Multilayer electronic component

Abstract

The present application provides a kind of multilayer electronic components, the multilayer electronic components include silicon organic compound layer, the silicon organic compound layer has main body cover part and extension, the main body cover part is arranged in the region of the outer surface of main body, electrode layer and conductive resin layer of which outer electrode is not arranged, the extension is arranged to extend from the main body cover part to the conductive resin layer and plating layer between the outer electrode, so the bending strength and moisture resistance reliability can be improved.

Description

[0001] This application is a divisional application of the invention patent application with the application date of June 9, 2020, the application number of 202010518230.2, and the title of "Multilayer Electronic Assembly". TECHNICAL FIELD

[0002] The present disclosure relates to a multilayer electronic assembly. BACKGROUND

[0003] A multilayer ceramic capacitor (MLCC), which is a kind of multilayer electronic assembly, can be a chip-type capacitor mounted on a printed circuit board of various electronic products such as an imaging device including a liquid crystal display (LCD), a plasma display panel (PDP), etc., and a computer, a smart phone, a mobile phone, etc., for charging or discharging therefrom.

[0004] Such a multilayer ceramic capacitor is useful as a component of various electronic devices due to its relatively small size, relatively high capacitance, and relatively easy installation. As various electronic devices such as computers, mobile devices, etc. are miniaturized and improved in output, the demand for miniaturization and high capacitance of the multilayer ceramic capacitor is increasing.

[0005] In addition, as interest in vehicle electrical / electronic components has recently increased, the multilayer ceramic capacitor also becomes required to have relatively high reliability and strength characteristics for use in vehicles or infotainment systems.

[0006] In order to secure high reliability and high strength characteristics, a method of changing a conventional external electrode including an electrode layer to have a double-layer structure including an electrode layer and a conductive resin layer has been proposed. In the double-layer structure including an electrode layer and a conductive resin layer, a resin composition including a conductive material is coated onto the electrode layer to absorb external impact and prevent penetration of plating solution. As a result, reliability can be improved.

[0007] However, as electric vehicles, autonomous vehicles, etc. are developed in the automobile industry, a larger number of multilayer ceramic capacitors are required, and the multilayer ceramic capacitors used in automobiles, etc. need to secure more stringent conditions for moisture resistance reliability and bending strength characteristics therein. SUMMARY

[0008] An aspect of the present disclosure is to provide a multilayer electronic assembly having improved bending strength characteristics.

[0009] An aspect of the present disclosure is to provide a multilayer electronic assembly having improved moisture resistance reliability.

[0010] An aspect of the present disclosure is to provide a multilayer electronic assembly having a low equivalent series resistance (ESR).

[0011] However, the objectives of the present disclosure are not limited to the above objectives, and will be more readily understood in describing specific embodiments of the present disclosure.

[0012] According to an aspect of the present disclosure, a multi-layer electronic component includes a main body including dielectric layers and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween, the main body having first and second surfaces opposite to each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposite to each other, and fifth and sixth surfaces connected to the first, second, third, and fourth surfaces and opposite to each other; a first external electrode including a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer, and a first plating layer disposed on the first conductive resin layer, and the first external electrode being divided into a first connection portion disposed on the third surface of the main body and a first belt portion extending from the first connection portion to a portion of each of the first, second, fifth, and sixth surfaces; a second external electrode including a second electrode layer connected to the second internal electrode, a second conductive resin layer disposed on the second electrode layer, and a second plating layer disposed on the second conductive resin layer, and the second external electrode being divided into a second connection portion disposed on the fourth surface of the main body and a second belt portion extending from the second connection portion to a portion of each of the first, second, fifth, and sixth surfaces; and a silicon (Si) organic compound layer having a main body covering portion disposed on an area of an outer surface of the main body between the first and second conductive resin layers, a first extension portion disposed to extend from the main body covering portion to an area between the first conductive resin layer and the first plating layer in the first belt portion, and a second extension portion disposed to extend from the main body covering portion to an area between the second conductive resin layer and the second plating layer in the second belt portion.

[0013] According to another aspect of the present disclosure, a multilayer electronic component includes a main body including dielectric layers and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween, the main body having first and second surfaces opposite to each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposite to each other, and fifth and sixth surfaces connected to the first, second, third, and fourth surfaces and opposite to each other; a first external electrode including a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer, and a first plating layer disposed on the first conductive resin layer, and the first external electrode being divided into a first connecting portion disposed on the third surface of the main body and a first belt portion extending from the first connecting portion to a portion of each of the first, second, fifth, and sixth surfaces; a second external electrode including a second electrode layer connected to the second internal electrode, a second conductive resin layer disposed on the second electrode layer, and a second plating layer disposed on the second conductive resin layer, and the second external electrode being divided into a second connecting portion disposed on the fourth surface of the main body and a second belt portion extending from the second connecting portion to a portion of each of the first, second, fifth, and sixth surfaces; and a silicon (Si) organic compound layer having a main body covering portion disposed on an area between the first and second conductive resin layers, a first extension portion disposed to extend from the main body covering portion to an area between the first plating layer and the first conductive resin layer, and a second extension portion disposed to extend from the main body covering portion to an area between the second plating layer and the second conductive resin layer. The first extension portion has a first opening, and the second extension portion has a second opening.

