A vacuum hot pressing and forming device for copper-clad substrates

Abstract

The present invention discloses a vacuum hot pressing forming device for copper-clad substrates, which is applied in the technical field of vacuum hot pressing forming of copper-clad substrates. By setting a vacuum limiting mechanism, the limiting component can reinforce the adsorption component, and the adsorption component can evacuate itself to a vacuum. The vacuum environment will enhance the direct heat transfer effect. The connection component can limit the adsorption component to increase the tightness of the internal vacuum environment. The bearing component can limit the copper-clad substrate to increase the stability of the copper-clad substrate being limited. The clamping component can clamp the raw material plate of the copper-clad substrate, making the layers of the raw material plates of the copper-clad substrate distinct and easy to distinguish. The reset component can reset the clamping component to facilitate clamping a new batch of raw material plates of the copper-clad substrate.

Description

Technical Field

[0001] The present invention belongs to the technical field of vacuum hot pressing forming of copper-clad substrates, and particularly relates to a vacuum hot pressing forming device for copper-clad substrates. Background Art

[0002] The substrate is the basic material for manufacturing PCBs. Generally, the substrate is a copper-clad laminate. In the manufacture of single-sided and double-sided printed boards, hole processing, electroless copper plating, electroplating copper, etching, etc. are selectively performed on the substrate material: copper-clad laminate to obtain the required circuit pattern.

[0003] Currently, the invention with the publication number: CN102281717B discloses a manufacturing method for a high-frequency circuit module substrate. This invention discloses a manufacturing method for a high-frequency circuit module substrate, which includes the following steps: Step 1, photoplotting module manufacturing; Step 2, dielectric module manufacturing; Step 3, metallization treatment manufacturing for the hole wall; Step 4, manufacturing of the surface circuit pattern; Step 5, manufacturing of electroplating etching; Step 6, forming manufacturing to make a high-frequency circuit module substrate. The high-frequency circuit module substrate manufactured by this invention is suitable for wireless sensor monitoring devices. The manufactured high-frequency circuit module substrate has good consistency, high precision, excellent high-frequency high-Q characteristics, is beneficial to improving the quality factor of the circuit system, can adapt to large current and high-temperature characteristics, has good temperature characteristics, a small thermal expansion coefficient, and a small temperature coefficient of dielectric constant. The substrate is applied to wireless sensor monitoring devices in harsh environments, which can extend the service life of the device.

[0004] The existing vacuum hot pressing forming device for copper-clad substrates has the following disadvantages when processing copper-clad substrates:

[0005] 1. Lack of long-term accurate positioning of the copper-clad substrate, reducing the quality of the copper-clad substrate during hot pressing forming;

[0006] 2. Lack of the ability to heat the copper-clad substrate during pressing, reducing the efficiency of the copper-clad substrate during hot pressing forming. Summary of the Invention

[0007] The purpose of the present invention is directed to an existing vacuum hot pressing forming device for copper-clad substrates, and its advantages are:

[0008] 1. It can accurately position the copper-clad substrate for a long time, improving the quality of the copper-clad substrate during hot pressing forming;

[0009] 2. It can heat the copper-clad substrate during pressing, improving the efficiency of the copper-clad substrate during hot pressing forming.

[0010] The above technical object of the present invention is achieved through the following technical solutions: A vacuum hot pressing and forming device for a copper-clad substrate, comprising a vacuum limiting mechanism and a hot pressing and forming mechanism. The hot pressing and forming mechanism is bolted on both sides of the vacuum limiting mechanism. The vacuum limiting mechanism includes an adsorption component, a limiting component, a connection component, a bearing component, a clamping component and a reset component. The connection component is opened at the top of the adsorption component. The limiting component is clamped inside the connection component. The bearing component is clamped inside the connection component. The clamping component is slidably connected to the top of the bearing component. The reset component is slidably connected to the right side of the clamping component. The hot pressing and forming mechanism includes a clamping component, a pressing component and a heating component. The clamping component is bolted on both sides of the adsorption component. The pressing component is bolted on the top of the clamping component. The heating component is bolted on the bottom of the pressing component. The surface of the heating component is slidably connected to the inner wall of the limiting component.

