Support assembly and method of manufacturing the same, display assembly, electronic device

Abstract

The application provides a support assembly, a preparation method thereof, a display assembly and an electronic device. The support assembly comprises a support and a heat-conducting member. The support has a bending region and a non-bending region. The support in the bending region has at least one through hole. The heat-conducting member is arranged in the through hole. The support assembly provided by the application has the heat-conducting member arranged in the through hole of the support in the bending region. The excellent heat conductivity of the heat-conducting member increases the heat-conducting cross-sectional area of the bending region, thereby improving the heat-conducting efficiency of the heat on both sides of the bending region, and further improving the heat dissipation performance of the support assembly and the user experience.

Description

Technical Field

[0001] This application belongs to the field of support component technology, specifically relating to support components and their preparation methods, display components, and electronic devices. Background Technology

[0002] To support foldable screens, a support structure is typically placed on the back of the screen. Furthermore, to improve the bending performance of the foldable screen, multiple through-holes are usually incorporated into the bending area of ​​the support structure. However, this reduces the heat transfer efficiency between the two sides of the through-holes. Summary of the Invention

[0003] In view of this, the first aspect of this application provides a support component, including a support member and a heat-conducting member, the support member having a bending area and a non-bending area, the support member located in the bending area having at least one through hole, and the heat-conducting member being disposed in the through hole.

[0004] The support component provided in the first aspect of this application increases the heat conduction cross-sectional area of ​​the bending area by adding a heat-conducting element inside the through hole opened in the support member in the bending area. This increases the heat conduction efficiency of heat on both sides of the bending area, thereby improving the heat dissipation performance of the support component and enhancing the user experience.

[0005] A second aspect of this application provides a method for fabricating a support component, comprising:

[0006] A support member is provided, the support member having a bent area and a non-bent area, the support member located in the bent area having at least one through hole;

[0007] A fluid thermally conductive material is provided, and the fluid thermally conductive material is disposed on one side surface of the support and covers the bending area;

[0008] A scraper is provided and disposed on one side surface of the support member;

[0009] The scraper is moved so that at least a portion of the fluid thermally conductive material is disposed within the through hole;

[0010] The fluid-state thermally conductive material solidified within the through-hole is transformed into a thermally conductive component.

[0011] The preparation method provided in the second aspect of this application is simple and low-cost. It only requires first placing a fluid thermally conductive material on the surface of the support member with through-holes, ensuring the fluid thermally conductive material covers the through-holes to provide a basis for subsequent filling. Then, a scraper is placed on the side of the support member with the fluid thermally conductive material. Moving the scraper then allows at least a portion of the fluid thermally conductive material to be placed within the through-holes. Finally, the fluid thermally conductive material placed within the through-holes is solidified, thus transforming into a thermally conductive element, thereby improving the conductivity and heat dissipation performance of the support assembly.

[0012] A third aspect of this application provides a display component, including a flexible member and a support component as provided in the first aspect of this application, wherein the flexible member has a display surface and a non-display surface disposed opposite to each other, and the support component is disposed on the non-display surface.

[0013] The display component provided in the third aspect of this application can improve the thermal conductivity and heat dissipation performance of the display component by adopting the support component provided in the first aspect of this application, thereby improving the user experience.

[0014] A fourth aspect of this application provides an electronic device including a folding assembly, a first housing, a second housing, and a display assembly as provided in a third aspect of this application, wherein the first housing and the second housing are disposed on opposite sides of the folding assembly, and the display assembly is mounted on the first housing, the second housing, and the folding assembly.

[0015] The electronic device provided in the fourth aspect of this application can improve the thermal conductivity and heat dissipation performance of the electronic device by adopting the display component provided in the third aspect of this application, thereby improving the user experience. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0017] Figure 1 This is an exploded view of the support components in one embodiment of this application.

[0018] Figure 2 for Figure 1 A partial schematic diagram of the bending area of ​​the central support component.

[0019] Figure 3 for Figure 1 A partial schematic diagram of the heat-conducting component.

[0020] Figure 4 for Figure 1 The diagram shows a cross-sectional view of the support component along the AA direction.

[0021] Figure 5This is a cross-sectional schematic diagram of the support component in another embodiment of this application.

