Device and method for plugging inner via holes of a multilayer printed circuit board with ink

By designing a device for through-hole plug ink in a multi-layer printed circuit board, the motor drive screw is used to adjust the position of the threaded rod to achieve the fixation of circuit boards of different sizes, the problem of inconvenient operation of through-hole plug ink in a multi-layer printed circuit board is solved and the operation convenience is improved.

CN116209180BActive Publication Date: 2025-07-25GUANGDE OUKEDA ELECTRONICS CO LTD
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Patent Information

Application Number
CN202310406832.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-17
Publication Date
2025-07-25
Estimated Expiration
2043-04-17

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Abstract

The present invention provides a device and method for plugging ink into inner vias of a multilayer printed circuit board, relating to the field of plugging ink into inner vias of a multilayer printed circuit board. The device and method for plugging ink into inner vias of the multilayer printed circuit board include a bottom plate, a top frame fixedly installed on the top of the bottom plate, a support seat fixedly installed on the top of the top frame, a hydraulic telescopic rod fixedly installed on the top of the support seat, a top hole provided on the top of the top frame, an installation plate fixedly installed at the end of the output end of the hydraulic telescopic rod extending into the top hole, and an ink plugging mechanism fixedly installed on the bottom surface of the installation plate; a placement frame is fixedly installed in the middle of the bottom plate, four adjustment holes are formed on the surface of the placement frame, the four adjustment holes are arranged in an array with the central axis of the bottom plate as the axis, and fixing mechanisms are installed on the surface of the bottom plate below the adjustment holes. The problem that during the operation of plugging ink into inner vias of the existing multilayer printed circuit board, it is not convenient to fix circuit boards of different sizes, resulting in inconvenient operation of plugging ink into inner vias of the circuit board is solved.
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Description

Technical Field

[0001] The present invention relates to the technical field of inner via hole oil plugging technology for multilayer printed circuit boards, and specifically to a device and method for plugging inner via holes of multilayer printed circuit boards with ink. Background Art

[0002] The names of circuit boards include: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high-frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. Circuit boards miniaturize and visualize circuits, and play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. Circuit boards can be called printed wiring boards or printed circuit boards [1], with the English names (Printed Circuit Board) PCB, (Flexible Printed Circuitboard) FPC circuit board (FPC circuit board is also called flexible circuit board. A flexible circuit board is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film. It has the characteristics of high wiring density, light weight, thin thickness, and good bendability.) and rigid-flex circuit board (reechas, Soft and hard combination plate) - The birth and development of FPC and PCB have given birth to this new product, the rigid-flex circuit board. Therefore, a rigid-flex circuit board is a circuit board formed by combining a flexible circuit board and a rigid circuit board through processes such as lamination and combining them together according to relevant process requirements, with the characteristics of FPC and PCB.

[0003] During the operation of plugging inner via holes of existing multilayer printed circuit boards with ink, it is not convenient to fix circuit boards of different sizes, resulting in inconvenient operation of plugging inner via holes of circuit boards. Summary of the Invention

[0004] (I) Technical Problems to be Solved

[0005] In view of the deficiencies of the prior art, the present invention provides a device and method for plugging inner via holes of multilayer printed circuit boards with ink, which solves the problem that during the operation of plugging inner via holes of existing multilayer printed circuit boards with ink, it is not convenient to fix circuit boards of different sizes, resulting in inconvenient operation of plugging inner via holes of circuit boards.

