A refrigeration system for a deep-sea manned platform

Abstract

The present invention relates to a refrigeration system for a deep-sea manned platform, comprising a pressure-resistant bulkhead, a fixing member welded to the pressure-resistant bulkhead, a connector mounted on the top surface of the fixing member via a flange and a fastener, the connector being in an "Ω"-shaped structure, the top surface of the connector being a cold plate, a plurality of evenly distributed heat pipes welded to the inner wall surface of the cold plate, holes corresponding to the heat pipes being opened on the pressure-resistant bulkhead, each heat pipe being placed in external seawater after passing through the hole, each heat pipe being sealed by welding to the corresponding hole, and external fins being installed on the heat pipes located in the external seawater; a flange structure being provided on the outer ring of the outer wall surface of the cold plate, a modular replacement assembly being installed on the flange structure; and a control box being further provided, the control box being electrically connected to the modular replacement assembly, and operating flexibly and reliably to meet usage requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of deep-sea manned equipment auxiliary equipment, and in particular to a deep-sea manned platform refrigeration system. Background Art

[0002] The deep-sea platform belongs to the field of deep-sea manned equipment. The deep-sea manned platform is an important manned equipment for scientific researchers to conduct deep-sea exploration, deep-sea investigation, and deep-sea rescue.

[0003] The cabin is densely populated with personnel and equipment, and some areas experience significant heat and humidity loads. To improve personnel comfort and reduce the ambient temperature of localized high-heat-dissipating equipment, cooling is required in these areas. At the same time, to meet the needs of researchers, samples collected outside the cabin must be stored at low temperatures.

[0004] Traditional mechanical compression refrigeration systems require the introduction of external seawater. The equipment and pipelines take up a lot of space and are noisy. The refrigerant is also one of the sources of atmospheric pollution. Summary of the Invention

[0005] In response to the shortcomings of the above-mentioned existing production technologies, the applicant provides a deep-sea manned platform refrigeration system, which does not require the introduction of external seawater, has fewer mechanical moving parts, and is low in noise. Through modular replacement within the cabin, it can meet the needs of local area refrigeration within the cabin and low-temperature preservation of sampled samples.

[0006] The technical solutions adopted in the present invention are as follows:

[0007] A deep-sea manned platform refrigeration system includes a pressure-resistant bulkhead, a fixing member welded to the pressure-resistant bulkhead, a connector mounted on the top surface of the fixing member via a flange and a fastener, the connector having an "Ω"-shaped structure, the top surface of the connector being a cold plate, a plurality of evenly distributed heat pipes welded to the inner wall surface of the cold plate, holes corresponding to the heat pipes being opened in the pressure-resistant bulkhead, each heat pipe being placed in external seawater after passing through the hole, each heat pipe being sealed by welding to the corresponding hole, and external fins being installed on the heat pipes located in the external seawater; a flange structure is provided on the outer ring of the outer wall surface of the cold plate, and a modular replacement assembly is installed on the flange structure; and a control box is also included, which is electrically connected to the modular replacement assembly.

[0008] Its further technical solution is:

[0009] The modular replacement component adopts an air conditioning component or a low-temperature refrigeration component.

[0010] The air conditioning component structure is as follows: it includes a bellows fixed to a flange structure, an air outlet is opened in the middle of the top surface of the bellows, an air outlet hose is installed at the air outlet, and a plurality of air inlet holes are opened on the wall of the bellows; a plurality of No. 1 semiconductor refrigeration sheets are arranged inside the bellows and at intervals on the top surface of the cold plate, a fin heat sink is installed on the top surface of the No. 1 semiconductor refrigeration sheet, an insulation material is laid in the gap between the bottom of the fin heat sink and the cold plate, and a fan is installed on the top of the fin heat sink through fasteners.

[0011] The cross section of the bellows is a "┏┓" structure.

[0012] The installation position of the finned heat sink corresponds to the air inlet.