[0014] According to another aspect of the present disclosure, a multilayer electronic component includes a main body, first and second outer electrodes, and a silicon (Si) organic compound layer. The main body includes dielectric layers and first and second inner electrodes alternately stacked in a stacking direction with respective dielectric layers interposed between the first and second inner electrodes, the first and second inner electrodes being respectively exposed to opposite end surfaces of the main body in a length direction perpendicular to the stacking direction. The first outer electrode includes a first electrode layer, a first conductive resin layer, and a first plating layer, and the second outer electrode includes a second electrode layer, a second conductive resin layer, and a second plating layer, the first and second electrode layers being respectively provided on the opposite end surfaces of the main body and the first electrode layer being connected to the first inner electrode, the second electrode layer being connected to the second inner electrode, the first and second electrode layers also extending inwardly in the length direction along surfaces of the main body connecting the opposite end surfaces to each other; the first and second conductive resin layers respectively covering the first and second electrode layers; and the first and second plating layers respectively covering the first and second conductive resin layers. The silicon (Si) organic compound layer is provided to cover outer surfaces of the main body, the first and second electrode layers, and the first and second conductive resin layers. The Si organic compound layer has one or more first openings between the first conductive resin layer and the first plating layer such that the first conductive resin layer and the first plating layer are in contact through the one or more first openings, and one or more second openings between the second conductive resin layer and the second plating layer such that the second conductive resin layer and the second plating layer are in contact through the one or more second openings. BRIEF DESCRIPTION OF DRAWINGS

[0015] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0016] Figure 1 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment of the present disclosure;

[0017] Figure 2 is a cross-sectional view taken along line I-I' in Figure 1 ;

[0018] Figure 3 is a schematic exploded perspective view of a main body in which dielectric layers and inner electrodes are stacked, according to an exemplary embodiment of the present disclosure;

[0019] Figure 4 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment of the present disclosure; Figure 2enlarged view of the P region in

[0020] Figure 5 is a schematic perspective view of a multilayer electronic assembly according to another exemplary embodiment of the present disclosure;

[0021] Figure 6 is a cross-sectional view taken along Figure 5 line II-II' in

[0022] Figure 7 is a schematic perspective view showing a modified example of a multilayer electronic assembly according to another exemplary embodiment of the present disclosure; and

[0023] Figure 8 is a cross-sectional view taken along Figure 7 line III-III' in DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present disclosure will be described with reference to specific examples and accompanying drawings. However, the embodiments of the present disclosure can be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, the embodiments of the present disclosure can be provided to more completely describe the present disclosure to one of ordinary skill in the art. Therefore, the shape and size of elements in the drawings can be exaggerated for clarity of description, and elements denoted by the same reference numerals can be the same elements in the drawings.

[0025] In the drawings, parts irrelevant to the description will be omitted for the clarity of the present disclosure, and the thickness can be exaggerated to clearly show the layers and regions. The same reference numerals will be used to denote the same components. In addition, throughout the specification, unless otherwise specifically stated, when an element is referred to as "including" or "comprising" another element, it means that the element can further include other elements, without excluding the other elements.

[0026] In the drawings, the X direction can be defined as the second direction, L direction, or length direction, the Y direction can be defined as the third direction, W direction, or width direction, and the Z direction can be defined as the first direction, stacking direction, T direction, or thickness direction.

[0027] Multilayer electronic assembly

[0028] Figure 1 is a schematic perspective view of a multilayer electronic assembly according to an exemplary embodiment.

[0029] Figure 2 is a cross-sectional view taken along Figure 1 line I-I' in

[0030] Figure 3is a schematic exploded perspective view of a main body according to an exemplary embodiment in which a dielectric layer and internal electrodes are stacked.

[0031] Figure 4 is Figure 2 is a magnified view of the P region in

[0032] Hereinafter, a multilayer electronic component 100 according to an exemplary embodiment will be described with reference to the accompanying drawings. Figures 1 to 4

[0033] ​The multilayer electronic component 100 according to the exemplary embodiment can include a main body 110, a first external electrode 131, a second external electrode 132, and a silicon (Si) organic compound layer 140. The main body 110 includes dielectric layers 111 and first and second internal electrodes 121 and 122 which are alternately stacked with respective dielectric layers interposed therebetween, and has first and second surfaces 1 and 2 which are opposite to each other in a stacking direction, third and fourth surfaces 3 and 4 which are connected to the first and second surfaces 1 and 2 and are opposite to each other, and fifth and sixth surfaces 5 and 6 which are connected to the first, second, third, and fourth surfaces 1, 2, 3, and 4 and are opposite to each other. The first external electrode 131 includes a first electrode layer 131a connected to the first internal electrode 121, a first conductive resin layer 131b disposed on the first electrode layer 131a, a first plating layer 131c disposed on the first conductive resin layer 131b, and is divided into a first connecting portion A1 disposed on the third surface 3 of the main body 110 and a first band portion B1 extending from the first connecting portion A1 to a portion of each of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6. The second external electrode 132 includes a second electrode layer 132a connected to the second internal electrode 122, a second conductive resin layer 132b disposed on the second electrode layer 132a, and a second plating layer 132c disposed on the second conductive resin layer 132b, and is divided into a second connecting portion A2 disposed on the fourth surface 4 of the main body 110 and a second band portion B2 extending from the second connecting portion A2 to a portion of each of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6. The silicon (Si) organic compound layer 140 has a main body covering portion 143 disposed in a region of an outer surface of the main body 110 in which the first and second electrode layers 131a and 132a and the first and second conductive resin layers 131b and 132b are not disposed, a first extension portion 141 disposed to extend from the main body covering portion 143 to a region between the first conductive resin layer 131b and the first plating layer 131c in the first band portion B1, and a second extension portion 142 disposed to extend from the main body covering portion 143 to a region between the second conductive resin layer 132b and the second plating layer 132c in the second band portion B2. For example, the first extension portion 141 extends only between the first conductive resin layer 131b and the first plating layer 131c in the first band portion B1, and the second extension portion 142 extends only between the second conductive resin layer 132b and the second plating layer 132c in the second band portion B2.

