Dispensing machine for semiconductor processing

Abstract

The application discloses a point-gluing packaging machine for semiconductor processing, which comprises a packaging table, a conveying belt is mounted on the surface of the packaging table, a packaging box is mounted on the surface of the conveying belt, two adjusting lifting plates are vertically connected to the surface of the packaging table, the adjusting lifting plates are symmetrically arranged along the conveying belt, a limiting sleeve is movably sleeved on each of the adjusting lifting plates, the two limiting sleeves are fixedly connected through a supporting plate, a glue tank is mounted on the surface of the supporting plate, and a hydraulic rod is arranged on the two sides of the glue tank. The point-gluing packaging machine for semiconductor processing is supported by the tension spring between the limiting frame and the supporting plate, the piston rod extrudes the limiting frame, and after the hydraulic rod control button is touched, the hydraulic rod can be closed to prevent the point-gluing head from continuously moving downwards and extruding the surface of the semiconductor, thereby affecting the semiconductor processing quality and helping to control the distance between the point-gluing head and the surface of the semiconductor.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of dispensing packaging machines, in particular to a dispensing packaging machine for semiconductor processing. BACKGROUND

[0002] Semiconductors are part of circuit boards, and the core units of many electronic products, such as computers, mobile phones and digital recorders, utilize the conductivity change of semiconductors to process information. Common semiconductor materials include silicon, germanium and gallium arsenide, and silicon is the most influential among various semiconductor materials in commercial applications.

[0003] Dispensing machines are often used in semiconductor packaging. In the prior art, the glue tank and the dispensing head are connected through a glue pipe. If the glue pipe is too long, the glue is prone to solidification. In addition, the existing dispensing machine is not accurate enough in dispensing glue for semiconductors with different thicknesses. The height of the dispensing head needs to be adjusted back and forth, which is a complicated operation process and wastes manpower. Therefore, the dispensing packaging machine for semiconductor processing is improved. SUMMARY

[0004] In order to solve the above technical problems, the application provides the following technical scheme:

[0005] The dispensing packaging machine for semiconductor processing comprises a packaging table, a conveying belt is mounted on the surface of the packaging table, a packaging box is mounted on the surface of the conveying belt, two adjusting lifting plates are vertically connected to the surface of the packaging table, and the adjusting lifting plates are symmetrically arranged along the conveying belt, a limiting sleeve is movably arranged on each adjusting lifting plate, two limiting sleeves are fixedly connected through a supporting plate, a glue tank is mounted on the surface of the supporting plate, hydraulic rods are arranged on the two sides of the glue tank, a glue head push plate is parallelly arranged at the bottom of the supporting plate, a dispensing head is mounted at the bottom of the glue head push plate, the dispensing head is arranged in the middle of the glue head push plate, the dispensing head is connected to the bottom of the glue tank through a glue pipe, and the dispensing head is arranged above the conveying belt.

[0006] As a preferred technical scheme of the application, one end of the hydraulic rod is fixedly connected to the side wall of the glue tank, the other end of the hydraulic rod is connected to a piston rod, the piston rod is movably arranged through the supporting plate and arranged on the surface of the glue head push plate.

[0007] As a preferred technical scheme of the application, two limiting frames are fixedly connected to the surface of the glue head push plate, one end of the piston rod movably penetrates into the limiting frame through the supporting plate, a regulating pressure block is fixedly connected to the piston rod, a hydraulic rod regulating button is mounted at the bottom of the limiting frame, and the regulating pressure block is arranged on the surface of the hydraulic rod regulating button.

[0008] As a preferred technical scheme of the present application, the surface of the piston rod is movably wound with a tension spring, and the two ends of the tension spring are arranged on the mutually close side surfaces of the support plate and the rubber head push plate respectively.

[0009] As a preferred technical scheme of the present application, the mutually close side surfaces of the adjusting lifting plate are respectively provided with a limiting groove, the adjusting lifting plate is a hollow structure and is in communication with the limiting groove, a limiting block is fixedly connected in the adjusting lifting plate, and the limiting block movably passes through the limiting groove and is fixedly connected to the surface of the limiting sleeve.

