Domain controller automatic assembly apparatus and assembly method

Abstract

The application provides a domain controller automatic assembling equipment and assembling method, which comprises a conveying device, a bottom shell and upper cover feeding device, a dust removal cleaning device and a glue dispensing device arranged in sequence along the conveying path of the conveying device; the bottom shell and the upper cover are fed to the conveying device through the bottom shell and upper cover feeding device and are conveyed by the conveying device; the bottom shell and the upper cover are conveyed to the dust removal cleaning device to be cleaned; the bottom shell and the upper cover are conveyed to the glue dispensing device to be glued; the main circuit board feeding device and the screw locking device are further provided; the main circuit board is fed to the screw locking device through the main circuit board feeding device; the bottom shell and the upper cover are sequentially transferred to the screw locking device; the screw locking device locks the screw of the bottom shell and the main circuit board and locks the upper cover on the main circuit board. The application automatically assembles each component of the domain controller, improves the production efficiency and the assembling precision.

Description

Technical Field

[0001] The present invention relates to the technical field of automatic assembly devices, and in particular to a domain controller automatic assembly device and an assembly method. Background Art

[0002] A domain controller refers to at least one server in "domain" mode that is responsible for authenticating every computer and user connected to the network. In the logistics and distribution domain, autonomous vehicles are mainly coordinated and directed by domain controllers. Existing domain controllers mainly include an upper cover, a bottom shell, a main circuit board, and a support frame. The support frame is installed on the main circuit board, and the main circuit board is installed and fixed between the top cover and the bottom shell. Another common domain controller includes an upper cover, a bottom shell, a main circuit board, a support frame, a small circuit board, and a top cover. After the upper cover, bottom shell, and main circuit board are fixed together, the small circuit board must be installed and fixed on the other side of the bottom shell, and the top cover is placed on top of the small circuit board.

[0003] In the prior art, there is no automatic assembly equipment for domain controllers; domain controllers are mostly assembled by manual assembly, which is relatively complicated and troublesome, with low assembly efficiency and low assembly precision. Summary of the Invention

[0004] To this end, the present invention provides a domain controller automatic assembly device and assembly method to automatically assemble various components of the domain controller, thereby improving production efficiency and assembly accuracy.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A domain controller automatic assembly device comprises a frame, a conveying device is provided on the frame, and a bottom shell and upper cover loading device, a dust removal and cleaning device and a glue dispensing device are provided in sequence along the transmission path of the conveying device; the bottom shell and the upper cover are loaded onto the conveying device by the bottom shell and upper cover loading device, and transferred by the conveying device; transferred to the dust removal and cleaning device, which removes dust and cleans the bottom shell and the upper cover; transferred to the glue dispensing device, which dispenses glue on the bottom shell and the upper cover; one side of the conveying device is also provided with a main circuit board loading device and a screw locking device, the screw locking device is located at the end of the conveying device and is connected to the main circuit board loading device; after the main circuit board is loaded by the main circuit board loading device, it is transferred to the screw locking device; the bottom shell and the upper cover located on the conveying device are transferred to the screw locking device in sequence, the screw locking device screws the bottom shell and the main circuit board, and locks the upper cover to the main circuit board.

[0007] Furthermore, it also includes a small circuit board and face cover assembly device, which is located on the peripheral side of the screw locking device. The small circuit board and face cover are loaded onto the small circuit board and face cover assembly device, and the domain controller assembly product with the bottom shell, main circuit and upper cover assembled is also transferred to the small circuit board and face cover assembly device to be assembled with the small circuit board and face cover.

[0008] Furthermore, the small circuit board and face cover assembly device includes a small circuit board and face cover loading robot, a locking mechanism and an assembly transfer platform, and the assembly transfer platform is located between the small circuit board and face cover loading robot and the locking mechanism; the domain controller assembly is transferred to the assembly transfer platform, and the small circuit board and face cover are grabbed by the small circuit board and face cover loading robot and loaded onto the assembly transfer platform respectively, pre-installed on the domain controller assembly, and transferred to the locking mechanism via the assembly transfer platform, and locked and fixed by the locking mechanism.

[0009] Furthermore, a transport mechanism is provided between the small circuit board and cover assembly device and the screw locking device, and the transport mechanism transports the domain controller assembly product located on the screw locking device to the small circuit board and cover assembly device.

[0010] Furthermore, the transport mechanism is located at the end of the conveying device, the small circuit board and cover assembly device and the screw locking device are arranged on both sides of the transport mechanism, and the transport mechanism transports the bottom shell and upper cover on the conveying device to the screw locking device.

[0011] Furthermore, the bottom shell and upper cover loading device includes a bottom shell and upper cover cache silo and a loading robot. The bottom shell and upper cover are loaded through the bottom shell and loading cache silo. The loading robot grabs the bottom shell and upper cover respectively and transfers them to the conveying device.

[0012] Furthermore, the main circuit board loading device includes a main circuit board loading robot, a main circuit board dust removal mechanism and a receiving and transferring mechanism. The receiving and transferring mechanism transfers between the main circuit board loading robot and the main circuit board dust removal mechanism. The main circuit board is transferred to the receiving and transferring mechanism via the main circuit board loading robot, and then transferred to the main circuit board dust removal mechanism via the receiving and transferring mechanism for dust removal.

