electronic devices

Abstract

The present disclosure provides an electronic device, including a substrate, an electronic component, a driving component, a first trace, a second trace, a conductive pattern, and an electrostatic protection component. The substrate includes a first surface, a second surface relative to the first surface, and a third surface located between and connected to the first surface and the second surface. The electronic component is arranged on the first surface. The driving component is arranged on the second surface. The first trace is arranged on the first surface. The second trace is arranged on the second surface and is electrically connected to the driving component, and the corresponding first trace is electrically connected to the second trace. The conductive pattern is arranged on the third surface and is electrically connected to the driving component, and the conductive pattern receives a ground voltage to the driving component or is in a floating state. The electrostatic protection component is arranged on the first surface and is electrically connected to the driving component. The thickness of the conductive pattern is greater than or equal to 1 micron and less than or equal to 5 microns. The electronic device of the present disclosure embodiment can provide a reliable electrostatic protection design.

Description

Technical Field

[0001] The present disclosure relates to an electronic device. Background Art

[0002] With the technological advancement of modern electronic devices, the size of electronic components is getting smaller and smaller. Even for large electronic devices, they are often formed by splicing multiple small electronic devices. However, the insulation layer in small electronic components is also relatively thin. When static electricity accumulated at the edge of the electronic device invades the area where the electronic components are located, it is easy to suffer from static electricity breakdown, causing permanent damage to the electronic component. Or for other larger electronic components, if the static electricity accumulated at the edge of the electronic device is large enough and invades the area where the electronic components are located, they will also suffer the above-mentioned static electricity breakdown problem. Therefore, how to provide reliable electrostatic protection design in electronic devices has been one of the technologies that has been vigorously developed in recent years. Summary of the Invention

[0003] The present disclosure provides an electronic device that can provide a reliable electrostatic protection design.

[0004] According to an embodiment of the present disclosure, a display device includes a substrate, an electronic component, a driving component, a plurality of first traces, a plurality of second traces, a conductive pattern, and an electrostatic protection component. The substrate includes a first surface, a second surface, and a third surface, wherein the first surface is relative to the second surface, and the third surface is located between the first surface and the second surface and is connected to the first surface and the second surface. The electronic component is arranged on the first surface. The driving component is arranged on the second surface. A plurality of first traces are arranged on the first surface. A plurality of second traces are arranged on the second surface and are electrically connected to the driving component, wherein the corresponding first traces and the corresponding second traces are electrically connected to each other. The conductive pattern is arranged on the third surface and is electrically connected to the driving component, wherein the conductive pattern receives a ground voltage or is in a floating state to the driving component. The electrostatic protection component is arranged on the first surface and is electrically connected to the driving component. The conductive pattern has a thickness greater than or equal to 1 micron and less than or equal to 5 microns.

[0005] According to an embodiment of the present disclosure, a display device includes a substrate, an electronic component, a driving component, a plurality of first traces, a plurality of second traces, and a conductive pattern. The substrate includes a first surface, a second surface, and a third surface, wherein the first surface is opposite to the second surface, and the third surface is located between the first surface and the second surface and connected to the first surface and the second surface. The electronic component is arranged on the first surface. The driving component is arranged on the second surface. A plurality of first traces are arranged on the first surface. A plurality of second traces are arranged on the second surface and are electrically connected to the driving component, wherein the corresponding first traces and the corresponding second traces are electrically connected to each other. The conductive pattern is arranged on the third surface and is electrically connected to the driving component, wherein the conductive pattern receives a ground voltage to the driving component or is in a floating state. At least one of the plurality of first traces and at least one of the plurality of second traces receives a ground voltage to the driving component. The conductive pattern has a thickness greater than or equal to 1 micron and less than or equal to 5 microns.

[0006] In order to make the above features and advantages of the present disclosure more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure.

[0008] Figure 1A as well as Figure 1B A partial three-dimensional schematic diagram of an electronic device according to a first embodiment of the present disclosure;

[0009] Figure 2A as well as Figure 2B A partial three-dimensional schematic diagram of an electronic device according to a second embodiment of the present disclosure;

[0010] Figure 3A as well as Figure 3B A partial three-dimensional schematic diagram of an electronic device according to a third embodiment of the present disclosure;

[0011] Figure 4A as well as Figure 4B A partial three-dimensional schematic diagram of an electronic device according to a fourth embodiment of the present disclosure;

[0012] Figure 5A as well as Figure 5B A partial three-dimensional schematic diagram of an electronic device according to a fifth embodiment of the present disclosure;

[0013] Figure 6A as well as Figure 6B A partial three-dimensional schematic diagram of an electronic device according to a sixth embodiment of the present disclosure;

[0014] Figure 7A as well as Figure 7B It is a partial three-dimensional schematic diagram of an electronic device according to a seventh embodiment of the present disclosure. DETAILED DESCRIPTION

[0015] The present disclosure will be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and simplicity, many of the drawings in this disclosure depict only portions of electronic devices, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0016] Throughout this disclosure and the claims that follow, certain words will be used to refer to specific components. It will be understood by those skilled in the art that electronic device manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following description and claims, words such as "include," "contain," and "have" are open-ended words and should therefore be interpreted as meaning "including but not limited to..." Therefore, when the terms "include," "contain," and / or "have" are used in the description of this disclosure, they specify the presence of corresponding features, regions, steps, operations, and / or components, but do not exclude the presence of one or more corresponding features, regions, steps, operations, and / or components.

