Condensate drain, electronic assembly, and method of manufacturing a condensate drain

Abstract

The invention relates to a condensate discharge device for discharging condensate from at least one cooled component, in particular a cooled electronic device, and having surfaces which can form condensate, wherein the condensate discharge device comprises a thermally conductive element having a condensation surface, which is designed to at least partially cover the surface of the at least one component and to transfer cold which leads to condensation on the surface of the at least one component to the condensation surface, and a housing having at least one condensate discharge line and / or a condensate chamber for collecting condensate formed on the condensation surface, wherein the at least one condensate discharge line each defines at least one predetermined flow path for discharging condensate from the housing, which flow path is fluidically separated from the at least one component.

Description

TECHNICAL FIELD

[0001] The invention relates to a condensate discharge device for discharging condensate from a component, an electronic assembly having a component and such a condensate discharge device, and a method of manufacturing such a condensate discharge device. BACKGROUND

[0002] A large number of components having cooling devices are known from the prior art. In this case, in particular on actively cooled components, for example by means of water cooling, strong cooling can lead to condensation, which leads to the formation of condensate on the component.

[0003] This condensation occurs in particular when actively cooled components are not in operation, in particular electronic devices, for example power electronics, so that no excess heat has to or can be dissipated from the actively cooled components.

[0004] The condensate formed on the component can lead to corrosion and short circuits, so that the component is damaged by the condensate.

[0005] In order to avoid such damage, various countermeasures are known.

[0006] For example, it is provided that the component is at least partially encapsulated with a casting compound, so that condensation occurs not on the component itself but on the casting compound. However, in this case the condensate is usually not removed from the casting compound, so that this can lead to malfunctions and damage in the region adjacent to the component or in the unencapsulated region of the component. SUMMARY

[0007] It is therefore an object of the present invention to overcome the above-mentioned disadvantages and to provide a condensate discharge device, an electronic assembly and a method of manufacturing, in which the condensate is completely fluidically separated from the component and is preferably discharged independently of the spatial orientation of the component and / or the condensate discharge device.

[0008] This object is achieved by the combination of features according to the following technical solution.

[0009] According to the invention, therefore, a condensate discharge device for discharging condensate from at least one cooled component is proposed. The at least one component is in particular a cooled electronic device or electronic component, for example a power electronic device, which can be cooled by water cooling. For simplicity, the following refers to a (single) assembly, which is to be understood as at least one component. Such a component has a surface which can form condensate at least without the condensate discharge device according to the invention. According to the invention, the condensate discharge device comprises a thermally conductive element having a condensation surface. The thermally conductive element is in particular formed from an electrically non-conductive material and is preferably in close and direct abutment on the surface of the component, so that no cavity is formed between the component, in particular the surface of the component, and the thermally conductive element, in which condensation can occur. The thermally conductive element is designed to at least section-wise or partially and in particular completely cover the surface of the component and to transfer the condensation on the surface of the component to the condensation surface, so that condensate does not form on the surface of the component, but on the condensation surface. In order to control the condensation purposefully, the condensation surface can be smaller than the surface of the component. Furthermore, the condensate discharge device according to the invention has a housing, which is preferably formed from a material which is less thermally conductive compared to the thermally conductive element. The housing is provided with at least one condensate discharge line, but preferably with a plurality of condensate discharge lines and / or a condensate chamber for collecting or receiving the condensate formed on the condensation surface. The at least one condensate discharge line each determines or defines at least one predetermined flow path for discharging the condensate out of the housing, which is fluidically separated from the component.

[0010] Thus, when condensation occurs, condensate no longer forms on the component itself, but purposefully on the condensation surface, which is in particular provided for this purpose, from which the condensate is discharged purposefully via the condensate discharge line. Thus, the component is no longer subjected to corrosion, short circuits or other malfunctions caused by condensate.

