Substrate processing apparatus

Abstract

The substrate processing apparatus (100, 200) includes: a head unit (4); and a plurality of imaging units (82, 83) that are provided on the head unit (4) in a state of being arranged at a plurality of different height positions in the vertical direction, and that image the same imaging position (P2, P3) where an imaging object (B) is arranged from an inclined direction. Among the plurality of imaging units (82, 83), different depths of field (D1, D2) are set according to their respective inclination angles (θt, θu).

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus including a head unit. Background Art

[0002] Conventionally, a substrate processing apparatus including a head unit has been known. Such a substrate processing apparatus is disclosed, for example, in Japanese Unexamined Patent Application Publication No. 2019-75475.

[0003] In the component mounting apparatus (substrate processing apparatus) including a head unit disclosed in Japanese Unexamined Patent Application Publication No. 2019-75475, a photographing unit is provided in the head unit. The photographing unit includes two cameras arranged in the vertical direction. The photographing unit is configured to photograph the mounting position of a component mounted on a substrate from two directions (angles) using the two cameras. The two cameras are respectively arranged with an upper and lower offset so as to be able to photograph the mounting position of the component from a plurality of inclined directions with respect to the vertical direction. Here, the upper camera of the two vertically offset cameras has an optical axis with an inclined direction close to the vertical direction. The lower camera of the two vertically offset cameras has an optical axis with an inclined direction close to the horizontal direction.

[0004] In the component mounting apparatus disclosed in Japanese Unexamined Patent Application Publication No. 2019-75475, based on the images of the mounting position of the component photographed by the two cameras from two inclined directions, the horizontal position and the vertical height position of the component at the mounting position of the component are obtained.

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2019-75475 Summary of the Invention

[0008] Problems to be Solved by the Invention

[0009] However, in the component mounting device disclosed in Japanese Unexamined Patent Application Publication No. 2019-75475, the upper camera has an optical axis with an inclination direction close to the vertical direction, and the lower camera has an optical axis with an inclination direction close to the horizontal direction. Therefore, when photographing a substrate with upward warping and downward warping, the distance between the upward warped portion and the downward warped portion of the upper surface of the substrate in the optical axis direction of the second camera is larger than the distance between the upward warped portion and the downward warped portion of the upper surface of the substrate in the optical axis direction of the first camera. Therefore, it is considered that since the above distance in the optical axis direction of the second camera is larger than the above distance in the optical axis direction of the first camera, even if the upper camera focuses on both the upward warped portion and the downward warped portion of the upper surface of the substrate, sometimes the lower camera may not focus on either the upward warped portion or the downward warped portion of the upper surface of the substrate. Therefore, in the component mounting device (substrate working device) disclosed in Japanese Unexamined Patent Application Publication No. 2019-75475, it is desired to make the focus of the images taken from the inclination direction by each of the plurality of cameras (imaging units) arranged at a plurality of different height positions in the vertical direction more reliably coincide.

[0010] The present invention has been completed to solve the above problems, and an object of the present invention is to provide a substrate working device capable of making the focus of the images taken from the inclination direction by each of the plurality of imaging units arranged at a plurality of different height positions in the vertical direction more reliably coincide.

[0011] Technical means for solving the problems

[0012] A substrate working device according to an aspect of the present invention includes: a head unit including a working head for working on a substrate; and a plurality of imaging units arranged at a plurality of different height positions in the vertical direction in the head unit and respectively photographing the same photographing position where a photographing object is arranged from mutually different inclination directions. In the plurality of imaging units, different depths of field are set according to the inclination angles of the inclination directions in which they respectively perform photographing. In addition, the plurality of imaging units may be configured to photograph the same photographing position where a photographing object is arranged in a split field of view using a shared camera, or the plurality of imaging units may be configured to photograph the same photographing position where a photographing object is arranged using mutually independent cameras.

[0013] In the substrate processing apparatus according to one aspect of the present invention, as described above, among the plurality of imaging units, different depths of field are set according to the respective tilt angles directed from their respective height positions toward the imaging object. Thus, even if the plurality of imaging units are arranged at a plurality of different height positions in the vertical direction, by setting different depths of field according to the tilt angles in each of the plurality of imaging units, it is possible to perform focus setting on the same imaging position where the imaging object is arranged, individually. As a result, it is possible to make the focus (Japanese: ピント) of the images captured from the tilt direction by each of the plurality of imaging units arranged at a plurality of different height positions in the vertical direction more reliably coincide.

[0014] In the substrate processing apparatus according to the above aspect, preferably, the plurality of imaging units include: a first imaging unit having a first tilt angle in a tilt direction close to the vertical direction among the tilt angles; and a second imaging unit arranged below the first imaging unit and having a second tilt angle in a tilt direction closer to the horizontal direction than the first tilt angle, and the second imaging unit has a second depth of field deeper than the first depth of field of the first imaging unit. If configured in this way, by making the second depth of field deeper than the first depth of field, it is possible to sufficiently ensure the second depth of field of the second imaging unit, and thus it is possible to make the focus of the image captured by the second imaging unit more reliably aligned.

