures. The redundant constant temperature system of the high power density ratio robot joint module of the present invention adopts an independent redundant heat dissipation module composed of an electronically controlled heat dissipation module and a flat plate phase change heat pipe module. Among them, the electronically controlled heat dissipation module in the independent redundant heat dissipation module uses a fan backup cold redundant drive circuit for precise temperature control, and the flat plate phase change heat pipe in the independent redundant heat dissipation module uses a serpentine pulsating micro heat pipe with a sandwich structure for temperature conduction. These two sets of heat dissipation modules are based on completely different heat dissipation principles, dissipate heat independently of each other, but are functionally redundant with each other, and jointly maintain a relatively constant temperature environment (40 °C ≤ T ≤ 60 °C) for the normal operation of the robot joint module in a radiation environment.

[0005] The technical solution of the present invention provides a redundant constant temperature maintenance system for a high power density ratio robot joint module, including an electronically controlled heat dissipation module for the robot joint module and a flat plate phase change heat pipe module for the robot joint module, wherein:

[0006] The electronic control heat dissipation module of the robot joint module consists of a fan, a low-voltage power supply board, a servo drive board, an MCU control board, and a sensing and perception board;

[0007] The low-voltage power supply board in the electronic control heat dissipation module of the robot joint module supplies power to the servo drive board, the MCU control board, and the sensing and perception board of the robot joint module in sequence;

[0008] The MCU control board in the electronic control heat dissipation module of the robot joint module includes an upper MCU1 controller and a lower MCU2 controller. The upper MCU1 controller is used to calculate the servo motion algorithm of the robot joint module and perform model reconstruction calculation according to the fault mode of the robot joint module. At the same time, the calculation result is sent to the lower MCU2 controller in real time. The lower MCU2 controller is used to sense and process the temperature sensor signal on the sensing and perception board;

[0009] The sensing and perception board in the electronic control heat dissipation module of the robot joint module includes a temperature sensor and an ADC conversion circuit;

[0010] The temperature sensor collects the temperatures of the low-voltage power supply board, the servo drive board, the MCU control board, and the sensing and perception board in the electronic control heat dissipation module of the robot joint module. The collected temperatures pass through the ADC conversion circuit in the sensing and perception board and are fed back to the lower MCU2 controller in the robot joint module. The lower MCU2 controller compares the temperature signal detected by the temperature sensor in real time with the preset temperature threshold. The lower MCU2 controller outputs a control signal based on the comparison result to control the fan backup cold redundancy drive circuit in the electronic control heat dissipation module, and then controls the rotation speed of the fan to achieve precise dynamic regulation of the internal temperature of the robot joint module with a high power density ratio;

[0011] The flat-phase change heat pipe module of the robot joint module consists of a heat sink fin, a flat-phase change heat pipe, flat bolt holes, a multi-layer serpentine pulsating heat pipe, and a liquid filling pipe;

[0012] The flat-phase change heat pipe has a sandwich structure. The sandwich structure of the flat-phase change heat pipe consists of an upper flat plate, a middle groove, and a lower flat plate;

[0013] There are flat bolt holes on the upper flat plate and the lower flat plate of the flat-phase change heat pipe. Copper columns pass through the flat bolt holes to fixedly assemble and connect the upper flat plate and the lower flat plate of the flat-phase change heat pipe to the circuit board;

[0014] The circuit board is the servo drive board, the MCU control board, and the sensing and perception board;

[0015] The multi-layer serpentine pulsating heat pipe is embedded inside the middle groove of the flat-phase change heat pipe;

[0016] One heat sink fin is fixed to each of the upper and lower flat plates of the flat phase change heat pipe.

[0017] The multi-layer serpentine pulsating heat pipe is provided with a liquid filling pipe. The inside of the multi-layer serpentine pulsating heat pipe is evacuated through the liquid filling pipe, and the working medium is filled into the multi-layer serpentine pulsating heat pipe through the liquid filling pipe of the flat phase change heat pipe module.

[0018] Further, between the upper and lower flat plates of the flat phase change heat pipe, the above-mentioned circuit board is fixedly assembled and connected through copper posts and the flat plate bolt holes, and a heat conductive material is coated at the fixed assembly connection between the circuit board and the flat phase change heat pipe.

[0019] One heat sink fin is fixed to each of the upper and lower flat plates of the flat phase change heat pipe. The heat sink fin is in a circular arc wedge shape structure, and the circular arc wedge shape structure of the heat sink fin is tightly attached to the metal wall of the robot joint module, and a heat conductive material is coated at the joint between the circular arc wedge shape structure of the heat sink fin and the metal wall of the robot joint module.

[0020] Further, the multi-layer serpentine pulsating heat pipe is a structure in which multi-layer metal capillary heat pipes are bent into a serpentine shape, and the multi-layer serpentine pulsating heat pipe is embedded inside the middle groove of the flat phase change heat pipe.

[0021] The multi-layer serpentine pulsating heat pipe is a structure in which multi-layer metal capillary heat pipes are bent into a serpentine shape. The cross-sectional structure of the multi-layer serpentine pulsating heat pipe is an acute angle or sharp corner rectangle, and there is no liquid absorption core and flow control valve inside. The multi-layer serpentine pulsating heat pipe adsorbs liquid through the acute angle or sharp corner rectangle cross-section, and then forms a capillary action.

