In-situ apparatus for semiconductor process modules

Abstract

Various aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in a processing chamber. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, a mechanical blade for supporting the carrier is disclosed. In another aspect, a support structure for supporting the carrier in a degas chamber is disclosed. In another aspect, a method of transporting an edge ring on a carrier is disclosed.

Description

[0001] Divisional Statement

[0002] This application is a divisional application of the Chinese Patent Application No. 201811106975.7, filed on September 21, 2018, entitled “In-Situ Equipment for Semiconductor Process Modules,” which claims priority to U.S. Provisional Patent Application No. 62 / 737, 1 10, filed on September 28, 2018, entitled “In-Situ Equipment for Semiconductor Process Modules,” the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0003] Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in a processing chamber, such as those used in semiconductor processing. BACKGROUND

[0004] In a processing chamber, such as an etch chamber, a substrate is etched while being electrostatically clamped in place. Typically, a circular portion, referred to as an edge ring, is positioned directly outside the outer diameter of the substrate to protect the upper surface of the electrostatic chuck from being etched by the etchant chemistry. The edge ring is made of several different materials and can have different shapes, both of which affect process uniformity near the edge ring. During processing, the edge ring is etched over time, resulting in a change in shape and a change in process uniformity.

[0005] To address the change in process uniformity due to edge ring degradation, the edge ring is replaced according to a schedule. Conventionally, to replace the edge ring, the processing chamber is opened to allow an operator to access the interior of the edge ring. However, this process is time consuming and can take up to 24 hours to return the process to on-line due to venting of the processing chamber.

[0006] Therefore, there is a need for new methods and apparatuses for replacing edge rings. SUMMARY

[0007] Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in a processing chamber.

[0008] In one aspect, a carrier for supporting an edge ring includes a plate having a perimeter, the perimeter including two opposing curved edges. The carrier further includes a first plurality of sockets disposed in the plate, wherein each socket is configured to receive a lift pin therein, and a second plurality of sockets disposed in the plate, wherein each socket is configured to engage with a support structure. A first arcuate support structure is coupled to one of the two opposing curved edges, the first arcuate support structure extending above a plane of an upper surface of the plate. A second arcuate support structure is coupled to the other of the two opposing curved edges, the second arcuate support structure extending above the plane of the upper surface of the plate.

[0009] In another aspect, a mechanical blade includes a base and two fingers extending from the base. A base carrier engagement feature is coupled to an upper surface of the base and finger carrier engagement features are each coupled to an upper surface of a respective one of the two fingers.

[0010] In another aspect, a method of transferring an edge ring includes inserting a mechanical blade into a chamber through a slit valve, the mechanical blade having a carrier and an edge ring on the carrier; positioning the carrier and the edge ring on the carrier on a substrate support; actuating a substrate lift pin to lift the carrier from the mechanical blade; and retracting the mechanical blade from the chamber.

[0011] In another aspect, a carrier for supporting an edge ring includes a semicircular plate. The semicircular plate has a perimeter defined by two parallel edges and two opposite curved edges coupling the two parallel edges. A first plurality of sockets is disposed in the semicircular plate, each socket configured to receive a lift pin therein. A second plurality of sockets is disposed in the semicircular plate, each socket configured to engage a support structure. A first arcuate support structure is coupled to one of the two opposite curved edges. The first arcuate support structure extends above a plane of an upper surface of the semicircular plate. A second arcuate support structure is coupled to one of the two opposite curved edges, the second arcuate support structure extending above the plane of the upper surface of the semicircular plate.

[0012] In another aspect, a mechanical blade includes a base and two fingers extending from the base. The mechanical blade further includes two end pads, wherein one of the two end pads is disposed at each distal end of one of the two fingers. The mechanical blade further includes a base pad coupled to the base and a roller configured to actuate from the base toward the two fingers.

[0013] In another aspect, a mechanical blade includes a base having a raised ridge formed on an upper surface of the base and two fingers extending from the base. Each finger has a raised ridge formed on an upper surface of the finger at a respective distal end of the finger, wherein the raised ridges formed on the upper surfaces of the two fingers and the raised ridge formed on the upper surface of the base are co-circular arcs. The mechanical blade further includes a plurality of engagement posts, wherein one of the plurality of engagement posts is formed on the upper surface of the base and one of the plurality of engagement posts is formed on the upper surface of each of the two fingers.