[0006] (II) Technical Solutions

[0007] To achieve the above objectives, the present invention is realized through the following technical solutions:

[0008] In a first aspect, a device for plugging ink into inner vias of a multi-layer printed circuit board is provided, which includes a bottom plate. A top frame is fixedly installed on the top of the bottom plate, a support seat is fixedly installed on the top of the top frame, a hydraulic telescopic rod is fixedly installed on the top of the support seat. A top hole is provided on the top of the top frame. An installation plate is fixedly installed at the end of the output end of the hydraulic telescopic rod extending into the top hole. A ink plugging mechanism is fixedly installed on the bottom surface of the installation plate;

[0009] A placement frame is fixedly installed in the middle of the bottom plate. Four adjustment holes are provided on the surface of the placement frame. The four adjustment holes are arranged in an array with the central axis of the bottom plate as the axis. Fixing mechanisms are installed on the surface of the bottom plate below the adjustment holes. Each of the fixing mechanisms includes four folding plates fixedly installed on the surface of the bottom plate. The four shielding plates are respectively located directly below the four adjustment holes. Two symmetrically distributed first support blocks are fixedly installed on the surface of each folding plate. A first screw rod is rotatably installed between the two first support blocks. A first motor is fixedly installed on the surface of the first support block on one side of the end of the first screw rod. The output end of the first motor is fixedly connected to the first screw rod. A first screw sleeve adapted to the first screw rod is sleeved in the middle of the first screw rod. A connecting plate is fixedly installed on the top of the first screw sleeve. A sliding hole is provided in the middle of the connecting plate. A sliding column is slidably connected in the middle of the sliding hole. The bottom of the sliding column is fixedly connected with a sliding sleeve. A sliding rod is slidably connected in the middle of the sliding sleeve. One end of the sliding rod is fixedly connected with a second screw sleeve. A second screw rod adapted to the second screw sleeve is provided through the middle of the second screw sleeve. Both ends of the second screw rod are rotatably connected with second support blocks. Both of the second support blocks are fixedly installed on the surface of the folding plate. A second motor is fixedly installed on the surface of the second support block at the end of the second screw rod. The output end of the second motor is fixedly connected to the second screw rod. A threaded rod is fixedly connected to the top of the sliding column.

[0010] Preferably, the ink plugging mechanism includes a first electric telescopic rod fixedly installed at the bottom of the installation plate. A second electric telescopic rod is fixedly installed at the end of the first electric telescopic rod. The second electric telescopic rod is slidably connected to the bottom of the bottom plate. The end of the second electric telescopic rod is fixedly connected with a connecting block. The connecting block is slidably connected to the bottom of the bottom plate. A filling pump is fixedly installed on the surface of the connecting block. The output end of the filling pump is fixedly connected with a filling pipe.

[0011] Preferably, a fixed limiting ring is sleeved on the surface of the connecting column above the connecting plate.

[0012] Preferably, a nut connected by threading is sleeved on the top of the threaded rod.

[0013] In a second aspect, a method for plugging ink into inner vias of a multi-layer printed circuit board is provided. Based on the device for plugging ink into inner vias of a multi-layer printed circuit board, the method is characterized in that the method includes:

[0014] Fixed multi-layer printed circuit board: The position in the longitudinal axis direction of the threaded rod is adjusted by driving the first screw rod with the first motor, and the position in the transverse axis direction of the threaded rod is adjusted by driving the second screw rod with the second motor. After adjusting the positions of all four threaded rods, the multi-layer printed circuit board is fixed by the threaded rods;

[0015] Ink filling for through holes in multi-layer printed circuit board: Each through hole in the multi-layer printed circuit board is subjected to ink filling operation by an ink filling mechanism

[0016] Preferably, the fixing of the multi-layer printed circuit board by the threaded rods specifically includes:

[0017] By removing the nuts on each threaded rod, the fixing holes of the multi-layer printed circuit board are respectively sleeved onto the four threaded rods, and by screwing on the nuts on each threaded rod, the fixing of the multi-layer printed circuit board is completed.

[0018] Preferably, the ink filling operation for each through hole in the multi-layer printed circuit board by the ink filling mechanism specifically includes:

[0019] The position of the filling tube on the filling pump is adjusted by the first electric telescopic rod and the second electric telescopic rod, and the ink filling operation is respectively carried out for each through hole in the multi-layer printed circuit board.