[0013] The structure of the low-temperature refrigeration assembly is as follows: it includes an insulation box fixed to the flange structure, a closed structure is formed between the insulation box and the cold plate, a plurality of No. 1 semiconductor refrigeration plates are arranged inside the insulation box and on the top surface of the cold plate at intervals, a No. 2 semiconductor refrigeration plate is installed on the top surface of the No. 1 semiconductor refrigeration plate, and insulation materials are applied in the gap between the No. 1 semiconductor refrigeration plate and the No. 2 semiconductor refrigeration plate and on the inner wall surface of the insulation box; a finned radiator is installed on the top surface of the No. 2 semiconductor refrigeration plate, and a tray is placed above the finned radiator; a detachable door is provided on the top surface of the insulation box.

[0014] The second semiconductor refrigeration chip is smaller than the first semiconductor refrigeration chip.

[0015] The fixing piece adopts a square structure, and the top and bottom of the fixing piece are both set to be open; the connecting piece is a square structure with one end being open.

[0016] Both the fixing parts and the connecting parts adopt cylindrical structures.

[0017] The external fins are plate-type fins, and each external fin is provided with a circular hole for passing the heat pipe.

[0018] The beneficial effects of the present invention are as follows:

[0019] The present invention has a compact and reasonable structure and is easy to operate. Through the mutual cooperation between fixed components, modular replacement components, heat exchange plates, heat pipes, semiconductor refrigeration sheets, fans, insulation boxes, finned radiators, thermal insulation materials, bellows, control boxes and other components, modular replacement in the cabin can be easily realized to meet the needs of local area refrigeration in the cabin and the use of low-temperature storage of samples, thereby greatly improving working reliability.

[0020] The present invention realizes the transfer of heat in the cabin to the external environment through heat pipes and semiconductor refrigeration sheets. The modular replacement components in the cabin can be replaced to realize the functions of cooling local areas in the cabin and low-temperature preservation of sampled samples to meet different needs.

[0021] The present invention has fewer mechanical moving parts and can significantly reduce noise compared to traditional refrigeration systems.

[0022] The invention uses no refrigerant and utilizes the free-flowing seawater outside the cabin as a cold source, which can reduce the pollution source of the atmospheric environment in the cabin and improve the air quality in the cabin.

[0023] The present invention does not need to introduce external seawater into the cabin, and can directly use external artesian seawater as a cold source. There is no complicated piping system, which can save space in the cabin. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the structure of the present invention (Example 1).

[0025] Figure 2 This is a schematic structural diagram of the present invention (Example 2).

[0026] Among them: 1. Fixings; 2. Connectors; 3. Heat pipes; 4. No. 1 semiconductor refrigeration plate; 5. Control box; 6. Air conditioning assembly; 7. Low-temperature refrigeration assembly; 8. Finned radiator; 9. Fan; 10. Bellows; 11. Insulation material; 12. Insulation box; 13. No. 2 semiconductor refrigeration plate; 14. Tray; 15. Air outlet hose; 16. Pressure-resistant bulkhead; 17. External fins; 18. Cold plate; 19. Air inlet; 20. Door. DETAILED DESCRIPTION

[0027] The specific embodiments of the present invention will be described below with reference to the accompanying drawings.

[0028] like Figure 1 and Figure 2 As shown, the deep-sea manned platform refrigeration system of this embodiment includes a pressure bulkhead 16, a fixing part 1 is welded on the pressure bulkhead 16, and a connector 2 is installed on the top surface of the fixing part 1 through a flange and a fastener. The connector 2 has an "Ω"-shaped structure, and the top surface of the connector 2 is a cold plate 18. A plurality of evenly arranged heat pipes 3 are welded to the inner wall surface of the cold plate 18. Holes corresponding to the heat pipes 3 are opened on the pressure bulkhead 16. After passing through the hole, each heat pipe 3 is placed in the external seawater. Each heat pipe 3 is welded and sealed with the corresponding hole. External fins 17 are also installed on the heat pipe 3 located in the external seawater; a flange structure is provided on the outer ring of the outer wall surface of the cold plate 18, and a modular replacement component is installed on the flange structure; and a control box 5 is also included, which is electrically connected to the modular replacement component.

[0029] The modular replacement component adopts an air conditioning component 6 or a low-temperature refrigeration component 7.

