A multi-cavity tray for chip production and processing and a chip production and processing method

Abstract

The present application relates to the technical field of electronic chip, and particularly relates to a multi-cavity tray for chip production and processing and a chip production and processing method; the tray comprises a plurality of arrayed processing areas, the processing area comprises a cavity for fixing a chip, the cavity comprises an upper cavity in the upper half and a lower cavity in the lower half, the cross section of the upper cavity is inverted trapezoidal, and the cross section of the lower cavity is rectangular; the tray is extruded by a press after the chip fixed in the cavity is milled by a cutter; in the present application, the upper cavity structure with inverted trapezoidal cross section is adopted to make the chip have a certain inclination angle after milling, so as to facilitate taking, and after the milling step is completed, the press extrusion is adopted, the material itself is extruded into other materials cut out, and thus the wear of the cutter in the subsequent milling process is reduced, and the dimensional accuracy of the chip is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic chip, in particular to a multi-cavity tray for chip production and processing and a chip production and processing method. BACKGROUND

[0002] In the existing consumer electronics field, the precision of the chip is very high, especially in some artificial intelligence applications, the precision of the chip directly affects the work efficiency and the accuracy of information transmission.

[0003] And in the production and processing process of the chip, a high-precision specification tray is usually used to carry the chip for milling processing. However, in the current tray structure, the cavity for carrying the chip is mostly a vertical cavity structure, and since the thickness of the chip is very thin, the chip will be very difficult to take out if it is a straight edge.

[0004] Secondly, the cutter will constantly wear during the milling process of the chip, and the wear will cause errors, and usually a tray has about forty, fifty or so cavities in total, so the wear will be magnified fifty times, resulting in a decrease in the dimensional accuracy of the chip. SUMMARY

[0005] In view of the deficiencies in the prior art, the present application aims to provide a multi-cavity tray for chip production and processing which can facilitate the milling processing of the chip and improve the processing precision of the chip.

[0006] To solve the above technical problems, the technical solution provided by the present application is that the multi-cavity tray for chip production and processing comprises a plurality of arrayed processing areas, each processing area comprises a cavity for fixing a chip, the cavity comprises an upper cavity in the upper half and a lower cavity in the lower half, the cross section of the upper cavity is inverted trapezoidal, and the cross section of the lower cavity is rectangular.

[0007] After the milling processing of the chip fixed in the cavity by the cutter is completed, the tray is extruded by a press.

[0008] In the above technical solution, the upper cavity structure with an inverted trapezoidal cross section is used to make the chip have a certain inclination angle after milling, so as to facilitate the taking, and after the milling step is completed, the press is used to extrude the material itself, thereby reducing the wear of the cutter in the subsequent milling process and ensuring the dimensional accuracy of the chip.

[0009] Further, the angle between the side of the upper cavity with an inverted trapezoidal cross section and the vertical plane is 10°.

[0010] The chip production processing method adopts the multi-cavity tray for chip production processing.

[0011] Further, the production processing process comprises milling and extrusion in sequence.

[0012] Compared with the prior art, the chip production processing method has the following advantages: the tray structure is newly designed to solve the problem of the increased R angle after milling, and after the milling step is completed, the extrusion method of the press is adopted to extrude the other cut materials into the tray by using the characteristics of the materials, thereby reducing the wear of the cutter in the subsequent milling process and ensuring the size accuracy of the chip. BRIEF DESCRIPTION OF DRAWINGS

[0013] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, illustrate the present application and are used to explain the present application, and do not constitute a limitation on the present application. In the drawings:

[0014] Figure 1 Fig. 1 is a structural schematic view of the multi-cavity tray in the embodiment of the present application;

[0015] Figure 2 Fig. 2 is a vertical sectional view of the cavity in the embodiment of the present application;

[0016] In the figure: 1- processing area, 2- cavity, 3- upper cavity, 4- lower cavity. DETAILED DESCRIPTION

[0017] The preferred examples of the present application are described below in conjunction with the drawings, and it should be understood that the preferred examples described herein are only used to illustrate and explain the present application, and do not limit the present application.

[0018] As shown in Figure 1 and 2 The multi-cavity tray for chip production processing comprises a plurality of, in this embodiment 48, arrayed processing areas 1, each processing area 1 comprises a cavity 2 for fixing a chip, and the cavity 2 comprises an upper cavity 3 located in the upper half and a lower cavity 4 located in the lower half, wherein the cross section of the upper cavity 3 is inverted trapezoidal, and the cross section of the lower cavity 4 is rectangular.

[0019] Further, the angle between the side of the upper cavity 3 with the inverted trapezoidal cross section and the vertical plane is 10°, and the accuracy range is relatively high.

[0020] After the milling of the chip fixed in the cavity 2 by the cutter is completed, the tray needs to be extruded by a press.

[0021] The chip production and processing method adopts the multi-cavity tray for chip production and processing, and the production and processing process comprises milling and extrusion in sequence.

[0022] Compared with the prior art, the chip production and processing method has the following advantages: the tray structure is newly designed to solve the problem of the increased R angle after the milling of the cutter, the extrusion of the press is used after the end of the milling step, the other cut materials are extruded into the material by using the characteristics of the material itself, and the wear of the cutter in the subsequent milling process is reduced, and the size accuracy of the chip is ensured.

[0023] Finally, it should be noted that: the above only for the preferred examples of the present application, and not for limiting the present application, although the foregoing detailed description of the present application is made with reference to the foregoing examples, for those skilled in the art, it still can be modified to the technical scheme recorded in the foregoing embodiments, or equivalent replacement of some technical features. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A multi-cavity tray for chip production processing, characterized by, The tray comprises a plurality of arrayed processing areas, each of which comprises a cavity for fixing a chip, the cavity comprises an upper cavity in the upper half and a lower cavity in the lower half, the cross section of the upper cavity is inverted trapezoidal, and the cross section of the lower cavity is rectangular. The tray is extruded by a press after the chip fixed in the cavity is milled by a cutter.

2. A chip production processing method characterized by, The chip production and processing method comprises milling and extruding in sequence.

3. The chip production processing method according to claim 2, wherein The chip production and processing method comprises milling and extruding in sequence.

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