Method for producing resin molded product

Abstract

The present invention improves the quality and appearance of a second molded product such as a secondary molded product obtained by further resin molding a first molded product such as a primary molded product, and is a method for manufacturing a resin molded product, wherein a first molded product (P1) that has been resin molded is further resin molded using a first mold (2) having a mold cavity (2C) and a second mold (3) facing the first mold (2) to obtain a second molded product (P2), and the method for manufacturing the resin molded product comprises: a configuration step, in which the first molded product (P1) is configured in the mold cavity (2C) and a resin material (J) is configured on the first molded product (P1); and a clamping step, in which the first mold (2) and the second mold (3) are clamped after the configuration step.

Description

Technical Field

[0001] The present invention relates to a method for producing a resin molded product. Background Art

[0002] Conventionally, as disclosed in Patent Document 1, there is a method of manufacturing a resin molded product as a secondary molded product by further performing secondary molding by resin sealing on a primary molded product obtained by primary molding.

[0003] As an example of the manufacturing method, Figure 5 As shown, the resin material is contained in the cavity of the lower mold for primary molding, and the carrier is held in the upper mold, and the lower mold is molded with the upper mold, thereby obtaining a primary molded product (primary molding process). In addition, the primary molded product is peeled off from the carrier, and intermediate installation such as rewiring is performed on its upper surface. Then, the primary molded product installed in the middle is turned upside down and held by adsorption on the upper mold, and the resin material is contained in the lower mold for secondary molding, and the lower mold for secondary molding is molded with the upper mold, thereby obtaining a secondary molded product (secondary molding process).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. 2017 / 160231 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, in the manufacturing method, the secondary molded product is obtained by holding the primary molded product by suction and performing mold closing, so suction marks remain on the secondary molded product, which deteriorates the appearance of the secondary molded product and affects the reliability of the product.

[0009] In addition, if the resin material is contained in the cavity of the lower mold during secondary molding, the resin material will be heated directly from the lower mold and the temperature will rise, so the melting time of the resin material after the mold is closed is limited. In this way, the temperature of the resin material after the mold is closed is difficult to become uniform, and the viscosity of the resin material will vary. As a result, thermal stress is applied to the secondary molded product, which may cause warping, or spots or flow marks on the surface.

[0010] Therefore, the present invention is made to solve the above-mentioned problems, and a main subject thereof is to improve the quality and appearance of a second molded product such as a secondary molded product obtained by further resin molding a first molded product such as a primary molded product.

[0011] Technical means of solving problems

[0012] That is, the method for manufacturing a resin molded product of the present invention uses a first mold having a mold cavity and a second mold facing the first mold to further resin mold a first molded product that has been resin molded to obtain a second molded product, and the method for manufacturing a resin molded product is characterized in that it includes: a configuration step, in which the first molded product is configured in the mold cavity and a resin material is configured on the first molded product; and a clamping step, in which the first mold and the second mold are clamped after the configuration step.

[0013] Effects of the Invention

[0014] According to the present invention thus constituted, for example, the quality and appearance of a second molded product such as a secondary molded product obtained by further resin molding a first molded product such as a primary molded product can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a cross-sectional view schematically showing the structure of a resin molding apparatus during primary molding according to one embodiment of the present invention.

[0016] Figure 2 It is a cross-sectional view schematically showing the structure of the resin molding device of the embodiment during secondary molding.

[0017] Figure 3 This is a cross-sectional view schematically showing a state in which a primary molded product and a resin material are arranged in a cavity and a cover plate is sucked and held by an upper mold in the above embodiment.

[0018] Figure 4 It is a figure which shows typically each process of the manufacturing method of the resin molded product of the said embodiment.

[0019] Figure 5 It is a diagram schematically showing a conventional primary molding process and a secondary molding process.

[0020] Explanation of symbols

[0021] 100: Resin molding device

[0022] J: Resin material

[0023] P1: Primary molded product (first molded product)

[0024] P2: Secondary molded product (second molded product)

[0025] 2: Lower mold (first mold)

[0026] 2C: Cavity

[0027] 3: Upper mold (second mold)

[0028] 3P: Die Surface

[0029] 7: Cover

[0030] 8: Peel off sheet DETAILED DESCRIPTION

[0031] Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following description.