[0011] By adopting the above technical solutions, by setting the vacuum limiting mechanism and the hot pressing and forming mechanism, the vacuum limiting mechanism can limit and adsorb the copper-clad substrate, thereby increasing the stability of the copper-clad substrate. When the hot pressing and forming mechanism presses and forms the copper-clad substrate, it can heat the copper-clad substrate, thereby increasing the density of the copper-clad substrate when it is extruded.

[0012] The present invention is further configured as: The adsorption component includes a support base, a vacuum pump and a limiting frame. The vacuum pump is bolted on the front side of the support base. The limiting frame is clamped on the top of the support base.

[0013] By adopting the above technical solutions, by setting the adsorption component, the vacuum pump on the support base can pump the air in the limiting frame away, making the inside of the limiting frame form a vacuum, which is convenient for processing the copper-clad substrate.

[0014] The present invention is further configured as: The limiting component includes a support frame, a reinforcement plate and a reinforcing rib. The support frame is bolted on the inner wall of the limiting frame. The reinforcement plate is bolted on the surface of the support frame. The reinforcing rib is bolted on the surface of the reinforcement plate.

[0015] By adopting the above technical solutions, by setting the limiting component, the support frame can increase the structural stability of the limiting frame. The reinforcement plate can reinforce the outside of the limiting frame. The reinforcing rib can increase the stability of the reinforcement plate's support for the limiting frame, so as to improve the structural stability of the limiting frame when a vacuum is formed inside the limiting frame.

[0016] The present invention is further configured as: The connection component includes a connection groove, a sealing sleeve and a reset groove. The connection groove is opened on the top of the support base. The sealing sleeve is bolted on the inner wall of the connection groove. The reset groove is opened at the bottom of the inner wall of the connection groove.

[0017] With the above technical solution, by setting up the connection component, the connection slot can limit the position of the limit frame, the sealing sleeve can increase the tightness when the limit frame contacts the connection slot on the right side, and the reset slot can be used in cooperation with the bearing component.

[0018] The present invention is further configured as follows: The bearing component includes a support plate, an extrusion slot, a sliding slot, and a limit block. The support plate is snap-fitted in the connection slot. The extrusion slot is opened at the top of the support plate. The sliding slots are opened on both sides of the top of the support plate. The limit block is welded to the bottom of the support plate, and the limit block is snap-fitted with the reset slot.

[0019] With the above technical solution, by setting up the bearing component, the extrusion slot on the support plate can limit the position of the copper-clad laminate substrate, the limit block can be connected to the reset slot, and the sliding slot can be used in cooperation with the reset component.

[0020] The present invention is further configured as follows: The clamping component includes a front clamping sleeve, a rear clamping sleeve, a clamping slot, and a baffle. The bottom of the front clamping sleeve is slidably connected to the top of the support plate. The bottom of the rear clamping sleeve is slidably connected to the top of the support plate. The clamping slots are respectively opened at the rear side of the front clamping sleeve and the front side of the rear clamping sleeve. The baffle is bolted to the rear side of the front clamping sleeve.

[0021] With the above technical solution, by setting up the clamping component, the clamping slot between the front clamping sleeve and the rear clamping sleeve can clamp and layer the raw material plate of the copper-clad laminate substrate for directional limiting. And the baffle can limit the raw material plate of the copper-clad laminate substrate when the front clamping sleeve and the rear clamping sleeve release the raw material plate of the copper-clad laminate substrate, so that the raw material plate of the copper-clad laminate substrate enters the extrusion slot, improving the ability to limit the copper-clad laminate substrate.

