A micro-mucosal adhesive flexible circuit board packaging tray and packaging method

Abstract

This invention provides a micro-adhesive film-attached flexible circuit board packaging tray and packaging method, including a tray body with a front and a back. The front has several circuit board placement areas, and non-recessed areas corresponding to the placement areas are non-placement areas. The tray also includes: edge-guarding protrusions on the edges of the non-placement areas; edge-guarding protrusions with several hand-positioning grooves; placement areas with several placement grooves; and spacer protrusions at the joints of the placement grooves, dividing the placement areas into several placement grooves; the hand-positioning grooves are connected to the placement grooves. The release film is pressed against the micro-adhesive film through the hand-positioning grooves, allowing for the alignment and rapid packaging of the circuit boards. The spacer protrusions in the tray placement areas prevent the micro-adhesive film from sticking and overlapping, and their number and position can be set according to the specifications of the shipping packaging, enabling the simultaneous and rapid production of products of uniform specifications and improving packaging efficiency. The hand-positioning grooves are ergonomically designed to fit the size of a human finger, facilitating operation.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing, and more particularly to a micro-adhesive film-attached flexible circuit board packaging tray and packaging method. Background Technology

[0002] Flexible printed circuit boards (FPCs) offer excellent electrical performance and meet the design needs for smaller and higher-density installations. They help reduce assembly steps and enhance reliability, making them the best solution for miniaturizing and moving electronic products. They can be freely bent, rolled, and folded, and can even withstand millions of dynamic bends without damaging the wires. They can be arranged arbitrarily according to spatial layout requirements and can move and stretch freely in three-dimensional space, thus achieving integration of component assembly and wire connection. Flexible printed circuit boards can significantly reduce the size and weight of electronic products, meeting the needs of electronic products moving towards higher density, miniaturization, and higher reliability.

[0003] Currently, with the rapid development of flexible circuit boards, they are increasingly trending towards being lighter, thinner, and more refined. Simultaneously, the requirements for the quality, appearance, and performance of flexible circuit boards are also becoming increasingly stringent. The production process of flexible circuit boards involves directly processing portions of a single, continuous board product, which contains multiple evenly spaced individual flexible circuit board products.

[0004] Flexible circuit boards that pass ICT testing are often placed haphazardly in general-purpose pallets, which can easily lead to overlapping and damage. Packaging workers manually attach each flexible circuit board to the micro-adhesive film according to the layout order and cover it with release film. This process is cumbersome and requires manual alignment, resulting in low film application efficiency and easy scrapping and damage to the circuit boards. At the same time, when the order volume is large and the delivery time is tight, manually packaging flexible circuit boards one piece at a time leads to low overall packaging efficiency, affecting work and production efficiency and increasing labor and time costs. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to improve the packaging efficiency of flexible circuit boards and to provide a micro-adhesive film-attached flexible circuit board packaging tray and packaging method.

[0006] This invention provides the following technical solution:

[0007] A micro-adhesive film-attached flexible circuit board packaging tray includes a tray body, the tray body including a front side and a back side opposite to the front side, the front side having a plurality of recessed circuit board placement areas, and other non-recessed areas corresponding to the placement areas being non-placement areas, including:

[0008] The edge of the non-placement area is provided with a retaining protrusion;

[0009] The flange boss is provided with several hand position through slots;

[0010] The placement area is provided with several placement grooves;

[0011] The placement groove connection is provided with spaced protrusions to divide the placement area into several placement grooves;

[0012] The hand position through groove is connected to the placement groove.

[0013] Preferably, a micro-adhesive membrane is provided on the upper surface of the placement groove, the adhesive layer of the micro-adhesive membrane faces the opposite direction of the placement groove, and the circuit board is placed on the adhesive layer of the micro-adhesive membrane.

[0014] Preferably, the size of the micro-molecular adhesive membrane is not larger than the size of the placement groove.

[0015] Preferably, the hand position through groove is disposed at one end and / or both ends of the placement groove; the height of the hand position through groove is not higher than the height of the placement groove.

[0016] Preferably, the edge boss is provided with a plurality of support grooves; the support grooves form support columns protruding from the back side; when pallets are stacked, the support columns on the back side of the upper pallet are snapped into the support grooves of the lower pallet.

