Preparation method of PTFE modified fluororubber profile seal for semiconductor

Abstract

The application relates to the field of sealing rings, in particular to a preparation method of a PTFE modified fluororubber special-shaped sealing piece for semiconductors; the PTFE modified fluororubber special-shaped sealing piece for semiconductors is prepared by using fluororubber, reinforcing bodies, reinforcing fillers, acid absorbents, vulcanizing agents, vulcanization accelerators, cross-linking agents and softening agents; the special molecular structure of PTFE makes the PTFE have the characteristics of high hardness, high modulus and high melting point, and excellent properties such as chemical corrosion resistance, aging resistance, high temperature resistance and radiation resistance, so that the special environmental requirements can be met; the PTFE is compounded with the fluororubber, and the mechanical strength, oil resistance, heat-oxygen aging resistance and thermal stability of the fluororubber are further improved; the PTFE modified fluororubber special-shaped sealing piece for semiconductors prepared by the application has the excellent properties of high strength, corrosion resistance, aging resistance, high temperature resistance and high damping.

Description

Technical Field

[0001] This invention relates to the field of sealing rings, and in particular to a method for preparing a PTFE-modified fluororubber shaped seal for semiconductor applications. Background Technology

[0002] Semiconductor seals are materials or parts used to prevent fluid or solid particles from leaking between adjacent mating surfaces and to prevent external impurities such as dust and moisture from entering the interior of machinery and equipment.

[0003] Although small, rubber and plastic seals play a crucial role in the national economy, serving as fundamental components and accessories in major sectors such as defense, chemical, petroleum, coal, transportation, and machinery manufacturing. In recent years, with rapid economic growth, the rubber and plastic seal manufacturing industry has maintained double-digit growth.

[0004] CN202011117667.1 relates to the field of sealing ring processing technology and discloses a rubber sealing ring manufacturing process, including a shell, an acoustic rebound material fixedly connected inside the shell, a protective shell movably connected inside the acoustic rebound material, a vibrating block fixedly connected to the inner wall of the protective shell, a top component mechanism movably connected to the lower end of the vibrating block, a fixing ring sleeved on the outer surface of the top component mechanism, a cam rollingly connected to the lower end of the top component mechanism, a disk fixedly connected to the rear end of the cam, a belt movably connected to the outer surface of the disk, a heat-absorbing ring movably connected inside the belt, and an airbag movably connected inside the heat-absorbing ring. Through continuous impact, the generated sound waves propagate within the acoustic rebound material and then propagate in another direction after rebounding from the material, thereby destroying internal air bubbles during the molding of the rubber ring, achieving a tight internal structure.

[0005] CN202111242082.7 discloses an FFKM sealing ring for wafer fabrication process cavity application systems and its preparation method, belonging to the field of semiconductor chip manufacturing. The raw materials for making this FFKM sealing ring include the following components in parts by weight: 100 parts FFKM raw rubber, and 0.5-1.5 parts TR131. The FFKM sealing ring of this invention possesses high physical and mechanical properties, excellent pressure-transformation performance, superior resistance to media, excellent cleanliness, and good plasma resistance. Its FFKM rubber compound is easy to mix and vulcanize, has a long scorch time for easy production operation, and is widely used for sealing in wafer fabrication process cavity application systems.

[0006] CN202210633884.9: A large-size fluororubber sealing ring and its preparation method are proposed. The preparation method includes: connecting multiple semi-vulcanized fluororubber sealing strips end-to-end using unvulcanized fluororubber sealing strips to form the large-size fluororubber sealing ring; wherein the vulcanizing agent of the fluororubber sealing strips includes a vulcanizing activator for improving the connection performance between the unvulcanized and semi-vulcanized fluororubber sealing strips. The fluororubber sealing ring of this invention can firmly connect multiple fluororubber sealing strips into a large-size fluororubber sealing ring without the use of adhesives, reducing the manufacturing cost of mold design while meeting the high sealing strength requirements of large-size fluororubber sealing rings.

