Knock test device

Abstract

The present application relates to the technical field of semiconductor, and provides a wafer tapping test device, which comprises a grabbing assembly, a test table, a tapping assembly and a detecting assembly; the grabbing assembly is used for grabbing a wafer and transferring the wafer to the test table; the test table is used for placing and fixing the wafer; the tapping assembly is used for tapping the wafer fixed on the test table; and the detecting assembly is used for detecting the physical defects of the wafer after tapping. In this way, the grabbing assembly, the test table, the tapping assembly and the detecting assembly of the device sequentially perform the actions of grabbing the wafer, placing the wafer, tapping the wafer and testing the wafer, and the detection efficiency is higher. On the one hand, the wafer tapping test process can be standardized, the uncertain scratching and pollution can be avoided, the manpower can be released, the processing cost of the wafer is reduced, the tapping force stability and repeatability are better, the phenomenon that the good wafer is tapped and broken or the poor product is not detected out can be improved, and the detection efficiency and the detection quality are improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a chip knocking test apparatus. Background Technology

[0002] Wafer slicing is an essential process in semiconductor manufacturing. It involves cutting wafer ingots into wafers through machining. After slicing, wafers are prone to localized excessive internal stress or other defects invisible to the naked eye. Due to the thinness of wafers, these defects can easily lead to breakage during subsequent chemical processing, polishing, and other processes. This reduces the wafer yield of subsequent processes and increases wafer manufacturing costs.

[0003] Therefore, it is necessary to inspect the wafers after the wafer slicing process to ensure a high yield rate for subsequent processes and reduce wafer processing costs. Current wafer inspection methods generally involve manual tapping tests. However, manual tapping tests suffer from several drawbacks. Firstly, the handling of wafers cannot be standardized, easily leading to unpredictable scratches and contamination. Secondly, labor costs are high, and the stability and repeatability of the tapping force are poor, potentially resulting in good wafers being broken or defective wafers going undetected.

[0004] Therefore, a knocking test device is needed to improve the poor stability and repeatability of existing knocking methods and the unstable test quality. Summary of the Invention

[0005] This invention provides a wafer knocking test device. The device consists of a gripping component, a test stage, a knocking component, and a detection component, which sequentially perform actions of gripping the wafer, placing the wafer, knocking the wafer, and testing the wafer. It has high detection efficiency, which can standardize the wafer knocking test process, avoid uncertain scratches and contamination, free up manpower, reduce wafer processing costs, and improve the stability and repeatability of the knocking force. This can improve the phenomenon of good wafers being broken or defective products not being detected, thereby improving detection efficiency and detection quality.

[0006] The tapping test device includes: a gripping component, a test table, a tapping component, and a detection component;

[0007] The gripping component is used to grip the wafer and transfer it to the testing stage; the testing stage is used to place and fix the wafer; the tapping component is used to tap the wafer fixed on the testing stage; and the detection component is used to detect physical defects in the wafer after tapping. The gripping component, testing stage, tapping component, and detection component of this device can sequentially perform the actions of gripping the wafer, placing the wafer, tapping the wafer, and testing the wafer. The entire detection process is executed sequentially, resulting in high detection efficiency. On the one hand, it standardizes the wafer tapping test process, avoiding unpredictable scratches and contamination; on the other hand, it frees up manpower, reduces wafer processing costs, and the stability and repeatability of the tapping force are good, improving the detection efficiency and quality by preventing good wafers from being broken or defective products from going undetected.

[0008] Optionally, the knock test device further includes a wafer storage rack for storing the wafers to be tested, and the gripping component for sequentially gripping the wafers stored in the wafer storage rack. The wafer storage rack facilitates the sequential gripping and testing of wafers in batches.

[0009] Optionally, the test stage includes a first wafer support stage and a second wafer support stage, which are connected in a manner that allows them to approach or move away from each other, for clamping or releasing the wafer. The first wafer support stage and / or the second wafer support stage have test holes for the tapping component to pass through and tap the wafer clamped between the first and second wafer support stages. The arrangement of the first and second wafer support stages enables the placement and clamping of the wafer, facilitating subsequent tapping and inspection processes.