[0034] In the main body 110, the dielectric layers 111 and the internal electrodes 121 and 122 are alternately stacked.

[0035] The shape of the main body 110 is not limited, but can have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of ceramic powder particles included in the main body 110 during sintering, the main body 110 can have a substantially hexahedral shape rather than a hexahedral shape having a complete straight line.

[0036] The main body 110 can have a first surface 1 and a second surface 2 opposite each other in a thickness direction (Z direction), a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite each other in a length direction (X direction), and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4 and opposite each other in a width direction (Y direction).

[0037] The plurality of dielectric layers 111 constituting the main body 110 are in a sintered state and can be integrated with each other such that a boundary therebetween can not be apparent without using a scanning electron microscope (SEM).

[0038] According to an exemplary embodiment, a raw material forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead-based composite perovskite material, a strontium titanate-based material, or the like can be used.

[0039] Various ceramic additives, organic solvents, plasticizers, binders, dispersants, or the like can be added to a powder of barium titanate (BaTiO3) or the like as a material for forming the dielectric layer 111 according to the purpose of the present disclosure.

[0040] The main body 110 can have a capacitance forming portion provided in the main body 110 and including a first internal electrode 121 and a second internal electrode 122 provided to face each other with the dielectric layer 111 interposed therebetween to form a capacitance, and an upper protective layer 112 and a lower protective layer 113 provided above and below the capacitance forming portion, respectively.

[0041] The capacitance forming portion can contribute to the capacitance of a capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0042] The upper protective layer 112 can be formed by stacking a single dielectric layer or two or more dielectric layers in the vertical direction on the upper surface of the capacitor formation portion, the lower protective layer 113 can be formed by stacking a single dielectric layer or two or more dielectric layers in the vertical direction on the lower surface of the capacitor formation portion, and the upper protective layer 112 and the lower protective layer 113 can substantially function to prevent damage to the internal electrodes due to physical or chemical stress.

[0043] The upper protective layer 112 and the lower protective layer 113 can not include the internal electrodes, but can include the same material as that of the dielectric layer 111.

[0044] The plurality of internal electrodes 121 and 122 can be disposed to face each other with the dielectric layer 111 interposed therebetween.

[0045] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122, which are alternately disposed to face each other with a respective dielectric layer interposed therebetween.

[0046] The first internal electrode 121 and the second internal electrode 122 can be respectively exposed to the third surface 3 and the fourth surface 4.

[0047] Referring to Figure 2 , the first internal electrode 121 can be spaced apart from the fourth surface 4 and can be exposed through the third surface 3, and the second internal electrode 122 can be spaced apart from the third surface 3 and can be exposed through the fourth surface 4. The first external electrode 131 can be disposed on the third surface 3 of the main body 110 to be connected to the first internal electrode 121, and the second external electrode 132 can be disposed on the fourth surface 4 of the main body 110 to be connected to the second internal electrode 122.

[0048] For example, the first internal electrode 121 is connected to the first external electrode 131 without being connected to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 without being connected to the first external electrode 131. Accordingly, the first internal electrode 121 is formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second internal electrode 122 is formed to be spaced apart from the third surface 3 by a predetermined distance.

[0049] The first internal electrode 121 and the second internal electrode 122 can be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0050] Referring to Figure 3 , the main body 110 can be formed by alternately stacking the dielectric layer 111 on which the first internal electrode 121 is printed and the dielectric layer 111 on which the second internal electrode 122 is printed in the thickness direction (Z direction) and sintering the dielectric layers 111.

[0051] The material forming the first and second internal electrodes 121 and 122 is not limited. For example, the first and second internal electrodes 121 and 122 can be formed using a conductive paste including at least one of a noble metal material such as palladium (Pd), a palladium-silver (Pd-Ag) alloy, etc., nickel (Ni), and copper (Cu).

[0052] The method of printing the conductive paste can be a screen printing method, a gravure printing method, etc., but is not limited thereto.

[0053] The external electrodes 131 and 132 are disposed on the main body 110, and the external electrode 131 includes an electrode layer 131a, a conductive resin layer 131b, and a plating layer 131c, and the external electrode 132 includes an electrode layer 132a, a conductive resin layer 132b, and a plating layer 132c.

[0054] The external electrodes 131 and 132 can include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122.