[0017] Directional terms used herein, such as "up," "down," "front," "back," "left," "right," etc., are used only with reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes only and are not intended to limit the present disclosure. In the accompanying drawings, each figure illustrates the general characteristics of the methods, structures, and / or materials used in particular embodiments. However, these figures should not be construed as defining or limiting the scope or nature of the embodiments. For example, the relative sizes, thicknesses, and positions of various layers, regions, and / or structures may be reduced or exaggerated for clarity.

[0018] When a component (e.g., a layer or region) is referred to as being "on" another component, it can be directly on the other component or there can be other components between the two components. On the other hand, when a component is referred to as being "directly on" another component, there are no components between the two components. In addition, when a component is referred to as being "on" another component, the two components have a top-to-bottom relationship in a plan view, and the component can be above or below the other component, depending on the orientation of the device.

[0019] The terms "about," "equal to," "equal," or "same," "substantially," or "approximately" are generally interpreted as within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0020] The use of ordinal numbers such as "first" and "second" in the specification and claims to modify an element does not, by itself, imply or indicate any prior ordinal number of the element(s), nor does it indicate the order of one element relative to another, or the order of manufacturing methods. Such ordinal numbers are used solely to clearly distinguish one element from another with the same name. The claims and the specification may not use the same terminology; thus, the first element in the specification may be the second element in the claim.

[0021] It should be noted that the following embodiments may be implemented by replacing, recombining, or combining features from several different embodiments to create other embodiments without departing from the spirit of the present disclosure. Features from various embodiments may be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0022] The electrical connection or coupling described in this disclosure may refer to direct connection or indirect connection. In the case of direct connection, the endpoints of the components on the two circuits are directly connected or connected to each other by a conductor segment. In the case of indirect connection, there is a switch, diode, capacitor, inductor, other suitable components, or a combination of the above components between the endpoints of the components on the two circuits, but it is not limited to these.

[0023] In this disclosure, thickness, length, and width can be measured using an optical microscope, and thickness can be measured from cross-sectional images obtained through an electron microscope, but this is not limited to these measurements. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If a first value is equal to a second value, this implies that there may be an error of approximately 10% between the first and second values. If a first direction is perpendicular to a second direction, the angle between the first and second directions may be between 80 and 100 degrees. If the first direction is parallel to the second direction, the angle between the first and second directions may be between 0 and 10 degrees.

[0024] The electronic device disclosed herein may include a display, an antenna (such as a liquid crystal antenna), light emission, sensing, touch, splicing, other suitable functions, or a combination of the above functions, but is not limited thereto. The electronic device includes a rollable or flexible electronic device, but is not limited thereto. The electronic device may, for example, include a liquid crystal, a light emitting diode (LED), a quantum dot (QD), fluorescence, phosphorescence, other suitable materials, or a combination of the above. The light emitting diode may, for example, include an organic light emitting diode (OLED), a micro light emitting diode (micro-LED, mini-LED), or a quantum dot light emitting diode (QLED, QDLED), but is not limited thereto. The following text will use a display device or a splicing device as an electronic device to illustrate the contents of the present disclosure, but the present disclosure is not limited thereto.

[0025] Exemplary embodiments of the present disclosure are described below, and the same reference numerals are used in the drawings and the description to denote the same or similar parts.

[0026] Figure 1A as well as Figure 1B This is a partial three-dimensional schematic diagram of an electronic device according to the first embodiment of the present disclosure, wherein Figure 1A is a partial front perspective diagram of the electronic device according to the first embodiment of the present disclosure, and Figure 1B It is a partial three-dimensional schematic diagram of the back side of the electronic device according to the first embodiment of the present disclosure.

[0027] Please also refer to Figure 1A and Figure 1B The electronic device 10 a of this embodiment includes a substrate 100 , an electronic component 200 , a driving component 300 , a plurality of first traces 400A, a plurality of second traces 400B, and a conductive pattern 500 .

[0028] The material of the substrate 100 may be, for example, glass, plastic, or a combination thereof. For example, the material of the substrate 100 may include quartz, sapphire, polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), or other suitable materials or a combination of the above materials. In the present embodiment, the material of the substrate 100 is glass, but the present disclosure is not limited to this. In some embodiments, the substrate 100 has a first surface 100t, a second surface 100b, and a third surface 100s1. The first surface 100t and the second surface 100b of the substrate 100 are, for example, opposite to each other, and have a normal direction that is, for example, substantially parallel to the first direction D1, but the present disclosure is not limited to this. In the present embodiment, the first surface 100t and the second surface 100b of the substrate 100 are respectively the top surface and the bottom surface of the substrate 100, but the present disclosure is not limited to this. The third surface 100s1 of the substrate 100 is, for example, located between the first surface 100t and the second surface 100b, and is connected to the first surface 100t and the second surface 100b. Specifically, one side of the third surface 100s1 of the substrate 100 is connected to one side of the first surface 100t, and the opposite side of the third surface 100s1 of the substrate 100 is connected to one side of the second surface 100b. In some embodiments, the normal direction of the third surface 100s1 of the substrate 100 is, for example, substantially parallel to the second direction D2 and, for example, substantially perpendicular to the first direction D1, but the present disclosure is not limited thereto. In this embodiment, the third surface 100s1 of the substrate 100 is the first side surface of the substrate 100, but the present disclosure is not limited thereto.

