Coaxial packaging laser structure

Abstract

The invention provides a coaxial packaging laser structure, and belongs to the technical field of lasers. Comprising a tube base, a tube cap is arranged at the upper end of the tube base, pins are arranged on the inner side of the lower end of the tube base, a heat sink is arranged on the rear side of the upper end of the tube base, a laser chip is arranged in the middle of the front end of the heat sink, hold-down modules are arranged on the left side and the right side of the front end of the laser chip, and a photodiode is arranged in the middle of the upper end of the tube base. According to the laser chip clamping device, the laser chip is clamped under the action of the stress of the spring piece through the arranged pressing module, the front end of the pressing module is attached to the chamfer of the laser chip due to the fact that the spring pull rod at the front end is telescopic, clamping acting force is generated while pulling force is generated, and fixing is conducted in front of and on the side faces of the laser chip, the thermistor and the heat sink; under the condition that an existing installation structure is not changed, compared with a traditional mode of only depending on attachment for reinforcement, separation caused by thermal expansion mismatch is not prone to occurring, and using is more reliable.

Description

Technical Field

[0001] The present invention relates to the technical field of lasers, and particularly to a coaxial packaged laser structure. Background Art

[0002] A laser is an optical device that emits a laser beam. It generates a strong light beam with a specific wavelength, direction, and coherence by exciting atoms, molecules, or other particles to emit highly coherent light. A coaxial packaged laser is a laser in which optical components such as laser chips are packaged in a metal housing with a coaxial structure, also known as a TO packaged laser.

[0003] Currently, the main body shape of the packaging structure of existing coaxial packaged lasers is cylindrical, which is composed of a header and a cap to form a sealed structure. Then, various optoelectronic components are installed inside the sealed structure to form a complete laser. This TO packaged laser has the advantages of small size, flexible use, and low cost, and is easy to manufacture and assemble. However, although heat dissipation design can be carried out for parts such as the header in TO packaging, the overall heat dissipation performance is still relatively weak compared to some dedicated heat dissipation packaging structures. At the same time, in existing lasers, laser chips, thermistors, heat sinks, etc. inside are fixed by a mutually adhered installation method. Since the surface roughnesses of different materials are different, the actual contact area is not in an ideal state, and there will be an interfacial thermal resistance, which will also hinder the effective dissipation of heat from the laser chip through the heat sink. When operating at high power, the heat generated by the laser chip of the laser is difficult to dissipate quickly, resulting in too high a temperature of the chip, affecting its performance and lifespan. Moreover, there is a lack of a fixing structure in the area of components such as the laser chip. Since the thermal expansion coefficients of different materials are different, during the operation of the laser, temperature changes will cause different degrees of expansion or contraction of the laser chip, thermistor, and heat sink on site. This thermal expansion mismatch may cause a change in the adhesion pressure between them, and in severe cases, they may separate from each other, affecting the performance and reliability of the device. At the same time, the pins of existing TO packaging are prone to bending during installation and disassembly, affecting subsequent use. Therefore, it is necessary to optimize and improve the packaging structure of existing coaxial packaged lasers. Thus, the present application provides a coaxial packaged laser structure to meet the requirements. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a coaxial packaged laser structure to optimize and improve the problems of low self-heat dissipation efficiency of existing coaxial packaged lasers, lack of a mechanical fixing structure after the internal laser chip, thermistor, and heat sink are adhered, easy separation when thermal expansion mismatch occurs, and easy bending of pins.

[0005] To solve the above technical problems, the present invention provides the following technical solutions: A coaxial packaged laser structure includes a header. A cap is provided at the upper end of the header. Pins are provided inside the lower end of the header. A heat sink is provided at the rear side of the upper end of the header. A laser chip is provided in the middle of the front end of the heat sink. Pressing modules are provided on the left and right sides of the front end of the laser chip. A photodiode is provided in the middle of the upper end of the header. A support module is sleeved and installed at the outer end of the pin. A cooling module is provided inside the cap. A lens is embedded and installed inside the upper end of the cap. A heat conduction module is provided outside the lower side of the lens. Liquid inlet pipes are symmetrically distributed on the upper and lower sides of the outer end of the header.

[0006] Optionally, the header includes a base body, a welding groove, triangular blocks, an upper connecting pipe, and an inclined groove. A welding groove is formed on the outer side of the upper end of the base body. Triangular blocks are symmetrically provided at the rear of the inner side of the welding groove. An upper connecting pipe is provided in the middle of the rear side of the triangular blocks. An inclined groove is formed in the middle of the upper end of the base body.

[0007] Optionally, the cap includes a cap body, an outer clamping block, an inner embedded groove, and a sealing ring. An outer clamping block is provided at the lower end of the cap body. An inner embedded groove is formed above the inner side of the cap body. A sealing ring is provided at the lower end of the outer clamping block.

[0008] Optionally, the heat sink includes an inner cavity block, reinforcing plates, support blocks, and lower connecting pipes. Reinforcing plates are provided below the left and right sides of the outer end of the inner cavity block. Support blocks are symmetrically distributed at the lower end of the inner cavity block. Lower connecting pipes are symmetrically distributed in the middle of the lower end of the inner cavity block.