[0032] As described above, the method for manufacturing a resin molded product of the present invention uses a first mold having a mold cavity and a second mold facing the first mold to further resin mold a first molded product that has been resin molded to obtain a second molded product, and the method for manufacturing a resin molded product is characterized in that it includes: a configuration step, in which the first molded product is configured in the mold cavity and a resin material is configured on the first molded product; and a clamping step, in which the first mold and the second mold are clamped after the configuration step.

[0033] In the case of the manufacturing method of the resin molded product, resin material is arranged on the first molded product in the mold cavity of the first mold, and the first mold and the second mold are clamped together in the above state. Therefore, there is no need to adsorb and hold the first molded product on the second mold, and thus no adsorption marks will be produced on the second molded product.

[0034] In addition, the resin material receives heat from the first mold via the first molded product, so the temperature of the resin material rises slowly, thereby extending the melting time and improving the temperature uniformity of the resin material. As a result, it is less likely that thermal stress will remain in the second molded product, thereby suppressing deformation such as warping. In addition, since the temperature uniformity of the resin material is improved, it is less likely that spots or flow marks will be generated on the surface of the second molded product.

[0035] Conventionally, the forming mold (particularly the lower mold) of the second molded product such as the secondary molded product is different from the forming mold of the first molded product such as the primary molded product. In this case, in order to obtain the second molded product, the forming mold needs to be replaced, and the replacement operation becomes complicated. In addition, the initial cost (equipment investment) will also increase.

[0036] In order to appropriately solve the above problem, the first mold and the second mold are preferably configured using a molding die of the first molded product.

[0037] In this case, it is conceivable that the depth of the cavity of the first mold is adjusted so that the second molded product is deeper when the resin is molded than when the resin is molded for the first molded product.

[0038] As specific implementations of the arrangement step, the following two aspects are conceivable.

[0039] In a first aspect, the arranging step includes: a step of arranging the first molded product in the mold cavity; and a step of arranging a resin material on the first molded product arranged in the mold cavity.

[0040] According to the above aspect, the first molded product and the resin material are separately conveyed to the cavity, so that both can be reliably conveyed.

[0041] In a second aspect, the arranging step includes: a step of arranging a resin material on the first molded product; and a step of arranging the first molded product on which the resin material is arranged in the mold cavity.

[0042] According to the above aspect, the resin material and the first molded product can be placed in the cavity at once.

[0043] For example, when a second molding such as secondary molding is performed using a molding die for a first molding such as primary molding, if the shrinkage amount of the first molded product is small, it is considered that it is difficult to enter the mold cavity of the first mold when molding the second molded product.

[0044] In this case, it is desirable to further include a processing step of processing the first molded product before the arranging step.

[0045] By removing part or all of the outer periphery of the first molded product through the processing step, the first molded product can be easily arranged in the cavity of the first mold.

[0046] It is desirable that the mold clamping step is performed in a state where the mold surface of the second mold is covered with a cover plate having rigidity that maintains its own shape.

[0047] If the structure is as described above, the operating cost and waste cost generated by using the release film in the second mold can be reduced. In addition, since the cover plate has the rigidity to maintain its own shape and includes a component that can maintain its own shape in a natural state, the cover plate conveying mechanism for conveying the cover plate can be simplified. For example, it can be conveyed by a conveying mechanism having the same structure as the conveying mechanism for conveying the first molded product. Furthermore, since the cover plate is not as soft as the release film and maintains its shape in a natural state without external force except gravity, no wrinkles will be generated when it is installed on the mold surface of the second mold, and the mold structure will not be as complicated as when a release film is used.

[0048] It is desirable that a release sheet is attached to the surface of the cover plate that contacts the resin material.

[0049] According to the above structure, the attached resin can be removed simply by peeling off the release sheet after the resin is formed, and the cover plate can be used arbitrarily, and the cleaning operation of the cover plate can be facilitated.

[0050] In order to appropriately prevent the resin from adhering to the mold surface of the second mold, it is desirable that the outer shape of the cover plate in a plan view is larger than the outer shape of the cavity in a plan view.