[0022] Figure 6 This is a cross-sectional schematic diagram of the support component in another embodiment of this application.

[0023] Figure 7 This is a top view of the support member according to one embodiment of this application.

[0024] Figure 8 This is a process flow diagram of the method for preparing the support component according to one embodiment of this application.

[0025] Figures 9-13 The diagrams are for S100, S200, S300, S400, and S500, respectively.

[0026] Figure 14 This is a process flow diagram of S400 in one embodiment of this application.

[0027] Figure 15 for Figure 14 A schematic diagram corresponding to S410 in the middle.

[0028] Figure 16 This is a process flow diagram included before S200 in one embodiment of this application.

[0029] Figure 17 for Figure 16 A schematic diagram corresponding to S110 in the middle.

[0030] Figure 18 This is a process flow diagram of S200 in one embodiment of this application.

[0031] Figure 19 This is a process flow diagram included before S200 in another embodiment of this application.

[0032] Figure 20 for Figure 19 A schematic diagram corresponding to S120 in the middle.

[0033] Figure 21 This is a process flow diagram following S500 in one embodiment of this application.

[0034] Figure 22 This is a schematic diagram of the display components in one embodiment of this application.

[0035] Figure 23 This is an exploded view of an electronic device according to one embodiment of this application.

[0036] Label Explanation:

[0037] Support component-1, display component-2, electronic device-3, support member-10, bending area-10a, non-bending area-10b, through hole-100, first surface-101, second surface-102, heat-conducting component-20, heat-conducting material-21, first protective component-31, second protective component-32, first adhesive component-41, second adhesive component-42, scraping component-50, protective cover-60, receiving space-61, base plate-70, flexible component-80, display surface-801, non-display surface-802, folding component-90, first housing-91, second housing-92. Detailed Implementation

[0038] The following are preferred embodiments of this application. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

[0039] Before introducing the technical solution of this application, let's go over the technical issues of related technologies in detail.

[0040] Foldable phones, with their folding mechanism, can unfold to provide a larger display area when in use and fold down to achieve a smaller overall size when not in use, making them increasingly popular. Foldable phones typically include flexible components such as a folding screen. Because the folding screen is relatively soft, support components are usually placed on the non-display side to provide rigid support. Since the folding screen needs to be folded, to improve its bending performance—for example, minimizing creases, ensuring a smooth bending feel, and extending its lifespan—multiple through-holes are typically incorporated into the bending area of ​​the support components to enhance their bending ability.

[0041] However, creating through holes reduces the heat transfer efficiency between the two sides of the through hole. Specifically, when heat is conducted from one side of the through hole to the other (e.g., when heat is transferred along the length, width, or thickness), it passes through the through hole. The presence of the through hole significantly reduces the cross-sectional area for heat conduction when heat is transferred to the bending area, resulting in poor heat conduction efficiency when heat is conducted from one side of the through hole to the other. This leads to poor overall heat dissipation and greatly reduces the user experience.

[0042] In view of this, and to solve the above problems, this application provides a support component. Please refer to it as well. Figures 1-4 , Figure 1 This is an exploded view of the support components in one embodiment of this application. Figure 2 for Figure 1 A partial schematic diagram of the bending area of ​​the central support component. Figure 3 for Figure 1 A partial schematic diagram of the heat-conducting component. Figure 4for Figure 1 The diagram shows a cross-sectional view of the support assembly along the AA direction. This embodiment provides a support assembly 1, including a support member 10 and a heat-conducting member 20. The support member 10 has a bending region 10a and a non-bending region 10b. The support member 10 located in the bending region 10a has at least one through hole 100, and the heat-conducting member 20 is disposed in the through hole 100.

[0043] The support component 1 provided in this embodiment is mainly used for foldable electronic devices 3. Specifically, it can be installed on the flexible component 80, thereby improving the folding effect and heat dissipation effect of the flexible component 80 in addition to improving the support effect of the flexible component 80.