[0007] The seals prepared by the above patents and existing technologies have insufficient mechanical properties, such as low strength and low damping. At the same time, they are also slightly lacking in physical and chemical properties such as high temperature resistance, aging resistance, and resistance to media corrosion. Summary of the Invention

[0008] To address the above problems, this invention provides a method for preparing a PTFE-modified fluororubber profiled seal for semiconductor applications, comprising the following steps:

[0009] S1: Turn on the mixer and set the temperature to 40-45℃. Add 85-100 parts of fluororubber to the internal mixer and mix for 1-2 minutes. Then add 5-15 parts of reinforcement, 4-8 parts of reinforcing filler, 1-3 parts of acid absorber, 1-2 parts of vulcanizing agent, 0.5-1.5 parts of vulcanization accelerator, 1-3 parts of crosslinking agent, and 1-2 parts of softener in sequence. Continue mixing for 30-60 minutes and then take out the rubber compound. Pass the rubber through the open mill multiple times, make triangular bags, mix evenly, and let it stand at room temperature for 20-24 hours.

[0010] S2: Preparatory stage before vulcanization, metal irregular parts, bonded to rubber with glue.

[0011] S3: The first stage of vulcanization uses two flat molds, one upper and one lower, plus a special-shaped mold. The vulcanization temperature is 160-170℃, the time is 10-15min, and the pressure is 100-200Mpa.

[0012] S4: The second stage of vulcanization is carried out in a vacuum oven at a temperature of 250-290℃ for 16-24 hours to obtain PTFE-modified fluororubber shaped seals for semiconductors.

[0013] The acid absorbent is one or a mixture of magnesium oxide, calcium hydroxide, zinc oxide, and calcium oxide.

[0014] The vulcanization accelerator is one or a mixture of triallyl isocyanurate or triallyl cyanurate.

[0015] The reinforcing filler is one or more of carbon black, titanium dioxide, silica, light calcium carbonate, and kaolin.

[0016] The vulcanizing agent is one or a mixture of more than one of 2,5-dimethyl-2,5-di-tert-butylperoxyhexane or dicumyl peroxide.

[0017] The crosslinking agent is one or a mixture of one or more of the following: epoxy silane coupling agent KH560, vinyl silane coupling agent A172, amino silane coupling agent KH540, sulfur-containing silane coupling agent KH590, and acyloxy silane coupling agent KH570.

[0018] The softening agent is one or a mixture of more than one of pine tar, paraffin oil, naphthenic oil, aromatic oil, and CZ-S reagent.

[0019] The reinforcement is coated modified PTFE.

[0020] Furthermore, the method for coating modified PTFE is as follows:

[0021] S1: Mix 5-10 parts by weight of mercaptosilane with 500-800 parts by weight, add to a reaction vessel, purge with nitrogen, add 0.1-1 parts by weight of PTFE, ultrasonically disperse evenly, and stir at 60-70°C for 30-60 minutes.

[0022] S2: Add 1-4 parts of hexafluorobutyl acrylate and 3-8 parts of sodium ethoxide, stir and react at 60-70℃ for 1-4 hours, then add 2-5 parts of allyl borate pinacol ester, continue stirring and reacting for 30-60 minutes, filter the product and dry to obtain coated modified PTFE.

[0023] The mercaptosilanes mentioned include one or more of mercaptopropyltrimethoxysilane, mercaptomethyltrimethoxysilane, and mercaptomethyldimethoxymethylsilane.

[0024] The stirring rate is 300-500 rpm.

[0025] Reaction mechanism:

[0026] The PTFE treated with mercaptosilane undergoes a further addition reaction between its mercapto groups and hexafluorobutyl acrylate and allyl borate pinacol ester to obtain coated modified PTFE. The hexafluorobutyl and pinacol borate functional groups have improved compatibility with fluororubber, are uniformly dispersed in the molten state, and are not easily precipitated, thus improving the reinforcing effect of fluororubber composites.