[0015] In this case, preferably, the first imaging unit and the second imaging unit are arranged one above the other in the same plane along the vertical direction and image the same imaging position where the imaging object is arranged from the tilt direction, and the second imaging unit is arranged below the first imaging unit in the vertical direction and has a second depth of field deeper than the first depth of field. If configured in this way, compared with the case where the first imaging unit and the second imaging unit are arranged at positions deviated from the same plane along the vertical direction, it is possible to reduce the horizontal installation space of the first imaging unit and the second imaging unit. As a result, it is possible to more reliably align the focus of the image captured by the second imaging unit, and it is possible to suppress the enlargement of the head unit on which the first imaging unit and the second imaging unit are installed.

[0016] In the substrate processing apparatus including the first imaging unit and the second imaging unit described above, preferably, by setting the aperture of the first imaging unit to be constant, the first depth of field is set to be a constant depth of field, and by setting the aperture of the second imaging unit to be constant, the second depth of field is set to be a constant depth of field deeper than the first depth of field. If configured in this way, a configuration for adjusting the apertures of the first imaging unit and the second imaging unit is not required, and thus it is possible to suppress the enlargement of the head unit.

[0017] In the above-described substrate processing apparatus having the first imaging unit and the second imaging unit, preferably, each of the first imaging unit and the second imaging unit is configured to image at least one of the periphery of the mounting position of the component to be imaged and the periphery of the adsorption position of the component. The first depth of field and the second depth of field are each set in a cross section along the arrangement direction of the first imaging unit and the second imaging unit, based on the assumed deviation amount of the height position of the upper surface of the substrate caused by the warping of the substrate, or the assumed deviation amount of the height position of the upper surface of the component stored in the storage tape due to the difference in the type of the storage tape for storing the component, the horizontal length of the component, and the tilt angle. If configured in this way, appropriate values of the first depth of field and the second depth of field can be obtained, and thus an appropriate depth of field can be set for each of the first imaging unit and the second imaging unit. In addition, the difference in the type of the storage tape includes not only the case of the difference in the type of the tape such as a paper tape and a corrugated tape, but also a broad concept including the case where the size of the storage portion for storing the component is different even for the same paper tape, and the case where the size of the storage portion for storing the component is different even for the same corrugated tape.

[0018] In the above-described substrate processing apparatus having the first imaging unit and the second imaging unit, preferably, the substrate processing apparatus further includes: an illumination unit that irradiates light to the imaging object; and a control unit that controls imaging of the imaging object by each of the first imaging unit and the second imaging unit. The control unit is configured to perform the following control: by making any one of the sensor gains for the first imaging unit and the second imaging unit, the exposure times for the first imaging unit and the second imaging unit, and the light amount of the illumination unit different, the brightness of the images captured by the first imaging unit and the second imaging unit is made substantially the same. If configured in this way, even when the second depth of field is made deeper than the first depth of field, focusing can be performed in the second imaging unit, and moreover, the brightness of the image captured by the second imaging unit can be ensured. As a result, the focus of the image captured by the second imaging unit can be more reliably aligned, and an image having the same brightness as the image captured by the first imaging unit can be captured by the second imaging unit.

[0019] In the above-described substrate processing apparatus in which the exposure times of the first imaging unit and the second imaging unit are different, preferably, the control unit is configured to perform the exposure of the second imaging unit in parallel with the exposure of the first imaging unit. If configured in this way, the time required for exposure when imaging the imaging position can be suppressed to the minimum, and thus the operation time of the work head on the substrate can be prevented from increasing.

[0020] In the above-described substrate processing apparatus including the first imaging unit and the second imaging unit, preferably, the first imaging unit and the second imaging unit further include a first camera and a second camera, respectively. If configured in this way, compared with the case of performing imaging using a shared camera, the structure of the optical systems such as lenses of the first imaging unit and the second imaging unit can be simplified, and thus the complication of the structures of the first imaging unit and the second imaging unit can be suppressed.

[0021] In the above-described substrate processing apparatus including the first imaging unit and the second imaging unit, preferably, the first imaging unit and the second imaging unit further include: a shared camera; and an optical system that divides the field of view of the shared camera. If configured in this way, the number of required cameras can be suppressed, and thus the enlargement of the head unit can be suppressed.

[0022] In the above-described substrate processing apparatus including the first imaging unit and the second imaging unit, preferably, it is configured to obtain the height position of the periphery of the object to be imaged based on the first image captured by the first imaging unit and the second image captured by the second imaging unit. If configured in this way, by obtaining the height position of the periphery of the object to be imaged based on the first image and the focused second image, the height position of the periphery of the object to be imaged can be obtained more accurately, and thus the operation of the operation head on the substrate can be performed with higher precision.

[0023] Advantages of the Invention

[0024] According to the present invention, as described above, it is possible to make the focus (in Japanese: ピント) of the images captured from the inclined direction by each of the plurality of imaging units arranged at a plurality of different height positions in the vertical direction more reliably coincide. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a plan view showing the component mounting apparatus according to the first embodiment.

[0026] Figure 2 It is a side view showing a state in which an element in the storage tape is adsorbed by the mounting head of the component mounting apparatus according to the first embodiment.

[0027] Figure 3 It is a side view showing a state in which an element is mounted on a substrate by the mounting head of the component mounting apparatus according to the first embodiment.

[0028] Figure 4 It is a schematic diagram for obtaining the first depth of field of the first imaging unit of the component mounting apparatus according to the first embodiment.

[0029] Figure 5 It is a schematic diagram for obtaining the second depth of field of the second imaging unit of the component mounting apparatus according to the first embodiment.

[0030] Figure 6It is a schematic diagram for obtaining the height position of the shooting position in the component mounting device of the first embodiment.