[0022] The present invention is further configured as follows: The reset component includes a reset block, a reset rod, and a reset tension spring. The reset blocks are respectively bolted to the bottoms of the front clamping sleeve and the rear clamping sleeve. The bottom of the reset block is slidably connected to the reset slot. The reset rod is bolted to the front side of the rear clamping sleeve. The front side of the reset rod is slidably connected to the baffle. The reset tension spring is sleeved on the surface of the reset rod, and the front side of the reset tension spring is snap-fitted with the baffle.

[0023] With the above technical solution, by setting up the reset component, the reset block can make the front clamping sleeve and the rear clamping sleeve slide in the sliding slot along with the reset block. The reset rod can slide in the baffle to limit the rear clamping sleeve. And the reset tension spring can reset between the front clamping sleeve and the rear clamping sleeve, facilitating continuous clamping of the raw material plate of the copper-clad laminate substrate.

[0024] The present invention is further configured as follows: The clamping component includes a hydraulic rod, a connecting support rod, and a connecting support plate. The hydraulic rods are bolted to both sides of the support base. The connecting support rods are bolted to the output ends at the tops of the hydraulic rods. The connecting support plate is bolted to the tops of the connecting support rods.

[0025] With the above technical solution, by setting the clamping component, the hydraulic rod will push and pull the connecting support rod, thereby pushing and pulling the connecting support plate and changing the position of the pressing component.

[0026] The present invention is further configured as follows: The pressing component includes a top plate, a pressing hydraulic cylinder and a connecting buckle. Both sides of the top plate are bolted to the connecting support plate. The pressing hydraulic cylinder is bolted to the top of the top plate. The connecting buckle is bolted to the output end at the bottom of the pressing hydraulic cylinder.

[0027] With the above technical solution, by setting the pressing component, the pressing hydraulic cylinder on the top plate can push and pull the heating component at the bottom of the connecting buckle, so that the heating component presses and forms the copper clad laminate.

[0028] The present invention is further configured as follows: The heating component includes a heater body, a pressing block and a heat conducting plate. The heater body is bolted to the bottom of the connecting buckle. The pressing block is bolted to the bottom of the heater body. The heat conducting plate is bolted to the bottom of the pressing block. The heat conducting plate penetrates through the pressing block and is welded to the heater body.

[0029] With the above technical solution, by setting the heating component, the heater body can heat the heat conducting plate at the bottom of the pressing block. When the pressing component pushes until it contacts the copper clad laminate and presses and forms the copper clad laminate, the heat conducting plate will heat the heat conducting plate, increasing the temperature of the heat conducting plate and raising the temperature of the copper clad laminate, improving the compactness when the copper clad laminate is formed.

[0030] In summary, the present invention has the following beneficial effects:

[0031] 1. By setting the vacuum limiting mechanism, the limiting component can reinforce the adsorption component, and the adsorption component can evacuate itself to a vacuum. The vacuum environment will enhance the direct heat transfer effect. The connecting component can limit the adsorption component, increasing the tightness of the internal vacuum environment. The bearing component can limit the copper clad laminate, increasing the stability of the copper clad laminate being limited. The clamping component can clamp the raw material plates of the copper clad laminate, making the layers of the raw material plates of the copper clad laminate distinct and easy to distinguish. The reset component can reset the clamping component, facilitating the clamping of a new batch of raw material plates of the copper clad laminate;

[0032] 2. By setting up a hot pressing and forming mechanism, the clamping component can push the pressing component upward and pull it downward, thereby opening and closing the pressing component. The pressing component can push the heating component towards the raw material board of the copper-clad laminate to perform hot pressing and forming on the raw material board of the copper-clad laminate. The heating component can heat the raw material board of the copper-clad laminate to increase the heat of the raw material board of the copper-clad laminate. Moreover, in a vacuum state, the heat will not disperse and will be concentrated on the raw material board of the copper-clad laminate, thereby improving the compactness of the extrusion forming between the raw material boards of the copper-clad laminate. Brief Description of the Drawings