[0027] Technical effects:

[0028] The preparation method of the PTFE-modified fluororubber irregular-shaped seal for semiconductors according to the present invention has the following significant advantages compared with the prior art:

[0029] 1. The unique molecular structure of PTFE endows it with high hardness, high modulus, and high melting point, as well as excellent properties such as chemical corrosion resistance, aging resistance, high temperature resistance, and radiation resistance. This allows it to meet special environmental requirements, especially in marine environments. In addition to meeting chemical properties such as oil resistance, seawater resistance, ozone resistance, high temperature resistance, thermo-oxidative aging resistance, and radiation resistance, materials also need to possess sufficient mechanical properties such as compression resistance, impact resistance, and fatigue resistance. Combining PTFE with fluororubber achieves complementary and enhanced performance advantages of both materials. This allows fluororubber to maintain its original excellent properties while further improving the mechanical strength, oil resistance, thermo-oxidative aging resistance, and thermal stability of the matrix.

[0030] 2. The PTFE-modified fluororubber shaped seal for semiconductors prepared by this invention has excellent properties such as high strength, corrosion resistance, aging resistance, high temperature resistance and high damping. Attached Figure Description

[0031] Figure 1 For PTFE-modified fluororubber profiled seals used in semiconductors. Detailed Implementation

[0032] The invention will be further illustrated below through specific embodiments:

[0033] Mechanical property tests were conducted on a universal testing machine.

[0034] The tensile test was conducted according to the national standard GB / T528-1995. The specimens were cut into dumbbell shapes with a length of 25 mm ± 0.5 mm, and the hijacker moving speed was 500 mm / min. The tensile test was divided into 6 groups, with 3 specimens stretched in each group and the average value was taken as the final result. All tests were conducted at room temperature.

[0035] Compression tests were conducted according to the national standard GB / T7757-2009. The specimens were prepared as cylinders with a diameter of 29 mm and a height of 12.5 mm. The specimens were compressed at a speed of 10 mm / min until the strain reached 25%, and then relaxed at the same speed. This process was repeated three times. The compressive modulus and static stiffness of the specimens were calculated based on the stress-strain curve from the third compression test. The compression tests were conducted in six groups, with three specimens compressed in each group, and the average value was taken as the final result. All tests were performed at room temperature.

[0036] The hardness test was conducted according to the national standard GB / T531.1-2008. The sample was made into a cylinder with a height of 10 mm, and the hardness of the material was tested using an LX-A type Shore hardness tester. The hardness test was divided into 6 groups, with 1 sample in each group. The hardness value was measured 5 times at different positions at least 6 mm apart on the sample, and the median value was taken as the experimental result.

[0037] Example 1

[0038] A method for preparing a PTFE-modified fluororubber profiled seal for semiconductor applications, comprising the following steps:

[0039] S1: Turn on the mixer and set the temperature to 40℃. Add 85g of fluororubber to the internal mixer and mix for 1 minute. Then add 5g of reinforcement, 4g of reinforcing filler, 1g of acid absorber, 1g of vulcanizing agent, 0.5g of vulcanization accelerator, 1g of crosslinking agent, and 1g of softener in sequence. Continue mixing for 30 minutes and then take out the rubber compound. Pass the rubber through the open mill multiple times, make triangular bags, mix evenly, and let it stand at room temperature for 20 hours.

[0040] S2: Preparatory stage before vulcanization, metal irregular parts, bonded to rubber with glue.

[0041] S3: The first stage of vulcanization uses two flat molds, one upper and one lower, plus an irregularly shaped mold. The first stage vulcanization temperature is 160℃, the time is 10min, and the pressure is 100Mpa.

