A full-coverage heat sink for a WiFi6 router
By designing a sandwich-structured, fully covered heat sink, the problem of uneven heat dissipation in WiFi 6 routers is solved, achieving more efficient heat dissipation and device stability, and preventing damage from clamping.
Patent Information
- Application Number
- CN202310232246.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-02-28
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2043-02-28
AI Technical Summary
WiFi 6 routers suffer from uneven heat dissipation due to high power consumption and large data throughput, which affects chip lifespan and device structural safety.
The full-coverage heatsink adopts a sandwich structure, including the TOP and BOTTOM heatsinks and the PCB board in the middle. The elastic telescopic structure and adjustment components ensure close contact and uniform heat dissipation, prevent excessive clamping force, and adjust the installation height to enhance ventilation.
It improves heat dissipation, prevents equipment damage, increases stability and heat dissipation uniformity, and adapts to different installation requirements.
Smart Images

Figure CN116234260B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of routers, in particular to a full-coverage heat dissipation fin of a WiFi6 router. BACKGROUND
[0002] A router is a hardware device that connects two or more networks and functions as a gateway between networks, is a special intelligent network device that reads the address in each data packet and then decides how to transmit, and a chip is installed in the router, and the chip generates heat when working, so that the chip needs to be cooled by a heat dissipation fin.
[0003] Due to the characteristics of high power, multiple channels and large data throughput of the current WIFI6 router, the heat generation is particularly large, the heat dissipation is poor, the service life of the chip is affected, and if the heat dissipation is unbalanced, the structure is deformed due to too much heat on a part of the product shell, use is affected, and even safety is harmed.
[0004] Therefore, a full-coverage heat dissipation fin of a WiFi6 router needs to be designed for the above problems. SUMMARY
[0005] The application aims to provide a full-coverage heat dissipation fin of a WiFi6 router to solve the problems in the background art.
[0006] To achieve the above-mentioned purpose, the application provides the following technical scheme: a full-coverage heat dissipation fin of a WiFi6 router, comprising a main body assembly and a first pressing assembly, the main body assembly comprises a TOP face heat dissipation fin, a PCB board and a BOTTOM face heat dissipation fin, and the PCB board is arranged below the TOP face heat dissipation fin, the BOTTOM face heat dissipation fin is arranged at the lower end of the PCB board, the first pressing assembly is arranged above the TOP face heat dissipation fin, a buffer assembly is arranged above the first pressing assembly, and a second pressing assembly is arranged at the lower end of the BOTTOM face heat dissipation fin.
[0007] Further, the buffer assembly is provided with an adjusting assembly on the side away from the central axis of the main body assembly, and an adjusting height assembly is arranged at the lower end of the adjusting assembly on the side close to the central axis of the main body assembly.
[0008] Further, the first pressing assembly comprises a contact pressing plate, a first spring and an extension rod, the first spring is arranged at the upper end of the contact pressing plate, and the extension rod is arranged in the first spring.
[0009] Further, the buffer assembly comprises a first connecting rod, a second connecting rod and a first spiral rotating rod, the second connecting rod is connected to the side away from the central axis of the main body assembly, and the first spiral rotating rod is arranged in the first connecting rod.
[0010] Further, the buffer assembly further comprises a rotating bearing and a friction chuck, and the outer portion of the first screw rod is provided with the rotating bearing, and the lower inner portion of the first screw rod is embedded with the friction chuck.
[0011] Further, the buffer assembly further comprises a flexible rod and a connecting column, and the lower end of the friction chuck is connected with the flexible rod, and the upper surface of the flexible rod is provided with the connecting column in the middle portion.
[0012] Further, the adjusting assembly comprises a containing column, a partition plate, a bearing plate, a second spring and a threaded rod, the inner portion of the containing column is provided with the partition plate, the side of the partition plate close to the central axis of the containing column is provided with the bearing plate, the lower portion of the bearing plate is provided with the second spring, and the inner portion of the bearing plate is penetrated by the threaded rod.
[0013] Further, the adjusting assembly further comprises a clasp ring, a card and a rotating head, and the upper end of the threaded rod is connected with the clasp ring, the left and right sides of the clasp ring are provided with the card, and the upper end of the clasp ring is provided with the rotating head.
