Production process of new energy transformer

Abstract

The present application relates to a kind of production process of new energy transformer, the process includes the following steps: S1: base material processing;S2: porous processing;S3: surface treatment;S4: plating electroplating;S5: welding copper column pre-embedded;S6: line etching;S7: insulation treatment;S8: primary winding;S9: secondary winding;S10: test packaging;S11: detection into warehouse;The way of twice winding solves the problem of coil winding and wiring, in the primary winding process, coil winding is wound at the two ends of the plate body, to form the main coil and form the secondary coil, facilitate the main coil and the core to form alternating magnetic field, and then the copper sheet of jack is made into a screen plate to plug the jack, the coil winding is respectively inserted into the inside of coil winding hole and terminal hole, the copper sheet plug jack is used to reduce the hole and hole spacing, and the plug jack is used to reduce the sliding of coil winding and ensure that the mutual coil winding avoids the mutual influence.

Description

Technical Field

[0001] The present invention relates to the technical field of transformers, and in particular to a production process for new energy transformers. Background Art

[0002] New energy, also known as unconventional energy, refers to various energy forms other than traditional energy. These include energy sources that are just beginning to be developed or are under active research and awaiting widespread promotion, such as solar energy, geothermal energy, wind energy, ocean energy, biomass energy, and nuclear fusion energy.

[0003] A transformer is a device that exchanges AC voltage, current, and impedance. When AC current flows through the primary coil, AC magnetic flux is generated in the iron core (or magnetic core), inducing voltage (or current) in the secondary coil. A transformer consists of an iron core (or magnetic core) and a coil with two or more windings. The winding connected to the power supply is called the primary coil, and the remaining windings are called the secondary coils. In a generator, whether the coil moves through a magnetic field or the magnetic field moves through a fixed coil, an electric potential is induced in the coil. In both cases, the value of the magnetic flux remains unchanged, but the amount of magnetic flux intersecting the coil changes. This is the principle of mutual induction. A transformer is a device that uses electromagnetic mutual induction to transform voltage, current, and impedance. With the advancement of technology, the integration of new energy sources and transformers has led to the development of technologies for manufacturing new energy transformers, thus bringing new energy into the field of transformers.

[0004] A transformer is a device that uses the principle of electromagnetic induction to change AC voltage. Its main components are a primary coil, a secondary coil, and an iron core (magnetic core). During the production process of a transformer, it undergoes steps such as winding and opening holes. The prior art lacks a solution to this problem. In view of this, the inventors of this application have conducted in-depth research and obtained a production process. To this end, the inventors have proposed a production process for a new energy transformer to solve the above-mentioned technical problems. Summary of the Invention

[0005] In order to overcome the above-mentioned shortcomings, the present invention aims to provide a technical solution that can solve the above-mentioned problems.

[0006] A production process for a new energy transformer, comprising the following steps:

[0007] S1: Base material processing: The base material is processed into size according to the production requirements of the planar transformer. The design drawings and technical requirements must be determined before cutting. When cutting, the plate material passes the IQC inspection and is produced according to the MI production instructions. After the material is issued, the drilling and cutting team is responsible for cutting the plate material into a size that is convenient for production according to the MI instructions. The plate material is drilled and the sides are polished to obtain the plate body;

[0008] S2: Multi-hole processing: Process the coil winding holes and wiring holes on the board separately, and open the base holes for embedding and fixing the welding copper pillars and positioning the mounting holes;

[0009] S3: Surface treatment: Anti-oxidation treatment is performed on the surface of the board. Anti-oxidation treatment adopts surface treatment. Copper is easily oxidized in the air, which is convenient for subsequent welding. The finished board is treated to prevent the copper surface from oxidation, which is convenient for subsequent welding and tinning.

[0010] S4: Electroplating: Circuit etching is performed on the board, and then the surface electroplating layer is processed. The insulating material metallization process is used to make the surface of the board conductive. The copper layer is electroplated on the surface of the board by electroplating. The electroplated copper layer uses chemically deposited copper. The copper plating can be assisted by electroplating equipment.

