Multi-lens module and electronic device

Abstract

The present application proposes a multi-lens module, including a metal support frame, a first lens module, a first heat dissipation component, a second lens module and a second heat dissipation component. The metal support frame is provided with a first groove and a second groove that are spaced apart. The surface of the metal support frame away from the first lens module is provided with a heat dissipation groove. The heat generated by the first lens module is transmitted to the metal support frame through the first heat dissipation component and dissipated through the heat dissipation groove. The heat generated by the second lens module is transmitted through the second heat dissipation component and the metal support frame and dissipated by the heat dissipation groove. The multi-lens module provided by the present application has a good heat dissipation effect. The present application also provides an electronic device including the multi-lens module.

Description

Technical Field

[0001] The present application relates to the technical field of electronic and optical devices, and in particular to a multi-lens module and an electronic device. Background Art

[0002] With the rapid development of 5G and the increasing market requirements for the shooting capabilities of mobile phone cameras and other photographic devices, the photographic devices currently on the market are usually multi-lens modules, and the pixels of the lens modules are also higher. However, with the increase in the number of lens modules and the improvement in pixels, multi-lens modules usually generate a lot of heat when in use, which accumulates inside the multi-lens modules, thereby affecting the imaging quality of the lens modules. Summary of the invention

[0003] In view of this, the present application provides a multi-lens module with better heat dissipation effect.

[0004] In addition, it is also necessary to provide an electronic device including the multi-lens module.

[0005] An embodiment of the present application provides a multi-lens module, including a metal support frame, a first lens module, a first heat dissipation component, a second lens module and a second heat dissipation component, wherein the metal support frame is provided with a first groove and a second groove which are spaced apart, the first lens module and the first heat dissipation component are both located in the first groove, and the first lens module is located on the first heat dissipation component, the second lens module and the second heat dissipation component are both located in the second groove, and the second lens module is located on the second heat dissipation component, a heat dissipation groove is provided on the surface of the metal support frame away from the first lens module, the heat generated by the first lens module is transmitted to the metal support frame via the first heat dissipation component and dissipated through the heat dissipation groove, and the heat generated by the second lens module is transmitted via the second heat dissipation component and the metal support frame and dissipated by the heat dissipation groove.

[0006] An embodiment of the present application further provides an electronic device, comprising the multi-lens module.

[0007] The metal support frame in the present application is provided with the heat dissipation groove on the surface away from the first lens module. The heat dissipation groove increases the heat dissipation area of ​​the metal support frame, is beneficial to the circulation of heat, and improves the heat dissipation capacity of the first lens module and the second lens module, thereby improving the heat dissipation capacity of the multi-lens module, and further improving the imaging quality of the multi-lens module. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic diagram of the structure of the multi-lens module provided in the first embodiment of the present application.

[0009] Figure 2 yes Figure 1 An exploded view of the multi-lens module is shown.

[0010] Figure 3 yes Figure 1 A schematic diagram of the structure of the metal support frame in the multi-lens module shown.

[0011] Figure 4 yes Figure 1 The cross-sectional schematic diagram of the multi-lens module along IV-IV is shown.

[0012] Figure 5 It is a structural schematic diagram of a multi-lens module provided in the second embodiment of the present application.

[0013] Figure 6 yes Figure 5 A schematic diagram of the structure of the metal support frame in the multi-lens module shown.

[0014] Figure 7 It is a three-dimensional schematic diagram of an electronic device of a multi-lens module provided by an embodiment of the present application.