[0014] Further, the height adjusting assembly comprises a limiting plate, a connecting head, a third spring and an inner limiting head, and the side of the limiting plate away from the central axis of the adjusting assembly is connected with the connecting head, the side of the connecting head away from the limiting plate is connected with the inner limiting head, and the side of the inner limiting head away from the connecting head is connected with the third spring.
[0015] Further, the height adjusting assembly further comprises a telescopic outer sleeve, a movable connecting block and a second screw rod, and the outer portion of the third spring is provided with the telescopic outer sleeve, the upper and lower ends of the telescopic outer sleeve are provided with the movable connecting block, and the inner portion of the movable connecting block is movably penetrated by the second screw rod.
[0016] Compared with the prior art, the device adopts a sandwich heat dissipation mode, can increase the contact area, maximize the heat dissipation effect, can reduce the non-contact surface test, help to increase the heat dissipation effect of the device, can prevent the damage of the PCB board caused by excessive clamping force, can prevent the clamping looseness of the device, increase the stability of the device, can adjust the installation height, facilitate the ventilation and heat dissipation of the router, and increase the heat dissipation effect.
[0017] 1、The middle position of the TOP surface heat dissipation fin is provided with a boss, which can fully contact with the PCB board, three bosses are on a TOP surface heat dissipation fin, the TOP surface heat dissipation fin can be fully utilized, the heat dissipation is maximized, the BOTTOM surface heat dissipation fin fully covers the PCB board, the heat equalization effect is achieved, the PCB board is stacked in the middle of the TOP surface heat dissipation fin and the BOTTOM surface heat dissipation fin, and the heat dissipation is carried out in a sandwich mode.
[0018] 2、The contact pressing plate of the application forms an elastic expansion structure between the first spring and the buffer assembly, and the elastic expansion structure can tightly press the TOP surface heat sink, so that the TOP surface heat sink and the BOTTOM surface heat sink are in close contact with the PCB board, the non-contact area of the TOP surface heat sink and the BOTTOM surface heat sink with the PCB board is reduced, and the heat generated by the PCB board is more easily absorbed and dissipated by the TOP surface heat sink and the BOTTOM surface heat sink.
[0019] 3、The application can change the resistance of the first screw rod by replacing the friction chuck with different friction coefficients, thereby changing the force required for the first connecting rod and the second connecting rod to separate, and preventing the clamping force of the TOP surface heat sink and the BOTTOM surface heat sink on the PCB board from being too large and causing damage.
[0020] 4、The card can be stuck in the card ring without adjusting the equipment, thereby preventing the threaded rod from automatically rotating under stress and affecting the clamping tightness of the equipment, and the second spring will push the bearing plate to make the card ring better with the card, increasing the stability of the equipment.
[0021] 5、The height adjusting assembly of the application can slide on the sidewall of the containing column, thereby adjusting the distance between the PCB board and the router housing, and controlling the installation distance according to the situation, so that the other side of the TOP surface heat sink and the BOTTOM surface heat sink of the equipment is more conducive to air flow, and the heat dissipation effect of the TOP surface heat sink and the BOTTOM surface heat sink is increased. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 is a front view structural schematic diagram of a full-coverage heat sink of a WiFi6 router of the application;
[0023] Figure 2 is a Figure 1 enlarged structural schematic diagram of position A in the application;
[0024] Figure 3 is a buffer assembly partial section enlarged structural schematic diagram of a full-coverage heat sink of a WiFi6 router of the application;
[0025] Figure 4 is a regulating assembly section enlarged structural schematic diagram of a full-coverage heat sink of a WiFi6 router of the application;
[0026] Figure 5 is a height adjusting assembly top view section enlarged structural schematic diagram of a full-coverage heat sink of a WiFi6 router of the application;
[0027] Figure 6 It is a three-dimensional structure schematic diagram of the TOP surface heat dissipation fin of a WiFi6 router full-coverage heat dissipation fin according to the present application;
[0028] Figure 7 It is a three-dimensional structure schematic diagram of the BOTTOM surface heat dissipation fin of a WiFi6 router full-coverage heat dissipation fin according to the present application.
