A power module integrated assembly mechanism and method

Abstract

The present invention discloses an integrated power module assembly mechanism and method, which relates to the field of power module assembly and solves the problems of complicated procedures, low efficiency, potential product quality risks, and low labor efficiency in the prior art when assembling IPM power modules and radiators. The mechanism includes a base assembly, a printing assembly, and an assembly line bracket. The base assembly is used to install the radiator to be assembled and the power module to be assembled. The base assembly can be slidably installed on the assembly line bracket. The printing assembly is used to apply thermal paste to the radiator to be assembled. The printing assembly can be rotatably installed on the assembly line bracket. When assembling the radiator and the power module using the integrated power module assembly mechanism, it is only necessary to flip the printing assembly, so that the coating of the radiator to be assembled and the assembly of the radiator and the power module can be achieved in one step, which simplifies the assembly process, improves assembly efficiency and product consistency, and can reduce the number of employees by one per shift, thereby achieving the goal of reducing staff and increasing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of power module assembly, and in particular to an integrated power module assembly mechanism and method. Background Art

[0002] Compared to AC fans, DC fans without built-in drivers currently offer advantages such as low losses, high efficiency, and a high power factor, making them widely used in refrigeration applications. In the control circuits of DC fans, IPM power modules are typically used as external drivers. During high-frequency operation, the high temperatures generated by IPM power modules can easily cause abnormal wafer burnout. Therefore, heat dissipation treatment is performed during the IPM power module production process. Currently, a common heat dissipation treatment involves attaching a metal heat sink made of wavy aluminum profiles to the surface of the IPM power module to dissipate heat.

[0003] Figure 1 FIG. 1 shows a schematic diagram of an IPM power module assembly mechanism in the prior art. Figure 1 As shown, the IPM power module assembly mechanism in the prior art includes a base 1, a radiator positioning seat 2 installed on the base 1, a printing portion 3 and an IPM power module positioning seat 4, wherein the radiator positioning seat 2 is fixed to the middle of the base 1, the printing portion 3 and the IPM power module positioning seat 4 are located on both sides of the radiator positioning seat 2, and the printing portion 3 and the IPM power module positioning seat 4 are rotatable, the radiator positioning seat 2 is used to fix the radiator, the printing portion 3 is used to apply thermal paste to the radiator, and the IPM power module positioning seat 4 is used to fix the IPM power module. Using the IPM power module assembly mechanism, the assembly between the IPM power module and the radiator includes the following steps: (1) fixing the radiator on the radiator positioning seat 2; (2) flipping the printing part 3 over the radiator and applying thermal paste to the radiator, and then flipping the printing part 3 to its original position; (3) flipping the IPM power module positioning seat 4 over the radiator; (4) fixing the IPM power module to the IPM power module positioning seat 4, and then assembling the IPM power module and the radiator with screws; finally, the IPM power module positioning seat 4 needs to be flipped over to its original position.

[0004] It can be seen that the assembly between the IPM power module and the heat sink using the IPM power module assembly mechanism in the prior art requires at least four flips, and the required assembly process is relatively complicated, which seriously restricts the assembly efficiency and poses a hidden danger to product quality. On the other hand, the assembly station requires at least three operators, one of whom installs the heat sink, one operates the printing part 3, and one operates the IPM power module positioning seat 4. This station requires a large number of operators and has low labor efficiency.

[0005] Therefore, there is an urgent need to improve the IPM power module assembly mechanism in the prior art. Summary of the Invention

[0006] One of the objectives of this invention is to provide an integrated power module assembly mechanism that addresses the technical challenges of prior art in assembling IPM power modules and heat sinks, which include complex processes, low efficiency, potential product quality risks, and the requirement of at least three operators, resulting in low labor efficiency. The various technical benefits of this preferred embodiment are detailed below.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] The integrated power module assembly mechanism of the present invention includes a base assembly, a printing assembly and an assembly line bracket, wherein the base assembly is used to install the radiator to be assembled and the power module to be assembled, and the base assembly can be slidably installed on the assembly line bracket, and the printing assembly is used to apply thermal paste to the radiator to be assembled, and the printing assembly can be rotatably installed on the assembly line bracket.

