A polishing pad dispensing device

Abstract

This invention relates to a polishing pad feeding device, comprising a fixed support, a conveying pipe, and a sealing element. A weighing machine is mounted on the fixed support for suspending and weighing powder bags. The first end of the conveying pipe is connected to the bottom of the powder bag, and the second end is connected to the polishing pad mixing tank. The sealing element is fitted onto the conveying pipe and abuts against the bottom of the powder bag. Compared with existing technologies, this invention allows for the direct feeding of microspheres into the polishing pad mixing tank via the conveying pipe. Furthermore, the weighing machine can display the real-time weight change of the powder bag, allowing the amount of microspheres fed to be obtained from the weight change. This effectively reduces the workload of the microsphere feeding process, prevents microsphere powder from scattering during feeding, and improves the efficiency and accuracy of microsphere feeding.

Description

Technical Field

[0001] This invention relates to the field of polishing preparation, and more particularly to a polishing pad feeding device. Background Technology

[0002] Polishing pads, also known as abrasive pads, have a rough surface and are used to directly contact the semiconductor surface to generate friction, mechanically removing the polishing layer on the semiconductor surface. Under the action of centrifugal force, polishing liquid is evenly sprayed onto the surface of the polishing pad to chemically remove the polishing layer on the semiconductor surface. At the same time, the reaction products are carried out of the polishing pad, thereby achieving nanoscale global planarization of the semiconductor processing surface, which meets the requirements of ultra-precision non-destructive surface processing of integrated circuit feature sizes below 0.35μm.

[0003] Polyurethane polishing pads are a commonly used type of polishing pad. They are generally prepared by mixing polyurethane prepolymer, curing agent, and microspheres. The microspheres are used to increase the roughness of the polishing pad and improve the polishing effect. During the preparation process, the microspheres need to be weighed first, and then added to the polyurethane prepolymer. This increases the labor intensity of the polishing pad preparation process. Furthermore, since the microspheres are powdered materials, the amount added can easily become inaccurate due to powder scattering during the addition process. Summary of the Invention

[0004] The purpose of this invention is to overcome the defects of the prior art and provide a polishing pad feeding device to improve the feeding efficiency and accuracy of microsphere powder.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A polishing pad feeding device, comprising:

[0007] A fixed bracket is provided, on which a weighing machine is installed. The weighing machine is used to hang the powder bag and weigh the powder bag.

[0008] A conveying pipe, the first end of which is connected to the bottom of the powder bag, and the second end of which is connected to the polishing pad mixing tank;

[0009] A sealing element is fitted onto the conveying pipe and abuts against the bottom of the powder bag.

[0010] In one embodiment, the seal includes a sealing portion forming a funnel-shaped opening around the delivery pipe, the funnel-shaped opening of the sealing portion being used to abut against the bottom of the powder bag.

[0011] In one embodiment, the funnel-shaped opening of the sealing portion is spherical;

[0012] Alternatively, the funnel-shaped opening of the sealing part may be conical.

[0013] In one embodiment, the first end of the conveying pipe is provided with a hollow plug, which is disposed in the powder bag, and the plug has a plurality of through holes distributed thereon.

[0014] In one embodiment, the bottom of the plug is flared, and the bottom of the plug can extend into the flared opening of the sealing part and clamp the bottom of the powder bag.

[0015] In one embodiment, the seal includes a connecting portion connected to the sealing portion, the connecting portion being threadedly connected to the delivery pipe.

[0016] In one embodiment, the top of the plug is conical, and the through holes are distributed on the conical surface of the plug.

[0017] In one embodiment, the through holes are arranged in rows along the conical generatrix of the plug, and multiple rows of the through holes are distributed around the central axis of the plug.

[0018] In one embodiment, the central axis of the through hole is inclined toward the side closer to the bottom of the plug, and the angle between the central axis of the through hole and the conical generatrix of the plug is 30° to 60°.

