Early warning method and device based on junction temperature sensor

Abstract

The present application provides an early warning method and device based on a junction temperature sensor. After obtaining the sampled temperatures of a chip under test collected by the junction temperature sensor within a preset number of sampling periods, the method performs temperature processing on the sampled temperatures for the preset number of sampling periods in the order of sampling time. If the temperature processing result shows that the sampled temperatures for the preset number of sampling periods remain rising in the order of sampling time, the time required to reach a preset overheating alarm temperature is determined based on the total sampling duration and sampled temperatures corresponding to the preset number of sampling periods. If the time required to reach the preset overheating alarm temperature is not greater than the configured early warning duration, an overheating alarm signal is generated, and the overheating alarm signal is outputted via an alarm device. This method can output an overheating alarm signal before the temperature reaches a level that would damage the chip under test, thereby preventing the chip under test from being damaged due to overheating.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an early warning method and device based on a junction temperature sensor. Background Art

[0002] Chips like SOCs often have one or more die temperature sensors (DTS) inside to measure the internal core temperature. These sensors, primarily composed of a PN junction, are also called junction temperature sensors. When the chip temperature exceeds a threshold, they generate an alarm signal.

[0003] When the chip outputs an alarm signal due to overheating exceeding the threshold, the software can take measures to reduce the computing load; or the hardware can completely cut off power to protect the chip.

[0004] However, if a latch-up effect occurs in the chip or the external power supply suddenly loses control, the internal temperature of the chip will rise sharply. In this case, the chip is often damaged due to overheating before the junction temperature sensor outputs an alarm signal. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide an early warning method and device based on a junction temperature sensor, so as to solve the above-mentioned problems existing in the prior art and obtain the remaining charging time with high accuracy.

[0006] In a first aspect, a junction temperature sensor-based early warning method is provided, which is applied to a temperature alarm controller of an alarm system. The alarm system also includes a junction temperature sensor, a chip under test, and an alarm device. The method may include:

[0007] Obtaining the sampled temperature of the chip under test collected by the junction temperature sensor within a preset number of sampling periods; the preset number is an integer not less than 3;

[0008] Performing temperature processing on the sampled temperatures of the preset number of sampling periods in the order of sampling time to obtain a temperature processing result;

[0009] If the temperature processing result shows that the sampling temperature of the preset number of sampling periods remains in an increasing state according to the order of sampling time, then the time required to reach the preset overheat alarm temperature is determined based on the total sampling time and sampling temperature corresponding to the preset number of sampling periods;

[0010] If the time required to reach the preset overheat alarm temperature is not greater than the configured advance alarm time, an overheat alarm signal is generated, and the overheat alarm signal is output through the alarm device.

[0011] In a second aspect, an early warning device based on a junction temperature sensor is provided, which is applied to a temperature alarm controller of an alarm system. The alarm system also includes a junction temperature sensor, a chip under test, and an alarm device. The device may include:

[0012] An acquiring unit, configured to acquire the sampled temperature of the chip under test collected by the junction temperature sensor within a preset number of sampling periods; the preset number is an integer not less than 3;

[0013] a temperature processing unit, configured to perform temperature processing on the sampled temperatures of the preset number of sampling periods in the order of sampling time to obtain a temperature processing result;

[0014] a determining unit configured to determine, if the temperature processing result shows that the sampled temperatures for the preset number of sampling periods remain in an increasing state according to the chronological order of the sampling times, a time required to reach a preset overheat alarm temperature based on the total sampling duration and the sampled temperatures corresponding to the preset number of sampling periods;

[0015] The generating unit is configured to generate an overheating alarm signal if the time required to reach the preset overheating alarm temperature is not greater than the configured advance alarm time, so as to output the overheating alarm signal through the alarm device.

[0016] In a third aspect, an electronic device is provided, the electronic device including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other via the communication bus;

[0017] Memory for storing computer programs;

[0018] The processor is configured to implement any of the method steps described in the first aspect when executing a program stored in the memory.

[0019] In a fourth aspect, a computer-readable storage medium is provided, wherein a computer program is stored in the computer-readable storage medium, and when the computer program is executed by a processor, any of the method steps described in the first aspect is implemented.