[0009] Optionally, the pressing module includes a rod body, spring pieces, a scale disk, a knob rod, a spring pull rod, a strip block, an adjusting rod, and an angle plate. Spring pieces are provided on the upper and lower sides of the outer end of the rod body. Scale disks are provided on the upper and lower sides of the outer end of the rod body. A knob rod is provided at the upper end of the scale disk. A spring pull rod is provided at the front side of the outer end of the knob rod. A strip block is provided at the front side of the spring pull rod. An adjusting rod is provided at the right side of the outer end of the strip block. An angle plate is provided at the right end of the adjusting rod.

[0010] Optionally, the support module includes a cylindrical block, a threaded rod, a magnetic attraction block, a tension spring, a support rod, a sleeve, and a rubber sleeve. A threaded rod is provided at the upper end of the cylindrical block. A magnetic attraction block is provided inside the top end of the threaded rod. Tension springs are symmetrically distributed in the middle of the outer end of the cylindrical block. A support rod is provided at the front end of the tension spring. A sleeve is provided at the front end of the support rod. A rubber sleeve is provided inside the sleeve.

[0011] Optionally, the cooling module includes an outer rotating pipe, an inner rotating pipe, a liquid inlet, a liquid outlet, and a connecting piece. The inner rotating pipe is communicated with the inside of the outer rotating pipe. A liquid inlet is provided on the left side of the lower end of the outer rotating pipe. A liquid outlet is provided on the right side of the lower end of the inner rotating pipe. Connecting pieces are symmetrically distributed in the middle of the outer rotating pipe and the inner rotating pipe.

[0012] Optionally, the heat conduction module includes a heat conduction shell, an embedding ring, welding points, and heat conduction fins. An embedding ring is provided at the top end of the heat conduction shell. Welding points are annularly distributed at the upper end of the embedding ring. Heat conduction fins are annularly distributed inside the heat conduction shell.

[0013] Optionally, the lower end of the tube cap extends to the inside of the upper end of the tube base and is welded by energy storage welding. The upper end of the pin penetrates through the inside of the tube base and extends upward. The inner side of the contact end of the pin and the tube base is sealed with each other by a glass ring. The heat sink is an integral structure. Among them, the front-end structure is rectangular, the rear-end structure is arc-shaped, and there are two through holes on the left and right opened inside the rectangular structure at the front end. An inverted U-shaped pipeline cavity is opened inside the arc-shaped structure at the rear end. A thermistor is attached between the heat sink and the laser chip. There are two groups of pressing modules symmetrically distributed on the left and right.

[0014] Optionally, the rod body, the scale disk, and the knob rod are spliced together by threads to form a whole. The spring pieces and the spring pull rods are symmetrically distributed up and down. The rear end of the spring pull rod is thread-reinforced with the front side of the outer end of the knob rod, and the front end of the spring pull rod is fixedly welded to the rear end of the strip.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects: In the above solution, through the arranged pressing module, before the laser chip, the thermistor, and the heat sink are fitted and fixed, first insert two special-sized square rods into the slots opened at the top ends of the left and right knob rods, and then rotate the knob rods in opposite directions, so that the left and right knob rods drive the clamping structure formed by the spring pull rod, the strip, the adjusting rod, and the angle plate at the front end to expand to both sides. During the expansion, when the knob rod drives the rod body to rotate, the spring piece will complete the winding work. After that, when the fitting of the laser chip, the thermistor, and the heat sink is completed, only need to slowly release the rotational force of the knob rod. Under the action of its own characteristics, the spring piece will release the energy generated by the winding, push the expanded clamping structure to close inward, and make the left and right angle plates fit on both sides of the laser chip for clamping. Moreover, through the action of the spring pull rod, the transverse structure composed of the strip, the adjusting rod, and the angle plate can be extended and contracted, generating a backward pulling force at the front end of the laser chip, making the three of the laser chip, the thermistor, and the heat sink fit more firmly and tightly. Without changing the existing installation structure, compared with the traditional method that only relies on fitting and reinforcement, it is not easily affected by thermal expansion mismatch and separated, and is more reliable to use.

[0016] With the provided heat conduction module, due to the heat conduction fins annularly distributed on its inner side, the heat dissipation contact area is increased, and the heat of the gas heated by the laser chip operation is absorbed. Then, the heat is conducted to the outer cavity through the heat conduction shell. At the same time, through the symmetrically arranged liquid inlet pipes on the left and right, they can be connected to the output end and the recovery end of the external cooling device. When cooling is required, the coolant in the external cooling device is injected from the left liquid inlet pipe below the tube base. A part of the coolant will enter the internal cavity of the tube base, and the coolant entering the cavity will reach the upper connecting pipe on the left through the internal passage of the tube base and then enter the heat sink to carry away the heat conducted by the heat sink. Another part of the coolant will flow into the cooling module along the liquid inlet pipe penetrating the inside of the tube base and flow from the outer rotating pipe to the inner rotating pipe. Since the inner rotating pipe is wound around the outside of the heat conduction shell, the heat conducted by the heat conduction shell is absorbed. Then, the coolant enters the liquid inlet pipe on the right below the tube base from the liquid discharge port to complete the discharge work. Compared with the traditional heat dissipation through heat conduction, the new heat dissipation structure not only has a better effect, but also the overall structure is only optimized and improved on the inner side of the existing tube base, tube cap and heat sink, without increasing the overall size of the existing laser, and improves the performance and service life of the internal components.