[0013] Furthermore, the main circuit board loading device also includes a support frame transfer mechanism, a glue tearing mechanism and a CCD camera mechanism. The glue tearing mechanism, the CCD camera mechanism and the receiving and transferring mechanism are located on the transfer path of the support frame transfer mechanism. The support frame transfer mechanism grabs the loaded support frame and transfers it to the glue tearing mechanism. The glue tearing mechanism tears off the tape on the support frame. The support frame transfer mechanism transfers the support frame after the glue is torn to the CCD camera mechanism for photography, and transfers it to the receiving and transferring mechanism to align the support frame and the main circuit board.

[0014] Furthermore, a top cover flipping device is provided between the conveying device and the screw locking device. The top cover flipping device picks up the top cover located on the conveying device and flips it 180° so that the glue-dispensing surface of the top cover faces downward.

[0015] The present invention also provides a domain controller assembly method, which is characterized by comprising the following steps:

[0016] A1: Provide the aforementioned domain controller automatic assembly equipment, including the bottom case, top cover, and main circuit board.

[0017] A2, perform dust removal, cleaning and glue application on the bottom shell and upper cover respectively;

[0018] A3, perform dust removal on the main circuit board;

[0019] A4, align and bond the bottom case and the main circuit board;

[0020] A5. Align and glue the top cover to the main circuit board.

[0021] The technical solution provided by the present invention has the following beneficial effects:

[0022] The present invention automatically realizes the loading, dust removal, cleaning and gluing of the bottom shell and the upper cover by sequentially arranging the bottom shell and upper cover loading buffer silos, loading robots, dust removal and cleaning devices and glue dispensing devices along the transmission path of the conveying device. At the same time, a main circuit board loading device and a screw locking device are arranged on the peripheral side of the conveying device. The main circuit board loading device automatically realizes the loading of the main circuit board, and the bottom shell and the main circuit board are locked and fixed at the screw locking device, and the upper cover is locked and fixed above the main circuit board. The present invention automatically realizes the assembly of various components of the domain controller, has a high degree of automation, and improves assembly efficiency and assembly accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Shown is a schematic structural diagram of the present invention;

[0024] Figure 2 Shown is a top view of the present invention;

[0025] Figure 3 Shown is a schematic structural diagram of the dust removal and cleaning device of the present invention;

[0026] Figure 4 Shown is a side view of the dust removal and cleaning device of the present invention;

[0027] Figure 5 Shown is a structural schematic diagram of the receiving platform of the present invention;

[0028] Figure 6 Shown is a schematic structural diagram of the main circuit board loading device of the present invention;

[0029] Figure 7 Shown Figure 6 A partial enlarged view of

[0030] Figure 8 It is a structural schematic diagram of the support frame loading assembly device of the present invention;

[0031] Figure 9 Shown is a schematic structural diagram of the screw locking device of the present invention.

[0032] Description of labels:

[0033] 1- conveying device, 11- conveying line, 12- fixture; 2- bottom shell and upper cover loading device, 21- bottom shell and upper cover loading cache silo, 22- loading robot; 3- dust removal and cleaning device, 31- picking mechanism, 32- dust removal mechanism, 321- upper dust removal chamber, 322- lower dust removal chamber, 323- receiving platform, 3231- receiving plate, 3232- lifting assembly, 3233- rotating drive assembly, 324- lifting drive assembly; 4- dispensing device, 41- first dispensing mechanism, 42- second dispensing mechanism; 5- main circuit board loading device, 51- main circuit board loading robot , 52-main circuit board dust removal mechanism, 521-lower dust removal chamber, 53-receiving and transferring mechanism, 531-lateral transfer drive assembly, 532-receiving platform, 533-rotating drive component, 534-clamping assembly, 54-support frame transfer mechanism, 55-glue peeling mechanism, 56-ccd camera mechanism, 6-screw locking device, 61-conveyor line, 62-screw locking mechanism, 63-handling mechanism, 64-transfer mechanism, 7-small circuit board and cover assembly device, 71-small circuit board and cover loading robot, 72-locking mechanism, 73-assembly transfer platform, 8-upper cover flipping device. DETAILED DESCRIPTION

[0034] To further illustrate various embodiments, the present invention is provided with accompanying drawings. These drawings form part of the present disclosure and are primarily used to illustrate the embodiments and, in conjunction with the relevant description in the specification, to explain the operating principles of the embodiments. By referring to these drawings, one of ordinary skill in the art will understand other possible embodiments and the advantages of the present invention. The components in the figures are not drawn to scale, and similar reference numerals are generally used to represent similar components.

[0035] At the same time, the directions such as up, down, front, back, left, and right mentioned in this embodiment are only for reference and do not represent directions in actual use. In addition, if the embodiments of the present invention include descriptions such as "first" and "second", such descriptions are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, the definition of "first" or "second" may explicitly or implicitly include at least one of such features.

[0036] The present invention will now be further described with reference to the accompanying drawings and specific embodiments.