[0009] According to a preferred embodiment, the base assembly includes a first positioning seat, an elastic assembly and a second positioning seat, the first positioning seat is installed on the second positioning seat, the elastic assembly is installed between the first positioning seat and the second positioning seat, and a mounting portion is provided on the first positioning seat, and the mounting portion is used to install the heat sink to be assembled and the power module to be assembled.

[0010] According to a preferred embodiment, a power module limiting portion is further provided on the first positioning seat. After the radiator to be assembled is installed on the mounting portion, the elastic component is in a naturally extended state, and the surface of the power module limiting portion is higher than the surface of the radiator to be assembled. When the printed component applies pressure to the base component, the elastic component is in a compressed state, and the surface of the power module limiting portion is flush with the surface of the radiator to be assembled; when the printed component releases the pressure on the base component, the elastic component returns to a naturally extended state, and the surface of the power module limiting portion is higher than the surface of the radiator to be assembled.

[0011] According to a preferred embodiment, a first limit block and a second limit block are provided on the first positioning seat, the first limit block and the second limit block are located on both sides of the mounting portion, the spacing between the first limit block and the second limit block is the same as the width between the power modules to be assembled, and the first limit block and the second limit block constitute the power module limiting portion.

[0012] According to a preferred embodiment, a third limit block, a fourth limit block and a bottom plate are provided in the second positioning seat, wherein the third limit block and the fourth limit block are provided with grooves, the width of the grooves is the same as the width of the radiator to be assembled, and the distance between the grooves on the third limit block and the grooves on the fourth limit block is the same as the length of the radiator to be assembled; the grooves on the third limit block, the grooves on the fourth limit block and the bottom plate constitute the radiator limiting part.

[0013] According to a preferred embodiment, the assembly line support is a roller-type assembly line structure.

[0014] According to a preferred embodiment, the printing assembly includes a printing plate and a support plate, wherein the printing plate is rotatably mounted on the assembly line bracket; the support plate is fixedly mounted under the roller of the assembly line bracket, and when the printing plate rotates to a position above the assembly line bracket and parallel to the assembly line bracket, the support plate is also located under the printing plate.

[0015] According to a preferred embodiment, the integrated power module assembly mechanism further includes a positioning block, with baffles provided on both sides of the positioning block. The positioning block is placed under the base assembly, and the baffles on both sides of the positioning block abut against both sides of the base assembly respectively.

[0016] According to a preferred embodiment, the number of the positioning blocks is at least two, and the positioning blocks are placed on the assembly line bracket at intervals, and the number of the base components is the same as the number of the positioning blocks.

[0017] The integrated power module assembly mechanism provided by the present invention has at least the following beneficial technical effects:

[0018] The power module integrated assembly mechanism of the present invention includes a base component, a printing component and an assembly line bracket, wherein the base component is used to install the radiator to be assembled and the power module to be assembled, and the base component can be slidably installed on the assembly line bracket, and the printing component is used to apply thermal paste to the radiator to be assembled, and the printing component can be rotatably installed on the assembly line bracket. Since the base component can be used to install the radiator to be assembled and the power module to be assembled at the same time, when the radiator and the power module are assembled using the power module integrated assembly mechanism, the radiator to be assembled can be first installed on the base component, and then the printing component can be flipped over to achieve the coating of the thermal paste on the radiator to be assembled. After the coating is completed, the printing component is flipped back to its original position again. At the same time, after the power module is installed on the radiator to be assembled, the radiator and the power module can be assembled.

[0019] As can be seen, when assembling the heat sink and power module using this integrated power module assembly mechanism, only the printed assembly needs to be flipped, allowing the coating of the heat sink to be assembled and the assembly of the heat sink and power module to be completed in one step. This simplifies the assembly process, thereby improving assembly efficiency and product consistency. Furthermore, it can reduce the number of workers by one per shift (the operator responsible for flipping the power module positioning seat can be eliminated), achieving the goal of reducing staff and increasing efficiency. In other words, the integrated power module assembly mechanism of the present invention solves the technical problems of the prior art in assembling IPM power modules and heat sinks, such as complex processes, low efficiency, and the risk of product quality risks, as well as the requirement of at least three operators at the assembly station, resulting in low labor efficiency.