[0017] With the provided support module, after the laser pins are installed, a rubber sleeve is used to wrap the middle part of the outside of the pins. Then, according to the distribution pitch of the pins, the length of the support rod and the self-stress of the tension spring are adjusted so that the distance between the symmetrically distributed sleeves and the cylindrical blocks just matches the distribution pitch of the pins. Then, the sleeves are installed on the outside of the rubber sleeve, and the cylindrical blocks are fixed through threaded rods and magnetic blocks, so that the support module supports in the middle of multiple pins, thereby reducing the problem of bending of the pins during installation and disassembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings incorporated herein and constituting a part of the specification illustrate embodiments of the present invention and, together with the specification, are further used to explain the principles of the present invention and enable those skilled in the relevant art to implement and use the present invention.

[0019] Figure 1 is a three-dimensional structural schematic diagram of the present invention; Figure 2 is a three-dimensional exploded structural schematic diagram of the tube base, tube cap and heat sink of the present invention; Figure 3 is a three-dimensional structural schematic diagram of the tube base of the present invention; Figure 4 is a three-dimensional bottom structural schematic diagram of the heat sink of the present invention; Figure 5 is a three-dimensional exploded structural schematic diagram of the pressing module of the present invention; Figure 6 is a three-dimensional bottom assembled structural schematic diagram of the tube base, pins and support module of the present invention; Figure 7 Schematic top-down three-dimensional structure diagram of the support module of the present invention; Figure 8 Schematic bottom-up three-dimensional structure diagram of the cap and heat conduction module of the present invention; Figure 9 Schematic three-dimensional assembled structure diagram of the cap and cooling module of the present invention; Figure 10 Schematic three-dimensional structure diagram of the cooling module of the present invention; Figure 11 Schematic plan structure diagram of the cooling module of the present invention; Figure 12 Schematic top-down three-dimensional structure diagram of the heat conduction module of the present invention.

[0020] Reference numerals: 1, tube base; 2, cap; 3, pin; 4, heat sink; 5, laser chip; 6, pressing module; 7, photodiode; 8, support module; 9, cooling module; 10, lens; 11, heat conduction module; 12, liquid inlet pipe; 101, seat body; 102, welding groove; 103, triangular block; 104, upper connection pipe; 105, inclined groove; 2, cap body; 202, outer clamping block; 203, embedded groove; 204, sealing ring; 401, inner cavity block; 402, reinforcement plate; 403, support block; 404, lower connection pipe; 601, rod body; 602, spring piece; 603, scale disk; 604, button rod; 605, spring pull rod; 606, strip; 607, adjusting rod; 608, angle plate; 801, cylindrical block; 802, threaded rod; 8, magnetic attraction block; 804, tension spring; 805, support rod; 806, sleeve; 807, rubber sleeve; 901, outer rotating pipe; 902, inner rotating pipe; 903, liquid inlet; 904, liquid outlet; 905, connecting piece; 111, heat conduction shell; 112, embedded ring; 113, welding point; 114, heat conduction fin.

[0021] As shown in the figure, in order to clearly implement the structure of the embodiments of the present invention, specific structures and devices are marked in the figure, but this is only for schematic purposes and is not intended to limit the present invention to this specific structure, device and environment. Those of ordinary skill in the art can adjust or modify these devices and environments according to specific needs. Detailed Description of the Invention

[0022] The following describes in detail a coaxial package laser structure provided by the present invention with reference to the accompanying drawings and specific embodiments. At the same time, it should be noted here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments. For some well-known technologies, those skilled in the art can also implement them in other alternative ways; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0023] It should be noted that in the specification, references to "an embodiment", "embodiments", "exemplary embodiments", "some embodiments", etc. indicate that the described embodiments may include specific features, structures, or characteristics, but not necessarily every embodiment includes such specific features, structures, or characteristics. Additionally, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such feature, structure, or characteristic in connection with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the relevant art.

[0024] Generally, terms can be understood, at least in part, from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or can be used to describe a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood to not necessarily be intended to convey a set of exclusive factors, but rather, depending at least in part on the context, can alternatively allow for the existence of other factors that are not necessarily explicitly described.

[0025] It can be understood that the meanings of "on", "above", and "over" in the present invention should be construed in the broadest manner such that "on" not only means "directly on" something, but also includes the meaning of being "on" something with intervening features or layers therebetween, and "above" or "over" not only means "above" or "over" something, but also can include the meaning of being "above" or "over" something with no intervening features or layers therebetween.