[0015] Main component symbols

[0016] Multi-lens module 100, 200

[0017] Metal support frame 10

[0018] First groove 101

[0019] The second groove 102

[0020] The third groove 103

[0021] Heat sink 11, 12

[0022] The first heat dissipation slot 111

[0023] The second heat dissipation slot 112

[0024] The third heat dissipation slot 113

[0025] Heat dissipation component 20

[0026] The first thermal conductive adhesive 201

[0027] First steel sheet 202

[0028] First thermal grease 203

[0029] The second heat dissipation component 21

[0030] The second thermal conductive glue 211

[0031] Second steel sheet 212

[0032] Second thermal grease 213

[0033] The third heat dissipation component 22

[0034] The third thermal conductive glue 221

[0035] The third steel sheet 222

[0036] Third thermal grease 223

[0037] First lens module 30

[0038] Second lens module 31

[0039] The third lens module 32

[0040] First circuit board 40

[0041] The first hard plate portion 401

[0042] The first receiving hole 4011

[0043] Second hard plate portion 402

[0044] First electrical connection portion 4021

[0045] First soft board portion 403

[0046] Second circuit board 41

[0047] The third hard plate portion 411

[0048] The second receiving hole 4111

[0049] Fourth hard plate portion 412

[0050] Second electrical connection portion 4121

[0051] Second soft board portion 413

[0052] The third circuit board 42

[0053] Fifth hard plate portion 421

[0054] The third receiving hole 4211

[0055] Sixth hard plate portion 422

[0056] The third electrical connection portion 4221

[0057] The third soft board portion 423

[0058] First photosensitive chip 50

[0059] The second photosensitive chip 51

[0060] The third photosensitive chip 52

[0061] The first bearing seat 60

[0062] First light hole 601

[0063] The first bearing slot 602

[0064] The second bearing seat 61

[0065] Second light hole 611

[0066] The second bearing slot 612

[0067] The third bearing seat 62

[0068] The third light hole 621

[0069] The third bearing slot 622

[0070] First filter 63

[0071] Second filter 64

[0072] The third filter 65

[0073] First voice coil motor 70

[0074] First adhesive layer 701

[0075] The first receiving hole 702

[0076] Second voice coil motor 71

[0077] Second adhesive layer 711

[0078] The second receiving hole 712

[0079] Third voice coil motor 72

[0080] The third adhesive layer 721

[0081] The third receiving hole 722

[0082] First shot 80

[0083] Second shot 81

[0084] Third Shot 82

[0085] First colloid 90

[0086] Second colloid 91

[0087] The third colloid 92

[0088] Electronic device 300

[0089] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0090] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0091] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0092] In order to further explain the technical means and effects adopted by the present application to achieve the intended purpose, the present application is described in detail below in conjunction with the accompanying drawings and preferred implementation methods.

[0093] See also Figure 1 and Figure 2 The first embodiment of the present application provides a multi-lens module 100, which includes a metal support frame 10, a first heat dissipation assembly 20, a second heat dissipation assembly 21, a third heat dissipation assembly 22, a first lens module 30, a second lens module 31 and a third lens module 32.

[0094] In this embodiment, the metal support frame 10 is substantially in the shape of a rectangular parallelepiped. In this embodiment, along the length direction of the metal support frame 10, the metal support frame 10 is provided with a first groove 101, a second groove 102 and a third groove 103 which are spaced apart. Among them, the first groove 101, the second groove 102 and the third groove 103 do not penetrate the metal support frame 10, and the first groove 101, the second groove 102 and the third groove 103 are located on the same surface of the metal support frame 10.

[0095] Please also read Figure 3 In this embodiment, a heat dissipation groove 11 is provided on one surface of the metal support frame 10. The heat dissipation groove 11 and the first groove 101 are respectively located on two opposite surfaces of the metal support frame 10.

[0096] In this embodiment, the heat dissipation slot 11 includes a first heat dissipation slot portion 111, a second heat dissipation slot portion 112, and a third heat dissipation slot portion 113 that are spaced apart. In this embodiment, the extension direction of the first heat dissipation slot portion 111, the extension direction of the second heat dissipation slot portion 112, and the extension direction of the third heat dissipation slot portion 113 are all extended along the width direction of the metal support frame 10, that is, perpendicular to the connecting direction of the first lens module 30 and the second lens module 31. The first heat dissipation slot portion 111, the second heat dissipation slot portion 112, and the third heat dissipation slot portion 113 can increase the surface area of ​​the metal support frame 10. The first heat dissipation slot portion 111, the second heat dissipation slot portion 112, and the third heat dissipation slot portion 113 all include a plurality of sub-heat dissipation slots (not shown) that are spaced apart and arranged in parallel, and the extension direction of the sub-heat dissipation slots is extended along the width direction of the metal support frame 10.

[0097] In this embodiment, the metal support frame 10 is made of aluminum or steel.

[0098] Please also read Figure 4 , the first heat dissipation component 20 is located in the first groove 101. In this embodiment, the first heat dissipation component 20 includes a first thermal conductive adhesive 201, a first steel sheet 202 and a first thermal conductive silicone grease 203 which are stacked in sequence. The first thermal conductive silicone grease 203 is bonded to the bottom surface of the first groove 101.

[0099] The second heat dissipation component 21 is located in the second groove 102. In this embodiment, the second heat dissipation component 21 includes a second thermally conductive adhesive 211, a second steel sheet 212, and a second thermally conductive silicone grease 213 which are stacked in sequence. The second thermally conductive silicone grease 213 is bonded to the bottom surface of the second groove 102.