[0020] The second object of the present invention is to provide a method for assembling an integrated power module.

[0021] The power module integrated assembly method of the present invention is accomplished using the power module integrated assembly mechanism described in any one of the technical solutions of the present invention, and the method comprises the following steps:

[0022] The base assembly is mounted on the positioning block, and the base assembly and the positioning block are driven by the assembly line bracket to move to the printing assembly;

[0023] Install the radiator to be assembled on the mounting portion of the first positioning seat of the base assembly, and limit and fix the radiator to be assembled by the radiator limiting portion on the second positioning seat of the base assembly;

[0024] flipping the printed board of the printed assembly over the base assembly, and applying thermal paste to the heat sink to be assembled through the printed board;

[0025] The printed circuit board is flipped over to a position separated from the base assembly, and the power module limiting portion on the first positioning seat is restored to a position where its surface is higher than the surface of the heat sink to be assembled under the restoring force of the elastic component of the base assembly;

[0026] Installing the power module to be assembled above the radiator to be assembled, and limiting and fixing the power module to be assembled by the power module limiting portion;

[0027] Fix the heat sink to be assembled and the power module to be assembled.

[0028] The integrated power module assembly method provided by the present invention has at least the following beneficial technical effects:

[0029] The integrated power module assembly method of the present invention is completed by utilizing the integrated power module assembly mechanism of any one of the technical solutions of the present invention. During the assembly process of the heat sink to be assembled and the power module to be assembled, it is only necessary to flip the printed assembly, so that the coating of the heat sink to be assembled and the assembly of the heat sink and the power module can be completed in one step, thereby simplifying the assembly process, thereby improving the assembly efficiency and product consistency, and achieving a reduction of one person per shift (the operator who flips the power module positioning seat can be eliminated), thereby achieving the purpose of reducing staff and increasing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 It is a schematic diagram of a power module assembly mechanism in the prior art;

[0032] Figure 2 This is an assembly diagram of a preferred embodiment of the integrated power module assembly mechanism of the present invention;

[0033] Figure 3 This is an exploded view of a preferred embodiment of the integrated power module assembly mechanism of the present invention;

[0034] Figure 4 is an exploded view of a preferred embodiment of the base assembly of the present invention;

[0035] Figure 5 is a schematic diagram of a preferred embodiment of the first positioning seat of the present invention;

[0036] Figure 6 is a schematic diagram of a preferred embodiment of the second positioning seat of the present invention;

[0037] Figure 7 This is an assembly drawing of the heat sink and power module to be assembled.

[0038] In the figure: 1. base; 2. radiator positioning seat; 3. printing part; 4. IPM power module positioning seat; 10. base assembly; 101. first positioning seat; 1011. mounting part; 1012. power module limiting part; 1013. first limiting block; 1014. second limiting block; 1015. protrusion; 102. elastic assembly; 1021. spring; 1022. bolt column; 103. second positioning seat; 1031. third limiting block; 1032. fourth limiting block; 1033. bottom plate; 1034. groove; 1035. radiator limiting part; 20. printing assembly; 201. printing board; 202. support plate; 30. assembly line bracket; 40. radiator to be assembled; 50. power module to be assembled; 60. positioning block; 601. baffle. DETAILED DESCRIPTION

[0039] To make the objectives, technical solutions, and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other implementations obtained by those of ordinary skill in the art without inventive effort are within the scope of protection of the present invention.

[0040] The following is attached with the instruction manual Figures 2 to 7 The power module integrated assembly mechanism and method of the present invention are described in detail in Examples 1 and 2.

[0041] Example 1

[0042] This embodiment describes in detail the integrated assembly mechanism of the power module of the present invention.