[0026] Furthermore, spatial relative terms such as "under", "below", "lower", "above", "upper", etc. may be used herein for convenience of description to describe the relationship of one element or feature to another or other elements or features, as illustrated in the figures. Spatial relative terms are intended to cover different orientations in the use or operation of the device in addition to the orientation depicted in the figures. The device may be oriented in other ways, and the spatial relative descriptors used herein may be interpreted accordingly.

[0027] As Figures 1 to 12As shown in the figure, an embodiment of the present invention provides a coaxial packaged laser structure, including a header 1, a header cap 2 is provided at the upper end of the header 1, pins 3 are provided inside the lower end of the header 1, a heat sink 4 is provided at the rear side of the upper end of the header 1, a laser chip 5 is provided in the middle of the front end of the heat sink 4, holding modules 6 are provided on the left and right sides of the front end of the laser chip 5, a photodiode 7 is provided in the middle of the upper end of the header 1, a support module 8 is sleeved and installed at the outer end of the pin 3, a cooling module 9 is provided inside the header cap 2, a lens 10 is embedded and installed inside the upper end of the header cap 2, a heat conduction module 11 is provided outside the lower side of the lens 10, and liquid inlet pipes 12 are symmetrically distributed on the upper and lower sides of the outer end of the header 1.

[0028] The header 1 is an integral structure, and only a pipeline channel for the coolant to pass through is provided on the outside. The lower end of the header cap 2 extends to the inside of the upper end of the header 1 and is welded by energy storage welding. There are three pins 3 symmetrically distributed. The pins 3 are triangularly distributed under the header 1. Among them, the left and right pins 3 are respectively connected to the laser chip 5 and the photodiode 7, and the rear pin 3 is connected to the ground terminal. The upper end of the pin 3 penetrates through the inside of the header 1 and extends upward. The inner side of the contact end of the pin 3 and the header 1 is sealed with a glass ring. The heat sink 4 is an integral structure. Among them, the front-end structure is rectangular, the rear-end structure is arc-shaped, and there are two through holes on the left and right in the front-end rectangular structure. An inverted U-shaped pipeline cavity is provided inside the rear-end arc-shaped structure. The inlet and outlet of the inverted U-shaped pipeline cavity are respectively communicated with two lower connecting pipes 404 installed on the left and right sides below. A thermistor is attached between the heat sink 4 and the laser chip 5. There are two groups of holding modules 6 symmetrically distributed on the left and right. The photodiode 7 is adhesively installed in the middle of the inner side of the upper end of the header 1. The support module 8 is adsorbed on the middle of the lower end of the header 1 by magnetic attraction reinforcement. The liquid inlet 903 and the liquid outlet 904 of the cooling module 9 are respectively communicated with the liquid inlet pipes 12 on the left and right sides. The shape of the lens 10 is commonly spherical, hemispherical, conical, wedge-shaped, double-beveled, etc., and can be selected according to parameters such as the divergence angle of the chip fast and slow axes. The lower end of the heat conduction module 11 extends to the inside of the upper end of the header 1, and, at the contact end of the two, a sealing treatment is performed. The upper end of the heat conduction module 11 is welded and fixed at the contact position with the upper end inside the header cap 2. The liquid inlet pipes 12 are symmetrically distributed left and right, and, on each side, there are two distributed up and down. Each of the two on each side is hermetically communicated with the coolant pipeline channel provided inside the header 1.

[0029] During operation, through the set pressing module 6, before the laser chip 5, the thermistor and the heat sink 4 are bonded and fixed, the pressing modules 6 installed on both sides are first rotated in opposite directions, so that the clamping structures formed at the front ends on both sides expand outwards. After the laser chip 5, the thermistor and the heat sink 4 are bonded, only the rotational force of the pressing module 6 needs to be slowly released. Under the action of the material stress of the internal parts themselves, the expanded clamping structures on both sides are pushed to close inwards. Moreover, since the front end of the pressing module 6 can extend and contract, the front-end clamping structure of the pressing module 6 fits with the chamfer of the laser chip 5, generating a backward pulling force and an inward clamping force at the front end of the laser chip 5, thereby strengthening and fixing the front and side of the bonding of the laser chip 5, the thermistor and the heat sink 4, making the three bond more firmly and tightly. Without changing the existing installation structure, compared with the traditional method that only relies on bonding for reinforcement, it is not easily affected by thermal expansion mismatch and detached, and is more reliable to use.

[0030] As Figure 2 , Figure 3 and Figure 8 shown, the base 1 includes a base body 101, a welding groove 102, triangular blocks 103, an upper connecting pipe 104 and an inclined groove 105. A welding groove 102 is formed on the outer side of the upper end of the base body 101. Triangular blocks 103 are symmetrically arranged at the rear of the inner side of the welding groove 102. An upper connecting pipe 104 is arranged in the middle of the rear side of the triangular block 103. An inclined groove 105 is formed in the middle of the upper end of the base body 101; the tube cap 2 includes a cap body 201, an outer clamping block 202, an embedded groove 203 and a sealing ring 204. An outer clamping block 202 is arranged at the lower end of the cap body 201. An embedded groove 203 is formed above the inner side of the cap body 201. A sealing ring 204 is arranged at the lower end of the outer clamping block 202.