[0010] Optionally, the striking assembly includes a rotating component, a telescopic component, and a striking hammer. The telescopic component is disposed on the rotating component, and the striking hammer is disposed on the telescopic end of the telescopic component. The test stage has a test area for placing the wafer. When the telescopic component rotates with the rotating component, the striking range of the striking hammer is located within the test area. By rotating the striking hammer and the detection assembly with the rotating component 31, the striking hammer can strike the wafer circumferentially, which helps to maintain a large striking detection range and improve the detection effect.

[0011] Optionally, the first wafer stage is located below the second wafer stage, and at least a portion of the upper surface of the first wafer stage serves as a bearing surface for placing the wafer transferred by the gripping assembly.

[0012] Optionally, the first plate-holding stage is connected to the second plate-holding stage in a liftable manner.

[0013] Optionally, the first wafer stage includes two carrier members arranged at intervals along a horizontal direction, and the second wafer stage has a test hole, the area between the test hole and the two carrier members at least partially overlapping in vertical projection. This arrangement facilitates wafer testing and also helps to avoid interference with the support arm.

[0014] Optionally, the detection component includes a photoelectric sensor disposed on the rotating component. The photoelectric sensor emits light towards the test area, and its detection range is located within the test area as the rotating component rotates. During the circumferential striking of the wafer by the hammer, the rotating component can simultaneously detect the wafer circumferentially, which helps maintain a larger striking and detection range, thereby comprehensively improving the detection quality.

[0015] Optionally, the gripping assembly includes a support arm that is repositionable relative to the wafer storage rack and the test stage. The wafer storage rack includes vertically arranged storage shelves with gaps between adjacent shelves for the support arm to extend into and lift the wafer located on the upper storage shelf.

[0016] Optionally, the gripping component is horizontally disposed between the wafer storage rack and the test stage, and at least one component of the support arm and the wafer storage rack is disposed in a liftable manner, and / or; the support arm is disposed between the wafer storage rack and the test stage in a reciprocating horizontal movement manner; and / or, the support arm is disposed in a rotatable manner, and the rotation axis of the support arm extends vertically.

[0017] In summary, the wafer knocking test device includes: a gripping component, a test stage, a knocking component, and a detection component; the gripping component is used to grip the wafer and transfer it to the test stage; the test stage is used to place and fix the wafer; the knocking component is used to knock the wafer fixed on the test stage; and the detection component is used to detect physical defects in the wafer after knocking.

[0018] With this configuration, the device's gripping component, testing stage, tapping component, and inspection component can sequentially perform the actions of gripping the wafer, placing the wafer, tapping the wafer, and testing the wafer. The entire inspection process is executed sequentially, resulting in high inspection efficiency. On the one hand, it standardizes the wafer tapping test process, avoiding unpredictable scratches and contamination; on the other hand, it frees up manpower, reduces wafer processing costs, and the operation of the tapping force has good stability and repeatability, which can improve the phenomenon of good wafers being broken or defective products not being detected, thereby improving inspection efficiency and inspection quality. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a knock test apparatus according to an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the support arm according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of the first plate support stage according to an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of the second plate support stage according to an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of a striking component according to an embodiment of the present invention;

[0024] Figure 6 This is a schematic diagram of the detection process according to an embodiment of the present invention. Figure 1 ;

[0025] Figure 7 This is a schematic diagram of the detection process according to an embodiment of the present invention. Figure 2 ;

[0026] Figure 8 This is a schematic diagram of the detection process according to an embodiment of the present invention. Figure 3 ;

[0027] Figure 9 This is a schematic diagram of the detection process according to an embodiment of the present invention. Figure 4 ;

[0028] Figure 10 This is a schematic diagram of the detection process according to an embodiment of the present invention. Figure 5 ;

[0029] Figure 11 This is a schematic diagram of the detection process according to an embodiment of the present invention. Figure 6 .

[0030] The reference numerals in the attached figures are as follows:

[0031] 10-Grip assembly; 11-Support arm; 12-Transfer table; 13-Rotating shaft;

[0032] 20-Test stage; 21-First support stage; 211-Supporting component; 212-Supporting surface; 213-Groove; 22-Second support stage; 23-Test hole; 24-Third drive motor; 25-Test area;

[0033] 30 - Striking assembly; 31 - Rotating component; 32 - Telescopic component; 33 - Striking hammer; 34 - Force sensor; 35 - Rotary motor;

[0034] 40 - Detection components;

[0035] 50 - Wafer storage rack; 51 - Storage rack; 52 - Storage box;

[0036] 60 - Waste storage box;

[0037] 70 - Track; 71 - Second drive motor;

[0038] 80-Lifting platform; 81-Lifting rail; 82-Lifting drive mechanism; 83-Lifting worktable; 84-Base plate; 85-First drive motor. Detailed Implementation

[0039] The following detailed description of the tapping test device proposed in this invention, in conjunction with the accompanying drawings and specific embodiments, will further illustrate its advantages and features. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the explanation of the embodiments of this invention.

