System for processing substrates and method for maintaining the same

Abstract

The present invention provides a system for processing substrates capable of inhibiting an increase in the footprint of the system and capable of performing maintenance of a vacuum transfer chamber, and a method for maintaining the same. The system for processing substrates of the present invention includes: an atmospheric transfer chamber; a vacuum transfer chamber; processing modules provided with vacuum processing chambers; and a load lock chamber, the vacuum transfer chamber and the load lock chamber being arranged at a height position where an operator can enter, a space on the lower side of the vacuum transfer chamber being closed from the outside by a plurality of the processing modules, except for a surface connected to the load lock chamber. The space on the lower side of the load lock chamber becomes a maintenance passage where the operator can enter and reach the space on the lower side of the vacuum transfer chamber from a direction other than the surface connected to the atmospheric transfer chamber.

Description

TECHNICAL FIELD

[0001] The present application relates to a system for processing a substrate and a maintenance method thereof. BACKGROUND

[0002] In a device that performs processing of a semiconductor wafer (hereinafter, referred to as "wafer") as a substrate in a manufacturing process of a semiconductor device, there is a device that houses a wafer in a vacuum processing chamber and supplies a processing gas to perform film formation or etching, or the like. Further, there is known a processing system in which a plurality of vacuum processing chambers are connected to a common vacuum transfer chamber in order to perform processing with high efficiency.

[0003] In such a processing system having a plurality of vacuum processing chambers, the number of devices provided in the system also increases. On the other hand, when the processing system is arranged in a factory in which the floor area is limited, reduction of the footprint becomes a large problem. Therefore, when it is intended to arrange a plurality of devices provided in the processing system in a limited space to achieve reduction of the footprint, securing of a maintenance space for performing maintenance of each device becomes a problem.

[0004] Patent Document 1 discloses a substrate processing device in which one side of a vacuum transfer chamber having a planar shape configured as a polygon of five sides or more is set as a maintenance region, and processing chambers of glass substrates are connected to the other sides of the vacuum transfer chamber.

[0005] PRIOR ART DOCUMENTS

[0006] PATENT DOCUMENTS

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2011-233788 SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] The present application provides a technology capable of suppressing increase of the footprint of a system and capable of performing maintenance of a vacuum transfer chamber.

[0010] MEANS FOR SOLVING THE PROBLEMS

[0011] The present invention provides a system capable of processing a substrate using a plurality of vacuum processing chambers, characterized by comprising: an atmospheric transfer chamber for performing transfer of the substrate under an atmospheric atmosphere; a vacuum transfer chamber for performing transfer of the substrate under a vacuum atmosphere; a plurality of processing modules configured by arranging the vacuum processing chambers and a facility provided in conjunction with the vacuum processing chambers in the up-down direction; and a load lock chamber provided between the atmospheric transfer chamber and the vacuum transfer chamber, capable of switching the inside between the atmospheric atmosphere and the vacuum atmosphere in a state in which the substrate is accommodated, the vacuum transfer chamber and the load lock chamber being arranged at a height position at which an operator can enter the lower side thereof, the load lock chamber and the plurality of vacuum processing chambers being connected to the side of the vacuum transfer chamber, the space on the lower side of the vacuum transfer chamber being closed from the outside by the plurality of processing modules except for the surface connected to the load lock chamber, and the space on the lower side of the load lock chamber becoming a maintenance passage through which the operator can enter and reach the space on the lower side of the vacuum transfer chamber from a direction other than the surface connected to the atmospheric transfer chamber.

[0012] Effects of the Invention

[0013] According to the present invention, it is possible to suppress an increase in the occupied area of the system and to perform maintenance of the vacuum transfer chamber. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a plan view of a substrate processing system of the present invention.

[0015] Figure 2 is an appearance perspective view of a substrate processing system of the present invention.

[0016] Figure 3 is a perspective view showing a configuration example of a drive mechanism of a multi-joint arm and a transfer container thereof.

[0017] Figure 4 is a perspective view showing a configuration example of a slide plate.

[0018] Figure 5 is a plan view showing a configuration example of the above slide plate.

[0019] Figure 6A is a first explanatory view of a delivery action example of the drive mechanism via the maintenance passage.

[0020] Figure 6B is a second explanatory view of the delivery action example of the above drive mechanism.

[0021] Explanation of Reference Numerals

[0022] P operator, 1 substrate processing system, 12A atmospheric transfer chamber, 12B load lock chamber, 16 maintenance passage, 23 vacuum transfer chamber, 3 processing module. DETAILED DESCRIPTION

[0023] <Overall Configuration>

[0024] Reference Figure 1 The overall configuration of the substrate processing system 1 of the embodiment of the present application is explained with reference to a plan view. In the present embodiment, the substrate processing system 1 which performs film formation processing as a vacuum processing on a wafer W as a substrate is exemplified. The substrate processing system 1 includes an in-out port 11, an in-out module 12, a vacuum transfer module 13, and a processing module 3. Figure 1 The processing module 3 includes two vacuum processing chambers 31A, 31B each of which can accommodate a wafer W. These vacuum processing chambers 31A, 31B are arranged in lateral directions with a gap between side walls. In the substrate processing system 1 of the present embodiment, a wafer transport robot having a multi-joint arm 24A can be used to transport wafers W into these vacuum processing chambers 31A, 31B. Then, in these vacuum processing chambers 31A, 31B, film formation processing can be performed on each wafer W with the same processing conditions.