[0010] As a preferred technical scheme of the present application, a plurality of limiting holes are arranged on the side outer wall of the adjusting lifting plate away from the limiting groove, and the limiting holes are arranged along the length direction of the adjusting lifting plate.

[0011] As a preferred technical scheme of the present application, a threaded hole is arranged on the limiting sleeve and close to the limiting hole, a positioning bolt is threadedly connected to the surface of the threaded hole, and one end of the positioning bolt passes through the threaded hole and extends into the limiting hole.

[0012] As a preferred technical scheme of the present application, a base is arranged at the bottom of the packaging table, and a plurality of heat dissipation holes are arranged at the bottom of the base.

[0013] The present application has the following beneficial effects:

[0014] 1. The glue dispensing packaging machine for semiconductor processing can perform glue dispensing and packaging work on the semiconductor by arranging the packaging table and arranging the packaging box and the glue dispensing head on the packaging table, arranging the glue tank on the top of the glue dispensing head can reduce the transmission channel between the glue tank and the glue dispensing head, prevent the glue from solidifying, and further reduce the processing cost.

[0015] 2. The glue dispensing packaging machine for semiconductor processing can adjust the height of the glue dispensing head by adjusting the height of the glue tank through the support plate, and further adjust the height of the glue dispensing head by arranging the hydraulic rod connected to the glue head push plate, so as to perform glue dispensing processing on the surface of the semiconductor.

[0016] 3. The glue dispensing packaging machine for semiconductor processing can prevent the glue dispensing head from continuously moving downward to press the surface of the semiconductor and affect the processing quality of the semiconductor by arranging the tension spring between the limiting frame and the support plate, and closing the hydraulic rod after the piston rod presses the limiting frame and touches the hydraulic rod control button. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This invention relates to a three-dimensional dispensing and encapsulation machine for semiconductor processing. Figure 1 ;

[0019] Figure 2 This invention relates to a three-dimensional dispensing and encapsulation machine for semiconductor processing. Figure 2 ;

[0020] Figure 3 This invention relates to a three-dimensional dispensing and encapsulation machine for semiconductor processing. Figure 3 ;

[0021] Figure 4 This is a side view schematic diagram of a dispensing and packaging machine for semiconductor processing according to the present invention;

[0022] Figure 5 This is the present invention. Figure 3 Enlarged view of point A in the middle.

[0023] In the diagram: 1. Packaging platform; 2. Packaging box; 3. Base; 4. Adjusting lifting plate; 5. Limiting sleeve; 6. Limiting hole; 7. Positioning bolt; 8. Glue box; 9. Support plate; 10. Glue head push plate; 11. Conveyor belt; 12. Hydraulic rod; 13. Tension spring; 14. Limiting frame; 15. Hydraulic rod control button; 16. Piston rod; 17. Limiting groove; 18. Glue dispensing head. Detailed Implementation

[0024] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0025] Example: Figures 1-5 As shown, the present invention discloses a dispensing and encapsulation machine for semiconductor processing, comprising an encapsulation table 1, a conveyor belt 11 mounted on the surface of the encapsulation table 1, an encapsulation box 2 mounted on the surface of the conveyor belt 11, two adjusting lifting plates 4 vertically connected to the surface of the encapsulation table 1, and the adjusting lifting plates 4 being symmetrically arranged along the conveyor belt 11, each adjusting lifting plate 4 being movably fitted with a limiting sliding sleeve 5, the two limiting sliding sleeves 5 being fixedly connected by a support plate 9, a glue box 8 mounted on the surface of the support plate 9, and hydraulic rods 12 being respectively arranged on both sides of the glue box 8, a glue head push plate 10 being arranged parallel to the bottom of the support plate 9, a glue head 18 being mounted on the bottom of the glue head push plate 10, and the glue head 18 being located in the middle of the glue head push plate 10, the glue head 18 being connected to the bottom of the glue box 8 by a glue tube, and the glue head 18 being located above the conveyor belt 11.