[0040] In this invention, "proximal" and "distal" refer to the relative orientation, position, and direction of the components or actions relative to each other from the perspective of the doctor using the product. Although "proximal" and "distal" are not restrictive, "distal" usually refers to the end that first enters the patient's body, and "proximal" usually refers to the opposite end of "distal".

[0041] In this invention, "outer diameter" and "inner diameter" refer to the diameter of a circular structure, while for a non-circular structure, the inner diameter refers to the diameter of its inscribed circle and the outer diameter refers to the diameter of its circumscribed circle. "Axial direction" refers to the direction of the central axis of a cylindrical rod, while for a non-cylindrical rod, the axial direction refers to the length direction of the rod.

[0042] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the term “at least two” is generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. Additionally, as used in this invention, “installed,” “connected,” “joined,” and “set” on one element by another should be interpreted broadly, generally indicating only a connection, coupling, mating, or transmission relationship between the two elements, which can be direct or indirect through an intermediate element. They should not be construed as indicating or implying a spatial positional relationship between the two elements, i.e., one element can be located inside, outside, above, below, or to one side of another element, unless otherwise explicitly stated. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances. Furthermore, directional terms such as above, below, up, down, upward, downward, left, right, etc., are used relative to exemplary embodiments as shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.

[0043] In this embodiment, the vertical direction is the direction indicated by gravity, and the horizontal direction is the direction perpendicular to the vertical direction.

[0044] This embodiment provides a wafer knocking test device, including: a gripping component 10, a test stage 20, a knocking component 30, a detection component 40, a wafer storage rack 50, and a waste storage box 60;

[0045] like Figure 1 As shown, the gripping component 10, the test stage 20, and the wafer storage rack 50 are arranged horizontally, with the tapping component 30 positioned above the test stage 20 and the waste storage box 60 positioned below the test stage 20. This overall layout allows the wafer to be placed horizontally on the test stage 20 and tapped perpendicularly to the wafer by the tapping component 30 located above the test stage 20.

[0046] The wafer storage rack 50 is used to store the wafers to be inspected. Specifically, the wafer storage rack 50 includes storage racks 51 and storage boxes 52 arranged vertically. Each storage rack 51 is located inside the storage box 52, and each storage rack 51 is used to place the wafers, leaving the center of the wafers suspended. The storage box 52 is placed on a lifting platform 80. The lifting platform includes a lifting rail 81, a lifting drive mechanism 82, and a lifting worktable 83. The lifting worktable 83 is vertically slidably mounted on the lifting rail 81, and the lifting drive mechanism 82 is disposed on the lifting rail 81 to drive the lifting worktable 83 to move up and down. Please refer to [reference needed]. Figure 1 As shown, in this embodiment, the lifting drive mechanism 82 is composed of a lead screw and nut pair, wherein a base plate 84 is fixedly connected to the lifting track 81, the lead screw is threadedly rotated with the base plate 84, and a first drive motor 85 is installed on the base plate 84 to drive the lead screw to rotate, thereby driving the lead screw to rise and fall relative to the base plate 84. The upper end of the lead screw is rotated with the bottom of the lifting worktable 83 with a single degree of freedom, thereby driving the lifting worktable 83 to rise and fall; wherein the wafer storage rack 50 is placed on the lifting worktable 83.

[0047] In other alternative embodiments, the lifting of the storage box 52 can also employ known lifting structures such as hydraulic cylinders, telescopic arms, and scissor lifts, which will not be described in detail here.

[0048] Please refer to Figure 1 and Figure 2 As shown, the gripping component 10 is used to sequentially grip the wafers stored in the wafer storage rack 50 and transfer the wafers to the test stage 20; wherein the gripping component 10 includes a support arm 11, the support arm 11 being repositionable relative to the wafer storage rack 50 and the test stage 20, the repositioning here refers to the repositioning direction and position; there is a gap between adjacent storage racks 51, which allows the support arm 11 to extend into and lift the wafers located on the upper storage rack.