[0043] The integrated power module assembly mechanism of this embodiment includes a base assembly 10, a printing assembly 20 and an assembly line bracket 30. Figure 2 and Figure 3 As shown. Preferably, the base assembly 10 is used to install the heat sink 40 to be assembled and the power module 50 to be assembled, and the base assembly 10 can be slidably installed on the assembly line bracket 30, and the printing assembly 20 is used to apply thermal paste to the heat sink 40 to be assembled, and the printing assembly 20 can be rotatably installed on the assembly line bracket 30. The power module 50 to be assembled is, for example, an IPM power module or an IGBT power module. The assembly diagram of the heat sink 40 to be assembled and the power module 50 to be assembled is shown in FIG. Figure 7 shown.

[0044] The power module integrated assembly mechanism of this embodiment includes a base component 10, a printing component 20 and an assembly line bracket 30, wherein the base component 10 is used to install the heat sink 40 to be assembled and the power module 50 to be assembled, and the base component 10 can be slidably installed on the assembly line bracket 30, the printing component 20 is used to apply thermal paste to the heat sink 40 to be assembled, and the printing component 20 can be rotatably installed on the assembly line bracket 30. Since the base component 10 can be used to install the heat sink 40 to be assembled and the power module 50 to be assembled at the same time, when the power module integrated assembly mechanism is used to assemble the heat sink 40 to be assembled, the heat sink 40 to be assembled can be installed on the base component 10 first, and then the printing component 20 can be flipped over to achieve the coating of the thermal paste on the heat sink 40 to be assembled. After the coating is completed, the printing component 20 is flipped over again to its original position. At the same time, after the power module is installed on the heat sink 40 to be assembled, the heat sink and the power module can be assembled.

[0045] As can be seen, when assembling the heat sink and power module using this integrated power module assembly mechanism, only the printed assembly 20 needs to be flipped, allowing the coating of the heat sink 40 to be assembled and the assembly of the heat sink and power module to be completed in one step. This simplifies the assembly process, thereby improving assembly efficiency and product consistency. Furthermore, it can reduce the number of workers by one per shift (the operator responsible for flipping the power module positioning seat can be eliminated), achieving the goal of reducing staff and increasing efficiency. In other words, the integrated power module assembly mechanism of this embodiment solves the technical problems of the prior art in assembling IPM power modules and heat sinks, such as complex processes, low efficiency, and the risk of product quality problems, as well as the requirement of at least three operators at the assembly station, resulting in low labor efficiency.

[0046] On the other hand, the integrated power module assembly mechanism of this embodiment can be used not only for the assembly of IPM power modules and heat sinks, but also for the assembly of IGBT and other power modules and heat sinks, providing a new improvement idea for the assembly process of IGBT and other power modules and heat sinks, and can be promoted and applied in the electronic assembly industry, with the advantage of a wide range of uses.

[0047] According to a preferred embodiment, the base assembly 10 includes a first positioning seat 101, an elastic component 102 and a second positioning seat 103, the first positioning seat 101 is installed on the second positioning seat 103, the elastic component 102 is installed between the first positioning seat 101 and the second positioning seat 103, and the first positioning seat 101 is provided with a mounting portion 1011, the mounting portion 1011 is used to mount the heat sink 40 to be assembled and the power module 50 to be assembled, such as Figure 4 and Figure 5Preferably, the elastic component 102 includes a spring 1021 and a bolt column 1022. One end of the bolt column 1022 is mounted on the second positioning seat 103. The spring 1021 is sleeved on the bolt column 1022. The length of the spring 1021 in a naturally extended state is greater than the height of the bolt column 1022. Figure 4 As shown. The integrated power module assembly mechanism of the preferred technical solution of this embodiment, when assembling the heat sink 40 and the power module 50, can first be placed on the mounting portion 1011. After applying thermal paste via the printed assembly 20, the power module 50 can be mounted on the heat sink 40. The heat sink 40 and the power module 50 can then be assembled. Furthermore, an elastic component 102 is provided between the first positioning seat 101 and the second positioning seat 103. The elastic component 102 allows the depressed first positioning seat 101 to rebound to its original position, facilitating the installation of the power module 50.