[0037] See Figures 1 to 9 As shown, as a preferred embodiment of the present invention, a domain controller automatic assembly device is provided for automatically assembling the various components of the domain controller. The domain controller described in this embodiment includes an upper cover, a bottom shell, a main circuit board, a support frame, a small circuit board, and a cover. The support frame is mounted on the main circuit board, and the main circuit board is mounted and fixed between the cover and the bottom shell. After the upper cover, the bottom shell, and the main circuit board are fixed together, the small circuit board needs to be mounted and fixed to the other side of the bottom shell, and the cover is placed over the small circuit board.

[0038] See Figures 1 to 2As shown, the domain controller automatic assembly equipment includes a frame, a conveying device 1 is provided on the frame, and a bottom shell and upper cover feeding device 2, a dust removal and cleaning device 3 and a glue dispensing device 4 are sequentially provided along the transmission path of the conveying device 1; one side of the conveying device 1 is also provided with a main circuit board feeding device 5 and a screw locking device 6, the screw locking device 6 is located at the end of the conveying device 1 and is connected to the main circuit board feeding device 5; wherein, a small circuit board and face cover assembly device 7 is also provided on the peripheral side of the screw locking device 6; the bottom shell and upper cover are loaded onto the conveying device 1 through the bottom shell and upper cover feeding device 2, and transferred through the conveying device 1; transferred to the dust removal and cleaning device 3, which performs dust removal and cleaning on the bottom shell and upper cover; transferred to the glue dispensing device 4, It is used to dispense glue on the bottom shell and the top cover; at the same time, the main circuit board is loaded by the main circuit board loading device 5 and then transferred to the screw locking device 6; the bottom shell and the top cover on the conveying device 1 are transferred to the screw locking device 6 in turn, and the screw locking device 6 screws the bottom shell and the main circuit board, and locks the top cover on top of the main circuit board; then the small circuit board and the surface cover are loaded to the small circuit board and surface cover assembly device 7; the domain controller assembly product that has completed the assembly of the bottom shell, the main circuit board and the top cover is also transferred to the small circuit board and surface cover assembly device 7 to realize the assembly of the domain controller product with the small circuit board and the surface cover; in this way, the assembly of the various components of the domain controller is realized automatically, with a high degree of automation, which greatly improves production efficiency and assembly accuracy. Of course, in other embodiments, if the structure of the domain controller only includes the top cover, the bottom shell, the main circuit board and the support frame, the small circuit board and surface cover assembly device 7 will be deleted accordingly, and this article does not limit it. Among them, each of the above-mentioned mechanisms is coordinated through the processing system, that is, the conveying device 1, the bottom shell and upper cover feeding device 2, the dust removal and cleaning device 3, the dispensing device 4, the main circuit board feeding device 5, the screw locking device 6, and the small circuit board and cover assembly device 7 are all connected to the processing system. Specifically, the processing system is preferably a PLC processing system in the prior art. The PLC processing system is widely used in the control of automated machines and is already mastered and skillfully used by technicians in this field. For example, the position of the product between each mechanism can be sensed by setting sensors at the corresponding position and output to the processing system; for example, a CCD camera mechanism is set between each device to transmit the information data obtained by the camera to the processing system, which is processed by the control system and outputs signals to control the actions of each action mechanism, etc. This article will not go into details.

[0039] Among them, the conveying device 1 is used to convey the bottom shell and the upper cover. Specifically, the conveying device 1 is a conveyor line 11 distributed in parallel up and down, and a jig 12 is provided on the conveyor line 11 to place the bottom shell and the upper cover; wherein, the head end and the end end of the conveyor line 11 are provided with a jig lifting platform to realize the up and down reflux of the jig. Furthermore, the conveyor line 11 includes a conveyor belt and a drive motor for driving the conveyor belt. This conveyor line structure is a common technology in this field and is not described in detail in this article. A plurality of position sensors are also provided on the conveyor line 11 to detect the conveying position of the jig 12. Of course, in other embodiments, the conveying device 1 can also be a loading turntable or other conveying mechanism for conveying domain controller parts to various assembly mechanisms, which is not limited in this article. The present embodiment adopts the method of the conveyor line 11 to facilitate the placement of the various components of the domain controller and to facilitate transmission to the subsequent action mechanisms.

[0040] Among them, continue to refer to Figures 1 to 2 As shown, the bottom shell and upper cover loading device 2 is arranged at the starting end of the conveying device 1. The bottom shell and upper cover loading device 2 includes a bottom shell and upper cover loading buffer silo 21 and a loading robot 22. The bottom shell and upper cover are loaded through the bottom shell and upper cover loading buffer silo 21. The loading robot 22 grabs the bottom shell and upper cover respectively and transfers them to the conveying device 1. Specifically, the bottom shell and upper cover loading buffer silo 21 includes a bottom shell buffer silo and an upper cover buffer silo; manual labor or a handling device transports the bottom shell buffer silo and the upper cover buffer silo to the machine platform of the rack for grabbing by the loading robot 22; wherein, the output end of the loading robot 22 is compatible with both the bottom shell and the upper cover, so that only one loading robot 22 is required to achieve the grabbing of the bottom shell and the upper cover.

