A manual solder paste printing device

Abstract

This invention provides a manual solder paste printing device, including a base, a stencil height adjustment device, a squeegee sliding and height adjustment device, a stencil clamp, and a squeegee. The stencil height adjustment device is connected to the base and is movable relative to the base along a first direction. The stencil clamp is fixed to the stencil height adjustment device and is used to mount the stencil. The squeegee sliding and height adjustment device is connected to the stencil height adjustment device and is movable relative to the stencil height adjustment device along a second direction. The squeegee is fixed to the squeegee sliding and height adjustment device and is able to drive the squeegee to move along the first direction, and the squeegee can contact the stencil. The solder paste coating thickness of this invention is uniform, improving the consistency and stability of manual operation.

Description

Technical Field

[0001] This invention relates to the field of surface mount technology for aerospace electronic products, and more specifically, to a manual solder paste printing device. Background Art

[0002] In the production of aerospace electronic products, some airfoil lead devices require software debugging and curing processes, and are generally assembled after the other components on the board have been soldered. Due to the limited open space of the installed components, the solder paste printing of these airfoil lead devices is mostly done manually. The characteristics of large number of pins, small spacing, soft material, and narrow width make the solder paste application of this type of device extremely difficult. The main problems are: (1) inconsistent tilt angle of the squeegee, resulting in uneven solder paste application; (2) uneven force on the squeegee, resulting in displacement of the stencil and the printed circuit board; (3) the stencil cannot be lifted horizontally when demolded, resulting in solder paste displacement; (4) solder paste overflows from the perimeter of the stencil onto the printed circuit board, causing contamination of the installed components. Considering the above factors, the consistency and stability of manual operation are important factors leading to solder paste printing quality problems.

[0003] In existing technologies addressing the aforementioned problems, one solder paste printing apparatus for SMT uses a squeegee 30-50mm wider than the printed circuit board, making it unsuitable for printed circuit boards with pre-installed components. Another surface mount device solder paste printing method uses a pressure plate to press solder paste into the mesh holes of a stencil; this method easily causes solder paste to flow to the bottom of the stencil, resulting in bridging, and is unsuitable for wing-lead devices with a large number of leads, small spacing, and narrow width. A squeegee, a tool for detecting solder paste viscosity, and a solder paste supply tool for printing solder paste only allow the squeegee to move along the printing direction, not perpendicular to it; that is, the contact force between the squeegee and the stencil cannot be adjusted, making it unsuitable for solder paste printing of multi-configuration, small-batch wing-lead devices. Therefore, this invention provides a manual solder paste printing apparatus suitable for single-piece, small-batch solder paste printing of wing-lead devices. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a solder paste printing apparatus suitable for single-piece, small-batch airfoil lead devices.

[0005] The present invention provides a manual solder paste printing device, comprising a base, a stencil height adjustment device, a squeegee sliding and height adjustment device, a stencil clamp, and a squeegee. The stencil height adjustment device is connected to the base and is movable relative to the base along a first direction. The stencil clamp is fixed on the stencil height adjustment device and is used to install the stencil. The squeegee sliding and height adjustment device is connected to the stencil height adjustment device and is movable relative to the stencil height adjustment device along a second direction. The squeegee is fixed on the squeegee sliding and height adjustment device and is capable of driving the squeegee to move along the first direction. The squeegee can contact the stencil, and the first direction is perpendicular to the second direction.

[0006] Furthermore, the base includes a base plate, a column, and a slider. The column is perpendicular to the base plate, one end of the column is connected to the base plate, and the slider is sleeved on the column, allowing the slider to slide along the column and lock.

[0007] Preferably, the base further includes a handle and a stop, the stop being located at the other end of the column, and the handle being fixed to the base plate.

[0008] Furthermore, the steel mesh height adjustment device includes a knob, a support column, a first nut, a linear bearing, a fixing block, a shaft, a connecting plate, and a steel mesh clamp mounting plate. The linear bearing is sleeved on the support column, and the fixing block is sleeved on the linear bearing. Two sets of fixing blocks are provided. The two ends of the shaft are respectively connected to the two sets of fixing blocks. The connecting plate is sleeved on the support column, and both sides of the connecting plate are locked by the first nut. The steel mesh clamp mounting plate is sleeved on the support column, and the steel mesh clamp mounting plate and the connecting plate are located on both sides of the fixing block. The knob passes through the connecting plate and is threadedly connected to the connecting plate. One end of the knob contacts the fixing block. The fixing block is also provided with a hole that cooperates with the slider.