[0025]

[0026] Next, each part constituting the substrate processing system 1 is explained. In the present embodiment, the X-axis direction is set as the front-rear direction (the base end side of the X-axis is set as the front), and the Y-axis direction orthogonal to the X-axis is set as the lateral direction (the same as in Figure 1 Figure 2 Figure 5 Figure 6A Figure 6B

[0027] The four in-out ports 11 are connected to the in-out module 12, and a wafer transport container 10 for accommodating a wafer W can be placed at each in-out port 11. In the substrate processing system 1, the in-out ports 11, the in-out module 12, and the vacuum transfer module 13 are arranged in this order in the front-rear direction. Moreover, the processing module 3 is connected to the left and right sides of the vacuum transfer module 13 and the rear side when viewed from the front. That is, the vacuum transfer module 13 of the present embodiment is connected to three processing modules 3 with its sides surrounded from three directions.

[0028] ​​​​​​The load-in / out module 12 includes an atmospheric transfer chamber 12A and a load lock chamber 12B. The atmospheric transfer chamber 12A is an atmospheric atmosphere, and includes a multi-joint arm 21 for transferring wafers W between the wafer transfer container 10 and the load lock chamber 12B. The multi-joint arm 21 is liftable, rotatable, and extendable. In addition, the multi-joint arm 21 is supported on a base portion 211, and the base portion 211 is movable in the left-right direction as viewed from the front side along a travel rail 212.

[0029] The load lock chamber 12B is provided between the atmospheric transfer chamber 12A and the vacuum transfer chamber 13. The load lock chamber 12B is capable of switching the atmosphere inside between an atmospheric atmosphere and a vacuum atmosphere in a state in which wafers W are accommodated. The load lock chamber 12B of the present example includes two placement portions 22 arranged in the left-right direction as viewed from the front side. The multi-joint arm 21 of the atmospheric transfer chamber 12A is capable of transferring wafers W between the two placement portions 22 and the wafer transfer container 10, and hands over wafers W one piece with respect to each of the two placement portions 22. The placement portion 22 includes an unillustrated substrate support portion, which is constituted by, for example, support pins for supporting positions separated in the circumferential direction of a wafer W from a central portion of the wafer W.

[0030] The vacuum transfer module 13 includes a vacuum transfer chamber 23 in which a multi-joint arm 24A is provided, the vacuum transfer chamber 23 being capable of forming a vacuum atmosphere inside. The multi-joint arm 24A is liftable, rotatable, and extendable. An end effector 25 constituting a front end portion of the multi-joint arm 24A includes two holding portions 26 formed at a spacing from each other. By holding wafers W one piece with respect to each of the holding portions 26, the multi-joint arm 24A is capable of transferring two wafers W together at a prescribed spacing. In addition, the end effector 25 is provided, for example, two pieces at a spacing in the up-down direction, and one end effector 25 is capable of receiving wafers W from a chamber (the load lock chamber 12B, the vacuum processing chambers 31A, 31B), and the other end effector 25 is capable of sending out wafers W to the chamber.

[0031] As described above, the multi-joint arm 24A is capable of transferring two wafers W together. Therefore, it is possible to transfer two wafers W together between the vacuum processing chambers 31A, 31B and the vacuum transfer module 13. In addition, it is also possible to transfer two wafers W together between the load lock chamber 12B and the vacuum transfer module 13.

[0032] The multi-joint arm 24A and a drive portion 24B described later constitute a substrate transfer robot of the present example.

[0033] Each vacuum processing chamber 31A and 31B is depressurized by a vacuum exhaust mechanism (not shown) to create a vacuum atmosphere. A stage 32 is provided inside each vacuum processing chamber 31A and 31B, and the wafer W is placed on this stage 32 for film deposition. For example, when film deposition is performed while heating the wafer W, a heater can be provided in the stage 32. Additionally, each vacuum processing chamber 31A and 31B can be equipped with a gas supply unit, consisting of a nozzle or the like, for supplying film-deposition gas to the wafer W placed on the stage 32. These heaters and gas supply units are not shown in the figures. Furthermore, a support pin (not shown) is provided in the stage 32 for the transfer of the wafer W being fed in and out.

[0034] Here, the vacuum processing chambers 31A and 31B are not limited to those capable of film formation, but can also be capable of etching, cleaning, ashing, and other processes.

[0035] Gate valves G are respectively installed between the atmospheric delivery chamber 12A and the load locking chamber 12B, between the load locking chamber 12B and the vacuum delivery module 13, and between each vacuum processing chamber 31A, 31B of the processing module 3 and the vacuum delivery module 13. The gate valves G can be used to open and close the delivery port of the wafer W and independently regulate the atmosphere in the atmospheric delivery chamber 12A and each of the chambers 12B, 23, 31A, 31B.

[0036] In the substrate processing system 1 described above, after the wafer W is transported from the wafer transport container 10 to the vacuum processing chambers 31A and 31B connected to the vacuum transport module 13 and processed, it returns to the wafer transport container 10.

[0037] <Layout of vacuum delivery module 13>

[0038] For substrate processing system 1 with the above structure, refer to... Figure 2 The exterior 3D diagram and other images provide a more detailed explanation of its layout.