[0020] The junction temperature sensor-based early warning method provided in an embodiment of the present application obtains the sampled temperatures of the chip under test collected by the junction temperature sensor within a preset number of sampling periods, then performs temperature processing on the sampled temperatures for the preset number of sampling periods in the order of sampling time to obtain a temperature processing result. If the temperature processing result shows that the sampled temperatures for the preset number of sampling periods remain rising in the order of sampling time, the time required to reach the preset overheating alarm temperature is determined based on the total sampling time and the sampled temperatures corresponding to the preset number of sampling periods. If the time required to reach the preset overheating alarm temperature is not greater than the configured early warning time, an overheating alarm signal is generated and outputted via an alarm device. This method can output an overheating alarm signal before the temperature reaches a level that would damage the chip under test, thereby preventing damage to the chip under test due to overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 This is a diagram of the architecture of an alarm system using an early warning method based on a junction temperature sensor provided in an embodiment of the present application;

[0023] Figure 2 A schematic flow chart of an early warning method based on a junction temperature sensor provided in an embodiment of the present application;

[0024] Figure 3 A schematic diagram of a temperature treatment process provided in an embodiment of the present application;

[0025] Figure 4 A schematic structural diagram of an early warning device based on a junction temperature sensor provided in an embodiment of the present application;

[0026] Figure 5 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0028] The early warning method based on the junction temperature sensor provided in the embodiment of the present application can be applied in Figure 1 In the alarm system architecture shown in Figure 1 As shown, the alarm system may include: a temperature alarm controller, a junction temperature sensor DTS, a chip under test, and an alarm device.

[0029] The junction temperature sensor is used to collect the temperature of the chip under test at a preset sampling rate according to the configured sampling period and send the collected temperature to the temperature alarm controller;

[0030] A temperature alarm controller, configured to execute the junction temperature sensor-based early warning method of the present application based on the received collected temperature and generate an overheating alarm signal;

[0031] An alarm device is used to output an overheating alarm signal; wherein, the alarm device can use different devices according to the signal form of the overheating alarm signal. For example, if the overheating alarm signal is a sound signal, the alarm device can be a buzzer; if the overheating alarm signal is a light signal, the alarm device can be a prompt light; if the overheating alarm signal is an electrical signal, the alarm device can be a terminal device held by the management personnel to receive the overheating alarm signal in text form.

[0032] It can be seen that the early warning method based on the junction temperature sensor provided in the embodiment of the present application can output an overheating warning signal before the temperature reaches a level that damages the chip under test, thereby preventing the chip under test from being damaged due to overheating.

[0033] Before describing the early warning method of the present application in detail, it is necessary to explain the thermodynamic formula and the need to pre-configure some parameter data for the prediction chip.

[0034] (1) Thermodynamic formula:

[0035] Heat Q = heating power P × time Δt, and heat Q = specific heat capacity C × mass M × temperature difference ΔT;

[0036] It can be deduced that: time Δt = specific heat capacity C × mass M × temperature difference ΔT / heating power P.

[0037] Simplified to: time Δt = k × temperature difference ΔT;

[0038] Where k is the heating coefficient, k = specific heat capacity C × mass M / heating power P. Since specific heat capacity C and mass M are constant, the heating coefficient k is inversely proportional to the heating power P. A smaller k indicates a greater heating power of the heat source (or "chip under test"). Conversely, a larger k indicates a smaller heating power. Time Δt is the time (or "duration") it takes for the uncontrolled heat source to heat the chip under test to the preset overheating warning temperature.

[0039] (2) Pre-configured parameters:

[0040] Overheat alarm temperature T hOV , such as the default 125℃;

[0041] Advance warning time t AT : For example, the default value is 1000ms;

[0042] Early warning initial control temperature T L0 : For example, the default setting is 65℃;

[0043] The number of consecutive sampling times n in a sampling cycle: For example, the default is 5 times, which can be the number of consecutive sampling times using the highest sampling rate of DTS;

[0044] The sampling interval t between two adjacent sampling cycles SP : For example, the default value is 5ms, which is the time interval between two adjacent sampling cycles;

[0045] Minimum temperature difference threshold ΔT0: For example, the default setting is 5°C. This temperature difference represents the maximum temperature difference without a runaway heat source, that is, the upper limit of the temperature difference for judging whether the chip under test is overheating.