[0041] In this embodiment, the bottom shell and the upper cover are grabbed by the loading robot 22 and placed on the jig 12 of the conveying device 1, and then transferred to the dust removal and cleaning device 3 via the conveying device 1 for dust removal and cleaning. Figures 3 to 5As shown, the dust removal and cleaning device 3 includes a pickup mechanism 31 and a dust removal mechanism 32. The pickup mechanism 31 is located between the dust removal mechanism 32 and the conveying device 1, and picks up the jig 12 and transfers it to the dust removal mechanism 32. Specifically, the dust removal mechanism 32 includes an upper dust removal chamber 321, a lower dust removal chamber 322, an air blowing mechanism provided between the upper dust removal chamber 321 and the lower dust removal chamber 322, and a receiving platform 323. Among them, the upper dust removal chamber 321 and the lower dust removal chamber 322 are distributed up and down, and the upper dust removal chamber 321 is connected to the lifting drive assembly 324. The upper dust removal chamber 321 is driven by the lifting drive assembly 324 to move away from the lower dust removal chamber 322, so that the picking mechanism 31 can move the jig 12 and the bottom shell and upper cover located thereon to between the lower dust removal chamber 322 and the upper dust removal chamber 321; or the upper dust removal chamber 321 is driven by the lifting drive assembly 324 to move close to the lower dust removal chamber 322, so that the upper dust removal chamber 321 and the lower dust removal chamber 322 form a complete chamber; the blowing assembly is arranged in the upper dust removal chamber 321, and the air outlet of the blowing assembly is inclined downward toward the receiving platform 323, and blows air to remove dust from the bottom shell and upper cover on the receiving platform 323.

[0042] Among them, the receiving platform 323 and the jig 12 are provided with positioning components that cooperate with each other for positioning. The receiving platform 323 is connected to the jig 12 through the positioning components. Specifically, the positioning components are magnetic parts and electromagnets. The magnetic parts and electromagnets are respectively arranged on the jig 12 and the receiving platform 323. The jig 12 is connected to the receiving platform 323 through the mutual adsorption of the magnetic parts and the electromagnets. In this embodiment, the receiving platform 323 includes a receiving plate 3231 and a lifting assembly 3232, and the magnetic parts are arranged on the receiving plate 3231 to correspond one to one with the electromagnets on the fixture 12; wherein, the receiving plate 3231 has two opposite sides provided with a clearance gap for the lifting assembly 3232 to extend out, and the lifting assembly 3232 includes a driving member and a positioning block, the driving member is connected to the positioning block, and drives the positioning block to extend from the clearance gap, abut against the fixture 12 before the receiving plate 3231, and drive the fixture 12 to descend, so that the fixture 12 is placed on the receiving plate 3231, so as to avoid the fixture 12 from descending too sharply, generating a large potential energy, colliding with the receiving plate 3231, and causing the magnetic parts on the receiving plate 3231 to be damaged. To ensure effective cleaning of the bottom shell and top cover, the receiving platform 323 further includes a rotation drive assembly 3233, which is connected to the receiving plate 3231 to drive the receiving plate 3231 and the fixture 12 to tilt. In this way, the air blowing mechanism within the dust removal and cleaning device 3 blows air onto the bottom shell and top cover of the fixture 12, which is rotated at a certain angle, achieving multi-directional cleaning of the bottom shell and top cover, ensuring effective dust removal.

[0043] The specific working process of the dust removal and cleaning device 3 is as follows: the picking mechanism 31 picks up the jig 12 with its bottom shell and top cover placed on the conveying device 1 and transfers it to the dust removal mechanism 32. The lifting assembly on the receiving platform 323 is driven upward to abut against the jig 12, and drives the jig 12 downward to be placed on the receiving platform 323. At this time, the jig 12 and the receiving platform 323 are connected to each other via the positioning assembly. The upper dust removal chamber 321 and the lower dust removal chamber 322 are closed, with the jig 12, the bottom shell and the top cover located therebetween. The blowing assembly blows air to remove dust from the bottom shell and the top cover of the jig 12. Then, the receiving platform 323 and the jig 12 rotate to a certain angle driven by the rotating drive assembly 3233. The blowing assembly continues to blow air to remove dust from the bottom shell and the top cover of the jig 12 at this angle to ensure the dust removal and cleaning effect of the bottom shell and the top cover. After cleaning, the upper dust removal chamber 321 is reset.

[0044] The jig 12 containing the cleaned bottom shell and upper cover is picked up by the picking mechanism 31 and transported back to the conveying device 1. It is then transferred to the glue dispensing device 4 via the conveying device 1 to perform glue dispensing on the surface of the bottom shell and upper cover. The X-axis, Y-axis, and Z-axis are defined as the three coordinate axes of the spatial rectangular coordinate system, wherein the conveying direction of the conveying device 1 is the X-axis direction, the horizontal movement direction perpendicular to the X-axis direction is the Y-axis direction, and the vertical movement direction is the Z-axis direction. In this embodiment, the glue dispensing device 4 is fixedly installed above the conveying device 1; because glue dispensing is required at multiple locations on the upper surface of the bottom shell and the upper cover, the glue dispensing device 4 includes a first glue dispensing mechanism 41 and a second glue dispensing mechanism 42. The glue outlet of the first glue dispensing mechanism 41 is larger than that of the second glue dispensing mechanism 42. The first glue dispensing mechanism 41 is used to dispense glue to a large area of ​​the upper surface of the bottom shell and the upper cover, and the second glue dispensing mechanism 42 is used to dispense glue to a small area of ​​the upper surface of the bottom shell and the upper cover. Of course, in other embodiments, only one dispensing mechanism may be provided, which is not limited herein. In this embodiment, a first dispensing mechanism 41 and a second dispensing mechanism 42 are used to improve dispensing efficiency. Furthermore, the first dispensing mechanism 41 and the second dispensing mechanism 42 each include an X-axis moving drive assembly, a Y-axis moving drive assembly, a Z-axis lifting drive assembly, a dispensing assembly, and a glue thickness and width detection assembly. The X-axis moving drive assembly, the Y-axis moving drive assembly, and the Z-axis lifting drive assembly are driven to drive the movement of the dispensing assembly and the glue thickness and width detection assembly, thereby respectively achieving dispensing of glue on the upper surface of the bottom shell and the upper surface of the upper cover, and detection of the dispensing thickness and width.