[0022] The multi-layer serpentine pulsating heat pipe is provided with a liquid filling pipe. The inside of the multi-layer serpentine pulsating heat pipe is evacuated through the liquid filling pipe, and the working medium is filled into the multi-layer serpentine pulsating heat pipe through the liquid filling pipe of the flat phase change heat pipe module.

[0023] Further, when filling the working medium into the multi-layer serpentine pulsating heat pipe, according to the radiation effect heat and loss heat of the robot joint module in different radiation environments, as well as the temperature control threshold that needs to be maintained inside the joint, working media with different melting and boiling points are filled.

[0024] Further, during the temperature regulation and feedback process, the lower MCU2 controller participates in the regulation in real time to form a complete closed-loop control; the lower MCU2 controller can also transmit the temperature signals of the low-voltage power supply board, servo drive board, MCU control board and sensing board to the PC host computer through the upper MCU1 controller of the robot joint module, realizing real-time visualization of the temperature of the electronic control heat dissipation module of the robot joint module.

[0025] Furthermore, the servo drive board in the electronic control heat dissipation module of the robot joint module further includes a fan backup cold redundancy drive circuit;

[0026] The fan backup cold redundancy drive circuit consists of a level shift chip circuit, a DC discrete gate drive circuit, and a cold redundancy power supply circuit;

[0027] The fan backup cold redundancy drive circuit composed of the level shift chip circuit, the DC discrete gate drive circuit, and the cold redundancy power supply circuit is highly integrated inside the servo drive board by using integrated circuits and board manufacturing processes;

[0028] The topology of the DC discrete gate drive circuit consists of a second N-type MOS transistor N2, a third N-type MOS transistor N3, a fourth N-type MOS transistor N4, and a first P-type MOS transistor P1;

[0029] In terms of the connection method of the DC discrete gate drive circuit, the gate of the second N-type MOS transistor N2 is directly connected to the lower layer control of the MCU2, the drain of the second N-type MOS transistor N2 is connected to the gate of the third N-type MOS transistor N3, the drain of the third N-type MOS transistor N3 is respectively connected to the gates of the fourth N-type MOS transistor N4 and the first P-type MOS transistor P1, the sources of the fourth N-type MOS transistor N4 and the first P-type MOS transistor P1 are connected, and the sources of the fourth N-type MOS transistor N4 and the first P-type MOS transistor P1 together form a push-pull output for driving the first N-type MOS transistor N1 of the fan 1 in the electronic control heat dissipation module of the robot joint module;

[0030] The topology of the cold redundancy power supply circuit consists of a fifth N-type MOS transistor N5, a second P-type MOS transistor P2, a first filter capacitor C1, and a second output voltage dividing resistor R2;

[0031] In terms of the connection method of the cold redundancy power supply circuit, the gate of the fifth N-type MOS transistor N5 is connected to the lower layer controller of the MCU2, the drain of the fifth N-type MOS transistor N5 is connected to the gate of the second P-type MOS transistor P2, the source of the second P-type MOS transistor P2 is connected to +V2, and the output +V3 passes through the second output voltage dividing resistor R2 and is connected to the discrete device gate drive circuit.

[0032] Furthermore, the cold redundancy power supply circuit can be further described as: when the arbitration signal from the lower layer controller of the MCU2 is received by the gate of the fifth N-type MOS transistor N5, indicating that the level shift chip circuit is not working properly, the fifth N-type MOS transistor N5 conducts, the second P-type MOS transistor P2 conducts, +V2 = +V3, and +V3 directly supplies power to the DC discrete gate drive circuit alone;

[0033] Since there is no arbitration signal sent by the lower-layer controller of the MCU2, it indicates that the level-shifting chip circuit is working properly. The fifth N-type MOS transistor N5 is cut off, and the second P-type MOS transistor P2 is cut off. +V3 = 0, and no external power supply is provided. The DC discrete gate drive circuit is in a power-off standby cold standby state.

[0034] Furthermore, the fan in the electronic control heat dissipation module of the robot joint module is installed inside the robot joint module and is close to the low-voltage power supply board side. The copper posts pass through the flat plate bolt holes, fixedly assembling the servo drive board, the MCU control board, and the sensing and perception board with the flat plate phase change heat pipe. After assembly, the electronic control heat dissipation module of the robot joint module and the flat plate phase change heat pipe module of the robot joint module are formed.

[0035] The electronic control heat dissipation module of the robot joint module and the flat plate phase change heat pipe module of the robot joint module are assembled together with the mechanical structure of the robot joint module to form a high-power density ratio robot joint module redundant type constant temperature maintenance system.

[0036] The beneficial effects of the present invention are as follows:

[0037] (1) Based on the principles of independence, diversification, and redundancy in radiation-resistant design and the principle that similar redundancy cannot suppress common-mode faults, the redundant type constant temperature system of the high-power density ratio robot joint module of the present invention adopts an independent redundant heat dissipation module composed of an electronic control heat dissipation module and a flat plate phase change heat pipe module. Among them, the electronic control heat dissipation module in the independent redundant heat dissipation module uses a fan backup cold redundancy drive circuit for precise temperature control, and the flat plate phase change heat pipe module in the independent redundant heat dissipation module uses a serpentine pulsating micro heat pipe with a sandwich structure for temperature conduction. These two sets of heat dissipation modules are based on completely different heat dissipation principles, dissipating heat independently of each other, but being functionally redundant with each other, and jointly maintaining a relatively constant temperature environment for the normal operation of the robot joint module in a radiation environment.