[0046] It should be noted that the default values ​​of the above parameters can be configured according to the specifications, packaging, usage time, usage environment and actual business requirements of the chip under test, and the embodiments of the present application are not limited here.

[0047] The preferred embodiments of the present application are described below in conjunction with the drawings in the specification. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present application and are not used to limit the present application. In addition, the embodiments and features in the embodiments of the present application can be combined with each other if there is no conflict.

[0048] Figure 2 This is a flow chart of an early warning method based on a junction temperature sensor provided in an embodiment of the present application. Figure 2 As shown, applied to a temperature alarm controller, the method may include:

[0049] Step S210: obtaining the sampled temperature of the chip under test collected by the junction temperature sensor within a preset number of sampling periods.

[0050] The preset number may be an integer not less than 3.

[0051] In a specific implementation, the number of consecutive sampling times n of the junction temperature sensor in each sampling period and the candidate sampling temperature collected each time are obtained; n can be a positive integer greater than 3;

[0052] The weighted average of the n candidate sampling temperatures in each sampling period is determined as the sampling temperature TH of the corresponding sampling period. That is, one sampling period corresponds to one sampling temperature TH.

[0053] Furthermore, in order to ensure the accuracy of the sampling temperature TH of each sampling period, the maximum candidate sampling temperature and the minimum candidate sampling temperature values ​​among the n candidate sampling temperatures in each sampling period can be deleted, and the weighted average value of the remaining n-2 candidate sampling temperatures after deletion is calculated. For example, when n is 5 times by default, the weighted average value at this time is calculated for the remaining 3 candidate sampling temperatures; the calculated weighted average value is determined as the sampling temperature TH of the corresponding sampling period.

[0054] It should be noted that the subsequent plan is based on the sampling temperature of a preset number of sampling cycles in order to more accurately determine whether there is an out-of-control heat source, that is, whether the chip temperature of the chip under test exceeds the temperature threshold. The temperature threshold is the threshold for determining whether the chip is heating normally or there is an out-of-control heat source.

[0055] The number of preset quantities can be determined according to actual business needs and is not limited in this application.

[0056] Step S220 : performing temperature processing on the sampled temperatures of a preset number of sampling periods in the order of sampling time to obtain a temperature processing result.

[0057] In specific implementation, the temperature processing results can be obtained in the following two ways:

[0058] Method 1: Curve fitting is performed on the sampled temperatures of a preset number of sampling periods in the order of sampling time to obtain a temperature curve in a temperature coordinate system. The horizontal axis of the temperature coordinate system is the sampling time, and the vertical axis is the sampling temperature.

[0059] Check whether the sampling temperature of each sampling period is greater than the early warning initial control temperature T L0 ;

[0060] If any sampling temperature is not greater than T L0 , it indicates that there is no runaway heat source. The temperature processing result obtained at this time is that the sampling temperature does not keep rising for a preset number of sampling cycles in the order of sampling time. In other words, the chip under test cannot be damaged by heat at this time.

[0061] If so, obtain the slope of the curve at the sampling temperature of each sampling period, and compare the sizes of the preset number of curve slopes in the order of sampling time. If the slope of the curve increases successively, it indicates that the temperature is in a rising trend. At this time, the temperature processing result obtained is that the sampling temperature of the preset number of sampling periods in the order of sampling time remains in an rising state.

[0062] Method 2: When not in the cycle state (or "initial state"), first determine whether the sampling temperature TH0 of the initial sampling cycle is not less than the early alarm initial control temperature T L0 ; The initial sampling period is the first sampling period among the preset number of sampling periods;

[0063] If not, obtain the sampled temperature of the chip under test collected by the junction temperature sensor within a new preset number of sampling periods, and return to execute step S220; wherein the new preset number of sampling periods is a preset number of sampling periods adjacent to the preset number of sampling periods.