[0014] In another aspect, a method of transferring an edge ring includes inserting a mechanical blade into a chamber through a slit valve, the mechanical blade having a carrier and an edge ring on the carrier. The carrier and the edge ring on the carrier are positioned on a substrate support, and a substrate lift pin is actuated to lift the carrier from the mechanical blade. The mechanical blade is retracted from the chamber, and the substrate lift pin is actuated to lower the carrier toward the substrate support. A second set of lift pins is actuated to lift the edge ring from the carrier, and the mechanical blade is inserted into the chamber and engages the carrier. The carrier and the mechanical blade are removed from the chamber, and the edge ring is lowered into contact with the substrate support.

[0015] In another aspect, a support structure for supporting a substrate carrier includes a base having a first end and a second end, and a cross member disposed at the first end of the base. The cross member is disposed in the same plane as the base and has a greater width than the base. The cross member includes an opening formed therethrough, and at least two support posts extending from a surface of the cross member, the at least two support posts positioned on opposite sides of the opening. The support structure further includes a vertical member extending from the second end of the base. The vertical member extends in a direction opposite the at least two support posts of the cross member. The vertical member includes a ball bearing or contact pad at an end of the vertical member. BRIEF DESCRIPTION OF DRAWINGS

[0016] For a more detailed understanding of the foregoing features of the present disclosure, reference can be made to the more detailed description of the various aspects presented in the foregoing description in connection with the figures. It is noted, however, that the figures are merely intended to generally illustrate the example aspects, and thus, should not be construed as a limitation on the scope of the present disclosure, as the present disclosure can allow for other equally effective aspects.

[0017] Figure 1 A processing system is shown in accordance with one aspect of the present disclosure.

[0018] Figure 2A is a schematic top plan view of a carrier in accordance with one aspect of the present disclosure. Figure 2B is Figure 2A is a schematic bottom plan view of the carrier of Figures 2C-2F is Figure 2A is a schematic cross-sectional view of the carrier of

[0019] Figure 3A is a schematic top plan view of a carrier supporting an edge ring thereon. Figure 3B is Figure 3A is a schematic cross-sectional view of

[0020] Figure 4A and Figure 4B are schematic top and bottom plan views, respectively, of a mechanical blade supporting a carrier thereon according to one aspect of the present disclosure. Figure 4C and Figure 4D are schematic cross-sectional views of a mechanical blade supporting a carrier thereon according to one aspect of the present disclosure.

[0021] Figure 5A is a schematic perspective view of a mechanical blade according to one aspect of the present disclosure.

[0022] Figure 5B is a schematic perspective view of a support structure supporting a carrier according to one aspect of the present disclosure. Figure 5A schematic cross-sectional view of a mechanical blade of

[0023] Figures 6A-6I placement of an edge ring within a processing chamber is schematically illustrated according to one aspect of the present disclosure.

[0024] Figure 7 is a flow chart of a method of placing an edge ring according to one aspect of the present disclosure.

[0025] Figure 8A is a schematic view of a carrier in a degas chamber.

[0026] Figure 8B and Figure 8C are schematic perspective views of a support finger according to aspects of the present disclosure.

[0027] Figure 9 a cassette according to one aspect of the present disclosure is disclosed.

[0028] For ease of understanding, the same reference numbers have been used, where possible, to designate identical elements common to the figures. It is contemplated that elements and features of one aspect can be beneficially incorporated into other aspects without further recitation. DETAILED DESCRIPTION

[0029] Various aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in a processing chamber. In one aspect, a carrier for supporting an edge ring is disclosed. In another aspect, one or more mechanical blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degas chamber is disclosed. In yet another aspect, a method of transporting an edge ring on a carrier is disclosed.

[0030] Figure 1A processing system 100 is shown in accordance with one aspect of the present disclosure. The processing system 100 includes a factory interface 101 to which a plurality of substrate cassettes 102 can be coupled for transfer of substrates into the processing system 100. The processing system 100 further includes first vacuum ports 103a, 103b that couple the factory interface 101 to respective degas chambers 104a, 104b. Second vacuum ports 105a, 105b are coupled to the respective degas chambers 104a, 104b and disposed between the degas chambers 104a, 104b and a transfer chamber 106 to facilitate transfer of substrates into the transfer chamber 106. The transfer chamber 106 includes a plurality of process chambers 107 disposed about and coupled to the transfer chamber. The process chambers 107 are coupled to the transfer chamber 106 by respective ports 108, such as slit valves. A controller 109 controls various aspects of the processing system 100.

[0031] The process chambers 107 can include one or more of etch chambers, deposition chambers (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma enhanced versions thereof), anneal chambers, etc. Some of the process chambers 107, such as etch chambers, can include an edge ring therein that occasionally needs to be replaced. While conventional systems require an operator to disassemble the process chamber to replace the edge ring, the processing system 100 is configured to facilitate replacement of the edge ring without requiring the operator to disassemble the process chamber 107.