[0049] The gripping assembly 10 is horizontally positioned between the wafer storage rack 50 and the test stage 20. The gripping assembly 10 also includes a transfer table 12, on which the support arm 11 is rotatably mounted. The rotation axis of the support arm 11 extends vertically. Specifically, the support arm 11 has a V-shaped structure in its vertical projection. The support arm 11 is fixedly connected to a rotating shaft 13, which rotatably engages with the transfer table 12. The rotation axis of the rotating shaft 13 extends vertically, and the transfer table 12 can have a built-in motor to drive the rotating shaft 13. The support arm 11 can achieve precise rotation and positioning through a PLC or industrial computer in conjunction with a servo controller and a servo motor. A track 70 is installed between the wafer storage rack 50 and the test stage 20, and the transfer table 12 is horizontally mounted on the track 70. For details, please refer to... Figure 1As shown, track 70 is a lead screw, with both ends mounted in two bearing seats via bearings. One end of the lead screw passes through the corresponding bearing seat and engages with the rotor of the second drive motor 71, allowing the lead screw to rotate. The transfer table 12 is threadedly engaged with the lead screw and can be driven to move horizontally. Multiple lead screws can be arranged in parallel to ensure the stability of the transfer table 12. When the transfer table 12 moves horizontally along track 70, it reciprocates horizontally between the wafer storage rack 50 and the test stage 20.

[0050] In other alternative embodiments, the track 70 can be an I-shaped, T-shaped, or other type of track placed on a foundation. The transfer platform 12 can slide with the track 70, and the transfer platform 12 can be driven by a linear motor or other linear drive structure to move linearly along the track 70. Alternatively, the track 70 can also be an I-shaped or T-shaped track and be coupled with a lead screw, wherein the transfer platform 12 can slide with the corresponding track, and the transfer platform 12 is simultaneously coupled with the lead screw thread drive. The lead screw is set parallel to the track, and during the rotation of the lead screw, it can drive the transfer platform 12 to slide along the track. Alternatively, an electric wheel can be set below the transfer platform 12 to directly rotate with the track. The track 70 can also adopt other known structures, which will not be described in detail here.

[0051] In this embodiment, the support arm 11 has horizontal linear motion and rotational degrees of freedom. In other alternative embodiments, its orientation can be set according to actual needs, such as a four-degree-of-freedom robotic arm, a five-degree-of-freedom robotic arm, a six-degree-of-freedom robotic arm, or a seven-degree-of-freedom robotic arm. Taking a six-degree-of-freedom robotic arm as an example, it has six degrees of freedom: movement along the X-axis, movement along the Y-axis, movement along the Z-axis, rotation along the X-axis, rotation along the Y-axis, and rotation along the Z-axis, to achieve free orientation change of the support arm 11.

[0052] Additionally, the support arm 11 can also be a rectangular coordinate type, cylindrical coordinate type, spherical coordinate type, or articulated robotic arm. According to its driving method, the support arm 11 can be a hydraulic robotic arm, a pneumatic robotic arm, or an electric robotic arm. A hydraulic robotic arm typically consists of a drive system composed of hydraulic equipment, servo valves, oil pumps, and an oil tank, with the actuator driving the robotic arm's operation. A pneumatic robotic arm typically consists of cylinders, air valves, air tanks, and an air compressor. Its advantages include convenient air supply, rapid action, simple structure, low cost, and easy maintenance. An electric robotic arm is currently the most widely used driving method for robotic arms. Its advantages include convenient power supply, fast response, large driving force, convenient signal detection, transmission, and processing, and the ability to adopt various flexible control schemes.

[0053] In other alternative embodiments, the support arm 11 can be configured to be movable up and down, while the storage box 52 remains relatively stationary. The up and down movement of the support arm 11 can be adapted to the storage position of each wafer in the storage box 52 in sequence.

[0054] Please continue to refer to this. Figure 1 , Figure 3 and Figure 4 As shown, the test stage 20 is used to place and fix the wafer;

[0055] The test stage 20 includes a first wafer support stage 21 and a second wafer support stage 22, which are connected in a manner that allows them to approach or move away from each other, for clamping or releasing the wafer.

