A multi-size wafer pre-alignment and centering device

Abstract

A multi-size wafer pre-alignment and centering device comprises a turntable, a substrate, a wafer fixing seat and a plurality of clamping mechanisms arranged along the circumference of the substrate. The substrate is rotatably connected to the turntable through a connecting shaft. The wafer fixing seat is arranged at the center of the plurality of clamping mechanisms. Each clamping mechanism comprises a first clamping plate and a second clamping plate for clamping the wafer. The first clamping plate is rotatably connected to the second clamping plate through a spring rod. A first arc groove is provided on the inner side of the first clamping plate. A support rod is also fixed under the clamping mechanism. A through groove is provided on the substrate, and an arc groove corresponding to the through groove is provided on the turntable. One end of the support rod passes through the through groove and extends into the arc groove. A pressure spring is also provided on the substrate for limiting the movement of the support rod toward the outer edge of the substrate. The present invention can realize pre-alignment and centering of two wafers of different sizes by arranging the first clamping plate and the second clamping plate, thereby improving equipment utilization, saving costs and being highly practical.

Description

Technical Field

[0001] The invention relates to the field of wafer production, in particular to a multi-size wafer pre-alignment and centering device. Background Art

[0002] The semiconductor industry has rapidly developed alongside the last wave of computer and internet technology revolutions. Chips, as core components of computers, account for the vast majority of a computer's total cost. While China's chip industry has grown rapidly in recent years, domestic integrated circuit chip manufacturing technology lags far behind the world's advanced levels and remains in its infancy. Photolithography is the core process in semiconductor processing. Within this technology, the lithography machine is the most crucial and crucial piece of equipment, its performance directly determining the development of the integrated circuit industry. As the most complex, technically challenging, and costly piece of equipment in microelectronics equipment, the lithography machine is a significant factor constraining the development of my country's semiconductor industry. Currently, the pre-alignment unit in a lithography machine is only suitable for wafers of a single size. Therefore, processing wafers of other sizes requires replacing the pre-alignment unit in the lithography machine, which is labor-intensive and resource-intensive. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a multi-size wafer pre-alignment and centering device, which can achieve the purpose of pre-aligning and centering wafers of different sizes without replacing the device.

[0004] The object of the present invention is achieved through the following technical solutions:

[0005] A multi-size wafer pre-alignment and centering device comprises a turntable, a base plate, a wafer fixing seat and a plurality of clamping mechanisms arranged along the circumference of the base plate, the base plate is rotatably connected to the turntable via a connecting shaft, the wafer fixing seat is arranged at the center of a plurality of clamping mechanisms, each clamping mechanism comprises a first clamping plate and a second clamping plate for clamping the wafer, the first clamping plate is rotatably connected to the second clamping plate via a spring rod, a first arc-shaped groove is provided on the inner side of the first clamping plate, a second arc-shaped groove is provided on the inner side of the second clamping plate, a support rod is further fixed under the clamping mechanism, a through groove is provided on the base plate, an arc groove corresponding to the through groove is provided on the turntable, one end of the support rod passes through the through groove and extends into the arc groove, the base plate The cam is secured to the bottom of the second support frame and is secured to the second support frame by a spring. The cam is secured to the bottom of the second support frame by a spring. The cam is secured to the bottom of the second support frame by a spring.

[0006] In the above invention, further, an electric telescopic rod is provided above the connecting shaft, the wafer fixing seat is fixed to the telescopic end of the electric telescopic rod, and a vacuum suction cup is also provided on the wafer fixing seat.

[0007] In the above invention, further, the outer side of the first clamping plate is further provided with an arcuate surface cooperating with the second arcuate groove, and the arcuate surface abuts against the second arcuate groove under the action of the spring rod.

[0008] In the above invention, further, a positioning platform that cooperates with the lower surface of the second clamping plate is provided at the connection between the first clamping plate and the first fixing plate.