[0048] According to a preferred embodiment, a power module limiting portion 1012 is further provided on the first positioning seat 101. Figure 5 As shown. Preferably, after the heat sink 40 to be assembled is installed on the mounting portion 1011, the elastic component 102 is in a naturally extended state, the surface of the power module limiting portion 1012 is higher than the surface of the heat sink 40 to be assembled, and when the printing component 20 applies pressure to the base component 10, the elastic component 102 is in a compressed state, and the surface of the power module limiting portion 1012 is flush with the surface of the heat sink 40 to be assembled; when the printing component 20 releases the pressure on the base component 10, the elastic component 102 returns to a naturally extended state, and the surface of the power module limiting portion 1012 is higher than the surface of the heat sink 40 to be assembled. The power module integrated assembly mechanism of the preferred technical solution of this embodiment, by arranging the power module limiting portion 1012 on the first positioning seat 101, can limit the installed power module 50 to be assembled, so as to ensure the assembly quality of the heat sink 40 to be assembled and the power module 50 to be assembled and the consistency of the product. On the other hand, the power module integrated assembly mechanism of the preferred technical solution of this embodiment utilizes the function of the elastic component 102. When the printing component 20 applies pressure to the base component 10, the elastic component 102 is in a compressed state, and the surface of the power module limiting portion 1012 is flush with the surface of the heat sink 40 to be assembled, thereby ensuring the coating quality of the printed component 20 on the heat sink 40 to be assembled; when the printing component 20 releases the pressure on the base component 10, the elastic component 102 returns to a natural extension state, and the surface of the power module limiting portion 1012 is higher than the surface of the heat sink 40 to be assembled, which can facilitate the installation of the power module 50 to be assembled, and at the same time facilitate the use of the power module limiting portion 1012 to limit the power module 50 to be assembled.

[0049] According to a preferred embodiment, a first limiting block 1013 and a second limiting block 1014 are provided on the first positioning seat 101. The first limiting block 1013 and the second limiting block 1014 are located on both sides of the mounting portion 1011. The spacing between the first limiting block 1013 and the second limiting block 1014 is the same as the width between the power modules 50 to be assembled, and the first limiting block 1013 and the second limiting block 1014 constitute the power module limiting portion 1012. Figure 5 In the integrated power module assembly mechanism of the preferred technical solution of this embodiment, the spacing between the first limit block 1013 and the second limit block 1014 is the same as the width between the power modules 50 to be assembled. The first limit block 1013 and the second limit block 1014 can limit the left and right sides of the power module 50 to be assembled, and the front and rear sides of the power module 50 to be assembled are aligned with the bolt fixing holes on the heat sink 40 to be assembled, so that the power module 50 to be assembled can be positioned in multiple directions, thereby ensuring the assembly quality of the heat sink 40 to be assembled and the power module 50 to be assembled and the consistency of the product.

[0050] According to a preferred embodiment, at least two protrusions 1015 are provided on each of the first limiting block 1013 and the second limiting block 1014, and the protrusions 1015 are spaced apart from each other. Figure 5 The spacing between the protrusions 1015 of the first limiting block 1013 and the protrusions 1015 on the second limiting block 1014 is the same as the distance between the pins on both sides of the power module 50 to be assembled. Therefore, the protrusions 1015 of the first limiting block 1013 and the protrusions 1015 on the second limiting block 1014 can be abutted against the pins on both sides of the power module 50 to further position the power module 50 to be assembled, thereby further ensuring the assembly quality of the heat sink 40 to be assembled with the power module 50 to be assembled and the consistency of the product.