[0011] The basic idea of the invention is to allow condensation in a defined area, i.e. the condensation surface, while minimizing the condensation area by heat exchange with the environment and encapsulating it with respect to the component, for example an electronic device. In order to protect the area that allows condensation, a casting compound is used to seal the component with respect to the area that allows condensation and to protect against damage / short circuits.

[0012] Due to the condensation area defined by the condensation surface and the plurality of condensate discharge lines, according to the improved solution explained in more detail below, it is also possible to install the electronic device or component to be protected in different installation positions. In these installation positions, the condensate is always remote from the electronic device or component.

[0013] According to an advantageous variant, it can be provided that the housing has a lower part and / or an upper part, which are designed to surround the component, in particular the surface area, from two opposite sides.

[0014] The component may, for example, be formed of a circuit board and a power module disposed thereon, the power module contacting the circuit board and having a cooling device on the side facing away from the circuit board. Because strong cooling or light cooling of the power module when it is not in use may cause condensation on the side of the circuit board facing away from the power module, the surface of the component where condensation may occur is equal to the surface of the circuit board facing away from the power module in the area of ​​the power module.

[0015] The two-part housing of the condensate drain device can be configured such that the lower part of the housing is adjacent to the cooling device and surrounds the power module on the side of the circuit board facing the cooling device, while the upper part of the housing is located on the side of the circuit board away from the cooling device, thus surrounding the surface where condensation may occur.

[0016] Furthermore, preferably, the condensing surface is exposed in the condensate chamber, i.e., specifically without a shell or shell material, and forms part of the surface defining the condensate chamber. Thus, the condensate chamber is partially defined by the shell and partially by the condensing surface.

[0017] To facilitate the discharge of condensate, it is preferably specified that at least one condensate drain line, or each condensate drain line, is designed to discharge condensate from the housing, the condensate forming on the condensation surface and being transported by gravity along a flow path separate from at least one component into the condensate chamber. For this purpose, the corresponding condensate drain line may also have guide channels and / or fluid passages through which the condensate can be discharged from the housing.

[0018] In principle, components that discharge condensate via the condensate discharge device according to the invention can be arranged in different installation locations or orientations in space. Changes in spatial orientation may also occur during operation, particularly in unstable systems. For example, components can be arranged in a first spatial orientation or a second spatial orientation different from the first spatial orientation, or their spatial orientation can be changed from the first spatial orientation to the second orientation. To ensure that condensate is discharged in the first and second orientations, and preferably in all possible orientations, an advantageous improvement is that the housing has a first condensate discharge line and a second condensate discharge line, the first condensate discharge line defining at least one predetermined first flow path for discharging condensate from the housing, the first flow path being separate from the fluid of the component, and the second condensate discharge line having at least one predetermined second flow path for discharging condensate from the housing, the second flow path being separate from the fluid of the component. The condensate discharge device can be fixed to the component, preferably without changing its relative position to the component, thereby allowing it to be arranged with the component in a first spatial orientation or a second spatial orientation different from the first spatial orientation, or with its spatial orientation changed relative to the component. In order to discharge condensate, the condensate is specified to be able to be led out of the housing in the first spatial orientation through the first condensate discharge line and / or through the second condensate discharge line, and in the second spatial orientation through the second condensate discharge line and / or the first condensate discharge line.

[0019] It can be specified that the condensate flows out only through the first condensate drain pipe in the first orientation, and only through the second condensate drain pipe in the second orientation. This may occur, for example, when the component rotates 90° or 180° from the first orientation into the second orientation about a spatial axis perpendicular to the vertical axis of space.

[0020] Preferably, at least one associated condensate drain line is provided for multiple orientations, and more preferably for each possible spatial orientation of the component, through which condensate can be guided out of the housing, particularly by gravity.

[0021] The outer casing and its condensate chamber can also be designed in a funnel shape, opening on the side opposite to the condensation surface. Therefore, the outer wall of the casing forming the funnel creates multiple condensate drain lines.

