A circuit board assembly

Abstract

The present invention discloses a circuit board assembly, which includes: a circuit board with a signal line arranged inside; a high-speed connector with two rows of pins; the pins are bent in the same direction so that the pins are formed with a bent portion and a horizontal portion, one end of the bent portion is connected to the body of the high-speed connector, and the other end of the bent portion is connected to the horizontal portion, and the horizontal portion extends along a side away from the bent portion; a layer-changing via is opened on the circuit board, the layer-changing via is arranged corresponding to the horizontal portion, and the signal line extends into the layer-changing via and is connected to the horizontal portion. With this arrangement, high-speed signals can enter the connector inside the high-speed connector area without having to go around to the outside of the pad, which can reduce the routing length and reduce link loss. At the same time, the space of the overlapping part can be fully utilized, thereby saving external board-level routing space.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic circuits, and in particular to a circuit board assembly. Background Art

[0002] As server internal bus speeds such as PCI-Express (peripheral component interconnect express, abbreviated as PCIe, a high-speed serial computer expansion bus standard) and CXL (Compute Express Link, an open industry standard for high-bandwidth, low-latency device interconnection) continue to increase, board-level design requirements for high-speed signal integrity are becoming increasingly stringent. On-board high-speed connectors, such as slimline connectors and MCIO connectors, are an indispensable part of server design. The basic style of high-speed connectors in existing technologies is shown in the figure below. Figure 1 As shown, high-speed connectors typically have two rows of pins that diverge and connect to a circuit board. The pins have a bend and a horizontal portion at the end closest to the circuit board. One end of the bend connects to the high-speed connector body, while the other end of the bend connects to the horizontal portion, which extends away from the bend.

[0003] like Figure 1 As shown, there are two ways for high-speed signals to enter a high-speed connector from the pins: one is from the outside of the surface mount pad, along the direction of the pin. This is called "toe entry." The other is from the inside of the surface mount pad, skipping the horizontal section and entering directly from the inside of the surface mount pad, along the direction of the bend, and towards the connector. This is called "heel entry." Typically, high-speed signals are required to enter the connector using "toe entry," as heel entry creates pad stubs, which in turn generate reflections that affect high-speed signal quality.

[0004] Figure 2The diagram shows the internal PCB routing of high-speed signals entering a surface-mount high-speed connector using "toe entry." The inner-layer high-speed signal must first go outside the connector pad, punch a hole outside the pad, and switch layers to the surface layer. This requires wrapping around the pad before entering the connector through "toe entry." However, this approach has two disadvantages: First, the trace must first wrap around the pad, increasing the trace length and link loss. Second, the trace requires punching a hole outside the pad to switch layers to the surface layer, occupying the space outside the connector pad on the circuit board. This makes the trace space relatively cramped, which is inconvenient for board-level design. This is especially true for high-density boards where high-speed connectors are placed close to the board edge, making the trace space even more cramped. Summary of the Invention

[0005] Therefore, the technical problem to be solved by the present invention is that the wiring length on the circuit board is long and the wiring space is relatively cramped in the prior art, so as to provide a circuit board assembly.

[0006] To achieve the above-mentioned object, an embodiment of the present invention provides a circuit board assembly, which includes: a circuit board having a signal line disposed therein;

[0007] A high-speed connector is provided with two rows of pins; the pins are bent in the same direction, so that the pins are formed with a bent portion and a horizontal portion, one end of the bent portion is connected to the body of the high-speed connector, and the other end of the bent portion is connected to the horizontal portion, and the horizontal portion extends along a side away from the bent portion;

[0008] A layer-changing via hole is provided on the circuit board. The layer-changing via hole is provided corresponding to the horizontal portion. The signal line extends into the layer-changing via hole and is connected to the horizontal portion.

[0009] Optionally, the circuit board is provided with a wiring layer, the signal line is provided in the wiring layer, and the layer-changing via allows the wiring layer to penetrate the surface of the circuit board.

[0010] Optionally, a plurality of wiring layers are provided inside the circuit board.

[0011] Optionally, the high-speed connector is any one or more of a crimp connector, a patch connector, and a through-hole welding connector.