[0055] The first external electrode 131 can include a first electrode layer 131a, a first conductive resin layer 131b, and a first plating layer 131c, and the second external electrode 132 can include a second electrode layer 132a, a second conductive resin layer 132b, and a second plating layer 132c. The first and second electrode layers 131a and 132a can be formed on the third and fourth surfaces 3 and 4 (opposite end surfaces) of the main body 110, respectively, and can extend inward in the length direction along the surfaces (e.g., the first and second surfaces 1 and 2, and the fifth and sixth surfaces 5 and 6) of the main body 110 connecting the third and fourth surfaces 3 and 4 to each other, e.g., toward the center of the main body 110.

[0056] When the first external electrode 131 is divided according to the position where it is disposed, the first external electrode 131 is divided into a first connection portion A1 disposed on the third surface 3 of the main body and a first belt portion B1 extending from the first connection portion A1 to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6.

[0057] When the second external electrode 132 is divided according to the position where it is disposed, the second external electrode 132 is divided into a second connection portion A2 disposed on the fourth surface 4 of the main body and a second belt portion B2 extending from the second connection portion A2 to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6.

[0058] The first electrode layer 131a and the second electrode layer 132a can be formed using any material as long as it is a material having electrical conductivity such as metal, and a specific material can be determined in consideration of electrical properties, structural stability, and the like.

[0059] For example, the first electrode layer 131a and the second electrode layer 132a can include a conductive metal and glass.

[0060] The conductive metal used for the electrode layers 131a and 132a is not limited as long as it can be electrically connected to the internal electrode to form a capacitor, and the conductive metal can include at least one selected from the group consisting of, for example, copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0061] The electrode layers 131a and 132a can be formed by applying a conductive paste and sintering the conductive paste, the conductive paste being prepared by adding a glass frit to conductive metal powder particles.

[0062] When the first electrode layer 131a and the second electrode layer 132a do not include a conductive metal and glass, the corner portions where the connection portion A1 and the belt portion B1 intersect and the corner portions where the connection portion A2 and the belt portion B2 intersect can be formed to be thin, or separation can occur between the end portion of the belt portion B1 and the main body 110 and between the end portion of the belt portion B2 and the main body 110. Therefore, since moisture resistance reliability can be problematic, the effect of improving moisture resistance reliability can be more effective when the first electrode layer 131a and the second electrode layer 132a include a conductive metal and glass.

[0063] The first electrode layer 131a and the second electrode layer 132a can be formed by atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, or the like.

[0064] Further, the first electrode layer 131a and the second electrode layer 132a can be formed by transferring a sheet including a conductive metal onto the main body 110.

[0065] The conductive resin layers 131b and 132b can include a conductive metal and a base resin.

[0066] The conductive metal included in the conductive resin layers 131b and 132b serves to electrically connect the conductive resin layers 131b and 132b to the first plating layer 131c and the second plating layer 132c, respectively.

[0067] The conductive metal included in the conductive resin layers 131b and 132b is not limited as long as it can be electrically connected to the first plating layer 131c and the second plating layer 132c, and can include at least one selected from the group consisting of, for example, copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0068] The conductive metal included in the conductive resin layers 131b and 132b can include at least one of a spherically shaped powder particle and a flaky powder particle. For example, the conductive metal can include only the flaky powder particle, or can include only the spherically shaped powder particle, or can include a mixture of the flaky powder particle and the spherically shaped powder particle.

[0069] The spherically shaped powder particle can have an incomplete spherical shape, and can have a shape in which, for example, a ratio of a length of a long axis to a length of a short axis (long axis / short axis) is 1.45 or less.

[0070] The flaky powder particle refers to a powder particle having a flat and elongated shape, and is not limited to a specific shape, and, for example, a ratio of a length of a long axis to a length of a short axis (long axis / short axis) can be 1.95 or more.

[0071] The lengths of the long axis and the short axis of the spherically shaped powder particle and the flaky powder particle can be measured from an image obtained by scanning a cross section (L-T cross section) in an X direction and a Z direction with a scanning electron microscope (SEM), the cross section (L-T cross section) being taken from a central portion of the multilayer electronic component in a width (Y) direction.

[0072] The base resin included in the conductive resin layers 131b and 132b serves to secure adhesiveness and to absorb an impact.

[0073] The base resin included in the conductive resin layers 131b and 132b is not limited as long as it has adhesiveness and impact absorbability and is mixed with the conductive metal powder particle to prepare a paste, and the base resin can include, for example, an epoxy-based resin.

[0074] The first plating layer 131c and the second plating layer 132c serve to improve mounting characteristics. In addition, when a bending stress is generated, the first plating layer 131c and the second plating layer 132c can be peeled off for preventing a bending crack.

[0075] The first plating layer 131c can be a nickel (Ni) plating layer or a tin (Sn) plating layer, and the second plating layer 132c can also be a Ni plating layer or a Sn plating layer.

[0076] A first additional plating layer 131d can further be provided on the first plating layer 131c, and a second additional plating layer 132d can further be provided on the second plating layer 132c. In this case, the first plating layer 131c and the second plating layer 132c can each be a Ni plating layer, and the first additional plating layer 131d and the second additional plating layer 132d can each be a Sn plating layer.