[0031] Figure 7 It is a top view showing the component mounting device of the second embodiment.

[0032] Figure 8 It is a side view showing the irradiation state of the light of the illumination unit of the component mounting device of the second embodiment.

[0033] Figure 9 It is a side view of the head unit of the component mounting device which is a modified example of the first and second embodiments. Detailed Embodiments

[0034] Hereinafter, embodiments for embodying the present invention will be described based on the drawings.

[0035] [First Embodiment]

[0036] Refer to Figures 1 to 6 , the structure of the component mounting device 100 of the first embodiment of the present invention will be described. In addition, the component mounting device 100 is an example of the "substrate processing device" in the scope of protection.

[0037] As Figure 1 shown, the component mounting device 100 is configured to convey the substrate S by a pair of conveyors 2 and mount the component B on the substrate S at the working position P1. In addition, the component B is an example of the "shooting object" in the scope of protection.

[0038] The component mounting device 100 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, a component identification imaging unit 7, an imaging unit 8, and a control unit 9.

[0039] Here, the conveying direction of the substrate S by the pair of conveyors 2 is set as the X1 direction, the direction opposite to the X1 direction is set as the X2 direction, and the direction combining the X1 direction and the X2 direction is set as the X direction. The direction orthogonal to the X direction in the horizontal direction is set as the Y direction. One direction in the Y direction is set as the Y1 direction, and the other direction in the Y direction is set as the Y2 direction. The direction orthogonal to the X direction and the Y direction is set as the Z direction (vertical direction), one direction in the Z direction is set as the Z1 direction (upward direction), and the other direction in the Z direction is set as the Z2 direction (downward direction).

[0040] A pair of conveyors 2 are arranged on a base 1 and configured to convey a substrate S in the X1 direction. In addition, a holding mechanism is provided on the pair of conveyors 2, and the holding mechanism holds the substrate S being conveyed in a state of stopping at the working position P1. In addition, the pair of conveyors 2 are configured to be able to adjust the interval in the Y direction according to the size of the substrate S.

[0041] The component supply unit 3 is arranged outside the pair of conveyors 2 (on the Y1 direction side and the Y2 direction side). In addition, a plurality of tape feeders 31 are arranged in the component supply unit 3. The component supply unit 3 is configured to supply components B to a mounting head 42 described later.

[0042] The tape feeder 31 holds a reel (not shown) around which a tape is wound, and the tape holds a plurality of components B at regular intervals. The tape feeder 31 is configured to rotate the reel by feeding out the storage tape 32 holding the components B, thereby supplying the components B from the front end of the tape feeder 31. Here, the components B include electronic components such as ICs, transistors, capacitors, and resistors.

[0043] The head unit 4 is arranged on the Z1 direction side of the pair of conveyors 2 and the component supply unit 3, and includes a plurality of (five) mounting heads 42 having suction nozzles 41 mounted at the lower ends (refer to Figure 2 ). In addition, the mounting head 42 is an example of the "working head" in the scope of protection claimed.

[0044] The mounting head 42 is configured to perform operations on the substrate S. Specifically, the mounting head 42 is configured to adsorb the components B in the component supply unit 3. In addition, the mounting head 42 is configured to mount the components B on the substrate S. In this way, the mounting head 42 adsorbs the components B supplied by the component supply unit 3 and mounts the adsorbed components B on the substrate S arranged at the working position P1. In addition, the mounting head 42 is configured to be able to move up and down (able to move in the Z direction), and is configured to adsorb and hold the components B supplied from the tape feeder 31 by the negative pressure generated at the front end of the suction nozzle 41 by a negative pressure generator (not shown), and mount the components B at the mounting position P3 of the substrate S. In addition, the mounting position P3 of the component B is an example of the "imaging position" in the scope of protection claimed.

[0045] The substrate recognition camera 43 is configured to photograph the fiducial marks of the substrate S to recognize the position and orientation of the substrate S. And by photographing and recognizing the position of the fiducial marks, the mounting position P3 of the components B on the substrate S can be accurately obtained.

[0046] The support portion 5 includes a motor 51. The support portion 5 is configured to move the head unit 4 along the support portion 5 in the X direction by driving the motor 51. Both ends of the support portion 5 are supported by a pair of rail portions 6.

[0047] A pair of rail parts 6 are fixed to the base 1. The rail part 6 on the X1 side includes a motor 61. The rail part 6 is configured such that by driving the motor 61, the support part 5 is moved in the Y direction along the pair of rail parts 6. The head unit 4 can move in the X direction along the support part 5, and the support part 5 can move in the Y direction along the rail part 6. Thus, the head unit 4 can move in the horizontal direction (XY direction).

[0048] The component recognition photographing part 7 is fixed to the upper surface of the base 1. The component recognition photographing part 7 is arranged outside the pair of conveyors 2 (on the Y1 direction side and the Y2 direction side). The component recognition photographing part 7 is configured to photograph the component B adsorbed to the nozzle 41 of the mounting head 42 from the lower side (Z2 direction side) to recognize the adsorption state (adsorption posture) of the component B before the mounting of the component B. Thus, the control unit 9 can obtain the adsorption state of the component B adsorbed to the nozzle 41 of the mounting head 42.