[0038] (2) The low-voltage power supply board, servo drive board, MCU control board, and sensing and perception board in the electronic control heat dissipation module not only function as the electronic control module of the robot joint module, but also have their own electronic control heat dissipation module. On the basis of hardly increasing the internal space and electronic control hardware of the robot joint module, precise temperature control and feedback can be achieved. In addition, the fan backup cold redundancy drive circuit in the electronic control heat dissipation module uses a level-shifting chip circuit, a DC discrete gate drive circuit, and a cold redundancy power supply circuit, which are highly integrated on the servo drive board through integrated circuit and board manufacturing processes, and are controlled by the arbitration signal sent by the MCU1 lower-layer controller on the MCU control board. The cold redundancy power supply circuit can switch the level-shifting chip circuit or the DC discrete gate drive circuit according to the arbitration signal.

[0039] (3) In this invention patent, the fan in the electronic control heat dissipation module of the robot joint module is essentially a motor, which is only used in a special application scenario here. Therefore, the fan backup cold redundancy drive circuit can not only be used to drive the fan, but also be used to drive the electronic control devices of all DC motors, as well as the electromagnetic brake drive of the robot joint, and has a certain universality.

[0040] (4) During the entire working fluid circulation process of the flat plate phase change heat pipe module, it does not consume external mechanical work and electric work, and completely realizes self-oscillation and heat transfer under thermal drive. It is an open-loop physical heat conduction and is used as a redundant constant temperature heat dissipation module for a high power density ratio robot joint module. In addition, the multi-layer serpentine pulsating heat pipe in the flat plate phase change heat pipe module has the characteristic of anti-gravity. The operating performance of the multi-layer serpentine pulsating heat pipe is basically not affected by the gravity effect, and it can operate in environments such as inverted gravity field and microgravity field, and can also work at any inclination angle. It is especially suitable for heat dissipation under high sealing and protection levels in the case of arbitrary towing movement in space of a high power density ratio robot joint module. Brief Description of the Drawings

[0041] The above and / or additional advantages of the present application will become obvious and easy to understand in the description of the embodiments in conjunction with the following drawings, where:

[0042] Figure 1 It is a schematic diagram of the composition of a redundant constant temperature maintenance system for a high power density ratio robot joint module;

[0043] Figure 2 It is an electromechanical assembly drawing of a redundant constant temperature maintenance system for a high power density ratio robot joint module;

[0044] Figure 3 It is an electromechanical assembly drawing of the flat plate phase change heat pipe module and the electronic control heat dissipation module;

[0045] Figure 4 It is a schematic diagram of the operation of an independent redundant heat dissipation system for a robot joint module;

[0046] Figure 5 It is a circuit diagram of the fan backup cold redundancy drive;

[0047] Figure 6 It is a circuit diagram of the cold redundancy power supply;

[0048] Figure 7 It is a heat transfer schematic diagram of the flat plate phase change heat pipe module of the robot joint module;

[0049] Figure 8 It is an internal structure diagram of the flat plate phase change heat pipe;

[0050] Figure 9 It is a schematic diagram of the phase change process of the working fluid inside the multi-layer serpentine pulsating heat pipe;

[0051] Figure 10 It is a schematic cross-sectional view of a multi-layer serpentine pulsating heat pipe.

[0052] Wherein: 1 - fan, 2 - low-voltage power supply board, 3 - servo drive board, 4 - heat sink fins, 5 - flat-phase change heat pipe, 50 - upper flat plate, 51 - lower flat plate, 52 - middle groove, 7 - MCU control board, 8 - sensing and perception board, 9 - flat plate bolt hole, 10 - multi-layer serpentine pulsating heat pipe, 11 - liquid filling pipe; 12 - copper column. Specific implementation manners

[0053] In order to more clearly understand the above-mentioned objects, features, and advantages of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.

[0054] As Figure 1-2 shown, this embodiment provides a redundant constant temperature maintenance system for a high power density ratio robot joint module. The constant temperature maintenance system includes an electric control heat dissipation module of the robot joint module and a flat-phase change heat pipe module of the robot joint module.

[0055] As Figure 2 shown, the electric control heat dissipation module of the robot joint module includes a fan 1, a low-voltage power supply board 2, a servo drive board 3, an MCU control board 7, and a sensing and perception board 8.

[0056] As Figure 3 shown, the low-voltage power supply board 2 in the electric control heat dissipation module of the robot joint module supplies power to the servo drive board 3, the MCU control board 7, and the sensing and perception board 8 of the robot joint module in sequence, adopting a power-taking-by-stages power supply method.

[0057] As Figure 3 shown, the sensing and perception board 8 in the electric control heat dissipation module of the robot joint module includes a temperature sensor and an ADC conversion circuit.