[0012] Optionally, two rows of conductive members are provided in the high-speed connector, and portions of the two rows of conductive members exposed from the high-speed connector form the two rows of pins.

[0013] Optionally, two rows of conductive members are close to each other in the high-speed connector to form a slot, and the slot is suitable for inserting a card into the high-speed connector.

[0014] Optionally, the two rows of conductive members form two rows of guide portions at an end away from the circuit board, and along the insertion direction of the card, the guide portions are located upstream of the slot.

[0015] Optionally, the two rows of guide portions form a guide groove, and the card is inserted into the slot after passing through the guide groove.

[0016] Optionally, along the insertion direction of the card, the opening of the guide slot gradually becomes smaller.

[0017] Optionally, the guide groove is smoothly connected to the slot.

[0018] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0019] 1. An embodiment of the present invention provides a circuit board assembly, comprising: a circuit board having a signal line disposed therein; a high-speed connector having two rows of pins; the pins being bent in the same direction so as to form a bent portion and a horizontal portion, one end of the bent portion being connected to a body of the high-speed connector, the other end of the bent portion being connected to the horizontal portion, and the horizontal portion extending along a side away from the bent portion; and a layer-changing via provided on the circuit board, the layer-changing via being disposed corresponding to the horizontal portion, the signal line extending into the layer-changing via and then connected to the horizontal portion.

[0020] With this arrangement, the pins are bent in the same direction, forming a bent portion and a horizontal portion. This means that the pins of the high-speed connector are flipped in the same direction during connector manufacturing, changing from "pin heel entry" on the left and "pin tip entry" on the right to "pin tip entry" on the left and "pin tip entry" on the right. This allows high-speed signals to enter the connector from within the high-speed connector area, eliminating the need to detour around the outside of the pads. This reduces routing length and link loss. Furthermore, during routing, the need to punch holes outside the pads to switch layers to the surface makes routing space even more limited when designing high-density boards and placing high-speed connectors close to the board edge. However, in the embodiments of the present invention, by bending the pins in the same direction, one side of the pins can extend between the high-speed connector and the circuit board. This eliminates the need to occupy the space outside the connector pads at the hole-switch location, fully utilizing the space in the overlapped portion between the high-speed connector and the circuit board, thereby saving external board-level routing space.

[0021] Furthermore, in response to the two shortcomings of the high-speed connector routing method in the background technology, namely, the long routing length resulting in large link loss and the large space occupied and the non-utilization of board-level design, the current solution is to punch layer-changing vias on the high-speed connector pads, and the signal directly punches holes on the pads and changes layers, and then enters the connector from the pin tips of the pads. Although this method can reduce the routing length and save space to a certain extent, it requires the addition of a new circuit board manufacturing process, which increases the cost of the circuit board by approximately 10%. However, for this solution, the present application can not only reduce the routing length, but also save some board-level routing space, while also being able to apply existing circuit board manufacturing processes without the need for additional new costs.

[0022] 2. By providing a routing layer within the circuit board and connecting the routing layer to the circuit board surface through layer-switching vias, the present invention ensures that high-speed signals enter the connector from the pin tips without signal reflection. Furthermore, while ensuring signal quality, the length of high-speed signal routing and link loss are minimized, while also reducing the space occupied by high-speed connector routing.

[0023] 3. By providing multiple routing layers, the present invention allows designers to have more options for routing on multi-layer circuit boards, eliminating the need to be constrained by the layout space constraints of a single routing layer. This allows signal lines to have more layers to choose from. Furthermore, it allows for more freedom in selecting appropriate routing paths for complex, noise-sensitive electronic circuits.

[0024] 4. In the embodiment of the present invention, by setting the high-speed connector to multiple types, technical personnel in this field can use different types of high-speed connectors according to actual conditions, and then select appropriate wiring paths for different types of high-speed connectors, so that the circuit board assembly can meet different application scenarios in actual applications and provide more degrees of freedom.

[0025] 5. In the embodiment of the present invention, two rows of conductive parts are provided in the high-speed connector, and the portions of the two rows of conductive parts exposed from the high-speed connector form two rows of pins. In this way, the pins and the conductive parts can be integrally formed. Compared with separately providing the pins and the conductive parts and then welding the pins and the conductive parts, this can obviously ensure the signal integrity of the link during signal transmission and avoid signal interference caused by the welding parts when the pins and the conductive parts are separately provided.