[0029] In the figure: 1, main body assembly; 101, TOP surface heat dissipation fin; 102, PCB board; 103, BOTTOM surface heat dissipation fin; 2, first pressing assembly; 201, contact pressing plate; 202, first spring; 203, telescopic rod; 3, buffer assembly; 301, first connecting rod; 302, second connecting rod; 303, first screw rod; 304, rotating bearing; 305, friction clamp; 306, flexible rod; 307, connecting column; 4, adjusting assembly; 401, containing column; 402, partition; 403, bearing plate; 404, second spring; 405, threaded rod; 406, snap ring; 407, card; 408, rotating head; 5, height adjusting assembly; 501, limiting plate; 502, connecting head; 503, telescopic sleeve; 504, movable connecting block; 505, second screw rod; 506, third spring; 507, inner limiting head; 6, second pressing assembly. DETAILED DESCRIPTION
[0030] As Figures 1 to 7 shown, the present application provides a technical solution: a WiFi6 router full-coverage heat dissipation fin, which comprises a main body assembly 1 and a first pressing assembly 2, the main body assembly 1 comprises a TOP surface heat dissipation fin 101, a PCB board 102 and a BOTTOM surface heat dissipation fin 103, and the TOP surface heat dissipation fin 101 is provided below the PCB board 102, the lower end of the PCB board 102 is provided with the BOTTOM surface heat dissipation fin 103, the first pressing assembly 2 is located above the TOP surface heat dissipation fin 101, and the first pressing assembly 2 is provided above the buffer assembly 3, and the lower end of the BOTTOM surface heat dissipation fin 103 is provided with a second pressing assembly 6;
[0031] The specific operation is as follows: the TOP surface heat dissipation fin 101 is provided with a boss at the middle position, which can be in full contact with the PCB board 102, three bosses are on one TOP surface heat dissipation fin 101, which can fully utilize the TOP surface heat dissipation fin 101 to maximize heat dissipation, the BOTTOM surface heat dissipation fin 103 fully covers the PCB board 102 to achieve the effect of uniform heating, the TOP surface heat dissipation fin 101 and the BOTTOM surface heat dissipation fin 103 are stacked in the middle of the PCB board 102 to perform heat dissipation in a sandwich manner, and the first pressing assembly 2 and the second pressing assembly 6 respectively clamp the upper and lower sides of the main body assembly 1.
[0032] As Figure 4 andFigure 5 As shown, the buffer assembly 3 is provided with an adjusting assembly 4 away from one side of the axis of the main body assembly 1, and the lower end of the adjusting assembly 4 is provided with an adjusting height assembly 5 close to one side of the axis of the main body assembly 1, and the adjusting height assembly 5 can slide on the side wall of the containing column 401, so as to adjust the distance between the PCB board 102 and the router shell, so as to control the installation distance according to the situation, so that the other side of the TOP surface heat sink 101 and the BOTTOM surface heat sink 103 is more convenient for air flow, and the heat dissipation effect of the TOP surface heat sink 101 and the BOTTOM surface heat sink 103 is increased.
[0033] The buffer assembly 3 can clamp and buffer, and will automatically release the clamping when the clamping force exceeds a certain limit, preventing damage caused by clamping. The adjusting assembly 4 can control the position of the buffer assembly 3, facilitating clamping of the device. The adjusting height assembly 5 can adjust the installation height, facilitating ventilation on both sides of the main body assembly 1.
[0034] As shown in the first pressing assembly 2, the first pressing assembly 2 includes a contact pressing plate 201, a first spring 202, and a telescopic rod 203, and the upper end of the contact pressing plate 201 is provided with the first spring 202, and the inside of the first spring 202 is provided with the telescopic rod 203. Figure 2
[0035] The contact pressing plate 201, the first spring 202, and the telescopic rod 203 constitute an elastic extension structure between the contact pressing plate 201 and the buffer assembly 3, which can tightly press the TOP surface heat sink 101, so that the TOP surface heat sink 101 and the BOTTOM surface heat sink 103 are in close contact with the PCB board 102, reducing the non-contact area between the TOP surface heat sink 101 and the BOTTOM surface heat sink 103 and the PCB board 102, so that the heat generated by the PCB board 102 is more easily absorbed and dissipated by the TOP surface heat sink 101 and the BOTTOM surface heat sink 103.