[0058] As Figure 3 shown, the MCU control board 7 in the electric control heat dissipation module of the robot joint module includes an upper-layer MCU1 controller and a lower-layer MCU2 controller. The upper-layer MCU1 controller is used to calculate the servo motion algorithm of the robot joint module, and perform model reconstruction calculation according to the fault mode of the robot joint module. At the same time, the calculation result is sent to the lower-layer MCU2 controller in real time. The lower-layer MCU2 controller is used to sense and process the temperature sensor signal on the sensing and perception board 8;

[0059] Among them, as Figure 4As described above, the process of the electronic control heat dissipation module of the robot joint module can be further described as follows: The temperature sensor collects the temperatures of the low-voltage power supply board 2, the servo drive board 3, the MCU control board 7, and the sensing and perception board 8 of the electronic control heat dissipation module of the robot joint module. The temperature sensor inputs the collected temperature analog signal into the ADC conversion circuit in the sensing and perception board 8, which converts it into a digital temperature signal. Then, through the communication protocol, the temperature signals of the low-voltage power supply board 2, the servo drive board 3, the MCU control board 7, and the sensing and perception board 8 are transmitted to the lower-layer MCU2 controller in the robot joint module. The lower-layer MCU2 controller compares the temperature signal detected in real time by the temperature sensor with the preset temperature threshold. Based on the comparison result, the lower-layer MCU2 controller outputs a PWM control signal to control the fan backup cold redundancy drive circuit in the electronic control heat dissipation module, thereby controlling the rotation speed of the fan. By controlling the rotation speed of the fan, the internal air circulation speed of the robot joint module is controlled, achieving precise dynamic regulation of the temperature;

[0060] Among them, as Figure 4 described above, the process of the electronic control heat dissipation module of the robot joint module can be further described as follows: In the above temperature regulation and feedback process, the lower-layer MCU2 controller participates in the regulation in real time, forming a complete closed-loop control. In addition, the lower-layer MCU2 controller can also transmit the temperature signals of the low-voltage power supply board 2, the servo drive board 3, the MCU control board 7, and the sensing and perception board 8 to the PC host computer after passing through the upper-layer MCU1 controller of the robot joint module, realizing real-time visualization of the temperature of the electronic control heat dissipation module of the robot joint module. Visualize and monitor the temperature of the robot joint module in the radiation environment. When it is close to the radiation heat effect threshold, the host computer can issue an alarm for reminder, and the operator can make corresponding emergency treatment.

[0061] As Figure 3 、 Figure 5 and Figure 6 shown, the servo drive board 3 in the electronic control heat dissipation module of the robot joint module, in addition to including the servo drive circuit of the robot joint module, also includes a fan backup cold redundancy drive circuit;

[0062] The fan backup cold redundancy drive circuit is composed of a level shift chip circuit, a DC discrete gate drive circuit, and a cold redundancy power supply circuit;

[0063] Among them, the topology of the DC discrete gate drive circuit is composed of a second N-type MOS transistor N2, a third N-type MOS transistor N3, a fourth N-type MOS transistor N4, and a first P-type MOS transistor P1;

[0064] Among them, in the connection mode of the DC discrete gate drive circuit, the gate of the second N-type MOS transistor N2 is directly connected to the lower layer control of the MCU2, the drain of the second N-type MOS transistor N2 is connected to the gate of the third N-type MOS transistor N3, the drain of the third N-type MOS transistor N3 is respectively connected to the gates of the fourth N-type MOS transistor N4 and the first P-type MOS transistor P1, the sources of the fourth N-type MOS transistor N4 and the first P-type MOS transistor P1 are connected, and the sources of the fourth N-type MOS transistor N4 and the first P-type MOS transistor P1 jointly form a push-pull output for driving the first N-type MOS transistor N1 of the fan 1 of the electronic control heat dissipation module of the robot joint module;

[0065] Among them, the cold redundant power supply circuit topology is composed of a fifth N-type MOS transistor N5, a second P-type MOS transistor P2, a first filter capacitor C1, and a second output voltage dividing resistor R2;

[0066] Among them, in the connection mode of the cold redundant power supply circuit, the gate of the fifth N-type MOS transistor N5 is connected to the lower layer controller of the MCU2, the drain of the fifth N-type MOS transistor N5 is connected to the gate of the second P-type MOS transistor P2, the source of the second P-type MOS transistor P2 is connected to +V2, and the output +V3 passes through the second output voltage dividing resistor R2 and is connected to the discrete device gate drive circuit;

[0067] Among them, the working process of the cold redundant power supply circuit can be further described as follows: when the gate of the fifth N-type MOS transistor N5 receives the arbitration signal from the lower layer controller of the MCU2, indicating that the level shift chip circuit is not working properly, the fifth N-type MOS transistor N5 conducts, the second P-type MOS transistor P2 conducts, +V2 = +V3, and +V3 directly supplies power to the DC discrete gate drive circuit alone;

[0068] When the lower layer controller of the MCU2 does not issue an arbitration signal, indicating that the level shift chip circuit is working properly, the fifth N-type MOS transistor N5 is cut off, the second P-type MOS transistor P2 is cut off, +V3 = 0, and no external power supply is provided. The DC discrete gate drive circuit is in a power-off standby cold standby state;

[0069] The fan backup cold redundant drive circuit consists of a level shift chip circuit, a DC discrete gate drive circuit, and a cold redundant power supply circuit. These circuits are important components of the electronic control heat dissipation module. These circuits are highly integrated inside the servo drive board 3 through integrated circuit and board manufacturing processes, and these circuits all draw power from the low-voltage power supply board 2, and the power supply method is hierarchical power supply.