[0030] The structure of the air-conditioning component 6 is as follows: it includes a bellows 10 fixed to the flange structure, an air outlet is opened in the middle of the top surface of the bellows 10, an air outlet hose 15 is installed at the air outlet, and a plurality of air inlet holes 19 are opened on the wall of the bellows 10; a plurality of No. 1 semiconductor refrigeration sheets 4 are arranged at intervals inside the bellows 10 and on the top surface of the cold plate 18, a finned heat sink 8 is installed on the top surface of the No. 1 semiconductor refrigeration sheet 4, and a thermal insulation material 11 is laid in the gap between the bottom of the finned heat sink 8 and the cold plate 18, and a fan 9 is installed on the top of the finned heat sink 8 through fasteners.

[0031] The cross section of the bellows 10 is in a “┏┓” structure.

[0032] The installation position of the fin heat sink 8 corresponds to the air inlet hole 19 .

[0033] The structure of the low-temperature refrigeration assembly 7 is as follows: it includes an insulation box body 12 fixed to the flange structure, a closed structure is formed between the insulation box body 12 and the cold plate 18, a plurality of No. 1 semiconductor refrigeration plates 4 are arranged inside the insulation box body 12 and on the top surface of the cold plate 18, a No. 2 semiconductor refrigeration plate 13 is installed on the top surface of the No. 1 semiconductor refrigeration plate 4, and insulation materials 11 are applied in the gap between the No. 1 semiconductor refrigeration plate 4 and the No. 2 semiconductor refrigeration plate 13 and on the inner wall surface of the insulation box body 12; a finned heat sink 8 is installed on the top surface of the No. 2 semiconductor refrigeration plate 13, and a tray 14 is placed above the finned heat sink 8; a removable door 20 is provided on the top surface of the insulation box body 12.

[0034] The second semiconductor refrigeration chip 13 is smaller than the first semiconductor refrigeration chip 4 .

[0035] The fixing member 1 adopts a square structure, and the top and bottom of the fixing member 1 are both set to be open; the connecting member 2 is a square structure with one end being open.

[0036] Both the fixing member 1 and the connecting member 2 adopt a cylindrical structure.

[0037] The external fins 17 are plate-type fins, and each external fin 17 is provided with a circular hole through which the heat pipe 3 passes.

[0038] The specific structure and functions of the present invention are as follows:

[0039] Includes fixed components and modular replacement components.

[0040] The fixing assembly includes a fixing part 1, a connecting part 2, a heat pipe 3, a No. 1 semiconductor refrigeration plate 4, an external fin 17, etc.

[0041] Fixing 1 is welded to pressure bulkhead 16 and connected to connector 2 via a flange. Connector 2's top surface is a cold plate 18. One end of a heat pipe 3 is exposed to the seawater and connected to several external fins 17. The other end is embedded in cold plate 18. The top surface of cold plate 18 is in close contact with several No. 1 semiconductor cooling sheets 4, which are connected to control box 5.

[0042] Among them, the modular components include an air-conditioning component 6 and a low-temperature refrigeration component 7.

[0043] like Figure 1 As shown, when the air conditioning component 6 is used:

[0044] The air conditioning assembly 6 includes a finned heat sink 8, a fan 9, a bellows 10, a heat insulating material 11 and the like.

[0045] The fan 9 is bolted to the finned heat sink 8 and secured to the bellows 10. Its start, stop, and speed are controlled by the control box 5. The bellows 10 is also bolted to the cold plate 18. Insulation material 11 is installed between the bottom plate of the finned heat sink 8 and the cold plate 18. Hot and humid cabin air enters the bellows 10 through air inlets 19 around its perimeter. The air outlet is connected to an air hose 15, delivering cool air to the desired area.

[0046] like Figure 2 As shown, when the low temperature refrigeration component 7 is used:

[0047] The low-temperature refrigeration assembly 7 includes a heat-insulating box 12, a second semiconductor refrigeration plate 13, a tray 14, etc.

[0048] The heat preservation box 12 is connected to the cold plate 18 by bolts. The second semiconductor refrigeration plate 13 is tightly attached to the first semiconductor refrigeration plate 4 to form a two-stage refrigeration system. The second semiconductor refrigeration plate 13 is connected to the control box 5.