[0042] S4: The second stage of vulcanization is carried out in a vacuum oven at a temperature of 250°C for 16 hours to obtain a PTFE-modified fluororubber shaped seal for semiconductors.

[0043] The acid absorbent mentioned is magnesium oxide.

[0044] The vulcanization accelerator is triallyl isocyanurate.

[0045] The reinforcing filler is carbon black.

[0046] The vulcanizing agent is 2,5-dimethyl-2,5-di-tert-butylperoxyhexane.

[0047] The crosslinking agent is an epoxy silane coupling agent, specifically KH560.

[0048] The softener mentioned is pine tar.

[0049] The reinforcement is coated modified PTFE.

[0050] Furthermore, the method for coating modified PTFE is as follows:

[0051] S1: Mix 5g mercaptosilane with 500g ethanol, add to a reaction vessel, purge with nitrogen, add 0.1g PTFE, ultrasonically disperse evenly, and stir at 60℃ for 30 minutes;

[0052] S2: Add 1g of hexafluorobutyl acrylate and 3g of sodium ethoxide, stir at 60°C for 1 hour, then add 2g of allyl borate pinacol ester, continue stirring for 30 minutes, filter the product and dry to obtain coated modified PTFE.

[0053] The mercaptosilane mentioned is mercaptopropyltrimethoxysilane.

[0054] The stirring rate is 300 rpm.

[0055] Example 2

[0056] A method for preparing a PTFE-modified fluororubber profiled seal for semiconductor applications, comprising the following steps:

[0057] S1: Turn on the mixer and set the temperature to 40℃. Add 90g of fluororubber to the internal mixer and mix for 1 minute. Then add 7g of reinforcement, 5g of reinforcing filler, 2g of acid absorber, 1.5g of vulcanizing agent, 1g of vulcanization accelerator, 2g of crosslinking agent, and 1.5g of softener in sequence. Continue mixing for 40 minutes and then take out the rubber compound. Pass the rubber through the open mill multiple times, make triangular bags, mix evenly, and let it stand at room temperature for 21 hours.

[0058] S2: Preparatory stage before vulcanization, metal irregular parts, bonded to rubber with glue.

[0059] S3: The first stage of vulcanization uses two flat molds, one upper and one lower, plus a special-shaped mold. The first stage vulcanization temperature is 165℃, the time is 12min, and the pressure is 150Mpa.

[0060] S4: The second stage of vulcanization is carried out in a vacuum oven at a temperature of 260°C for 18 hours to obtain a PTFE-modified fluororubber shaped seal for semiconductors.

[0061] The acid absorbent is calcium hydroxide.

[0062] The vulcanization accelerator is triallyl isocyanurate.

[0063] The reinforcing filler is titanium dioxide.

[0064] The vulcanizing agent is 2,5-dimethyl-2,5-di-tert-butylperoxyhexane.

[0065] The crosslinking agent is a vinyl silane coupling agent, specifically A172.

[0066] The softener is paraffin oil.

[0067] The reinforcement is coated modified PTFE.

[0068] Furthermore, the method for coating modified PTFE is as follows:

[0069] S1: Mix 7g mercaptosilane with 600g ethanol, add to a reaction vessel, purge with nitrogen, then add 0.4g PTFE, ultrasonically disperse evenly, and stir at 65℃ for 40 minutes;

[0070] S2: Add 2g of hexafluorobutyl acrylate and 4g of sodium ethoxide, stir at 65°C for 2 hours, then add 3g of allyl borate pinacol ester, continue stirring for 40 minutes, filter the product and dry to obtain coated modified PTFE.

[0071] The mercaptosilane mentioned is mercaptomethyltrimethoxysilane.

[0072] The stirring rate is 400 rpm.