[0051] <One embodiment of the present invention>

[0052] Hereinafter, an embodiment of the method for manufacturing a resin molded product of the present invention will be described with reference to the accompanying drawings. In addition, for ease of understanding, any of the following figures are schematically depicted in an appropriately omitted or exaggerated manner. The same constituent elements are marked with the same symbols and the description is appropriately omitted.

[0053] The method for manufacturing a resin molded product of the present embodiment manufactures a second molded product as a resin molded product by further performing resin molding by compression molding on a first molded product that has been resin molded by, for example, compression molding, using a lower mold 2 as a first mold having a mold cavity 2C formed therein and an upper mold 3 as a second mold disposed opposite to the lower mold 2. Hereinafter, a primary molded product P1 obtained by primary molding is referred to as a first molded product, and a secondary molded product P2 obtained by further performing resin molding on the primary molded product P1 is referred to as a second molded product.

[0054] Specifically, the manufacturing method of the resin molded product includes: a primary molding process, in which a substrate W serving as a carrier is resin-molded to obtain a primary molded product P1; and a secondary molding process, in which the primary molded product P1 obtained by the primary molding process is further resin-molded to obtain a secondary molded product P2, and the two processes are performed using the same resin molding device 100.

[0055] <Structure of resin molding device 100>

[0056] The resin forming device 100 is a resin forming device of a compression forming (compression molding) method, and Figure 1 and Figure 2 As shown, the mold assembly includes: a lower mold 2 having a cavity 2C, an upper mold 3 arranged to face the cavity 2C of the lower mold 2 , and a mold clamping mechanism 4 to which the lower mold 2 and the upper mold 3 are mounted and to clamp the lower mold 2 and the upper mold 3 .

[0057] The mold clamping mechanism 4 includes a movable platen 41 to which the lower mold 2 is mounted, an upper fixed platen 42 to which the upper mold 3 is mounted, and a driving mechanism 43 for moving the movable platen 41 upward and downward.

[0058] The movable platen 41 has the lower mold 2 mounted on its upper surface and is supported by a plurality of pillars 45 erected on the lower fixed platen 44 so as to be movable up and down. In addition, the upper fixed platen 42 has the upper mold 3 mounted on its lower surface and is fixed so as to face the movable platen 41 at the upper ends of the plurality of pillars 45.

[0059] The driving mechanism 43 is disposed between the movable platen 41 and the lower fixed platen 44, and moves the movable platen 41 up and down to close the lower mold 2 and the upper mold 3. The driving mechanism 43 of the present embodiment is a direct-acting driving mechanism that uses a ball screw mechanism 431 that converts the rotation of a servo motor or the like into a linear motion to move the movable platen 41 up and down, but may also be a connecting rod type driving mechanism that uses a connecting rod mechanism such as a toggle link to transmit a power source such as a servo motor to the movable platen 41.

[0060] A lower mold holding portion 46 is provided between the lower mold 2 and the movable platen 41. The lower mold holding portion 46 includes a heating plate 461 for heating the lower mold 2, a heat insulating member 462 provided on the lower surface of the heating plate 461, and a side wall member 463 provided on the upper surface of the heating plate 461 and surrounding the lower mold 2. In addition, an upper mold holding portion 47 is provided between the upper mold 3 and the upper fixed platen 42. The upper mold holding portion 47 includes a heating plate 471 for heating the upper mold 3, a heat insulating member 472 provided on the upper surface of the heating plate 471, a side wall member 473 provided on the lower surface of the heating plate 471 and surrounding the upper mold 3, and a sealing member 474 provided at the lower end of the side wall member 473. Moreover, when the mold is closed by the driving mechanism 43, the side wall member 463 is in close contact with the sealing member 474 of the side wall member 473, so that the space for accommodating the lower mold 2 and the upper mold 3 is isolated from the outside air. In addition, the sealing member may also be disposed at the upper end of the side wall member 463 instead of being disposed at the lower end of the side wall member 473 .