[0056] In this embodiment, the second substrate receiving platform 22 remains relatively stationary relative to the overall frame, while the first substrate receiving platform 21 can be raised and lowered relative to the second substrate receiving platform 22. For details, please refer to [reference needed]. Figure 1 As shown, a third drive motor 24 is provided on the second plate support 22. The third drive motor 24 is a linear motor. The drive end of the third drive motor 24 is connected to the first plate support 21 to drive the first plate support 21 to rise and fall.

[0057] Furthermore, the first wafer stage 21 is located below the second wafer stage 22, and at least a portion of the upper surface of the first wafer stage 21 serves as a bearing surface for placing the wafer transferred by the gripping assembly 10. When the wafer supported by the support arm 11 is placed between the first wafer stage 21 and the second wafer stage 22, the first wafer stage 21 rises so that the bearing surface contacts the wafer, and the first wafer stage 21 continues to rise closer to the second wafer stage 22, clamping the wafer between the first wafer stage 21 and the second wafer stage 22.

[0058] In other alternative embodiments, the second substrate stage 22 may be vertically mounted on the first substrate stage 21, or both the first substrate stage 21 and the second substrate stage 22 may be vertically mounted relative to each other.

[0059] Please continue to refer to this. Figure 1 , Figure 3 as well as Figure 4 As shown, the second wafer stage 22 has a test hole 23 for the tapping assembly 30 to pass through to tap the wafer held between the first wafer stage 21 and the second wafer stage 22.

[0060] Furthermore, the first wafer stage 21 includes two support members 211, which are arranged at intervals in a horizontal direction. The area between the test hole 23 and the two support members 211 at least partially overlaps in vertical projection. The test hole 23 extends horizontally through the side of the second wafer stage 22 near the wafer storage rack 50. The two support members 211 extend horizontally (i.e., along the line connecting the wafer storage rack 50 and the test stage 20) in a direction perpendicular to the horizontal direction. Figure 1 The wafer is arranged in a left-right direction, so the opening end of the area between the two carriers 211 and the opening end of the test hole 23 both face the wafer storage rack 50. This arrangement facilitates the formation of an open clearance space to accommodate support arms 11 with different structures. Moreover, the width of the support arm is smaller than the width between the two carriers 211, and the diameter of the wafer is larger than the width between the two carriers 211. When the support arm 11 transfers the wafer between the first wafer stage 21 and the second wafer stage 22, the support arm 11 is located in the area between the two carriers 211 or above that area. When the two corresponding carriers 211 in the first wafer stage 21 rise synchronously and approach the second wafer stage 22, the wafer is supported on the two carriers 211. When the two carriers 211 continue to rise synchronously, the wafer is clamped between the first wafer stage 21 and the second wafer stage 22, ensuring that the support arm 11 is not clamped.

[0061] Please refer to Figure 3 As shown, in this embodiment, the two support members 211 are fan-shaped ring structures arranged opposite each other. The outer circular contours of the two support members 211 are located on the same cylindrical surface. The support member 211 has an arc-shaped groove 213 adapted to the wafer. The bottom of the groove 213 is the support surface 212. The circular area enclosed by the two grooves is the test area 25 of the wafer. Two third drive motors 24 are respectively provided on the second wafer stage 22. The two third drive motors 24 are respectively connected to the two support members 211 to drive the support members 211 to move up and down.

[0062] By setting up two support members 211, the middle of the wafer is suspended when it is placed on the first wafer stage 21, which is conducive to the impact test. At the same time, if the wafer breaks during the impact, it is also convenient for the wafer to fall naturally from between the two support members 211 into the waste storage box 60.

[0063] In other alternative embodiments, the first substrate stage 21 can be configured as an integral structure, and corresponding test holes can also be opened on the first substrate stage 21.

[0064] In other alternative embodiments, the structure of the carrier 211 can also be adapted to meet actual usage requirements.