[0051] According to a preferred embodiment, a third limiting block 1031, a fourth limiting block 1032 and a bottom plate 1033 are provided in the second positioning seat 103, wherein the third limiting block 1031 and the fourth limiting block 1032 are provided with a groove 1034, the width of the groove 1034 is the same as the width of the radiator 40 to be assembled, and the distance between the groove 1034 on the third limiting block 1031 and the groove 1034 on the fourth limiting block 1032 is the same as the length of the radiator 40 to be assembled; the groove 1034 on the third limiting block 1031, the groove 1034 on the fourth limiting block 1032 and the bottom plate 1033 constitute a radiator limiting portion 1035, as shown Figure 6As shown in the preferred technical solution of the integrated power module assembly mechanism of this embodiment, the groove 1034 on the third limiting block 1031, the groove 1034 on the fourth limiting block 1032, and the bottom plate 1033 form a heat sink limiting portion 1035. The width of the groove 1034 is the same as the width of the heat sink 40 to be assembled, and the distance between the groove 1034 on the third limiting block 1031 and the groove 1034 on the fourth limiting block 1032 is the same as the length of the heat sink 40 to be assembled. The heat sink limiting portion 1035 can limit the length and width of the heat sink 40 to be assembled, thereby ensuring the assembly quality and product consistency of the heat sink 40 to be assembled with the power module 50 to be assembled.

[0052] According to a preferred embodiment, the assembly line support 30 is a roller assembly line structure, such as Figure 2 and Figure 3 Specifically, the roller assembly line is provided with a roller and a driving mechanism, the driving mechanism being used to drive the roller to rotate, thereby driving the base assembly 10 placed on the roller to move through the rotation of the roller. The roller assembly line structure can be a structure in the prior art and will not be described in detail here.

[0053] According to a preferred embodiment, the printing assembly 20 includes a printing plate 201 and a support plate 202, wherein the printing plate 201 is rotatably mounted on the assembly line bracket 30; the support plate 202 is fixedly mounted below the roller of the assembly line bracket 30, and when the printing plate 201 rotates to a position above the assembly line bracket 30 and parallel to the assembly line bracket 30, the support plate 202 is also located below the printing plate 201, such as Figure 2 and Figure 3 As shown. Preferably, the structure of the printed board 201 may be the same as the structure of the printing part in the prior art, and will not be described in detail here. Preferably, the support plate 202 is a structure with relatively high hardness, such as a steel plate. In the integrated assembly mechanism of the power module of the preferred technical solution of this embodiment, the printed component 20 also includes a support plate 202, and the support plate 202 is fixedly installed under the roller of the assembly line bracket 30. When the printed board 201 applies thermal paste to the radiator 40 to be assembled on the base assembly 10, the printed board 201 applies a downward force to the radiator 40 to be assembled. Through the supporting effect of the support plate 202, the problem of excessive force applied by the printed board 201 causing the assembly line bracket 30 to be concave downward can be avoided, thereby helping to maintain a close fit between the printed board 201 and the radiator 40 to be assembled, thereby ensuring the coating quality of the printed board 201 on the radiator 40 to be assembled.

[0054] According to a preferred embodiment, the power module integrated assembly mechanism further includes a positioning block 60, and baffles 601 are provided on both sides of the positioning block 60. The positioning block 60 is placed below the base assembly 10, and the baffles 601 on both sides of the positioning block 60 abut against both sides of the base assembly 10, such as Figure 2 and Figure 3 As shown. Preferably, after the base assembly 10 is mounted on the positioning block 60, the height of the baffle 601 surface is lower than the height of the base assembly 10 surface. This can avoid the problem of the baffle 601 being too high when the printed assembly 20 applies thermal paste to the heat sink 40 to be assembled, resulting in the printed assembly 20 not being able to maintain a tight fit with the heat sink 40 to be assembled. The power module integrated assembly mechanism of the preferred technical solution of this embodiment also includes a positioning block 60. The positioning block 60 can limit the position of the base assembly 10. When the printed assembly 20 applies thermal paste to the heat sink 40 to be assembled, the base assembly 10 can be prevented from being offset, which can affect the coating quality of the printed board 201 on the heat sink 40 to be assembled.