[0026] 6. Compared to simply providing a slot in a high-speed connector, where a separate conductive member is provided for communicating with the card, the present invention utilizes two rows of conductive members positioned adjacent to each other to form a slot in the high-speed connector. The slot is suitable for inserting a card into the high-speed connector. This arrangement improves the stability of the electrical connection between the card and the conductive member, ensuring proper communication between the card and the conductive member. Furthermore, the slot formed by the conductive member can also stabilize the card, along with the existing socket in the high-speed connector, ensuring a stable connection between the card and the high-speed connector.

[0027] 7. In the embodiment of the present invention, two rows of guide portions are formed at the ends of the two rows of conductive members away from the circuit board. When a technician installs a plug-in card into the slot of the high-speed connector, the technician can insert the card along the guide portions. Under the guidance of the guide portions, the technician can more easily insert the card into the slot. Compared with directly inserting the card into the slot without the guide portions, the installation efficiency can be significantly improved.

[0028] 8. In the embodiment of the present invention, the two rows of guide portions form guide grooves, and the card is inserted into the slot after passing through the guide grooves. When a technician installs the card into the slot of the high-speed connector, the technician can insert the card along the guide portions. Under the guidance of the guide portions, the technician can more easily insert the card into the guide grooves, and then slide the card directly into the slot through the guide grooves. Compared with directly inserting the card into the slot without a guide groove, this can significantly improve installation efficiency.

[0029] 9. In this embodiment of the present invention, the opening of the guide slot gradually decreases along the card insertion direction. When installing a card into a high-speed connector slot, if the insertion direction accidentally misaligns with the slot entrance, the guide slot's opening gradually decreases. This allows the technician to insert the card into the slot after reaching the inner edge of the guide slot, thereby expanding the card's insertion range. This eliminates the need for technicians to carefully align the card and allows them to insert it directly into the slot along the larger opening of the guide slot, improving installation efficiency.

[0030] 10. In the embodiment of the present invention, the guide groove is smoothly connected to the slot. During the insertion process, technicians will not be hindered or frictioned by the connection between the guide groove and the slot. This improves the smoothness of the insertion process and reduces the wear and tear on the card during the insertion process, thereby ensuring the signal integrity of the link during signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary workers in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0032] Figure 1 A schematic diagram of a circuit board assembly in the prior art;

[0033] Figure 2 A schematic diagram of the wiring of a circuit board in the prior art;

[0034] Figure 3 is a schematic diagram of a circuit board assembly after pin flipping according to an embodiment of the present invention;

[0035] Figure 4 Schematic diagram of the wiring of the circuit board in an embodiment of the present invention.

[0036] Reference numerals:

[0037] 100, plug-in card; 200, high-speed connector; 300, guide groove; 400, slot; 501, horizontal portion; 502, bending portion; 503, vertical portion; 504, abutting portion; 600, circuit board. DETAILED DESCRIPTION

[0038] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary workers in this field without creative work are within the scope of protection of the present invention.

[0039] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components; and wireless or wired connections. A person skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0041] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0042] As server internal bus speeds such as PCI-Express (peripheral component interconnect express, abbreviated as PCIe, a high-speed serial computer expansion bus standard) and CXL (Compute Express Link, an open industry standard for high-bandwidth, low-latency device interconnection) continue to increase, board-level design requirements for high-speed signal integrity are becoming increasingly stringent. On-board high-speed connectors, such as slimline connectors and MCIO connectors, are an indispensable part of server design. The basic style of high-speed connectors in existing technologies is shown in the figure below. Figure 1 As shown, high-speed connectors typically have two rows of pins that diverge and connect to a circuit board. The pins have a bend and a horizontal portion at the end closest to the circuit board. One end of the bend connects to the high-speed connector body, while the other end of the bend connects to the horizontal portion, which extends away from the bend.