[0045] The jig 12 on the conveying device 1 and the bottom shell and upper cover located thereon pass through the first dispensing mechanism 41 and the second dispensing mechanism 42 in sequence. The first dispensing mechanism 41 and the second dispensing mechanism 42 respectively operate to dispense glue on the upper surface of the bottom shell and the upper cover and detect the thickness and width of the glue. The jig 12 with the bottom shell and the upper cover after the glue dispensing action is then transported to the end via the conveying device 1. In this embodiment, the end of the conveying path of the conveying device 1 is also provided with an upper cover flipping device 8. The upper cover flipping device 8 picks up the upper cover located on the conveying device 1 and flips it 180° so that the glue-dispensing surface of the upper cover faces downward. Specifically, the upper cover flipping device 8 includes a drive motor and a rotating shaft connected to the drive motor. The rotating shaft is hinged with a suction component. The drive motor drives the suction component to rotate around the rotating shaft so that the suction component is sucked onto the upper surface of the upper cover, thereby driving it to rotate 180° so that the upper surface of the upper cover, i.e., the glue-dispensing surface, faces downward.

[0046] In this embodiment, a main circuit board loading device 5 is also provided on one side of the conveying device 1. Figures 6 to 8 As shown, the main circuit board loading device 5 includes a main circuit board loading robot 51, a main circuit board dust removal mechanism 52, and a receiving and transferring mechanism 53. The receiving and transferring mechanism 53 transfers the loaded main circuit board between the main circuit board loading robot 51 and the main circuit board dust removal mechanism 52. The loaded main circuit board is transferred to the receiving and transferring mechanism 53 by the main circuit board loading robot 51, and then transferred to the main circuit board dust removal mechanism 52 by the receiving and transferring mechanism 53 for dust removal. Specifically, the receiving and transferring mechanism 53 includes a lateral transfer drive assembly 531 and a receiving platform 532 mounted at the output end of the lateral transfer drive assembly 531. The receiving platform 532 is used to place the main circuit board. The receiving platform 532 is also connected to a rotating drive member 533 to drive the receiving platform 532 and the main circuit board thereon to rotate. Furthermore, to ensure that the main circuit board is stably fixed on the receiving platform 532, a clamping assembly 534 is also provided on the receiving platform 532 to clamp and position the main circuit board. In this embodiment, the main circuit board dust removal mechanism 52 includes an upper dust removal chamber and a lower dust removal chamber 521. The upper dust removal chamber is connected to a lifting drive member to drive the lifting of the upper dust removal chamber to move away from the lower dust removal chamber 521 or closer to the lower dust removal chamber 521; wherein, a blowing assembly is fixedly installed in the upper dust removal chamber and faces downward. Furthermore, limiting grooves are provided on two opposite sides of the lower dust removal chamber 521. Under the drive of the lateral transfer drive assembly 531, the receiving platform 532 is transferred to the main circuit board dust removal mechanism 52 and snapped into the limiting grooves to be confined within the lower dust removal chamber 521. In this embodiment, in order to achieve comprehensive cleaning of the main circuit board, the rotating drive member 533 drives the receiving platform 532 and the main circuit board to rotate 45°, 90°, and 180°, respectively. Of course, in other embodiments, there is no limit on the angle and number of times the rotating drive member 533 drives the rotation.

[0047] The specific working process of the main circuit board loading device 5 is as follows: the main circuit board loading robot 51 grabs the main circuit board and transfers it to the receiving platform 532, and the clamping assembly 534 on the receiving platform 532 clamps and limits the main circuit board; the receiving platform 532 is then driven by the lateral transfer driving assembly 531 to move to the lower dust removal chamber 521; at this time, the lower dust removal chamber 521 and the upper dust removal chamber are in the initial state, that is, the two are far away from each other, and the space between the lower dust removal chamber 521 and the upper dust removal chamber can be used for the receiving platform 532 to pass through; after the receiving platform 532 is limited to the lower dust removal chamber 521, the upper dust removal chamber is driven to move downward to close with the lower dust removal chamber 521 to form a closed chamber; at this time, the rotating driving member 533 drives the receiving platform 532 to rotate at multiple angles, so that the blowing assembly is aimed at the main circuit board for blowing, so as to realize dust removal and cleaning of the main circuit board. After the dust removal and cleaning of the main circuit board is completed, the upper dust removal chamber is driven to move upward and return to its initial state. The receiving platform 532 moves to the side away from the lower dust removal chamber 521 under the drive of the lateral transfer drive component 531.