[0064] If so, detect whether the temperature difference between the sampling temperature TH1 of the second sampling period and the sampling temperature TH0 of the first sampling period meets the preset temperature difference condition; wherein, when not in the cycle state, the first sampling period is the initial sampling period, and the second sampling period is the next sampling period adjacent to the first sampling period;

[0065] When the temperature difference meets the preset temperature difference alarm condition, the second sampling period is determined as the new first sampling period, and the next sampling period adjacent to the second sampling period is determined as the new second sampling period, and the execution step is returned to: detecting whether the temperature difference between the sampling temperature of the second sampling period and the sampling temperature of the first sampling period meets the preset temperature difference condition, until detecting whether the temperature difference corresponding to the last two adjacent sampling periods in the preset number of sampling periods meets the preset temperature difference condition; wherein, the preset temperature difference alarm condition is the condition that the temperature difference is not less than the configured minimum temperature difference threshold ΔT0.

[0066] When the temperature difference corresponding to the last two adjacent sampling periods meets the preset temperature difference alarm condition, a temperature processing result is obtained indicating that the sampling temperatures of the preset number of sampling periods in the order of sampling time remain in an increasing state.

[0067] Furthermore, in the above execution process, when the temperature difference does not meet the preset temperature difference condition, the sampling temperature of the chip under test collected by the junction temperature sensor within a new preset number of sampling cycles is obtained, and the process returns to execute step S220; wherein, the new preset number of sampling cycles is the preset number of sampling cycles adjacent to the preset number of sampling cycles.

[0068] In one example, taking the number of sampling periods as 4, as Figure 3As shown, the four sampling periods correspond to four states, namely S0, S1, S2 and S3, and the sampling temperatures corresponding to the corresponding states are TH0, TH1, TH2 and TH3.

[0069] (1) S0 state, judge TH0 and early warning initial control temperature T L0 The size of TH0>=T L0 , enter the next state S1; otherwise, remain in the S0 state and obtain the sampled temperature of the chip under test collected by the junction temperature sensor within a new preset number of sampling cycles;

[0070] (2) In the S1 state, the temperature difference between TH1 and TH0 is determined to be greater than the minimum temperature difference threshold ΔT0. When TH1–TH0>=ΔT0, the system enters the next state S2. Otherwise, the system returns to the S0 state. That is, when TH1–TH0<ΔT0, the system returns to the S0 state and obtains the sampled temperature of the chip under test collected by the junction temperature sensor within a new preset number of sampling cycles.

[0071] (3) In the S2 state, the temperature difference between TH2 and TH1 is determined to be greater than the minimum temperature difference threshold ΔT0. When TH2–TH1>=ΔT0, the system enters the next state S3. Otherwise, the system returns to the S0 state. That is, when TH2–TH1<ΔT0, the system returns to the S0 state and obtains the sampled temperature of the chip under test collected by the junction temperature sensor within a new preset number of sampling cycles.

[0072] (4) State S3: The temperature difference between TH3 and TH2 is determined to be greater than the minimum temperature difference threshold ΔT0. When TH3–TH2>=ΔT0, the temperature processing result is obtained, i.e., state S4 is reached, which indicates that the sampling temperature of the preset number of sampling cycles is kept rising in the order of the sampling time. Otherwise, the state S0 is returned, i.e., when TH3–TH2<ΔT0, the state S0 is returned.

[0073] Step S230: Determine the time required to reach the preset overheat alarm temperature based on the temperature processing result, the total sampling time corresponding to the preset number of sampling periods, and the sampling temperature.

[0074] In a specific implementation, if the temperature processing result is that the sampling temperature of a preset number of sampling periods remains in an rising state in the order of sampling time, the heating coefficient k is determined based on the total sampling time corresponding to the preset number of sampling periods and the target sampling temperature difference corresponding to the preset number of sampling periods; wherein the total sampling time can be the sum of the time required for n samplings in each sampling period of the preset number of sampling periods and the sampling interval between two adjacent sampling periods; the target sampling temperature difference can be the difference between the sampling temperature of the last sampling period and the sampling temperature of the first sampling period.

[0075] Based on the heating coefficient k and the configured overheating alarm temperature T hOV The time Δt required to reach the preset overheat alarm temperature is obtained by combining the sampling temperature of the last sampling cycle with the sampling temperature of the last sampling cycle.