[0039] like Figure 1 As shown, in this example, the vacuum delivery module 13 is configured as a square vacuum delivery chamber 23 when viewed from above, with one load locking chamber 12B and three processing modules 3 connected to the four sides respectively.

[0040] like Figure 6A As shown in the schematic diagram, the vacuum delivery chamber 23 is configured as a flat shell in the vertical direction, and the load locking chamber 12B and the processing module 3 described above can be connected to its side walls. For example, when using... Figure 1As explained above, the multi-joint arm 24A is provided inside the vacuum transfer chamber 23, and on the other hand, the drive section 24B for driving the multi-joint arm 24A is provided outside the vacuum transfer chamber 23.

[0041] As shown in Figure 6A , the vacuum transfer chamber 23 is supported from the lower surface side by the framework section 231 of the skeleton structure, and is arranged at a position above the floor F of the building of the semiconductor factory in which the substrate processing system 1 is installed. Between the lower surface of the vacuum transfer chamber 23 supported on the framework section 231 and the floor F of the factory, a space having a height dimension of, for example, about 1000 to 1600 mm is formed.

[0042] A cable box 232 in which a power supply cable for supplying electric power to the electric power consuming equipment, a cable for instruments, and the like are housed can be arranged in a space in the range of about 150 to 300 mm from the floor in the space. The cable box 232 is arranged in the range of about 150 to 300 mm from the floor in the space.

[0043] Further, the space between the upper surface of the cable box 232 and the lower surface of the vacuum transfer chamber 23 becomes a maintenance space 230 in which the operator P can enter and perform a maintenance operation.

[0044] Here, in the vacuum transfer chamber 23 of the present example, the multi-joint arm 24A can be used to perform transfer of the wafer W at a transfer height of 1500 mm or more from the floor F. The transfer height in the conventional vacuum transfer chamber 23 is set in the range of about 1100 to 1350 mm. In the vacuum transfer chamber 23 of the present example, by setting the transfer height of the wafer W at a higher position than in the past, the maintenance space 230 in which the operator P can easily perform an operation is ensured.

[0045] Further, the drive section 24B for driving the multi-joint arm 24A can be arranged in the maintenance space 230. As also shown in Figure 3 , the drive section 24B is configured as a columnar body, for example, a cylinder, which is longer in the up-down direction, and has a height dimension in the range of about 550 to 850 mm and a maximum diameter in the range of about 350 to 550 mm.

[0046] A drive mechanism for performing the up-down, rotation, and extension / contraction operation of the multi-joint arm 24A is housed inside the drive section 24B. The drive section 24B is installed in the central portion of the lower surface of the vacuum transfer chamber 23 in a state in which the long axis of the cylinder is oriented in the up-down direction. Further, the drive section 24B is suspended and supported in a manner in which it projects downward from the lower surface of the vacuum transfer chamber 23 toward the maintenance space 230 (the state in which the drive section 24B is installed in the vacuum transfer chamber 23 is not shown). The drive section 24B together with the multi-joint arm 24A constitutes the substrate transfer robot in the present example.

[0047] Layout of processing module 3

[0048] Next, the layout of the processing module 3 connected to the side surface of the vacuum transfer chamber 23 will be described. As used herein, the "layout" means the arrangement of the processing module 3 in the horizontal plane. Figure 1 As explained above, in the substrate processing system 1 of the present example, two vacuum processing chambers 31A, 31B are connected to each of the three side surfaces of the vacuum transfer chamber 23. Various devices such as a gas supply section for supplying a film formation gas, an exhaust system for performing vacuum exhaust of the vacuum processing chambers 31A, 31B, an electric power supply system for supplying electric power to a heater or the like, and control devices related to various controls can be provided in association with each of the vacuum processing chambers 31A, 31B. In the following description, these devices will also be referred to as "associated devices".

[0049] On the other hand, as explained in the background art, in the substrate processing system 1, it is required to suppress an increase in the footprint of the substrate processing system 1 provided on the floor F of a factory. In particular, in the case where two vacuum processing chambers 31A, 31B are arranged adjacent to each other, the associated devices are required to be provided in association with each of the vacuum processing chambers 31A, 31B, and therefore, it is necessary to efficiently arrange these multiple devices.

[0050] Therefore, in the substrate processing system 1 of the present example, the vacuum processing chambers 31A, 31B and the associated devices thereof are arranged in the vertical direction to constitute the processing module 3, and an increase in the footprint of each processing module 3 is suppressed. For example, the processing module 3 is configured to assemble the above-described vacuum processing chambers 31A, 31B and the associated devices thereof in a rack of a skeletal structure, and to arrange them in the vertical direction. The processing module 3 can be configured to cover the outer surface of the rack in which the multiple devices are housed with a housing 30.

[0051] As indicated by the broken lines in Figure 2 , in the processing module 3, the vacuum processing chambers 31A, 31B are arranged at a height position at which the vacuum transfer chamber 23 can be connected.

[0052] The processing modules 3 connected to each of the three side surfaces of the vacuum transfer chamber 23 are of the same structure. By employing the processing modules 3 of the same structure, as compared with the case where different structures of the processing modules 3 are provided depending on the arrangement position, it is possible to reduce the design cost. In addition, it is possible to suppress the occurrence of inconsistency in the processing conditions of the wafer W caused by the difference in the arrangement positions of the vacuum processing chambers 31A, 31B and the associated devices, and the difference in the pipe length or the like accompanying therewith, and it is possible to perform uniform film formation processing between different processing modules 3.