[0022] Due to its funnel shape, the condensate chamber preferably widens as the distance from the condensation surface increases.

[0023] To prevent condensate from accumulating at the bottom of the condensate chamber or on the condensation surface, one or more condensate drain lines can be installed near the condensation surface. The condensate chamber preferably has a rectangular basic shape, wherein the condensate drain lines can be located in at least one corner, and preferably in each corner. Guide channels can be installed from the condensation surface, leading to the corresponding condensate drain lines, so that condensate can flow from the condensation surface through the guide channels into the corresponding condensate drain lines. Such guide channels can, for example, be formed by one or more inclined planes.

[0024] The component, or a circuit board, which is part of the component, may have an opening through which at least one condensate drain line or one of a plurality of condensate drain lines may extend.

[0025] The thermally conductive element is preferably formed from a castable or paint or a flowable and hardenable protective material that remains flowable or liquid during processing and can then be hardened to form the thermally conductive element.

[0026] The housing may have a cavity for accommodating a heat-conducting element, wherein the cavity is completely filled with the heat-conducting element. The walls of the cavity may be partially formed by the housing and partially formed by the component and / or cooling device. Furthermore, the cavity is designed to at least partially enclose the component and completely enclose the surface of the component. The cavity forms a casting mold for the castable. Accordingly, the cavity preferably opens only toward the condensate chamber, such that the castable can be introduced into the cavity through the condensate chamber, and the castable, which has hardened to form the heat-conducting element, closes the opening of the cavity to the condensate chamber and forms a condensation surface.

[0027] To enable a fluid seal, together with the component, for the cavity of a casting mold used for casting refractory material, according to another embodiment variation, the housing may have at least one sealing portion, specifically designed as, for example, a sealing lip, to abut against the component. The sealing portion is designed to seal, with respect to the environment, the cavity designed as a casting mold, preferably in a fluid-tight manner, together with the at least one component. If the housing has a lower and upper portion, or if the housing is designed in multiple portions, the sealing portion, specifically designed as a sealing lip, may also be provided on each or at least multiple portions of the housing.

[0028] On the other hand, it relates to an electronic component having a cooling device, at least one electrical component, and a condensate draining device according to the invention. The electronic component may also be referred to as an electronic unit. The cooling device for cooling at least one component is arranged on one or more components, and said at least one component has a surface on which condensate may form due to cooling by the cooling device, at least in the absence of a condensate draining device, which can be avoided by the condensate draining device according to the invention.

[0029] The electronic component preferably has a component housing, which specifically surrounds the at least one component having a condensate drain device. The condensate drain device housing is specifically arranged entirely inside the component housing. At least one condensate drain line is designed to drain condensate from the component housing. Accordingly, the condensate chamber can be fluidly or circumferentially connected to the environment surrounding the component housing via each condensate drain line, such that the condensate can preferably be transported to the environment by gravity.

[0030] Furthermore, an important aspect of the invention relates to a method for manufacturing an electronic component according to the invention. A housing is arranged to abut against a cavity formed by at least one component, and preferably is sealed relative to at least one component, and more preferably is sealed in a liquid-tight manner, such that the cavity is open only to a condensate chamber through which liquid (condensate) can flow out or drain. For example, an airtight seal is not required. Then, through an opening leading to the condensate chamber, a castable material distributed within the cavity and completely filling the cavity is filled by gravity, and the thermally conductive element is formed after the castable material hardens.

[0031] The features disclosed above can be combined as needed, provided that these features are technically feasible and do not contradict each other. Attached Figure Description

[0032] Other advantageous further aspects of the invention are characterized in the dependent claims or presented in more detail below together with the description of preferred embodiments of the invention with reference to the accompanying drawings. The drawings show:

[0033] Figure 1 A perspective view of a condensate drain device installed on the component;

[0034] Figure 2 A top view of the condensate discharge device;

[0035] Figure 3 This is the first cross section through the condensate discharge device;

[0036] Figure 4 This is the second cross section through the condensate discharge device. Detailed Implementation

[0037] Figures 1 to 4 This is a schematic example and illustrates a condensate drain device 1 or an electronic component with a cooling device 4, and a component 2 with the condensate drain device 1 cooled by the cooling device 4. The same reference numerals in the figures indicate the same functional and / or structural features. Although not every reference numeral is used in every figure, the corresponding features are present. Therefore, the following description applies to all figures.