[0032] Figure 1 The transfer of an edge ring 110 into a process chamber 107 is shown schematically. In accordance with one aspect of the present disclosure, the edge ring 110 is removed from a cassette 102 via a factory interface robot 111 located in the factory interface 101, or alternatively, is directly loaded into the factory interface 101. The factory interface robot 111 transfers the edge ring 110 through one of the first vacuum ports 103a, 103b and into a respective degas chamber 104a, 104b. A transfer chamber robot 112 located in the transfer chamber 106 removes the edge ring 110 from one of the degas chambers 104a, 104b through the second vacuum port 105a or 105b. The transfer chamber robot 112 moves the edge ring 110 into the transfer chamber 106, where the edge ring 110 can be transferred to a desired process chamber 107 through a respective port 108. While the transfer of the edge ring 110 is shown in FIG. 1 for clarity, the transfer of the edge ring 110 occurs while the edge ring 110 is located on a carrier. Figure 1

[0033] Figure 1 ​One example of edge ring transport is shown, however, other examples are contemplated. For example, it is contemplated that the edge ring can be manually loaded into the transport chamber 106. From the transport chamber 106, the edge ring 110 can be loaded into the process chamber 107 by the transport chamber robot 112. Additionally or alternatively, the edge ring can be loaded in a substrate support pedestal (SSP). An additional SSP can be positioned in communication with the factory interface 101 opposite the SSP shown. It is contemplated that the processed edge ring 110 can be removed from the processing system 100 in any manner described herein. When utilizing two SSPs or multiple cassettes 102, it is contemplated that one SSP or cassette 102 can be used for unprocessed edge rings 110 while the other SSP or cassette 102 can be used to receive processed edge rings 110.

[0034] Figure 2A is a schematic top plan view of a carrier 213 according to an aspect of the disclosure. Figure 2B is Figure 2A is a schematic bottom plan view of the carrier 213 of Figures 2C-2F is Figure 2A is a schematic cross-sectional view of the carrier 213 of. The carrier 213 is a semicircular plate 216 having a perimeter defined by two parallel edges 214a, 214b and two opposing curved edges 215a, 215b that couple the two parallel edges 214a, 214b. The curved edges 215a, 215b facilitate laterally supporting an edge ring positioned thereon, while the two parallel edges 214a, 214b allow the carrier 213 to be housed in a process chamber that was not originally designed to house the carrier 213 therein. For example, the two parallel edges 214a, 214b facilitate actuating a lift pin within the process chamber without interfering with the carrier 213 while the carrier 213 is located within the process chamber.

[0035] The semicircular plate 216 includes a central opening 217 and one or more semicircular openings (three shown) 218a positioned concentrically about the central opening 217. Additional semicircular openings 218b are positioned concentrically about the one or more semicircular openings 218a. The semicircular openings 218a, 218b facilitate reducing the weight of the carrier 213, thereby allowing the carrier 213 to be used on existing transport equipment that was not originally designed to handle weights in excess of the weight of a semiconductor wafer. In one example, the semicircular plate 216 is formed of one or more materials including carbon fiber, graphite, silicon carbide, graphite-coated silicon carbide, silicon nitride, silicon oxide, aluminum oxide, etc. Other materials are also contemplated.

[0036] The semicircular plate 216 also includes a first plurality of sockets 219 disposed in the semicircular plate. The sockets 219 are metal caps disposed in holes formed through the semicircular plate 216. The sockets 219 are sized and configured to receive a lift rod therein to facilitate actuation of the carrier 213 within a processing chamber. The sockets 219 are each located at a same radial distance from a center of the semicircular plate 216. In one example, the sockets 219 are positioned at a radius that is greater than a radius of the semicircular opening 218a, but less than a radius of the semicircular opening 218b.

[0037] Figure 2C and Figure 2D is a schematic cross-sectional view of a socket 219. The socket 219 includes a body 220 having a cylindrical shape, and a flared base 221 at one end of the body. The body 220 is disposed through the semicircular plate 216, while the flared base 221 is positioned partially in and in contact with a counterbore formed on a lower surface of the semicircular plate 216. The socket 219 includes a first recess 222 extending into the body 220, and a counterbore 223 formed in the flared base 221. The recess 222 and the counterbore 223 are coupled by a tapered sidewall 224 to facilitate feature engagement. In one example, the recess 222 has an elliptical or parabolic shape to accommodate a diameter alignment feature. In such an example, the recess 222 can have a greater width in a direction parallel to the two parallel edges 214a, 214b, which is opposite to a direction perpendicular to the two parallel edges 214a, 214b. The parabolic or elliptical shape of the recess 222 facilitates housing of a lift rod within the recess 222.