[0019] In one embodiment, the fixed bracket includes a base plate, a top plate, and a support plate. The two ends of the support plate are connected to the base plate and the top plate, respectively. The weighing machine is connected to the top plate and located between the base plate and the top plate.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] 1. This polishing pad feeding device directly suspends the powder bag containing microspheres on a weighing machine. A conveying pipe connects the powder bag and the polishing pad mixing tank, and a sealing component ensures a tight seal between the conveying pipe and the powder bag. During the feeding process, the device directly feeds microspheres into the polishing pad mixing tank through the conveying pipe. The weighing machine displays the real-time weight change of the powder bag, allowing the device to determine the amount of microspheres added. This effectively reduces the workload of the microsphere feeding process, prevents microsphere powder from scattering during feeding, and improves the efficiency and accuracy of microsphere feeding.

[0022] 2. The sealing component of the polishing pad feeding device is provided with a connecting part and a sealing part. The connecting part is connected to the conveying pipe by a threaded sealing sleeve, and the sealing part is provided with a spherical or conical funnel-shaped opening. By cooperating with the bottom of the plug, it clamps the bottom of the powder bag to prevent the microspheres from overflowing from the connection between the powder bag and the conveying pipe, effectively avoiding the scattering of microsphere powder.

[0023] 3. The hollow plug on the conveying pipe has a through hole, so the microsphere powder enters the conveying pipe through the plug via the through hole. This is used to limit the rate at which the microsphere powder enters the conveying pipe, avoid blockage of the opening of the conveying pipe, and improve the microsphere dosing efficiency.

[0024] 4. The plug is designed with a conical top and the through hole is located at the top of the cone. Firstly, the conical shape of the plug can improve the efficiency of inserting the powder bag. Secondly, the through hole on the conical surface can facilitate the flow of microspheres from the top of the cone to the bottom of the plug, thus preventing the microspheres from clogging the plug and the opening of the delivery pipe.

[0025] 5. The plug is provided with a through hole that slopes downwards, and the angle between the axis of the through hole and the conical generatrix of the plug is set to 30° to 60°. This helps to improve the efficiency of the microspheres passing through the through hole, prevents the microspheres from clogging the through hole, and further improves the microsphere dosing efficiency. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the polishing pad feeding device in one embodiment.

[0027] Figure 2 This is a perspective view of a polishing pad feeding device in one embodiment.

[0028] Figure 3 This is a cross-sectional view of the polishing pad feeding device in the plug-in state in one embodiment.

[0029] Figure 4 This is a cross-sectional view of the polishing pad feeding device in a clamping state in one embodiment.

[0030] Figure 5 This is a perspective view of the conveying pipeline in one embodiment.

[0031] Figure 6 This is a cross-sectional view of the conveying pipeline in one embodiment.

[0032] Reference numerals: 100, polishing pad feeding device; 10, fixed bracket; 11, base plate; 12, top plate; 13, support plate; 20, weighing machine; 30, powder bag; 40, conveying pipe; 41, first switching valve; 42, second switching valve; 50, sealing element; 51, connecting part; 52, sealing part; 60, plug; 61, through hole; 70, vacuum pump; 80, gas filter. Detailed Implementation

[0033] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0034] like Figures 1 to 6 As shown, in one embodiment, a polishing pad feeding device 100 is provided, including a fixed bracket 10 and a conveying pipe 40;

[0035] The fixed bracket 10 is equipped with a weighing machine 20, which is used to hang the powder bag 30 and weigh the powder bag 30. The first end of the conveying pipe 40 is connected to the bottom of the powder bag 30, and the second end of the conveying pipe 40 is connected to the polishing pad mixing tank. A sealing element 50 is fitted on the conveying pipe 40, and the sealing element 50 abuts against the bottom of the powder bag 30.

[0036] The polishing pad feeding device 100 directly suspends the powder bag 30 containing microspheres on the weighing machine 20. A conveying pipe 40 connects the powder bag 30 and the polishing pad mixing tank, and a sealing element 50 ensures a sealed connection between the conveying pipe 40 and the powder bag 30. During the feeding process, the polishing pad feeding device 100 can directly feed microspheres into the polishing pad mixing tank through the conveying pipe 40, and the weighing machine 20 can display the weight change of the powder bag 30 in real time. The amount of microspheres added can be obtained by the weight change of the powder bag 30, which effectively reduces the workload of the microsphere feeding process, avoids the microsphere powder from scattering during the feeding process, and improves the efficiency and accuracy of microsphere feeding.