[0009] In the above invention, further, the guide rod and the second fixed plate, and the slide rod and the first fixed plate are rotatably connected by means of a ball head and a ball bowl.

[0010] In the above invention, further, an elastic spring is provided between the first fixing plate and the mounting plate on the second fixing plate.

[0011] In the above invention, further, a sensor for detecting the action of the peripheral loading mechanism is provided on the substrate.

[0012] In the above invention, further, a roller is provided on the end portion of the support rod extending to one end of the arc-shaped groove, and the support rod is slidably connected to the arc-shaped groove through the roller.

[0013] The beneficial effects of the present invention are:

[0014] The present invention can realize pre-alignment and centering of two wafers of different sizes by setting the first clamping plate and the second clamping plate, thereby improving equipment utilization, saving costs, and being highly practical, thereby achieving the purpose of pre-alignment and centering of wafers of different sizes without replacing the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the present invention;

[0016] Figure 2 This is a schematic diagram of the turntable structure;

[0017] Figure 3 It is a front view of the present invention;

[0018] Figure 4 This is a schematic diagram of the spring rod structure of the present invention;

[0019] Figure 5 A schematic diagram of a working structure of the clamping mechanism of the present invention;

[0020] Figure 6 This is another schematic diagram of the working structure of the clamping mechanism of the present invention;

[0021] Figure 7 This is a schematic diagram of the support rod structure of the present invention.

[0022] In the figure, 1-turntable, 2-substrate, 3-wafer fixing seat, 4-clamping mechanism, 5-connecting shaft, 6-spring rod, 7-support rod, 8-pressure spring, 9-electric telescopic rod, 10-sensor, 11-roller, 1.1-arc groove, 2.1-through groove, 4.1-first clamping plate, 4.2-second clamping plate, 4.3-first arc groove 4.4-second arc groove, 4.5-arc surface, 4.6-first fixing plate, 4.7-second fixing plate, 4.8-positioning platform, 4.9-mounting plate, 4.10-elastic spring, 6.1-guide rod, 6.2-slide rod, 6.3-telescopic spring. DETAILED DESCRIPTION

[0023] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0024] It should be noted that the illustrations provided in the following embodiments are merely schematic illustrations of the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0025] Example

[0026] A multi-size wafer pre-alignment and centering device, please see the attached Figure 1 -Attached Figure 7 As shown, it includes a turntable 1, a substrate 2, a wafer holder 3 and a plurality of clamping mechanisms 4 arranged along the circumference of the substrate 2. The substrate 2 is rotatably connected to the turntable 1 above the turntable 1 through a connecting shaft 5. The wafer holder 3 is arranged at the center of the plurality of clamping mechanisms 4. An electric telescopic rod 9 is provided above the connecting shaft 5. The wafer holder 3 is fixed to the telescopic end of the electric telescopic rod 9. A vacuum suction cup is also provided on the wafer holder 3. Each clamping mechanism includes a first clamping plate 4.1 and a second clamping plate 4.2 for clamping the wafer. The first clamping plate 4.1 is rotatably connected to the second clamping plate 4.2 through a spring rod 6. The inner side of the first clamping plate 4.1 is provided with a first arc groove 4.3, and the second A second arc-shaped groove 4.4 is provided on the inner side of the clamping plate 4.2, and an arc-shaped surface 4.5 that cooperates with the second arc-shaped groove 4.4 is also provided on the outer side of the first clamping plate 4.1. The arc-shaped surface 4.5 abuts against the second arc-shaped groove 4.4 under the action of the spring rod 6. A support rod 7 is also fixed under the holding mechanism 4, a through groove 2.1 is provided on the base plate 2, and an arc-shaped groove 1.1 corresponding to the through groove 2.1 is provided on the turntable 1. One end of the support rod 7 passes through the through groove 2.1 and extends into the arc-shaped groove 1.1. A pressure spring 8 for limiting the movement of the support rod 7 toward the outer edge of the base plate 2 is also provided on the surface of the base plate 2. A sensor 10 for detecting the action of the peripheral loading mechanism is also provided.