[0061] The lower mold 2 is used for both the primary molding process and the secondary molding process. The cavity 2C of the lower mold 2 receives the resin material J in the primary molding process (see Figure 1 ), the primary molded product P1 and the resin material J are received in the secondary molding process (refer to Figure 2 ) In addition, as the resin material J, for example, a granular resin can be used.

[0062] Specifically, the lower mold 2 includes a bottom member 201 as a single member forming a planar bottom surface of the cavity 2C, and side members 202 surrounding the bottom member 201. The upper surface of the bottom member 201 and the inner peripheral surface of the side member 202 form the cavity 2C.

[0063] The side member 202 is arranged to be able to move up and down relative to the bottom member 201. Specifically, the base plate 203 relative to the lower mold 2 is supported by a plurality of elastic members 204 such as coil springs. In addition, the lower mold 2 of this embodiment is covered with a release film 5 to improve the demolding properties of the primary molded product P1 and the secondary molded product P2. In addition, a vent (not shown) for exhausting air or gas may also be provided on the upper surface of the side member 202 (the contact surface between the side member 202 and the substrate W).

[0064] Here, the lower mold 2 is configured to be adjustable so that the depth of the cavity 2C during the resin molding of the secondary molded product P2 (secondary molding step) is deeper than the depth of the cavity 2C during the resin molding of the primary molded product P1 (primary molding step).

[0065] Specifically, we can consider Figure 2 As shown in FIG. 1 , by interposing a spacer member 6 such as a gasket between the base plate 203 of the lower mold 2 and the elastic member 204, the relative height of the side member 202 with respect to the bottom member 201 is adjusted, thereby adjusting the depth of the mold cavity 2C. For example, in the primary molding process, it is conceivable that the spacer member 6 is not interposed between the base plate 203 and the elastic member 204 (see FIG. 1 ). Figure 1 ), in the secondary molding process, the spacer member 6 is interposed between the base plate 203 and the elastic member 204 (refer to Figure 2 ), thereby making the depth of the cavity 2C of the secondary molding process deeper than the depth of the cavity 2C of the primary molding process. In addition, the depth of each cavity 2C can also be adjusted by changing the thickness of the spacer member 6 in the primary molding process and the secondary molding process.

[0066] The upper mold 3 is used for both the primary molding process and the secondary molding process. The mold surface 3P of the upper mold 3 is flat, and in the primary molding process, it absorbs and holds the back side of the substrate W (see Figure 1 ), the cover plate 7 which replaces the mold release film is adsorbed and held in the secondary molding process (refer to Figure 2 ). Here, if Figure 3 As shown, a suction port 3h is formed on the lower surface of the upper mold 3, and a suction flow path 3R connected to the suction port 3h is formed inside the upper mold 3. The suction flow path 3R is connected to an external suction device (not shown).

[0067] The cover plate 7 used in the secondary forming is particularly as follows Figure 3 As shown, the mold surface 3P of the upper mold 3 is covered in such a manner that the resin material J does not adhere to the mold surface 3P of the upper mold 3. The cover plate 7 of this embodiment has rigidity to maintain its own shape, and includes a member having rigidity to maintain its own shape (e.g., a flat plate shape) in a natural state where no force other than gravity is applied from the outside. The cover plate 7 is made of metal, resin, or paper, for example.

[0068] In addition, the thickness of the cover plate 7 depends on the material, but is generally preferably about 0.2 mm to about 0.5 mm. If it is thinner than about 0.2 mm, it is sometimes difficult to maintain its own shape in the natural state. On the other hand, if it is thicker than about 0.5 mm, it is sometimes difficult to support its own weight and maintain its own shape in the natural state depending on the size. In addition, it will lead to increased costs or deterioration of operability caused by increased weight. In the case of paper in particular, if it is thicker than about 0.5 mm, the amount of deformation caused by pressing with the forming pressure will become larger, making it difficult to ensure the flatness of the resin molded part of the resin molded product.