[0011] S5: Pre-embedding of welding copper pillars: installing the welding copper pillars for wiring into the base holes of the welding copper pillars, and installing and fixing the installation positioning pillars for installation and positioning into the base holes of the installation positioning pillars;

[0012] S6: Circuit etching: Etching the circuit on the surface of the board. After the board is etched by the etching machine, the exposed copper will be removed by the etchant spray, while the lower part protected by the photosensitive dry film will be retained; after etching, the photosensitive dry film needs to be removed. The photosensitive dry film removal requires using sodium hydroxide to strip off the photosensitive dry film remaining on the board surface;

[0013] S7: Insulation treatment: Apply a solder mask ink layer to the surface of the board, and use green oil printing to form a protective layer on the surface of the board to obtain a solder mask ink layer board. The solder mask layer plays a role in solder resistance, protection, and improving insulation resistance, while also improving the appearance quality of the board. The solder mask layer refers to the part of the printed board that needs to be coated with green oil. In fact, this solder mask uses a negative film output. After the shape of the solder mask layer is mapped to the board, green oil solder mask is not applied, but to expose the copper skin of the board;

[0014] S8: Primary Winding: Wind the coil windings around the two ends of the solder resist ink layer plate body obtained in S7, one end of the coil winding is connected to one end of the solder resist ink layer plate body to form a main coil, one end of the coil winding is connected to the other end of the solder resist ink layer plate body to form a secondary coil, one end of the main coil is connected to a power switch, an iron core is installed on the surface of the solder resist ink layer plate body, the iron cores are respectively installed on the bottom and top of the solder resist ink layer plate body, and are electrically connected to the solder resist ink layer plate body;

[0015] S9: Secondary winding: Drill out the copper sheet for plugging the holes in the board, make a mesh plate for plugging the holes, and insert the coil winding into the coil winding hole and the wiring hole respectively. Use the copper sheet to plug the holes to reduce the distance between the holes, solving the problem of coil winding and wiring;

[0016] S10: Test packaging: The board after secondary winding needs to be cleaned and then undergo open / short circuit test. It will not be shipped until 100% of the test is passed. The test requires a dedicated ICT test frame. After the needle is implanted at the pad position, the computer test for open / short circuit is performed according to the program. The test process is carried out by existing testing equipment. Only after the test is passed can the next process be carried out;

[0017] S11: Inspection and warehousing: Transformers that have passed the test need to undergo a final appearance and technical indicator inspection. Only after they are confirmed to be qualified can they be shipped. Currently, manual visual inspection is the main method. Warehousing involves freight and export, and packaging is very critical to avoid direct scrapping due to damage to the board due to poor packaging.

[0018] Furthermore, in S2, the copper sheet plugging process can be assisted by plugging equipment, and after the plugging is completed, it is baked in an oven at 175-200 degrees.

[0019] Furthermore, in S3, the surface treatment process may be one of: tin-lead tin spraying, lead tin spraying, lead-free tin spraying, immersion gold, OSP, immersion tin and immersion silver.

[0020] Furthermore, in S6, the etching machine uses a mixed etchant of sodium chlorate or hydrochloric acid when performing the etching process, and the etching process can be assisted by an etching device to remove the photosensitive dry film through etching and film stripping.

[0021] Furthermore, in S7, 90% of the solder resist of the printed solder resist layer is green; the solder resist color can be one of green, yellow, red, black and blue.

[0022] Furthermore, in the S10, the cleaning process uses a high-temperature solution of potassium permanganate or sodium hydroxide to remove the epoxy resin slag generated by drilling the board from the hole wall to ensure good inner layer interconnection of the board and avoid signal non-conduction. Measurement is required during the process of grinding the slag.