[0027] Specifically, a first fixing plate 4.6 integrally formed with the first clamping plate 4.1 is provided below the first clamping plate 4.1, and a second fixing plate 4.7 integrally formed with the second clamping plate 4.2 is provided below the second clamping plate 4.2. A positioning platform 4.8 is provided at the connection between the first clamping plate 4.1 and the first fixing plate 4.6 and the lower surface of the second clamping plate 4.2, and the spring rod 6 is rotatably connected between the first fixing plate 4.6 and the second fixing plate 4.7.

[0028] More specifically, the first fixed plate 4.6 and the second fixed plate 4.7 are both provided with a mounting plate 4.9, the spring rod 6 includes a guide rod 6.1, a slide rod 6.2 and a telescopic spring 6.3, the slide rod 6.2 is sleeved in the guide rod 6.1 and can slide along the length direction of the guide rod 6.1, the telescopic spring 6.3 is sleeved on the outer wall of the guide rod 6.1, and the two ends of the telescopic spring 6.3 are respectively fixed on the guide rod 6.1 and the slide rod 6.2, the guide rod 6.1 and the slide rod 6.2 pass through the mounting plate and are rotatably connected between the first fixed plate 4.6 and the second fixed plate 4.7. Preferably, the ends of the guide rod 6.1 and the slide rod 6.2 have a ball head structure, and the first fixed plate 4.6 and the second fixed plate 4.7 are both provided with a ball bowl structure, and the guide rod 6.1 and the second fixed plate 4.7 and the slide rod 6.2 and the first fixed plate 4.6 are all rotatably connected by matching the ball head and the ball bowl.

[0029] In the present invention, the first arcuate grooves 4.3 of multiple first clamping plates 4.1 are combined to form an annular groove for fixing wafers. Similarly, the second arcuate grooves 4.4 of multiple second clamping plates 4.2 can be combined to form an annular groove for fixing wafers of other sizes. In this embodiment, four-inch wafers and six-inch wafers are taken as examples to illustrate the working principle and working process of the present invention.

[0030] When aligning and centering the four-inch wafer, the turntable 1 is used to install the device on the peripheral rotating mechanism, and the first clamping plate 4.1 is forced upward, the spring rod 6 is rotated upward, the first clamping plate 4.1 moves upward and makes the positioning platform 4.8 abut against the bottom surface of the second clamping plate 4.2. At this time, the slide bar 6.2 moves outward and pulls the telescopic spring 6.3 outward. The arc surface 4.5 is pressed against the second arc groove 4.4 under the action of the tension of the telescopic spring 6.3 and the lifting force of the spring rod 6. When the sensor 10 senses that the peripheral component is on the sheet, the sensor 10 gives a signal to the control system to drive the peripheral rotating mechanism to drive the turntable 1 to rotate. During the rotation of the turntable 1, under the action of centrifugal force, the support rod 7 moves outward along the arc groove 1.1 and the through groove 2.1 and squeezes the pressure spring 8. Preferably, the support rod 7 extends to the arc groove 1.1. A roller 11 is provided on the end of the end, and the support rod 7 is slidably connected to the arc groove 1.1 through the roller 11. The above arrangement can make the support rod 7 move more smoothly in the arc groove 1.1. At the same time, the electric telescopic rod 9 extends upward to allow the wafer fixing seat 3 to catch the wafer. After the vacuum suction cup absorbs the wafer, it is reset to the centering position under the drive of the electric telescopic rod 9. When the wafer is loaded, the turntable 1 stops rotating, and the support rod 7 moves inward under the action of the pressure spring 8 to restore the deformation. The first arc grooves 4.3 of the multiple first clamping plates 4.1 are pressed against the outer wall of the four-inch wafer, so that the wafer can be aligned and centered. After centering is completed, the turntable 1 rotates, the first clamping plate 4.1 releases the clamping of the wafer, the electric telescopic rod 9 moves upward, the vacuum suction cup releases the vacuum, and the centered wafer can be handed over to the external loading mechanism.