[0048] In this embodiment, the main circuit board loading device 5 also includes a support frame loading assembly device. Specifically, the support frame loading assembly device includes a support frame transfer mechanism 54, a glue tearing mechanism 55 and a CCD camera mechanism 56. The glue tearing mechanism 55, the CCD camera mechanism 56 and the receiving and transferring mechanism 53 are located on the transfer path of the support frame transfer mechanism 54. The support frame transfer mechanism 54 grabs the loaded support frame and transfers it to the glue tearing mechanism 55. The glue tearing mechanism 55 tears off the tape on the support frame. The support frame transfer mechanism 54 then transfers the support frame after the glue is torn off to the CCD camera mechanism 56 for photographing, and transfers it to the receiving and transferring mechanism 53 to align the support frame with the main circuit board. Specifically, the adhesive stripping mechanism 55 includes a driving cylinder 551 and a clamping portion 552 located at the output end of the driving cylinder 551. The support frame transfer mechanism 54 drives the support frame to move to the adhesive stripping mechanism 55. The driving cylinder 551 of the adhesive stripping mechanism 55 actuates the clamping portion 552 to clamp the adhesive film on the support frame. The support frame transfer mechanism 54 then drives the support frame to move laterally to separate the adhesive film from the support frame. In this embodiment, the bottom surface of the loading support frame is affixed with double-sided tape, with one side adhered to the bottom surface of the support frame and the other side adhered to the adhesive film. Part of the adhesive film extends beyond the support frame. Thus, the adhesive stripping mechanism 55 and the support frame transfer mechanism 54 cooperate to clamp the adhesive film that extends beyond the support frame. The support frame transfer mechanism 54 then drives the support frame to move laterally, thereby achieving the adhesive film tearing action. Furthermore, a collection box for collecting the adhesive film is provided below the adhesive stripping mechanism 55.

[0049] The CCD camera mechanism 56 is located on the conveying path of the support frame transfer mechanism 54 and between the adhesive removal mechanism 55 and the receiving platform 532. The detection surface of the CCD camera mechanism 56 faces upward to capture images of the lower surface of the passing support frame. Thus, the CCD camera mechanism 56 and the CCD camera provided on the support frame transfer mechanism 54 can be used to accurately locate the position of the support frame, facilitating subsequent alignment and bonding of the support frame to the main circuit board.

[0050] After the glue removal and CCD photography are complete, the support frame is transported to the receiving platform 532 via the support frame transfer mechanism 54 and aligned with the main circuit board to achieve bonding of the support frame to the main circuit board. In this embodiment, the surface of the main circuit board has two support frame installation locations. Therefore, after completing the alignment and bonding of the support frame on one side, the support frame transfer mechanism 54 repeats the action to align and bond the other support frame to the main circuit board, completing the assembly of the two. In this way, the main circuit board loading device 5 automates the loading of the main circuit board, the loading of the support frame, and the assembly of the main circuit board and support frame, achieving a high degree of automation and improving assembly accuracy and efficiency.

[0051] In this embodiment, the main circuit board loading robot 51 transfers the main circuit board assembled with the support frame to the conveying mechanism, and then transfers it to the screw locking device 6 through the conveying mechanism; the screw locking device 6 is located at the end of the conveying device 1. Figure 9 As shown, the screw locking device 6 includes a conveyor line 61 and a screw locking mechanism 62 located above the conveyor line 61. The conveyor line 61 is for placing the main circuit board, the bottom shell and the cover; the screw locking mechanism 62 includes an X-axis drive moving component, a Y-axis drive moving component, a Z-axis lifting drive component and a screw assembly machine. The X-axis drive moving component, the Y-axis drive moving component and the Z-axis lifting drive component cooperate to drive the movement of the screw assembly machine to achieve screw locking of the bottom shell and the main circuit board, and to screw locking of the cover, the bottom shell and the main circuit board. Specifically, the X-axis drive moving component and the Y-axis drive moving component are drive components arranged along the X-axis direction and the Y-axis respectively. The drive component is a drive component such as a motor-driven belt slide assembly or a motor-driven screw slide assembly, which is not limited in this article. The Z-axis lifting drive component is a lifting cylinder, etc. In this embodiment, multiple screw locking devices 6 are provided to improve assembly efficiency; of course, in other embodiments, the number of screw locking devices 6 is not limited. Furthermore, a conveying mechanism 63 is provided between the screw locking device 6 and the conveying device 1 to transfer the bottom shell and the surface cover on the jig 12 to the conveying line of the screw locking device 6 respectively; a conveying mechanism 64 is also provided between the screw locking device 6 and the main circuit board loading device 5 to transport the main circuit board to the conveying line of the screw locking device 6.