[0077] The first plating layer 131c and the second plating layer 132c can each include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0078] The Si organic compound layer 140 has a main body covering portion 143, a first extension portion 141, and a second extension portion 142. The main body covering portion 143 is provided in a region of the outer surface of the main body 110 in which the first electrode layer 131a and the second electrode layer 132a and the first conductive resin layer 131b and the second conductive resin layer 132b are not provided. The first extension portion 141 is provided so as to extend from the main body covering portion 143 to a region between the first plated layer 131c and the first conductive resin layer 131b in the first band portion B1. The second extension portion 142 is provided so as to extend from the main body covering portion 143 to a region between the second plated layer 132c and the second conductive resin layer 132b in the second band portion B2.

[0079] The Si organic compound layer 140 functions to prevent stress generated when the multilayer electronic component 100 is mounted on a substrate from propagating to the main body 110 when the substrate is deformed due to thermal and physical shocks, and to prevent cracks.

[0080] Further, the Si organic compound layer 140 functions to improve moisture resistance by blocking a moisture penetration path.

[0081] The base resin included in the conductive resin layers 131b and 132b also functions to absorb shocks, but the function of the base resin is limited because the first conductive resin layer 131b and the second conductive resin layer 132b must be provided so as to be insulated from each other.

[0082] Further, because the main body covering portion 143 does not include a conductive metal and is provided in a region of the outer surface of the main body 110 in which the first electrode layer 131a and the second electrode layer 132a are not provided, the main body covering portion 143 is provided in a wider region to more effectively absorb shocks and inhibit stress propagation.

[0083] Further, the main body covering portion 143 can prevent moisture from penetrating into the main body 110 through the outer surface of the main body 100 by sealing fine pores or cracks of the main body 110.

[0084] The first extension portion 141 is provided so as to extend from the main body covering portion 143 to a region between the first plated layer 131c and the first conductive resin layer 131b in the first band portion B1, and functions to inhibit stress propagation to the main body 110 and prevent cracks.

[0085] Further, the first extension portion 141 functions to inhibit separation between an end portion of the first electrode layer 131a provided in the first band portion B1 and the main body 110, to improve moisture resistance reliability.

[0086] The second extension portion 142 is provided so as to extend from the main body covering portion 143 to a region between the second plated layer 132c and the second conductive resin layer 132b in the second band portion B2, and functions to inhibit stress propagation to the main body 110 and prevent cracks.

[0087] Further, the second extension portion 142 functions to improve moisture resistance reliability by suppressing separation between the end portion of the second electrode layer 132a provided in the second band portion B2 and the main body 110.

[0088] Further, since the extension portions 141 and 142 of the Si organic compound layer 140 have low bonding strength with the plating layers 131c and 132c, peeling of the plating layers 131c and 132c can occur when a bending stress is generated. Therefore, the extension portions 141 and 142 can function to prevent a bending crack.

[0089] However, when the bonding force between the extension portions 141 and 142 and the plating layers 131c and 132c is too low, peeling can occur even under a low bending stress, and thus, a bending crack can not be effectively prevented.

[0090] Therefore, openings (for example, openings H1 and H2 in FIG. 1) can be formed in the first extension portion 141 and the second extension portion 142, so that the plating layers 131c and 132c are in contact with the conductive resin layers 131b and 132b through the openings. Therefore, a predetermined bonding force can be ensured to more effectively prevent a bending crack. Figure 2

[0091] The Si organic compound layer 140 can be formed by forming the first electrode layer 131a and the second electrode layer 132a on the main body 110 including a dielectric layer and an internal electrode, forming the first conductive resin layer 131b and the second conductive resin layer 132b on the first electrode layer 131a and the second electrode layer 132a, respectively, forming a silicon (Si) organic compound layer on the exposed outer surface of the main body 110 and on the first conductive resin layer 131b and the second conductive resin layer 132b, and removing a portion of the Si organic compound layer formed on the first conductive resin layer 131b and the second conductive resin layer 132b.

[0092] The method of removing the Si organic compound layer can be, for example, laser processing, mechanical polishing, dry etching, wet etching, masking deposition using a protective layer, or the like.

[0093] The Si organic compound layer 140 can include an alkoxysilane.

[0094] Therefore, the Si organic compound layer 140 has a polymer form including a plurality of carbon-silicon bond structures, and has hydrophobicity.

[0095] The alkoxysilane prevents moisture penetration and contamination, and penetrates into various inorganic substrates and then solidifies to protect the product and increase durability. Further, the alkoxysilane can react with a hydroxyl (OH) group, and thus, a strong chemical bond can be formed to improve durability.

[0096] ​Compared to the epoxy resin or the inorganic compound, the epoxy resin is difficult to effectively inhibit the penetration of moisture because it does not have a hydrophobic effect, a large amount of CO2 gas can be generated during curing to cause detachment, and the inorganic compound does not have a functional group capable of reacting with a hydroxyl group when applied to the surface of the main body 110, thus being difficult to adhere to the surface of the main body 110 and not forming a chemical bond. Accordingly, it can be difficult to apply the epoxy resin or the inorganic compound to the present disclosure.