[0073] Example 3

[0074] A method for preparing a PTFE-modified fluororubber profiled seal for semiconductor applications, comprising the following steps:

[0075] S1: Turn on the mixer and set the temperature to 45℃. Add 95g of fluororubber to the internal mixer and mix for 2 minutes. Then add 12g of reinforcement, 7g of reinforcing filler, 2g of acid absorber, 1.5g of vulcanizing agent, 1g of vulcanization accelerator, 2g of crosslinking agent, and 1.5g of softener in sequence. Continue mixing for 50 minutes and then take out the rubber compound. Pass the rubber through the open mill multiple times, make triangular bags, mix evenly, and let it stand at room temperature for 23 hours.

[0076] S2: Preparatory stage before vulcanization, metal irregular parts, bonded to rubber with glue.

[0077] S3: The first stage of vulcanization uses two flat molds, one upper and one lower, plus a special-shaped mold. The first stage vulcanization temperature is 165℃, the time is 14min, and the pressure is 150Mpa.

[0078] S4: The second stage of vulcanization is carried out in a vacuum oven at a temperature of 280°C for 22 hours to obtain a PTFE-modified fluororubber shaped seal for semiconductors.

[0079] The acid absorbent mentioned is zinc oxide.

[0080] The vulcanization accelerator is triallyl cyanurate.

[0081] The reinforcing filler is silica.

[0082] The vulcanizing agent is dicumyl peroxide.

[0083] The crosslinking agent is an aminosilane coupling agent, KH540.

[0084] The softener is a naphthenic oil.

[0085] The reinforcement is coated modified PTFE.

[0086] Furthermore, the method for coating modified PTFE is as follows:

[0087] S1: Mix 9g mercaptosilane with 700g ethanol, add to a reaction vessel, purge with nitrogen, then add 0.9g PTFE, ultrasonically disperse evenly, and stir at 65℃ for 50 minutes;

[0088] S2: Add 3g of hexafluorobutyl acrylate and 7g of sodium ethoxide, stir at 65°C for 3 hours, then add 4g of allyl borate pinacol ester, continue stirring for 50 minutes, filter the product and dry to obtain coated modified PTFE.

[0089] The mercaptosilane mentioned is mercaptomethyltrimethoxysilane.

[0090] The stirring rate is 400 rpm.

[0091] Example 4

[0092] A method for preparing a PTFE-modified fluororubber profiled seal for semiconductor applications, comprising the following steps:

[0093] S1: Turn on the mixer and set the temperature to 45℃. Add 100g of fluororubber to the internal mixer and mix for 2 minutes. Then add 15g of reinforcement, 8g of reinforcing filler, 3g of acid absorber, 2g of vulcanizing agent, 1.5g of vulcanization accelerator, 3g of crosslinking agent, and 2g of softener in sequence. Continue mixing for 60 minutes and then take out the rubber compound. Pass the rubber through the open mill multiple times, make triangular bags, mix evenly, and let it stand at room temperature for 24 hours.

[0094] S2: Preparatory stage before vulcanization, metal irregular parts, bonded to rubber with glue.

[0095] S3: The first stage of vulcanization uses two flat molds, one upper and one lower, plus an irregularly shaped mold. The first stage vulcanization temperature is 170℃, the time is 15min, and the pressure is 200Mpa.

[0096] S4: The second stage of vulcanization is carried out in a vacuum oven at a temperature of 290°C for 24 hours to obtain a PTFE-modified fluororubber shaped seal for semiconductors.

[0097] The acid absorbent mentioned is calcium oxide.

[0098] The vulcanization accelerator is triallyl cyanurate.

[0099] The reinforcing filler is light calcium carbonate.

[0100] The vulcanizing agent is dicumyl peroxide.

[0101] The crosslinking agent is a sulfur-containing silane coupling agent, KH590.

[0102] The softening agent is CZ-S reagent.

[0103] The reinforcement is coated modified PTFE.

[0104] Furthermore, the method for coating modified PTFE is as follows:

[0105] S1: Mix 10g mercaptosilane with 800g ethanol, add to a reaction vessel, purge with nitrogen, add 1g PTFE, ultrasonically disperse evenly, and stir at 70℃ for 60 minutes.