[0023] Compared with the prior art, the beneficial effects of the present invention are: a two-winding method is used to solve the coil winding and wiring problems, and the coil winding is wound around the two ends of the plate in one winding process to form a main coil and a secondary coil, which is convenient for the main coil and the iron core to form an alternating magnetic field, and then a mesh plate is made through the copper sheet for plugging the holes to plug the holes, and the coil winding is respectively inserted into the coil winding hole and the wiring hole. The copper sheet is used to plug the holes to reduce the distance between the holes, and the plugging method is used to reduce the sliding of the coil winding and ensure that the coil windings do not affect each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1It is a flow chart of the production process of new energy transformers. Implementation Method

[0025] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0026] See also Figure 1 A production process for a new energy transformer is specifically implemented, and the process includes the following steps:

[0027] A production process for a new energy transformer, comprising the following steps:

[0028] S1: Base material processing: The base material is processed into size according to the production requirements of the planar transformer. The design drawings and technical requirements must be determined before cutting. When cutting, the plate material passes the IQC inspection and is produced according to the MI production instructions. After the material is issued, the drilling and cutting team is responsible for cutting the plate material into a size that is convenient for production according to the MI instructions. The plate material is drilled and the sides are polished to obtain the plate body;

[0029] S2: Multi-hole processing: Coil winding holes and wiring holes are processed separately on the board, and basic holes for embedding and fixing welding copper columns and positioning mounting holes are opened at the same time. The copper sheet plugging holes can be assisted by plugging equipment. After the plugging is completed, it is baked in an oven at 196 degrees.

[0030] S3: Surface treatment: Anti-oxidation treatment is performed on the surface of the board. Anti-oxidation treatment adopts surface treatment. Copper is easily oxidized in the air, which is convenient for subsequent welding. The finished board is treated to prevent the copper surface from oxidation, which is convenient for subsequent soldering and tinning. The surface treatment process can be: tin-lead tin spraying, lead tin spraying, lead-free tin spraying, immersion gold, OSP, immersion tin and immersion silver.

[0031] S4: Electroplating: Circuit etching is performed on the board, and then the surface electroplating layer is processed. The insulating material metallization process is used to make the surface of the board conductive. The copper layer is electroplated on the surface of the board by electroplating. The electroplated copper layer uses chemically deposited copper. The copper plating can be assisted by electroplating equipment.

[0032] S5: Pre-embedding of welding copper pillars: installing the welding copper pillars for wiring into the base holes of the welding copper pillars, and installing and fixing the installation positioning pillars for installation and positioning into the base holes of the installation positioning pillars;

[0033] S6: Circuit etching: Etching circuits on the surface of the board. After the board is etched by the etching machine, the exposed copper will be removed by the etchant spray, while the lower part protected by the photosensitive dry film will be retained; after etching, the photosensitive dry film needs to be removed. The photosensitive dry film removal requires sodium hydroxide to strip off the photosensitive dry film remaining on the board surface. The etching machine uses sodium chlorate or hydrochloric acid mixed etchant during the etching process. Etching can be assisted by etching equipment. The photosensitive dry film is removed by etching and stripping.

[0034] S7: Insulation treatment: Apply solder mask ink layer to the surface of the board, and use green oil printing to form a protective layer on the surface of the board to obtain a solder mask ink layer board. The printed solder mask layer plays the role of solder resistance, protection, and improving insulation resistance, while improving the appearance quality of the board. The solder mask layer refers to the part of the printed board that needs to be green-painted. In fact, this solder mask uses a negative film output. After the shape of the solder mask layer is mapped to the board, it is not green-painted, but in order to expose the copper skin of the board, 90% of the solder mask printed on the solder mask layer is green; the solder mask color can be one of green, yellow, red, black and blue;

[0035] S8: Primary Winding: Wind the coil windings around the two ends of the solder resist ink layer plate body obtained in S7, one end of the coil winding is connected to one end of the solder resist ink layer plate body to form a main coil, one end of the coil winding is connected to the other end of the solder resist ink layer plate body to form a secondary coil, one end of the main coil is connected to a power switch, an iron core is installed on the surface of the solder resist ink layer plate body, the iron cores are respectively installed on the bottom and top of the solder resist ink layer plate body, and are electrically connected to the solder resist ink layer plate body;

