Integrated circuit printing device

Abstract

The utility model relates to an integrated circuit printing device in the technical field of integrated circuit printing, which comprises a body and an adsorption platform, the adsorption platform is provided with a plurality of vacuum holes, the side edge of the body is provided with side edge vacuum holes, and the body is internally provided with a limiting pin. According to the utility model, an optimization mode that the PCB units are in one-to-one correspondence with the vacuum holes is adopted, so that the adsorption effect is greatly enhanced, the phenomena of substrate warping, shaking and the like caused by vacuum adsorption weakness in the printing process are effectively avoided, the solder paste printing balling quality is greatly improved, the defective rate of products is remarkably reduced, and the production efficiency is improved. And the production efficiency is greatly improved, and considerable economic benefits are created for integrated circuit manufacturing enterprises.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit printing technical field especially relates to an integrated circuit printing device. BACKGROUND

[0002] Due to the implementation of the half-cut process, the originally dense and continuous molding layer at the bottom of the substrate will generate a cutting groove. Taking a common production specification as an example, the strip contains a total of 320 elements, and most of the vacuum holes are concentrated at the edge of the unit, and part of the vacuum holes are just above the cutting groove. These cutting grooves are relatively narrow, only 0.35mm in width, and 0.62mm in depth, while the diameter of the vacuum suction platform hole of the traditional printing device is usually 2mm. In this way, in actual operation, the vacuum hole is easily sucked to the cutting groove position, and then falls into a vacuum state. This vacuum phenomenon will cause a series of adverse consequences in the process of printing the solder paste into a ball, the most prominent of which is that it causes uneven distribution of tin, and the amount of solder paste in some areas is too small, which seriously affects the electrical connection reliability of the integrated circuit, greatly increases the product rejection rate, and brings high cost burden to the production enterprise. SUMMARY

[0003] The utility model discloses an integrated circuit printing device that solves the problems in the prior art.

[0004] To achieve the above object, the utility model adopts the following technical scheme: an integrated circuit printing device is composed of a body and a suction platform, a plurality of vacuum holes are arranged on the suction platform, a side edge vacuum hole is arranged on the side edge of the body, and a limiting pin is arranged in the body.

[0005] The vacuum holes correspond to the positions of each product unit on the PCB, and the diameter of the vacuum holes is 0~1 / 2*product size.

[0006] The vacuum holes are arranged in a 10*32 manner.

[0007] Further description of the above technical scheme:

[0008] The vacuum holes correspond to the positions of each product unit on the PCB, and the diameter of the vacuum holes is 1-3.5mm.

[0009] Further description of the above technical scheme:

[0010] The limiting pin is used for installing a limiting post, and the limiting post matches the stopping position of the PCB with the vacuum holes.

[0011] Further description of the above technical scheme:

[0012] The distance between the leftmost vacuum hole of the adsorption platform and the leftmost edge of the adsorption platform is 15-21mm; and / or the distance between the rightmost vacuum hole of the adsorption platform and the rightmost edge of the adsorption platform is 15-21mm.

[0013] As a further description of the above technical solutions:

[0014] The distance between the innermost vacuum hole of the adsorption platform and the innermost edge of the adsorption platform is 3-5mm; and / or the distance between the outermost vacuum hole of the adsorption platform and the outermost edge of the adsorption platform is 3-5mm.

[0015] As a further description of the above technical solutions:

[0016] The limiting pin is located at the middle position of the body, and the distance between the limiting pin and the left and right edges of the respective adjacent side is 73-79mm.

[0017] The utility model has the following beneficial effects: the utility model adopts the optimization mode that PCB board unit and vacuum hole one-to-one correspond, greatly strengthens adsorption efficacy, effectively avoids the anarchy such as substrate warping, shaking and so on induced by vacuum adsorption impotence in the printing process, makes the quality of solder paste printing ball leap-forwardly improve, not only significantly reduces the product's defective rate, also greatly improves production efficiency, creates considerable economic benefits for integrated circuit manufacturing enterprises. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A structural schematic view of an integrated circuit printing device is provided for the utility model.

[0019] Legend:

[0020] 1, body;2, adsorption platform;3, vacuum hole;4, side edge vacuum hole;5, limiting pin. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0022] Reference Figure 1The utility model provides an embodiment: a kind of integrated circuit printing device, is composed of adsorption platform 2 and body 1, this structure design fuses functionality and practicality.Body 1 and the embedding of adsorption platform 2 Additional sealing rubber ring, by filling embedding gap, the reliability and sustainability of vacuum adsorption are significantly improved.Adsorption platform 2 as the key part of bearing PCB board, several vacuum holes 3 arranged on it play a crucial adsorption fixing effect.The side of body 2 is equipped with side vacuum hole 4, this unique design not only enhances the adsorption stability of whole, but also plays the function of auxiliary adsorption when coping with some special working conditions, ensure that the position of PCB board is accurate and faultless in printing process.And the limit pin 5 equipped in body 2, set positioning reference for the whole device operation, guarantee the orderly development of subsequent process.

[0023] Vacuum hole 3 corresponds with each point position on PCB board, and this accurate corresponding relationship is obtained through a large number of experiments and simulation optimization.The diameter of vacuum hole 3 is 1-3.5mm, and it is limited in this range by considering the adsorption force demand and avoiding physical damage to PCB board and other factors.If the diameter is too small, the adsorption force is difficult to meet the requirements when facing some large-area PCB board or slightly uneven board, and it is easy to loosen and displace, and if the diameter is too large, it may leave too obvious traces on PCB board, and even affect the internal circuit structure of board.Vacuum hole 3 is arranged in the mode of 10x32, and this arrangement mode closely fits the common PCB board layout specification, and can realize all-around and uniform adsorption of PCB board with the most optimized layout.The spacing of vacuum hole 3 is the same as the product unit size of PCB board, so that each vacuum hole 3 can accurately act on the corresponding PCB board unit area, avoid local pressure uneven caused by adsorption blind area or repeated adsorption, and avoid the interference of cutting groove area on vacuum adsorption caused by half-cut process.The positioning spacing error between PCB board and adsorption platform 2 is 3 / 4 of the product unit size of PCB board, and this strict error control ensures that PCB board can be quickly and accurately aligned with vacuum hole 3 when placed on adsorption platform 1, greatly improves the production preparation efficiency, and reduces the waste caused by inaccurate alignment.