[0106] S2: Add 4g of hexafluorobutyl acrylate and 8g of sodium ethoxide, stir at 70°C for 4 hours, then add 5g of allyl borate pinacol ester, continue stirring for 60 minutes, filter the product and dry to obtain coated modified PTFE.

[0107] The mercaptosilane mentioned is mercaptomethyldimethoxymethylsilane.

[0108] The stirring rate is 500 rpm.

[0109] Comparative Example 1

[0110] Pure fluororubber.

[0111] Comparative Example 2

[0112] A method for preparing a PTFE-modified fluororubber profiled seal for semiconductor applications, comprising the following steps:

[0113] S1: Turn on the internal mixer, set the temperature to 40℃, add 85g of fluororubber to the internal mixer, mix for 1 minute, then add 4g of reinforcing filler, 1g of acid absorber, 1g of vulcanizing agent, 0.5g of vulcanization accelerator, 1g of crosslinking agent and 1g of softener in sequence, continue to mix for 30 minutes, take out the rubber compound, pass it through the open mill several times, make triangular bags, mix evenly, and let it stand at room temperature for 20 hours;

[0114] S2: Preparatory stage before vulcanization, metal irregular parts, bonded to rubber with glue.

[0115] S3: The first stage of vulcanization uses two flat molds, one upper and one lower, plus an irregularly shaped mold. The first stage vulcanization temperature is 160℃, the time is 10min, and the pressure is 100Mpa.

[0116] S4: The second stage of vulcanization is carried out in a vacuum oven at a temperature of 250°C for 16 hours to obtain a PTFE-modified fluororubber shaped seal for semiconductors.

[0117] The acid absorbent mentioned is magnesium oxide.

[0118] The vulcanization accelerator is triallyl isocyanurate.

[0119] The reinforcing filler is carbon black.

[0120] The vulcanizing agent is 2,5-dimethyl-2,5-di-tert-butylperoxyhexane.

[0121] The crosslinking agent is an epoxy silane coupling agent, specifically KH560.

[0122] The softener mentioned is pine tar.

[0123] Comparative Example 3

[0124] A method for preparing a PTFE-modified fluororubber profiled seal for semiconductor applications, comprising the following steps:

[0125] S1: Turn on the internal mixer, set the temperature to 40℃, add 85g of fluororubber to the internal mixer, mix for 1 minute, then add 5g of reinforcement, 4g of reinforcing filler, 1g of acid absorber, 1g of vulcanizing agent, 0.5g of vulcanization accelerator, 1g of crosslinking agent and 1g of softener in sequence, continue to mix for 30 minutes, take out the rubber compound, pass it through the open mill several times, make triangular bags, mix evenly, and let it stand at room temperature for 20 hours;

[0126] S2: Preparatory stage before vulcanization, metal irregular parts, bonded to rubber with glue.

[0127] S3: The first stage of vulcanization uses two flat molds, one upper and one lower, plus an irregularly shaped mold. The first stage vulcanization temperature is 160℃, the time is 10min, and the pressure is 100Mpa.

[0128] S4: The second stage of vulcanization is carried out in a vacuum oven at a temperature of 250°C for 16 hours to obtain a PTFE-modified fluororubber shaped seal for semiconductors.

[0129] The acid absorbent mentioned is magnesium oxide.

[0130] The vulcanization accelerator is triallyl isocyanurate.

[0131] The reinforcing filler is carbon black.

[0132] The vulcanizing agent is 2,5-dimethyl-2,5-di-tert-butylperoxyhexane.

[0133] The crosslinking agent is an epoxy silane coupling agent, specifically KH560.

[0134] The softener mentioned is pine tar.

[0135] The reinforcement is coated modified PTFE.