[0033] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0034] Figure 2 is a schematic diagram of the adsorption component and structure of the present invention;

[0035] Figure 3 is a schematic diagram of the connection component, limit component and bearing component structure of the present invention;

[0036] Figure 4 is a schematic diagram of the clamping component structure of the present invention;

[0037] Figure 5 is a schematic diagram of the reset component structure of the present invention;

[0038] Figure 6 is a schematic diagram of the clamping component structure of the present invention;

[0039] Figure 7 is a schematic diagram of the pressing component structure of the present invention;

[0040] Figure 8 is a schematic diagram of the heating component structure of the present invention.

[0041] Reference numerals: 1, vacuum limit mechanism; 101, adsorption component; 1011, support base; 1012, vacuum pump; 1013, limit frame; 102, limit component; 1021, support frame; 1022, reinforcement plate; 1023, reinforcing rib; 103, connection component; 1031, connection groove; 1032, sealing sleeve; 1033, reset groove; 104, bearing component; 1041, support plate; 1042, extrusion groove; 1043, sliding groove; 1044, limit block; 105, clamping component; 1051, front clamping sleeve; 1052, rear clamping sleeve; 1053, clamping groove; 1054, baffle; 106, reset component; 1061, reset block; 1062, reset rod; 1063, reset tension spring; 2, hot pressing and forming mechanism; 201, clamping component; 2011, hydraulic rod; 2012, connecting support rod; 2013, connecting support plate; 202, pressing component; 2021, top plate; 2022, pressing hydraulic cylinder; 2023, connecting buckle; 203, heating component; 2031, heater body; 2032, pressing block; 2033, heat conducting plate. Detailed implementation mode

[0042] The present invention will be further described in detail below with reference to the accompanying drawings.

[0043] Embodiment 1:

[0044] Refer to Figures 1-5 , a vacuum hot pressing and forming device for a copper-clad substrate, including a vacuum limit mechanism 1. The vacuum limit mechanism 1 includes an adsorption component 101, a limit component 102, a connection component 103, a bearing component 104, a clamping component 105 and a reset component 106. The connection component 103 is opened at the top of the adsorption component 101. The limit component 102 is clamped on the inner wall of the connection component 103. The bearing component 104 is clamped on the inner wall of the connection component 103. The clamping component 105 is slidably connected to the top of the bearing component 104. The reset component 106 is slidably connected to the right side of the clamping component 105. By setting the vacuum limit mechanism 1, the limit component 102 can reinforce the adsorption component 101, and the adsorption component 101 can pump itself into a vacuum. The vacuum environment will increase the effect of direct heat transfer. The connection component 103 can limit the adsorption component 101 and increase the tightness of the internal vacuum environment. The bearing component 104 can limit the copper-clad substrate and increase the stability of the copper-clad substrate being limited. The clamping component 105 can clamp the raw material plates of the copper-clad substrate, making the raw material plates of the copper-clad substrate distinct in layers for easy distinction. The reset component 106 can reset the clamping component 105, facilitating the clamping of a new batch of raw material plates of the copper-clad substrate.

[0045] As Figure 2As shown in the figure, the adsorption assembly 101 includes a support base 1011, a vacuum pump 1012, and a limit frame 1013. The vacuum pump 1012 is bolted to the front side of the support base 1011, and the limit frame 1013 is snap-fitted to the top of the support base 1011. By setting up the adsorption assembly 101, the vacuum pump 1012 on the support base 1011 can pump out the air inside the limit frame 1013, creating a vacuum inside the limit frame 1013, which facilitates the processing of the copper-clad substrate.