[0031] When aligning and centering the six-inch wafer, force is applied downward to the first clamping plate 4.1, and the arc surface 4.5 breaks away from contact with the second arc groove 4.4. At the same time, the first clamping plate 4.1 moves inward to the bottom of the second clamping plate 4.2 under the tension of the telescopic spring 6.3, and finally is stably maintained under the second clamping plate 4.2 under the support of the spring rod 6. At this time, the six-inch wafer can be aligned and centered by the second clamping plate 4.2. Preferably, an elastic spring leaf 4.10 is provided between the mounting plate 4.9 on the first fixed plate 4.6 and the second fixed plate 4.7. The elastic spring leaf 4.10 can reduce the lifting and supporting force of the spring rod 6 on the first clamping plate 4.1, so that the first clamping plate 4.1 can be easier to maintain the four-inch and six-inch working postures, and prevent the first clamping plate 4.1 from displacement in the two working postures.

[0032] The above-described embodiments merely represent specific implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, and all such variations and improvements fall within the scope of protection of the present invention.

Claims

1. A multi-size wafer pre-alignment and centering device, characterized in that: The wafer fixing seat includes a turntable, a substrate, a wafer fixing seat and a plurality of clamping mechanisms arranged along the circumference of the substrate. The substrate is rotatably connected to the turntable through a connecting shaft. The wafer fixing seat is arranged at the center of the plurality of clamping mechanisms. Each clamping mechanism includes a first clamping plate and a second clamping plate for clamping the wafer. The first clamping plate is rotatably connected to the second clamping plate through a spring rod. A first arc groove is provided on the inner side of the first clamping plate, and a second arc groove is provided on the inner side of the second clamping plate. A support rod is also fixed under the clamping mechanism. A through groove is provided on the substrate, and an arc groove corresponding to the through groove is provided on the turntable. One end of the support rod passes through the through groove and extends into the arc groove. The substrate is also provided with a plate for limiting The cam is secured to the bottom of the second support frame and is secured to the second support frame by a spring. The cam is secured to the bottom of the second support frame by a spring. The cam is secured to the bottom of the second support frame by a spring.

2. The multi-size wafer pre-alignment and centering device according to claim 1, characterized in that: An electric telescopic rod is provided above the connecting shaft, a wafer fixing seat is fixed on the telescopic end of the electric telescopic rod, and a vacuum suction cup is also provided on the wafer fixing seat.

3. The multi-size wafer pre-alignment and centering device according to claim 1, characterized in that: The outer side of the first clamping plate is further provided with an arcuate surface that matches the second arcuate groove. The arcuate surface abuts against the second arcuate groove under the action of the spring rod.

4. The multi-size wafer pre-alignment and centering device according to claim 1, characterized in that: A positioning platform is provided at the connection between the first clamping plate and the first fixing plate and is matched with the lower surface of the second clamping plate.

5. The multi-size wafer pre-alignment and centering device according to claim 1, characterized in that: The guide rod and the second fixing plate, and the slide rod and the first fixing plate are all rotatably connected by means of a ball head and a ball bowl.

6. The multi-size wafer pre-alignment and centering device according to claim 1, characterized in that: An elastic spring is provided between the first fixing plate and the mounting plate on the second fixing plate.

7. The multi-size wafer pre-alignment and centering device according to claim 1, characterized in that: The base plate is also provided with a sensor for detecting the action of the peripheral film loading mechanism.

8. The multi-size wafer pre-alignment and centering device according to claim 1, characterized in that: A roller is provided on the end portion of the support rod extending to one end of the arc-shaped groove, and the support rod is slidably connected to the arc-shaped groove through the roller.

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