[0009] Furthermore, the steel mesh height adjustment device also includes a spring, which is sleeved on the support column and located between the fixing block and the steel mesh clamp mounting plate.

[0010] Preferably, the connecting plate and the steel mesh clamp mounting plate are arranged vertically, and the connecting plate and the steel mesh clamp mounting plate are linked to the support column.

[0011] Furthermore, the scraper sliding and height adjustment device includes a sliding block, an adjustment knob, a column, a third nut, a plate, a first linear bearing, a scraper mounting block, and a second linear bearing. The sliding block has a first surface and a second surface that are perpendicular to each other. The second linear bearing is sleeved on the shaft. The first surface of the sliding block is sleeved on the second linear bearing. The first linear bearing is sleeved on the column. The second surface of the sliding block is sleeved on the first linear bearing. The plate is sleeved on the column. Both sides of the plate are locked by the third nut. The scraper mounting block is connected to one end of the column. The scraper mounting block and the plate are located on both sides of the first linear bearing. The adjustment knob passes through the plate and is threadedly connected to the plate. One end of the adjustment knob contacts the second surface of the sliding block.

[0012] Furthermore, the scraper sliding and height adjustment device also includes a shock-absorbing spring, which is sleeved on the column and located between the first linear bearing and the scraper mounting block.

[0013] Preferably, the scraper mounting block has an inclined surface, and the scraper is disposed on the inclined surface of the scraper mounting block.

[0014] Preferably, the steel mesh clamp is L-shaped, and the steel mesh clamp is provided with a waist-shaped hole. The steel mesh clamp is connected to the steel mesh clamp mounting plate by bolts. The steel mesh clamps are arranged opposite to each other, and the steel mesh and the side wall of the steel mesh clamp form a U-shaped structure. The scraper slides in the U-shaped groove of the U-shaped structure.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The manual solder paste printing device provided by the present invention maintains the angle between the squeegee and the stencil at a set angle, resulting in uniform solder paste coating thickness and improving the consistency and stability of manual operation; it can be applied to printed circuit boards with some components already soldered, and will not interfere with the installed components during the solder paste printing process; the stencil can be lifted horizontally upwards as a whole when demolding, avoiding solder paste displacement; the squeegee has side wall shielding during the application process to prevent solder paste overflow from contaminating the installed components. Attached Figure Description

[0016] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0017] Figure 1 This is an overall schematic diagram of the manual solder paste printing device according to an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the base of the manual solder paste printing device according to an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the stencil height adjustment device of the manual solder paste printing device according to an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the squeegee sliding and height adjustment device of the manual solder paste printing device according to an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of the stencil clamp of the manual solder paste printing device according to an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of the scraper of the manual solder paste printing device according to an embodiment of the present invention; Figure 7 This is a schematic diagram showing the connection between the stencil and the stencil clamp in the manual solder paste printing device according to an embodiment of the present invention. Detailed Implementation

[0023] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0024] This invention provides a manual solder paste printing device, such as... Figure 1 As shown, the manual solder paste printing device of this embodiment includes a stencil height adjustment device 1, a squeegee sliding and height adjustment device 2, a squeegee 3, a stencil clamp 4, and a base 5.

[0025] like Figure 2 As shown, the base 5 includes a stop 501, a column 502, a slider 503, a handle 504, and a base plate 505. The base plate 505 serves as a platform for the printed circuit board, with a flatness better than 0.1 mm and a roughness better than Ra 1.6 μm. The column 502 and the handle 504 are installed on both sides of the base plate 505. The slider 503 has a locking function, allowing it to slide freely on the column 502 or be locked at any position on the column 502. The stop 501 is installed on the top of the column 502 to prevent the slider 503 from sliding off the column 502. In this embodiment, the first direction is the vertical direction, and the second direction is the horizontal direction of the line connecting the two columns 502.