[0044] The support member 10 is mainly used to support the flexible member 80, thereby providing rigid support for the flexible member 80. Optionally, the material of the support member 10 includes, but is not limited to, aluminum alloy, iron alloy, magnesium alloy, or copper alloy, etc. The support member 10 has a bending area 10a and a non-bending area 10b, wherein the bending area 10a corresponds to the bending area 10a of the flexible member 80, and is mainly the area that bends during the folding and unfolding process. The non-bending area 10b corresponds to the non-bending area 10b of the flexible member 80. The non-bending area 10b does not bend during the folding and unfolding process of the support member 10. The number and position of the bending area 10a and the non-bending area 10b are not limited in this embodiment. For example, in one embodiment, the number of bending area 10a and non-bending area 10b is one, and the bending area 10a is located on one side of the non-bending area 10b. In another embodiment, there is one bending region 10a and two non-bending regions 10b, with the two non-bending regions 10b located on opposite sides of the bending region 10a. Optionally, the two non-bending regions 10b are arranged symmetrically about the bending region 10a.

[0045] In this embodiment, at least one through hole 100 can be formed on the support member 10 located in the bending area 10a. The through hole 100 is used to improve the bending effect of the bending area 10a, thereby improving the bending performance of the support member 10. This allows the support member 10 to have better support performance in the non-bending area 10b and better bending performance in the bending area 10a. In this case, the support member 10 can also be called a bendable mesh plate, and the through hole 100 can be called an etched hole, that is, a hole etched by an etching process. Optionally, the number of through holes 100 can be one or more. When the number of through holes 100 is multiple, the multiple through holes 100 are arranged in an array. Further optionally, the multiple through holes 100 include multiple rows of through holes 100 and multiple columns of through holes 100, with adjacent rows of through holes 100 staggered. Specifically, as shown... Figure 2 As shown, a portion of the through-hole 100 in the nth row corresponds precisely to the gap between two adjacent through-holes 100 in the (n+1)th row. This further improves bending performance.

[0046] Furthermore, this embodiment does not limit the shape of the through hole 100. For example, the shape of the through hole 100 can be circular, square, elliptical, racetrack-shaped, etc. Figure 2 As shown, this embodiment is only illustrated using a racetrack-shaped through hole 100. The racetrack-shaped through hole 100 gives the support assembly 1 advantages such as small creases, good bending feel, and long bending life when applied to the flexible part 80.

[0047] The thermally conductive component 20 is a component with excellent thermal conductivity. Optionally, the thermally conductive component 20 includes, but is not limited to, thermally conductive silicone, thermally conductive gel, thermally conductive grease, thermally conductive potting compound, etc. The thermally conductive component 20 is a solid material, which can be formed by curing a fluid thermally conductive material 21.

[0048] The support assembly 1 provided in this embodiment adds a heat-conducting element 20 inside the through hole 100 of the support member 10 in the bending region 10a. When heat is transferred from one side of the through hole 100 to the bending region 10a, the heat-conducting element 20 fills the pores of the through hole 100, increasing the cross-sectional area for heat conduction. Furthermore, the heat-conducting element 20 has a better heat conduction effect than the support member 10. For example, when the support assembly 1 is applied to an electronic device 3, along the length direction of the support member 10, when heat is transferred from the upper half (motherboard area) to the lower half (non-motherboard area) of the electronic device 3, the heat-conducting area of ​​the bending region 10a is increased, and the thermal conductivity of the bending region 10a is also increased. This improves the heat conduction efficiency between the upper and lower halves of the electronic device 3, thus better transferring heat from the motherboard area to the lower half, improving the heat dissipation performance of the support assembly 1, and enhancing the user experience.

[0049] Optionally, the heat-conducting component 20 also has good ductility, bending resistance and good bonding force with the etched holes, which can improve the bending performance of the support component 1 and improve the connection effect between the heat-conducting component 20 and the support component 10.

[0050] Please refer to this again. Figure 4 In this embodiment, the support member 10 has a first surface 101 and a second surface 102 arranged opposite to each other, the through hole 100 penetrates the first surface 101 and the second surface 102, one side surface of the heat-conducting member 20 is flush with the first surface 101, and the other side surface of the heat-conducting member 20 is flush with the second surface 102.