[0070] As Figure 8 shown, the flat phase change heat pipe module of the robot joint module is composed of a heat sink fin 4, a flat phase change heat pipe 5, flat bolt holes 9, a multi-layer serpentine pulsating heat pipe 10, and a liquid filling pipe 11;

[0071] Among them, asFigure 8 As shown, the flat phase change heat pipe 5 has a sandwich structure, and the sandwich structure of the flat phase change heat pipe 5 consists of an upper flat plate 50, a middle groove 52, and a lower flat plate 51;

[0072] Among them, as Figure 8 shown, there are flat bolt holes 9 on the upper flat plate 50 and the lower flat plate 51 of the flat phase change heat pipe 5. The copper columns 12 pass through the flat bolt holes 9 to fixedly assemble and connect the upper flat plate 50 and the lower flat plate 51 of the flat phase change heat pipe 5 to the circuit board;

[0073] The circuit boards are a servo drive board 3, an MCU control board 7, and a sensing board 8;

[0074] The upper flat plate 50 and the lower flat plate 51 of the flat phase change heat pipe 5 are fixedly assembled and connected to the circuit board, and a heat-conducting material is applied at the fixed assembly connection between the circuit board and the flat phase change heat pipe 5 to ensure close fitting between the two and improve the heat transfer efficiency;

[0075] The multi-layer serpentine pulsating heat pipe 10 has a structure in which a multi-layer metal capillary heat pipe is bent into a serpentine shape, and the multi-layer serpentine pulsating heat pipe 10 is embedded inside the middle groove 52 of the flat phase change heat pipe 5;

[0076] One heat sink fin 4 is fixed on each of the upper flat plate 50 and the lower flat plate 51 of the flat phase change heat pipe 5. The heat sink fin 4 has a circular arc wedge structure, and the circular arc wedge structure of the heat sink fin 4 is in close contact with the metal wall of the robot joint module, and a heat-conducting material is applied at the contact between the circular arc wedge structure of the heat sink fin 4 and the metal wall of the robot joint module to ensure close fitting between the two and improve the heat transfer efficiency.

[0077] Combined with as Figure 7 shown, the working process of the flat phase change heat pipe module of the robot joint module can be further described as follows:

[0078] The heat generated by the radiation effect and the working loss of the semiconductor chip circuits on the servo drive board 3, the MCU control board 7, and the sensing board 8 inside the robot joint module is first transferred from the semiconductor chip circuits to the chip package substrate, and then the chip package substrate transfers the heat generated by the radiation effect and the working loss to the circuit boards of the servo drive board 3, the MCU control board 7, and the sensing board 8, completing the first-level transfer of the heat generated by the radiation effect and the working loss;

[0079] The upper plate 50 and the lower plate 51 of the flat-phase change heat pipe 5 are fixedly assembled and connected to the circuit boards of the servo drive board 3, the MCU control board 7, and the sensing board 8 through copper posts 12. The fixed assembly joints are coated with a heat-conducting material, which has the functions of physical isolation and rapid heat transfer, and can ensure that the radiation effect heat and the working loss heat are transferred from the circuit board to the flat heat pipe, completing the second-level transfer of the radiation effect heat and the working loss heat;

[0080] The multi-layer serpentine pulsating heat pipe 10 embedded in the middle groove 52 of the flat-phase change heat pipe 5 transfers the radiation effect heat and the working loss heat to the heat sink fin 4 through the phase change of the internal working fluid. The structure of the heat sink fin 4 is an arc-shaped wedge structure, which just fits tightly with the metal wall of the robot joint module. A heat-conducting material is coated between the heat sink fin 4 and the joint metal wall, so that the radiation effect heat and the working loss heat can be ensured to be transferred to the metal shell of the robot joint module. Finally, the metal shell of the joint module exchanges heat with the air convection, completing the third-level transfer of the radiation effect heat and the working loss heat.

[0081] As Figure 9 and Figure 10 shown, the multi-layer serpentine pulsating heat pipe 10 is a structure in which multi-layer metal capillary heat pipes are bent into a serpentine shape. The cross-sectional structure of the multi-layer serpentine pulsating heat pipe 10 is an acute-angled or sharp-angled rectangle, without a liquid-absorbing core and a flow control valve inside. The multi-layer serpentine pulsating heat pipe 10 adsorbs liquid through the acute-angled or sharp-angled rectangular cross-section, thereby forming a capillary action;

[0082] As Figure 8 shown, the multi-layer serpentine pulsating heat pipe 10 has no flow control valve but has a liquid filling tube 11. Through the liquid filling tube 11 of the flat-phase change heat pipe module, the inside of the multi-layer serpentine pulsating heat pipe 10 can be pumped into a vacuum, and the working medium can be filled into the multi-layer serpentine pulsating heat pipe 10 through the liquid filling tube 11 of the flat-phase change heat pipe module;

[0083] When the multi-layer serpentine pulsating heat pipe 10 is filled with the working medium, it can be further described as follows: When the multi-layer serpentine pulsating heat pipe 10 is filled with the working medium, different working media with different melting and boiling points can be filled according to the radiation effect heat and loss heat of the robot joint module in different radiation environments, as well as the temperature control threshold that needs to be maintained inside the joint. In addition, based on the heat balance principle of the robot joint, the best liquid filling rate needs to be maintained when filling the working medium.