[0038] The semicircular plate 216 also includes a second plurality of sockets 225 (three shown) disposed in the semicircular plate. The sockets 225 are each configured to engage a support structure, such as a mechanical blade. By engaging the sockets 225 with the support structure, this reduces or prevents relative movement between the carrier 213 and the support structure during transport of the carrier 213. For example, the support structure can include corresponding male plugs to be received within the sockets 225.

[0039] The sockets 225 include a body 226 disposed in an opening formed in the semicircular plate 216. The sockets 225 also include a flared portion 227 disposed at one end of the body 226. The flared portion 227 has a diameter that is greater than the body 226, and is disposed partially in a counterbore formed on a bottom side of the semicircular plate 216. A bore 228 is formed through the body 226 and the flared portion 227, and includes a counterbore 229 at opposite ends of the bore 228. The counterbore 229 on the lower end of the bore 228 facilitates guiding of a male plug into the socket 225.

[0040] Each of the sockets 219, 225 can be formed of one or more of metal, silicon carbide, graphite, alumina, silicon nitride, silicon oxide, polyethylene terephthalate, or a ceramic material. Other materials are also contemplated. In one example, the sockets 219, 225 are formed of a soft polymeric material, such as acetal, PTFE, or a ceramic material, such as silicon carbide, to reduce particle generation.

[0041] The carrier 213 also includes a first arcuate support structure 230a coupled to the semicircular plate 216 at the curved edge 215a, and a second arcuate support structure 230b coupled to the semicircular plate 216 at the curved edge 215b. Each of the first and second arcuate support structures 230a, 230b is disposed on an upper surface of the semicircular plate 216. The first and second arcuate support structures 230a, 230b extend above the plane of the upper surface of the semicircular plate 216. In one example, each of the first and second arcuate support structures 230a, 230b has a length that is less than the length of the corresponding curved edge 215a, 215b. Each of the first and second arcuate support structures 230a, 230b can be formed of a material such as carbon fiber, polyethylene terephthalate, or graphite.

[0042] Each of the first and second arcuate support structures 230a, 230b includes a convex extension 231 that engages an opening 232 formed through the semicircular plate 216. Figure 2F A cross-sectional view showing the convex extension 231 and the opening 232 is shown. The extension 231 engages the opening 232 and is retained in the opening 232 via an interference fit. In one example, the opening 232, as well as the first and second arcuate support structures 230a, 230b, are positioned radially outward of the socket 225. Each of the first and second arcuate support structures 230a, 230b has a radius of curvature that is approximately equal to the radius of curvature of the curved edge 215a, 215b.

[0043] Referring back to Figure 2F Each of the first and second arcuate support structures 230a, 230b includes a stepped surface on their radially outward edges. Each stepped surface includes a support surface 233 positioned approximately parallel to the upper surface of the semicircular plate 216, and a vertical wall 234 positioned radially inward of the support surface 233 and oriented nearly perpendicular to the upper surface of the semicircular plate 216. The edge ring (e.g., as shown in FIG. 2) can be formed of a material such as carbon fiber, polyethylene terephthalate, or graphite. Figure 3Ais engaged with the support surface 233 while supported on the carrier 213. In one example, the distance between the vertical walls 234 of the opposing first and second arcuate support structures 230a, 230b is approximately equal to the inner diameter of the edge ring, thereby reducing or mitigating movement of the edge ring relative to the carrier 213 during the transfer process. In one example, the vertical walls 234 are positioned radially outward of the convex extensions 231.

[0044] While Figures 2A-2F One example of the carrier 213 is shown, but other examples are contemplated. For example, the carrier 213 can have a fully circular body rather than a semi-circular shape. Additionally or alternatively, the carrier can include circular openings rather than semi-circular openings 218a, 218b. In another example, the semi-circular openings 218a, 218b can be excluded. In such an example, the carrier 213 can be formed at least in part from carbon fiber, a lightweight composite material, or another high-strength, low-weight, vacuum-compatible material. In one example, the carrier 213 is symmetric about one or more axes to mitigate imbalance during movement and placement of the carrier 213. In another example, the first and second arcuate support structures 230a, 230b include an outer edge that tapers inward from a lower portion to an upper portion to facilitate engagement with and alignment of the edge ring 110.