[0029] In other embodiments, the substrate 100 further has a fourth surface 100s2. The fourth surface 100s2 of the substrate 100 is opposite to the third surface 100s1 and is also connected to the first surface 100t and the second surface 100b. Specifically, one side of the fourth surface 100s2 of the substrate 100 is connected to one side of the first surface 100t, and the opposite side of the fourth surface 100s2 of the substrate 100 is connected to one side of the second surface 100b. In some embodiments, the normal direction of the fourth surface 100s2 of the substrate 100 is, for example, substantially parallel to the second direction D2 and, for example, substantially perpendicular to the first direction D1, but the present disclosure is not limited thereto. In this embodiment, the fourth surface 100s2 of the substrate 100 is the second side surface of the substrate 100, but the present disclosure is not limited thereto.

[0030] In other embodiments, the substrate 100 further has a fifth surface 100s3. The fifth surface 100s3 of the substrate 100 is adjacent to the third surface 100s1 and the fourth surface 100s2, and is also connected to the first surface 100t and the second surface 100b. Specifically, one side of the fifth surface 100s3 of the substrate 100 is connected to one side of the first surface 100t, and the opposite side of the fifth surface 100s3 of the substrate 100 is connected to one side of the second surface 100b. In some embodiments, the normal direction of the fifth surface 100s3 of the substrate 100 is, for example, substantially parallel to the third direction D3 and, for example, substantially perpendicular to the first direction D1 and the second direction D2, but the present disclosure is not limited thereto. In some embodiments, the fifth surface 100s3 is, for example, connected to the third surface 100s1 and the fourth surface 100s2. In this embodiment, the fifth surface 100s3 of the substrate 100 is the third side surface of the substrate 100, but the present disclosure is not limited thereto.

[0031] The electronic component 200 is, for example, disposed on the first surface 100t of the substrate 100. Figure 1AThe arrangement of one electronic component is shown, but the present disclosure is not limited thereto. That is, a plurality of electronic components 200 may be provided. The plurality of electronic components 200 may be arranged on the first surface 100t of the substrate 100, for example, in an array arrangement, a staggered arrangement (e.g., a pentile arrangement), or other arrangements, but the present disclosure is not limited thereto. In this embodiment, the electronic component 200 includes a plurality of light-emitting elements that can emit light of various suitable colors (e.g., blue light) or UV light, but the present disclosure is not limited thereto. In some embodiments, the plurality of electronic components 200 may include self-luminous materials. For example, the electronic component 200 may include an organic light emitting diode (OLED), an inorganic light emitting diode (LED), such as a sub-millimeter light emitting diode (mini LED) or a micro LED, a quantum dot (QD), a quantum dot light emitting diode (QLED, QDLED), fluorescence, phosphor, other suitable materials, or a combination of the above materials, but the present disclosure is not limited thereto. The size of the electronic component 200 can be adjusted as needed. In other embodiments, the electronic component 200 may include a non-self-luminous material, such as liquid crystal molecules, electrophoretic display media, or other applicable media as examples. The liquid crystal molecules are liquid crystal molecules that can be rotated or switched by a vertical electric field or liquid crystal molecules that can be rotated or switched by a transverse electric field, but the present disclosure is not limited thereto. In some embodiments, the electronic device 10a of this embodiment may optionally include a filling layer (not shown). The filling layer is, for example, disposed on the first surface 100t of the substrate 100 and covers the electronic component 200. For example, in addition to being disposed above the electronic component 200, the filling layer is also disposed adjacent to or around the electronic component 200. Therefore, the filling layer can be used, for example, to fix or protect the electronic component 200. In some embodiments, the filling layer includes a transparent material. For example, the material of the filling layer may include epoxy resin, acrylic, other suitable materials, or a combination thereof. In some embodiments, the filling layer may include a single-layer structure or a composite layer structure, but the present disclosure is not limited thereto. In addition, the electronic device 10a may, for example, selectively further include a functional layer (not shown), wherein the functional layer, for example, covers the above-mentioned filling layer. In some embodiments, the functional layer may, for example, have a high surface hardness. For example, the functional layer may, for example, include a hard coating layer with a pencil hardness greater than 5H to protect components such as the electronic component 200 from being scratched or damaged. In addition, the functional layer may also, for example, have functions such as anti-glare or reducing color difference values. For example, the functional layer may, for example, include multiple anti-glare structures or optical matching layers.The anti-glare structure can be used, for example, to generate sufficient scattering of the incident ambient light, thereby preventing most of the ambient light from entering the electronic device 10a and affecting the effect of its display screen, thereby having anti-glare capabilities. In addition, the optical matching layer can, for example, include multiple film layers with different refractive indices, which can be used to avoid the problem that components such as the electronic component 200 interfere with the display of the electronic device 10a under the irradiation of ambient light. It is worth noting here that although this embodiment is described by taking the electronic component 200 as an example including multiple light-emitting elements, it does not mean that the present application is only applicable to the electronic device 10a including multiple light-emitting elements, that is, the electronic device 10a of the present application can also be an electronic device such as an antenna device, a sensing device or a splicing device. For example, the electronic device 10a may include active components, passive components or a combination thereof, which may include diodes, transistors, capacitors, inductors, resistors or a combination thereof, and the present disclosure is not limited thereto.