[0065] Please continue to refer to this. Figure 1 and Figure 5 As shown, the striking assembly 30 is used to strike the wafer fixed on the test stage 20. The striking assembly 30 includes a rotating component 31, a telescopic component 32, and a striking hammer 33. The rotating component 31 is mounted on a top support 34 and can be driven to rotate by a rotary motor 35 mounted on the top support 34. The rotating component 31 is disc-shaped. The telescopic component 32 is eccentrically mounted on the rotating component 31. The telescopic end of the rotating component 31 extends downward and connects to the striking hammer 33. The rotation axis of the rotating component 31 extends vertically. When the telescopic component 32 rotates with the rotating component 31, the striking range of the striking hammer 33 is located within the test area 25 corresponding to the first wafer support stage 21. During the testing process, the wafer is located within the test area, which ensures that the striking hammer 33 can always strike the wafer during its rotation.

[0066] In this embodiment, the hammer 33 is spherical with a smooth outer surface to ensure point contact between the hammer 33 and the wafer. The spherical shape prevents scratching the wafer during hammering, thus avoiding secondary damage. In other alternative embodiments, the hammer 33 can be ellipsoidal or have other structures, such as a columnar shape, with the end in contact with the wafer having an arc surface.

[0067] In this embodiment, the telescopic component 32 is a cylinder, and a force sensor 34 can be installed at the end of the hammer 33 or on the telescopic component 32 to detect the force during the strike. This also helps to archive the strike data, making the strike data traceable, while achieving adjustable strike force and ensuring strike stability.

[0068] In other alternative embodiments, the telescopic member 32 may be an electric telescopic rod, or a connecting structure to form the vertical reciprocating telescopic motion of the hammer, or the telescopic member 32 may be a crank-connecting rod structure to drive the vertical reciprocating telescopic motion.

[0069] The detection component 40 is used to detect physical defects in the wafer after being struck. Physical defects here refer to cracks, notches, or deformation exceeding preset values. A notch refers to a detected gap at a certain location on the wafer. Notch detection has two scenarios: one is that the entire wafer is still on the test stage, with a partial gap; the other is that the entire wafer is completely broken and fallen off, in which case the wafer's presence cannot be detected, and it is considered to have a notch. Similarly, deformation exceeding preset values ​​refers to localized deformation exceeding a preset range. This also has two scenarios: one is plastic deformation occurring while the wafer remains intact; the other is that the wafer is broken but still connected, but with localized misalignment.

[0070] With the above configuration, the device's gripping component 10, testing stage 20, tapping component 30, and detection component 40 can sequentially perform the actions of gripping the wafer, placing the wafer, tapping the wafer, and testing the wafer. The entire detection process is executed sequentially, resulting in high detection efficiency. On the one hand, it standardizes the wafer tapping test process, avoiding unpredictable scratches and contamination; on the other hand, it frees up manpower, reduces wafer processing costs, and the stability and repeatability of the tapping force are good, which can improve the phenomenon of good wafers being broken or defective products not being detected, thereby improving detection efficiency and quality.

[0071] In this embodiment, the detection component 40 includes a photoelectric sensor, which is disposed on the rotating member 31. The emission direction of the photoelectric sensor 31 is vertically oriented towards the test area 25. When the photoelectric sensor 31 rotates with the rotating member 31, the detection range of the photoelectric sensor 31 is located in the test area 25, so that the emission direction of the photoelectric sensor 31 is aligned with the wafer during the rotation of the rotating member 31.

[0072] A photoelectric sensor is a device that converts light signals into electrical signals. Its working principle is based on the photoelectric effect. The photoelectric effect refers to the phenomenon where electrons in a substance absorb the energy of photons when light shines on it, resulting in an electrical effect. Based on different phenomena, the photoelectric effect is divided into three categories: external photoelectric effect, internal photoelectric effect, and photovoltaic effect. Photoelectric devices include phototubes, photomultiplier tubes, photoresistors, photodiodes, phototransistors, and photovoltaic cells. The performance and characteristic curves of photoelectric devices are analyzed.

[0073] Photoelectric sensors are sensors that use photoelectric devices as conversion elements. They can be used to detect non-electrical physical quantities that directly cause changes in light intensity, such as light intensity, illuminance, radiation thermometry, and gas composition analysis; they can also be used to detect other non-electrical quantities that can be converted into changes in light intensity, such as part diameter, surface roughness, strain, distance, displacement, vibration, velocity, acceleration, as well as the shape and working status identification of objects. Photoelectric detection methods using photoelectric sensors have advantages such as high accuracy, fast response, and non-contact operation. Moreover, they can measure a wide range of parameters, and the sensors have simple structures and flexible forms, making them easy to select.