[0049] (Photographing unit)

[0050] As Figure 2 and Figure 3 shown, the photographing unit 8 is provided on the head unit 4. Thus, the photographing unit 8 is configured to move in the XY direction together with the head unit 4 by the movement of the head unit 4 in the horizontal direction (XY direction). The photographing unit 8 is offset in the horizontal direction (especially the Y direction) with respect to the mounting head 42 so as not to interfere with the movement of the mounting head 42 in the Z direction.

[0051] The photographing unit 8 is configured to be able to photograph the position where the mounting head 42 is to descend without moving the head unit 4. Specifically, the photographing unit 8 is configured to be able to photograph the adsorption position P2 (photographing position) of the component supply part 3 from multiple (two) directions. In addition, the photographing unit 8 is configured to be able to photograph the mounting position P3 (photographing position) of the substrate S from multiple (two) directions. In addition, the adsorption position P2 of the component B is an example of the "photographing position" in the claimed scope.

[0052] In this way, the photographing unit 8 is configured to photograph the periphery of the adsorption position P2 of the component B from multiple (two) directions, thereby photographing the first image and the second image. In addition, the photographing unit 8 is configured to photograph the periphery of the mounting position P3 of the component B from multiple (two) directions, thereby photographing the first image and the second image.

[0053] Specifically, the photographing unit 8 includes a lighting part 81, a first photographing part 82, and a second photographing part 83. Here, a set of the first photographing part 82 and the second photographing part 83 is correspondingly arranged for each of the multiple mounting heads 42.

[0054] The lighting unit 81 has a light source such as an LED (Light Emitting Diode). The lighting unit 81 is configured to irradiate the component B disposed at the adsorption position P2 or the mounting position P3 (imaging position) with light. The lighting unit 81 is configured to emit light when imaging is performed by the first imaging unit 82 and the second imaging unit 83. The lighting unit 81 is provided around the first imaging unit 82 and the second imaging unit 83. In addition, the first imaging unit 82 and the second imaging unit 83 are an example of the "multiple imaging units" in the claimed scope.

[0055] The first imaging unit 82 and the second imaging unit 83 each have a first camera 82a and a second camera 83a. The first camera 82a has a first imaging element 182a. The second camera 83a has a second imaging element 183a. The first imaging element 182a is configured to convert the light incident from the first lens unit 182b described later into an electrical signal. The second imaging element 183a is configured to convert the light incident from the second lens unit 183b described later into an electrical signal. In addition, the first imaging unit 82 and the second imaging unit 83 each have a first optical system 82b and a second optical system 83b. The first optical system 82b includes a first lens unit 182b having a plurality of lenses and a first aperture unit 182c. The second optical system 83b includes a second lens unit 183b having a plurality of lenses and a second aperture unit 183c. The first aperture unit 182c is a hole that restricts the light directed toward the first lens unit 182b. The second aperture unit 183c is a hole that restricts the light directed toward the second lens unit 183b.

[0056] The first imaging unit 82 and the second imaging unit 83 are provided in the head unit 4 in a state of being disposed at a plurality of different height positions in the Z direction. Each of the first imaging unit 82 and the second imaging unit 83 is configured to image the same adsorption position P2 (imaging position) or mounting position P3 (imaging position) where the component B is disposed from mutually different inclined directions intersecting the Z direction.

[0057] As Figure 4 and Figure 5As shown, the first imaging unit 82 and the second imaging unit 83 are configured to image from different tilt angles (θu and θt) with respect to the reference plane H0 in their respective imaging directions. The first imaging unit 82 and the second imaging unit 83 are arranged one above the other in the same plane along the Z direction and image the same adsorption position P2 (imaging position) or mounting position P3 (imaging position) where the component B (imaging object) is disposed from the tilt direction. Specifically, the first imaging unit 82 and the second imaging unit 83 are adjacently disposed within the vertical plane (within the YZ plane) with respect to the reference plane H0 and including the adsorption position P2 of the component B or the mounting position P3 of the component B. In addition, the first imaging unit 82 and the second imaging unit 83 are offset from each other in the Z direction. Here, the reference plane H0 is the upper surface of the substrate S that extends along the horizontal direction and is in a non-warped state.

[0058] The first imaging unit 82 has a first tilt angle θu in the tilt direction closer to the vertical direction among the tilt angles. The second imaging unit 83 is disposed on the Z2 direction side of the first imaging unit 82 and has a second tilt angle θt in the tilt direction closer to the horizontal direction than the first tilt angle θu. Here, the tilt angle indicates the degree of tilt of the optical axis of the first imaging unit 82 and the optical axis of the second imaging unit 83 that extend toward the component B with respect to the reference plane H0.

[0059] Therefore, each of the first imaging unit 82 and the second imaging unit 83 is configured to image both the periphery of the mounting position P3 (imaging position) of the component B as the imaging object and the periphery of the adsorption position P2 (imaging position) of the component B. That is, the imaging unit 8 can image the adsorption position P2 where the mounting head 42 adsorbs the component B and the mounting position P3 where the mounting head 42 mounts the component B from multiple directions (angles) respectively.

[0060] As Figure 4 and Figure 5 shown, in the first imaging unit 82 and the second imaging unit 83 of the first embodiment, different depths of field are set according to the first tilt angle θu and the second tilt angle θt in the tilt directions in which they image respectively. That is, in the first imaging unit 82 and the second imaging unit 83, different depths of field are set according to the first tilt angle θu and the second tilt angle θt of the respective optical axes from their respective height positions toward the component B. Specifically, the first imaging unit 82 has a first depth of field D1. The second imaging unit 83 has a second depth of field D2 deeper than the first depth of field D1 of the first imaging unit 82. Here, the second imaging unit 83 is disposed below the first imaging unit 82 in the vertical direction (Z2 direction).