[0032] The driving element 300 is, for example, disposed on the second surface 100b of the substrate 100. In some embodiments, the driving element 300 is disposed on the second surface 100b of the substrate 100 in the manner of a chip on glass (COG), but the present disclosure is not limited thereto. That is, in other embodiments, the driving element 300 can be disposed on the second surface 100b of the substrate 100 in the manner of a chip on plastic (COP) on a flexible substrate. In this embodiment, two driving elements 300 (driving element 300A and driving element 300B) are disposed on the second surface 100b of the substrate 100, but the present disclosure is not limited thereto. In addition, in this embodiment, the electronic device 10a further includes a plurality of pads PAD disposed on the second surface 100b of the substrate 100. It is worth noting here that although the present embodiment only shows a plurality of pads PAD including pad PAD1, pad PAD2, pad PAD3, pad PAD4, pad PAD5 and pad PAD6, the present disclosure is not limited to this. The driving element 300A and the driving element 300B may, for example, include a driving chip, a circuit board or a combination thereof. In some embodiments, the driving chip may include driving units such as a timing control unit, a data driving unit and a power driving unit, and the circuit board may include a flexible printed circuit board (FPC), but the present disclosure is not limited to this. In the present embodiment, the driving element 300A is bonded to the pad PAD1, the pad PAD2 and the pad PAD3, and the driving element 300B is bonded to the pad PAD4, the pad PAD5 and the pad PAD6, but the present disclosure is not limited to this.

[0033] The plurality of first traces 400A and the plurality of second traces 400B are, for example, respectively disposed on the first surface 100t and the second surface 100b of the substrate 100 and are electrically connected to the driving element 300. Specifically, the plurality of first traces 400A are disposed on the first surface 100t of the substrate 100, and the plurality of second traces 400B are disposed on the second surface 100b of the substrate 100, wherein each of the second traces 400B is connected to a corresponding pad PAD, that is, in this embodiment, each of the second traces 400B is connected to pads PAD1, PAD2, PAD3, PAD4, PAD5, and PAD6. In this embodiment, the electronic device 10a further includes a plurality of third traces 400C disposed on the fifth surface 100s3 of the substrate 100, wherein corresponding first traces 400A and corresponding second traces 400B are electrically connected to each other via the third traces 400C disposed on the fifth surface 100s3 of the substrate 100. Specifically, one end of the third trace 400C disposed on the fifth surface 100s3 of the substrate 100 can be connected to one of the plurality of first traces 400A, and the other end of the third trace 400C disposed on the fifth surface 100s3 of the substrate 100 can be connected to one of the plurality of second traces 400B, such that corresponding first traces 400A and corresponding second traces 400B are electrically connected to each other. From another perspective, the corresponding first trace 400A, second trace 400B and third trace 400C are combined into trace 400, wherein each trace 400 has different functions according to the components it connects to, which will be described in detail in the following embodiments.