[0069] Here, the so-called "having rigidity to maintain its own shape" means that the strength is set to a degree that the cover plate 7 will not be deformed by its own weight or the deformation caused by its own weight is negligible in practical terms when one end of the cover plate 7 is supported and the one end is in a cantilever state as a fixed end. Alternatively, the so-called "having rigidity to maintain its own shape" means that the strength is set to a degree that the cover plate 7 can be maintained in an upright state when the cover plate 7 is made vertical and the lower end is supported. In addition, the so-called "having rigidity to maintain its own shape" does not include the situation where it is easily deformed after being lifted, such as a release film, and cannot maintain its own shape and wrinkles may occur.

[0070] As a metal material, for example, a flat plate made of stainless steel or copper can be cited. As a resin material, for example, a flat plate made of plastic such as glass epoxy resin can be cited. As a paper material, for example, thick paper such as dustproof paper can be cited. Since the forming mold (lower mold 2, upper mold 3) is heated, the cover plate 7 is preferably heat-resistant.

[0071] Here, on the surface of the cover plate 7 in contact with the resin material J, it is desirable that Figure 3 As shown, a release sheet 8 is adhered. Here, when the release sheet 8 is a multi-layer structure, the outermost release sheet 8 can be peeled off after the secondary molding process and can be used in the next secondary molding process. When the release sheet 8 is a single-layer structure, the release sheet 8 can be peeled off after the secondary molding process and a new release sheet 8 can be adhered to the cover plate 7 and can be used in the next secondary molding process.

[0072] Furthermore, the outer shape of the cover plate 7 when viewed from above is larger than the outer shape of the cavity 2C when viewed from above. For example, when the cavity 2C is rectangular, it is possible to consider using a cover plate 7 having a rectangular shape larger than the cavity 2C, and when the cavity 2C is circular, it is possible to consider using a cover plate 7 having a circular shape larger than the cavity 2C. In this way, the cover plate 7 is larger than the cavity 2C, so that the molten resin material J can be prevented from contacting the mold surface 3P of the upper mold 3.

[0073] Furthermore, the cover plate 7 may be formed in the same shape as the substrate W used in the primary molding step in a plan view. Thus, the cover plate 7 can be positioned using positioning pins (not shown) provided on the substrate W of the upper mold 3 .

[0074] <Details of the method for producing resin molded products>

[0075] Next, refer to Figure 4 The details of the method for manufacturing a resin molded product using the resin molding apparatus 100 will be described.

[0076] <A. Primary forming process>

[0077] The primary molding process of this embodiment includes: a supply / holding process, in which resin material J is supplied to the mold cavity 2C of the lower mold 2, and the substrate W serving as a carrier is adsorbed and held on the upper mold 3; a clamping process, in which the lower mold 2 and the upper mold 3 are clamped and the substrate W is resin molded; and a peeling process, in which the primary molded product P1 obtained by resin molding is peeled off from the substrate W.

[0078] <A-1. Supply / holding process>

[0079] First, the resin material J measured by the resin material supply mechanism (not shown) is supplied to the cavity 2C of the opened lower mold 2. At this time, the resin material supply mechanism may place the measured resin material J on the release film 5, and bring the release film 5 carrying the resin material J into close contact with the cavity 2C, thereby supplying the resin material J to the cavity 2C. Alternatively, the release film 5 may be brought into close contact with the cavity 2C in advance, and the resin material supply mechanism may supply the measured resin material J to the cavity 2C to which the release film 5 is in close contact.

[0080] The substrate W is then transported to the mold surface 3P of the opened upper mold 3 by a transport mechanism (not shown) and held by suction on the mold surface 3P of the opened upper mold 3. At this time, the substrate W is positioned by positioning pins (not shown) provided on the mold surface 3P of the upper mold 3.

[0081] <A-2. Mold closing process>

[0082] Then, after the resin material J is melted in the lower mold 2, the lower mold 2 and the upper mold 3 are clamped by a clamping mechanism 4 at a predetermined clamping pressure. After a predetermined time has passed, the clamping mechanism 4 lowers the lower mold 2 and the upper mold 3 are opened. Thus, a flat plate-shaped primary molded product P1 is formed by resin on the substrate W.

[0083] <A-3. Peeling process>

[0084] After the mold closing process, the substrate W (including the substrate W of the primary molded product P1) molded by the resin is received from the upper mold 3 after the mold opening by a conveying mechanism (not shown). Then, the primary molded product P1 is peeled off from the substrate W by a peeling mechanism (not shown). The peeled primary molded product P1 is stored in a primary molded product storage unit (not shown) or the like. In addition, after the mold closing process, the release film 5 of the lower mold 2 is also removed separately. In this way, the primary molding process is completed.