[0061] The first depth of field D1 is set according to the F value of the first camera 82a. Specifically, by setting the aperture of the first photographing unit 82 to be constant, the first depth of field D1 is set to be a constant depth of field. That is, the first depth of field D1 is set by the first aperture unit 182c, which is a hole having a constant diameter. The second depth of field D2 is set according to the F value of the second camera 83a. Specifically, by setting the aperture of the second photographing unit 83 to be constant, the second depth of field D2 is set to be a constant depth of field deeper than the first depth of field D1. That is, the second depth of field D2 is set by the second aperture unit 183c, which is a hole having a constant diameter. Here, the diameter of the hole of the second aperture unit 183c is smaller than the diameter of the straight hole of the first aperture unit 182c.

[0062] The first depth of field D1 and the second depth of field D2 are each set in a cross section along the arrangement direction of the first photographing unit 82 and the second photographing unit 83, according to the assumed deviation amount H of the height position of the upper surface of the substrate S caused by the warping of the substrate, or the assumed deviation amount of the height position of the upper surface of the component B accommodated in the accommodation tape 32 caused by the difference in the type of the accommodation tape 32 for accommodating the component B, the horizontal direction (Y direction) length of the component B, and the tilt angle. Here, in the following description, the deviation amount H of the height position of the upper surface of the substrate S will be described. The deviation amount H is the difference between the upper height position H1 of the upper surface of the substrate S when the substrate S is warped upward and the lower height position H2 of the upper surface of the substrate S when the substrate S is warped downward. In addition, the deviation amount H may also be the deviation amount of the height position of the upper surface of the component B accommodated in the accommodation tape 32. In this case, the deviation amount H is the difference between the height position of the upper surface of the component B accommodated in one accommodation tape 32 as a reference among multiple types and the height position of the upper surface of the component B accommodated in an accommodation tape 32 of a type different from the above accommodation tape 32.

[0063] Here, the first depth of field D1 and the second depth of field D2 are each set according to the larger one of the deviation amount H of the height position of the upper surface of the substrate S and the deviation amount of the height position of the upper surface of the component B accommodated in the accommodation tape 32. In addition, the first depth of field D1 and the second depth of field D2 are each set according to the maximum length among the horizontal direction (Y direction) lengths of the plurality of components B.

[0064] As Figure 4 shown, the first depth of field D1 is set in a cross section along the arrangement direction of the first photographing unit 82 and the second photographing unit 83, according to the deviation amount H of the height position of the upper surface of the substrate S, the horizontal direction (Y direction) length L of the component B, and the first tilt angle θu. Specifically, the first depth of field D1 is obtained based on the relational expression D1 = H * sin(θu) + L * cos(θu).

[0065] As Figure 5As shown in the figure, the second depth of field D2 is set according to the deviation amount H of the height position of the upper surface of the substrate S, the horizontal length L of the component B, and the second inclination angle θt in the cross section along the arrangement direction of the first photographing unit 82 and the second photographing unit 83. Specifically, the second depth of field D2 is obtained based on the relational expression of the second depth of field D2 = H*sin(θt) + L*cos(θt).

[0066] As an example, in the case where the deviation amount H = 1.0 [mm], the length L = 4.0 [mm], θu = 60 degrees, and θt = 30 degrees, the first depth of field D1 is calculated to be approximately 2.866 [mm], and the second depth of field D2 is calculated to be approximately 3.964 [mm]. In this case, the second depth of field D2 is approximately 1.4 times deeper than the first depth of field D1. Accordingly, the F value of the second camera 83a is set smaller than the F value of the first camera 82a so that the second depth of field D2 becomes approximately 1.4 times the depth of the first depth of field D1. In this way, the first camera 82a and the second camera 83a are designed.

[0067] (Control Unit)

[0068] As Figure 1 shown in the figure, the control unit 9 includes a CPU (Central Processing Unit) and a storage unit. The storage unit is a storage device having memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory). An element mounting program for mounting the element B on the substrate S is stored in the storage unit.

[0069] As Figure 6 shown in the figure, the control unit 9 is configured to obtain the horizontal direction (XY direction) position and the vertical direction (Z direction) height position H3 of the component B at the adsorption position P2 of the component B based on the images of the adsorption position P2 of the component B photographed by the first photographing unit 82 and the second photographing unit 83 from multiple (two) directions. In addition, the control unit 9 is configured to obtain the horizontal direction (XY direction) position and the vertical direction (Z direction) height position H3 of the mounting position P3 of the component B based on the images of the mounting position P3 of the component B photographed by the first photographing unit 82 and the second photographing unit 83 from multiple (two) directions.

[0070] Specifically, the control unit 9 is configured to obtain the height position H3 with respect to the reference plane H0 through stereo matching. That is, by matching the images of the adsorption position P2 or the mounting position P3 of the component B captured by the first imaging unit 82 and the second imaging unit 83 substantially simultaneously, the height position H3 and the horizontal position of the captured position are obtained. That is, the control unit 9 is configured to perform the following control: based on the first image captured by the first imaging unit 82 and the second image captured by the second imaging unit 83, the height position H3 around the object to be captured is obtained. General matching methods such as SSD (Sum of Squared Difference) and SAD (Sum of Absolute Difference) are used for the matching.