[0036] As shown in the buffer assembly 3, the buffer assembly 3 includes a first connecting rod 301, a second connecting rod 302, and a first screw rod 303, and the first connecting rod 301 is connected with the second connecting rod 302 away from one side of the axis of the main body assembly 1, and the inside of the first connecting rod 301 is provided with the first screw rod 303. Figure 3
[0037] By the rotation between the flexible rod 306 and the connecting column 307, the friction chuck 305 with different friction coefficients is in contact with the first screw rod 303, so as to change the resistance of the rotation of the first screw rod 303, thereby changing the force required for the separation of the first connecting rod 301 and the second connecting rod 302, and the above structure can prevent the clamping force of the TOP surface fin 101 and the BOTTOM surface fin 103 on the PCB board 102 from being too large, and damage from occurring, and the rotating bearing 304 can support the first screw rod 303.
[0038] As shown in Figure 4 The adjusting assembly 4 comprises a containing column 401, a partition plate 402, a bearing plate 403, a second spring 404 and a threaded rod 405, the inside of the containing column 401 is provided with the partition plate 402, the side close to the central axis of the containing column 401 is provided with the bearing plate 403, the lower part of the bearing plate 403 is provided with the second spring 404, the inside of the bearing plate 403 is penetrated by the threaded rod 405, the adjusting assembly 4 further comprises a clasp ring 406, a card 407 and a rotating head 408, the upper end of the threaded rod 405 is connected with the clasp ring 406, the left and right sides of the clasp ring 406 are provided with the card 407, and the upper end of the clasp ring 406 is provided with the rotating head 408;
[0039] The card 407 can clamp the clasp ring 406 when the equipment is not adjusted, so as to prevent the threaded rod 405 from rotating automatically under force and affect the fastening degree of the clamping of the equipment, and meanwhile the second spring 404 pushes the bearing plate 403, so that the clasp ring 406 can be better clamped with the card 407, and the stability of the equipment is increased, the card 407 and the clasp ring 406 are separated by pressing the rotating head 408 with a tool, and the partition plate 402 can divide the inside of the containing column 401, so as to prevent the adjusting height assembly 5 from affecting the movement of the bearing plate 403.
[0040] As shown in Figure 5 The adjusting height assembly 5 comprises a limiting plate 501, a connecting head 502, a third spring 506 and an inner limiting head 507, the side away from the central axis of the adjusting assembly 4 of the limiting plate 501 is connected with the connecting head 502, the side away from the limiting plate 501 of the connecting head 502 is connected with the inner limiting head 507, and the side away from the connecting head 502 of the inner limiting head 507 is connected with the third spring 506, the adjusting height assembly 5 further comprises a telescopic outer sleeve 503, a movable connecting block 504 and a second screw rod 505, the outside of the third spring 506 is provided with the telescopic outer sleeve 503, the upper and lower ends of the telescopic outer sleeve 503 are provided with the movable connecting block 504, and the inside of the movable connecting block 504 is movably penetrated by the second screw rod 505;
[0041] When the position adjustment of the height adjusting assembly 5 is completed, loosen the telescopic sleeve 503, the third spring 506 will pull the telescopic sleeve 503, make the telescopic sleeve 503 re-suiting to the outside of the inner limiting head 507, so that the second spiral rotating rod 505 re-inserts into the inside of the receiving column 401, auxiliary fixing the telescopic sleeve 503, the rotating connection between the second spiral rotating rod 505 and the movable connecting block 504, through the limiting plate 501 on the receiving column 401 to slide the adjusting position, the connecting head 502 connects the limiting plate 501 and the inner limiting head 507.