[0085] Here, in the manufacturing method of the resin molded product of the present embodiment, between the primary molding process and the secondary molding process, there is a processing process for removing part or all of the outer periphery of the primary molding product P1 in cooperation with the secondary molding process described later when the shrinkage amount of the primary molding product P1 is small, and an intermediate installation process for performing intermediate installation such as rewiring of the primary molding product P1.

[0086] <B. Processing steps>

[0087] The outer shape of the primary molded product P1 that has been stripped and cooled to room temperature through the stripping process is measured. When the resin shrinkage of the primary molded product P1 is small, the outer periphery of the primary molded product P1 is removed by grinding or the like as needed. In addition, the outer shape of the primary molded product P1 may not be measured, but the outer periphery of the primary molded product P1 may be removed by grinding or the like. Thus, the primary molded product P1 can be reliably arranged in the mold cavity 2C in the secondary molding process. The processing step may be performed using a processing device different from the resin molding device 100 described above, but may also be performed inside the resin molding device 100 by providing the resin molding device 100 with a processing function.

[0088] <C. Intermediate installation process>

[0089] Intermediate installation such as redistribution wiring (not shown) is performed on one side (e.g., the side peeled from the substrate W) of the primary molded product P1 peeled from the substrate W. Thus, an intermediate installation surface P1x is formed on the primary molded product P1. The intermediate installation process may be performed using an intermediate installation device different from the resin molding device 100, but may also be performed inside the resin molding device 100 by providing the resin molding device 100 with an intermediate installation function.

[0090] <D. Secondary molding process>

[0091] The secondary molding process of this embodiment is performed after the intermediate installation process. Before the secondary molding process is performed, the depth of the cavity 2C of the lower mold 2 of the resin molding device 100 is adjusted based on the set value of the thickness of the secondary molded product P2. In addition, the depth adjustment method of the cavity 2C can be considered as follows: Figure 2As shown, this is performed by interposing a spacer member 6 such as a gasket between the base plate 203 of the lower mold 2 and the elastic member 204 .

[0092] Specifically, the secondary molding process includes: a configuration process, in which a primary molded product P1 is configured in the mold cavity 2C, and a resin material J is configured on the primary molded product P1; a holding process, in which the cover plate 7 is held on the upper mold 3; a clamping process, in which the lower mold 2 and the upper mold 3 are clamped and the primary molded product P1 is resin molded; and a stripping process, in which the secondary molded product P2 obtained by resin molding is stripped from the cover plate 7.

[0093] <D-1. Arrangement process>

[0094] The arrangement step includes the step of arranging the primary molded product P1 in the mold cavity 2C, and the step of arranging the resin material J measured by the resin material supply mechanism (not shown) on the primary molded product P1 arranged in the mold cavity 2C. Here, the primary molded product P1 arranged in the mold cavity 2C is arranged in such a manner that its middle mounting surface P1x faces upward. In addition, the resin material J, while being arranged on the primary molded product P1, receives heat from the lower mold 2 through the primary molded product P1 and begins to melt.

[0095] The process of placing the primary molded product P1 in the cavity 2C may include placing the primary molded product P1 on the release film 5 and placing the primary molded product P1 in the cavity 2C by adsorbing the release film 5 on which the primary molded product P1 is placed.

[0096] Furthermore, the placement step may include a step of placing the measured resin material J on the primary molded product P1 and a step of placing the primary molded product P1 on which the resin material J is placed in the cavity 2C.

[0097] In addition, the process of configuring the primary molded product P1 configured with resin material J in the mold cavity 2C can consider placing the primary molded product P1 configured with resin material J on the release film 5, and allowing the release film 5 carrying the primary molded product P1 to be adsorbed on the mold cavity 2C, while configuring the primary molded product P1 configured with resin material J in the mold cavity 2C.