[0097] Accordingly, since the Si organic compound layer 140 can include an alkoxysilane, an effect of sealing a fine pore or a crack can be further improved, and a bending stress and a moisture resistance reliability can be further improved.

[0098] When a thickness of the first conductive resin layer 131b on the first electrode layer 131a in the first belt portion B1 is defined as Ta and a thickness of the first extension portion 141 is defined as Tb, Tb / Ta can be greater than or equal to 0.5 and less than or equal to 0.9.

[0099] Figure 4 is Figure 2 an enlarged view of the P region in Figure 4 The thickness of the first conductive resin layer 131b on the first electrode layer 131a and the first extension portion 141 in the first belt portion B1 will be described in detail. However, the relevant detailed description can be equally applied to the thickness of the second conductive resin layer 132b on the second electrode layer 132a and the second extension portion 142 in the second belt portion B2.

[0100] After preparing sample chips while changing a ratio (Tb / Ta) of the thickness Tb of the first extension portion 141 to the thickness Ta of the first conductive resin layer 131b on the first electrode layer 131a in the first belt portion B1, the bending strength and the equivalent series resistance (ESR) were evaluated, and the results are shown in Tables 1 and 2, respectively.

[0101] The bending strength was measured by a bending strength measurement method using a piezoelectric effect. After mounting the sample of the multilayer ceramic capacitor on a substrate, the distance from the central portion pressed during bending was set to 6 mm to observe whether a crack occurred in the sample chip. A comparison of the number of sample chips in which a crack occurred to the total number of sample chips is shown.

[0102] According to the ESR evaluation, the sample chip was maintained at a temperature of -55℃ for 30 minutes, and the temperature was increased to 125℃ and then maintained for 30 minutes, which is one cycle. After 500 cycles were applied, a sample in which the ESR was greater than 50 mΩ was determined to be defective. A comparison of the number of sample chips having a defective ESR to the total number of sample chips is shown.

[0103] Table 1

[0104]

[0105] Referring to Table 1, in Test 1 in which Tb / Ta is 0.3, cracks occurred in three sample chips out of the total of 300 sample chips.

[0106] On the other hand, in Test 2, Test 3, Test 4, Test 5, and Test 6 in which Tb / Ta is 0.5 or more, there were no sample chips in which cracks occurred. Thus, the bending strength is excellent.

[0107] Table 2

[0108]

[0109] Referring to Table 2, in Test 5 in which Tb / Ta is 1.1, ESR defects occurred in five sample chips out of the total of 1600 sample chips. In Test 6 in which Tb / Ta is 1.3, ESR defects occurred in twelve sample chips out of the total of 1600 sample chips.

[0110] On the other hand, in Test 1, Test 2, Test 3, and Test 4 in which Tb / Ta is 0.9 or less, there were no sample chips in which ESR defects occurred. Thus, the ESR characteristics are excellent.

[0111] Thus, in order to improve the bending strength while ensuring excellent ESR characteristics, the ratio (Tb / Ta) of the thickness Tb of the first extension portion 141 to the thickness Ta of the first conductive resin layer 131b on the first electrode layer 131a in the first belt portion B1 can be specifically greater than or equal to 0.5 and less than or equal to 0.9.

[0112] Figure 5 is a schematic perspective view of a multilayer electronic component according to another exemplary embodiment.

[0113] Figure 6 is a cross-sectional view taken along line II-II' in Figure 5 .

[0114] Figure 7 is a schematic perspective view showing a modified example of a multilayer electronic component according to another exemplary embodiment.

[0115] Figure 8 is a cross-sectional view taken along line III-III' in Figure 7 .

[0116] Hereinafter, reference will be made to Figures 5 to 8A multi-layer electronic component 100' according to another exemplary embodiment and a modified example 100" thereof will be described. However, a description common to the multi-layer electronic component 100 according to the embodiment will be omitted to avoid redundant description.

[0117] The multilayer electronic component 100' according to the exemplary embodiment can include a main body 110, a first external electrode 131, a second external electrode 132, and a silicon (Si) organic compound layer 140'. The main body 110 includes a dielectric layer 111 and first and second internal electrodes 121 and 122 alternately stacked with respective dielectric layers interposed therebetween, and has a first surface 1 and a second surface 2 opposite to each other in a stacking direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces 1 and 2 and opposite to each other, and a fifth surface 5 and a sixth surface 6 connected to the first, second, third, and fourth surfaces 1, 2, 3, and 4 and opposite to each other. The first external electrode 131 includes a first electrode layer 131a connected to the first internal electrode 121, a first conductive resin layer 131b disposed on the first electrode layer 131a, a first plating layer 131c disposed on the first conductive resin layer 131b, and is divided into a first connecting portion C1 disposed on the third surface 3 of the main body 110 and a first band portion B1 extending from the first connecting portion C1 to a portion of each of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6. The second external electrode 132 includes a second electrode layer 132a connected to the second internal electrode 122, a second conductive resin layer 132b disposed on the second electrode layer 132a, and a second plating layer 132c disposed on the second conductive resin layer 132b, and is divided into a second connecting portion C2 disposed on the fourth surface 4 of the main body 110 and a second band portion B2 extending from the second connecting portion C2 to a portion of each of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6. The silicon (Si) organic compound layer 140' has a main body covering portion 143 disposed in a region of an outer surface of the main body 110 in which the first and second electrode layers 131a and 132a and the first and second conductive resin layers 131b and 132b are not disposed, a first extension portion 141' disposed to extend from the main body covering portion 143 to a region between the first plating layer 131c and the first conductive resin layer 131b, and a second extension portion 142' disposed to extend from the main body covering portion 143 to a region between the second plating layer 132c and the second conductive resin layer 132b. Similarly to the above embodiment, when a thickness of the first conductive resin layer 131b on the first electrode layer 131a is defined as Ta and a thickness of the first extension portion 141' is defined as Tb, or a thickness of the second conductive resin layer 132b on the second electrode layer 132a is defined as Ta and a thickness of the second extension portion 142' is defined as Tb, Tb / Ta can be greater than or equal to 0.5 and less than or equal to 0.9.The first extension portion 141' and the second extension portion 142' can have a first opening H1 and a second opening H2, respectively.