[0045] Figure 3A is a schematic top plan view of the carrier 213 on which the edge ring 110 is supported. Figure 3B is Figure 3A is a schematic cross-sectional view. As Figure 3A and Figure 3B shown, the edge ring 110 is disposed on and supported by the first and second arcuate support structures 230a, 230b. A lower surface of the edge ring 110 contacts the support surface 233, while a radially inward edge of the edge ring 110 contacts the vertical walls 234 of the first and second arcuate support structures 230a, 230b. In the example shown, the edge ring 110 has an inner diameter that is less than an outer diameter of the first and second arcuate support structures 230a, 230b, and the edge ring 110 has an outer diameter that is greater than the outer diameter of the first and second arcuate support structures 230a, 230b. Additionally, an upper surface of the edge ring 110 is disposed above an upper surface of the first and second arcuate support structures 230a, 230b. In one example, one or both of the first and second arcuate support structures 230a, 230b can include a feature such as a flat surface for engaging an electrostatic chuck or other substrate support to facilitate alignment therewith.

[0046] Figure 4A and Figure 4B are a schematic top plan view and a schematic bottom plan view, respectively, of a mechanical blade 435 supporting a carrier 213 thereon according to an aspect of the present disclosure. Figure 4C and Figure 4D are schematic cross-sectional views of a mechanical blade 435 supporting a carrier 213 thereon according to an aspect of the present disclosure. The mechanical blade 435 can be used on a factory interface robot 111. However, other uses are also contemplated.

[0047] The mechanical blade 435 includes a base 436 and one or more fingers 437 (e.g., two fingers 437 are shown) extending from the base 436. In the example shown, the fingers 437 are palmate, but it is contemplated that discrete fingers 437 can be utilized. The base 436 can be coupled to an actuated arm of a robot to facilitate movement of the mechanical blade 435. In one or more embodiments, a mechanical blade according to the present disclosure can include one or more carrier engagement features to facilitate engagement and support of a carrier 213 with the mechanical blade. For example, the mechanical blade can include a base carrier engagement feature (such as coupled to or formed on an upper surface of the base of the mechanical blade) and a finger carrier engagement feature (such as coupled to or formed on an upper surface of each finger of the mechanical blade). In the example shown, the mechanical blade 435 includes an end pad 438 disposed at a distal end of each finger 437 for a carrier engagement feature. The mechanical blade 435 also includes one or more base pads 439 (e.g., two pads 439 are shown) coupled to an upper surface of the base 436 as a base carrier engagement feature. The mechanical blade 435 also includes a roller 440, and the roller 440 is configured to actuate inwardly and outwardly (e.g., laterally) toward the two fingers 437 from the base 436. The roller 440 is coupled to a sliding member 441 that moves relative to the base 436. The roller 440 can rotate about a post, or can be a non-rotating member such as a bumper. An actuator (not shown) is configured to actuate the sliding member 441 and the roller 440 toward the distal ends of the fingers 437 to facilitate securing of the carrier 213. Referring to Figure 4D , the roller 440 is shown in a non-contact position, but can be actuated to contact the outer edge of the carrier 213 to facilitate securing of the carrier 213. In the contact position of the roller 440 and the carrier 213, there is a gap between the bottom surface of the edge ring 110 and the upper surface of the roller 440 such that the roller 440 can be actuated without contacting the edge ring 110, thereby reducing damage to the edge ring 110 and reducing particle generation.

[0048] Rollers 440 are positioned between two base pads 439 disposed adjacent or abutting base 436. An upper surface 490 of each base pad 439 is a support surface for carrier 213. Each base pad 439 includes a flat lower surface 442 disposed on an upper surface of finger 437 (or its palm) at a proximal end of finger 437. Upper surface 490 of each base pad 439 includes a step 443 adjacent base 436, and a tapered portion 444 that tapers downward from step 443 toward a distal end of finger 437. In one example, carrier 213 rests on tapered portion 444 of upper surface 490 during transport.

[0049] Finger 437 additionally includes an end pad 438 disposed at a distal end of finger 437. End pad 438 is formed of the same or similar material as base pads 439. End pad 438 facilitates support of carrier 213 at or near the end of finger 437, and is sized and shaped to keep carrier 213 parallel to finger 437 during transport of carrier 213. In one example, end pad 438 includes a flat lower surface 445 that contacts finger 437, and an upper surface having a flat portion 446a that contacts carrier 213, and a tapered portion 446b proximate flat portion 446a. In one example, the height of base pads 439 and end pad 438 are selected to provide a gap between the lower surface of socket 225 and the upper surface of finger 437.