[0071] (Effect of the First Embodiment)

[0072] In the first embodiment, the following effects can be obtained.

[0073] In the first embodiment, as described above, in the first imaging unit 82 and the second imaging unit 83 (multiple imaging units), different depths of field are set according to the first inclination angle θu and the second inclination angle θt of the respective optical axes toward the component B from their respective height positions. Thus, even if the first imaging unit 82 and the second imaging unit 83 (multiple imaging units) are respectively arranged at multiple different height positions in the Z direction (vertical direction), by setting different depths of field according to the inclination angles in each of the first imaging unit 82 and the second imaging unit 83 (multiple imaging units), the focus setting can be individually performed for the adsorption position P2 or the mounting position P3 where the component B (object to be captured) is arranged. As a result, the focus (Japanese: ピント) of the images captured from the inclination direction by each of the first imaging unit 82 and the second imaging unit 83 (multiple imaging units) arranged at multiple different height positions in the vertical direction can be made to coincide more reliably.

[0074] In addition, in the first embodiment, as described above, the first imaging unit 82 and the second imaging unit 83 are provided. The first imaging unit 82 has a first inclination angle θu in the inclination direction closer to the Z direction (vertical direction) among the inclination angles, and the second imaging unit 83 is arranged below the first imaging unit 82 and has a second inclination angle θt in the inclination direction closer to the horizontal direction than the first inclination angle θu. A second depth of field D2 deeper than the first depth of field D1 of the first imaging unit 82 is set for the second imaging unit 83. Thus, by making the second depth of field D2 deeper than the first depth of field D1, the second depth of field D2 of the second imaging unit 83 can be sufficiently ensured, and therefore the focus of the image captured by the second imaging unit 83 can be made to coincide more reliably.

[0075] In addition, in the first embodiment, as described above, the first imaging unit 82 and the second imaging unit 83 are arranged one above the other in the same plane along the Z direction (vertical direction) and image the same adsorption position P2 (imaging position) or mounting position P3 (imaging position) where the element B (imaging object) is arranged from an inclined direction. The second imaging unit 83 is arranged below the first imaging unit 82 in the Z direction (vertical direction), and a second depth of field D2 deeper than the first depth of field D1 is set. As a result, compared with the case where the first imaging unit 82 and the second imaging unit 83 are arranged at positions deviated from the same plane along the Z direction (vertical direction), the horizontal installation space of the first imaging unit 82 and the second imaging unit 83 can be reduced. As a result, the focus of the image captured by the second imaging unit 83 can be made consistent more reliably, and the enlargement of the head unit 4 on which the first imaging unit 82 and the second imaging unit 83 are arranged can be suppressed.

[0076] In addition, in the first embodiment, as described above, by setting the aperture of the first imaging unit 82 to be constant, the first depth of field D1 is set to be a constant depth of field. By setting the aperture of the second imaging unit 83 to be constant, the second depth of field D2 is set to be a constant depth of field deeper than the first depth of field D1. As a result, a configuration for adjusting the apertures of the first imaging unit 82 and the second imaging unit 83 is not required, and thus the enlargement of the head unit 4 can be suppressed.

[0077] In addition, in the first embodiment, as described above, each of the first imaging unit 82 and the second imaging unit 83 is configured to image at least one of the periphery of the mounting position P3 of the element B and the periphery of the adsorption position P2 of the element B as the element B (imaging object). In a cross section along the arrangement direction of the first imaging unit 82 and the second imaging unit 83, the first depth of field D1 and the second depth of field D2 are set according to the deviation amount H of the height position of the upper surface of the substrate S caused by the warping of the substrate S, the horizontal length L of the element B, the first inclination angle θu, and the second inclination angle θt. As a result, appropriate values of the first depth of field D1 and the second depth of field D2 can be obtained, and thus an appropriate depth of field can be set for each of the first imaging unit 82 and the second imaging unit 83.

[0078] In addition, in the first embodiment, as described above, a first camera 82a and a second camera 83a are respectively provided in the first imaging unit 82 and the second imaging unit 83. As a result, compared with the case of imaging using a shared camera, the configuration of the optical systems such as lenses of the first imaging unit 82 and the second imaging unit 83 can be simplified, and thus the complication of the configuration of the first imaging unit 82 and the second imaging unit 83 can be suppressed.

[0079] In addition, in the first embodiment, as described above, the control unit 9 is configured to obtain the height position of the periphery of the component B (the object to be photographed) based on the first image photographed by the first photographing unit 82 and the second image photographed by the second photographing unit 83. Thus, by obtaining the height position of the periphery of the component B (the object to be photographed) based on the first image and the focused second image, it is possible to obtain the height position of the periphery of the object to be photographed more accurately. Therefore, the operation of the mounting head 42 on the substrate S can be performed with high precision.

[0080] [Second Embodiment]

[0081] Refer to Figure 7 and Figure 8 to describe the structure of the component mounting apparatus 200 of the second embodiment. In the second embodiment, different from the first embodiment, the control unit 209 makes the brightness of the image photographed by the first photographing unit 82 coincide with the brightness of the image photographed by the second photographing unit 83. In addition, in the second embodiment, the description of the same structure as that of the first embodiment is omitted.

[0082] As Figure 7 and Figure 8 shown, the component mounting apparatus 200 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, a component recognition photographing unit 7, a photographing unit 8, and a control unit 209. In addition, the component mounting apparatus 200 is an example of the "substrate working apparatus" in the scope of protection.