[0031] The base body 101 is an integral structure. There is a height difference between the middle area and the outer area at the upper end of the base body 101. A welding groove 102 is formed at the position of the height difference. The inner depth and width of the welding groove 102 are adapted to the height and width of the outer clamping block 202. There are two triangular blocks 103 symmetrically distributed on the left and right. Moreover, positioning and installation holes are formed at the upper ends of the two triangular blocks 103. There are two upper connecting pipes 104 distributed on the left and right. The lower end of the upper connecting pipe 104 extends into the base body 101 and is hermetically connected to the coolant pipeline channel formed inside the base body 101. The inclination angle of the inclined groove 105 is the same as that of the photodiode 7; the cap body 201 and the outer clamping block 202 are of an integral structure. The size of the embedded groove 203 is adapted to the upper-end structure of the heat conduction module 11. The sealing ring 204 is made of sheet metal material, such as indium or tin. During welding, only a certain pressure needs to be applied to melt it and fill the gap at the welding end, playing a role in welding and sealing.

[0032] During operation, through the provided seat body 101, due to the coolant pipeline channels opened on the inner side, the externally injected coolant can flow inside. Then, it enters the heat sink 4 along the upper connecting pipes 104 connected on the left and right, and discharges in a timely manner through heat conduction the heat generated by the operation of the laser chip 5 and the photodiode 7, ensuring the working performance and lifespan of the laser chip 5 and the photodiode 7. Through the welding groove 102 and the outer clamping block 202, the seat body 101 and the cap body 201 can be welded and reinforced to form an integral sealed structure. Through the design of the triangular block 103, the heat sink 4 can be installed and reinforced. Through the design of the embedded groove 203, the upper end of the heat conduction module 11 can be welded to the cap body 201, forming two inner and outer cavities inside the cap body 201. Among them, the size of the outer cavity is adapted to the size of the cooling module 9, and the cooling module 9 can be installed inside. And after the inner cavity is hermetically assembled between the lower end of the heat conduction module 11 and the upper end of the seat body 101, an inner cover structure is formed outside the working environment of the laser chip 5 and the photodiode 7, increasing the heat contact area and facilitating the subsequent improvement of the heat dissipation efficiency.

[0033] As Figure 4 and Figure 5 shown, the heat sink 4 includes an inner cavity block 401, a reinforcing plate 402, a support block 403, and a lower connecting pipe 404. Reinforcing plates 402 are provided below the left and right sides of the outer end of the inner cavity block 401. Support blocks 403 are symmetrically distributed at the lower end of the inner cavity block 401. Lower connecting pipes 404 are symmetrically distributed in the middle of the lower end of the inner cavity block 401; The pressing module 6 includes a rod body 601, a spring piece 602, a scale disk 603, a button rod 604, a spring pull rod 605, a strip block 606, an adjusting rod 607, and an angle plate 608. Spring pieces 602 are provided on the upper and lower sides of the outer end of the rod body 601. Scale disks 603 are provided on the upper and lower sides of the outer end of the rod body 601. A button rod 604 is provided at the upper end of the scale disk 603. A spring pull rod 605 is provided on the front side of the outer end of the button rod 604. A strip block 606 is provided on the front side of the spring pull rod 605. An adjusting rod 607 is provided on the right side of the outer end of the strip block 606. An angle plate 608 is provided at the right end of the adjusting rod 607.

[0034] The inner cavity block 401 and the reinforcement plate 402 are integrally welded structures. The positioning and mounting holes opened on the reinforcement plate 402 are adapted to the positioning and mounting holes opened at the upper end of the triangular block 103. At the same time, with the cooperation of the three supporting blocks 403 welded and installed at the lower end of the inner cavity block 401, the reinforcement work of the inner cavity block 401 is realized. There are two lower connecting pipes 404 symmetrically distributed left and right, and the distribution distance between the two lower connecting pipes 404 is interconnected with the upper connecting pipes 104 distributed left and right at the upper end of the seat body 101; the rod body 601, the scale disk 603 and the button rod 604 are threadedly joined into a whole. The spring pieces 602 and the spring pull rods 605 are both symmetrically distributed up and down. Among them, the inner protruding end of the spring piece 602 extends to the inner side of the outer end of the rod body 601, while the outer protruding end of the spring piece 602 extends to the inner wall of the through hole opened inside the heat sink 4. The rear end of the spring pull rod 605 is threadedly reinforced with the front side of the outer end of the button rod 604, and the front end of the spring pull rod 605 is fixedly welded to the rear end of the strip block 606. The adjusting rod 607 can adjust the overall length according to requirements. The angle plate 608 is made of polyimide material.