[0036] S9: Secondary winding: Drill out the copper sheet for plugging the holes in the board, make a mesh plate for plugging the holes, and insert the coil winding into the coil winding hole and the wiring hole respectively. Use the copper sheet to plug the holes to reduce the distance between the holes, solving the problem of coil winding and wiring;

[0037] S10: Test packaging: The board after secondary winding needs to be cleaned and then undergo an open / short circuit test. It will not be shipped until 100% of the test is passed. The test requires a dedicated ICT test stand. After the needle is implanted at the pad position, the computer test for open / short circuit is performed according to the program. The test process is tested by existing testing equipment. Only after the test is passed can the next process be carried out. The cleaning process uses potassium permanganate or sodium hydroxide high-temperature solution to remove the epoxy resin slag generated by drilling the board from the hole wall to ensure good internal interconnection of the board and avoid signal non-conduction. Measurement is required during the grinding process of the slag;

[0038] S11: Inspection and warehousing: Transformers that have passed the test need to undergo a final appearance and technical indicator inspection. Only after they are confirmed to be qualified can they be shipped. Currently, manual visual inspection is the main method. Warehousing involves freight and export, and packaging is very critical to avoid direct scrapping due to damage to the board due to poor packaging.

[0039] See also Figure 1 A production process for a new energy transformer is specifically implemented, and the process includes the following steps:

[0040] S1: Base material processing: The base material is processed into size according to the production requirements of the planar transformer. The design drawings and technical requirements must be determined before cutting. When cutting, the plate material passes the IQC inspection and is produced according to the MI production instructions. After the material is issued, the drilling and cutting team is responsible for cutting the plate material into a size that is convenient for production according to the MI instructions. The plate material is drilled and the sides are polished to obtain the plate body;

[0041] S2: Multi-hole processing: Coil winding holes and wiring holes are processed separately on the board, and basic holes for embedding and fixing welding copper columns and positioning mounting holes are opened at the same time. The copper sheet plugging holes can be assisted by plugging equipment. After the plugging is completed, it is baked in an oven at 183 degrees.

[0042] S3: Surface treatment: Anti-oxidation treatment is performed on the surface of the board. Anti-oxidation treatment adopts surface treatment. Copper is easily oxidized in the air, which is convenient for subsequent welding. The finished board is treated to prevent the copper surface from oxidation, which is convenient for subsequent soldering and tinning. The surface treatment process can be: tin-lead tin spraying, lead tin spraying, lead-free tin spraying, immersion gold, OSP, immersion tin and immersion silver.

[0043] S4: Electroplating: Circuit etching is performed on the board, and then the surface electroplating layer is processed. The insulating material metallization process is used to make the surface of the board conductive. The copper layer is electroplated on the surface of the board by electroplating. The electroplated copper layer uses chemically deposited copper. The copper plating can be assisted by electroplating equipment.

[0044] S5: Pre-embedding of welding copper pillars: installing the welding copper pillars for wiring into the base holes of the welding copper pillars, and installing and fixing the installation positioning pillars for installation and positioning into the base holes of the installation positioning pillars;

[0045] S6: Circuit etching: Etching circuits on the surface of the board. After the board is etched by the etching machine, the exposed copper will be removed by the etchant spray, while the lower part protected by the photosensitive dry film will be retained; after etching, the photosensitive dry film needs to be removed. The photosensitive dry film removal requires sodium hydroxide to strip off the photosensitive dry film remaining on the board surface. The etching machine uses sodium chlorate or hydrochloric acid mixed etchant during the etching process. Etching can be assisted by etching equipment. The photosensitive dry film is removed by etching and stripping.