[0118] The first conductive resin layer 131b can be in contact with the first plating layer 131c through the first opening H1, and the second conductive resin layer 132b can be in contact with the second plating layer 132c through the second opening H2. For example, the first opening H1 can be filled with the first plating layer 131c, and the second opening H2 can be filled with the second plating layer 132c.

[0119] The Si organic compound layer 140' can be formed by forming the first electrode layer 131a and the second electrode layer 132a on the main body 110 including the dielectric layer and the internal electrode, forming the first conductive resin layer 131b and the second conductive resin layer 132b on the first electrode layer 131a and the second electrode layer 132a, respectively, forming a silicon (Si) organic compound layer on the exposed outer surface of the main body 110 and the first conductive resin layer 131b and the second conductive resin layer 132b, and removing a portion of the Si organic compound layer formed on the first conductive resin layer 131b and the second conductive resin layer 132b to form the first opening H1 and the second opening H2.

[0120] The method of removing the area in which the openings H1 and H2 will be formed can be, for example, laser processing, mechanical polishing, dry etching, wet etching, masking deposition using a protective layer, etc.

[0121] In this case, the area of the first opening H1 can be 20% to 90% of the area of the first extension portion 141', and the area of the second opening H2 can be 20% to 90% of the area of the second extension portion 142'.

[0122] When the area of the first opening H1 is less than 20% of the area of the first extension portion 141', the electrical connectivity between the first plating layer 131c and the first conductive resin layer 131b deteriorates to increase the ESR. On the other hand, when the area of the first opening H1 is greater than 90% of the area of the first extension portion 141', the effect of improving the bending strength and moisture resistance reliability of the Si organic compound layer 140' can be insufficient.

[0123] The first opening H1 can be provided in one or more of the first band portion B1 and the first connection portion C1, and the second opening H2 can be provided in one or more of the second band portion B2 and the second connection portion C2.

[0124] As Figure 6 illustrated, the first extension portion 141' can have a form in which the first opening H1 is provided only in the first connection portion C1, and the second extension portion 142' can have a form in which the second opening H2 is provided only in the second connection portion C2.

[0125] Further, as shown in Figure 8 The first extension 141" can have a form in which the first opening H1 is provided in both the first connection portion C1 and the first band portion B1, and the second extension 142" can have a form in which the second opening H2 is provided in both the second connection portion C2 and the second band portion B2.

[0126] The shapes and the number of the openings H1 and H2 are not limited, and each of the openings H1 and H2 can have a shape such as a circular shape, a rectangular shape, an elliptical shape, a rectangular shape with rounded corners, or the like, and can have an irregular shape.

[0127] As described above, the multilayer electronic component can include a silicon (Si) organic compound layer having a main body covering portion provided in a region of an outer surface of a main body in which an electrode layer and a conductive resin layer are not provided, and an extension portion provided to extend from the main body covering portion to between the conductive resin layer and a plating layer of an outer electrode, and thus the bending strength can be improved.

[0128] Further, the Si organic compound layer can be provided to improve moisture resistance reliability.

[0129] While embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the disclosure defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body includes a dielectric layer and alternatingly stacked first and second inner electrodes, with the corresponding dielectric layer between the first and second inner electrodes. The body has a first and second surface opposite to each other in the stacking direction, a third and fourth surface connected to the first and second surfaces and opposite to each other, and a fifth and sixth surface connected to the first, second, third, and fourth surfaces and opposite to each other. The first external electrode includes a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer, and a first plating layer disposed on the first conductive resin layer. Each of the first electrode layer, the first conductive resin layer, and the first plating layer has a first connecting portion and a first strip portion. The first connecting portion is disposed on the third surface of the body, and the first strip portion extends from the first connecting portion to a portion of each of the first surface, the second surface, the fifth surface, and the sixth surface. The second external electrode includes a second electrode layer connected to the second internal electrode, a second conductive resin layer disposed on the second electrode layer, and a second plating layer disposed on the second conductive resin layer. Each of the second electrode layer, the second conductive resin layer, and the second plating layer has a second connecting portion and a second strip portion. The second connecting portion is disposed on the fourth surface of the body, and the second strip portion extends from the second connecting portion to a portion of each of the first surface, the second surface, the fifth surface, and the sixth surface. A silicone organic compound layer has a main cover portion, a first extension portion, and a second extension portion. The main cover portion is disposed on the outer surface of the main body in a region located between a first conductive resin layer and a second conductive resin layer. The first extension portion extends from the main cover portion to a region between a first strip portion of the first conductive resin layer and a first strip portion of a first plating layer. The first conductive resin layer contacts the first plating layer through an opening in the first extension portion. The second extension portion extends from the main cover portion to a region between a second strip portion of the second conductive resin layer and a second strip portion of the second plating layer. The second conductive resin layer contacts the second plating layer through an opening in the second extension portion. The first conductive resin layer and the second conductive resin layer comprise a conductive metal and a matrix resin. Wherein, the area of ​​the opening in the first extension is 20% to 90% of the area of ​​the first extension, and The area of ​​the opening in the second extension is 20% to 90% of the area of ​​the second extension.