[0038] Especially in Figure 3 and Figure 4 As can be seen, component 2 has, for example, a power electronic device 5 that is electrically contacted on circuit board 6.

[0039] The power electronic devices 5 become very hot during operation, so they must be cooled by the cooling device 4. For this purpose, the cooling device 4 has a heat sink 7, which dissipates the heat of the power electronic devices 5 and transfers the heat to the cooling pipes 8 or the coolant flowing through the cooling pipes 8.

[0040] A large number of components are typically cooled by coolant, so that when the power electronics 5 is deactivated, i.e. turned off and therefore does not dissipate any heat, the coolant also flows through the heat sink 7 or component 2 to cool it.

[0041] This results in low temperatures on component 2, which may lead to condensation on component 2, especially on surface 3 of component 2.

[0042] A condensate drain device 1 is provided for the purposeful removal of condensate formed on component 2.

[0043] It has an outer shell 20 consisting of an upper part 26 and a lower part 25.

[0044] The lower part 25 is disposed on the first or lower side of the circuit board 6, and the power electronics 5 and the cooling device 4 are also arranged on this side. Here, the lower part 25 surrounds the power electronics in the circumferential direction around the vertical axis Z located in the plane of the drawing, and is tightly sealed with the heat sink 7 and sealed relative to the circuit board 6 by the sealing lip 28.

[0045] The upper part 26 is arranged on the opposite side of the circuit board 6 relative to the lower part 25, and is sealed relative to the circuit board 6 by another sealing lip 28.

[0046] Therefore, the upper portion 26 and the lower portion 25 of the housing 20 together define a fluid-sealed cavity 27 surrounding the power electronics 5, on which the surface 3 of the component where condensation may occur is located. The cavity 27 opens only through the opening 29 to the condensate chamber 24 formed by the housing 20. Thus, the cavity 27 forms a casting mold in which a portion of the power electronics 5 and the circuit board 6, or more generally a portion of the component 2 where condensation may occur, and the entire surface 3 are arranged or accommodated.

[0047] During manufacturing, the still-flowable or liquid castable is then filled into the mold cavity 27 that forms the casting mold. The castable is distributed throughout and completely fills the mold cavity 27. By curing the castable, a thermally conductive element 10 is formed, which completely covers the surface 3 where condensation may occur, thereby preventing condensation on the surface.

[0048] Since the outer casing 20 rests directly against the heat-conducting element 10 except for the area of ​​the opening 29, and preferably has a much lower thermal conductivity than the heat-conducting element 10, condensation can only occur in the area of ​​the opening 29 or in the area of ​​the opening 29 where the condensation surface 11 is formed. This prevents condensation on the component 2 and specifically generates condensation on the condensation surface 11.

[0049] The condensing surface 11 is located within or forms a portion of the condensate chamber 24. Therefore, condensate formed on the condensing surface 11 is collected in the condensate chamber 24. To prevent malfunctions and damage to the surrounding area, the condensate must be able to drain from the condensate chamber 24 in a targeted and safe manner.

[0050] In example Figure 3 and Figure 4 In the installation position shown, where gravity is parallel to the vertical axis Z and acts downwards in the plane shown, condensate can be discharged from the condensation surface 11 to the first and second condensate discharge lines 21, 22 via a guide channel 30 designed for this purpose. Specifically, it can be... Figure 1 and Figure 2 I saw it in the middle.