[0053] As Figure 1As illustrated, the width of the processing module 3 coincides with the width of the side wall of the vacuum transport chamber 23 when viewed from the vacuum transport chamber 23 side. Also, the depth of the processing module 3 when viewed from the same direction coincides with the depth of the vacuum processing chambers 31A, 31B. In this way, the plurality of devices are concentratedly arranged in a relatively narrow region in each processing module 3.

[0054] As a result of the plurality of devices being concentratedly arranged in each processing module 3 as described above, as illustrated in FIG. 1, the processing modules 3 are arranged in a row in the front-rear direction on the upper side of the vacuum transport chamber 23. Figure 2 As illustrated, the upper end of the processing module 3 protrudes to a position higher than the upper surface of the vacuum transport chamber 23 supported on the framework portion 231. As the height dimension of the processing module 3, a range of about 2500 to 3500 mm can be exemplified.

[0055] Also, as illustrated in FIG. 1, the processing module 3 extends from the floor F side of the factory in which the substrate processing system 1 is arranged to a height position above the upper surface of the vacuum transport chamber 23. By providing the processing module 3 having such a structure along the three side surfaces of the vacuum transport chamber 23, the maintenance space 230 on the lower side of the vacuum transport chamber 23 described below becomes a state of being closed from three sides by these processing modules 3. Figure 2 Figure 6A As illustrated, the processing module 3 extends from the floor F side of the factory in which the substrate processing system 1 is arranged to a height position above the upper surface of the vacuum transport chamber 23. By providing the processing module 3 having such a structure along the three side surfaces of the vacuum transport chamber 23, the maintenance space 230 on the lower side of the vacuum transport chamber 23 described below becomes a state of being closed from three sides by these processing modules 3.

[0056] <Layout of the atmospheric transport chamber 12A and the load lock chamber 12B>

[0057] Next, the layout structure of the atmospheric transport chamber 12A and the load lock chamber 12B will be described.

[0058] As illustrated in the schematic external structure in FIG. 2, the load lock chamber 12B is configured as a housing that is flat in the front-rear direction. The placement portion 22 in the load lock chamber 12B is provided in such a manner that the handover height of the wafer W between the unillustrated support pin and the multi-joint arm 24A on the vacuum transport chamber 23 side coincides with the transport height of the wafer W (1500 mm or more from the floor F) described above. Figure 6A In addition, a gate valve G is provided on each of the side surfaces of the load lock chamber 12B in the front-rear direction.

[0059] As illustrated, the load lock chamber 12B is supported from the lower surface side by the framework portion 122 of the skeletal structure and is arranged at a position above the floor F. A space having a height dimension of about 800 to 1400 mm is formed between the lower surface of the load lock chamber 12B supported on the framework portion 122 and the floor F.

[0060] Figure 6A

[0061] ​​​The cable box 232 and the like described above can be arranged in a space in a range of a distance of about 150 to 300 mm from the floor 150. In addition, a space between the upper surface of the cable box 232 and the lower surface of the load lock chamber 12B is connected to the maintenance space 230 on the vacuum transfer chamber 23 side, and becomes a maintenance passage 16 through which the operator P can pass to enter the maintenance space 230.

[0062] As shown in Figure 2 , the atmospheric transfer chamber 12A includes a housing for arranging the multi-joint arm 21 that constitutes a space in which the wafer W is transferred by the multi-joint arm 21, and the in-out port 11 is connected to the front surface of the housing. The atmospheric transfer chamber 12A has a height dimension from the floor F side to a height position above the upper surface of the vacuum transfer chamber 23. In addition, the width dimension of the atmospheric transfer chamber 12A as viewed from the front side is wider than the width dimensions of the load lock chamber 12B and the vacuum transfer chamber 23.

[0063] As shown in Figure 1 , a recess is formed in the back surface of the atmospheric transfer chamber 12A, and the front side half of the load lock chamber 12B is fitted into the recess. With this structure, it is possible to arrange the touch panel display 101 and a control computer and the like not shown as equipment constituting the substrate processing system 1 in the regions on both sides of the load lock chamber 12B, and to avoid the substrate processing system 1 from increasing in size more than necessary.

[0064] < Maintenance Passage >

[0065] In the substrate processing system 1 having the layout structure described above, the maintenance space 230 formed on the lower side of the vacuum transfer chamber 23 is closed from the outside by the processing modules 3 except for the surface connected to the load lock chamber 12B. Here, "closed" is not limited to, for example, a case where the processing modules 3 arranged adjacent to each other are closely arranged without a gap therebetween. Even in a case where gaps are formed between these processing modules 3, in a case where the operator P cannot enter from the gaps, it can be said that these surfaces are in a state where the processing modules 3 are closed from the outside for the operator P.

[0066] In addition, the atmospheric transfer chamber 12A is arranged on the front surface of the load lock chamber 12B, and therefore, it is also impossible to enter the maintenance space 230 from the front side. Therefore, the substrate processing system 1 of the present example is configured so that the operator P can enter the maintenance space 230 via the maintenance passage 16 from a direction other than the front side, that is, the side side, with respect to the surface connected to the atmospheric transfer chamber 12A (the front surface of the load lock chamber 12B) when viewed from the front side.