[0051] The support member 10 has a first surface 101 and a second surface 102 arranged opposite to each other, wherein the first surface 101 and the second surface 102 can be understood as the upper and lower surfaces of the support member 10. A through hole 100 penetrates the upper and lower surfaces of the support member 10 and extends along the width direction of the support member 10. This embodiment not only allows the heat-conducting element 20 to be disposed within the through hole 100, but also allows one side surface of the heat-conducting element 20 to be flush with the first surface 101, and the other side surface of the heat-conducting element 20 to be flush with the second surface 102. In other words, the upper and lower surfaces of the heat-conducting element 20 are flush with the upper and lower surfaces of the support member 10, thereby improving the flatness of the support assembly 1 and better supporting the flexible element 80.

[0052] Optionally, the heat-conducting element 20 is bonded to the sidewall of the through hole 100. In other words, the heat-conducting element 20 fills the entire through hole 100.

[0053] Please refer to Figure 5 , Figure 5 This is a cross-sectional schematic diagram of a support component according to another embodiment of this application. In this embodiment, the support component 1 satisfies at least one of the following conditions: the support component 1 further includes a first protective member 31, which is disposed on one side of the support component 10 and covers the bending area 10a. The support component 1 further includes a second protective member 32, which is disposed on the other side of the support component 10 and covers the bending area 10a.

[0054] This embodiment may also include a first protective member 31, which covers the bending area 10a to prevent the heat-conducting member 20 from leaking due to accidental detachment. Furthermore, the first protective member 31 can be subsequently used near the flexible member 80. Therefore, the first protective member 31 can prevent the flexible member 80 from being punctured by the ribs of the through hole 100 when it is bent. Optionally, the material of the first protective member 31 may include, but is not limited to, thermoplastic polyurethane elastomer (TPU), polyethylene terephthalate (PET), etc.

[0055] This embodiment may also include a second protective element 32, which covers the bending area 10a to prevent the heat-conducting element 20 from leaking due to accidental detachment. Furthermore, the second protective element 32 can be subsequently used near the rotating shaft. Therefore, the second protective element 32 can prevent the rotating shaft from being punctured by the ribs of the through hole 100 when the flexible element 80 is bent. Optionally, the material of the second protective element 32 may include, but is not limited to, thermoplastic polyurethane elastomer (TPU), polyethylene terephthalate (PET), etc.

[0056] Furthermore, the support assembly 1 may include only the first protective member 31, only the second protective member 32, or both the first protective member 31 and the second protective member 32. When the support assembly 1 includes both the first protective member 31 and the second protective member 32, the first protective member 31 and the second protective member 32 are located on opposite sides of the support member 10. The first protective member 31 and the second protective member 32 can cooperate with each other to clamp the heat-conducting member 20, further preventing it from falling off and leaking. This embodiment is only illustrated by the example of the support assembly 1 including both the first protective member 31 and the second protective member 32.

[0057] Please refer to Figure 6 , Figure 6 This is a cross-sectional schematic diagram of a support component according to another embodiment of this application. In this embodiment, the support component 1 satisfies at least one of the following conditions: the support component 1 further includes a first protective member 31 and a first adhesive member 41, a portion of the first protective member 31 corresponds to the non-bending region 10b, and the first adhesive member 41 is bonded between the support member 10 of the non-bending region 10b and the first protective member 31 corresponding to the non-bending region 10b. The support component 1 further includes a second protective member 32 and a second adhesive member 42, a portion of the second protective member 32 corresponds to the non-bending region 10b, and the second adhesive member 42 is bonded between the support member 10 of the non-bending region 10b and the second protective member 32 corresponding to the non-bending region 10b.

[0058] This embodiment may further include a first protective member 31 and a first adhesive member 41, wherein the first protective member 31 covers the bending area 10a and part of the non-bending area 10b. The first adhesive member 41 is bonded between the support member 10 of the non-bending area 10b and the first protective member 31 corresponding to the non-bending area 10b. In other words, the first protective member 31 of the bending area 10a serves a protective function, while the first protective member 31 of the non-bending area 10b serves a connecting function. This embodiment only controls the portion of the non-bending area 10b corresponding to the first protective member 31, which can reduce the length of the first protective member 31. That is, the first adhesive member 41 is only bonded to the area of ​​the non-bending area 10b near the bending area 10a, and the other areas of the non-bending area 10b are not provided with the first adhesive member 41 and the first protective member 31. This can reduce the cost and thickness of the support assembly 1, reserving installation space for other components.