[0050] In one example, rollers 440, each end pad 438, and each base pad 439 are a cushioning material to reduce damage to carrier 213. In another example, rollers 440, each end pad 438, and each base pad 439 are formed of silicon oxide, silicon nitride, silicon carbide, or polyethylene terephthalate. Finger 437 and base 436 can be formed of a metal or metal alloy, such as aluminum, or a ceramic material, such as silicon carbide.

[0051] Figure 5A is a schematic view of a mechanical blade 548 and a mechanical wrist 549 according to an aspect of the present disclosure. Figure 5B is a schematic view of a support carrier 213 and an edge ring 110 according to an aspect of the present disclosure. Figure 5A is a cross-sectional view of a mechanical blade 548 of. In one aspect, mechanical blade 548 is configured to couple to an existing mechanical wrist, or can be coupled to a mechanical wrist 549 by one or more fasteners 550, such as bolts. Mechanical wrist 549, in turn, can be coupled to a robot arm to facilitate movement of mechanical blade 548. In one example, mechanical blade 548 and optionally mechanical wrist 549 can be used with a transfer chamber robot 112 (shown in Figure 1 ).

[0052] The mechanical blade 548 includes a base 551 adjacent to the distal end of the mechanical wrist 549. The base 551 has a raised ridge 552 formed on its upper surface. In one example, the raised ridge 552 includes a stepped surface (not shown). The stepped surface can engage the carrier 213 during transport operations to facilitate support of the carrier 213, thereby providing additional support to the carrier 213. The mechanical blade 548 also includes two fingers 554 extending from the base 551. Each finger 554 has a raised ridge 555 formed on its upper surface at the distal end of the respective finger. Each raised ridge 555 extends vertically from the upper surface of each finger 554.

[0053] The raised ridges 555 of the fingers 554 and the raised ridges 552 of the base 551 are configured in a semi-circular or curved arrangement. In one example, the raised ridges 555 formed on the upper surfaces of the two fingers 554 and the raised ridges 552 formed on the upper surface of the base 551 are concyclic arcs. In such an example, the concyclic arc can be approximately the same size as the carrier 213 to facilitate support of the carrier 213.

[0054] In addition to or as an alternative to the support provided by the raised ridges 552 and 555, the mechanical blade 548 may include a plurality of carrier engagement features, such as a plurality of engagement struts 556 (three shown). In one example, the engagement strut 556 is a cylindrical column extending vertically from the upper surface of the mechanical blade 548. The base 551 includes one of the engagement struts 556 formed on the upper surface of the base adjacent to the raised ridge 552, while each of the two fingers 554 includes an engagement strut 556 disposed on the upper surface of its respective finger.

[0055] like Figure 5B As shown, each engagement post 556 is positioned to engage a corresponding socket 225 of the carrier 213. Engagement of the sockets 225 by the engagement post 556 reduces relative movement between the mechanical blade 548 and the carrier 213 during transport. When the socket 225 is engaged by the engagement post 556, the upper surface of the mechanical blade 548 is spaced apart from the lower surface of the semi-circular plate 216 of the carrier 213. The size of the socket 225 is selected to provide a gap between the upper surface of the mechanical blade 548 and the lower surface of the semi-circular plate 216, thereby reducing contact between components and resulting in reduced particle generation.

[0056] Additionally, the size of the socket 225 can be selected to space the lower surface of the edge ring 110 from the upper surfaces of the raised ridges 552 and 555, thereby reducing or eliminating contact between the edge ring 110 and the mechanical blade 548. This reduced contact between the edge ring 110 and the mechanical blade 548 mitigates damage to the edge ring 110 caused by unintentional contact with the mechanical blade 548. Similarly, it should be noted that, for similar reasons, the size of the mechanical blade 548 can be selected to maintain the spacing between the edge ring 110 and the mechanical wrist 549.

[0057] In some examples, the mechanical blade 548 may include one or more openings 557 formed therein. These openings 557 facilitate weight reduction of the mechanical blade 548, thereby compensating for the weight of the carrier 213. In doing so, the mechanical blade 548 can be adapted to existing robotic arms that were not originally designed to transport the carrier 213. In one example, the mechanical blade 548 may also be used to transport a substrate. In such an example, the engagement post 556 may include a circular upper surface to minimize contact with the substrate being transported, thereby reducing particle generation.

[0058] Figures 6A-6H The placement of the edge ring 110 within the processing chamber 107 is schematically shown according to one aspect of this disclosure. Figure 7 This is a flowchart of a method 760 for placing an edge ring according to one aspect of this disclosure. For ease of explanation, in conjunction with… Figures 6A-6H explain Figure 7 .