2. The multilayer electronic component according to claim 1, wherein, The organosilicon compound layer includes alkoxysilanes.

3. The multilayer electronic component according to claim 2, wherein, Tb / Ta is greater than or equal to 0.5 and less than or equal to 0.9, wherein the thickness of the first conductive resin layer on the first strip portion of the first electrode layer is defined as Ta and the thickness of the first extension portion is defined as Tb.

4. The multilayer electronic assembly according to claim 1, wherein, The first electrode layer and the second electrode layer comprise conductive metal and glass.

5. The multilayer electronic assembly according to claim 1, further comprising: A first additional coating and a second additional coating are respectively disposed on the first coating and the second coating.

6. The multilayer electronic component according to claim 1, wherein, The first conductive resin layer contacts the first plating layer through an opening in the first extension located in the first connection portion, and the second conductive resin layer contacts the second plating layer through an opening in the second extension located in the second connection portion.

7. The multilayer electronic assembly according to claim 1, wherein, The main body cover is disposed on the outer surface of the main body where the first electrode layer and the second electrode layer, as well as the first conductive resin layer and the second conductive resin layer, are not disposed.

8. The multilayer electronic component according to claim 6, wherein, The first conductive resin layer contacts the first plating layer through an opening in the first extension located in the first connecting portion and the first strip portion, and the second conductive resin layer contacts the second plating layer through an opening in the second extension located in the second connecting portion and the second strip portion.

9. A multilayer electronic component, comprising: The body includes a dielectric layer and alternatingly stacked first and second inner electrodes, with the corresponding dielectric layer between the first and second inner electrodes. The body has a first and second surface opposite to each other in the stacking direction, a third and fourth surface connected to the first and second surfaces and opposite to each other, and a fifth and sixth surface connected to the first, second, third, and fourth surfaces and opposite to each other. The first external electrode includes a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer, and a first plating layer disposed on the first conductive resin layer. Each of the first electrode layer, the first conductive resin layer, and the first plating layer has a first connecting portion and a first strip portion. The first connecting portion is disposed on the third surface of the body, and the first strip portion extends from the first connecting portion to a portion of each of the first surface, the second surface, the fifth surface, and the sixth surface. The second external electrode includes a second electrode layer connected to the second internal electrode, a second conductive resin layer disposed on the second electrode layer, and a second plating layer disposed on the second conductive resin layer. Each of the second electrode layer, the second conductive resin layer, and the second plating layer has a second connecting portion and a second strip portion. The second connecting portion is disposed on the fourth surface of the body, and the second strip portion extends from the second connecting portion to a portion of each of the first surface, the second surface, the fifth surface, and the sixth surface. A silicone organic compound layer has a main cover portion, a first extension portion, and a second extension portion. The main cover portion is disposed on the outer surface of the main body in a region located between a first conductive resin layer and a second conductive resin layer. The first extension portion is configured to extend from the main cover portion to a region between the first plating layer and the first conductive resin layer. The second extension portion is configured to extend from the main cover portion to a region between the second plating layer and the second conductive resin layer. The first extension has a first opening, and the second extension has a second opening. Wherein, the first opening is provided in at least one of the first strip portion and the first connecting portion, and The second opening is provided in at least one of the second belt portion and the second connecting portion. Wherein, the area of ​​the first opening is 20% to 90% of the area of ​​the first extension, and The area of ​​the second opening is 20% to 90% of the area of ​​the second extension.

10. The multilayer electronic component according to claim 9, wherein, The first opening is provided in both the first strip portion and the first connecting portion, and The second opening is provided in both the second belt portion and the second connecting portion.

11. The multilayer electronic assembly according to claim 9, wherein, The organosilicon compound layer includes alkoxysilanes.

12. The multilayer electronic assembly according to claim 11, wherein, Tb / Ta is greater than or equal to 0.5 and less than or equal to 0.9, wherein the thickness of the first conductive resin layer on the first strip portion of the first electrode layer is defined as Ta and the thickness of the first extension portion is defined as Tb.

13. The multilayer electronic assembly according to claim 9, wherein, The first conductive resin layer and the second conductive resin layer comprise a conductive metal and a matrix resin.

14. The multilayer electronic assembly according to claim 9, wherein, The first electrode layer and the second electrode layer comprise conductive metal and glass.

15. The multilayer electronic assembly according to claim 9, further comprising: A first additional coating and a second additional coating are respectively disposed on the first coating and the second coating.

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