[0051] The guide channel 30 and the condensate discharge lines 21, 22 are formed by the housing 20. Thus, condensate can be discharged through the first and second condensate discharge lines 21, 22 in a manner that separates it from the fluid of component 2. For this purpose, recesses are provided in component 2 or in the circuit board 6 of component, through which the first and second condensate discharge lines 21, 22 extend.

[0052] A particularly advantageous further aspect of the invention is that the condensate can be discharged not only from a single predetermined location from the condensate chamber 24, but also from multiple locations, so that the condensate discharge device 1 can use components 2 with different positioning, or together with components 2, change spatial orientation or position in space, while ensuring safe discharge of condensate.

[0053] For this purpose, the condensate chamber 24 is designed as an open funnel, which is open on the side opposite to component 2 along the vertical axis Z.

[0054] Starting from the initial position, such as Figure 3 and Figure 4As shown, condensate can initially flow away under gravity through the first and second condensate drain lines 21, 22 and along the flow paths 21S, 22S defined by them. If the component 2 with the condensate drain device 1 rotates about the spatial axis Y or is arranged to rotate with the condensate drain device, the condensate can flow out through the first condensate drain pipe 21 or the second condensate drain pipe 22 up to a limiting angle. If the rotation exceeds the limiting angle, the condensate can no longer flow into the first or second condensate drain pipes 21, 22, but instead flows out through the condensate drain pipe 23 formed by the funnel shape of the condensate chamber 24, wherein the condensate chamber 24 forms multiple possible condensate drain ports 23 due to its upward-opening shape. Four possible flow paths 23S1 to 23S4 are shown here as examples. If the rotation about the spatial axis Y exceeds the limiting angle, the condensate can flow out of the condensate chamber 24 along the flow path 23S1 or along the flow path 23S3, depending on the direction of rotation about the spatial axis Y.

[0055] In this example, we assume the limiting angle is approximately 90°.

[0056] Accordingly, the condensate discharge device 1 can be arbitrarily rotated or arranged in a rotatable manner around the spatial axis Y, wherein in each case, reliable discharge of condensate is ensured and in a manner that separates it from the fluid of the component.

[0057] Two other flow paths, 23S2 and 23S4, are also shown as examples, which allow condensate to be discharged from the condensate chamber 24 when the condensate discharge device 1 rotates about the spatial axis X.

[0058] In addition to the first and second condensate drain lines 21 and 22, which are not shown here, other condensate drain lines passing through the circuit board 6 may also be provided.

[0059] Not shown in the figure, the entire electronic assembly may have a housing containing the encapsulation component 2 and the condensate drain device 1. The condensate drain lines 21, 22, 23 are preferably arranged to exit from the housing, such that the condensate can be guided out of the housing along flow paths 21S, 22S, 23S1, 23S2, 23S3, 23S4 and, for example, through a hose, without fluid contact with the components.

[0060] The implementation of this invention is not limited to the preferred exemplary embodiments specified above. Rather, even in cases of fundamentally different designs, various variations of the illustrated scheme are conceivable.

Claims

1. A condensate discharge device (1) for discharging condensate from at least one cooled component (2), the condensate discharge device having a surface (3) capable of forming condensate. The condensate discharge device (1) therein includes a heat-conducting element (10) having a condensation surface (11), the heat-conducting element being designed to at least partially cover the surface (3) of at least one component (2) and to transfer cold that causes condensation to the condensation surface (11) on the surface (3) of the at least one component (2). The condensate discharge device also has a housing (20) having at least one condensate discharge line (21, 22, 23) and / or a condensate chamber (24) for collecting condensate formed on the condensate surface (11). in, Each of the at least one condensate discharge line (21, 22, 23) defines at least one predetermined flow path (21S, 22S, 23S1, 23S2, 23S3, 23S4) for discharging condensate from the housing (20), the flow path being fluidly separated from the at least one component (2). The thermally conductive element (10) is formed of a protective material that is fluid and capable of solidification. The outer shell (20) has a cavity (27) for accommodating the heat-conducting element (10), wherein the cavity (27) is completely filled by the heat-conducting element (10) and is designed to at least partially surround the at least one component (2) and completely surround the surface (3) of the at least one component (2), and forms a casting mold for casting refractory.