[0055] According to a preferred embodiment, the number of the positioning blocks 60 is at least two, and the positioning blocks 60 are placed on the assembly line bracket 30 at intervals, and the number of the base assemblies 10 is the same as the number of the positioning blocks 60 . Figure 2 and Figure 3 The schematic diagram shows two base assemblies 10 and two positioning blocks 60. The preferred technical solution of this embodiment is a power module integrated assembly mechanism that simultaneously places at least two sets of positioning blocks 60 and base assemblies 10 on the assembly line bracket 30. This allows the next heat sink 40 to be installed simultaneously while the heat sink and power module are being coated and assembled, further improving assembly efficiency.

[0056] Example 2

[0057] This embodiment describes in detail the integrated power module assembly method of the present invention.

[0058] The power module integrated assembly method of this embodiment is performed using the power module integrated assembly mechanism described in any one of the technical solutions in Example 1, and the method includes the following steps:

[0059] Step 1: Install the base assembly 10 on the positioning block 60 . The base assembly 10 and the positioning block 60 are driven by the assembly line bracket 30 to move to the printing assembly 20 .

[0060] Step 2: Install the radiator 40 to be assembled on the mounting portion 1011 on the first positioning seat 101 of the base assembly 10 , and limit and fix the radiator 40 to be assembled by the radiator limiting portion 1035 on the second positioning seat 103 of the base assembly 10 .

[0061] Step 3: Flip the printed board 201 of the printed assembly 20 over the base assembly 10 , and apply thermal paste to the heat sink 40 to be assembled through the printed board 201 .

[0062] Step 4: Flip the printed circuit board 201 to a position separated from the base assembly 10. The power module limiting portion 1012 on the first positioning seat 101 is restored to a position where its surface is higher than the surface of the heat sink 40 to be assembled under the restoring force of the elastic component 102 of the base assembly 10.

[0063] Step 5: Install the power module 50 to be assembled above the heat sink 40 to be assembled, and use the power module limiting portion 1012 to limit and fix the power module 50 to be assembled.

[0064] Step 6: Fix the heat sink 40 to be assembled and the power module 50 to be assembled.

[0065] The integrated power module assembly method of this embodiment is completed by using the integrated power module assembly mechanism of any one of the technical solutions in Example 1. During the assembly process of the heat sink 40 to be assembled and the power module 50 to be assembled, it is only necessary to flip the printed component 20, so that the coating of the heat sink 40 to be assembled and the assembly of the heat sink and the power module can be completed in one step, which simplifies the assembly process, thereby improving the assembly efficiency and product consistency, and can achieve a reduction of one person per shift (the operator who flips the power module positioning seat can be eliminated), thereby achieving the purpose of reducing staff and increasing efficiency.

[0066] In the description of the present invention, it should be noted that, unless otherwise specified, "plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific direction, be constructed, or operate in a specific direction, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0067] It should also be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; and direct or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the present invention depending on the specific circumstances.

[0068] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A power module integrated assembly mechanism, characterized in that: The invention comprises a base assembly (10), a printing assembly (20) and an assembly line bracket (30), wherein the base assembly (10) is used to install a heat sink (40) to be assembled and a power module (50) to be assembled, and the base assembly (10) is slidably mounted on the assembly line bracket (30), and the printing assembly (20) is used to apply heat dissipation paste to the heat sink (40) to be assembled, and the printing assembly (20) is rotatably mounted on the assembly line bracket (30); The base assembly (10) comprises a first positioning seat (101), an elastic assembly (102) and a second positioning seat (103); the first positioning seat (101) is mounted on the second positioning seat (103); the elastic assembly (102) is mounted between the first positioning seat (101) and the second positioning seat (103); and a mounting portion (1011) is provided on the first positioning seat (101); the mounting portion (1011) is used for mounting a heat sink (40) to be assembled and a power module (50) to be assembled.