[0035] During operation, through the provided lower connecting pipes 404, they can be interconnected with the upper connecting pipes 104 distributed left and right at the upper end of the seat body 101, and in cooperation with the inverted U-shaped passage opened inside the heat sink 4, it is convenient to inject the coolant into the interior to timely cool down the heat conducted out by the heat sink 4. Through the provided pressing module 6, before the laser chip 5, the thermistor and the heat sink 4 are fitted and fixed, first insert two special-sized square rods into the slots opened at the tops of the left and right button rods 604, and then rotate the button rods 604 in opposite directions, so that the left and right button rods 604 drive the clamping structure formed by the spring pull rod 605, the strip block 606, the adjusting rod 607 and the angle plate 608 at the front end to expand to both sides. During the expansion, since the rotation of the button rod 604 drives the rod body 601 to rotate, the spring piece 602 will complete the winding work. After that, when the laser chip 5, the thermistor and the heat sink 4 are fitted, only need to slowly release the rotational force of the button rod 604. Under the action of its own characteristics, the spring piece 602 will release the energy generated during winding, push the expanded clamping structure to close inward, and make the left and right angle plates 608 fit on both sides of the laser chip 5 for clamping. And, through the action of the spring pull rod 605, the transverse structure formed by the strip block 606, the adjusting rod 607 and the angle plate 608 can complete forward extension and contraction, generating a backward pulling force at the front end of the laser chip 5, making the laser chip 5, the thermistor and the heat sink 4 fit more firmly and tightly. Without changing the existing installation structure, compared with the traditional method that only relies on fitting and reinforcement, it is not easily affected by thermal expansion mismatch and cause detachment, and is more reliable to use.

[0036] Such as Figure 6 and Figure 7As shown, the support module 8 includes a cylindrical block 801, a threaded rod 802, a magnetic attraction block 803, a tension spring 804, a support rod 805, a sleeve 806, and a rubber sleeve 807. At the upper end of the cylindrical block 801, there is a threaded rod 802. Inside the top end of the threaded rod 802, there is a magnetic attraction block 803. At the middle part of the outer end of the cylindrical block 801, the tension springs 804 are symmetrically distributed. At the front end of the tension spring 804, there is a support rod 805. At the front end of the support rod 805, there is a sleeve 806. Inside the sleeve 806, there is a rubber sleeve 807.

[0037] The whole cylindrical block 801 is made of metal. The lower end of the threaded rod 802 is threadedly extended into the inside of the cylindrical block 801. The magnetic attraction block 803 is embedded and installed inside the upper end of the threaded rod 802. The tension spring 804 and the support rod 805 are mutually adapted. The contact end of the support rod 805 and the tension spring 804 is welded and fixed together. There are three sleeves 806 symmetrically distributed. The sleeve 806 is made of ceramic material. The outer diameter of the rubber sleeve 807 is mutually adapted to the inner diameter of the sleeve 806. When the rubber sleeve 807 is heated, it will expand and fit tightly with the inner wall of the sleeve 806.

[0038] During operation, through the set support module 8, after the installation of the laser pin 3 is completed, the rubber sleeve 807 is used to wrap the middle part of the outside of the pin 3. Then, according to the distribution spacing of the pins 3, the length of the support rod 805 and the self-stress of the tension spring 804 are adjusted so that the spacing between the symmetrically distributed sleeves 806 and the cylindrical block 801 just matches the distribution spacing of the pins 3. Then, the sleeve 806 is installed on the outside of the rubber sleeve 807, and the cylindrical block 801 is fixed through the threaded rod 802 and the magnetic attraction block 803, so that the support module 8 supports in the middle of multiple pins 3, thereby reducing the problem of bending of the pins 3 during the installation and disassembly process.

[0039] As Figures 8 to 12 shown, the cooling module 9 includes an outer rotating tube 901, an inner rotating tube 902, a liquid inlet 903, a liquid outlet 904, and a connecting piece 905. The inner side of the outer rotating tube 901 is communicated with the inner rotating tube 902. On the left side of the lower end of the outer rotating tube 901, there is a liquid inlet 903. On the right side of the lower end of the inner rotating tube 902, there is a liquid outlet 904. The connecting pieces 905 are symmetrically distributed in the middle of the outer rotating tube 901 and the inner rotating tube 902; the heat conduction module 11 includes a heat conduction shell 111, an embedded ring 112, a welding point 113, and heat conduction fins 114. At the top end of the heat conduction shell 111, there is an embedded ring 112. The welding points 113 are annularly distributed at the upper end of the embedded ring 112. The heat conduction fins 114 are annularly distributed inside the heat conduction shell 111.

[0040] The outer rotating tube 901 and the inner rotating tube 902 are connected and communicated at the top by butt joint. The liquid inlet 903 and the outer rotating tube 901 are connected and communicated with each other to form an integral structure. The liquid outlet 904 and the inner rotating tube 902 are connected and communicated with each other to form an integral structure. The outer rotating tube 901 and the inner rotating tube 902 are supported by symmetrically distributed connecting pieces 905 to ensure that there is a gap between them. The heat conducting shell 111 and the embedding ring 112 are of an integral structure. Welding points 113 are annularly distributed at the upper end of the embedding ring 112. Annularly distributed heat conducting fins 114 are welded on the inner side of the heat conducting shell 111.