[0043] like Figure 1 As shown, there are two ways for high-speed signals to enter a high-speed connector from the pins: one is from the outside of the connector's surface-mount pads, along the direction of the pins. This refers to entering from the outside of the connector's surface-mount pads, following the horizontal section, the bend, and the direction of the high-speed connector. This is called "toe entry." The other is from the inside of the connector's surface-mount pads, skipping the horizontal section and entering directly from the inside of the connector's surface-mount pads, along the bend and the direction of the high-speed connector. This is called "heel entry." High-speed signals are typically required to enter the connector using toe entry, as heel entry creates pad stubs, which can cause reflections that affect high-speed signal quality.

[0044] Figure 2The diagram shows the internal PCB routing of high-speed signals entering a surface-mount high-speed connector using "toe entry." The inner-layer high-speed signal must first go outside the connector pad, punch a hole outside the pad, and switch layers to the surface layer. This requires wrapping around the pad before entering the connector through "toe entry." However, this approach has two disadvantages: First, the trace must first wrap around the pad, increasing the trace length and link loss. Second, the trace requires punching a hole outside the pad to switch layers to the surface layer, occupying the space outside the connector pad on the circuit board. This makes the trace space relatively cramped, which is inconvenient for board-level design. This is especially true for high-density boards where high-speed connectors are placed close to the board edge, making the trace space even more cramped.

[0045] Example 1

[0046] like Figure 3 As shown, an embodiment of the present invention provides a circuit board assembly, which includes a circuit board 600 and a high-speed connector 200 .

[0047] Specifically, in an embodiment of the present invention, a signal line is provided within the circuit board 600. Circuit boards 600 are categorized by the number of layers into three broad categories: single-layer circuit boards 600, double-layer circuit boards 600, and multi-layer circuit boards 600. First, a single-layer circuit board 600. On the most basic PCB, components are concentrated on one side, and signal lines are concentrated on the other. A double-layer circuit board 600 has copper cladding and wiring on both sides, and vias can be used to connect the lines between the two layers to form the required network connection. A multi-layer board refers to a printed circuit board having three or more conductive graphic layers laminated with insulating materials between them, with the conductive patterns interconnected as required. Multi-layer circuit boards 600 are a product of the development of electronic information technology toward high speed, multi-function, large capacity, small size, thinness, and lightweight.

[0048] Signal lines can be microstrip lines or strip lines. Specifically, it is relatively difficult to control the impedance of microstrip lines, the overall equivalent dielectric constant of microstrip lines is low, and the signal transmission rate on microstrip lines is faster. Because microstrip lines are distributed on the surface of the circuit board 600, they can save layers for high-density wiring, but they are more susceptible to interference. Strip lines are arranged on the inner layer of the circuit board 600. The electric field of the strip line is only within the range of the circuit board 600, so it is relatively easy to control the impedance. The dielectric constant of the medium surrounding the strip line is high, but the signal transmission speed is relatively slow. Because the strip line is inside the circuit board 600, it is not easy to interfere. Of course, this embodiment is only an example of the type of signal line, but it is not limited to this. Those skilled in the art can make changes according to actual conditions to achieve the same technical effect.

[0049] Furthermore, in this embodiment, the high-speed connector 200 is provided with two rows of pins, such as Figure 3 As shown, the pins are bent in the same direction, forming a bent portion 502 and a horizontal portion 501. One end of the bent portion 502 is connected to the body of the high-speed connector 200, and the other end of the bent portion 502 is connected to the horizontal portion 501. The horizontal portion 501 extends along a side away from the bent portion 502. The end of the horizontal portion 501 away from the bent portion 502 is connected to the communication line. This allows the pins to enter the connector from the tip, eliminating solder stubs and reflections, thereby improving high-speed signal quality.

[0050] Specifically, for the shape of the bending portion 502, Figure 3 As shown, it can be formed as a whole by three fold line sections. Along the vertical direction, from top to bottom, the first fold line section, the second fold line section, and the third fold line section are connected in sequence. First, the first fold line section is arranged in the vertical direction, one end of the first fold line section is connected to the body of the high-speed connector 200, the other end of the first fold line section is connected to the upper end of the second fold line section, and the lower end of the second fold line section is connected to the third fold line section. Among them, the second fold line section has a certain angle with the vertical direction. The angle of this angle can be determined by those skilled in the art according to actual conditions. For example, it can be 30°, 45°, 60°, or 75°. Of course, this embodiment is only an example of the angle, but it is not limited to this. It can achieve the same technical effect. The third fold line section is arranged in the horizontal direction, completely attached to the circuit board 600, and the other end of the third fold line section is connected to the horizontal section 501.