[0084] Among them, as Figure 9 and Figure 10 shown, the working process of the multi-layer serpentine pulsating heat pipe 10 in the flat-phase change heat pipe module of the robot joint module can be further described as follows:

[0085] The inside of the multi-layer serpentine pulsating heat pipe 10 is evacuated through the liquid filling pipe 11, and a certain liquid filling rate of the working medium is filled. The liquid working medium will form bubble columns and liquid columns inside the multi-layer serpentine pulsating heat pipe 10, and these bubble columns and liquid columns are randomly distributed inside the multi-layer serpentine pulsating heat pipe 10;

[0086] The radiation effect heat and loss heat generated by the servo drive board 3, MCU control board 7 and sensor perception board 8 inside the robot joint module are transmitted through the first level and the second level, and are transmitted to the flat phase change heat pipe 5. The working fluid inside the multi-layer serpentine pulsating heat pipe 10 absorbs heat to generate bubbles, which expand and increase pressure rapidly, pushing the working fluid to move to the low-temperature end of the heat sink fin 4. Among them, the multi-layer serpentine pulsating heat pipe 10 close to the heat sink fin 4 is the low-temperature end. The bubbles inside the multi-layer serpentine pulsating heat pipe 10 at the low-temperature heat sink end cool, shrink and rupture, the pressure drops, and the working fluid changes from gas phase to liquid phase again;

[0087] In the process of the gas phase of the working medium in the multi-layer serpentine pulsating heat pipe 10 being converted back into the liquid phase, due to the existence of the liquid filling rate, the working medium liquid phase flows back along the acute angle or pointed rectangular cross section of the multi-layer serpentine pulsating heat pipe 10 under the action of capillary force;

[0088] The multi-layer serpentine pulsating heat pipe 10 has its own anti-gravity characteristics. It transfers heat to the low-temperature end of the heat sink fin 4 by relying on the transpiration pull of the evaporation of the working medium. After being cooled, it changes from the gas phase to the liquid phase. The liquid phase working medium relies on the capillary force of the sharp-angled or sharp-angled rectangular cross-section to attract each other and return the liquid phase to the high-temperature end of the servo drive board 3, MCU control board 7 and sensor perception board 8 of the internal circuit of the robot joint module, and completes the working cycle;

[0089] When the multi-layer serpentine pulsating heat pipe 10 is in a working cycle, there is a pressure difference between the low-temperature end of the heat sink fin 4 and the high-temperature end of the robot joint module circuit servo drive board 3, MCU control board 7 and sensor perception board 8, and there is a pressure imbalance between adjacent serpentine pipes, so that the working fluid oscillates and flows between the low-temperature end and the high-temperature end, thereby realizing heat transfer;

[0090] The multi-layer serpentine pulsating heat pipe 10 does not consume external mechanical and electrical power during the entire working cycle, and achieves self-oscillation and heat transfer completely under thermal drive. It is an open-loop physical heat conduction and is used as a redundant constant temperature heat dissipation module for a high power density robot joint module.

[0091] The fan 1 in the robot joint module electric control heat dissipation module is installed inside the robot joint module and close to one side of the low-voltage power supply board 2. The copper column 12 passes through the flat plate bolt hole 9 to fix the servo drive board 3, the MCU control board 7 and the sensor perception board 8 with the flat plate phase change heat pipe 5. After assembly, the robot joint module electric control heat dissipation module and the robot joint module flat plate phase change heat pipe module are formed;

[0092] The electronic control heat dissipation module of the robot joint module, the flat-phase change heat pipe module of the robot joint module, and the mechanical structure of the robot joint module are assembled together to form a redundant type constant temperature maintenance system for the robot joint module with a high power density ratio.

[0093] In terms of the circuit topologies and connection manners of the above-mentioned DC discrete gate drive circuit and cold redundant power supply circuit, in the embodiments, only MOS transistors are used as specific examples for illustration. However, the circuit topologies and connection manners of the above-mentioned DC discrete gate drive circuit and cold redundant power supply circuit are applicable not only to MOS transistors, but also to power devices such as IGBTs or thyristors.

[0094] In this invention patent, the fan 1 in the electronic control heat dissipation module of the robot joint module is essentially a motor, which is only used as a special application scenario here. Therefore, the fan backup cold redundant drive circuit can not only be used to drive the fan, but also be used to drive the electronic control devices of all DC motors and the electromagnetic brake drive of the robot joint.

[0095] In summary, the redundant type constant temperature system for the robot joint module with a high power density ratio of the present invention adopts an independent redundant heat dissipation module composed of an electronic control heat dissipation module and a flat-phase change heat pipe module. Among them, the electronic control heat dissipation module in the independent redundant heat dissipation module uses a backup cold redundant drive circuit for precise closed-loop temperature control, and the flat-phase change heat pipe in the independent redundant heat dissipation module uses a serpentine pulsating micro heat pipe with a sandwich structure for temperature conduction. These two sets of heat dissipation modules are based on completely different heat dissipation principles, dissipate heat independently from each other, but are functionally redundant with each other, and jointly maintain a relatively constant temperature environment (40°C ≤ T ≤ 60°C) for the normal operation of the robot joint module in a radiation environment.