[0059] Figure 6A A schematic top perspective view of the interior of processing chamber 107 is shown. Processing chamber 107 includes ports 108, such as slit valves, to facilitate the entry and exit of mechanical blades 548 and mechanical wrists 549. In operation 761 of method 760, a carrier 213 having an edge ring 110 thereon is positioned in processing chamber 107 via mechanical blades 548. The carrier 213 and the edge ring 110 are centered on the electrostatic chuck of the substrate support 680, as... Figure 6A As shown. The dimensions of carrier 213 are selected to allow carrier 213 and edge ring 110 to pass through port 108 without requiring a change in the size of port 108. Therefore, carrier 213 can be used on existing chambers without requiring a significant reconfiguration of the dimensions of processing chamber 107. However, it is contemplated that port 108 could be dimensionally modified to provide additional clearance for the entry and exit of carrier 213.

[0060] In operation 762, such as Figure 6BAs shown, the substrate lift pins 681 (e.g., a first set of lift pins) are actuated to contact the sockets 219 of the carrier 213. In one example, three (3) substrate lift pins 681 are actuated such that each substrate lift pin 681 engages a respective socket 219. The substrate lift pins 681 and the sockets 219 are positioned to allow engagement therebetween without interference from the mechanical blade 548. Subsequently, in operation 763, the substrate lift pins 681 are further actuated upward to lift the carrier 213 and the edge ring 110 supported thereon from the mechanical blade 548. In such a configuration, the carrier 213 and the edge ring 110 are positioned above and apart from the mechanical blade 548, as shown. Figure 6C

[0061] In operation 764, the mechanical blade 548 is withdrawn from the processing chamber 107, and the carrier 213 and the edge ring 110 are lowered toward the substrate support 680, as shown. Figure 6D In one example, the carrier 213 is lowered to a position spaced apart from an upper surface of the substrate support 680, but below a horizontal plane of the mechanical blade 548 or the initial engagement position of operation 762.

[0062] In operation 765, outer lift pins 682 (e.g., a second set of lift pins) located radially outward of the substrate lift pins 681 are actuated upward. The outer lift pins 682 are disposed below a lift ring 683, and thus, when actuated upward, raise the lift ring 683 to form a surface of the substrate support 680. The lift ring 683 is actuated upward via the outer lift pins 682 to contact a bottom surface of the edge ring 110, as shown. Figure 6E The lift ring 683 includes a stepped surface on an inner periphery to receive the edge ring 110 in the lift ring 683. Alternatively, the lift ring 683 can include a tapered surface to facilitate alignment.

[0063] In operation 766, the edge ring 110 is lifted from the carrier 213, as shown. Figure 6F As a reference, Figure 6F is shown relative to Figure 6E ​A schematic side view rotated approximately 90 degrees shows different cross-sections of the carrier 213. The edge ring 110 is raised by further upward actuation of the lifting ring 683 using the outer lifting rod 682. In operation 766, the carrier 213 remains positioned on the substrate lifting rod 681 while the edge ring 110 is raised from the carrier 213. In this configuration, the carrier 213 is positioned in a first plane, and the lifting ring 683 and the edge ring 110 located on the lifting ring are positioned in a second plane above the first plane. In one example, the carrier 213 may also be optionally raised to align the carrier 213 with the port 108 to facilitate removal of the carrier 213 from the processing chamber 107. In this example, the lifting ring 683 and the edge ring 110 remain positioned above the carrier 213.

[0064] In operation 767, the carrier 213 is removed from the processing chamber 107, such as... Figure 6G As shown. The carrier 213 is removed by inserting the mechanical blade 584 back into the processing chamber 107 and lowering the carrier 213 onto the mechanical blade 584 using the substrate lifting rod 681. The substrate lifting rod 681 is further lowered into the substrate support 680 to reduce the possibility of interference with the substrate lifting rod 681. With the carrier 213 positioned on the mechanical blade 584, the mechanical blade 584 is removed from the processing chamber 107.

[0065] Parallel edges 214a, 214b Figure 2A (As shown) a gap is provided relative to the outer lifting rod 682, thereby allowing the carrier 213 to exit from the processing chamber 107 while the outer lifting rod 682 remains extended in the vertical-lifted position. As described above, the carrier 213 can be retracted to separate from the edge ring 110, thereby leaving the edge ring 110 in the processing chamber 107.