[0098] <D-2. Holding process>

[0099] In the holding step, the cover plate 7 is transported by a transport mechanism (not shown) and held by suction on the mold surface 3P of the upper mold 3 that has been opened. At this time, the cover plate 7 is positioned by positioning pins (not shown) provided on the mold surface 3P of the upper mold 3. The cover plate 7 of this embodiment has the same shape as the substrate W, and is positioned using the positioning pins of the substrate W.

[0100] <D-3. Mold closing process>

[0101] Then, after the resin material J is melted in the lower mold 2, the lower mold 2 and the upper mold 3 are clamped by the clamping mechanism 4 using a specified clamping pressure. After a specified time, the lower mold 2 is lowered by the clamping mechanism 4 and the lower mold 2 and the upper mold 3 are opened. Thus, a flat secondary molded product P2 is resin-formed on the cover plate 7. The secondary molded product P2 has an appearance substantially the same as that of the primary molded product P1 when viewed from above. In addition, the primary molded product P1 that has been thermally shrunk or has its periphery removed will be overmolded when it is contained in the mold cavity 2C and there is a gap between it and the inner peripheral surface of the mold cavity 2C (the inner peripheral surface of the side member 202).

[0102] <D-4. Peeling process>

[0103] After the mold closing process, the cover plate 7 (including the cover plate 7 of the secondary molded product P2) molded by the resin is received from the upper mold 3 after the mold opening by a conveying mechanism (not shown). Then, the secondary molded product P2 is peeled off from the cover plate 7 by a peeling mechanism (not shown). The peeled secondary molded product P2 is accommodated in a secondary molded product accommodating portion not shown, etc. In addition, after the mold closing process, the release film 5 of the lower mold 2 is also removed separately. In this way, the secondary molding process is completed.

[0104] <Effects of the present embodiment>

[0105] According to the resin molding device 100 of this embodiment, since the resin material J is arranged on the primary molded product P1 in the mold cavity 2C of the lower mold 2, and the lower mold 2 and the upper mold 3 are clamped together in the said state, there is no need to adsorb and hold the primary molded product P1 on the upper mold 3, so that no adsorption marks are generated on the secondary molded product P2.

[0106] In addition, since the resin material J receives heat from the lower mold 2 via the primary molded product P1, the temperature rise of the resin material J becomes slow, so that the melting time can be extended, and the temperature uniformity of the resin material J can be improved. As a result, thermal stress is less likely to remain in the secondary molded product P2, and deformation such as warping can be suppressed. In addition, since the temperature uniformity of the resin material J is improved, spots and flow marks are less likely to be generated on the surface of the secondary molded product P2.

[0107] Furthermore, in this embodiment, since the same forming dies 2 and 3 are used in the primary forming and the secondary forming, it is not necessary to replace the forming dies between the primary forming and the secondary forming, and the acquisition cost (equipment investment) can be suppressed.

[0108] Furthermore, since the mold surface 3P of the upper mold 3 is covered with the cover plate 7 during the secondary molding, it is not necessary to use a mold release film on the upper mold 3, and the resin can be prevented from adhering to the mold surface 3P of the upper mold 3. Therefore, the running cost and the disposal cost caused by using a mold release film on the upper mold 3 can be reduced.

[0109] Furthermore, since the cover plate 7 has rigidity to maintain its own shape and includes a member that can maintain its own shape in a natural state, the cover plate conveying mechanism for conveying the cover plate 7 can be simplified. For example, the cover plate 7 can be conveyed by a conveying mechanism having the same structure as the conveying mechanism for conveying the substrate W or the primary molded product. Furthermore, since the cover plate 7 is not as soft as a release film and maintains its shape in a natural state where no force is applied from the outside except gravity, wrinkles will not be generated when it is installed on the mold surface 3P of the upper mold 3, and the mold structure will not be as complicated as when a release film is used.

[0110] Furthermore, since the release sheet 8 is adhered to the surface of the cover plate 7 in contact with the resin material P, the adhered resin can be removed simply by peeling off the release sheet 8 after the secondary molding, and the cleaning operation of the cover plate 7 can be facilitated.

[0111] <Other Modified Embodiments>

[0112] In addition, the present invention is not limited to the above-described embodiments.