[0083] The control unit 209 of the second embodiment is configured to perform the following control: by making the exposure times of the first photographing unit 82 and the second photographing unit 83 different from each other, the brightnesses of the images photographed by the first photographing unit 82 and the second photographing unit 83 are made to be substantially the same as each other. Specifically, the control unit 209 performs the following control: by making the exposure time of the second photographing unit 83 larger than the exposure time of the first photographing unit 82 by an amount by which the amount of transmitted light decreases due to the deeper depth of field, the brightnesses of the images photographed by the first photographing unit 82 and the second photographing unit 83 are made to be substantially the same as each other.

[0084] In addition, at this time, the control unit 209 may also be configured to perform the exposure of the second imaging unit 83 in parallel with the exposure of the first imaging unit 82. That is, as an example, in the case where the exposure start timing of the first imaging unit 82 is made to coincide with the exposure start timing of the second imaging unit 83, the exposure end timing of the first imaging unit 82 may be made to coincide with the exposure end timing of the second imaging unit 83. In addition, as an example, sometimes the exposure of the first imaging unit 82 is started during the exposure of the second imaging unit 83, and the exposure of the first imaging unit 82 is ended. In addition, as an example, sometimes the exposure of the first imaging unit 82 is started during the exposure of the second imaging unit 83, and the exposure of the first imaging unit 82 is ended after the exposure of the second imaging unit 83 is ended. In addition, other configurations of the second embodiment are the same as those of the first embodiment described above.

[0085] (Effect of the second embodiment)

[0086] In the second embodiment, similarly to the first embodiment described above, in the first imaging unit 82 and the second imaging unit 83 (multiple imaging units), different depths of field are set according to the first tilt angle θu and the second tilt angle θt of their respective optical axes toward the element B from their respective height positions. As a result, it is possible to make the focus (in Japanese: ピント) of the images taken from the tilt direction by each of the first imaging unit 82 and the second imaging unit 83 (multiple imaging units) arranged at multiple different height positions in the vertical direction more reliably coincide.

[0087] In addition, in the second embodiment, as described above, the element mounting device 200 is provided with: an illumination unit 81 that irradiates light to the element B (the object to be imaged); and a control unit 209 that controls the imaging of the element B (the object to be imaged) by each of the first imaging unit 82 and the second imaging unit 83. The control unit 209 is configured to perform the following control: by making the exposure times of the first imaging unit 82 and the second imaging unit 83 different from each other, the brightness of the images taken by the first imaging unit 82 and the second imaging unit 83 is made to be substantially the same as each other. As a result, even in the case where the second depth of field D2 is made deeper than the first depth of field D1, it is possible to focus in the second imaging unit 83, and not only that, but also to ensure the brightness of the image taken by the second imaging unit 83. As a result, it is possible to make the focus of the image taken by the second imaging unit 83 more reliably coincide, and it is possible to take an image with the same brightness as the image taken by the first imaging unit 82 by the second imaging unit 83.

[0088] In addition, in the second embodiment, as described above, the control unit 209 is configured to perform the exposure of the second imaging unit 83 in parallel with the exposure of the first imaging unit 82. Thus, the time required for exposure when imaging the adsorption position P2 or the mounting position P3 (imaging position) can be minimized, so that the operation time of the mounting head 42 on the substrate S can be prevented from increasing. In addition, other effects of the second embodiment are the same as those of the first embodiment.

[0089] [Modification Example]

[0090] In addition, it should be considered that the first and second embodiments disclosed this time are illustrative in all aspects and not restrictive. The scope of the present invention is not shown by the descriptions of the above first and second embodiments, but is shown by the scope of claims, and includes all changes (modification examples) within the meaning and scope equivalent to the scope of claims.

[0091] For example, in the above first and second embodiments, an example is shown in which the first imaging unit 82 and the second imaging unit 83 are arranged one above the other in the same plane along the vertical direction and image the same imaging position where the imaging object is arranged from an inclined direction. However, the present invention is not limited to this. In the present invention, the first imaging unit and the second imaging unit may not be arranged in the same plane along the vertical direction.

[0092] In addition, in the above second embodiment, an example is shown in which the control unit 9 (209) is configured to perform the following control: by making the exposure times for the first imaging unit 82 and the second imaging unit 83 different, the brightnesses of the images respectively captured by the first imaging unit 82 and the second imaging unit 83 are made substantially the same. However, the present invention is not limited to this. In the present invention, the control unit may be configured to perform the following control: by making the sensor gains for the first imaging unit and the second imaging unit different, the brightnesses of the images respectively captured by the first imaging unit and the second imaging unit are made substantially the same. In this case, in the control unit, the sensor gain of the second imaging unit is set to be larger than the sensor gain of the first imaging unit. In addition, the control unit may be configured to perform the following control: by making the light amounts of the illumination units different, the brightnesses of the images respectively captured by the first imaging unit and the second imaging unit are made substantially the same. In this case, in the control unit, the exposure timings of the first imaging unit and the second imaging unit are set separately, and the light amount at the time of exposure of the second imaging unit is set to be larger than the light amount at the time of exposure of the first imaging unit.