[0096] The steps in the present invention can be adjusted, combined, and deleted according to actual needs. The units in the device of this application can be combined, divided, and deleted according to actual needs. Although this application is disclosed in detail with reference to the accompanying drawings, it should be understood that these descriptions are only exemplary and are not used to limit the application of this application. The protection scope of this application is defined by the appended claims and may include various variations, modifications, and equivalent solutions made to the invention without departing from the protection scope and spirit of this application.

Claims

1. A redundant constant temperature maintenance system for a high power density ratio robot joint module, comprising an electronic control heat dissipation module of the robot joint module and a flat phase change heat pipe module of the robot joint module, characterized in that: The electronic control heat dissipation module of the robot joint module is composed of a fan (1), a low-voltage power supply board (2), a servo drive board (3), an MCU control board (7), and a sensing and perception board (8). The low-voltage power supply board (2) in the electronic control heat dissipation module of the robot joint module supplies power to the servo drive board (3), the MCU control board (7), and the sensing and perception board (8) of the robot joint module in sequence. The MCU control board (7) in the electronic control heat dissipation module of the robot joint module includes an upper MCU1 controller and a lower MCU2 controller. The upper MCU1 controller is used to calculate the servo motion algorithm of the robot joint module and perform model reconstruction calculation according to the fault mode of the robot joint module. At the same time, the calculation result is sent to the lower MCU2 controller in real time. The lower MCU2 controller is used to sense and process the temperature sensor signal on the sensing and perception board (8). The sensing and perception board (8) in the electronic control heat dissipation module of the robot joint module includes a temperature sensor and an ADC conversion circuit. The temperature sensor collects the temperatures of the low-voltage power supply board (2), the servo drive board (3), the MCU control board (7), and the sensing and perception board (8) in the electronic control heat dissipation module of the robot joint module. The collected temperature is fed back to the lower MCU2 controller in the robot joint module through the ADC conversion circuit in the sensing and perception board (8). The lower MCU2 controller compares the temperature signal detected in real time by the temperature sensor with a preset temperature threshold. The lower MCU2 controller outputs a control signal based on the comparison result to control the fan backup cold redundancy drive circuit in the electronic control heat dissipation module, and then controls the rotation speed of the fan (1) to achieve precise dynamic regulation of the internal temperature of the robot joint module with a high power density ratio. The flat-phase change heat pipe module of the robot joint module is composed of a heat sink fin (4), a flat-phase change heat pipe (5), flat bolt holes (9), a multi-layer serpentine pulsating heat pipe (10), and a liquid filling pipe (11). The flat-phase change heat pipe (5) has a sandwich structure. The sandwich structure of the flat-phase change heat pipe (5) is composed of an upper flat plate (50), a middle groove (52), and a lower flat plate (51). There are flat bolt holes (9) on the upper flat plate (50) and the lower flat plate (51) of the flat-phase change heat pipe (5). Copper columns (12) pass through the flat bolt holes (9) to fixedly assemble and connect the upper flat plate (50) and the lower flat plate (51) of the flat-phase change heat pipe (5) to the circuit board. The circuit board is the servo drive board (3), the MCU control board (7), and the sensing and perception board (8). The multi-layer serpentine pulsating heat pipe (10) is embedded inside the middle groove (52) of the flat-phase change heat pipe (5). One heat sink fin (4) is fixed on each of the upper flat plate (50) and the lower flat plate (51) of the flat-phase change heat pipe (5). The multi-layer serpentine pulsating heat pipe (10) is provided with a liquid filling tube (11). The inside of the multi-layer serpentine pulsating heat pipe (10) is evacuated through the liquid filling tube (11), and the working medium is filled into the multi-layer serpentine pulsating heat pipe (10) through the liquid filling tube (11) of the flat plate phase change heat pipe module.

2. The redundant constant temperature maintenance system for a high power density ratio robot joint module according to claim 1, characterized in that: Between the upper flat plate (50) and the lower flat plate (51) of the flat plate phase change heat pipe (5), the circuit board is fixedly assembled and connected by copper columns (12) and the flat plate bolt holes (9). A heat conductive material is coated at the fixed assembly connection between the circuit board and the flat plate phase change heat pipe (5). One heat sink fin (4) is fixed to each of the upper flat plate (50) and the lower flat plate (51) of the flat plate phase change heat pipe (5). The heat sink fin (4) is of a circular arc wedge-shaped structure. The circular arc wedge-shaped structure of the heat sink fin (4) is tightly attached to the metal wall of the robot joint module, and a heat conductive material is coated at the joint between the circular arc wedge-shaped structure of the heat sink fin (4) and the metal wall of the robot joint module.