[0046] As Figure 2 shown in the figure, the limit assembly 102 includes a support frame 1021, a reinforcement plate 1022, and a reinforcing rib 1023. The support frame 1021 is bolted to the inner wall of the limit frame 1013, the reinforcement plate 1022 is bolted to the surface of the support frame 1021, and the reinforcing rib 1023 is bolted to the surface of the reinforcement plate 1022. By setting up the limit assembly 102, the support frame 1021 can increase the structural stability of the limit frame 1013, the reinforcement plate 1022 can reinforce the outside of the limit frame 1013, and the reinforcing rib 1023 can increase the stability of the reinforcement plate 1022 in supporting the limit frame 1013, thereby improving the structural stability of the limit frame 1013 when a vacuum is formed inside the limit frame 1013.

[0047] As Figure 3 shown in the figure, the connection assembly 103 includes a connection groove 1031, a sealing sleeve 1032, and a reset groove 1033. The connection groove 1031 is opened on the top of the support base 1011, the sealing sleeve 1032 is bolted to the inner wall of the connection groove 1031, and the reset groove 1033 is opened at the bottom of the inner wall of the connection groove 1031. By setting up the connection assembly 103, the connection groove 1031 can limit the position of the limit frame 1013, the sealing sleeve 1032 can increase the tightness when the limit frame 1013 contacts the connection groove 1031 on the right side, and the reset groove 1033 can be used in cooperation with the bearing assembly 104.

[0048] As Figure 3 shown in the figure, the bearing assembly 104 includes a support plate 1041, an extrusion groove 1042, a sliding groove 1043, and a limit block 1044. The support plate 1041 is snap-fitted into the connection groove 1031, the extrusion groove 1042 is opened on the top of the support plate 1041, the sliding grooves 1043 are opened on both sides of the top of the support plate 1041, and the limit block 1044 is welded to the bottom of the support plate 1041. The limit block 1044 is snap-fitted with the reset groove 1033. By setting up the bearing assembly 104, the extrusion groove 1042 on the support plate 1041 can limit the position of the copper-clad substrate, the limit block 1044 can be connected to the reset groove 1033, and the sliding groove 1043 can be used in cooperation with the reset assembly 106.

[0049] As Figure 4As shown, the clamping assembly 105 includes a front ferrule 1051, a rear ferrule 1052, a clamping groove 1053, and a baffle 1054. The bottom of the front ferrule 1051 is slidably connected to the top of the support plate 1041, and the bottom of the rear ferrule 1052 is slidably connected to the top of the support plate 1041. The clamping grooves 1053 are respectively formed on the rear side of the front ferrule 1051 and the front side of the rear ferrule 1052. The baffle 1054 is bolted to the rear side of the front ferrule 1051. By providing the clamping assembly 105, the clamping grooves 1053 between the front ferrule 1051 and the rear ferrule 1052 can clamp the copper-clad laminate raw board in layers for directional limiting, and the baffle 1054 can limit the copper-clad laminate raw board when the front ferrule 1051 and the rear ferrule 1052 release the copper-clad laminate raw board, allowing the copper-clad laminate raw board to enter the extrusion groove 1042, improving the ability to limit the copper-clad laminate raw board.

[0050] As Figure 5 As shown, the reset assembly 106 includes a reset block 1061, a reset rod 1062, and a reset tension spring 1063. The reset block 1061 is respectively bolted to the bottom of the front ferrule 1051 and the bottom of the rear ferrule 1052. The bottom of the reset block 1061 is slidably connected to the reset groove 1033. The reset rod 1062 is bolted to the front side of the rear ferrule 1052, and the front side of the reset rod 1062 is slidably connected to the baffle 1054. The reset tension spring 1063 is sleeved on the surface of the reset rod 1062, and the front side of the reset tension spring 1063 is clamped to the baffle 1054. By providing the reset assembly 106, the reset block 1061 can allow the front ferrule 1051 and the rear ferrule 1052 to slide in the sliding groove 1043 along with the reset block 1061. The reset rod 1062 can slide in the baffle 1054 to limit the rear ferrule 1052, and the reset tension spring 1063 can reset between the front ferrule 1051 and the rear ferrule 1052, facilitating continuous clamping of the copper-clad laminate raw board.