[0076] In an example, the number of sampling periods is 4, and the sampling is continuous n times in each sampling period, and the heating coefficient k = 3×(sampling interval t SP + the time required for n sampling times) / (TH3-TH0);

[0077] The time required to reach the preset overheating alarm temperature Δt = heating coefficient k×(T hOV -TH3).

[0078] Furthermore, in order to achieve early warning and reduce the possibility of damage to the chip under test, the time Δt required to reach the preset overheating warning temperature can be further shortened. Specifically:

[0079] Based on the heating coefficient k and the configured overheating alarm temperature T hOV And the sampling temperature and duration correction coefficient x of the last sampling cycle, obtain the time Δt required to reach the preset overheat alarm temperature;

[0080] Continuing the above example, Δt = heating coefficient k × (T hOV -TH3)×time correction coefficient x, where (T hOV -TH3) represents the temperature difference ΔT.

[0081] As can be seen, if the temperature difference ΔT remains constant, the heating power will remain stable, and the duration correction coefficient x can be maintained at 1, that is, x = 1. If the temperature difference ΔT gradually increases, it means that the heating power is gradually increasing, and the duration correction coefficient x is corrected downward, that is, 0 < x < 1. In other words, the duration correction coefficient x is inversely correlated with the heating power of the chip under test.

[0082] In some embodiments, the duration correction coefficient can be obtained based on a trained duration analysis model and the heat generation power of the chip under test. The duration analysis model can be obtained by training a neural network model based on the historical changing relationship between the heat generation power and the duration correction coefficient.

[0083] Alternatively, the duration correction coefficient may be obtained based on a preset mapping relationship between different duration correction coefficients and different heating powers.

[0084] It should be noted that the specific method for obtaining the duration correction coefficient can be determined according to actual business needs, and the embodiment of the present application does not limit it here.

[0085] Step S240: Generate an overheat warning signal according to the time required to reach the preset overheat warning temperature.

[0086] In the specific implementation, if the time required to reach the preset overheat alarm temperature is not longer than the configured advance alarm time, the advance alarm time t AT , an overheat alarm signal is generated to output the overheat alarm signal through the alarm device;

[0087] If the time required to reach the preset overheat alarm temperature is longer than the configured advance alarm time t AT , then obtain the sampled temperature TH of the chip under test collected by the junction temperature sensor within a new preset number of sampling periods, and return to execute step S220: perform temperature processing on the sampled temperature TH of the preset number of sampling periods in the order of sampling time; wherein the new preset number of sampling periods is the preset number of sampling periods adjacent to the preset number of sampling periods.

[0088] Step S250: Output an overheat alarm signal through the alarm device.

[0089] Send control information to the alarm device, where the control information includes an output instruction and an overheat alarm signal.

[0090] Corresponding to the above method, the embodiment of the present application also provides an early warning device based on a junction temperature sensor, such as Figure 4 As shown, the device includes:

[0091] The acquisition unit 410 is configured to acquire the sampled temperature of the chip under test collected by the junction temperature sensor within a preset number of sampling periods; the preset number is an integer not less than 3;

[0092] The temperature processing unit 420 is used to perform temperature processing on the sampled temperatures of the preset number of sampling periods in the order of sampling time to obtain a temperature processing result;

[0093] a determining unit 430 configured to determine, if the temperature processing result indicates that the sampled temperatures for the preset number of sampling periods continue to rise according to the chronological order of the sampling times, a time required to reach a preset overheat alarm temperature based on the total sampling duration and the sampled temperatures corresponding to the preset number of sampling periods;

[0094] The generating unit 440 is configured to generate an overheating alarm signal if the time required to reach the preset overheating alarm temperature is not greater than the configured advance alarm time, so as to output the overheating alarm signal through an alarm device.

[0095] The functions of each functional unit of the early warning device based on the junction temperature sensor provided in the above-mentioned embodiment of the present application can be realized through the above-mentioned method steps. Therefore, the specific working process and beneficial effects of each unit in the early warning device based on the junction temperature sensor provided in the embodiment of the present application will not be repeated here.