[0052] The specific working process of the screw locking device 6 is as follows: the transporting mechanism 63 grabs the bottom shell on the jig 12 of the conveying device 1 and transports it to the jig on the conveyor line 61 of the screw locking device 6; the rear transfer mechanism 64 grabs the main circuit board assembled with the support frame and transports it to the jig on the conveyor line 61 of the screw locking device 6, so that the main circuit board is pre-installed on the bottom shell. Since the upper surface of the bottom shell is coated with glue, the main circuit board can be pre-fixed on the bottom shell; the bottom shell pre-installed with the main circuit board is transferred to the screw locking mechanism 62 via the conveyor line to perform screw locking and fixing between the two; and then the screw locking is completed. The attached main circuit board and bottom shell are moved to the side of the conveying mechanism 63 under the transfer of the screw locking device 6's conveyor line. The conveying mechanism 63 grabs the flipped top cover on the top cover flipping device 8 and pre-installs it on the screw-locked main circuit board and bottom shell on the conveyor line of the screw locking device 6. At this time, the glue-dispensing side of the top cover faces downward because the top cover can be pre-fixed on the main circuit board. After the conveyor line of the screw locking device 6 drives the jig to the screw locking mechanism 62 to perform screw locking and fixing between the top cover, the main circuit board and the bottom shell to form the domain controller assembly. The conveyor line 61 of the rear screw locking device 6 drives the jig and the domain controller assembly to return to the side of the conveying mechanism 63. The conveying mechanism 63 transports the domain controller assembly to the small circuit board and face cover assembly device 7.

[0053] In this embodiment, the transport mechanism 63 is located at the end of the conveying device 1, and the small circuit board and cover assembly device 7 and the screw locking device 6 are respectively arranged on both sides of the transport mechanism 63. The transport mechanism 63 is not only used to transport the bottom shell and upper cover on the conveying device 1 to the screw locking device 6, but also used to transport the domain controller assembly at the screw locking device 6 to the small circuit board and cover assembly device 7. Of course, in other embodiments, the layout of the conveying device 1, the circuit board and cover assembly device 7, and the screw locking device 6 is not limited to this. Multiple transport mechanisms can be used to transport components between each other, and this is not limited to this herein. The above layout is adopted in this embodiment to achieve the purpose of using one transport mechanism to transport different components between different locations, thereby saving equipment costs.

[0054] Continue reading Figures 1 to 2As shown, the small circuit board and face cover assembly device 7 includes a small circuit board and face cover loading robot 71, a locking mechanism 72 and an assembly transfer platform 73. The assembly transfer platform 73 is located between the small circuit board and face cover loading robot 71 and the locking mechanism 72. The domain controller assembly is transferred to the assembly transfer platform 73. The small circuit board and face cover are grabbed by the small circuit board and face cover loading robot 71 and loaded onto the assembly transfer platform 73 respectively. They are pre-loaded onto the domain controller assembly and transferred to the locking mechanism 72 via the assembly transfer platform 73. They are locked and fixed by the locking mechanism 72. Specifically, the small circuit board silo containing the small circuit board and the face cover silo containing the face cover are loaded onto the machine platform of the rack manually or by a handling device. The small circuit board and face cover loading robot 71 grabs the small circuit board and face cover respectively and places them on the assembly transfer platform 73. The assembly transfer platform 73 includes a transverse transfer drive and an assembly platform provided at the output end of the transverse transfer drive. The assembly platform moves transversely under the drive of the transverse transfer drive. The locking mechanism 72 is a common screw assembly mechanism. The specific working process of the small circuit board and cover assembly device 7 is as follows: the conveying mechanism conveys the domain controller assembly product to the assembly platform of the assembly transfer platform 73, and the assembly platform is driven by the lateral transfer drive member to move to the side where the small circuit board and cover loading robot 71 is located, so that the small circuit board and cover loading robot 71 can grab the small circuit board and pre-install it on the domain controller assembly product; the rear assembly platform is driven by the lateral transfer drive member and moves to the locking mechanism 72 to perform the screw locking action between the two; the rear assembly platform is driven by the lateral transfer drive member and moves to the side where the small circuit board and cover loading robot 71 is located, so that the small circuit board and cover loading robot 71 can grab the cover and pre-install it on the domain controller assembly product; the rear assembly platform is driven by the lateral transfer drive member and moves to the locking mechanism 72 to perform the screw locking action between the two; in this way, the small circuit board and the cover are respectively locked and fixed on the domain controller assembly product.

[0055] In this embodiment, a good product conveyor belt and a defective product conveyor belt are further provided on the transfer path of the transport mechanism 63; the good domain controllers that have been assembled properly are grabbed and placed on the good product conveyor belt, and then transferred to the good product conveyor belt for unloading; or the defective domain controllers that have been assembled unqualified are grabbed and placed on the defective product conveyor belt, and then transferred to the defective product conveyor belt for unloading.

[0056] This embodiment also provides a domain controller assembly method, comprising the following steps:

[0057] A1. Provide the above-mentioned domain controller assembly method, including a bottom case, a top cover, and a main circuit board;

[0058] A2, perform dust removal, cleaning and glue application on the bottom shell and upper cover respectively;

[0059] A3, perform dust removal on the main circuit board;

[0060] A4, align and bond the bottom case and the main circuit board;

[0061] A5. Align and glue the top cover to the main circuit board.

[0062] Among them, this embodiment also includes step A6, providing a small circuit board and a face cover, and assembling the domain controller assembly with the bottom shell, upper shell and main circuit board assembled with the small circuit board and the face cover in sequence.

[0063] Among them, the above-mentioned step A1 provides the above-mentioned domain controller assembly method, provides a bottom shell, an upper cover and a main circuit board, and also includes providing a support frame, and aligning and gluing the support frame to the main circuit board.