[0034] In this embodiment, when the electronic component 200 includes multiple light-emitting elements, the multiple traces 400 may include a first power supply line 410 (including a first power supply line 410A, a first power supply line 410B and a first power supply line 410C), a second power supply line 420 (including a second power supply line 420A, a second power supply line 420B and a second power supply line 420C), a data line 430 (including a data line 430A, a data line 430B and a data line 430C) and a working signal line 440 (including a working signal line 440A, a working signal line 440B and a working signal line 440C), wherein the first power supply line 410, the second power supply line 420, the data line 430 and the working signal line 440 are respectively connected to pads PAD2, pads PAD4, pads PAD3 and pads PAD5. From another perspective, in this embodiment, the first routing 400A arranged on the first surface 100t of the substrate 100 includes a first power supply line 410A, a second power supply line 420A, a data line 430A and a working signal line 440A, the second routing 400B arranged on the second surface 100b of the substrate 100 includes a first power supply line 410B, a second power supply line 420B, a data line 430B and a working signal line 440B, and the third routing 400C arranged on the third surface 100s1 of the substrate 100 includes a first power supply line 410C, a second power supply line 420C, a data line 430C and a working signal line 440C. The electronic component 200 can be supplied with an anode power supply potential, for example, via a first power supply line 410, and can be supplied with a cathode power supply potential, for example, via a second power supply line 420. The anode power supply potential is a higher power supply potential than the cathode power supply potential, so that the electronic component 200 can emit light by supplying a forward current due to the potential difference between the anode power supply potential and the cathode power supply potential. In this embodiment, the electronic device 10a further includes a first transistor TFT1, a second transistor TFT2, a gate driver GD, and a storage capacitor Cst, which are disposed on the first surface 100t of the substrate 100. The source terminal of the first transistor TFT1 is connected to the electronic component 200, for example, and the drain terminal of the first transistor TFT1 is connected to the first power supply line 410. The first transistor TFT1 can, for example, serve as a switching element for driving the electronic component 200. The source terminal of the second transistor TFT2 is connected to the data line 430, the drain terminal of the second transistor TFT2 is connected to the gate terminal of the first transistor TFT1, and the gate terminal of the second transistor TFT2 is connected to the gate line GL. The second transistor TFT2 can, for example, serve as a switching element for driving a pixel unit (not shown).The gate driver GD is connected to the gate line GL and driven via the working signal line 440, and can transmit the corresponding gate signal to the pixel unit (not shown) through the gate line GL to turn on the active element (such as the second transistor TFT2) in the corresponding pixel unit, wherein the working signal line 440 can, for example, include at least a clock signal line, but the present disclosure is not limited to this. The two ends of the storage capacitor Cst are, for example, respectively coupled to the source terminal of the first transistor TFT1 and the gate terminal of the second transistor TFT2, wherein one end of the storage capacitor Cst can, for example, receive a power supply voltage through the first transistor TFT1, and the other end of the storage capacitor Cst can, for example, receive a data voltage through the second transistor TFT2. It is to be noted here that the above-mentioned components that the electronic device 10a may also include are based on the example of the electronic element 200 including multiple light-emitting elements. It should be noted that the electronic device protected by the present disclosure is not limited to including the above-mentioned components. In addition, although the first power supply line 410, the second power supply line 420, the data line 430 and the working signal line 440 are in. Figure 1A and Figure 1B Although only one trace is shown, the present disclosure is not limited thereto. That is, the electronic device 10a may include multiple first power supply lines 410, multiple second power supply lines 420, multiple data lines 430, and multiple working signal lines 440. Furthermore, the multiple traces 400 may also include other traces having other functions, and the present disclosure is not limited thereto.

[0035] The conductive pattern 500 may, for example, be disposed on at least one side surface of the substrate 100. In the present embodiment, the conductive pattern 500 is disposed on the third surface 100s1 of the substrate 100. The conductive pattern 500 may, for example, be formed on the third surface 100s1 of the substrate 100 by performing a laser process. Specifically, in some embodiments, a conductive pattern material layer (not shown) may be first formed on at least the third surface 100s1 of the substrate 100 by performing a sputtering method (or a thermal evaporation method or an atomic layer deposition method), and then a laser process may be performed on the conductive pattern material layer to form the conductive pattern 500, but it should be noted that the present disclosure is not limited to this. In other embodiments, the conductive pattern 500 may be formed on the third surface 100s1 of the substrate 100 by performing a printing process. The material of the conductive pattern 500 formed may, for example, include a low-impedance material such as silver, copper, gold, aluminum, tin, nickel, or a combination thereof. However, the material of the conductive pattern 500 may also, for example, be other suitable materials or a combination of the above materials, and the present disclosure is not limited to this. In some embodiments, the conductive pattern 500 is electrically connected to the driving element 300. For example, the conductive pattern 500 and the driving element 300 can be electrically connected to each other via a reference voltage line RL to provide electrostatic protection. Specifically, the reference voltage line RL is disposed on the second surface 100b of the substrate 100 and may include, for example, a reference voltage line RLa and a reference voltage line RLb, wherein the two ends of the reference voltage line RLa are respectively connected to one end of the pad PAD6 and the conductive pattern 500, and the two ends of the reference voltage line RLb are respectively connected to the other end of the pad PAD6 and the conductive pattern 500. The reference voltage line RL can be applied with a ground voltage (e.g., a voltage of 0V) via the driving element 300, and its electrical connection with the conductive pattern 500 creates a current path with relatively low impedance. Based on this, when static electricity accumulates at the edge of the electronic device (for example, near the junction of the first surface 100t and the third surface 100s1 of the substrate 100 and / or the junction of the second surface 100b and the third surface 100s1 of the substrate 100), it can be dissipated through the current path generated by the reference voltage line RL and the conductive pattern 500, thereby preventing the static electricity from invading the area where the electronic component 200 is provided in the electronic device 10a, thereby playing a role in electrostatic protection. However, the present disclosure is not limited to this. In other embodiments, the conductive pattern 500 may be in a floating state. In some embodiments, the thickness of the conductive pattern 500 is greater than or equal to 1 micron and less than or equal to 5 microns (1 micron ≤ the thickness of the conductive pattern 500 ≤ 5 microns). In detail, the thickness of the conductive pattern 500 in the second direction D2 is greater than or equal to 1 micron and less than or equal to 5 microns (1 micron ≤ the thickness of the conductive pattern 500 ≤ 5 microns).