[0026] One end of the hydraulic rod 12 is fixedly connected to the side wall of the glue tank 8, the other end of the hydraulic rod 12 is connected with the piston rod 16, the piston rod 16 is movably inserted through the support plate 9 and is arranged on the surface of the glue head push plate 10.

[0027] Two limiting racks 14 are fixedly connected to the surface of the glue head push plate 10, one end of the piston rod 16 is movably inserted into the limiting rack 14 and is fixedly connected with the regulating pressure block, the bottom of the limiting rack 14 is provided with the hydraulic rod regulating button 15, and the regulating pressure block is arranged on the surface of the hydraulic rod regulating button 15.

[0028] The surface of the piston rod 16 movably winds the tension spring 13, and the two ends of the tension spring 13 are arranged on the mutually close side surfaces of the support plate 9 and the glue head push plate 10.

[0029] The mutually close side surfaces of the adjusting lifting plate 4 are respectively provided with the limiting grooves 17, the adjusting lifting plate 4 is a hollow structure and is in communication with the limiting grooves 17, the adjusting lifting plate 4 is fixedly connected with the limiting block, the limiting block movably passes through the limiting grooves 17 and is fixedly connected to the surface of the limiting sleeve 5.

[0030] The outer wall of the adjusting lifting plate 4 away from the limiting grooves 17 is provided with a plurality of limiting holes 6, and the limiting holes 6 are arranged along the length direction of the adjusting lifting plate 4.

[0031] The limiting sleeve 5 is provided with the threaded hole, the threaded hole is arranged on the side of the limiting sleeve 5 close to the limiting hole 6, the surface of the threaded hole is connected with the positioning bolt 7 through the thread, and one end of the positioning bolt 7 passes through the threaded hole and extends into the limiting hole 6.

[0032] The bottom of the packaging table 1 is provided with the base 3, and the bottom of the base 3 is provided with a plurality of heat dissipation holes.

[0033] Working principle: the semiconductor is conveyed on the conveying belt 11, the position of the limiting sliding sleeve 5 on the adjusting lifting plate 4 is adjusted through sliding, the glue head 18 is pushed up and down, the limiting sliding sleeve 5 is fixed with the adjusting lifting plate 4 through the positioning bolt 7, so that the position of the glue box 8 is fixed, when a single semiconductor is processed, the hydraulic rod 12 is started, the glue head push plate 10 pushes the glue head 18 to move down, the piston rod 16 pushes the glue head push plate 10 to move, the tension spring 13 is supported on the surface of the limiting frame 14, when the glue head 18 touches the surface of the semiconductor, the glue head push plate 10 cannot move down, if the hydraulic rod 12 does not stop, the piston rod 16 continues to move down, the piston rod 16 touches the hydraulic rod control button 15, and the movement of the hydraulic rod 12 is controlled to stop, after the glue dispensing is completed, the conveying belt 11 conveys the semiconductor into the packaging box 2, packaging is carried out, the packaging table 1 is arranged, the packaging box 2 and the glue head 18 are arranged on the packaging table 1, the semiconductor can be glued and packaged, the glue box 8 is arranged on the top of the glue head 18, the transmission channel between the glue box 8 and the glue head 18 is reduced, the glue solidification is prevented, and the processing cost is reduced, the height of the glue box 8 is adjusted through the supporting plate 9, so that the height of the glue head 18 is adjusted, the height of the glue head 18 is further adjusted through the arrangement of the hydraulic rod 12 connected to the glue head push plate 10, the surface of the semiconductor is glued and processed, the height of the glue head 18 is adjusted in a large range through the supporting plate, the height of the glue head 18 is adjusted through the hydraulic rod 12 in the actual operation process, the height of the glue head 18 is adjusted when a single semiconductor is processed, the tension spring 13 is arranged and supported between the limiting frame 14 and the supporting plate 9, the piston rod 6 extrudes the limiting frame 14, touches the hydraulic rod control button 15, and the hydraulic rod 12 can be closed, so that the glue head 18 is prevented from continuously moving down and extruding the surface of the semiconductor, the processing quality of the semiconductor is affected, the distance between the glue head 18 and the surface of the semiconductor is controlled.