[0051] Furthermore, the third fold line portion and the horizontal portion 501 can be arranged in a straight line. That is, the horizontal portion 501 is located on the extension of the third fold line portion, and the length direction of the horizontal portion 501 coincides with the extension direction of the extension line. Of course, the third fold line portion and the horizontal portion 501 can also be integrally formed, that is, the third fold line portion and the horizontal portion 501 are made of the same metal sheet. In addition, the first fold line portion, the second fold line portion, the third fold line portion, and the horizontal portion 501 can all be made of the same metal sheet.

[0052] Of course, this embodiment is only an example of the forming method of the first fold line portion, the second fold line portion, the third fold line portion, and the horizontal portion 501, but it is not limited to this, as long as it can achieve the same technical effect.

[0053] As for the bending direction of the pins, this embodiment is only an example. Figure 3As shown, they are all bent toward the left. Those skilled in the art can change it according to actual conditions. For example, they can all be bent toward the right. Therefore, there is no restriction on the bending direction of the pins, as long as the same technical effect can be achieved.

[0054] Furthermore, in this embodiment, layer-change vias are provided on the circuit board 600, corresponding to the horizontal portion 501. The signal lines extend through the layer-change vias and connect to the horizontal portion 501. Those skilled in the art may designate corresponding layer-change vias based on the actual number of pins on the high-speed connector 200. For example, if the high-speed connector 200 has 8 pins, the circuit board 600 may have 8 corresponding layer-change vias; if the high-speed connector 200 has 16 pins, the circuit board 600 may have 16 corresponding layer-change vias; and if the high-speed connector 200 has 24 pins, the circuit board 600 may have 24 corresponding layer-change vias. This embodiment is merely illustrative; the number of pins or the number of layer-change vias on the high-speed connector 200 do not change; the same technical effect can be achieved.

[0055] In this arrangement, the pins are bent in the same direction so that the pins are formed with a bent portion 502 and a horizontal portion 501. That is, the pins of the high-speed connector 200 are flipped in the same direction during the manufacture of the connector, so that the connector pins are changed from "pin heel entry" on the left and "pin tip entry" on the right to "pin tip entry" on the left and "pin tip entry" on the right. Figure 4 As shown by the dotted line in the figure, the high-speed signal can enter the connector inside the high-speed connector 200 area without having to go around the outside of the pad, which can reduce the routing length and reduce the link loss. At the same time, during the routing process, since it is necessary to punch holes outside the pad to change layers to the surface layer, when designing high-density boards, the routing space is even more cramped when the high-speed connector 200 is placed close to the edge of the board. However, in the embodiment of the present invention, since the pins are bent in the same direction, one side of the pins can extend between the high-speed connector 200 and the circuit board 600. Therefore, the external space of the connector pad can be saved at the punching and layer change location, and the space of the overlapping portion between the high-speed connector 200 and the circuit board 600 can be fully utilized, thereby saving external board-level routing space.

[0056] Furthermore, in response to the two shortcomings of the high-speed connector 200 routing method in the background technology, namely, the long routing length resulting in large link loss and the large space occupied and the non-utilization of board-level design, the current solution is to punch layer-changing vias on the high-speed connector 200 pads. The signal is directly punched on the pads and then changes layers, and then enters the connector from the pin tips of the pads. Although this method can reduce routing length and save space to a certain extent, it requires adding a new circuit board 600 manufacturing process, which increases the cost of the circuit board 600 by approximately 10%. However, for this solution, the present application can not only reduce routing length, but also save some board-level routing space. At the same time, it can also apply the existing circuit board 600 manufacturing process without adding additional new costs.

[0057] Furthermore, in an optional embodiment of the present invention, the circuit board 600 is provided with a routing layer, the signal line being provided within the routing layer, and the layer-changing vias connect the routing layer to the surface of the circuit board 600. Similarly, routing layers can be categorized by the number of layers of the circuit board 600. As described in the above embodiment, circuit boards 600 are categorized by the number of layers into three broad categories: single-layer circuit boards 600, double-layer circuit boards 600, and multi-layer circuit boards 600. Multiple routing layers are generally connected to each other using through holes, buried vias, and blind vias. Multiple routing layers have more buried and blind vias than double-layer boards.