[0017] Preferably, the length of the hand position through groove is 5mm to 12mm; the width of the hand position through groove is 0mm to 5mm; the depth of the hand position through groove is 10mm to 11mm; the length of the hand position through groove is not greater than the length of the placement groove; and the width of the hand position through groove is the same as the width of the side guard boss.

[0018] Preferably, one corner of the tray is provided with a foolproof chamfer notch.

[0019] Preferably, the upper surface of the retaining protrusion is provided with a foolproof arrow mark.

[0020] Preferably, the tray material includes antistatic materials.

[0021] A method for packaging flexible circuit boards with micro-adhesive film attachment includes:

[0022] S01, according to the size of the tray placement groove, cut the micro-adhesive film, separate the release film on the surface of the micro-adhesive film, and set it aside for later use;

[0023] S02, place the micro-adhesive membrane on the upper surface of the placement groove on the front of the tray through the hand position through the groove, with the adhesive layer of the micro-adhesive membrane facing upward;

[0024] S03, the robot arm of the equipment picks up the flexible circuit board for the ICT process, and then places the flexible circuit board that has passed the ICT process onto the micro-adhesive membrane in the placement groove in sequence.

[0025] S04, Align the release film with the placement groove through the hand position through the groove, and place it on the placement groove on which the flexible circuit board is attached;

[0026] S05, press the release film into the placement groove through the hand position through the groove, so that the release film and the micro adhesive film are bonded together, and the packaged continuous flexible circuit board is obtained.

[0027] The embodiments of the present invention have the following advantages:

[0028] The micro-adhesive film is placed on the upper surface of the tray placement groove in advance. After the robotic arm of the equipment automatically places the circuit board, the worker places the release film on the upper surface of the placement groove and presses the release film towards the tray through the hand position groove so that the release film and the micro-adhesive film adhere together. The circuit board can be quickly packaged without the need for placement and precise alignment of the circuit board.

[0029] The hand slot is set at one and / or both ends of the groove, and the length of the hand slot is matched with the width of a person's finger. Each hand slot can accommodate 1 to 5 fingers, so that workers can place their fingers in the hand slot to apply the release film, which is in line with the workers' habits of applying the release film.

[0030] The pallet placement area is equipped with spacer protrusions to prevent the micro-adhesive films from sticking and overlapping, and to facilitate alignment when applying the release film, preventing the release film from being applied off-center. The number and position of the spacer protrusions can be set according to the specifications of the circuit board shipping packaging, enabling workers to quickly produce products of uniform specifications at the same time, improving packaging efficiency.

[0031] The tray is provided with several support grooves, which face the back to form support columns protruding from the back. When the trays are stacked, the support columns on the back of the upper tray and the support grooves of the lower tray are snapped together, so that when the trays are stacked, the gap between the two trays is high when they are in opposite directions, and the lower tray will not be lifted when the upper tray is lifted.

[0032] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort. Figure 1 This is a schematic diagram of the front structure of the tray before applying the micro-adhesive film to the flexible circuit board packaging tray and packaging method of the present invention.

[0034] Figure 2 This is a schematic diagram of the front structure of the tray on which the circuit board is placed after the micro-adhesive film is applied, which is a micro-adhesive film attached to the flexible circuit board packaging tray and packaging method of the present invention.

[0035] Figure 3 This is a schematic diagram of the reverse side of the tray of the micro-adhesive film-attached flexible circuit board packaging tray and packaging method of the present invention;

[0036] Explanation of reference numerals in the attached diagram:

[0037] 1-Tray; 11-Side guard boss; 111-Support groove; 112-Support column; 12-Hand position through groove; 13-Placement groove; 14-Interval protrusion; 15-Micro adhesive film; 2-Circuit board; 3-Foothole-proof chamfer notch. Detailed Implementation

[0038] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0039] It should be noted that when an element is said to be "fixed" to another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly" on another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0040] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the template description is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0043] Example 1

[0044] A micro-adhesive film-attached flexible circuit board packaging tray includes a tray body 1. In this embodiment, the dimensions of the tray body 1 are 39*30*1.2cm. The tray body 1 includes a front side and a back side facing each other. The front side has several recessed circuit board 2 placement areas, each with dimensions of 35.55*25.55*0.8cm. Other non-recessed areas corresponding to the placement areas are non-placement areas.