[0059] Furthermore, there is a gap between the first protective member 31 and the support member 10 corresponding to the bending area 10a and the first adhesive member 41 is not provided, so that the bending performance of the bending area 10a is not affected and the misalignment is prevented.

[0060] This embodiment may further include a second protective member 32 and a second adhesive member 42, wherein the second protective member 32 covers the bending area 10a and part of the non-bending area 10b. The second adhesive member 42 is bonded between the support member 10 of the non-bending area 10b and the second protective member 32 corresponding to the non-bending area 10b. In other words, the second protective member 32 of the bending area 10a serves a protective function, while the second protective member 32 of the non-bending area 10b serves a connecting function. This embodiment only controls the portion of the non-bending area 10b that does not correspond to the second protective member 32, which can reduce the length of the second protective member 32. That is, the second adhesive member 42 is only bonded to the area of ​​the non-bending area 10b near the bending area 10a, and the other areas of the non-bending area 10b are not provided with the second adhesive member 42 and the second protective member 32. This can reduce the cost and thickness of the support assembly 1, reserving installation space for other components.

[0061] Furthermore, there is a gap between the second protective member 32 and the support member 10 corresponding to the bending area 10a and no second adhesive member 42 is provided, so that the bending performance of the bending area 10a is not affected and misalignment is prevented.

[0062] In addition, the support component 1 may include only the first protective member 31 and the first adhesive member 41, or only the second protective member 32 and the second adhesive member 42, or both the first protective member 31 and the second protective member 32. This embodiment is only used to illustrate the support component 1 by including the first protective member 31, the first adhesive member 41, the second protective member 32 and the second adhesive member 42.

[0063] Please refer to Figure 7 , Figure 7 This is a top view of a support member according to one embodiment of this application. In this embodiment, the support member 10 has two non-bending areas 10b, which are located on opposite sides of the bending area 10a, and also on opposite sides of the extending direction of the through hole 100.

[0064] In this embodiment, the support member 10 may have one bending region 10a and two non-bending regions 10b, and the two non-bending regions 10b may be provided on opposite sides of one bending region 10a. Simultaneously, the two non-bending regions 10b are also provided in the extending direction of the through hole 100 (e.g., ...). Figure 7 On the opposite sides of the through hole 100 (as shown in the D1 direction), in other words, the direction of the through hole 100 is perpendicular to the bending direction of the support member 10, which can further improve the bending performance of the support member 10.

[0065] Please refer to this as well. Figures 8-13 , Figure 8 This is a process flow diagram of the method for preparing the support component according to one embodiment of this application. Figures 9-13The diagrams shown correspond to steps S100, S200, S300, S400, and S500, respectively. In this embodiment, a method for manufacturing a support component 1 includes steps S100, S200, S300, S400, and S500. Detailed descriptions of steps S100, S200, S300, S400, and S500 are as follows.

[0066] Please refer to Figure 9 S100, a support member 10 is provided, the support member 10 having a bending region 10a and a non-bending region 10b, the support member 10 located in the bending region 10a having at least one through hole 100.

[0067] Please refer to Figure 10 S200, a fluid thermally conductive material 21 is provided, and the fluid thermally conductive material 21 is disposed on one side surface of the support 10 and covers the bending area 10a.

[0068] Please refer to Figure 11 S300, a scraper 50 is provided, and the scraper 50 is disposed on one side surface of the support 10.

[0069] Please refer to Figure 12 S400, the scraper 50 is moved so that at least a portion of the fluid thermally conductive material 21 is disposed within the through hole 100.

[0070] Please refer to Figure 13 S500, the fluid-state thermally conductive material 21 solidified in the through hole 100 is transformed into a thermally conductive element 20.