[0067] On the other hand, as described above, in the substrate processing system 1 of the present example, the front side half of the load lock chamber 12B is fitted with the recess formed in the back surface of the atmospheric transfer chamber 12A. Therefore, in such a state, there is also a case where the operator P cannot enter the maintenance passage 16 via the gap between the load lock chamber 12B and the processing module 3.

[0068] Therefore, as Figure 2 shown, when the atmospheric transfer chamber 12A is viewed from the front, a notch portion 121 is formed, for example, in the lower position at the back of the right hand. In addition, in the region opposite to the notch portion 121 of the atmospheric transfer chamber 12A, a notch portion 31 is also formed on the processing module 3 side. The tunnel-like space formed by these notch portions 121, 31, together with the space on the lower side of the load lock chamber 12B, constitutes a part of the maintenance passage 16. Further, the maintenance passage 16 formed by the notch portions 121, 31 opens to the side surface of the atmospheric transfer chamber 12A, forming an opening portion 16a, whereby the operator P can enter the maintenance passage 16. As an example of the opening size of the opening portion 16a, the structure of the transfer container 5 of the drive section 24B described later will be described.

[0069] Further, if there is a sufficient gap between the atmospheric transfer chamber 12A and the processing module 3, which the operator P can enter, it is not a necessary condition to provide the above-described notch portions 121, 31.

[0070] On the other hand, as described above, the regions on both sides of the load lock chamber 12B are also used as regions in which the constituent devices of the substrate processing system 1 are arranged. In this regard, when the notch portion 121 is formed in the atmospheric transfer chamber 12A, the arrangement space of the devices is correspondingly reduced. From this viewpoint, in the substrate processing system 1 of the present example, no opening portion 16a is provided (no notch portion 121 is formed) on the left-hand side of the atmospheric transfer chamber 12A when viewed from the front.

[0071] Further, here, as described above, in the substrate processing system 1 of the present example, the processing modules 3 are of the same structure as each other. Therefore, although the other processing module 3 arranged on the back side and the left-hand side of the vacuum transfer chamber 23 is shielded and cannot be seen in Figure 2 the drawing, the notch portion 31 is formed in the same position in the other processing module 3. These notch portions 31 are not of a size in which the operator P can enter the maintenance space 230. On the other hand, these notch portions 31 can be used as a light window when the operator P performs an operation inside the maintenance space 230, a passage for handing over small parts, an arrangement space of a power supply cable for a jig used when performing a maintenance operation, and the like.

[0072] <Transfer Jig of Drive Section 24B>

[0073] Next, a configuration example of a jig (transport container 5, slide plate 6) for carrying in and out the drive section 24B, which is one of the largest devices provided in the vacuum transport chamber 23, via the maintenance passage 16 described above will be described. In the substrate processing system 1 of the present example, the drive section 24B is housed in the transport container 5, and the transport container 5 is moved by sliding on the detachable slide plate 6 laid along the transport path thereof to perform transport.

[0074] <Transport container 5>

[0075] Figure 3 An appearance perspective view of the drive section 24B and its transport container 5 is shown. The drive section 24B, which is configured as a cylinder having a height dimension of about 550 to 850 mm as described above, is supported in a vertically standing state in a manner that protrudes downward from the lower surface of the vacuum transport chamber 23. In addition, the drive section 24B has a weight of about 60 to 100 kg. Therefore, when a device such as an aerial crane or a hoist is not used, it is difficult to perform an operation of laying the drive section 24B horizontally. However, there is no room to arrange such a device in the narrow maintenance space 230.

[0076] Therefore, in the substrate processing system 1 of the present example, the transport container 5 is configured as a cage-shaped container capable of housing the drive section 24B in a vertically standing state. In the case where the lower end of the drive section 24B supported in a suspended state from the lower surface of the vacuum transport chamber 23 interferes with the upper end of the transport container 5, it is also possible to make a part of the upper side of the transport container 5 a detachable portion 52 detachable with respect to the main body portion 51 as exemplified in the middle example. Figure 3

[0077] A resin plate 53 is provided on the bottom surface of the transport container 5, and it is possible to reduce the friction with the slide plate 6 to make the sliding movement easy. In addition, since no casters for movement are provided, it is possible to reduce the height dimension of the transport container 5.

[0078] The transport container 5 in a state of housing the drive section 24B has a height dimension in the range of about 600 to 950 mm and a width dimension in the range of about 400 to 600 mm. Therefore, the height and width of the maintenance passage 16 and the opening portion 16a formed by the atmospheric transport chamber 12A and the notch portions 121, 31 of the processing modules 3 are configured to have dimensions through which the transport container 5 in a state of housing the drive section 24B can pass.

[0079] <Slide plate 6>

[0080] The slide plate 6 is provided on the floor of the space (maintenance passage 16, maintenance space 230) on the lower side of the load lock chamber 12B and the vacuum transport chamber 23 from the opening portion 16a of the maintenance passage 16 to the mounting position of the drive section 24B. In the present example, the slide plate 6 is configured as a plate-shaped member having a width dimension of about 400 to 600 mm and a length dimension of about 800 to 1200 mm.​Figure 5 In the diagram, the area used to configure the skateboard 6 is indicated by dashed lines. Furthermore, for ease of illustration, [the following text is missing]. Figure 5 Descriptions of the multi-joint arm 24A and the mounting portion 22 within the load locking chamber 12B are appropriately omitted.