[0045] The placement area has two placement grooves 13, each with dimensions of 25.55*17.63*0.8cm. A spacer protrusion 14 separates the placement area into two grooves 13 at their connection point. A micro-adhesive membrane 15 is applied to the upper surface of each groove 13; the micro-adhesive membrane 15 is slightly smaller than the groove size to facilitate placement by the worker. After removing the release film, the adhesive layer of the micro-adhesive membrane 15 faces the opposite direction to the groove 13.

[0046] In this embodiment, the dimensions of the spacer protrusion 14 are 25.55*0.3*0.8cm. The spacer protrusion 14 is connected to the two edge bosses 11 to prevent the micro-adhesive film 15 from sticking and overlapping. The number and position of the spacer protrusion 14 can be set according to the specifications of the packaging of the circuit board 2, so that workers can quickly produce products of uniform specifications at the same time and improve the efficiency of packaging.

[0047] In this embodiment, eight double-sided flexible circuit boards 2 are placed on a micro-adhesive film 15 with an adhesive layer, so a tray 1 can hold sixteen double-sided flexible circuit boards 2.

[0048] The edges of the four sides of the non-placement area are provided with edge-blocking protrusions 11;

[0049] The edge boss 11 is provided with four hand slots 12; the hand slots 12 are paired and correspond to each other, with two hand slots 12 forming a group, and the hand slots 12 are connected to the placement grooves 13; the two groups of hand slots 12 are respectively set on both sides of the two placement grooves 13, that is, the left and right sides, corresponding to the left and right hands of a person, so that workers can use their left and right hands to stick the release film, which conforms to human working habits;

[0050] In this embodiment, the length of the hand position groove 12 is 11.22cm; the width of the hand position groove 12 is 3.21cm; the depth of the hand position groove 12 is 0.11cm; the length of the hand position groove 12 is not greater than the length of the placement groove 13; the width of the hand position groove 12 is the same as the width of the side guard boss 11, ensuring that the worker can press the release film located above the placement groove 13 through the hand position groove 12;

[0051] The height of the finger groove should not be higher than the height of the placement groove 13, so that the worker can press the release film onto the adhesive layer of the micro-adhesive film 15 through the finger groove and make it fit tightly; if the height of the finger groove is higher than the placement groove 13, there is a risk that the release film will not be able to fit with the micro-adhesive film 15 or will contain air bubbles.

[0052] Each edge protrusion 11 is provided with one or two support grooves 111; the support groove 111 has a groove depth of 0.3cm; the support groove 111 forms a support post 112 protruding from the back side; when the pallets 1 are stacked, the support post 112 on the back side of the upper pallet 1 is snapped into the support groove 111 of the lower pallet 1, so that when the pallets 1 are stacked, the gap between the two pallets 1 is high when they are snapped together, and the lower pallet 1 will not be lifted when the upper pallet 1 is lifted.

[0053] A chamfered notch 3 is provided at one corner of the pallet 1; at the same time, an arrow is provided on the upper surface of the edge protrusion 11 to make it easy to identify the direction of the pallet 1 and to prevent mistaken identity.

[0054] The tray 1 is made of black PS anti-static material to prevent the generation of static electricity. This is to prevent workers from making mistakes when pasting the release film, and also to prevent static electricity from damaging the components and causing damage to the electrical performance of the FPC.

[0055] Example 2

[0056] A method for packaging flexible circuit boards with micro-adhesive film adhesion includes the following steps:

[0057] S01, according to the size of the placement groove 13 of the tray 1, cut the micro-adhesive membrane 15, separate the release film on the surface of the micro-adhesive membrane 15, and set it aside for later use.

[0058] In this embodiment, the dimensions of a single placement groove 13 are 25.55*17.63*0.8cm, and the dimensions of a single micro-adhesive membrane 15 are 25*17cm;

[0059] S02, the micro-adhesive membrane 15 is placed on the upper surface of the groove through the hand position through groove 12, with the adhesive layer of the micro-adhesive membrane 15 facing upward;

[0060] S03, the robot arm of the equipment picks up the flexible circuit board 2 for the ICT process, and places the flexible circuit board 2 that has passed the ICT process on the micro-adhesive film 15 with adhesive layer in the placement groove 13 in sequence; eight double-sided flexible circuit boards 2 are grouped together, and two groups of circuit boards 2 are placed on one tray 1, that is, sixteen.