[0071] The preparation method provided in this embodiment is simple and low-cost. It only requires first placing a fluid thermally conductive material 21 on the surface of the support member 10 with an opening 100, ensuring the fluid thermally conductive material 21 covers the opening 100, providing a foundation for subsequent filling. Then, a scraper 50 can be placed on the side of the support member 10 with the fluid thermally conductive material 21. Moving the scraper 50 then forces at least a portion of the fluid thermally conductive material 21 into the opening 100, achieving filling. Finally, the fluid thermally conductive material 21 solidifies within the opening 100, transforming into a thermally conductive element 20, thereby improving the conductivity and heat dissipation performance of the support assembly 1. Optionally, the scraper 50 includes, but is not limited to, a scraper.

[0072] Please refer to this as well. Figures 14-15 , Figure 14 This is a process flow diagram of S400 in one embodiment of this application. Figure 15 for Figure 14The schematic diagram corresponds to S410. In this embodiment, S400, "moving the scraper 50 so that at least a portion of the fluid thermally conductive material 21 is disposed within the through hole 100", includes S410. A detailed description of S410 is as follows.

[0073] Please refer to Figure 15 S410, the scraper 50 is moved along the extending direction of the through hole 100 so that at least a portion of the fluid thermally conductive material 21 is disposed within the through hole 100.

[0074] In this embodiment, when moving the scraper 50, it can extend along the extension direction of the through hole 100 (e.g., Figure 15 The material is moved in the direction shown in D2, allowing the thermally conductive material 21 to gradually enter the through-hole 100. This prevents a large amount of thermally conductive material 21 from entering the through-hole 100 simultaneously, which could cause blockage and incomplete filling of the through-hole 100.

[0075] Please refer to this as well. Figures 16-18 , Figure 16 This is a process flow diagram included before S200 in one embodiment of this application. Figure 17 for Figure 16 A schematic diagram corresponding to S110 in the middle. Figure 18 This is a process flow diagram of S200 in one embodiment of this application. Before S200 "providing the fluid thermally conductive material 21", S110 is also included. The detailed description of S110 is as follows.

[0076] Please refer to Figure 17 S110, a protective cover 60 is provided, the protective cover 60 having a receiving space 61, the protective cover 60 is disposed on one side surface of the support member 10 and the bending area 10a corresponds to the receiving space 61;

[0077] S200 "providing a fluid-state thermally conductive material 21" includes: S210. A detailed description of S210 is as follows.

[0078] S210, the fluid thermally conductive material 21 is disposed within the receiving space 61 and covers the bending area 10a.

[0079] Before providing the thermally conductive material 21, a protective cover 60 with a receiving space 61 can be provided on the support member 10, so that the protective cover 60 covers the through hole 100 of the bending area 10a. In other words, the bending area 10a is covered by the receiving space 61. In this way, when providing the thermally conductive material 21, the thermally conductive material 21 can be directly placed in the receiving space 61. It can also be understood that in this embodiment, the protective cover 60 is used to surround the through hole 100 in the bending area 10a in the middle of the support member 10, thus limiting the filling range of the thermally conductive material 21. This not only covers the bending area 10a, but also prevents the fluid thermally conductive material 21 from flowing out of the protective cover 60 and thus contaminating other components.

[0080] Please refer to this as well. Figures 19-21 , Figure 19 This is a process flow diagram included before S200 in another embodiment of this application. Figure 20 for Figure 19 A schematic diagram corresponding to S120 in the middle. Figure 21 This is a process flow diagram following S500 in one embodiment of this application. In this embodiment, S120 is included before S200 "providing the fluid thermally conductive material 21". A detailed description of S120 is as follows.

[0081] Please refer to Figure 20 S120, a base plate 70 is provided, which abuts against the other side surface of the support member 10 and covers the bending area 10a;

[0082] Following S500, which states that "the fluid-state thermally conductive material 21 disposed within the through-hole 100 is solidified, thereby transforming into a thermally conductive element 20," the process further includes S510. A detailed description of S510 follows.

[0083] S510, Remove the base plate 70.

[0084] Before providing the thermally conductive material 21, this embodiment may also provide a base plate 70 on the surface of the support member 10 opposite to where the thermally conductive material 21 is to be placed, such that the base plate 70 abuts against the other side surface of the support member 10 and covers the bending area 10a. In this way, when the fluid thermally conductive material 21 enters the through hole 100, the base plate 70 can be used to support the thermally conductive material 21, preventing leakage. The base plate 70 can be removed after the thermally conductive material 21 has cooled and solidified.