[0100] The third heat dissipation component 22 is located in the third groove 103. In this embodiment, the third heat dissipation component 22 includes a third thermal conductive adhesive 221, a third steel sheet 222 and a third thermal conductive silicone grease 223 which are stacked in sequence. The third thermal conductive silicone grease 223 is bonded to the bottom surface of the third groove 103.

[0101] Please refer again Figure 2 and Figure 4, the first lens module 30 includes a first circuit board 40. In this embodiment, the first circuit board 40 includes a first hard board part 401, a second hard board part 402, and a first soft board part 403 located between the first hard board part 401 and the second hard board part 402. Wherein, the first hard board part 401 is located on the first thermal conductive glue 201 and is arranged in the first groove 101. The second hard board part 402 and the first soft board part 403 are both located outside the first groove 101. A first receiving hole 4011 is provided in the first hard board part 401. Wherein, the first receiving hole 4011 passes through the first hard board part 401. A first electrical connection part 4021 is installed on one surface of the second hard board part 402. The first electrical connection part 4021 is used to realize signal transmission between the multi-lens module 100 and an electronic device (not shown). Wherein, the first electrical connection part 4021 can be a connector or a gold finger.

[0102] The second lens module 31 includes a second circuit board 41. In this embodiment, the second circuit board 41 includes a third hard board portion 411, a fourth hard board portion 412, and a second soft board portion 413 located between the third hard board portion 411 and the fourth hard board portion 412. The third hard board portion 411 is located on the second thermal conductive adhesive 211 and is arranged in the second groove 102. The fourth hard board portion 412 and the second soft board portion 413 are both located outside the second groove 102. A second receiving hole 4111 is provided in the third hard board portion 411. The second receiving hole 4111 passes through the third hard board portion 411. A second electrical connection portion 4121 is installed on one surface of the fourth hard board portion 412. The second electrical connection portion 4121 is used to realize signal transmission between the multi-lens module 100 and an electronic device (not shown). The second electrical connection portion 4121 can be a connector or a gold finger.

[0103] The third lens module 32 includes a third circuit board 42. In this embodiment, the third circuit board 42 includes a fifth hard board portion 421, a sixth hard board portion 422, and a third soft board portion 423 located between the fifth hard board portion 421 and the sixth hard board portion 422. The fifth hard board portion 421 is located on the third thermal conductive adhesive 221 and is disposed in the third groove 103. The sixth hard board portion 422 and the third soft board portion 423 are both located outside the third groove 103. A third receiving hole 4211 is provided in the fifth hard board portion 421. The third receiving hole 4211 passes through the fifth hard board portion 421. A third electrical connection portion 4221 is installed on one surface of the sixth hard board portion 422. The third electrical connection portion 4221 is used to realize signal transmission between the multi-lens module 100 and an electronic device (not shown). The third electrical connection portion 4221 may be a connector or a gold finger.

[0104] The first lens module 30 also includes a first photosensitive chip 50. The first photosensitive chip 50 is received in the first receiving hole 4011 and is located on the first thermally conductive adhesive 201. The heat generated by the first photosensitive chip 50 is sequentially transmitted to the metal support frame 10 through the first thermally conductive adhesive 201, the first steel sheet 202 and the first thermally conductive silicone grease 203, and is dissipated to the outside through the first heat dissipation slot 111, so as to improve the heat dissipation capacity of the multi-lens module 100.

[0105] The second lens module 31 also includes a second photosensitive chip 51. The second photosensitive chip 51 is received in the second receiving hole 4111 and is located on the second thermal conductive adhesive 211. The heat generated by the second photosensitive chip 51 is sequentially transmitted to the metal support frame 10 through the second thermal conductive adhesive 211, the second steel sheet 212 and the second thermal conductive silicone grease 213, and is dissipated to the outside through the second heat dissipation slot 112, so as to improve the heat dissipation capacity of the multi-lens module 100.

[0106] The third lens module 32 further includes a third photosensitive chip 52. The third photosensitive chip 52 is received in the third receiving hole 4211 and is located on the third thermal conductive adhesive 221. The heat generated by the third photosensitive chip 52 is sequentially transmitted to the metal support frame 10 through the third thermal conductive adhesive 221, the third steel sheet 222 and the third thermal conductive silicone grease 223, and is dissipated to the outside through the third heat dissipation slot 113, so as to improve the heat dissipation capacity of the multi-lens module 100.