[0058] By providing a routing layer within circuit board 600 and connecting this routing layer to the surface of circuit board 600 through layer-switching vias, this embodiment of the present invention ensures that high-speed signals enter the connector from the pin tips without generating signal reflections. Furthermore, while maintaining signal quality, this minimizes high-speed signal routing length and link loss, while also reducing the space occupied by the routing of high-speed connector 200.

[0059] Furthermore, in an optional embodiment of the present invention, the circuit board 600 is internally provided with multiple routing layers. This embodiment of the present invention provides designers with more layout options when initially designing the routing layout of the multi-layer circuit board 600, eliminating the need to be constrained by the layout space constraints of a single routing layer. This allows signal lines to route through a wider range of board layers. Furthermore, it allows for greater freedom in selecting appropriate routing paths for complex, noise-sensitive electronic circuits.

[0060] Of course, those skilled in the art can change the number of routing layers according to actual conditions. This embodiment is just an example. For example, it can be three layers, four layers, or five layers, but there is no limitation to this. It only needs to achieve the same technical effect.

[0061] Furthermore, in an optional embodiment of the present invention, the high-speed connector 200 is any one or more of a crimp connector, a surface mount connector, and a through-hole solder connector. By providing multiple types of high-speed connectors 200 in this embodiment of the present invention, those skilled in the art can use different types of high-speed connectors 200 according to actual circumstances and select appropriate wiring paths for each type of high-speed connector 200. This allows the circuit board assembly to meet different application scenarios and provide greater flexibility in practical applications.

[0062] Of course, those skilled in the art may change the type of the high-speed connector 200 according to actual conditions. This embodiment is merely an example and is not intended to be limiting. It only needs to achieve the same technical effect.

[0063] Furthermore, in an optional embodiment of the present invention, the high-speed connector 200 is provided with two rows of conductive members, and the portions of the two rows of conductive members exposed from the high-speed connector 200 form the two rows of pins. The conductive members can be made of a metal material, such as gold, silver, copper, iron, tin, or aluminum. Of course, those skilled in the art may modify the material of the conductive members based on practical needs. This embodiment is merely illustrative and not intended to be limiting, as long as the same technical effect is achieved.

[0064] In the embodiment of the present invention, two rows of conductive members are provided in the high-speed connector 200, and the portions of the two rows of conductive members exposed from the high-speed connector 200 are formed into two rows of pins. In this way, the pins and the conductive members can be integrally formed. Compared with separately providing the pins and the conductive members and then welding the pins and the conductive members, this can obviously ensure the signal integrity of the link during the signal transmission process and avoid signal interference caused by the welding parts when the pins and the conductive members are separately provided.

[0065] Furthermore, in an optional embodiment of the present invention, two rows of conductive members are positioned adjacent to each other in the high-speed connector 200 to form a slot 400. The slot 400 is adapted for inserting the card 100 into the high-speed connector 200. The high-speed connector 200 is provided with a socket that communicates with the slot 400. To insert the card 100, a technician first inserts the card 100 into the socket, then inserts it inward along the socket into the slot 400. Once inserted into the slot 400, the high-speed connector 200 can stably receive data from the card 100.

[0066] Compared to simply providing a slot 400 within the high-speed connector 200, where a separate conductive element for communicating with the card 100 is located, the embodiment of the present invention utilizes two rows of conductive elements positioned adjacent to each other within the high-speed connector 200 to form the slot 400, which is suitable for inserting the card 100 into the high-speed connector 200. This arrangement improves the stability of the electrical connection between the card 100 and the conductive elements, ensuring proper communication between the two. Furthermore, the slot 400 formed by the conductive elements also stabilizes the card 100, along with the existing socket in the high-speed connector 200, ensuring a stable connection between the card 100 and the high-speed connector.