[0034] Finally, it should be noted that in the description of the present application, it should be noted that the terms "vertical", "upper", "lower", "horizontal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as limiting the present application in terms of indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0035] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] The above merely provides preferred embodiments of the application, and is not used to limit the application. Although the application has been described in detail with reference to the foregoing embodiments, the technical solutions recorded in the foregoing embodiments can still be modified or some technical features can be replaced by equivalent features by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application shall be included in the protection scope of the application.

Claims

1. A dispensing and encapsulation machine for semiconductor processing, comprising an encapsulation stage (1), characterized in that, The surface of the packaging platform (1) is equipped with a conveyor belt (11), and the surface of the conveyor belt (11) is equipped with a packaging box (2). The surface of the packaging platform (1) is vertically connected to two adjusting lifting plates (4), and the adjusting lifting plates (4) are symmetrically arranged along the conveyor belt (11). The adjusting lifting plates (4) are respectively movably fitted with limiting sleeves (5). The two limiting sleeves (5) are fixedly connected by a support plate (9). The surface of the support plate (9) is equipped with a glue box (8), and hydraulic rods (12) are respectively arranged on both sides of the glue box (8). The bottom of the support plate (9) is parallel to a glue head push plate (10). The bottom of the glue head push plate (10) is equipped with a glue dot (18), and the glue dot (18) is located in the middle of the glue head push plate (10). The glue dot (18) is connected to the bottom of the glue box (8) through a glue tube. The glue dot (18) is located above the conveyor belt (11). One end of the hydraulic rod (12) is fixedly connected to the side wall of the glue box (8), and the other end of the hydraulic rod (12) is connected to a piston rod (16). The piston rod (16) moves through the support plate (9) and is set on the surface of the glue head push plate (10). Two limiting frames (14) are fixedly connected to the surface of the rubber head push plate (10). The piston rod (16) passes through one end of the support plate (9) and is movably inserted into the limiting frame (14), and is fixedly connected to the adjusting pressure block. A hydraulic rod adjusting button (15) is installed at the bottom of the limiting frame (14), and the adjusting pressure block is set on the surface of the hydraulic rod adjusting button (15). The piston rod (16) is movably wound with a tension spring (13), and the two ends of the tension spring (13) are respectively set on the side surfaces of the support plate (9) and the rubber head push plate (10) that are close to each other; Limiting grooves (17) are respectively opened on the side of the adjusting lifting plate (4) that are close to each other. The adjusting lifting plate (4) has a hollow structure and is connected to the limiting grooves (17). A limiting block is fixedly connected inside the adjusting lifting plate (4). The limiting block moves through the limiting grooves (17) and is fixedly connected to the surface of the limiting sleeve (5).

2. The dispensing and encapsulation machine for semiconductor processing according to claim 1, characterized in that, Multiple limiting holes (6) are provided on the outer wall of the adjusting lifting plate (4) away from the limiting groove (17), and the limiting holes (6) are arranged along the length direction of the adjusting lifting plate (4).

3. The dispensing and encapsulation machine for semiconductor processing according to claim 2, characterized in that, The limiting sleeve (5) has a threaded hole, which is located on the side of the limiting sleeve (5) near the limiting hole (6). The surface of the threaded hole is connected to a positioning bolt (7) by a thread, and one end of the positioning bolt (7) passes through the threaded hole and extends into the limiting hole (6).

4. The dispensing and encapsulation machine for semiconductor processing according to claim 1, characterized in that, The bottom of the encapsulation stage (1) is equipped with a base (3), and the bottom of the base (3) is provided with multiple heat dissipation holes.

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