[0096] The present application also provides an electronic device, such as Figure 5 As shown, it includes a processor 510 , a communication interface 520 , a memory 530 and a communication bus 540 , wherein the processor 510 , the communication interface 520 , and the memory 530 communicate with each other via the communication bus 540 .

[0097] Memory 530, for storing computer programs;

[0098] The processor 510 is configured to execute the program stored in the memory 530 by performing the following steps:

[0099] Obtaining the sampled temperature of the chip under test collected by the junction temperature sensor within a preset number of sampling periods; the preset number is an integer not less than 3;

[0100] Performing temperature processing on the sampled temperatures of the preset number of sampling periods in the order of sampling time to obtain a temperature processing result;

[0101] If the temperature processing result shows that the sampling temperature of the preset number of sampling periods remains in an increasing state according to the order of sampling time, then the time required to reach the preset overheat alarm temperature is determined based on the total sampling time and sampling temperature corresponding to the preset number of sampling periods;

[0102] If the time required to reach the preset overheat alarm temperature is not greater than the configured advance alarm time, an overheat alarm signal is generated, and the overheat alarm signal is output through the alarm device.

[0103] The communication bus mentioned above can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus. This communication bus can be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one thick line is used in the figure, but this does not mean that there is only one bus or only one type of bus.

[0104] The communication interface is used for communication between the above electronic device and other devices.

[0105] The memory may include random access memory (RAM) or non-volatile memory (NVM), such as at least one disk storage. Alternatively, the memory may be at least one storage device located away from the processor.

[0106] The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components.

[0107] The implementation methods and beneficial effects of the various components of the electronic device in the above embodiments to solve the problems can be found in Figure 2 The various steps in the embodiment shown are implemented, therefore, the specific working process and beneficial effects of the electronic device provided by the embodiment of the present application are not repeated here.

[0108] In another embodiment provided in the present application, a computer-readable storage medium is also provided, which stores instructions. When the computer-readable storage medium is run on a computer, it enables the computer to execute the early warning method based on the junction temperature sensor described in any of the above embodiments.

[0109] In another embodiment provided by the present application, a computer program product including instructions is further provided. When the computer program product is executed on a computer, the computer is enabled to execute the early warning method based on the junction temperature sensor described in any one of the above embodiments.

[0110] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, systems, or computer program products. Therefore, the embodiments of the present application can be implemented in the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Furthermore, the embodiments of the present application can be implemented in the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0111] The embodiments of the present application are described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the steps in the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0112] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0113] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0114] Although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they become aware of the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0115] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the claims and their equivalents, the embodiments of the present application are also intended to include these modifications and variations.

Claims

1. An early warning method based on a junction temperature sensor, characterized in that: In a temperature alarm controller applied to an alarm system, the alarm system further includes a junction temperature sensor, a chip under test, and an alarm device, and the method includes: Obtaining the sampled temperature of the chip under test collected by the junction temperature sensor within a preset number of sampling periods; the preset number is an integer not less than 3; Performing temperature processing on the sampled temperatures of the preset number of sampling periods in the order of sampling time to obtain a temperature processing result; If the temperature processing result shows that the sampling temperature of the preset number of sampling periods remains in an increasing state according to the order of sampling time, then the time required to reach the preset overheat alarm temperature is determined based on the total sampling time and sampling temperature corresponding to the preset number of sampling periods; If the time required to reach the preset overheat alarm temperature is not greater than the configured advance alarm time, an overheat alarm signal is generated, and the overheat alarm signal is output through the alarm device.

2. The method according to claim 1, wherein Performing temperature processing on the sampled temperatures of the preset number of sampling periods in the order of sampling time to obtain temperature processing results, including: When not in the circulation state, determine whether the sampling temperature of the initial sampling period is not less than the early alarm initial control temperature; If so, detecting whether the temperature difference between the sampling temperature of the second sampling period and the sampling temperature of the first sampling period meets a preset temperature difference condition; wherein, the first sampling period that is not in a cycle state is the initial sampling period, and the second sampling period is the next sampling period adjacent to the first sampling period; When the temperature difference satisfies the preset temperature difference alarm condition, the second sampling period is determined as a new first sampling period, and the next sampling period adjacent to the second sampling period is determined as a new second sampling period, and the process returns to the step of detecting whether the temperature difference between the sampling temperature of the second sampling period and the sampling temperature of the first sampling period satisfies the preset temperature difference condition, until detecting whether the temperature difference corresponding to the last two adjacent sampling periods in the preset number of sampling periods satisfies the preset temperature difference condition; When the temperature difference corresponding to the last two adjacent sampling periods meets the preset temperature difference alarm condition, the temperature processing result is obtained, which indicates that the sampling temperatures of the preset number of sampling periods remain in an increasing state in the order of sampling time.