[0051] Brief description of the usage process: First, place the raw board of the copper-clad laminate substrate into the clamping groove 1053 in the front sleeve 1051 and the rear sleeve 1052. Due to the pulling force generated by the return spring 1063 on the return rod 1062, the front sleeve 1051 and the rear sleeve 1052 are moved and reset by the return block 1061 in the sliding groove 1043, thereby clamping the raw board of the copper-clad laminate substrate. After the limit frame 1013 contacts the connection groove 1031 and is clamped with the sealing sleeve 1032, the support plate 1041 can be placed into the return groove 1033 along the limit block 1044. The vacuum pump 1012 on the support base 1011 will pump the air in the limit frame 1013 away along the support base 1011, so that the limit frame 1013 forms a vacuum state. Moreover, the support frame 1021 and the reinforcement plate 1022 will support the limit frame 1013, increasing the structural stability of the limit frame 1013. The reinforcing rib 1023 can further enhance the structural stability of the reinforcement plate 1022. Finally, start the hot pressing and forming mechanism 2, and let the hot pressing and forming mechanism 2 extrude the raw board of the copper-clad laminate substrate into the clamping groove 1053. When the raw board of the copper-clad laminate substrate enters the clamping groove 1053, the front sleeve 1051, the rear sleeve 1052, and the baffle 1054 will limit the movement of the raw board of the copper-clad laminate substrate.

[0052] Embodiment 2:

[0053] Reference Figures 6-8 A vacuum hot pressing and forming device for a copper-clad laminate substrate, including a hot pressing and forming mechanism 2. The hot pressing and forming mechanism 2 is bolted to both sides of the vacuum limiting mechanism 1. The hot pressing and forming mechanism 2 includes a clamping component 201, a pressing component 202, and a heating component 203. The clamping component 201 is bolted to both sides of the adsorption component 101. The pressing component 202 is bolted to the top of the clamping component 201. The heating component 203 is bolted to the bottom of the pressing component 202. The surface of the heating component 203 is slidably connected to the inner wall of the limiting component 102. By setting the hot pressing and forming mechanism 2, the clamping component 201 can push the pressing component 202 upward and pull it downward, so that the pressing component 202 can be opened and closed. The pressing component 202 can push the heating component 203 towards the position of the raw board of the copper-clad laminate substrate to press and form the raw board of the copper-clad laminate substrate. The heating component 203 can heat the raw board of the copper-clad laminate substrate, increasing the heat of the raw board of the copper-clad laminate substrate. And under the vacuum state, the heat will not diffuse and will be concentrated on the raw board of the copper-clad laminate substrate, thereby improving the density of the extrusion forming between the raw boards of the copper-clad laminate substrate.

[0054] Such as Figure 6As shown, the clamping assembly 201 includes a hydraulic rod 2011, a connecting support rod 2012, and a connecting support plate 2013. The hydraulic rod 2011 is bolted to both sides of the support base 1011. The connecting support rod 2012 is bolted to the output end at the top of the hydraulic rod 2011. The connecting support plate 2013 is bolted to the top of the connecting support rod 2012. By setting the clamping assembly 201, the hydraulic rod 2011 will push and pull the connecting support rod 2012, thereby pushing and pulling the connecting support plate 2013 to change the position of the pressing assembly 202.

[0055] As Figure 7 shown, the pressing assembly 202 includes a top plate 2021, a pressing hydraulic cylinder 2022, and a connecting buckle 2023. Both sides of the top plate 2021 are bolted to the connecting support plate 2013. The pressing hydraulic cylinder 2022 is bolted to the top of the top plate 2021. The connecting buckle 2023 is bolted to the output end at the bottom of the pressing hydraulic cylinder 2022. By setting the pressing assembly 202, the pressing hydraulic cylinder 2022 on the top plate 2021 can push and pull the heating assembly 203 at the bottom of the connecting buckle 2023, so that the heating assembly 203 presses and forms the copper clad laminate substrate.