[0037] Specifically, such as Figure 1 As shown, in one embodiment, the polishing pad feeding device 100 includes a vacuum pump 70 and a gas filter 80. The inlet of the vacuum pump 70 is connected to a conveying pipe 40, and a first switching valve 41 is also provided on the conveying pipe 40, which is located between the vacuum pump 70 and the powder bag 30. Meanwhile, the gas filter 80 is connected to the conveying pipe 40 between the first switching valve 41 and the powder bag 30, and a second switching valve 42 is provided between the gas filter 80 and the conveying pipe 40.

[0038] Specifically, such as Figure 2 As shown, in one embodiment, the fixed bracket 10 includes a base plate 11, a top plate 12 and a support plate 13. The two ends of the support plate 13 are connected to the base plate 11 and the top plate 12 respectively. The weighing machine 20 is connected to the top plate 12 and is located between the base plate 11 and the top plate 12.

[0039] The weighing machine 20 includes a hanging scale, which includes a sensing body and a hook. One end of the sensing body is connected to the top plate 12, and the other end of the sensing body is rotatably connected to the hook. The hook is used to hang the powder bag 30.

[0040] Specifically, such as Figure 3 , Figure 4 and Figure 5As shown, in one embodiment, the sealing member 50 includes a connecting part 51 and a sealing part 52 connected to each other. The connecting part 51 is sealed and sleeved on the conveying pipe 40, and the sealing part 52 forms a funnel-shaped opening around the connecting part 51. The inner wall of the sealing part 52 is used to abut against the bottom of the powder bag 30.

[0041] Furthermore, such as Figure 5 As shown, in one embodiment, the funnel-shaped opening of the sealing part 52 is spherical, and the radius of the sealing part 52 is equal to the bottom radius of the powder bag 30;

[0042] Alternatively, in one embodiment, the funnel-shaped opening of the sealing part 52 is conical, and the generatrix of the cone of the sealing part 52 is tangent to the bottom of the powder bag 30.

[0043] Specifically, continue to refer to Figure 3 , Figure 4 , Figure 5 and Figure 6 In one embodiment, the first end of the conveying pipe 40 is provided with a hollow plug 60, which is disposed in the powder bag 30, and a plurality of through holes 61 are distributed on the plug 60.

[0044] Furthermore, such as Figure 6 As shown, in one embodiment, the bottom of the plug 60 is flared, and the bottom of the plug 60 can extend into the flared opening of the sealing part 52 and hold the bottom of the powder bag 30. In this specific embodiment, the bottom of the plug 60 is adapted to the shape of the sealing part 52, and is hemispherical or conical.

[0045] The sealing element 50 includes a connecting part 51 connected to the sealing part 52, and the connecting part 51 is threadedly connected to the conveying pipe 40. The sealing element 50 of the polishing pad feeding device 100 is provided with a connecting part 51 and a sealing part 52. The connecting part 51 is threadedly and sealed to the conveying pipe 40. The sealing part 52 is provided with a spherical or conical funnel-shaped opening, which clamps the bottom of the powder bag 30 by cooperating with the bottom of the plug 60, preventing microspheres from overflowing from the connection between the powder bag 30 and the conveying pipe 40, and effectively avoiding the scattering of microsphere powder.

[0046] like Figure 3 and Figure 4 As shown, during the installation of the aforementioned polishing pad feeding device 100, the powder bag 30 is first suspended on the weighing machine 20, and then the plug 60 of the conveying pipe 40 is inserted into the bottom of the powder bag 30 (e.g., Figure 3 As shown), align the bottom of the plug 60 with the bottom of the powder bag 30, then move the seal 50 on the conveying pipe 40 until the flared opening of the seal 50 is aligned with the bottom of the powder bag 30. At this point, the seal 50 and the plug 60 tightly clamp the bottom of the powder bag 30 (as shown). Figure 4As shown in the diagram, this effectively prevents microspheres from leaking out of the gap between the powder bag 30 and the conveying pipe 40, improving the sealing effect inside the powder bag 30. After installation, a vacuum pump 70 can be used to create a vacuum, allowing the microspheres in the powder bag 30 to enter the polishing pad mixing tank through the conveying pipe 40. The weight reduction of the powder bag 30 displayed on the weighing machine 20 at this time is the weight of the microspheres added. Therefore, for better sealing and weighing effects, the position of the plug 60 on the powder bag 30 and the position where the weighing machine 20 is suspended are preferably on the same vertical axis.