[0067] In this embodiment of the present invention, the two rows of conductive members are each provided with a vertical portion 503 and an abutting portion 504. The vertical portions 503 and the abutting portions 504 are interconnected, and the vertical portions 503 are arranged side by side in the vertical direction. The planes on which the vertical portions 503 of the two rows of conductive members lie are parallel to each other. After the card 100 is inserted into the slot 400, the tops of the vertical portions 503 of the two rows of conductive members are flush with the bottom of the card 100. Furthermore, the abutting portions 504 of the two rows of conductive members approach each other and then extend in the vertical direction to form the slot 400. A certain angle is formed between the abutting portions 504 of the two rows of conductive members and their respective vertical portions 503. The angle can be determined by those skilled in the art based on actual conditions, for example, 30°, 45°, 60°, or 75°. Of course, this embodiment is merely illustrative of the angle, and is not intended to be limiting. Any angle that can achieve the same technical effect is sufficient.

[0068] Furthermore, the vertical portion 503 and the abutting portion 504 can be integrally formed, that is, made from the same metal sheet. Furthermore, the vertical portion 503 and the abutting portion 504 can be made from different metal sheets. Of course, this embodiment merely illustrates the molding method of the vertical portion 503 and the abutting portion 504, but is not intended to be limiting. Any method that can achieve the same technical effect is sufficient.

[0069] Furthermore, in an optional embodiment of the present invention, the two rows of conductive members form two rows of guide portions at the end away from the circuit board 600. Along the insertion direction of the card 100, the guide portions are located upstream of the slot 400. The guide portions may be strip-shaped ribs or grooves. Of course, those skilled in the art may modify the structural type of the guide portions based on practical needs. This embodiment is merely illustrative and not limiting, as long as they achieve the same technical effect.

[0070] In the embodiment of the present invention, two rows of guide portions are formed at one end of the two rows of conductive members away from the circuit board 600. When a technician installs the plug-in card 100 into the slot 400 of the high-speed connector 200, the technician can insert the card 100 along the guide portions. Under the guidance of the guide portions, the technician can more easily insert the plug-in card 100 into the slot 400. Compared with directly inserting the plug-in card 100 into the slot 400 without the guide portions, the installation efficiency can be significantly improved.

[0071] Furthermore, in an optional embodiment of the present invention, the two rows of guide portions form a guide groove 300, through which the card 100 is inserted into the slot 400. The guide groove 300 can be a strip-shaped groove, a flared groove, or a funnel-shaped groove. Of course, those skilled in the art may modify the structural type of the guide portion according to actual circumstances. This embodiment is merely illustrative and not limiting, as long as it can achieve the same technical effect.

[0072] In the embodiment of the present invention, the guide groove 300 is formed by two rows of guide portions. The plug-in card 100 is inserted into the slot 400 after passing through the guide groove 300. When a technician installs the plug-in card 100 into the slot 400 of the high-speed connector 200, the technician can insert the card along the guide portion. Under the guidance of the guide portion, the technician can more easily insert the plug-in card 100 into the guide groove 300, and then slide the card 100 directly into the slot 400 through the guide groove 300. Compared with directly inserting the card into the slot 400 without the guide groove 300, the installation efficiency can be significantly improved.

[0073] Furthermore, the guide portion and the abutment portion 504 can be integrally formed, that is, made from the same metal sheet. Furthermore, the guide portion and the abutment portion 504 can be made from different metal sheets. Of course, this embodiment merely illustrates the molding method of the guide portion and the abutment portion 504, but is not intended to be limiting. Any method that can achieve the same technical effect is sufficient.

[0074] Furthermore, in an optional embodiment of the present invention, the opening of the guide slot 300 gradually becomes smaller along the insertion direction of the card 100. Figure 3As shown, a flared groove is used as an example. In this embodiment of the present invention, the opening of the guide slot 300 gradually decreases along the insertion direction of the card 100. When a technician installs the card 100 into the slot 400 of the high-speed connector 200, if the insertion direction accidentally misaligns with the entrance direction of the slot 400, the opening of the guide slot 300 gradually decreases. This allows the technician to insert the card 100 into the inner edge of the guide slot 300 before sliding it into the slot 400, thereby expanding the insertion range of the card 100. During insertion, the technician no longer needs to worry about aligning the card; they can simply insert the card into the slot 400 along the larger opening of the guide slot 300, improving installation efficiency.