[0036] In this embodiment, the conductive pattern 500 may be further disposed on the fourth surface 100s2 of the substrate 100. The processes performed on the fourth surface 100s2 of the substrate 100 and the materials used in disposing the conductive pattern 500 thereon may refer to the aforementioned embodiments and will not be described in detail here. Furthermore, the conductive pattern 500 disposed on the fourth surface 100s2 of the substrate 100 may also be electrically connected to a reference voltage line RL to receive a ground voltage from the driving element 300 (this reference voltage line RL is connected to the pad PAD1, and the connection method thereof may refer to the aforementioned embodiments and will not be described in detail here). This creates another current path with relatively low impedance near the junction between the first surface 100t of the substrate 100 and the fourth surface 100s2 and / or near the junction between the second surface 100b of the substrate 100 and the fourth surface 100s2, thereby providing electrostatic protection. Furthermore, regarding the arrangement of the conductive pattern 500, the present disclosure provides a plurality of first traces 400A and a plurality of second traces 400B having the aforementioned design, which can maintain the stability of signal transmission. In this embodiment, the conductive pattern 500 uniformly covers the third surface 100s1 and the fourth surface 100s2 of the substrate 100, but the present disclosure is not limited to this. In other embodiments, portions of the third surface 100s1 and the fourth surface 100s2 of the substrate 100 may not be covered by the conductive pattern 500.

[0037] Figure 2A as well as Figure 2B This is a partial three-dimensional schematic diagram of an electronic device according to a second embodiment of the present disclosure, wherein Figure 2A is a partial front perspective diagram of an electronic device according to a second embodiment of the present disclosure, and Figure 2B This is a partial perspective diagram of the back side of the electronic device according to the second embodiment of the present disclosure. Figure 2A as well as Figure 2B The embodiments can be used separately Figure 1A as well as Figure 1B The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0038] Please also refer to Figure 2A and Figure 2B, the main difference between the electronic device 10b of this embodiment and the aforementioned electronic device 10a is that the electronic device 10b also includes an electrostatic protection element 600. In this embodiment, the electrostatic protection element 600 is arranged on the first surface 100t of the substrate 100 and is electrically connected to the driving element 300. The electrostatic protection element 600 may be, for example, an electrostatic protection element composed of a diode, a capacitor or a combination thereof, but the present disclosure is not limited to this. In this embodiment, the electrostatic protection element 600 includes a transistor (diode-connected transistor) composed of a plurality of diodes, but the present disclosure is not limited to this. In addition, in this embodiment, the electrostatic protection element 600 is coupled between the first power supply terminal VGH and the second power supply terminal VGL, wherein the first power supply terminal VGH and the second power supply terminal VGL are each used to provide the maximum voltage and the minimum voltage required for the internal circuit operation of the electrostatic protection element 600, but the present disclosure is not limited to this. In this embodiment, the plurality of traces 400 further include a third power supply line 450 (including a third power supply line 450A, a third power supply line 450B, and a third power supply line 450C) and a fourth power supply line 460 (including a fourth power supply line 460A, a fourth power supply line 460B, and a fourth power supply line 460C), wherein the third power supply line 450 and the fourth power supply line 460 are respectively connected to pads PAD7 and pads PAD8. From another perspective, in this embodiment, the first trace 400A disposed on the first surface 100t of the substrate 100 further includes a third power supply line 450A and a fourth power supply line 460A, the second trace 400B disposed on the second surface 100b of the substrate 100 further includes a third power supply line 450B and a fourth power supply line 460B, and the third trace 400C disposed on the third surface 100s1 of the substrate 100 further includes a third power supply line 450C and a fourth power supply line 460C. Therefore, the ESD protection element 600 can be supplied with a corresponding power supply potential, for example, via the third power supply line 450 and the fourth power supply line 460. The ESD protection element 600 included in the electronic device 10b of this embodiment can also provide a current path with relatively low impedance, thereby providing ESD protection.

[0039] Figure 3A as well as Figure 3B is a partial three-dimensional schematic diagram of an electronic device according to a third embodiment of the present disclosure, wherein Figure 3A is a partial front perspective diagram of an electronic device according to a third embodiment of the present disclosure, and Figure 3B This is a partial perspective diagram of the back side of the electronic device according to the third embodiment of the present disclosure. Figure 3A as well as Figure 3B The embodiments can be used separately Figure 1A as well as Figure 1BThe component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0040] Please also refer to Figure 3A and Figure 3B The main difference between the electronic device 10c of this embodiment and the aforementioned electronic device 10a is that the multiple traces 400 in the electronic device 10c further include a first ground line 470 and a second ground line 480. Specifically, when the electronic component 200 includes multiple light-emitting elements, the multiple traces 400, in addition to the first power supply line 410, the second power supply line 420, the data line 430, and the working signal line 440, also include first ground lines 470 (including first ground line 470A, first ground line 470B, and first ground line 470C) and second ground lines 480 (including second ground line 480A, second ground line 480B, and second ground line 480C). The first ground line 470 and the second ground line 480 are respectively connected to the pad PAD1 and the pad PAD6. From another perspective, in this embodiment, the first trace 400A disposed on the first surface 100t of the substrate 100 further includes a first ground line 470A and a second ground line 480A. The second trace 400B disposed on the second surface 100b of the substrate 100 further includes a first ground line 470B and a second ground line 480B. Furthermore, the third trace 400C disposed on the third surface 100s1 of the substrate 100 further includes a first ground line 470C and a second ground line 480C. Based on this, in some embodiments, the conductive pattern 500 and the first and second ground lines 470 and 480 can be electrically connected to each other via a reference voltage line RL to provide electrostatic protection. Specifically, the first and second ground lines 470 and 480 can be applied with a ground voltage (e.g., 0V) by, for example, the driver element 300. This creates a relatively low-impedance current path through their electrical connection to the conductive pattern 500. Based on this, when static electricity is generated in the area where the electronic component 200 is located in the electronic device 10c, it can be dissipated through the current path generated by the first ground line 470 and / or the second ground line 480 and the conductive pattern 500, thereby preventing the static electricity from breaking through the electronic component 200 and playing a role in electrostatic protection. In addition, although the first ground line 470 and the second ground line 480 are Figure 3A and Figure 3B The electronic device 10 c is shown as having only one first ground line 470 , but the present disclosure is not limited thereto. That is, the electronic device 10 c may include a plurality of first ground lines 470 and a plurality of second ground lines 480 .