[0093] In addition, in the above first and second embodiments, an example is shown in which the first imaging unit 82 and the second imaging unit 83 respectively include a first camera 82a and a second camera 83a. However, the present invention is not limited to this. In the present invention, as Figure 9As in the illustrated modification example, the first imaging unit 82 and the second imaging unit 83 may also include a shared camera 382 and an optical system 383 that divides the field of view of the shared camera. Thereby, the number of required cameras can be suppressed, and thus the enlargement of the head unit 4 can be suppressed.

[0094] In addition, in the above-described first and second embodiments, as an example of the "working head" in the claimed scope, the mounting head 42 is shown, but the present invention is not limited thereto. In the present invention, the working head may also be a dispensing head for applying an adhesive to a substrate.

[0095] In addition, in the above-described first and second embodiments, as an example of the "substrate working device" in the claimed scope, the component mounting device is shown, but the present invention is not limited thereto. In the present invention, the substrate working device may also be a coating device for coating an adhesive or paste solder onto a substrate.

[0096] In addition, in the second embodiment, an example is shown in which the control unit 209 is configured to perform the exposure of the second imaging unit 83 in parallel with the exposure of the first imaging unit 82, but the present invention is not limited thereto. In the present invention, the exposure of the first imaging unit and the exposure of the second imaging unit may also be performed sequentially.

[0097] Reference Numeral Explanation

[0098] 4 Head unit

[0099] 42 Mounting head (working head)

[0100] 81 Lighting unit

[0101] 82 First imaging unit (multiple imaging units)

[0102] 82a First camera

[0103] 83 Second imaging unit (multiple imaging units)

[0104] 83a Second camera

[0105] 100, 200 Component mounting device (substrate working device)

[0106] 382 Shared camera

[0107] 383 Optical system

[0108] B Component (imaging object)

[0109] D1 First depth of field

[0110] D2 Second depth of field

[0111] H Deviation amount

[0112] H3 height position

[0113] L length

[0114] P2 adsorption position (shooting position)

[0115] P3 installation position (shooting position)

[0116] S substrate

[0117] θt second tilt angle

[0118] θu first tilt angle

Claims

1. A substrate processing apparatus, comprising: a head unit including a processing head for processing a substrate; and a plurality of imaging units arranged at a plurality of different height positions in the vertical direction in the head unit, and respectively imaging the same imaging position where an imaging object is arranged from mutually different tilt directions, in the plurality of imaging units, different depth of fields are set according to the tilt angles of the respective tilt directions for imaging, the plurality of imaging units include a first imaging unit and a second imaging unit arranged at different height positions in the vertical direction, the substrate processing apparatus is configured to obtain the height position of the imaging position by performing stereo matching of a first image captured by the first imaging unit and a second image captured by the second imaging unit.

2. The substrate processing apparatus according to claim 1, wherein the plurality of imaging units include: a first imaging unit having a first tilt angle in a tilt direction close to the vertical direction among the tilt angles; and a second imaging unit arranged below the first imaging unit and having a second tilt angle in a tilt direction closer to the horizontal direction than the first tilt angle, the second imaging unit has a second depth of field deeper than the first depth of field of the first imaging unit.

3. The substrate processing apparatus according to claim 2, wherein the first imaging unit and the second imaging unit are arranged vertically one above the other in the same plane along the vertical direction and image the same imaging position where the imaging object is arranged from the tilt direction, the second imaging unit is arranged below the first imaging unit in the vertical direction and has the second depth of field deeper than the first depth of field.

4. The substrate processing apparatus according to claim 2 or 3, wherein by setting the aperture of the first imaging unit to be constant, the first depth of field is set to be a constant depth of field, by setting the aperture of the second imaging unit to be constant, the second depth of field is set to be a constant depth of field deeper than the first depth of field.

5. The substrate processing apparatus according to claim 2 or 3, wherein each of the first imaging unit and the second imaging unit is configured to image at least one of the periphery of the mounting position of the component as the imaging object and the periphery of the adsorption position of the component, the first depth of field and the second depth of field are each set in a cross section along the arrangement direction of the first imaging unit and the second imaging unit according to the assumed deviation amount of the height position of the upper surface of the substrate caused by the warping of the substrate or the assumed deviation amount of the height position of the upper surface of the component stored in the storage tape caused by the difference in the type of the storage tape for storing the component, the horizontal length of the component, and the tilt angle.

6. The substrate processing apparatus according to claim 2 or 3, wherein the substrate processing apparatus further includes: a lighting unit that irradiates light to the imaging object; and a control unit that controls imaging of the imaging object by each of the first imaging unit and the second imaging unit. The control unit is configured to perform control such that the brightness of the images captured by the first imaging unit and the second imaging unit is made the same by making any one of the sensor gains for the first imaging unit and the second imaging unit, the exposure times for the first imaging unit and the second imaging unit, and the light amount of the illumination unit different from each other.

7. The substrate processing apparatus according to claim 6, wherein the control unit is configured to perform exposure of the second imaging unit in parallel with the exposure of the first imaging unit.

8. The substrate processing apparatus according to any one of claims 2, 3, and 7, wherein the first imaging unit and the second imaging unit respectively include a first camera and a second camera.

9. The substrate processing apparatus according to any one of claims 2, 3, and 7, wherein the first imaging unit and the second imaging unit include: a shared camera; and an optical system that divides the field of view of the shared camera.

10. The substrate processing apparatus according to any one of claims 2, 3, and 7, wherein the substrate processing apparatus is configured to obtain the height position of the periphery of the object to be imaged based on a first image captured by the first imaging unit and a second image captured by the second imaging unit.

Images