3. The redundant constant temperature maintenance system for a high power density ratio robot joint module according to claim 1, characterized in that: The multi-layer serpentine pulsating heat pipe (10) is a structure in which multi-layer metal capillary heat pipes are bent into a serpentine shape. The multi-layer serpentine pulsating heat pipe (10) is embedded inside the middle groove (52) of the flat plate phase change heat pipe (5). The multi-layer serpentine pulsating heat pipe (10) is a structure in which multi-layer metal capillary heat pipes are bent into a serpentine shape. The cross-sectional structure of the multi-layer serpentine pulsating heat pipe (10) is an acute angle or sharp angle rectangle. There is no liquid absorption core and flow control valve inside. The multi-layer serpentine pulsating heat pipe (10) adsorbs liquid through the acute angle or sharp angle rectangular cross-section, thereby forming a capillary action. The multi-layer serpentine pulsating heat pipe (10) is provided with a liquid filling tube (11). The inside of the multi-layer serpentine pulsating heat pipe (10) is evacuated through the liquid filling tube (11), and the working medium is filled into the multi-layer serpentine pulsating heat pipe (10) through the liquid filling tube (11) of the flat plate phase change heat pipe module.

4. The redundant constant temperature maintenance system for a high power density ratio robot joint module according to claim 1, characterized in that: When filling the working medium into the multi-layer serpentine pulsating heat pipe (10), working media with different melting and boiling points are filled according to the radiation effect heat and loss heat of the robot joint module in different radiation environments, as well as the temperature control threshold that needs to be maintained inside the joint.

5. The redundant constant temperature maintenance system for a high power density ratio robot joint module according to claim 1, characterized in that: During the temperature regulation and feedback process, the lower controller of MCU2 participates in the regulation in real time to form a complete closed-loop control. The lower controller of MCU2 can also transmit the temperature signals of the low-voltage power supply board (2), the servo drive board (3), the MCU control board (7), and the sensing board (8) to the PC host computer through the upper controller of MCU1 of the robot joint module, realizing real-time visualization of the temperature of the electronic control heat dissipation module of the robot joint module.

6. The redundant constant temperature maintenance system for a high power density ratio robot joint module according to claim 1, characterized in that: The servo drive board (3) in the electronic control heat dissipation module of the robot joint module also includes a fan backup cold redundancy drive circuit. The fan backup cold redundancy drive circuit is composed of a level shift chip circuit, a DC discrete gate drive circuit, and a cold redundancy power supply circuit. The fan backup cold redundancy drive circuit composed of the level shift chip circuit, the DC discrete gate drive circuit, and the cold redundancy power supply circuit is highly integrated inside the servo drive board (3) by using integrated circuit and plate-making processes. The DC discrete gate drive circuit topology is composed of a second N-type MOS transistor N2, a third N-type MOS transistor N3, a fourth N-type MOS transistor N4, and a first P-type MOS transistor P1; In terms of the connection method of the DC discrete gate drive circuit, the gate of the second N-type MOS transistor N2 is directly connected to the lower layer control of the MCU2. The drain of the second N-type MOS transistor N2 is connected to the gate of the third N-type MOS transistor N3. The drain of the third N-type MOS transistor N3 is respectively connected to the gates of the fourth N-type MOS transistor N4 and the first P-type MOS transistor P1. The sources of the fourth N-type MOS transistor N4 and the first P-type MOS transistor P1 are connected. The sources of the fourth N-type MOS transistor N4 and the first P-type MOS transistor P1 together form a push-pull output for driving the first N-type MOS transistor N1 of the fan 1 of the electronic control heat dissipation module of the robot joint module; The cold redundant power supply circuit topology is composed of a fifth N-type MOS transistor N5, a second P-type MOS transistor P2, a first filter capacitor C1, and a second output voltage dividing resistor R2; In terms of the connection method of the cold redundant power supply circuit, the gate of the fifth N-type MOS transistor N5 is connected to the lower layer controller of the MCU2. The drain of the fifth N-type MOS transistor N5 is connected to the gate of the second P-type MOS transistor P2. The source of the second P-type MOS transistor P2 is connected to +V2, and the output +V3 of the drain passes through the second output voltage dividing resistor R2 and is connected to the discrete device gate drive circuit.

7. The redundant constant temperature maintenance system for a high power density ratio robot joint module according to claim 6, wherein: The cold redundant power supply circuit is set as follows: when the gate of the fifth N-type MOS transistor N5 receives the arbitration signal from the lower layer controller of the MCU2, indicating that the level shift chip circuit is not working properly, the fifth N-type MOS transistor N5 conducts, the second P-type MOS transistor P2 conducts, +V2 = +V3, and +V3 directly supplies power to the DC discrete gate drive circuit alone; When the lower layer controller of the MCU2 does not issue an arbitration signal, indicating that the level shift chip circuit is working properly, the fifth N-type MOS transistor N5 is cut off, the second P-type MOS transistor P2 is cut off, +V3 = 0, and no external power supply is provided. The DC discrete gate drive circuit is in a power-off standby cold standby state.

8. The redundant constant temperature maintenance system for a high power density ratio robot joint module according to claim 1, wherein: The fan (1) in the electronic control heat dissipation module of the robot joint module is installed inside the robot joint module and is close to the low-voltage power supply board (2). The copper column (12) passes through the flat plate bolt hole (9), and the servo drive board (3), the MCU control board (7), and the sensing and perception board (8) are fixedly assembled with the flat plate phase change heat pipe (5). After assembly, the electronic control heat dissipation module of the robot joint module and the flat plate phase change heat pipe module of the robot joint module are formed; The electronic control heat dissipation module of the robot joint module and the flat plate phase change heat pipe module of the robot joint module are assembled together with the mechanical structure of the robot joint module to form a high power density ratio robot joint module redundant type constant temperature maintenance system.

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