[0085] Optionally, a functional layer may be provided on the side of the base plate 70 near the support member 10, thereby reducing the bonding effect between the heat-conducting member 20 and the base plate 70, making it easier to separate the base plate 70 from the heat-conducting member 20.

[0086] Please refer to Figure 22 , Figure 22This is a schematic diagram of a display component according to one embodiment of the present application. This embodiment provides a display component 2, including a flexible member 80 and a support component 1 as provided in the above embodiment of the present application. The flexible member 80 has a display surface 801 and a non-display surface 802 disposed opposite to each other, and the support component 1 is disposed on the non-display surface 802.

[0087] The display component 2 provided in this embodiment can improve the thermal conductivity and heat dissipation performance of the display component 2 by adopting the support component 1 provided in the above embodiment of this application, thereby improving the user experience.

[0088] Please refer to Figure 23 , Figure 23 This is an exploded view of an electronic device according to one embodiment of the present application. This embodiment provides an electronic device 3, including a folding assembly 90, a first housing 91, a second housing 92, and a display assembly 2 as provided in the above embodiments of the present application. The first housing 91 and the second housing 92 are disposed on opposite sides of the folding assembly 90, and the display assembly 2 is mounted on the first housing 91, the second housing 92, and the folding assembly 90.

[0089] The electronic device 3 provided in this embodiment includes, but is not limited to, mobile terminals such as mobile phones, tablets, laptops, PDAs, personal computers (PCs), personal digital assistants (PDAs), portable media players (PMPs), navigation devices, wearable devices, smart bracelets, and pedometers, as well as fixed terminals such as digital TVs and desktop computers. This embodiment does not limit the type of electronic device 3. The folding assembly 90 itself can fold and unfold, thereby causing the first housing 91 and the second housing 92 connected to the folding assembly 90 to fold and unfold relative to each other, and further causing the display assembly 2 to fold and unfold.

[0090] The electronic device 3 provided in this embodiment can improve the thermal conductivity and heat dissipation performance of the electronic device 3 by adopting the display component 2 provided in the above embodiment of this application, thereby improving the user experience.

[0091] The above provides a detailed description of the embodiments provided in this application. This document elucidates and explains the principles and implementation methods of this application. The above description is only intended to help understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for fabricating a support component, characterized in that, include: A support member is provided, the support member having a bent area and a non-bent area, the support member located in the bent area having at least one through hole; A protective cover is provided, the protective cover having a receiving space, the protective cover being disposed on one side surface of the support member and the bending area corresponding to the receiving space; A fluid thermally conductive material is placed within the receiving space and covers the bending area; the fluid thermally conductive material is placed on one side surface of the support and covers the bending area. A scraper is provided and disposed on one side surface of the support member; The scraper is moved so that at least a portion of the fluid thermally conductive material is disposed within the through hole; The fluid-state thermally conductive material solidified within the through-hole is transformed into a thermally conductive component.

2. The preparation method according to claim 1, characterized in that, "Moving the scraper so that at least a portion of the fluid-state thermally conductive material is disposed within the through-hole" includes: The scraper is moved along the extension direction of the through hole so that at least a portion of the fluid thermally conductive material is disposed within the through hole.

3. The preparation method according to claim 1, characterized in that, Before "places a fluid thermally conductive material within the containment space and covers the bending area", the method further includes: A base plate is provided, which abuts against the other side surface of the support member and covers the bending area; After "solidifying the fluid-state thermally conductive material disposed within the through-hole to transform it into a thermally conductive element", the process further includes: Remove the base plate.

4. A display component, characterized in that, The support assembly includes a flexible component and a support component prepared by the method of any one of claims 1-3, wherein the flexible component has a display surface and a non-display surface disposed opposite to each other, and the support component is disposed on the non-display surface.

5. An electronic device, characterized in that, The device includes a folding assembly, a first housing, a second housing, and a display assembly as described in claim 4, wherein the first housing and the second housing are disposed on opposite sides of the folding assembly, and the display assembly is mounted on the first housing, the second housing, and the folding assembly.

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