[0041] Figure 4A as well as Figure 4BThis is a partial three-dimensional schematic diagram of an electronic device according to a fourth embodiment of the present disclosure, wherein Figure 4A is a partial front perspective diagram of an electronic device according to a fourth embodiment of the present disclosure, and Figure 4B This is a partial perspective diagram of the back side of the electronic device according to the fourth embodiment of the present disclosure. Figure 4A as well as Figure 4B The embodiments can be used separately Figure 2A as well as Figure 2B The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0042] Please also refer to Figure 4A and Figure 4B The main difference between the electronic device 10d of this embodiment and the aforementioned electronic device 10b is that the electronic device 10d further includes an ESD protection element 600, and the plurality of traces 400 in the electronic device 10d also include a first ground line 470 and a second ground line 480. The arrangement and function of the ESD protection element 600, the first ground line 470, and the second ground line 480 can be found in the aforementioned embodiment and will not be further described here.

[0043] Figure 5A as well as Figure 5B is a partial three-dimensional schematic diagram of an electronic device according to a fifth embodiment of the present disclosure, wherein Figure 5A is a partial front perspective diagram of an electronic device according to a fifth embodiment of the present disclosure, and Figure 5B This is a partial perspective diagram of the back side of the electronic device according to the fifth embodiment of the present disclosure. Figure 5A as well as Figure 5B The embodiments can be used separately Figure 1A as well as Figure 1B The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0044] Please also refer to Figure 5A and Figure 5BThe main difference between the electronic device 10e of this embodiment and the aforementioned electronic device 10a is that the corresponding first traces 400A and the corresponding second traces 400B are electrically connected to each other via through-holes 800 provided in the substrate 100. Specifically, the electronic device 10e may not include the third trace 400C. Instead, the electronic device 10e includes a plurality of through-holes 800 electrically connected to one end of the first trace 400A and one end of the second trace 400B. The through-holes 800 are filled with a conductive layer (not shown) to electrically connect the corresponding first traces 400A and the corresponding second traces 400B. For example, in this embodiment, the through hole 800 includes a through hole 810, a through hole 820, a through hole 830, and a through hole 840, wherein the first power supply line 410A and the first power supply line 410B are electrically connected to each other through the through hole 810, the second power supply line 420A and the second power supply line 420B are electrically connected to each other through the through hole 820, the data line 430A and the data line 430B are electrically connected to each other through the through hole 830, and the working signal line 440A and the working signal line 440B are electrically connected to each other through the through hole 840. It is worth noting that the through hole 800 of this embodiment can also be selectively applied to the electronic device 10b of the second embodiment, the electronic device 10c of the third embodiment, and the electronic device 10d of the fourth embodiment to provide another method for electrically connecting the first trace 400A and the second trace 400B. In this embodiment, the material of the substrate 100 includes glass, and thus the through hole 800 is a through glass via (TGV), but the present disclosure is not limited thereto.

[0045] Figure 6A as well as Figure 6B This is a partial three-dimensional schematic diagram of an electronic device according to a sixth embodiment of the present disclosure, wherein Figure 6A is a partial front perspective diagram of an electronic device according to a sixth embodiment of the present disclosure, and Figure 6B This is a partial perspective diagram of the back side of the electronic device according to the sixth embodiment of the present disclosure. Figure 6A as well as Figure 6B The embodiments can be used separately Figure 1A as well as Figure 1B The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0046] Please also refer to Figure 6A and Figure 6BThe main difference between the electronic device 10f of this embodiment and the aforementioned electronic device 10a is that portions of the third surface 100s1 and the fourth surface 100s2 of the substrate 100 are not covered by the conductive pattern 500. Specifically, the conductive pattern 500 in the electronic device 10f may include a conductive pattern 500a and a conductive pattern 500b, wherein the conductive pattern 500a and the conductive pattern 500b are separated from each other to expose the uncovered third surface 100s1 and the fourth surface 100s2 of the substrate 100, and the conductive pattern 500a is connected to one end of the reference voltage line RLb, and the conductive pattern 500b is connected to one end of the reference voltage line RLa.