[0024] Limit pin 5 is used for installing limit pile, and the limit pile makes the parking position of PCB board match with vacuum hole 3.In actual operation, when PCB board is placed on adsorption platform 2, the limit pile pushes PCB board, so that it is accurately parked at the predetermined position, and ensures that vacuum hole 3 can play the adsorption effect just right.This design detail plays a key role in the stability and accuracy of the whole printing process, and avoids a series of printing quality problems caused by initial position deviation of PCB board, such as tin paste deviation, missing printing and the like.

[0025] The body 1 can be a cavity, and the cavity side wall thickness is 5-10 mm, which is the result of comprehensive consideration from the aspects of structural strength and heat dissipation performance. Too thin side cannot provide sufficient support for the device, and deformation is easy to occur during long-term operation or under slight external force impact, thereby affecting the vacuum adsorption effect and the precision of the overall device; too thick will increase the material cost, and is not conducive to heat dissipation, which may cause damage to electronic components due to local overheating. The distance between the left and right sides of the side vacuum hole 4 and the left and right edges of the body 1 is 15-21 mm, and the distance between the upper and lower sides of the body 1 and the upper and lower edges of the body 1 is 3-5 mm. Such layout not only ensures that the side vacuum hole 4 can provide effective auxiliary adsorption force on the edge area of the PCB board to prevent the edge of the board from being raised or displaced, but also avoids being blocked by foreign matter or being damaged by accidental collision during processing due to being too close.

[0026] The limiting pin 5 is located at the middle position of the body 1, and the distance between the limiting pin 5 and the respective proximal side left and right edges is 73-79 mm. By setting the limiting pin 5 at the middle position, the force exerted by the limiting pile on the PCB board is more uniform, and accurate positioning and guidance can be achieved at the center position regardless of the size of the PCB board, ensuring that the entire printing process is in a normal state from the beginning.

[0027] Working principle: Before the integrated circuit printing operation starts, the PCB board to be printed is first carried to the upper side of the adsorption platform 2. At this time, since the limiting pile of the limiting pin 5 is pre-set with a precise parking position, the operator only needs to gently place the PCB board according to the conventional operation process, and the PCB board will be quickly and accurately aligned with the vacuum hole 3 on the adsorption platform 2 under the guidance of the limiting pile. The vacuum hole 3 generates strong and uniform adsorption force instantaneously by virtue of its specific diameter, arrangement and precise correspondence with the PCB board unit, and firmly fixes the PCB board on the adsorption platform 2. Even during the subsequent printing process, due to the vibration and external disturbance caused by the reciprocating motion of the scraper, the spreading and extrusion of the solder paste, etc., the PCB board will not be displaced or warped. At the same time, the side vacuum hole 4 on the side of the body 1 continuously plays an auxiliary adsorption role, further reinforcing the edge stability of the PCB board, ensuring that the solder paste can be uniformly and accurately printed on the predetermined position of the PCB board, thereby efficiently and stably completing the integrated circuit printing task, and providing a solid guarantee for the production of high-quality integrated circuits.

[0028] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. An integrated circuit printing apparatus, characterized in that: It consists of a body (1) and an adsorption platform (2). The adsorption platform (2) is provided with a plurality of vacuum holes (3). The side of the body (1) is provided with a side vacuum hole (4). The body (1) is provided with a limiting pin (5). The vacuum hole (3) corresponds to the position of each product unit on the PCB board, and the diameter of the vacuum hole (3) is 0~1 / 2*product size; The vacuum holes (3) are arranged in a 10×32 pattern.

2. The integrated circuit printing apparatus according to claim 1, characterized in that: The vacuum hole (3) corresponds to the position of each product unit on the PCB board, and the diameter of the vacuum hole (3) is 1-3.5mm.

3. The integrated circuit printing apparatus according to claim 1, characterized in that: The spacing of the vacuum holes (3) is less than or equal to the size of each product unit on the PCB.

4. The integrated circuit printing apparatus according to claim 1, characterized in that: The limiting pin (5) is used to install the limiting stake, which makes the PCB board stop position match the vacuum hole (3).

5. An integrated circuit printing apparatus according to claim 1, characterized in that: The main body (1) is a cavity, and the thickness of the side wall of the cavity is 5-10mm.

6. The integrated circuit printing apparatus according to claim 1, characterized in that: The distance between the leftmost vacuum hole (3) of the adsorption platform (2) and the leftmost edge of the adsorption platform (2) is 15-21 mm; and / or the distance between the rightmost vacuum hole (3) of the adsorption platform and the rightmost edge of the adsorption platform (2) is 15-21 mm.

7. An integrated circuit printing apparatus according to claim 1, characterized in that: The distance between the innermost vacuum hole (3) of the adsorption platform (2) and the innermost side of the adsorption platform is 3-5 mm; and / or the distance between the outermost vacuum hole (3) of the adsorption platform and the outermost side of the adsorption platform is 3-5 mm.

8. An integrated circuit printing apparatus according to claim 1, characterized in that: The limiting pin (5) is located in the middle of the body (1), and the distance between the limiting pin (5) and the left and right sides of the adjacent side is 73-79mm.

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