[0020] (III) Beneficial effects

[0021] For the device and method for ink filling of through holes in a multi-layer printed circuit board of the present invention, through the cooperation of the ink filling mechanism and the fixing mechanism, the problem that during the ink filling operation of through holes in the existing multi-layer printed circuit board, it is inconvenient to fix circuit boards of different sizes, resulting in inconvenient ink filling operation for through holes in the circuit board is effectively solved. Description of the drawings

[0022] Figure 1 It is a schematic diagram of the overall structure of the device of the present invention;

[0023] Figure 2 It is a structural diagram of the ink filling mechanism of the present invention;

[0024] Figure 3 It is a structural diagram of the placement frame of the present invention;

[0025] Figure 4 It is a structural diagram of the fixing mechanism of the present invention;

[0026] Figure 5 For the present invention Figure 4 The enlarged structural diagram at A in it.

[0027] Among them, 1. bottom plate; 2. top frame; 201. top hole; 3. support seat; 4. hydraulic telescopic rod; 5. placement frame; 501. adjustment hole; 6. mounting plate; 7. first electric telescopic rod; 8. second electric telescopic rod; 9. connecting block; 10. filling pump; 11. filling pipe; 12. first support block; 13. first motor; 14. first screw rod; 15. first screw sleeve; 16. connecting plate; 1601. sliding hole; 17. second support block; 18. second motor; 19. second screw rod; 20. second screw sleeve; 21. sliding rod; 22. sliding sleeve; 23. sliding column; 24. limiting ring; 25. threaded rod; 26. nut; 27. folding plate. Detailed implementation manners

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0029] Embodiment

[0030] As Figures 1-5 shown, an embodiment of the present invention provides a device for plugging ink into inner through-holes of a multi-layer printed circuit board, including a bottom plate 1. A top frame 2 is fixedly installed on the top of the bottom plate 1. A support seat 3 is fixedly installed on the top of the top frame 2. A hydraulic telescopic rod 4 is fixedly installed on the top of the support seat 3. A top hole 201 is provided on the top of the top frame 2. The end of the output end of the hydraulic telescopic rod 4 extending into the top hole 201 is fixedly installed with a mounting plate 6. A mechanism for plugging ink is fixedly installed on the bottom surface of the mounting plate 6;

[0031] A placement frame 5 is fixedly installed in the middle of the bottom plate 1. Four adjustment holes 501 are provided on the surface of the placement frame 5. The four adjustment holes 501 are arranged in an array with the central axis of the bottom plate 1 as the axis. Fixed mechanisms are installed on the surface of the bottom plate 1 below the adjustment holes 501. Each fixed mechanism includes four folding plates 27 fixedly installed on the surface of the bottom plate 1. The four shielding plates are respectively located directly below the four adjustment holes 501. Two symmetrically distributed first support blocks 12 are fixedly installed on the surface of the folding plate 27. A first screw rod 14 is rotatably installed between the two first support blocks 12. A first motor 13 is fixedly installed on the surface of the first support block 12 on one side of the end of the first screw rod 14. The output end of the first motor 13 is fixedly connected to the first screw rod 14. A first nut 15 that fits is sleeved in the middle of the first screw rod 14. A connecting plate 16 is fixedly installed at the top of the first nut 15. A sliding hole 1601 is provided in the middle of the connecting plate 16. A sliding column 23 is slidably connected in the middle of the sliding hole 1601. The bottom of the sliding column 23 is fixedly connected to a sliding sleeve 22. A sliding rod 21 is slidably connected in the middle of the sliding sleeve 22. One end of the sliding rod 21 is fixedly connected to a second nut 20. A second screw rod 19 is passed through the middle of the second nut 20. Both ends of the second screw rod 19 are rotatably connected to second support blocks 17. Both second support blocks 17 are fixedly installed on the surface of the folding plate 27. A second motor 18 is fixedly installed on the surface of the second support block 17 at the end of the second screw rod 19. The output end of the second motor 18 is fixedly connected to the second screw rod 19. The top of the sliding column 23 is fixedly connected to a threaded rod 25.