[0046] S7: Insulation treatment: Apply solder mask ink layer to the surface of the board, and use green oil printing to form a protective layer on the surface of the board to obtain a solder mask ink layer board. The printed solder mask layer plays the role of solder resistance, protection, and improving insulation resistance, while improving the appearance quality of the board. The solder mask layer refers to the part of the printed board that needs to be green-painted. In fact, this solder mask uses a negative film output. After the shape of the solder mask layer is mapped to the board, it is not green-painted, but in order to expose the copper skin of the board, 90% of the solder mask printed on the solder mask layer is green; the solder mask color can be one of green, yellow, red, black and blue;

[0047] S8: Primary Winding: Wind the coil windings around the two ends of the solder resist ink layer plate body obtained in S7, one end of the coil winding is connected to one end of the solder resist ink layer plate body to form a main coil, one end of the coil winding is connected to the other end of the solder resist ink layer plate body to form a secondary coil, one end of the main coil is connected to a power switch, an iron core is installed on the surface of the solder resist ink layer plate body, the iron cores are respectively installed on the bottom and top of the solder resist ink layer plate body, and are electrically connected to the solder resist ink layer plate body;

[0048] S9: Secondary winding: Drill out the copper sheet for plugging the holes in the board, make a mesh plate for plugging the holes, and insert the coil winding into the coil winding hole and the wiring hole respectively. Use the copper sheet to plug the holes to reduce the distance between the holes, solving the problem of coil winding and wiring;

[0049] S10: Test packaging: The board after secondary winding needs to be cleaned and then undergo an open / short circuit test. It will not be shipped until 100% of the test is passed. The test requires a dedicated ICT test stand. After the needle is implanted at the pad position, the computer test for open / short circuit is performed according to the program. The test process is tested by existing testing equipment. Only after the test is passed can the next process be carried out. The cleaning process uses potassium permanganate or sodium hydroxide high-temperature solution to remove the epoxy resin slag generated by drilling the board from the hole wall to ensure good internal interconnection of the board and avoid signal non-conduction. Measurement is required during the grinding process of the slag;

[0050] S11: Inspection and warehousing: Transformers that have passed the test need to undergo a final appearance and technical indicator inspection. Only after they are confirmed to be qualified can they be shipped. Currently, manual visual inspection is the main method. Warehousing involves freight and export, and packaging is very critical to avoid direct scrapping due to damage to the board due to poor packaging.

[0051] See also Figure 1 A production process for a new energy transformer is specifically implemented, and the process includes the following steps:

[0052] A production process for a new energy transformer, comprising the following steps:

[0053] S1: Base material processing: The base material is processed into size according to the production requirements of the planar transformer. The design drawings and technical requirements must be determined before cutting. When cutting, the plate material passes the IQC inspection and is produced according to the MI production instructions. After the material is issued, the drilling and cutting team is responsible for cutting the plate material into a size that is convenient for production according to the MI instructions. The plate material is drilled and the sides are polished to obtain the plate body;

[0054] S2: Multi-hole processing: Coil winding holes and wiring holes are processed on the board separately. At the same time, base holes for embedding and fixing welding copper pillars and positioning mounting holes are opened. The copper sheet plugging holes can be assisted by plugging equipment. After the plugging is completed, it is baked in an oven at 177 degrees.

[0055] S3: Surface treatment: Anti-oxidation treatment is performed on the surface of the board. Anti-oxidation treatment adopts surface treatment. Copper is easily oxidized in the air, which is convenient for subsequent welding. The finished board is treated to prevent the copper surface from oxidation, which is convenient for subsequent soldering and tinning. The surface treatment process can be: tin-lead tin spraying, lead tin spraying, lead-free tin spraying, immersion gold, OSP, immersion tin and immersion silver.

[0056] S4: Electroplating: Circuit etching is performed on the board, and then the surface electroplating layer is processed. The insulating material metallization process is used to make the surface of the board conductive. The copper layer is electroplated on the surface of the board by electroplating. The electroplated copper layer uses chemically deposited copper. The copper plating can be assisted by electroplating equipment.

[0057] S5: Pre-embedding of welding copper pillars: installing the welding copper pillars for wiring into the base holes of the welding copper pillars, and installing and fixing the installation positioning pillars for installation and positioning into the base holes of the installation positioning pillars;

[0058] S6: Circuit etching: Etching circuits on the surface of the board. After the board is etched by the etching machine, the exposed copper will be removed by the etchant spray, while the lower part protected by the photosensitive dry film will be retained; after etching, the photosensitive dry film needs to be removed. The photosensitive dry film removal requires sodium hydroxide to strip off the photosensitive dry film remaining on the board surface. The etching machine uses sodium chlorate or hydrochloric acid mixed etchant during the etching process. Etching can be assisted by etching equipment. The photosensitive dry film is removed by etching and stripping.