[0107] The first lens module 30 further includes a first bearing seat 60. The first bearing seat 60 is located on a surface of the first circuit board 40 away from the first heat dissipation assembly 20. The first bearing seat 60 is generally a hollow rectangular structure. A first light hole 601 is provided in the first bearing seat 60. The surface of the first bearing seat 60 away from the first circuit board 40 is recessed inwardly in an area adjacent to the first light hole 601 to form a first bearing groove 602.

[0108] The second lens module 31 also includes a second bearing seat 61. The second bearing seat 61 is located on the surface of the second circuit board 41 away from the second heat dissipation assembly 21. The second bearing seat 61 is generally a hollow rectangular structure. A second light hole 611 is provided in the second bearing seat 61. The surface of the second bearing seat 61 away from the second circuit board 41 is recessed inwardly in the area adjacent to the second light hole 611 to form a second bearing groove 612.

[0109] The third lens module 32 further includes a third bearing seat 62. The third bearing seat 62 is located on a surface of the third circuit board 42 away from the third heat dissipation assembly 22. The third bearing seat 62 is generally a hollow rectangular structure. A third light hole 621 is provided in the third bearing seat 62. The surface of the third bearing seat 62 away from the third circuit board 42 is recessed inwardly in an area adjacent to the third light hole 621 to form a third bearing groove 622.

[0110] The first lens module 30 further includes a first filter 63 . The first filter 63 is located in the first bearing slot 602 , and the first filter 63 is disposed opposite to the first photosensitive chip 50 .

[0111] The second lens module 31 further includes a second filter 64 . The second filter 64 is located in the second bearing slot 612 , and the second filter 64 is disposed opposite to the second photosensitive chip 51 .

[0112] The third lens module 32 further includes a third optical filter 65 , wherein the third optical filter 65 is located in the third bearing slot 622 , and the third optical filter 65 is arranged opposite to the third photosensitive chip 52 .

[0113] The first lens module 30 further includes a first voice coil motor 70. The first voice coil motor 70 is bonded to the first bearing seat 60 via a first adhesive layer 701. A first receiving hole 702 is provided in the first voice coil motor 70. A first internal thread (not shown) is provided on the inner wall of the first receiving hole 702.

[0114] The second lens module 31 further includes a second voice coil motor 71. The second voice coil motor 71 is bonded to the second bearing seat 61 through a second adhesive layer 711. A second receiving hole 712 is provided in the second voice coil motor 71. A second internal thread (not shown) is provided on the inner wall of the second receiving hole 712.

[0115] The third lens module 32 further includes a third voice coil motor 72. The third voice coil motor 72 is bonded to the third bearing seat 62 via a third adhesive layer 721. A third receiving hole 722 is provided in the third voice coil motor 72. A third internal thread (not shown) is provided on the inner wall of the third receiving hole 722.

[0116] The first lens module 30 further includes a first lens 80 . A first external thread (not shown) is disposed on the outer wall of the first lens 80 . The first internal thread is meshed with the first external thread to accommodate the first lens 80 in the first receiving hole 702 .

[0117] The second lens module 31 further includes a second lens 81 . A second external thread (not shown) is disposed on the outer wall of the second lens 81 . The second internal thread is meshed with the second external thread to accommodate the second lens 81 in the second receiving hole 712 .

[0118] The third lens module 32 further includes a third lens 82 . A third external thread (not shown) is disposed on the outer wall of the third lens 82 . The third internal thread and the third external thread are engaged with each other to accommodate the third lens 82 in the third receiving hole 722 .

[0119] The first lens module 30 further includes a first colloid 90 . The first colloid 90 is disposed around the first voice coil motor 70 , and the first colloid 90 is located in the first groove 101 to fix the first voice coil motor 70 in the first groove 101 .

[0120] The second lens module 31 further includes a second colloid 91 . The second colloid 91 is disposed around the second voice coil motor 71 , and the second colloid 91 is located in the second groove 102 to fix the second voice coil motor 71 in the second groove 102 .

[0121] The third lens module 32 further includes a third colloid 92 . The third colloid 92 is disposed around the third voice coil motor 72 , and the third colloid 92 is located in the third groove 103 to fix the third voice coil motor 72 in the third groove 103 .

[0122] See also Figure 5 and Figure 6 The second embodiment of the present application provides a multi-lens module 200. The difference between the multi-lens module 200 provided in the second embodiment and the multi-lens module 100 provided in the first embodiment is that: a heat dissipation groove 12 is provided on one surface of the metal support frame 10, and the heat dissipation groove 12 and the first groove 101 are respectively located on two opposite surfaces of the metal support frame 10. The heat dissipation groove 12 corresponds to the first heat dissipation component 20, the second heat dissipation component 21 and the third heat dissipation component 22, and the extension direction of the heat dissipation groove 12 is along the length direction of the metal support frame 10 (i.e., the connection direction of the first groove 101, the second groove 102 and the third groove 103).