[0047] Figure 7A as well as Figure 7B This is a partial three-dimensional schematic diagram of an electronic device according to a seventh embodiment of the present disclosure, wherein Figure 7A is a partial front perspective diagram of an electronic device according to a seventh embodiment of the present disclosure, and Figure 7B This is a partial perspective diagram of the back side of the electronic device according to the seventh embodiment of the present disclosure. Figure 7A as well as Figure 7B The embodiments can be used separately Figure 1A as well as Figure 1B The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0048] Please also refer to Figure 7A and Figure 7B The main difference between the electronic device 10g of this embodiment and the aforementioned electronic device 10a is that portions of the third surface 100s1 and fourth surface 100s2 of the substrate 100 are not covered by the conductive pattern 500'. Specifically, the width of the conductive pattern 500' in the electronic device 10g along the first direction D1 is smaller than the width of the conductive pattern 500 in the electronic device 10a along the first direction D1. Therefore, the conductive pattern 500' exposes portions of the third surface 100s1 and fourth surface 100s2 of the substrate 100.

[0049] It is worth noting that the conductive patterns (conductive pattern 500 , conductive pattern 500 a , conductive pattern 500 b , conductive pattern 500 ′) are not limited to those described in the aforementioned embodiments.

[0050] As described above, the presently disclosed embodiments provide a conductive pattern on at least one surface of a substrate within an electronic device, thereby providing a relatively low-impedance current path. Static electricity accumulated at the edge of the electronic device can be dissipated through this current path, thereby achieving ESD protection. Furthermore, the presently disclosed embodiments also provide an ESD protection element or grounding wire within the electronic device, allowing static electricity generated in an area of ​​the electronic device where the electronic components are located to be discharged through the ESD protection element or grounding wire to that area, thereby preventing electrostatic breakdown of the electronic components and achieving ESD protection.

[0051] Finally, it should be noted that the above embodiments are intended only to illustrate the technical solutions of the present disclosure, and are not intended to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art will appreciate that they may modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. Such modifications or replacements do not deviate from the essence of the corresponding technical solutions within the scope of the various embodiments of the present disclosure. The features of the various embodiments may be mixed and matched as needed, as long as they do not violate the spirit of the invention or conflict with each other.

Claims

1. An electronic device, characterized in that: include: A substrate comprising a first surface, a second surface, and a third surface, wherein the first surface is opposite to the second surface, and the third surface is located between the first surface and the second surface and connected to the first surface and the second surface; an electronic component disposed on the first surface; a driving element, disposed on the second surface; A plurality of first traces are arranged on the first surface; a plurality of second traces disposed on the second surface and electrically connected to the driving element, wherein corresponding first traces and corresponding second traces are electrically connected to each other; a conductive pattern disposed on the third surface and electrically connected to the driving element, wherein the conductive pattern and the driving element receive a ground voltage or are in a floating state; as well as an electrostatic protection element, disposed on the first surface and electrically connected to the driving element, The conductive pattern has a thickness greater than or equal to 1 micrometer and less than or equal to 5 micrometers.

2. The electronic device according to claim 1, wherein: The substrate further includes a fourth surface, wherein the fourth surface is opposite to the third surface and connected to the first surface and the second surface, and the conductive pattern is further disposed on the fourth surface.

3. The electronic device according to claim 1, wherein: The substrate further includes a fifth surface, wherein the fifth surface is adjacent to the third surface and connected to the first surface and the second surface, wherein the corresponding first traces and the corresponding second traces are electrically connected to each other via third traces disposed on the fifth surface.

4. The electronic device according to claim 1, wherein: The substrate further has a plurality of through holes, wherein corresponding first traces and corresponding second traces are electrically connected to each other through the through holes.

5. The electronic device according to claim 1, wherein: The conductive pattern is formed by performing a laser process or a printing process.

6. An electronic device, characterized in that: include: A substrate comprising a first surface, a second surface, and a third surface, wherein the first surface is opposite to the second surface, and the third surface is located between the first surface and the second surface and connected to the first surface and the second surface; as well as an electronic component disposed on the first surface; a driving element, disposed on the second surface; A plurality of first traces are arranged on the first surface; a plurality of second traces disposed on the second surface and electrically connected to the driving element, wherein corresponding first traces and corresponding second traces are electrically connected to each other; A conductive pattern is disposed on the third surface and electrically connected to the driving element, wherein the conductive pattern receives a ground voltage or is in a floating state from the driving element. wherein at least one of the plurality of first traces and at least one of the plurality of second traces receives a ground voltage from the driving element, The conductive pattern has a thickness greater than or equal to 1 micrometer and less than or equal to 5 micrometers.

7. The electronic device according to claim 6, wherein: The substrate further includes a fourth surface, wherein the fourth surface is opposite to the third surface and connected to the first surface and the second surface, and the conductive pattern is further disposed on the fourth surface.

8. The electronic device according to claim 6, wherein: The substrate further includes a fifth surface, wherein the fifth surface is adjacent to the third surface and connected to the first surface and the second surface, wherein the corresponding first traces and the corresponding second traces are electrically connected to each other via third traces disposed on the fifth surface.

9. The electronic device according to claim 6, wherein: The substrate further has a plurality of through holes, wherein corresponding first traces and corresponding second traces are electrically connected to each other through the through holes.

10. The electronic device according to claim 6, wherein: The conductive pattern is formed by performing a laser process or a printing process.

Images