[0059] S7: Insulation treatment: Apply solder mask ink layer to the surface of the board, and use green oil printing to form a protective layer on the surface of the board to obtain a solder mask ink layer board. The printed solder mask layer plays the role of solder resistance, protection, and improving insulation resistance, while improving the appearance quality of the board. The solder mask layer refers to the part of the printed board that needs to be green-painted. In fact, this solder mask uses a negative film output. After the shape of the solder mask layer is mapped to the board, it is not green-painted, but in order to expose the copper skin of the board, 90% of the solder mask printed on the solder mask layer is green; the solder mask color can be one of green, yellow, red, black and blue;

[0060] S8: Primary Winding: Wind the coil windings around the two ends of the solder resist ink layer plate body obtained in S7, one end of the coil winding is connected to one end of the solder resist ink layer plate body to form a main coil, one end of the coil winding is connected to the other end of the solder resist ink layer plate body to form a secondary coil, one end of the main coil is connected to a power switch, an iron core is installed on the surface of the solder resist ink layer plate body, the iron cores are respectively installed on the bottom and top of the solder resist ink layer plate body, and are electrically connected to the solder resist ink layer plate body;

[0061] S9: Secondary winding: Drill out the copper sheet for plugging the holes in the board, make a mesh plate for plugging the holes, and insert the coil winding into the coil winding hole and the wiring hole respectively. Use the copper sheet to plug the holes to reduce the distance between the holes, solving the problem of coil winding and wiring;

[0062] S10: Test packaging: The board after secondary winding needs to be cleaned and then undergo an open / short circuit test. It will not be shipped until 100% of the test is passed. The test requires a dedicated ICT test stand. After the needle is implanted at the pad position, the computer test for open / short circuit is performed according to the program. The test process is tested by existing testing equipment. Only after the test is passed can the next process be carried out. The cleaning process uses potassium permanganate or sodium hydroxide high-temperature solution to remove the epoxy resin slag generated by drilling the board from the hole wall to ensure good internal interconnection of the board and avoid signal non-conduction. Measurement is required during the grinding process of the slag;

[0063] S11: Inspection and warehousing: Transformers that have passed the test need to undergo a final appearance and technical indicator inspection. Only after they are confirmed to be qualified can they be shipped. Currently, manual visual inspection is the main method. Warehousing involves freight and export, and packaging is very critical to avoid direct scrapping due to damage to the board due to poor packaging.

[0064] The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, several simple deductions or substitutions can be made without departing from the concept of the present invention, and all of these should be considered as the scope of protection of the present invention.