[0032] As a further solution of the embodiment of the present invention, the ink filling mechanism includes a first electric telescopic rod 7 fixedly installed at the bottom of the mounting plate 6. The end of the first electric telescopic rod 7 is fixedly installed with a second electric telescopic rod 8. The second electric telescopic rod 8 is slidably connected to the bottom of the bottom plate 1. The end of the second electric telescopic rod 8 is fixedly connected to a connecting block 9. The connecting block 9 is slidably connected to the bottom of the bottom plate 1. A filling pump 10 is fixedly installed on the surface of the connecting block 9. The output end of the filling pump 10 is fixedly connected to a filling pipe 11.

[0033] As a further solution of the embodiment of the present invention, a fixed connection limiting ring 24 is sleeved on the connecting column above the connecting plate 16.

[0034] As a further solution of the embodiment of the present invention, a nut 26 that is threadedly connected is sleeved on the top of the threaded rod 25.

[0035] Another embodiment of the present invention provides a method for plugging ink into the inner through holes of a multi-layer printed circuit board, based on the device for plugging ink into the inner through holes of a multi-layer printed circuit board, which is characterized in that the method includes:

[0036] Fixed multi-layer printed circuit board: The position of the threaded rod 25 in the longitudinal axis direction is adjusted by driving the first screw rod 14 with the first motor 13, and the position of the threaded rod 25 in the transverse axis direction is adjusted by driving the second screw rod 19 with the second motor 18. After adjusting the positions of all four threaded rods 25, the multi-layer printed circuit board is fixed by the threaded rods 25;

[0037] Plugging ink into the through-holes in the multi-layer printed circuit board: The plugging ink operation is performed on each through-hole in the multi-layer printed circuit board by the ink plugging mechanism respectively

[0038] As a further solution of the embodiment of the present invention, the multi-layer printed circuit board is fixed by the threaded rods 25, specifically including:

[0039] By removing the nuts 26 on each threaded rod 25, the fixing holes of the multi-layer printed circuit board are respectively plugged onto the four threaded rods 25, and by screwing on the nuts 26 on each threaded rod 25, the fixing of the multi-layer printed circuit board is completed.

[0040] As a further solution of the embodiment of the present invention, the plugging ink operation is performed on each through-hole in the multi-layer printed circuit board by the ink plugging mechanism respectively, specifically including:

[0041] The position of the filling tube 11 on the filling pump 10 is adjusted by the first electric telescopic rod 7 and the second electric telescopic rod 8, and the plugging ink operation is performed on each through-hole in the multi-layer printed circuit board respectively.

[0042] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

Claims

1. An apparatus for plugging ink into through-holes in a multilayer printed circuit board, characterized in that It includes a bottom plate (1), a top frame (2) is fixedly installed on the top of the bottom plate (1), a support seat (3) is fixedly installed on the top of the top frame (2), a hydraulic telescopic rod (4) is fixedly installed on the top of the support seat (3), a top hole (201) is provided on the top of the top frame (2), and an installation plate (6) is fixedly installed at the end of the output end of the hydraulic telescopic rod (4) extending into the top hole (201). An ink plugging mechanism is fixedly installed on the bottom surface of the installation plate (6). A placement frame (5) is fixedly installed in the middle of the bottom plate (1). Four adjustment holes (501) are provided on the surface of the placement frame (5). The four adjustment holes (501) are arranged in an array with the central axis of the bottom plate (1) as the axis. Fixing mechanisms are installed on the surface of the bottom plate (1) below the adjustment holes (501). The fixing mechanisms each include four folding plates (27) fixedly installed on the surface of the bottom plate (1). The four folding plates are respectively located directly below the four adjustment holes (501). Two symmetrically distributed first support blocks (12) are fixedly installed on the surface of each folding plate (27). A first screw rod (14) is rotatably installed between the two first support blocks (12). A first motor (13) is fixedly installed on the surface of the first support block (12) on one side of the end of the first screw rod (14). The output end of the first motor (13) is fixedly connected to the first screw rod (14). A first screw sleeve (15) that fits is sleeved on the middle of the first screw rod (14). A connecting plate (16) is fixedly installed on the top of the first screw sleeve (15). A sliding hole (1601) is provided in the middle of the connecting plate (16). A sliding column (23) is slidably connected in the middle of the sliding hole (1601). The bottom of the sliding column (23) is fixedly connected to a sliding sleeve (22). A sliding rod (21) is slidably connected in the middle of the sliding sleeve (22). One end of the sliding rod (21) is fixedly connected to a second screw sleeve (20). A second screw rod (19) that fits is passed through the middle of the second screw sleeve (20). Both ends of the second screw rod (19) are rotatably connected to second support blocks (17). Both of the second support blocks (17) are fixedly installed on the surface of the folding plate (27). A second motor (18) is fixedly installed on the surface of the second support block (17) at the end of the second screw rod (19). The output end of the second motor (18) is fixedly connected to the second screw rod (19). The top of the sliding column (23) is fixedly connected to a threaded rod (25).