[0075] Furthermore, along the insertion direction of the card 100, the top opening of the guide slot 300 needs to be larger than the bottom opening of the guide slot 300, and the bottom opening of the guide slot 300 is the same as the opening of the slot 400, so that when the card 100 is inserted into the slot 400, a smooth transition can be achieved from the guide slot 300 to the slot 400. Furthermore, along the insertion direction of the card 100, the side walls of the guide slot 300 are close to each other, so that there is a certain angle between the side walls of the guide slot 300 and the vertical direction. The angle can be determined by those skilled in the art based on actual conditions, for example, 30°, 45°, 60°, or 75°. Of course, this embodiment is merely an example of the angle, but is not limiting, as long as it can achieve the same technical effect.

[0076] Furthermore, in an optional embodiment of the present invention, the guide groove 300 is smoothly connected to the slot 400. For example, the guide groove 300 and the slot 400 can be connected in such a way that a straight line is tangent to a curve, the straight line and the curve are smoothly connected, and the tangent point is a smooth connection point. Alternatively, the guide groove 300 and the slot 400 can be connected in such a way that the two curves have a common tangent line, the curves on both sides of the common normal are smoothly connected, and the tangent point is a smooth connection point. Of course, those skilled in the art can change the type of smooth connection according to actual conditions. This embodiment is merely an example, but is not intended to be limiting. Any method that can achieve the same technical effect is sufficient.

[0077] The embodiment of the present invention smoothly connects the guide groove 300 and the slot 400. During the insertion process, the technician will not be hindered or frictioned by the connection between the guide groove 300 and the slot 400, thereby improving the smoothness of the insertion process and reducing the wear and tear on the card 100 during the insertion process, thereby ensuring the signal integrity of the link during signal transmission.

[0078] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. A person skilled in the art would be able to make other variations or modifications based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A circuit board assembly, characterized in that: include: A circuit board (600) having a signal line disposed therein; A high-speed connector (200) is provided with two rows of pins; the pins are bent in the same direction so that the pins are formed with a bent portion (502) and a horizontal portion (501); one end of the bent portion (502) is connected to the body of the high-speed connector (200); the other end of the bent portion (502) is connected to the horizontal portion (501); and the horizontal portion (501) extends along a side away from the bent portion (502); A layer-changing via hole is provided on the circuit board (600), the layer-changing via hole is provided corresponding to the horizontal portion (501), and the signal line is connected to the horizontal portion (501) after extending into the layer-changing via hole; Two rows of conductive members are provided in the high-speed connector (200), and portions of the two rows of conductive members exposed from the high-speed connector (200) are formed into two rows of pins, so that the pins and the conductive members are integrally formed.

2. The circuit board assembly according to claim 1, wherein: The circuit board (600) is provided with a wiring layer, the signal line is provided in the wiring layer, and the layer-changing via hole allows the wiring layer to penetrate the surface of the circuit board (600).

3. The circuit board assembly according to claim 2, wherein: A plurality of wiring layers are provided inside the circuit board (600).

4. The circuit board assembly according to any one of claims 1 to 3, characterized in that: The high-speed connector (200) is any one or more of a crimp connector, a patch connector, and a through-hole welding connector.

5. The circuit board assembly according to any one of claims 1 to 3, characterized in that: The two rows of conductive members are close to each other in the high-speed connector (200) to form a slot (400), and the slot (400) is suitable for inserting a card (100) into the high-speed connector (200).

6. The circuit board assembly according to claim 5, wherein: The two rows of conductive members form two rows of guide portions at one end away from the circuit board (600), and along the insertion direction of the plug-in card (100), the guide portions are located upstream of the slot (400).

7. The circuit board assembly according to claim 6, wherein: The two rows of guide portions form a guide groove (300), and the insertion card (100) is inserted into the slot (400) after passing through the guide groove (300).

8. The circuit board assembly according to claim 7, wherein: Along the insertion direction of the insertion card (100), the opening of the guide slot (300) gradually becomes smaller.

9. The circuit board assembly according to claim 7 or 8, characterized in that: The guide groove (300) is smoothly connected to the slot (400).

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