[0026] like Figure 3As shown, the steel mesh height adjustment device 1 includes a knob 101, a support column 102, a first nut 103, a linear bearing 104, a fixing block 105, a shaft 106, a connecting plate 107, a second nut 108, a steel mesh clamp mounting plate 109, and a spring 110. The support column 102 can slide within the linear bearing 104; the connecting plate 107 and the steel mesh clamp mounting plate 109 interlock to connect the four support columns 102 together, realizing the linkage of the four columns 102; a spring 110 is installed between the steel mesh clamp mounting plate 109 and the fixing block 105 below the column 102 to play a shock absorption role. The knob 101 is screwed into the connecting plate 107 via a thread. Rotating the knob 101 causes the four columns 102 to move synchronously in the vertical direction, thereby driving the stencil clamp mounting plate 109 to move smoothly up and down. This allows for fine adjustment of the distance between the stencil and the printed circuit board, ensuring slow contact between the stencil and the printed circuit board without damaging the board. It also allows for slow separation of the stencil from the printed circuit board, ensuring the stencil remains horizontally detached from the board and preventing solder paste displacement. The fixing block 105 has a hole that matches the slider 503, allowing the fixing block 105 to be fitted onto the slider 503, enabling the fixing block 105 to move together with the slider 503.

[0027] like Figure 4 As shown, the scraper sliding and height adjustment device 2 includes a sliding block 201, an adjustment knob 202, a column 203, a third nut 204, a plate 205, a first linear bearing 206, a scraper mounting block 207, a shock-absorbing spring 208, and a second linear bearing 209. The sliding block 201 has an L-shaped structure. The first linear bearing 206 is located on one surface of the sliding block 201, allowing the column 203 to slide within it. The plate 205 and the scraper mounting block 207 connect the two columns 203 together. The scraper mounting surface 2071 of the scraper mounting block 207 forms a 120-degree angle with the horizontal plane. A shock-absorbing spring 208 is installed between the first linear bearing 206 and the scraper mounting block 207 below the column 203 to provide shock absorption. The adjustment knob 202 is screwed into the plate 205. Rotating the adjustment knob 202 causes the two columns 203 to move synchronously in the vertical direction, thereby driving the scraper mounting block 207 to move up and down. The second linear bearing 209 is located on the other side of the sliding block 201. The second linear bearing is sleeved on the shaft 106, so that the scraper sliding and height adjustment device 2 can slide along the shaft 106.

[0028] like Figure 5As shown, the stencil clamp 4 has an L-shaped structure; the stencil bonding surface 401 of the stencil clamp 4 has a flatness better than 0.01mm and a roughness better than Ra0.8μm; the oblong hole 403 is a threaded through hole for fixing the stencil clamp 4, which can adjust the position of the stencil clamp 4 so that the stencil clamp 4 can clamp stencils of different sizes; the mounting surface 404 of the stencil clamp 4 is the contact surface between the stencil clamp 4 and the stencil clamp mounting plate 109; the height of the side wall 405 of the stencil clamp 4 is greater than 25mm (represented by 402 in the figure), used to avoid components that have been soldered on the printed circuit board; the side wall 405 of the stencil clamp and the stencil form a U-shaped structure, such as... Figure 7 As shown, when the scraper 3 slides through the U-shaped groove, it can prevent the solder paste from overflowing to both sides and contaminating the installed components.

[0029] like Figure 6 As shown, the scraper 3 is a flat plate structure and is mounted on the scraper mounting surface 2071 of the scraper mounting block 207; the angle between the steel mesh contact surface 301 and the scraper mounting surface 302 is 120 degrees.

[0030] In this embodiment of the manual solder paste printing device, a stencil clamp 4 is mounted on a stencil clamp mounting plate 109, and the stencil is adhered to the stencil clamp 4. A stencil height adjustment device 1 is mounted on a slider 503, allowing the stencil to move up and down with the slider 503 for coarse height adjustment. Rotating the knob 101 allows the stencil to move smoothly up and down, achieving fine height adjustment and enabling slow contact or separation between the stencil and the printed circuit board. A scraper 3 is mounted on a scraper mounting block 207, and a scraper sliding and height adjustment device 2 is mounted on a shaft 106. Under the action of a damping spring 208, the scraper 3 can slide smoothly on the shaft 106. Rotating the adjustment knob 202 adjusts the contact force between the scraper and the stencil, ensuring balanced force on the scraper.