[0041] During operation, due to the annularly distributed heat conducting fins 114 on its inner side, the heat conducting module 11 increases the heat dissipation contact area, absorbs the heat of the gas heated by the laser chip 5, and then conducts the heat to the outer cavity through the heat conducting shell 111. At the same time, through the left and right symmetrically arranged liquid inlet pipes 12, they can be connected to the output end and the recovery end of an external cooling device. When cooling is required, the coolant in the external cooling device is injected from the left liquid inlet pipe 12 under the tube base 1. Part of the coolant will enter the internal cavity of the tube base 1. The coolant entering the cavity will reach the left upper connecting pipe 104 through the internal passage of the tube base 1 and then enter the heat sink 4 to take away the heat conducted by the heat sink 4. Another part of the coolant will flow along the liquid inlet pipe 12 passing through the inside of the tube base 1 into the cooling module 9 and flow from the outer rotating tube 901 into the inner rotating tube 902. Since the inner rotating tube 902 is wound around the outer side of the heat conducting shell 111, it absorbs the heat conducted by the heat conducting shell 111. Then the coolant enters the liquid inlet pipe 12 on the right side under the tube base 1 from the liquid outlet 904 to complete the discharge work. Compared with the traditional heat dissipation by heat conduction, the new heat dissipation structure has better effect, and the overall structure is only optimized and improved inside the existing tube base 1, tube cap 2 and heat sink 4, without increasing the overall size of the existing laser, and improving the performance and service life of the internal components.

[0042] The working principle of the technical solution provided by the present invention is as follows: For the coaxial packaged laser structure, through the pressing module 6 provided, before the laser chip 5, the thermistor and the heat sink 4 are bonded and fixed, first insert two special-sized corner rods into the slots opened at the tops of the left and right knob rods 604, and then rotate the knob rods 604 in opposite directions, so that the left and right knob rods 604 drive the clamping structure formed by the spring pull rod 605, the strip 606, the adjusting rod 607 and the angle plate 608 at the front end to expand outwards. At the same time, when the knob rod 604 drives the rod body 601 to rotate, the spring piece 602 will complete the winding work. After that, when the bonding of the laser chip 5, the thermistor and the heat sink 4 is completed, only need to slowly release the rotational force of the knob rod 604. Under the action of its own characteristics, the spring piece 602 will release the energy generated by winding, push the expanded clamping structure to close inwards, and make the left and right angle plates 608 fit on both sides of the laser chip 5 for clamping. And, through the action of the spring pull rod 605, the transverse structure formed by the strip 606, the adjusting rod 607 and the angle plate 608 can complete forward extension and contraction, generating a backward pulling force at the front end of the laser chip 5, making the bonding of the laser chip 5, the thermistor and the heat sink 4 more firm and tight. Without changing the existing installation structure, compared with the traditional method that only relies on bonding for reinforcement, it is not easily affected by thermal expansion mismatch and separated, and is more reliable to use; Secondly, through the heat conduction module 11 provided, due to the annularly distributed heat conduction fins 114 on its inner side, the heat dissipation contact area is increased, and the heat of the gas heated by the laser chip 5 is absorbed. Then, the heat is conducted outwards into the cavity through the heat conduction shell 111. At the same time, through the symmetrically arranged liquid inlet pipes 12 on the left and right, they can be connected to the output end and the recovery end of the external cooling device. When cooling is required, the coolant in the external cooling device is injected from the liquid inlet pipe 12 on the left side below the tube base 1. A part of the coolant will enter the internal cavity of the tube base 1, and the coolant entering the cavity will reach the upper connecting pipe 104 on the left through the internal passage of the tube base 1 and then enter the heat sink 4 to take away the heat conducted by the heat sink 4. Another part of the coolant will flow along the liquid inlet pipe 12 passing through the inside of the tube base 1 into the cooling module 9 and flow from the outer rotating pipe 901 into the inner rotating pipe 902. Since the inner rotating pipe 902 is wound around the outside of the heat conduction shell 111, the heat conducted by the heat conduction shell 111 is absorbed. Then the coolant enters the liquid inlet pipe 12 on the right side below the tube base 1 from the drain port 904 to complete the discharge work. Compared with the traditional heat dissipation method through heat conduction, the new heat dissipation structure has better effect, and the overall structure is only optimized and improved on the inner sides of the existing tube base 1, tube cap 2 and heat sink 4, without increasing the overall size of the existing laser, improving the performance and service life of the internal components;Moreover, after the installation of the laser pin 3 is completed, a rubber sleeve 807 is wrapped around the middle part of the outer side of the pin 3. Then, according to the distribution pitch of the pin 3, the length of the support rod 805 and the self-stress of the tension spring 804 are adjusted so that the distance between the symmetrically distributed sleeves 806 and the cylindrical block 801 exactly matches the distribution pitch of the pin 3. After that, the sleeve 806 is installed on the outer side of the rubber sleeve 807, and the cylindrical block 801 is fixed by the threaded rod 802 and the magnetic attraction block 803, so that the support module 8 supports in the middle of multiple pins 3, thereby reducing the problem of bending of the pin 3 during the installation and disassembly processes.

[0043] The present invention covers any alternatives, modifications, equivalent methods, and solutions made on the essence and scope of the present invention. For the public to have a thorough understanding of the present invention, specific details are described in detail in the following preferred embodiments of the present invention, and those skilled in the art can fully understand the present invention without the description of these details. In addition, well-known methods, processes, procedures, components, and circuits are not described in detail to avoid unnecessary confusion to the essence of the present invention.