[0081] exist Figure 5 In the example shown, the slide plate 6 is arranged to extend along the conveying path of the drive unit 24B. Figure 4 As shown, at both ends of the conveying path formed by the slide plate 6, there are protruding guide sections 62 with a height of a few millimeters to a few centimeters.

[0082] For example, the skateboard 6 can be constructed by assembling multiple plate components 61 made of polished stainless steel sheets. By assembling multiple plate components 61, the skateboard 6 can be assembled and disassembled on the floor of the maintenance passage 16 and maintenance space 230.

[0083] Here, as a component Figure 3 The resin material of the resin plate 53 at the bottom of the conveying container 5 shown can be selected from resin materials with a coefficient of friction with the stainless steel plate constituting the slide plate 6 that is, for example, in the range of about 0.03 to 0.3. Examples of such resins include polyacetal, polyester, and fluoropolymer.

[0084] As described above, the slide plate 6 is constructed by combining multiple plate components 61. On the other hand, the transport container 5, which houses the drive unit 24B, can move on the slide plate 6 by sliding. Therefore, when a step is formed at the joint between adjacent plate components 61, the sliding transport container 5 may be stuck by the step, hindering its movement.

[0085] Therefore, as Figure 4 As shown in the enlarged view, at the joint, the corners on the upper surface side of each plate component 61 are chamfered. Figure 4 This illustrates an example of forming a chamfered portion 611 by chamfering a curved surface. The shape of the chamfered portion 611 is not limited to a curved surface; it can also be a chamfered surface with an inclined surface. As a processing method for forming the chamfered portion 611, it can be a pressing process that flattens the corner on the upper surface side of the aforementioned joint, or it can be a process that uses a grinding machine to remove the corner.

[0086] <Maintenance Operations>

[0087] Reference Figure 6A , Figure 6B An example of a maintenance operation, including the disassembly operation of the drive unit 24B, in the substrate processing system 1 having the structure described above will be described. For ease of illustration, the processing module 3 and the atmospheric delivery chamber 12A are omitted from these figures, but in practice...Figure 1 、 Figure 2 As shown in FIG. 1, a processing module 3 and an atmospheric transfer chamber 12A are arranged around the vacuum transfer chamber 23 and the load lock chamber 12B.

[0088] When starting the maintenance operation, the processing of the wafer W in the substrate processing system 1 is ended, and the inside of the vacuum transfer chamber 23 is made into an atmospheric atmosphere. Then, a not-shown cover on the upper surface side of the vacuum transfer chamber 23 is opened, and the multi-joint arm 24A is removed using an overhead crane or a hoist arranged on the upper side of the vacuum transfer chamber 23.

[0089] On the other hand, on the lower side of the vacuum transfer chamber 23 and the load lock chamber 12B, the operator P enters the maintenance space 230 via the maintenance passage 16, and sets the skid 6. Next, the transfer container 5 is carried into the maintenance space 230, the dismounting portion 52 is removed, and the lower end portion of the driving portion 24B is inserted into the opening of the main body portion 51.

[0090] Then, the driving portion 24B is removed from the vacuum transfer chamber 23, and further, the driving portion 24B is slowly lowered and housed in the transfer container 5 (main body portion 51). At this time, it is also possible to slowly lower the driving portion 24B after making the driving portion 24B in a suspended state using the above-mentioned hoist arranged on the upper side of the vacuum transfer chamber 23 via the opening portion of the bottom surface of the vacuum transfer chamber 23 provided for connecting the multi-joint arm 24A and the driving portion 24B. Further, it is also possible to slowly lower the driving portion 24B using a jack arranged on a table or the like to support the flange portion of the driving portion 24B from the lower side.

[0091] After housing the driving portion 24B in the transfer container 5, the dismounting portion 52 is mounted on the main body portion 51 to fix the driving portion 24B. Then, the operator P pushes the transfer container 5 in the traveling direction to slide move the transfer container 5. Figure 6A ) Then, after reaching the formation position of the opening portion 16a by the maintenance passage 16, the transfer container 5 is placed as a whole on a dolly or the like, and is carried to a workshop where the maintenance of the driving portion 24B is performed.

[0092] It is also possible to consider a method of lifting and carrying the driving portion 24B to the upper side of the vacuum transfer chamber 23 using an overhead crane or a hoist. However, as described above, the driving portion 24B has a height dimension in the range of 550 to 850 mm or so. In order to make such a driving portion 24B as a whole pass through the opening portion 16a of the maintenance passage 16, it is necessary to make the height dimension of the driving portion 24B smaller than the height dimension of the opening portion 16a. Figure 2 ​The area above the processing module 3 and the atmospheric transport chamber 12A is removed, and a large structure needs to be set up around the substrate processing system 1 before an overhead crane or winch is installed. Therefore, compared to the case where only the flat articulated arm 24A is transported from the upper surface side, a large-scale transport device must be prepared. In this regard, the drive unit 24B can be transported using a simple structure of transport container 5 and slide plate 6 on the lower side of the vacuum transport chamber 23.

[0093] When installing the drive unit 24B, the drive unit 24B is transported in the reverse order of the above operation and installed on the lower surface of the vacuum delivery chamber 23.