[0031] In use, raise slider 503 to position the stencil height adjustment device 1, squeegee sliding and height adjustment device 2, squeegee 3, and stencil clamp 4 at a high position; place the printed circuit board on the base plate 505; adjust the position of the printed circuit board so that the position of the solder paste to be printed is directly below the squeegee sliding and height adjustment device 2; attach the stencil to the two stencil attachment surfaces 401; adjust the height of slider 503 to make the stencil contact the printed circuit board; rotate knob 101 downwards to ensure reliable contact between the stencil and the printed circuit board; rotate adjustment knob 202 downwards to make the squeegee 3 contact the stencil, maintaining even pressure on the squeegee; apply solder paste to the stencil, and slide the squeegee sliding and height adjustment device 2 to evenly spread the solder paste within the stencil mesh. Rotate knob 101 upwards to keep the stencil horizontal and detach it from the printed circuit board; raise slider 503 and remove the printed circuit board, thus completing one solder paste printing operation. The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in these embodiments can be arbitrarily combined with each other.

Claims

1. A manual solder paste printing device, characterized in that, The device includes a base, a steel mesh height adjustment device, a scraper sliding and height adjustment device, a steel mesh clamp, and a scraper. The steel mesh height adjustment device is connected to the base and can move relative to the base along a first direction. The steel mesh clamp is fixed to the steel mesh height adjustment device and is used to install the steel mesh. The scraper sliding and height adjustment device is connected to the steel mesh height adjustment device and can move relative to the steel mesh height adjustment device along a second direction. The scraper is fixed to the scraper sliding and height adjustment device and can drive the scraper to move along the first direction. The scraper can contact the steel mesh, and the first direction is perpendicular to the second direction. The base includes a base plate, a column, a slider, a handle, and a stop. The column is perpendicular to the base plate, one end of the column is connected to the base plate, the slider is sleeved on the column, the slider can slide along the column and lock, the stop is located at the other end of the column, and the handle is fixed to the base plate. The steel mesh height adjustment device includes a knob, a support column, a first nut, a linear bearing, a fixing block, a shaft, a connecting plate, and a steel mesh clamp mounting plate. The linear bearing is sleeved on the support column, and the fixing block is sleeved on the linear bearing. Two sets of fixing blocks are provided. The two ends of the shaft are respectively connected to the two sets of fixing blocks. The connecting plate is sleeved on the support column, and both sides of the connecting plate are locked by the first nut. The steel mesh clamp mounting plate is sleeved on the support column, and the steel mesh clamp mounting plate and the connecting plate are located on both sides of the fixing block. The knob passes through the connecting plate and is threadedly connected to the connecting plate. One end of the knob contacts the fixing block. The fixing block is also provided with a hole that mates with the slider.

2. The manual solder paste printing device according to claim 1, characterized in that, The steel mesh height adjustment device also includes a spring, which is sleeved on the support column and located between the fixing block and the steel mesh clamp mounting plate.

3. The manual solder paste printing device according to claim 1, characterized in that, The connecting plate and the steel mesh clamp mounting plate are arranged vertically, and the connecting plate and the steel mesh clamp mounting plate are connected to the support column.

4. The manual solder paste printing device according to claim 1, characterized in that, The scraper sliding and height adjustment device includes a sliding block, an adjustment knob, a column, a third nut, a plate, a first linear bearing, a scraper mounting block, and a second linear bearing. The sliding block has a first surface and a second surface that are perpendicular to each other. The second linear bearing is sleeved on the shaft. The first surface of the sliding block is sleeved on the second linear bearing. The first linear bearing is sleeved on the column. The second surface of the sliding block is sleeved on the first linear bearing. The plate is sleeved on the column. Both sides of the plate are locked by the third nut. The scraper mounting block is connected to one end of the column. The scraper mounting block and the plate are located on both sides of the first linear bearing. The adjustment knob passes through the plate and is threadedly connected to the plate. One end of the adjustment knob contacts the second surface of the sliding block.

5. The manual solder paste printing device according to claim 4, characterized in that, The scraper sliding and height adjustment device also includes a shock-absorbing spring, which is sleeved on the column and located between the first linear bearing and the scraper mounting block.

6. The manual solder paste printing device according to claim 4, characterized in that, The scraper mounting block has an inclined surface, and the scraper is disposed on the inclined surface of the scraper mounting block.

7. The manual solder paste printing device according to claim 1, characterized in that, The steel mesh clamp is L-shaped and has a waist-shaped hole. The steel mesh clamp is connected to the steel mesh clamp mounting plate by bolts. The steel mesh clamps are arranged opposite each other, and the steel mesh and the side wall of the steel mesh clamp form a U-shaped structure. The scraper slides in the U-shaped groove of the U-shaped structure.

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