[0074] The photoelectric sensor is connected to the controller, which typically includes at least one processor. The processor can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0075] The processor can communicate with multiple peripheral devices via a bus subsystem. These peripheral devices may include a storage system, user interface input devices, user interface output devices, and network interfaces. The user interface input devices can be used to input parameter threshold ranges. The photoelectric sensor transmits the collected data to the processor, which compares the detected parameters with the parameter threshold ranges. If the detected parameters exceed the parameter threshold ranges, the wafer is considered to have physical defects. The processor transmits the corresponding detection data to the storage system for archiving, and simultaneously sends the detection results to the user interface output devices for display.

[0076] The network interface may include one or more interfaces known in the art, such as LAN, WLAN, Bluetooth, other wired and wireless interfaces, etc. User interface input devices may include keyboards, clicking devices such as mice, trackballs, touchpads or graphics tablets, scanners, foot pedals, joysticks, touchscreens embedded in displays, audio input devices such as voice recognition systems, microphones, and other types of input devices. User interface output devices may include display subsystems, printers, fax machines, or non-visual displays such as audio output devices. The memory subsystem typically includes multiple memories, including main random access memory (RAM) for storing instructions and data during program execution and read-only memory (ROM) for storing fixed instructions therein.

[0077] When the rotating component 31 rotates, the striking hammer 33 strikes the wafer circumferentially. Simultaneously, the photoelectric sensor detects defects on the wafer circumferentially. Preferably, the distance between the striking hammer 33 and the central axis of rotation of the rotating component 31 is equal to the distance between the photoelectric sensor and the central axis of rotation of the rotating component 31. This ensures that the position detected by the photoelectric sensor is the position after the striking hammer 33 strikes, facilitating more accurate detection. During the circumferential detection process of the photoelectric sensor, the integrity of the wafer is checked. The photoelectric sensor 31 can be used to detect the distance to the wafer; if this distance exceeds a preset value, a defect is considered to exist.

[0078] As the hammer 33 and the detection component 40 rotate with the rotating component 31, the hammer 33 can strike the wafer circumferentially, and the rotating component 31 can simultaneously detect the wafer circumferentially. This helps to maintain a larger striking and detection range, and can comprehensively improve the detection quality.

[0079] In this embodiment, the waste storage box 60 is a box-shaped structure with an open top, used to store the waste detected by the detection component 40. The waste storage box 60 can be a cylindrical, cubic, or other structure.

[0080] In other alternative embodiments, the waste storage box 60 can be placed on the transmission structure, and a force sensor is provided at the bottom of the waste storage box 60. When the overall weight of the waste storage box 60 is detected to be greater than a threshold, it is considered that the waste storage box 60 is full of waste. At this time, the force sensor sends a signal to the controller, the controller sends a signal to control the transmission structure, the transmission structure starts transmission, and the waste storage box 60 is transmitted to the designated position. At the same time, the empty waste storage box 60 is transmitted to the bottom of the test platform 20.

[0081] During the testing process, please refer to... Figure 6-11 As shown, the specific testing procedures are as follows:

[0082] like Figure 6 As shown, the wafer to be tested is first placed in the wafer storage rack 50, and the wafer storage rack 50 is placed on the lifting platform 80. The lifting platform 80 can adjust the height of the wafer storage rack 50 so that the support arm 11 is adapted to the wafer picking position. The transfer table 12 is driven to approach the wafer storage rack 50 horizontally, so that the support arm 11 extends between the two wafers. After the lifting platform 80 is lowered, the wafer is supported on the support arm 11.

[0083] like Figure 7 As shown, the transfer table 12 then moves horizontally, causing the support arm 11 to exit the wafer storage rack 50;

[0084] like Figure 8 As shown, then control the support arm 11 to rotate to the side of the test table 20;

[0085] like Figure 9 As shown, the transfer stage 12 is then controlled to move horizontally, so that the support arm 11 delivers the wafer to the top of the first wafer support stage 21.

[0086] like Figure 10 As shown, the first wafer stage 21 is then raised so that the first wafer stage 21 and the second wafer stage 22 clamp the wafer.

[0087] like Figure 11 As shown, the support arm 11 then retracts to its original position.