Claims

1. A production process for a new energy transformer, characterized by: The process comprises the following steps: S1: Base material processing: The base material is processed into size according to the production requirements of the planar transformer. The design drawings and technical requirements must be determined before cutting. When cutting, the plate material passes the IQC inspection and is produced according to the MI production instructions. After the material is issued, the drilling and cutting team is responsible for cutting the plate material into a size that is convenient for production according to the MI instructions, drilling the plate material, and grinding the side to obtain the plate body; S2: Multi-hole processing: Process the coil winding holes and wiring holes on the board separately, and open the base holes for embedding and fixing the welding copper columns and installing the positioning columns; S3: Surface treatment: Anti-oxidation treatment is performed on the surface of the board. Anti-oxidation treatment adopts surface treatment. Copper is easily oxidized in the air, which is convenient for subsequent welding. The finished board is treated to prevent the copper surface from oxidation, which is convenient for subsequent welding and tinning. S4: Electroplating: Circuit etching is performed on the board, and then the surface electroplating layer is processed. The insulating material metallization process is used to make the surface of the board conductive. The copper layer is electroplated on the surface of the board by electroplating. The electroplated copper layer uses chemically deposited copper. The copper plating adopts electroplating equipment to assist the electroplating process. S5: Pre-embedding of welding copper pillars: installing the welding copper pillars for wiring into the base holes of the welding copper pillars, and installing and fixing the installation positioning pillars for installation and positioning into the base holes of the installation positioning pillars; S6: Circuit etching: Etching the circuit on the surface of the board. After the board is etched by the etching machine, the exposed copper will be removed by the etchant spray, while the lower part protected by the photosensitive dry film will be retained; after etching, the photosensitive dry film needs to be removed. The photosensitive dry film removal requires using sodium hydroxide to strip off the photosensitive dry film remaining on the board surface; S7: Insulation treatment: Apply a solder mask ink layer to the surface of the board, and use green oil printing to form a protective layer on the surface of the board to obtain a solder mask ink layer board. The solder mask layer plays a role in solder resistance, protection, and improving insulation resistance, while also improving the appearance quality of the board. The solder mask layer refers to the part of the printed board that needs to be coated with green oil. In fact, this solder mask layer uses a negative film output. After the shape of the solder mask layer is mapped to the board, green oil solder mask is not applied, but to expose the copper skin of the board; S8: Primary Winding: Wind the coil windings around the two ends of the solder resist ink layer plate body obtained in S7, one end of the coil winding is connected to one end of the solder resist ink layer plate body to form a main coil, one end of the coil winding is connected to the other end of the solder resist ink layer plate body to form a secondary coil, one end of the main coil is connected to a power switch, an iron core is installed on the surface of the solder resist ink layer plate body, the iron cores are respectively installed on the bottom and top of the solder resist ink layer plate body, and are electrically connected to the solder resist ink layer plate body; S9: Secondary winding: Drill out the copper sheet for plugging the holes in the board, make a mesh plate for plugging the holes, and insert the coil winding into the coil winding hole and the wiring hole respectively. Use the copper sheet to plug the holes to reduce the distance between the holes, solving the problem of coil winding and wiring; S10: Test packaging: The board after secondary winding needs to be cleaned and then undergo open / short circuit test. It will not be shipped until 100% of the test is passed. The test requires a dedicated ICT test frame. After the needle is implanted at the pad position, the computer test for open / short circuit is performed according to the program. The test process is carried out by existing testing equipment. Only after the test is passed can the next process be carried out; S11: Inspection and warehousing: Transformers that have passed the test need to undergo a final appearance and technical indicator inspection. Only after they are confirmed to be qualified can they be shipped. Currently, manual visual inspection is the main method. Warehousing involves freight and export, and packaging is very critical to avoid direct scrapping due to damage to the board due to poor packaging.

2. The production process of a new energy transformer according to claim 1, characterized in that: In S2, the copper sheet is plugged with a plugging device to assist the plugging process, and after the plugging is completed, it is baked in an oven at 175-200 degrees Celsius.

3. The production process of a new energy transformer according to claim 1, characterized in that: In S3, the surface treatment process adopts one of: lead-based tin spraying, lead-free tin spraying, immersion gold, OSP, immersion tin and immersion silver.

4. A production process for a new energy transformer according to any one of claims 1 to 3, characterized in that: In S6, the etching machine uses a sodium chlorate and hydrochloric acid mixed etchant when performing the etching process, and the etching equipment uses an auxiliary etching process to remove the photosensitive dry film through etching and film stripping.

5. A production process for a new energy transformer according to any one of claims 1 to 3, characterized in that: In S7, 90% of the solder resist of the printed solder resist layer is green; the solder resist color is one of green, yellow, red, black and blue.

6. A production process for a new energy transformer according to any one of claims 1 to 3, characterized in that: In the S10, the cleaning process uses a high-temperature potassium permanganate solution or a high-temperature sodium hydroxide solution to remove the epoxy resin slag generated by drilling the board from the hole wall to ensure good inner layer interconnection of the board and avoid signal non-conduction. Measurement is required during the grinding process of the slag.

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