[0042] Working principle: first pull the telescopic sleeve 503, through the rotating connection between the second spiral rotating rod 505 and the movable connecting block 504 can make the second spiral rotating rod 505 rotate, from the outer wall of the receiving column 401, then through the limiting plate 501 on the receiving column 401 to slide the adjusting position, when the position adjustment of the height adjusting assembly 5 is completed, loosen the telescopic sleeve 503, the third spring 506 will pull the telescopic sleeve 503, make the telescopic sleeve 503 re-suiting to the outside of the inner limiting head 507, so that the second spiral rotating rod 505 re-inserts into the inside of the receiving column 401, auxiliary fixing the telescopic sleeve 503, then put the TOP surface heat sink 101, PCB board 102 and BOTTOM surface heat sink 103 in the order of from top to bottom, then put the main assembly 1 placed on the four second pressing assembly 6, then press the rotating head 408 through the tool, make the card 407 and the clasp 406 off, then rotate the rotating head 408, so that the threaded rod 405 rotates to control the height of the buffer assembly 3, the first pressing assembly 2 clamps the main assembly 1, the contact pressing plate 201 can tightly press the TOP surface heat sink 101 through the elastic extension structure between the first spring 202 and the telescopic rod 203 and the buffer assembly 3, so that the TOP surface heat sink 101 and the BOTTOM surface heat sink 103 can be in close contact with the PCB board 102, when clamping, the clamping force is too large, the friction of the friction card head 305 to the first spiral rotating rod 303 cannot prevent the rotation of the first spiral rotating rod 303, the connection between the second connecting rod 302 and the first connecting rod 301 is separated, so that the installer can find in time, at the same time, the first connecting rod 301 and the second connecting rod 302 are separated and placed to clamp the damaged PCB board 102, then install the assembled equipment into the router shell.
Claims
1. A full-coverage heat sink for a WiFi 6 router, characterized in that, The utility model provides a heat dissipation device, including host component (1) and first press component (2), host component (1) includes TOP face fin (101), PCB board (102) and BOTTOM face fin (103), and the below of TOP face fin (101) is provided with PCB board (102), the lower end of PCB board (102) is provided with BOTTOM face fin (103), first press component (2) is located the above of TOP face fin (101), and the above of first press component (2) is provided with buffer assembly (3), buffer assembly (3) is provided with adjusting assembly (4) away from host component (1) central axis one side, and the lower end of adjusting assembly (4) is close to host component (1) central axis one side and is provided with height adjusting assembly (5), the lower end of BOTTOM face fin (103) is installed with second press component (6), buffer assembly (3) includes first connecting rod (301), second connecting rod (302) and first screw rod (303), and first connecting rod (301) is connected with second connecting rod (302) away from host component (1) central axis one side, the inside of first connecting rod (301) is provided with first screw rod (303), buffer assembly (3) still includes rotary bearing (304) and friction chuck (305), and the outside below of first screw rod (303) is provided with rotary bearing (304), the below inside of first screw rod (303) is inlaid with friction chuck (305), buffer assembly (3) still includes flexible rod (306) and connecting column (307), and the lower end of friction chuck (305) is connected with flexible rod (306), the upper surface middle part of flexible rod (306) is provided with connecting column (307), adjusting assembly (4) includes containing column (401), baffle (402), bearing plate (403), second spring (404) and threaded rod (405), and the inside of containing column (401) is provided with baffle (402), the side close to the central axis of containing column (401) of baffle (402) is provided with bearing plate (403), and the below of bearing plate (403) is installed with second spring (404), the inside of bearing plate (403) is penetrated with threaded rod (405), adjusting assembly (4) still includes snap ring (406), card (407) and rotating head (408), and the upper end of threaded rod (405) is connected with snap ring (406), the left and right sides of snap ring (406) are provided with card (407), and the upper end of snap ring (406) is installed with rotating head (408), height adjusting assembly (5) includes limit plate (501), connecting head (502), third spring (506) and inner limit head (507), and the side away from the central axis of adjusting assembly (4) of limit plate (501) is connected with connecting head (502), the side away from limit plate (501) of connecting head (502) is connected with inner limit head (507),And the inner limiting head (507) is connected with the third spring (506) away from the side of the connecting head (502), the height adjusting assembly (5) further comprises a telescopic outer sleeve (503), a movable connecting block (504) and a second screw rotating rod (505), and the outside of the third spring (506) is provided with the telescopic outer sleeve (503), the upper and lower ends of the telescopic outer sleeve (503) are provided with the movable connecting block (504), and the inside of the movable connecting block (504) is movably penetrated by the second screw rotating rod (505).
2. The full-coverage heat sink for a WiFi 6 router of claim 1, wherein, The first pressing assembly (2) comprises a contact pressing plate (201), a first spring (202) and a telescopic rod (203), and the upper end of the contact pressing plate (201) is provided with the first spring (202), and the inside of the first spring (202) is provided with the telescopic rod (203).
Citation Information
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