[0056] As Figure 8 shown, the heating assembly 203 includes a heater body 2031, a pressing block 2032, and a heat conducting plate 2033. The heater body 2031 is bolted to the bottom of the connecting buckle 2023. The pressing block 2032 is bolted to the bottom of the heater body 2031. The heat conducting plate 2033 is bolted to the bottom of the pressing block 2032. The heat conducting plate 2033 penetrates the pressing block 2032 and is welded to the heater body 2031. By setting the heating assembly 203, the heater body 2031 can heat the heat conducting plate 2033 at the bottom of the pressing block 2032. When the pressing assembly 202 pushes the pressing assembly 202 until it contacts the copper clad laminate substrate and presses and forms the copper clad laminate substrate, the heat conducting plate 2033 will heat the heat conducting plate 2033, increase the temperature of the heat conducting plate 2033 to raise the temperature of the copper clad laminate substrate, and improve the density when the copper clad laminate substrate is formed.

[0057] Brief description of the usage process: When hot pressing and forming the raw material plate of the copper clad laminate substrate, the hydraulic rod 2011 will move the connecting support rod 2012 and the connecting support plate 2013 downward together, thereby driving the top plate 2021 downward, and making the pressing hydraulic cylinder 2022 push the heater body 2031 at the bottom of the connecting buckle 2023 downward together with the top plate 2021. After the pressing hydraulic cylinder 2022 moves to the preset position, the pressing hydraulic cylinder 2022 will push the heater body 2031 at the bottom of the connecting buckle 2023 until the pressing block 2032 contacts and presses the raw material plate of the copper clad laminate substrate. The heater body 2031 will heat the heat conducting plate 2033, and the heat will heat the raw material plate of the copper clad laminate substrate in a vacuum environment until the raw material plate of the copper clad laminate substrate is completely hot pressed.

[0058] This specific embodiment is only an interpretation of the present invention and is not a limitation thereof. After reading this specification, those skilled in the art may make modifications to this embodiment that do not contribute creatively as needed, but as long as it is within the scope of the claims of the present invention, it is protected by the patent law.

Claims

1. A vacuum hot pressing forming device for a copper-clad substrate, comprising a vacuum limiting mechanism (1) and a hot pressing forming mechanism (2), characterized in that: The hot pressing and forming mechanism (2) is bolted to both sides of the vacuum limiting mechanism (1). The vacuum limiting mechanism (1) includes an adsorption component (101), a limiting component (102), a connection component (103), a bearing component (104), a clamping component (105), and a reset component (106). The connection component (103) is opened at the top of the adsorption component (101). The limiting component (102) is clamped to the inner wall of the connection component (103). The bearing component (104) is clamped to the inner wall of the connection component (103). The clamping component (105) is slidably connected to the top of the bearing component (104). The reset component (106) is slidably connected to the right side of the clamping component (105). The hot pressing and forming mechanism (2) includes a clamping component (201), a pressing component (202), and a heating component (203). The clamping component (201) is bolted to both sides of the adsorption component (101). The pressing component (202) is bolted to the top of the clamping component (201). The heating component (203) is bolted to the bottom of the pressing component (202). The surface of the heating component (203) is slidably connected to the inner wall of the limiting component (102).

2. The vacuum hot pressing forming device for a copper-clad substrate according to claim 1, wherein: The adsorption component (101) includes a support base (1011), a vacuum pump (1012), and a limiting frame (1013). The vacuum pump (1012) is bolted to the front side of the support base (1011). The limiting frame (1013) is clamped to the top of the support base (1011).