2. The condensate discharge device according to claim 1, wherein, The cooled component is a cooled electronic device.

3. The condensate discharge device according to claim 1, in, The housing (20) has a lower portion (25) and / or an upper portion (26) which are designed to surround the at least one component (2) from two opposite sides.

4. The condensate discharge device according to claim 3, wherein the lower part (25) and / or the upper part (26) is designed to surround the at least one component (2) from two opposite sides in the region of the surface (3).

5. The condensate discharge device according to any one of claims 1 to 4, in, The condensation surface (11) is exposed in the condensate chamber (24) and forms part of the surface that defines the condensate chamber (24).

6. The condensate discharge device according to any one of claims 1 to 4, in, The at least one condensate discharge line (21, 22, 23) is designed to discharge condensate from the housing (20), the condensate forming on the condensation surface (11) and being transported by gravity along the flow path (21S, 22S, 23S1, 23S2, 23S3, 23S4) which is fluidly separated from the at least one component (2) to the condensate chamber (24).

7. The condensate discharge device according to any one of claims 1 to 4, in, The at least one component (2) can be arranged in a first spatial orientation or in a second spatial orientation different from the first spatial orientation. The housing (20) has a first condensate drain line (21, 22, 23) defining a predetermined first flow path (21S, 22S, 23S1, 23S2, 23S3, 23S4) for draining condensate from the housing (20), the first flow path being fluidly separated from the at least one component (2). It also has a second condensate drain line (21, 22, 23), which defines at least one predetermined second flow path (21S, 22S, 23S1, 23S2, 23S3, 23S4) for draining condensate from the housing (20), the second flow path being fluidly separated from the at least one component (2). The condensate discharge device (1) can be arranged together with at least one component (2) in the first spatial orientation or in a second spatial orientation different from the first spatial orientation, and The condensate can be led out of the housing in the first spatial orientation through the first condensate drain line (21, 22, 23) and / or through the second condensate drain line (21, 22, 23), and in the second spatial orientation through the second condensate drain line (21, 22, 23) and / or the first condensate drain line (21, 22, 23).

8. The condensate discharge device according to any one of claims 1 to 4, in, The housing (20) has at least one sealing portion formed by a sealing lip (28), the sealing portion being designed to seal relative to the environment the mold cavity (27) designed as a casting mold.

9. The condensate discharge device according to claim 8, wherein, The sealing portion is designed to seal the mold cavity (27) of the casting mold together with the at least one component (2) relative to the environment.

10. An electronic component having a cooling device (4), at least one electrical component (2), and a condensate discharge device (1) according to any one of the preceding claims. in, A cooling device (4) for cooling the at least one component (2) is disposed on the at least one component, and the at least one component (2) has a surface (3) on which condensate can be formed by cooling by the cooling device (4).

11. The electronic component according to claim 10, It also includes the component housing, in, The housing (20) of the condensate discharge device (1) is arranged inside the component housing, and the at least one condensate discharge line (21, 22, 23) is designed to discharge condensate out of the component housing.

12. The electronic component according to claim 11, wherein the housing (20) of the condensate discharge device (1) is completely disposed inside the housing of the component.

13. A method for manufacturing a condensate discharge device (1) according to any one of claims 1 to 9, in, The outer shell (20) forming the mold cavity (27) is arranged adjacent to the at least one component (2) such that the mold cavity (27) is opened only to the condensate chamber (24). The casting material distributed in the mold cavity (27) and completely filling the mold cavity (27) is filled into the mold cavity (27) by gravity through the opening (29) leading to the condensate chamber (24), and the heat-conducting element (10) is formed after the casting material hardens.

14. The method according to claim 13, wherein, The outer casing (20) is sealed relative to the at least one component (2).

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