[0094] In addition, not limited to the removal of the drive unit 24B, various maintenance operations that can be performed from the lower surface of the load locking chamber 12B and the vacuum delivery chamber 23 can also be performed by the operator P entering the maintenance passage 16 and the maintenance space 230.

[0095] The substrate processing system 1 described above includes a maintenance passage 16 located on the lower side of the load locking chamber 12B. This maintenance passage 16 provides access for operator P to the maintenance space 230 on the lower side of the vacuum delivery chamber 23. This structure ensures unimpeded access for operator P without requiring large gaps between the processing modules 3 arranged along the side of the vacuum delivery chamber 23 or by omitting one processing module 3. Therefore, it is possible to suppress the increase in the footprint of the substrate processing system 1 and to perform maintenance on the vacuum delivery chamber 23.

[0096] Here, the structure of the substrate processing system 1 is not limited to using... Figure 1 , Figure 2 Examples are provided. For instance, the vacuum delivery chamber 23 may be a long, narrow rectangle in the front-to-back direction, with multiple processing modules 3 arranged on each of the left and right sides when viewed from the front. Alternatively, the vacuum delivery chamber 23 may be a pentagon or larger shape, with processing modules 3 connected to the sides other than the one connected to the load locking chamber 12B.

[0097] In addition, for the processing module 3, it is not necessary to arrange two vacuum processing chambers 31A and 31B in the horizontal direction. It is also possible to set one or more vacuum processing chambers in each module.

[0098] Furthermore, it is not necessary to install the slide plate 6 along the conveying path of the drive unit 24B. Alternatively, the conveying container 5 can be allowed to slide directly on the ground of the maintenance space 230 and the maintenance passage 16.

[0099] In addition, the structure of the transport container 5 can also be variously modified. For example, the drive section 24B can be disposed on a pedestal with casters, and then the pedestal can be moved to transport the drive section 24B, in a state in which the transport container 5 is vertically positioned or in a state in which the transport container 5 is horizontally positioned using a hoist or the like.

[0100] The embodiments disclosed this time are to be considered as illustrative and not restrictive in all points. The embodiments described above can be omitted, substituted, changed, in various ways without departing from the scope and spirit of the appended claims.

Claims

1. A system capable of processing a substrate using multiple vacuum processing chambers, characterized in that, include: An atmospheric transport chamber for transporting the substrate in an atmospheric atmosphere; A vacuum transport chamber for transporting the substrate in a vacuum atmosphere; Multiple processing modules are configured by arranging the vacuum processing chamber and parallel devices disposed therewith in a vertical direction; and A load-locking chamber, located between the atmospheric transport chamber and the vacuum transport chamber, is capable of switching its internal atmosphere between atmospheric and vacuum while the substrate is being housed within it. The vacuum delivery chamber and the load locking chamber are positioned at a height that allows the operator to access their lower sides. The load locking chamber and the plurality of vacuum processing chambers are respectively connected to the side of the vacuum delivery chamber. The space on the lower side of the vacuum delivery chamber, except for the surface connected to the load locking chamber, is enclosed from the outside by the plurality of processing modules. The space below the load locking chamber serves as a maintenance access route for the operator to enter and reach the space below the vacuum delivery chamber from a direction other than the surface connected to the atmospheric delivery chamber. The vacuum transport chamber has a substrate transport robot, which includes a multi-joint arm for substrate transport disposed within the vacuum transport chamber. and a drive mechanism connected to the articulated arm, which is arranged to extend into the space below the vacuum delivery chamber. The maintenance passage has width and height dimensions that allow the drive mechanism, which has been removed from the vacuum delivery chamber, to pass through. The drive mechanism is conveyed while housed in a conveying container, and the width and height of the maintenance passage are such that the conveying container housing the drive mechanism can pass through. A sliding plate is provided on the ground in the space below the vacuum delivery chamber and the load locking chamber, from the maintenance passage to the installation position of the drive mechanism. This plate allows the delivery container to slide.

2. The system as described in claim 1, characterized in that: The drive mechanism is formed as a long column in the vertical direction, which can pass through the maintenance passage with the long axis of the column in the vertical direction.

3. The system as described in claim 1 or 2, characterized in that: The slide plate is arranged to extend along the conveying path of the drive mechanism, and protruding guide portions are provided at both ends of the conveying path.

4. The system as described in claim 1 or 2, characterized in that: The slide plate is configured to be detachable by combining multiple plate components. To prevent the sliding conveyor container from getting stuck, the corners of the upper surface of the joints between adjacent plate components are chamfered.

5. The system as described in claim 1 or 2, characterized in that: The load locking chamber and the vacuum transport chamber are configured at a height position that allows the substrate to be transported at a transport height of more than 1500 mm above the ground of the building where the system is installed.

6. The system as described in claim 1 or 2, characterized in that: The maintenance passage is provided with an opening on either the left or right side of the load locking chamber when viewed from the atmospheric delivery chamber side, and the other side of the maintenance passage leading to the lower side of the load locking chamber is closed due to the arrangement of the equipment constituting the system.