[0088] In the above-mentioned testing process, the wafer is struck by the reciprocating extension and retraction of the telescopic component 32, and the rotating component 31 is rotated. When the striking force detected by the force sensor is greater than the set threshold, the cylinder of the telescopic component 32 is controlled by the controller to release the air pressure to relieve the force.

[0089] A photoelectric sensor detects whether the wafer has defects. If a defect is found, the clamping device is opened, and the wafer falls into the waste storage box 60, awaiting the next testing process. If no defects are found, after the test is completed, the wafer is supported by the pick-up arm 11 and placed back in its original position in the wafer storage rack 50, awaiting the next testing process.

[0090] In summary, the wafer knocking test device includes: a gripping component 10, a test stage 20, a knocking component 30, and a detection component 40; the gripping component 10 is used to grip the wafer and transfer it to the test stage 20; the test stage 20 is used to place and fix the wafer; the knocking component 30 is used to knock the wafer fixed on the test stage 20; and the detection component 40 is used to detect physical defects in the wafer after knocking.

[0091] With this configuration, the device's gripping component 10, testing stage 20, tapping component 30, and testing component 40 can sequentially perform the actions of gripping the wafer, placing the wafer, tapping the wafer, and testing the wafer. The entire testing process is executed sequentially, resulting in high testing efficiency. On the one hand, it standardizes the wafer tapping test process, avoiding unpredictable scratches and contamination; on the other hand, it frees up manpower, reduces wafer processing costs, and the stability and repeatability of the tapping force are good, which can improve the phenomenon of good wafers being broken or defective products not being detected, thereby improving testing efficiency and quality.

[0092] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A tapping test device, characterized in that, include: Grab component, test bench, tap component, and detection component; The gripping component is used to grip the wafer and transfer the wafer to the test station; The test stand is used to place and fix the wafer; The striking component is used to strike the wafer that is fixed on the test bench; The detection component is used to detect physical defects in the wafer after it has been struck. The test stage includes a first wafer support stage and a second wafer support stage, which are used to hold or release the wafer. The first wafer stage includes two support members, such that when the wafer is placed on the first wafer stage, the middle part of the wafer is in an elevated state; The first wafer stage and the second wafer stage are connected in a manner that allows them to be close to or far from each other. The first wafer stage and / or the second wafer stage have test holes for the tapping assembly to pass through in order to tap the wafer held between the first wafer stage and the second wafer stage. The two carriers are arranged at intervals along the horizontal direction, and a test hole is provided on the second support plate. The area between the test hole and the two carriers at least partially overlaps in vertical projection.

2. The knocking test device as described in claim 1, characterized in that, The chip knocking test device also includes a wafer storage rack for storing the wafer to be tested, and the gripping component for sequentially gripping the wafers stored in the wafer storage rack.

3. The knocking test device as described in claim 1, characterized in that, The striking assembly includes a rotating component, a telescopic component, and a striking hammer. The telescopic component is disposed on the rotating component, and the striking hammer is disposed on the telescopic end of the telescopic component. The test platform has a test area for placing wafers. When the telescopic component rotates with the rotating component, the striking range of the striking hammer is located within the test area.

4. The knocking test device as described in claim 1, characterized in that, The first wafer stage is located below the second wafer stage, and at least a portion of the upper surface of the first wafer stage serves as a bearing surface for placing the wafer transferred by the gripping assembly.

5. The knocking test apparatus as described in claim 4, characterized in that, The first plate receiving platform is connected to the second plate receiving platform in a liftable manner.

6. The knocking test apparatus as described in claim 3, characterized in that, The detection component includes a photoelectric sensor, which is disposed on the rotating component. The photoelectric sensor emits light towards the test area, and its detection range is located within the test area when the rotating component rotates.

7. The knocking test apparatus as described in claim 2, characterized in that, The gripping assembly includes a support arm that is repositionable relative to the wafer storage rack and the test stage. The wafer storage rack includes vertically arranged storage racks with gaps between adjacent racks for the support arm to extend into and lift the wafer located on the upper rack.

8. The knocking test apparatus as described in claim 7, characterized in that, The gripping component is horizontally disposed between the wafer storage rack and the test stage; the support arm and at least one component of the wafer storage rack are configured to be liftable; and / or the support arm is configured to be reciprocating horizontally between the wafer storage rack and the test stage; and / or the support arm is configured to be rotatable, with the rotation axis of the support arm extending vertically.

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