[0049] The modular components of the refrigeration system of the present invention include an air conditioning component 6 and a low-temperature refrigeration component 7, which can be quickly replaced and connected with fixed components to achieve local air conditioning or low-temperature storage of samples.

[0050] When connected to the air conditioning unit 6, the fan 9 drives moist external air into the air chamber through the air inlets 19 around the bellows 10. When the first semiconductor refrigeration chip 4 is powered, the cold end connects to the finned heat sink 8, cooling and dehumidifying the moist air before it is distributed to the desired area via the air duct. The hot end connects to the cold plate 18, transferring heat to one end of the heat pipe 3. The heat pipe 3 then transports the heat to the other end, where the heat is transferred to the external artesian seawater via the external fins 17.

[0051] When connected to the cryogenic refrigerator assembly 7, the first and second peltiers 4 and 13 form a two-stage refrigeration system, creating a lower ambient temperature. When power is applied to the first and second peltiers 4 and 13, the cold end of the first peltier 4 connects to the hot end of the second peltier 13. The cold end of the second peltier 13 cools the air inside the insulated box 12 via the finned heat sink 8. The heat transfer from the hot end of the first peltier 4 to the outside world is similar to when connected to the air conditioning assembly 6.

[0052] In actual work process:

[0053] Deep-sea manned platforms have requirements for local cooling and ventilation and low-temperature preservation of samples at different working depths or for different work tasks.

[0054] When the ambient temperature is high, local cooling and ventilation are required. By quickly connecting the air conditioning assembly 6 to the fixed assembly, the control box 5 receives data from the air outlet temperature sensor and controls the outlet air temperature to the set point by controlling the power of the first semiconductor cooling plate 4. Heat is discharged to the outside environment via the heat pipe 3, one end of which is connected to a number of external fins 17 to enhance heat exchange. The fan 9 speed is controlled by the control box 5, and the air supply volume can be adjusted according to demand. The air outlet hose 15 can be quickly connected to the cabin air supply duct to distribute the cool air to the local area requiring cooling.

[0055] When the ambient temperature is low, the cabin temperature is comfortable and cooling is not required. However, a cryogenic storage function is required for sample collection. By quickly connecting the cryogenic refrigeration assembly 7 and the fixed assembly, the control box 5 receives data from the temperature sensor inside the insulated chamber. The first and second semiconductor refrigeration plates 4 and 13 now form a two-stage refrigeration system, lowering the temperature at the cold end of the refrigeration plates and achieving cryogenic storage. The control box 5 controls the internal refrigeration temperature by controlling the power to the first and second semiconductor refrigeration plates 4 and 13. Heat is conducted to the outside environment via the heat pipe 3, one end of which is connected to a number of external fins 17 to enhance heat exchange. Samples are collected and stored through a removable door 20 on the side of the cryogenic refrigeration assembly 7.

[0056] This invention uses heat pipes (3) and semiconductor cooling elements to transfer heat from the cabin to the outside environment. Modular components within the cabin can be replaced to provide cooling to localized areas within the cabin and preserve samples at low temperatures. This refrigeration system has fewer moving mechanical parts and significantly reduces noise compared to traditional refrigeration systems. This refrigerant-free refrigeration system utilizes external seawater as a cooling source, reducing atmospheric pollution within the cabin and improving cabin air quality.

[0057] The above description is an explanation of the present invention, not a limitation of the present invention. The scope of the present invention is defined in the claims. Any modifications may be made within the scope of protection of the present invention.