2. The device for plugging ink into inner vias of a multi-layer printed circuit board according to claim 1, characterized in that: The ink plugging mechanism includes a first electric telescopic rod (7) fixedly installed at the bottom of the installation plate (6). A second electric telescopic rod (8) is fixedly installed at the end of the first electric telescopic rod (7). The second electric telescopic rod (8) is slidably connected to the bottom of the bottom plate (1). The end of the second electric telescopic rod (8) is fixedly connected to a connecting block (9). The connecting block (9) is slidably connected to the bottom of the bottom plate (1). A filling pump (10) is fixedly installed on the surface of the connecting block (9). The output end of the filling pump (10) is fixedly connected to a filling pipe (11).

3. The device for plugging ink into inner vias of a multilayer printed circuit board according to claim 1, characterized in that: A limiting ring (24) fixedly connected is sleeved on the surface of the sliding column above the connecting plate (16).

4. An apparatus for plugging ink into through-holes in a multi-layer printed circuit board according to claim 1, characterized in that: A nut (26) connected by thread is sleeved on the top of the threaded rod (25).

5. A method for plugging through-holes in a multi-layer printed circuit board with ink, based on the device for plugging through-holes in a multi-layer printed circuit board with ink according to any one of claims 1-4, characterized in that, The method includes: Fixing a multilayer printed circuit board: driving a first screw rod (14) by a first motor (13) to adjust the position of the threaded rod (25) in the longitudinal axis direction, driving a second screw rod (19) by a second motor (18) to adjust the position of the threaded rod (25) in the transverse axis direction. After adjusting the positions of all four threaded rods (25), fixing the multilayer printed circuit board by the threaded rods (25); Plugging ink into through holes in the multilayer printed circuit board: performing an ink plugging operation on each through hole in the multilayer printed circuit board respectively through an ink plugging mechanism.

6. A method for plugging ink into through-holes in a multi-layer printed circuit board according to claim 5, characterized in that: The fixing of the multilayer printed circuit board by the threaded rod (25) specifically includes: By removing the nuts (26) on each threaded rod (25), respectively inserting the fixing holes of the multilayer printed circuit board onto the four threaded rods (25), and by screwing on the nuts (26) on each threaded rod (25), the fixing of the multilayer printed circuit board is completed.

7. A method for plugging ink into through-holes in a multi-layer printed circuit board according to claim 5, characterized in that: The performing of the ink plugging operation on each through hole in the multilayer printed circuit board respectively through the ink plugging mechanism specifically includes: Adjusting the position of a filling tube (11) on a filling pump (10) by a first electric telescopic rod (7) and a second electric telescopic rod (8), and respectively performing an ink plugging operation on each through hole in the multilayer printed circuit board.

Citation Information

Patent Citations

  • Device and method for plugging ink into through hole in multilayer printed circuit board

    CN115297616A

  • Circuit board with photosensitive anti-corrosion ink layer

    CN210075695U