[0047] Furthermore, such as Figure 5 As shown, in one embodiment, the top of the plug 60 is conical, and through holes 61 are distributed on the conical surface of the plug 60. First, the conical shape of the plug 60 can improve the efficiency of inserting into the powder bag 30. Second, the through holes 61 on the conical surface facilitate the flow of microspheres along the top of the cone into the bottom of the plug 60, avoiding the microspheres from clogging the plug 60 and the opening of the delivery pipe 40.

[0048] Among them, the through holes 61 are arranged in rows along the conical generatrix of the plug 60, and multiple rows of through holes 61 are distributed around the central axis of the plug 60.

[0049] In this specific embodiment, the central axis of the through hole 61 is inclined towards the side closer to the bottom of the plug 60, and the angle between the central axis of the through hole 61 and the generatrix of the plug 60 is 30° to 60°. The plug 60 is provided with a through hole 61 that is inclined towards the bottom, and the angle between the axis of the through hole 61 and the generatrix of the plug 60 is set to 30° to 60°. This is beneficial for improving the efficiency of the microspheres passing through the through hole 61, preventing the microspheres from clogging the through hole 61, and further improving the microsphere dosing efficiency.

[0050] Specifically, in one embodiment, the sealing portion 52 includes a plurality of elastic sheets surrounding the connecting portion 51, with a gap between adjacent elastic sheets. Since the sealing portion 52 includes a plurality of independent elastic sheets, the elastic sheets can move away from the central axis under external force, thereby adapting to different sizes of the bottom of the powder bag 30, ensuring a tight fit between the sealing portion 52 and the powder bag 30, and improving the sealing effect.

[0051] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0052] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0053] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0054] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0055] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0056] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of the present invention without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A polishing pad feeding device, characterized in that, include: A fixed bracket (10) is provided with a weighing machine (20), which is used to hang the powder bag (30) and weigh the powder bag (30); The conveying pipe (40) has a first end connected to the bottom of the powder bag (30) and a second end connected to the polishing pad mixing tank. A sealing element (50) is fitted onto the conveying pipe (40) and abuts against the bottom of the powder bag (30); The powder bag (30) contains microspheres; one end of the conveying pipe (40) is provided with a hollow plug (60), which is located in the powder bag (30) and has multiple through holes (61). The sealing element (50) includes a sealing part (52) and a connecting part (51) connected to the sealing part (52). The sealing part (52) forms a funnel-shaped opening around the conveying pipe (40). The funnel-shaped opening of the sealing part (52) is used to abut against the bottom of the powder bag (30). The bottom of the plug (60) is flared, and the bottom of the plug (60) can extend into the flared opening of the sealing part (52) and clamp the bottom of the powder bag (30) with the sealing part (52); The connecting part (51) is threadedly connected to the conveying pipe (40), the sealing part (52) includes an elastic sheet surrounding the connecting part (51), and the bottom of the plug (60) abuts against the bottom of the powder bag (30).

2. The polishing pad feeding device according to claim 1, characterized in that, The funnel-shaped opening of the sealing part (52) is spherical; Alternatively, the funnel-shaped opening of the sealing part (52) is conical.

3. The polishing pad feeding device according to claim 1, characterized in that, The top of the plug (60) is conical, and the through hole (61) is distributed on the conical surface of the plug (60).

4. The polishing pad feeding device according to claim 3, characterized in that, The through holes (61) are arranged in rows along the conical generatrix of the plug (60), and multiple rows of the through holes (61) are distributed around the central axis of the plug (60).

5. The polishing pad feeding device according to claim 3, characterized in that, The central axis of the through hole (61) is inclined to the side closer to the bottom of the plug (60), and the angle between the central axis of the through hole (61) and the conical generatrix of the plug (60) is 30° to 60°.

6. The polishing pad feeding device according to claim 1, characterized in that, The fixed bracket (10) includes a base plate (11), a top plate (12) and a support plate (13). The two ends of the support plate (13) are connected to the base plate (11) and the top plate (12) respectively. The weighing machine (20) is connected to the top plate (12) and is located between the base plate (11) and the top plate (12).

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