Claims

1. A deep-sea manned platform refrigeration system, comprising a pressure bulkhead (16), characterized in that: A fixing part (1) is welded on the pressure-resistant bulkhead (16), and a connecting part (2) is installed on the top surface of the fixing part (1) through a flange and a fastener. The connecting part (2) is an "Ω"-shaped structure. The top surface of the connecting part (2) is a cold plate (18). A plurality of evenly arranged heat pipes (3) are welded on the inner wall surface of the cold plate (18). Holes corresponding to the heat pipes (3) are opened on the pressure-resistant bulkhead (16). Each heat pipe (3) is placed in the external seawater after passing through the hole. Each heat pipe (3) is sealed with the corresponding hole by welding. External fins (17) are also installed on the heat pipes (3) located in the external seawater. A flange structure is provided on the outer ring of the outer wall surface of the cold plate (18), and a modular replacement component is installed on the flange structure. A control box (5) is also included, and the control box (5) is electrically connected to the modular replacement component. The modular replacement assembly adopts an air conditioning assembly (6); The structure of the air conditioning assembly (6) is as follows: it includes a bellows (10) fixed to a flange structure, an air outlet is provided at the middle position of the top surface of the bellows (10), an air outlet hose (15) is installed at the air outlet, and a plurality of air inlet holes (19) are provided on the wall of the bellows (10); a plurality of No. 1 semiconductor refrigeration sheets (4) are arranged at intervals inside the bellows (10) and on the top surface of the cold plate (18), a finned heat sink (8) is installed on the top surface of the No. 1 semiconductor refrigeration sheet (4), a thermal insulation material (11) is laid in the gap between the bottom of the finned heat sink (8) and the cold plate (18), and a fan (9) is installed on the top of the finned heat sink (8) through fasteners.

2. The deep-sea manned platform refrigeration system according to claim 1, characterized in that: The cross section of the bellows (10) is a "┏┓" structure.

3. The deep-sea manned platform refrigeration system according to claim 1, characterized in that: The installation position of the finned heat sink (8) corresponds to the air inlet (19).

4. A deep-sea manned platform refrigeration system, comprising a pressure bulkhead (16), characterized in that: A fixing part (1) is welded on the pressure-resistant bulkhead (16), and a connecting part (2) is installed on the top surface of the fixing part (1) through a flange and a fastener. The connecting part (2) is an "Ω"-shaped structure. The top surface of the connecting part (2) is a cold plate (18). A plurality of evenly arranged heat pipes (3) are welded on the inner wall surface of the cold plate (18). Holes corresponding to the heat pipes (3) are opened on the pressure-resistant bulkhead (16). Each heat pipe (3) is placed in the external seawater after passing through the hole. Each heat pipe (3) is sealed with the corresponding hole by welding. External fins (17) are also installed on the heat pipes (3) located in the external seawater. A flange structure is provided on the outer ring of the outer wall surface of the cold plate (18), and a modular replacement component is installed on the flange structure. A control box (5) is also included, and the control box (5) is electrically connected to the modular replacement component. The modular replacement assembly adopts a low-temperature refrigeration assembly (7); The structure of the low-temperature refrigeration assembly (7) is as follows: it includes an insulation box (12) fixed to the flange structure, a closed structure is formed between the insulation box (12) and the cold plate (18), a plurality of No. 1 semiconductor refrigeration sheets (4) are arranged at intervals inside the insulation box (12) and on the top surface of the cold plate (18), a No. 2 semiconductor refrigeration sheet (13) is installed on the top surface of the No. 1 semiconductor refrigeration sheet (4), and a heat insulation material (11) is applied at the gap between the No. 1 semiconductor refrigeration sheet (4) and the No. 2 semiconductor refrigeration sheet (13) and the inner wall surface of the insulation box (12); a finned heat sink (8) is installed on the top surface of the No. 2 semiconductor refrigeration sheet (13), and a tray (14) is placed above the finned heat sink (8); and a detachable door (20) is provided on the top surface of the insulation box (12).

5. The deep-sea manned platform refrigeration system according to claim 4, characterized in that: The second semiconductor refrigeration plate (13) is smaller than the first semiconductor refrigeration plate (4).

6. A deep-sea manned platform refrigeration system according to claim 1 or 4, characterized in that: The fixing member (1) has a square structure, and the top and bottom of the fixing member (1) are both open; the connecting member (2) has a square structure with one end being open.

7. A deep-sea manned platform refrigeration system according to claim 1 or 4, characterized in that: The fixing member (1) and the connecting member (2) both adopt cylindrical structures.

8. A deep-sea manned platform refrigeration system according to claim 1 or 4, characterized in that: The external fins (17) are plate-type fins, and each external fin (17) is provided with a circular hole through which the heat pipe (3) passes.

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