3. The method according to claim 2, wherein The method further comprises: When the temperature difference does not meet the preset temperature difference condition, obtain the sampling temperature of the chip under test collected by the junction temperature sensor within a new preset number of sampling periods, and return to the execution step: perform temperature processing on the sampling temperature of the preset number of sampling periods in the order of sampling time; wherein, the new preset number of sampling periods is the preset number of sampling periods adjacent to the preset number of sampling periods.

4. The method according to claim 1, wherein Obtain the sampled temperature of the chip under test collected by the junction temperature sensor within a preset number of sampling periods, including: Obtain the number of consecutive sampling times n of the junction temperature sensor in each sampling period and the candidate sampling temperature collected each time; n is a positive integer greater than 3; The weighted average of the n candidate sampling temperatures in each sampling period is determined as the sampling temperature of the corresponding sampling period.

5. The method according to claim 1, wherein Determining the time required to reach a preset overheat alarm temperature based on the total sampling time and sampling temperature corresponding to the preset number of sampling periods includes: Determining a heating coefficient according to a total sampling duration corresponding to the preset number of sampling periods and a target sampling temperature difference corresponding to the preset number of sampling periods; The target sampling temperature difference is the difference between the sampling temperature of the last sampling period and the sampling temperature of the first sampling period; Based on the heating coefficient, the configured overheat alarm temperature and the sampling temperature of the last sampling period, the time required to reach the preset overheat alarm temperature is obtained.

6. The method according to claim 5, wherein Based on the heating coefficient, the preset overheat alarm temperature, and the sampling temperature of the last sampling period, the time required to reach the preset overheat alarm temperature is obtained, including: Based on the heating coefficient, the configured overheating alarm temperature, the sampling temperature of the last sampling cycle and the duration correction coefficient, the time required to reach the preset overheating alarm temperature is obtained; wherein the duration correction coefficient is inversely correlated with the heating power of the chip under test.

7. The method according to claim 1, wherein The method further comprises: If the time required to reach the preset overheating alarm temperature is longer than the configured advance alarm time, the sampled temperature of the chip under test collected by the junction temperature sensor within a new preset number of sampling periods is obtained, and the execution step is returned to: temperature processing is performed on the sampled temperatures of the preset number of sampling periods in the order of the sampling time; wherein the new preset number of sampling periods is the preset number of sampling periods adjacent to the preset number of sampling periods.

8. An early warning device based on a junction temperature sensor, characterized in that: In a temperature alarm controller applied to an alarm system, the alarm system further includes a junction temperature sensor, a chip under test, and an alarm device, and the device includes: An acquiring unit, configured to acquire the sampled temperature of the chip under test collected by the junction temperature sensor within a preset number of sampling periods; the preset number is an integer not less than 3; a temperature processing unit, configured to perform temperature processing on the sampled temperatures of the preset number of sampling periods in the order of sampling time to obtain a temperature processing result; a determining unit configured to determine, if the temperature processing result shows that the sampled temperatures for the preset number of sampling periods remain in an increasing state according to the chronological order of the sampling times, a time required to reach a preset overheat alarm temperature based on the total sampling duration and the sampled temperatures corresponding to the preset number of sampling periods; The generating unit is configured to generate an overheating alarm signal if the time required to reach the preset overheating alarm temperature is not greater than the configured advance alarm time, so as to output the overheating alarm signal through the alarm device.

9. An electronic device, characterized in that: The electronic device includes a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other via the communication bus; Memory for storing computer programs; A processor, configured to implement the method steps described in any one of claims 1 to 7 when executing a program stored in a memory.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method steps according to any one of claims 1 to 7 are implemented.

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