[0123] See also Figure 7 The present application further provides an electronic device 300, comprising the multi-lens module 100 or the multi-lens module 200. The electronic device 300 may be a mobile phone, a wearable device, a computer device, a vehicle, a monitoring device, etc. In this embodiment, the electronic device 300 is a mobile phone.

[0124] The metal support frame 10 in the present application is provided with the heat dissipation groove 11 on the surface away from the first lens module 30. The heat dissipation groove 11 increases the heat dissipation area of ​​the metal support frame 10, is beneficial to the circulation of heat, and improves the heat dissipation capacity of the first lens module 30, the second lens module 31 and the third lens module 32, thereby improving the heat dissipation capacity of the multi-lens module 100, and further improving the imaging quality of the multi-lens module 100.

[0125] The above description is only an optimized specific implementation of the present application, but it cannot be limited to this implementation in actual application.

Claims

1. A multi-lens module, characterized in that: The invention comprises a metal support frame, a first lens module, a first heat dissipation component, a second lens module and a second heat dissipation component, wherein the metal support frame is provided with a first groove and a second groove which are spaced apart, the first lens module and the first heat dissipation component are both located in the first groove, and the first lens module is located on the first heat dissipation component, the second lens module and the second heat dissipation component are both located in the second groove, and the second lens module is located on the second heat dissipation component, a heat dissipation groove is provided on the surface of the metal support frame away from the first lens module, the heat generated by the first lens module is transmitted to the metal support frame through the first heat dissipation component and dissipated through the heat dissipation groove, the heat generated by the second lens module is transmitted through the second heat dissipation component and the metal support frame and dissipated by the heat dissipation groove, the heat dissipation groove comprises a first heat dissipation groove portion and a second heat dissipation groove portion which is spaced apart from the first heat dissipation groove portion, the first heat dissipation groove portion corresponds to the first heat dissipation component, the second heat dissipation groove portion corresponds to the second heat dissipation component, and the extension direction of the first heat dissipation groove portion is perpendicular to the connection direction of the first lens module and the second lens module, and the extension direction of the second heat dissipation groove portion is perpendicular to the connection direction of the first lens module and the second lens module.

2. The multi-lens module according to claim 1, characterized in that: The first lens module includes a first circuit board and a first photosensitive chip, the first circuit board is located on the first heat dissipation component and is arranged in the first groove, the first circuit board is provided with a first receiving hole, the first photosensitive chip is received in the first receiving hole and is located on the first heat dissipation component, the second lens module includes a second circuit board and a second photosensitive chip, the second circuit board is located on the second heat dissipation component and is arranged in the second groove, the second circuit board is provided with a second receiving hole, the second photosensitive chip is received in the second receiving hole and is located on the second heat dissipation component.

3. The multi-lens module according to claim 2, characterized in that: The first heat dissipation component includes a first thermally conductive adhesive, a first steel sheet and a first thermally conductive silicone grease which are stacked in sequence, the first photosensitive chip is located on the first thermally conductive adhesive, and the first thermally conductive silicone grease is bonded to the bottom surface of the first groove, and the second heat dissipation component includes a second thermally conductive adhesive, a second steel sheet and a second thermally conductive silicone grease which are stacked in sequence, the second photosensitive chip is located on the second thermally conductive adhesive, and the second thermally conductive silicone grease is bonded to the bottom surface of the second groove.

4. The multi-lens module according to claim 1, wherein: The multi-lens module also includes a third lens module and a third heat dissipation assembly. The metal support frame is also provided with a third groove spaced apart from the second groove. The third lens module and the third heat dissipation assembly are both located in the third groove, and the third lens module is located on the third heat dissipation assembly. The heat generated by the third lens module is sequentially transmitted through the third heat dissipation assembly and the metal support frame and then dissipated by the heat dissipation groove.

5. The multi-lens module according to claim 1, wherein: The first lens module also includes a first colloid, which is arranged around the first lens module and is located in the first groove. The second lens module also includes a second colloid, which is arranged around the second lens module and is located in the second groove.

6. The multi-lens module according to claim 1, wherein: The metal support frame is made of aluminum or steel.

7. An electronic device, characterized in that: Comprising a multi-lens module as described in any one of claims 1 to 6.

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