3. The vacuum hot pressing forming device for a copper-clad substrate according to claim 2, wherein: The limiting component (102) includes a support frame (1021), a reinforcement plate (1022), and a reinforcing rib (1023). The support frame (1021) is bolted to the inner wall of the limiting frame (1013). The reinforcement plate (1022) is bolted to the surface of the support frame (1021). The reinforcing rib (1023) is bolted to the surface of the reinforcement plate (1022).

4. The vacuum hot pressing forming device for copper-clad substrates according to claim 2, wherein: The connection component (103) includes a connection groove (1031), a sealing sleeve (1032), and a reset groove (1033). The connection groove (1031) is opened at the top of the support base (1011). The sealing sleeve (1032) is bolted to the inner wall of the connection groove (1031). The reset groove (1033) is opened at the bottom of the inner wall of the connection groove (1031).

5. The vacuum hot pressing forming device for copper-clad laminates according to claim 4, wherein: The bearing component (104) includes a support plate (1041), an extrusion groove (1042), a sliding groove (1043), and a limiting block (1044). The support plate (1041) is clamped to the connection groove (1031). The extrusion groove (1042) is opened at the top of the support plate (1041). The sliding grooves (1043) are opened on both sides of the top of the support plate (1041). The limiting block (1044) is welded to the bottom of the support plate (1041). The limiting block (1044) is clamped to the reset groove (1033).

6. The vacuum hot pressing forming device for copper-clad laminates according to claim 5, characterized in that: The clamping assembly (105) includes a front ferrule (1051), a rear ferrule (1052), a clamping groove (1053) and a baffle (1054). The bottom of the front ferrule (1051) is slidably connected to the top of the support plate (1041), and the bottom of the rear ferrule (1052) is slidably connected to the top of the support plate (1041). The clamping grooves (1053) are respectively formed on the rear side of the front ferrule (1051) and the front side of the rear ferrule (1052), and the baffle (1054) is bolted to the rear side of the front ferrule (1051).

7. The vacuum hot pressing and forming device for copper-clad substrate according to claim 6, wherein: The reset assembly (106) includes a reset block (1061), a reset rod (1062) and a reset tension spring (1063). The reset block (1061) is bolted to the bottom of the front ferrule (1051) and the bottom of the rear ferrule (1052). The bottom of the reset block (1061) is slidably connected to the reset groove (1033). The reset rod (1062) is bolted to the front side of the rear ferrule (1052), and the front side of the reset rod (1062) is slidably connected to the baffle (1054). The reset tension spring (1063) is sleeved on the surface of the reset rod (1062), and the front side of the reset tension spring (1063) is clamped to the baffle (1054).

8. The vacuum hot pressing forming device for a copper-clad substrate according to claim 2, wherein: The clamping component (201) includes a hydraulic rod (2011), a connecting support rod (2012) and a connecting support plate (2013). The hydraulic rod (2011) is bolted to both sides of the support base (1011). The connecting support rod (2012) is bolted to the output end at the top of the hydraulic rod (2011), and the connecting support plate (2013) is bolted to the top of the connecting support rod (2012).

9. The vacuum hot pressing forming device for copper clad laminates according to claim 8, characterized in that: The pressing component (202) includes a top plate (2021), a pressing hydraulic cylinder (2022) and a connecting buckle (2023). The two sides of the top plate (2021) are bolted to the connecting support plate (2013). The pressing hydraulic cylinder (2022) is bolted to the top of the top plate (2021), and the connecting buckle (2023) is bolted to the output end at the bottom of the pressing hydraulic cylinder (2022).

10. A vacuum hot pressing forming device for a copper-clad substrate according to claim 9, characterized in that: The heating component (203) includes a heater body (2031), a pressing block (2032) and a heat conducting plate (2033). The heater body (2031) is bolted to the bottom of the connecting buckle (2023). The pressing block (2032) is bolted to the bottom of the heater body (2031). The heat conducting plate (2033) is bolted to the bottom of the pressing block (2032), and the heat conducting plate (2033) penetrates through the pressing block (2032) and is welded to the heater body (2031).

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