7. A system capable of processing a substrate using multiple vacuum processing chambers, characterized in that, include: An atmospheric transport chamber for transporting the substrate in an atmospheric atmosphere; A vacuum transport chamber for transporting the substrate in a vacuum atmosphere; Multiple processing modules are configured by arranging the vacuum processing chamber and parallel devices disposed therewith in a vertical direction; and A load-locking chamber, located between the atmospheric transport chamber and the vacuum transport chamber, is capable of switching its internal atmosphere between atmospheric and vacuum while the substrate is being housed within it. The vacuum delivery chamber and the load locking chamber are positioned at a height that allows the operator to access their lower sides. The load locking chamber and the plurality of vacuum processing chambers are respectively connected to the side of the vacuum delivery chamber. The space on the lower side of the vacuum delivery chamber, except for the surface connected to the load locking chamber, is enclosed from the outside by the plurality of processing modules. The space below the load locking chamber serves as a maintenance access route for the operator to enter and reach the space below the vacuum delivery chamber from a direction other than the surface connected to the atmospheric delivery chamber. The maintenance passage is provided with an opening on either the left or right side of the load locking chamber when viewed from the atmospheric delivery chamber side, and the other side of the maintenance passage leading to the lower side of the load locking chamber is closed due to the arrangement of the equipment constituting the system.

8. The system as described in claim 7, characterized in that: The vacuum transport chamber includes a substrate transport robot comprising: a multi-jointed arm for substrate transport disposed within the vacuum transport chamber; and a drive mechanism connected to the multi-jointed arm, which is configured to extend into the space below the vacuum transport chamber. The maintenance passage has width and height dimensions that allow the drive mechanism, which has been removed from the vacuum delivery chamber, to pass through.

9. The system as described in claim 8, characterized in that: The drive mechanism is formed as a long column in the vertical direction, which can pass through the maintenance passage with the long axis of the column in the vertical direction.

10. The system as described in claim 8 or 9, characterized in that: The drive mechanism is conveyed while housed in a conveying container, and the width and height of the maintenance passage are such that the conveying container housing the drive mechanism can pass through.

11. The system as described in claim 7 or 8, characterized in that: The load locking chamber and the vacuum transport chamber are configured at a height position that allows the substrate to be transported at a transport height of more than 1500 mm above the ground of the building where the system is installed.

12. A maintenance method for a system capable of processing a substrate using multiple vacuum processing chambers under a vacuum atmosphere, characterized in that: The system includes: an atmospheric transport chamber for transporting the substrate in an atmospheric atmosphere; a vacuum transport chamber for transporting the substrate in a vacuum atmosphere; multiple processing modules configured by arranging the vacuum transport chamber and parallel devices disposed therewith in a vertical direction; and a load locking chamber disposed between the atmospheric transport chamber and the vacuum transport chamber, which is capable of switching its internal atmosphere between atmospheric and vacuum atmospheres while the substrate is contained within it. The vacuum delivery chamber and the load locking chamber are positioned at a height that allows the operator to access their lower sides. The load locking chamber and the plurality of vacuum processing chambers are respectively connected to the side of the vacuum delivery chamber. The space on the lower side of the vacuum delivery chamber, except for the surface connected to the load locking chamber, is enclosed from the outside by the plurality of processing modules. The space below the load locking chamber serves as a maintenance access route for the operator to enter and reach the space below the vacuum delivery chamber from a direction other than the surface connected to the atmospheric delivery chamber. The vacuum transport chamber includes a substrate transport robot comprising: a multi-jointed arm for substrate transport disposed within the vacuum transport chamber; and a drive mechanism connected to the multi-jointed arm, which is configured to extend into the space below the vacuum transport chamber. The maintenance passage has width and height dimensions that allow the drive mechanism, which has been removed from the vacuum delivery chamber, to pass through. The drive mechanism is conveyed while housed in a conveying container, and the width and height of the maintenance passage are such that the conveying container housing the drive mechanism can pass through. A sliding plate is provided on the floor in the space below the vacuum delivery chamber and the load locking chamber, from the maintenance passage to the installation position of the drive mechanism. The operator enters the maintenance path to perform maintenance.

13. A maintenance method for a system capable of processing a substrate using multiple vacuum processing chambers in a vacuum atmosphere, characterized in that: The system includes: an atmospheric transport chamber for transporting the substrate in an atmospheric atmosphere; a vacuum transport chamber for transporting the substrate in a vacuum atmosphere; multiple processing modules configured by arranging the vacuum transport chamber and parallel devices disposed therewith in a vertical direction; and a load locking chamber disposed between the atmospheric transport chamber and the vacuum transport chamber, which is capable of switching its internal atmosphere between atmospheric and vacuum atmospheres while the substrate is contained within it. The vacuum delivery chamber and the load locking chamber are positioned at a height that allows the operator to access their lower sides. The load locking chamber and the plurality of vacuum processing chambers are respectively connected to the side of the vacuum delivery chamber. The space on the lower side of the vacuum delivery chamber, except for the surface connected to the load locking chamber, is enclosed from the outside by the plurality of processing modules. The space below the load locking chamber serves as a maintenance access route for the operator to enter and reach the space below the vacuum delivery chamber from a direction other than the surface connected to the atmospheric delivery chamber. The maintenance passage is arranged with an opening on either the left or right side of the load locking chamber when viewed from the atmospheric transport chamber side. The side of the maintenance passage leading to the lower side of the load locking chamber is closed due to the arrangement of the equipment constituting the system. The operator enters the maintenance path to perform maintenance.

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