[0113] For example, in the above embodiment, the first molded product is a primary molded product P1 and the second molded product is a secondary molded product P2, but the first molded product may be a secondary molded product and the second molded product may be a tertiary molded product, or the first molded product may be a tertiary molded product and the second molded product may be a quaternary molded product. That is, the present invention is also applicable to a case where the first molded product is a secondary or higher molded product.

[0114] In addition, in the above-described embodiment, the cover plate 7 is held by suction on the upper mold 3 during secondary molding, but in addition to the structure of holding by suction, a structure of holding the cover plate 7 by a clamping mechanism may be used. Alternatively, a structure of holding the cover plate 7 by a clamping mechanism may be used instead of the structure of holding by suction. Here, the clamping mechanism is provided around the upper mold 3 and is hooked on the lower surface of the outer edge of the cover plate 7 to hold the cover plate 7.

[0115] Furthermore, the cover sheet 7 itself may be formed by stacking a plurality of peelable films, and the outermost film of the cover sheet 7 may be peeled off for use each time the secondary molding is performed.

[0116] In the above-described embodiment, the primary molding process includes a processing step, but may not include a processing step. In addition, the peripheral portion of the primary molded product may be removed by the processing step, thereby adjusting the amount of resin molded around the primary molded product (overmolded amount) during the secondary molding.

[0117] In the above-described embodiment, the primary molding step and the secondary molding step are performed by the same resin molding device, but they may be performed by using different resin molding devices.

[0118] In the above-described embodiment, the resin material is a granular resin, but may be a liquid resin.

[0119] In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

[0120] Industrial Applicability

[0121] According to the present invention, the quality and appearance of a second molded product such as a secondary molded product obtained by further resin molding a first molded product such as a primary molded product can be improved.

Claims

1. A method for manufacturing a resin molded product, comprising: a primary molding step of molding a substrate with a resin using a lower mold having a mold cavity and an upper mold facing the lower mold to obtain a first molded product; and A secondary molding step is to further perform resin molding on the first molded product using the lower mold and the upper mold to obtain a second molded product. The one-step forming process includes: a supply / holding step of supplying a resin material to the cavity and holding the substrate by adsorption to the upper mold, a mold clamping step of clamping the lower mold and the upper mold to resin-mold the first molded product on the substrate after the supply / holding step, and a peeling step of peeling the first molded product formed of resin from the substrate, The secondary forming process comprises: a placement step of placing the first molded product in the mold cavity and placing a resin material on the first molded product; a holding step of holding the cover plate having a rigidity for maintaining its own shape on the upper mold, a mold closing step of closing the lower mold and the upper mold after the arrangement step, and resin-molding the second molded product on the cover plate; and a peeling step of peeling the second molded product formed of resin from the cover plate, The lower mold has a bottom member forming the bottom surface of the cavity and a side member surrounding the bottom member, and the cavity is formed by the upper surface of the bottom member and the inner peripheral surface of the side member. The side member is supported by an elastic member relative to the base plate in a manner that the side member can move up and down relative to the bottom member. By allowing a spacing member to be interposed between the base plate and the elastic member, the relative height of the side member with respect to the bottom member is adjusted, thereby adjusting the depth of the mold cavity of the lower mold so that the resin molding of the second molded product is deeper than the resin molding of the first molded product.

2. The method for manufacturing a resin molded product according to claim 1, wherein the arranging step comprises: The step of placing the first molded product in the mold cavity; as well as and placing a resin material on the first molded product placed in the cavity.

3. The method for manufacturing a resin molded product according to claim 1, wherein the arranging step comprises: a step of disposing a resin material on the first molded product; as well as A step of placing the first molded product having the resin material arranged therein in the mold cavity. 4 . The method for manufacturing a resin molded product according to claim 1 , further comprising a processing step of processing the first molded product before the arranging step. 5 . The method for manufacturing a resin molded product according to claim 1 , wherein a release sheet is adhered to a surface of the cover plate that contacts the resin material. 6 . The method for manufacturing a resin molded product according to claim 1 , wherein an outer shape of the cover plate in a plan view is larger than an outer shape of the cavity in a plan view.

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