2. The power module integrated assembly mechanism according to claim 1, characterized in that: The first positioning seat (101) is further provided with a power module limiting portion (1012). After the heat sink (40) to be assembled is installed on the mounting portion (1011), the elastic component (102) is in a naturally extended state, and the surface of the power module limiting portion (1012) is higher than the surface of the heat sink (40) to be assembled, and When the printed component (20) applies pressure to the base component (10), the elastic component (102) is in a compressed state, and the surface of the power module limiting portion (1012) is flush with the surface of the heat sink (40) to be assembled; when the printed component (20) releases the pressure on the base component (10), the elastic component (102) returns to a naturally extended state, and the surface of the power module limiting portion (1012) is higher than the surface of the heat sink (40) to be assembled.

3. The integrated power module assembly mechanism according to claim 2, wherein: A first limiting block (1013) and a second limiting block (1014) are provided on the first positioning seat (101), the first limiting block (1013) and the second limiting block (1014) are located on both sides of the mounting portion (1011), the spacing between the first limiting block (1013) and the second limiting block (1014) is the same as the width between the power modules (50) to be assembled, and the first limiting block (1013) and the second limiting block (1014) constitute the power module limiting portion (1012).

4. The integrated power module assembly mechanism according to any one of claims 1 to 3, characterized in that: A third limiting block (1031), a fourth limiting block (1032) and a bottom plate (1033) are provided in the second positioning seat (103), wherein a groove (1034) is provided on the third limiting block (1031) and the fourth limiting block (1032), the width of the groove (1034) being the same as the width of the radiator (40) to be assembled, and the distance between the groove (1034) on the third limiting block (1031) and the groove (1034) on the fourth limiting block (1032) being the same as the length of the radiator (40) to be assembled; The groove (1034) on the third limiting block (1031), the groove (1034) on the fourth limiting block (1032), and the bottom plate (1033) constitute a radiator limiting portion (1035).

5. The integrated power module assembly mechanism according to claim 1, wherein: The assembly line support (30) is a roller-type assembly line structure.

6. The integrated power module assembly mechanism according to claim 1, characterized in that: The printing assembly (20) comprises a printing plate (201) and a support plate (202), wherein the printing plate (201) is rotatably mounted on the assembly line bracket (30); the support plate (202) is fixedly mounted below the roller of the assembly line bracket (30), and when the printing plate (201) is rotated to a position above the assembly line bracket (30) and parallel to the assembly line bracket (30), the support plate (202) is also located below the printing plate (201).

7. The integrated power module assembly mechanism according to claim 1, wherein: It also includes a positioning block (60), with baffles (601) provided on both sides of the positioning block (60), the positioning block (60) being placed below the base assembly (10), and the baffles (601) on both sides of the positioning block (60) respectively abutting against both sides of the base assembly (10).

8. The integrated power module assembly mechanism according to claim 7, wherein: The number of the positioning blocks (60) is at least two, and the positioning blocks (60) are placed on the assembly line bracket (30) at intervals, and the number of the base components (10) is the same as the number of the positioning blocks (60).

9. A method for assembling an integrated power module, characterized in that: The method is performed using the integrated power module assembly mechanism according to any one of claims 1 to 8, and the method comprises the following steps: The base assembly (10) is mounted on the positioning block (60), and the base assembly (10) and the positioning block (60) are driven by the assembly line bracket (30) to move to the printing assembly (20); The radiator (40) to be assembled is mounted on the mounting portion (1011) on the first positioning seat (101) of the base assembly (10), and the radiator (40) to be assembled is limited and fixed by the radiator limiting portion (1035) on the second positioning seat (103) of the base assembly (10); Turning the printed board (201) of the printed assembly (20) over onto the base assembly (10), and applying heat dissipation paste to the heat sink (40) to be assembled via the printed board (201); The printed board (201) is flipped to a position separated from the base assembly (10), and the power module limiting portion (1012) on the first positioning seat (101) is restored to a position where its surface is higher than the surface of the heat sink (40) to be assembled under the restoring force of the elastic component (102) of the base assembly (10); The power module (50) to be assembled is installed above the heat sink (40) to be assembled, and the power module (50) to be assembled is limited and fixed by the power module limiting portion (1012); The heat sink (40) to be assembled and the power module (50) to be assembled are fixedly connected.

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