[0136] Furthermore, the method for coating modified PTFE is as follows:

[0137] S1: Mix 5g mercaptosilane with 500g ethanol, add to a reaction vessel, purge with nitrogen, add 0.1g PTFE, ultrasonically disperse evenly, and stir at 60℃ for 30 minutes;

[0138] S2: Add 3g of sodium ethoxide, stir at 60℃ for 1 hour, then add 2g of allyl borate pinacol ester, continue stirring for 30 minutes, filter the product and dry to obtain coated modified PTFE.

[0139] The mercaptosilane mentioned is mercaptopropyltrimethoxysilane.

[0140] The stirring rate is 300 rpm.

[0141]

[0142]

Claims

1. A method for preparing a PTFE-modified fluororubber profiled seal for semiconductor applications, comprising the following steps: S1: Turn on the mixer and set the temperature to 40-45℃. Add 85-100 parts of fluororubber to the internal mixer and mix for 1-2 minutes. Then add 5-15 parts of reinforcement, 4-8 parts of reinforcing filler, 1-3 parts of acid absorber, 1-2 parts of vulcanizing agent, 0.5-1.5 parts of vulcanization accelerator, 1-3 parts of crosslinking agent, and 1-2 parts of softener in sequence. Continue mixing for 30-60 minutes and then take out the rubber compound. Pass the rubber through the open mill multiple times, make triangular bags, mix evenly, and let it stand at room temperature for 20-24 hours. S2: Pre-vulcanization preparation, metal irregular parts, bonded to rubber with glue; S3: The first stage of vulcanization uses two flat molds, one upper and one lower, plus an irregularly shaped mold. The vulcanization temperature is 160-170℃, the time is 10-15min, and the pressure is 100-200MPa. S4: The second stage of vulcanization is carried out in a vacuum oven at a temperature of 250-290℃ for 16-24 hours to obtain PTFE-modified fluororubber profiled seals for semiconductors. The reinforcement is coated modified PTFE; The preparation method of the coated modified PTFE is as follows: S1: Mix 5-10 parts by weight of mercaptosilane with 500-800 parts by weight, add to a reaction vessel, purge with nitrogen, add 0.1-1 parts by weight of PTFE, ultrasonically disperse evenly, and stir at 60-70°C for 30-60 minutes. S2: Add 1-4 parts of hexafluorobutyl acrylate and 3-8 parts of sodium ethoxide, stir and react at 60-70℃ for 1-4 hours, then add 2-5 parts of allyl borate pinacol ester, continue stirring and reacting for 30-60 minutes, filter the product and dry to obtain coated modified PTFE. The mercaptosilanes mentioned include one or more of mercaptopropyltrimethoxysilane, mercaptomethyltrimethoxysilane, and mercaptomethyldimethoxymethylsilane.

2. The method for preparing a PTFE-modified fluororubber profiled seal for semiconductors according to claim 1, characterized in that: The acid absorbent is one or a mixture of magnesium oxide, calcium hydroxide, zinc oxide, and calcium oxide.

3. The method for preparing a PTFE-modified fluororubber profiled seal for semiconductors according to claim 1, characterized in that: The vulcanization accelerator is one or a mixture of triallyl isocyanurate or triallyl cyanurate.

4. The method for preparing a PTFE-modified fluororubber profiled seal for semiconductors according to claim 1, characterized in that: The reinforcing filler is one or more of carbon black, titanium dioxide, silica, light calcium carbonate, and kaolin.

5. The method for preparing a PTFE-modified fluororubber profiled seal for semiconductors according to claim 1, characterized in that: The vulcanizing agent is one or a mixture of more than one of 2,5-dimethyl-2,5-di-tert-butylperoxyhexane or dicumyl peroxide.

6. The method for preparing a PTFE-modified fluororubber profiled seal for semiconductors according to claim 1, characterized in that: The softening agent is one or a mixture of more than one of pine tar, paraffin oil, naphthenic oil, aromatic oil, and CZ-S reagent.

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