[0061] S04, manually align the release film with a placement groove 13 through the end slots, and place the release film on the placement groove 13 for attaching a set of flexible circuit boards 2;

[0062] S05, manually press the release film towards the tray 1 through the hand position groove 12 to make the release film adhere to the micro adhesive film 15. Repeat S04 to attach the release film to the second set of flexible circuit boards 2, and obtain two sets of packaged flexible circuit boards 2.

[0063] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limitations; therefore, other examples of exemplary embodiments may have different values.

[0064] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0065] The above-described embodiments are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A micro-adhesive film-attached flexible circuit board packaging tray, comprising a tray (1) body, the tray (1) body including a front side and a back side opposite to the front side, wherein the front side has a plurality of recessed flexible circuit board (2) placement areas, and other non-recessed areas corresponding to the placement areas are non-placement areas, characterized in that, include: The edge of the non-placement area is provided with a retaining protrusion (11). The flange boss (11) is provided with several hand position through slots (12). The placement area is provided with a number of placement grooves (13); the side boss (11) is provided with four hand position through grooves (12); the hand position through grooves (12) are in a corresponding relationship in pairs, and two hand position through grooves (12) form a group; the two groups of hand position through grooves (12) are respectively provided on both sides of the two placement grooves (13); The hand position through groove (12) is connected to the placement groove (13); The depth of the hand position through groove (12) is not higher than the depth of the placement groove (13); the length of the hand position through groove (12) is not greater than the length of the placement groove (13); the width of the hand position through groove (12) is the same as the width of the side guard boss (11); The placement groove (13) is provided with a spacer protrusion (14) at the connection point, which divides the placement area into several placement grooves (13). The spacer protrusion (14) is connected to the two side bosses (11); The edge boss (11) is provided with a plurality of support grooves (111); the support grooves (111) form support columns (112) protruding from the back side; when the pallets (1) are stacked, the support columns (112) on the back side of the upper pallet (1) are snapped together with the support grooves (111) of the lower pallet (1); The upper surface of the placement groove (13) is provided with a micro-adhesive membrane (15), with the adhesive layer of the micro-adhesive membrane (15) facing upwards, and the flexible circuit board (2) is placed on the adhesive layer of the micro-adhesive membrane (15).

2. The micro-adhesive film-attached flexible circuit board packaging tray as described in claim 1, characterized in that, The size of the micro-adhesive membrane (15) is no larger than the size of the placement groove (13).

3. The micro-adhesive film-attached flexible circuit board packaging tray as described in claim 1, characterized in that, The length of the hand position through groove (12) is 5mm~12mm; the depth of the hand position through groove (12) is 10~11mm.

4. The micro-adhesive film-attached flexible circuit board packaging tray as described in claim 1, characterized in that, One corner of the tray (1) is provided with a chamfered notch (3).

5. The micro-adhesive film-attached flexible circuit board packaging tray as described in claim 1, characterized in that, An arrow mark is provided on the upper surface of the flange boss (11).

6. The micro-adhesive film-attached flexible circuit board packaging tray as described in claim 1, characterized in that, The tray (1) is made of anti-static material.

7. A method for packaging flexible circuit boards with micro-adhesive film attachment, characterized in that, The method includes a flexible circuit board (2) and a micro-adhesive film-attached flexible circuit board packaging tray as described in any one of claims 1 to 6, the method comprising: S01, according to the size of the placement groove (13) of the tray (1), cut the micro-adhesive membrane (15), separate the release film on the surface of the micro-adhesive membrane (15), and set it aside for later use; S02, place the micro-adhesive membrane (15) on the upper surface of the placement groove (13) on the front of the tray (1) through the hand position through groove (12), with the adhesive layer of the micro-adhesive membrane (15) facing upward; S03, the equipment robot grabs the flexible circuit board (2) for ICT process, and places the flexible circuit board (2) that has passed the ICT process on the micro-adhesive film (15) of the placement groove (13) in sequence; S04, align the release film with the placement groove (13) through the hand position through groove (12) and place it on the placement groove (13) of the attached flexible circuit board (2); S05, press the release film in the direction of the placement groove (13) through the hand position through groove (12) to make the release film adhere to the micro adhesive film (15) and obtain the packaged continuous flexible circuit board (2).

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