[0064] Although the present invention has been particularly shown and described in conjunction with preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made to the present invention without departing from the spirit and scope of the invention as defined in the appended claims, and all such changes are within the scope of protection of the present invention.

Claims

1. A domain controller automatic assembly device, characterized by: The machine comprises a frame, a conveying device is provided on the frame, and a bottom shell and upper cover feeding device, a dust removal and cleaning device and a glue dispensing device are provided in sequence along the transmission path of the conveying device; the bottom shell and the upper cover are loaded onto the conveying device by the bottom shell and upper cover feeding device, and transferred by the conveying device; transferred to the dust removal and cleaning device, which performs dust removal and cleaning on the bottom shell and the upper cover; transferred to the glue dispensing device, which performs glue dispensing on the bottom shell and the upper cover; one side of the conveying device is also provided with a main circuit board feeding device and a screw locking device, the screw locking device is located at the end of the conveying device and is connected to the main circuit board feeding device; after the main circuit board is loaded by the main circuit board feeding device, it is transferred to the screw locking device; the bottom shell and the upper cover located on the conveying device are transferred to the screw locking device in sequence, the screw locking device screws the bottom shell and the main circuit board, and locks the upper cover to the main circuit board; The main circuit board loading device includes a main circuit board loading robot, a main circuit board dust removal mechanism and a receiving and transferring mechanism. The receiving and transferring mechanism transfers between the main circuit board loading robot and the main circuit board dust removal mechanism. The loaded main circuit board is transferred to the receiving and transferring mechanism by the main circuit board loading robot, and then transferred to the main circuit board dust removal mechanism for dust removal by the receiving and transferring mechanism. The receiving and transferring mechanism includes a transverse transfer drive component and a receiving platform installed at the output end of the transverse transfer drive component. The receiving platform is for placing the main circuit board. The receiving platform is also connected to a rotating drive component to drive the receiving platform and the main circuit board thereon to rotate. The receiving platform is also provided with a clamping component to clamp and position the main circuit board. The main circuit board loading device also includes a support frame loading assembly device, which includes a support frame transfer mechanism, a glue tearing mechanism and a CCD camera mechanism. The glue tearing mechanism, the CCD camera mechanism and the receiving and transferring mechanism are located on the transfer path of the support frame transfer mechanism. The support frame transfer mechanism grabs the loaded support frame and transfers it to the glue tearing mechanism. The glue tearing mechanism tears off the tape on the support frame. The rear support frame transfer mechanism transfers the support frame after the glue is torn to the CCD camera mechanism for photography, and transfers it to the receiving and transferring mechanism to align the support frame and the main circuit board.

2. The domain controller automatic assembly device according to claim 1, characterized in that: It also includes a small circuit board and face cover assembly device, which is located on the periphery of the screw locking device. The small circuit board and face cover are loaded onto the small circuit board and face cover assembly device, and the domain controller assembly product with the bottom shell, main circuit and upper cover assembled is also transferred to the small circuit board and face cover assembly device for assembly with the small circuit board and face cover.

3. The domain controller automatic assembly device according to claim 2, characterized in that: The small circuit board and face cover assembly device includes a small circuit board and face cover loading robot, a locking mechanism and an assembly transfer platform, and the assembly transfer platform is located between the small circuit board and face cover loading robot and the locking mechanism; the domain controller assembly is transferred to the assembly transfer platform, and the small circuit board and face cover are grabbed by the small circuit board and face cover loading robot and loaded onto the assembly transfer platform respectively, pre-installed on the domain controller assembly, and transferred to the locking mechanism via the assembly transfer platform, and locked and fixed by the locking mechanism.

4. The domain controller automatic assembly device according to claim 2, characterized in that: A transport mechanism is provided between the small circuit board and cover assembly device and the screw locking device, and the transport mechanism transports the domain controller assembly product located on the screw locking device to the small circuit board and cover assembly device.

5. The domain controller automatic assembly device according to claim 4, characterized in that: The transport mechanism is located at the end of the conveying device, the small circuit board and cover assembly device and the screw locking device are respectively arranged on both sides of the transport mechanism, and the transport mechanism transports the bottom shell and upper cover on the conveying device to the screw locking device.

6. The domain controller automatic assembly device according to claim 1, characterized in that: The bottom shell and upper cover loading device includes a bottom shell and upper cover buffer silo and a loading robot. The bottom shell and upper cover are loaded through the bottom shell and loading buffer silo. The loading robot grabs the bottom shell and upper cover respectively and transfers them to the conveying device.

7. The domain controller automatic assembly device according to claim 1, characterized in that: An upper cover flipping device is further provided between the conveying device and the screw locking device. The upper cover flipping device picks up the upper cover located on the conveying device and flips it 180° so that the glue-dispensing surface of the upper cover faces downward.

8. A method for assembling a domain controller, characterized by: The steps include: A1. Provide the domain controller automatic assembly device according to any one of claims 1 to 7, including a bottom shell, a top cover, and a main circuit board; A2, perform dust removal, cleaning and glue application on the bottom shell and upper cover respectively; A3, perform dust removal on the main circuit board; A4, align and bond the bottom case and the main circuit board; A5. Align and glue the top cover to the main circuit board.

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