[0044] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A coaxial packaged laser structure, characterized in that, It includes a base. A cap is provided at the upper end of the base. Pins are provided inside the lower end of the base. A heat sink is provided at the rear side of the upper end of the base. A laser chip is provided in the middle of the front end of the heat sink. Holding modules are provided on the left and right sides of the front end of the laser chip. A photodiode is provided in the middle of the upper end of the base. A support module is sleeved and installed at the outer end of the pin. A cooling module is provided inside the cap. A lens is embedded and installed inside the upper end of the cap. A heat conduction module is provided outside the lower side of the lens. Liquid inlet pipes are symmetrically distributed on the upper and lower sides of the outer end of the base.

2. The coaxial packaged laser structure according to claim 1, wherein The base includes a base body, a welding groove, triangular blocks, an upper connecting pipe, and an inclined groove. A welding groove is provided on the outer side of the upper end of the base body. Triangular blocks are symmetrically provided at the rear of the inner side of the welding groove. An upper connecting pipe is provided in the middle of the rear side of the triangular blocks. An inclined groove is provided in the middle of the upper end of the base body.

3. The coaxial package laser structure according to claim 1, characterized in that, The cap includes a cap body, an outer clamping block, an inner embedded groove, and a sealing ring. An outer clamping block is provided at the lower end of the cap body. An inner embedded groove is provided above the inner side of the cap body. A sealing ring is provided at the lower end of the outer clamping block.

4. The coaxial packaged laser structure according to claim 1, characterized in that, The heat sink includes an inner cavity block, reinforcing plates, support blocks, and lower connecting pipes. Reinforcing plates are provided below the left and right sides of the outer end of the inner cavity block. Support blocks are symmetrically distributed at the lower end of the inner cavity block. Lower connecting pipes are symmetrically distributed in the middle of the lower end of the inner cavity block.

5. The coaxial packaged laser structure according to claim 1, characterized in that, The holding module includes a rod body, spring pieces, a scale disk, a knob rod, a spring pull rod, a strip block, an adjusting rod, and an angle plate. Spring pieces are provided on the upper and lower sides of the outer end of the rod body. Scale disks are provided on the upper and lower sides of the outer end of the rod body. A knob rod is provided at the upper end of the scale disk. A spring pull rod is provided at the front side of the outer end of the knob rod. A strip block is provided at the front side of the spring pull rod. An adjusting rod is provided at the right side of the outer end of the strip block. An angle plate is provided at the right end of the adjusting rod.

6. The coaxial package laser structure according to claim 1, characterized in that The support module includes a cylindrical block, a threaded rod, a magnetic attraction block, a tension spring, a support rod, a sleeve, and a rubber sleeve. A threaded rod is provided at the upper end of the cylindrical block. A magnetic attraction block is provided inside the top end of the threaded rod. Tension springs are symmetrically distributed in the middle of the outer end of the cylindrical block. A support rod is provided at the front end of the tension spring. A sleeve is provided at the front end of the support rod. A rubber sleeve is provided inside the sleeve.

7. The coaxial package laser structure according to claim 1, characterized in that The cooling module includes an outer rotating pipe, an inner rotating pipe, a liquid inlet, a liquid outlet, and a connecting piece. The inner rotating pipe is communicated with the inside of the outer rotating pipe. A liquid inlet is provided on the left side of the lower end of the outer rotating pipe. A liquid outlet is provided on the right side of the lower end of the inner rotating pipe. Connecting pieces are symmetrically distributed in the middle of the outer rotating pipe and the inner rotating pipe.

8. The coaxial packaged laser structure according to claim 1, wherein, The heat conduction module includes a heat conduction shell, an embedded ring, welding points, and heat conduction fins. An embedded ring is provided at the top end of the heat conduction shell. Welding points are annularly distributed at the upper end of the embedded ring. Heat conduction fins are annularly distributed inside the heat conduction shell.

9. The coaxial packaged laser structure according to claim 1, characterized in that, The lower end of the pipe cap extends to the inner side of the upper end of the pipe socket and is welded by energy storage welding. The upper end of the pin penetrates through the inner side of the pipe socket and extends upward. The inner side of the contact end of the pin and the pipe socket is sealed with each other through a glass ring. The heat sink is an integral structure. Among them, the front-end structure is rectangular, the rear-end structure is arc-shaped, and there are two through holes on the left and right in the interior of the rectangular structure at the front end. An inverted U-shaped pipe cavity is provided in the interior of the arc-shaped structure at the rear end. A thermistor is attached between the heat sink and the laser chip. Two groups of pressing modules are symmetrically distributed on the left and right.

10. The coaxial packaged laser structure according to claim 5, characterized in that, The rod body, the dial and the button rod are screwed together as a whole. The spring pieces and the spring pull rods are symmetrically distributed up and down. The rear end of the spring pull rod is thread-reinforced with the front side of the outer end of the button rod, and the front end of the spring pull rod is fixedly welded to the rear end of the strip.

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