[0066] In operation 768, with the carrier 213 and mechanical blades 584 removed from the processing chamber 107, the lifting ring 683 and edge ring 110 are positioned on the substrate support 680, as... Figure 6H As shown. In such an example, the lifting ring 683 descends downwards via an actuation of the outer lifting rod 682 until the lifting ring 683 contacts the substrate support 680, thereby positioning the edge ring 110 in a predetermined position. In one example, the edge ring 110 may include an alignment label or other indexing feature to facilitate proper alignment of the edge ring 110 on the substrate support 680.

[0067] exist Figure 6I shown Figure 6HIn alternative examples of the method 700, the edge ring 110 can be positioned on the substrate support 680 such that the one or more lift pins 681 position the edge ring 110 in a non-parallel configuration relative to the upper surface of the substrate support 680 for processing. For example, the lift pins 681 can lift one section of the edge ring 110 to a relative height (relative to the substrate support 680) that is greater than another section of the edge ring 110. In doing so, the plasma sheath proximate the substrate support 680 is affected. Accordingly, the position of the edge ring 110 can be selected to affect the plasma sheath in order to bring about a more uniform processing result.

[0068] While Figure 7 One example of a method of transferring the edge ring 110 is shown, but other examples are contemplated. For example, it is contemplated that the edge ring 110 can be removed from the processing chamber 100 by performing the method 670 in reverse.

[0069] Additionally, it is contemplated that aspects of the disclosure can be used to further adjust plasma uniformity. In one example, once the edge ring 110 is positioned on the substrate support 680, the outer lift pins 682 can adjust the flatness of the edge ring 110 relative to the substrate support 680. For example, after the operation 768, small adjustments can be made to the flatness of the edge ring 110 by adjusting the vertical position of one or more of the outer lift pins 682 to affect the plasma sheath and / or chemistry in a particular location proximate the edge ring 110 (or the substrate being processed). In such an example, substrate processing can occur with the edge ring 110 being non-planar relative to the substrate surface.

[0070] Figure 8A is a schematic illustration of a carrier 213 when used within a degas chamber, such as the degas chamber 104a Figure 1 shown in FIG. 1. Figure 8B and Figure 8C is a schematic perspective view of a support structure 885 for use within a degas chamber in accordance with various aspects of the disclosure.

[0071] The interior of the degas chamber includes a plurality of support structures 885 (three are shown). The support structures 885 are configured to support a substrate, such as a semiconductor wafer, or a carrier on the support structures during a degas operation. The support structures 885 are oriented and configured to support semiconductor wafers (semiconductor wafers generally have a circular shape) as well as substrate carriers 213 (substrate carriers 213 have a semi-circular shape).

[0072] Each support structure 885 includes a base 886 having a first end 887a and a second end 887b. A cross member 888 is disposed at the first end 887a of the base 886. The cross member 888 is disposed in the same plane as the base 886, sharing a coplanar upper surface with the base 886. The cross member 888 has a width that is greater than the base 886 and is oriented perpendicular to the base 886. The cross member 888 includes an opening 899 formed therethrough, and at least two support posts 890 extending from a lower surface of the cross member 888. The two support posts 890 are positioned on opposite sides of the opening 899 and can have a cylindrical shape. In one example, the support posts 890 are axially movable or adjustable relative to the cross member 888.

[0073] The support structure 885 also includes a vertical member 891 extending from the second end 887b of the base 886. The vertical member 891 extends in a direction parallel to an axis of the support posts 890. In one example, the vertical member 891 extends relative to or from the base 886 in a direction opposite the two support posts 890. The vertical member 891 includes a ball bearing 892 at a distal end thereof. In another example, the vertical member 891 includes a contact pad at the distal end thereof. The ball bearing 892 (or contact pad) facilitates contact with the substrate without damaging a surface of the substrate. The contact pad or ball bearing 892 can be formed of a ceramic or another material to mitigate particle generation. In one example, the contact pad or ball bearing 892 is configured to support the substrate thereon during processing.

[0074] During operation, a substrate such as a semiconductor wafer is transferred into the degas chamber 104a and positioned on the support structure 885. Due to the size and shape of the substrate, the substrate is able to contact all of the ball bearings 892 of the support structure 885. However, due to the semi-circular shape of the carrier 213, the carrier 213 is not able to contact all of the ball bearings 892 of the support structure 885. However, the carrier 213 is able to contact the upper surface of the base 886 and the cross member 888 of each support structure 885, thereby allowing the support structure to support the semiconductor substrate as well as the carrier 213.

[0075] Reference Figure 8ATo facilitate supporting multiple substrates, the orientation of the support structures 885 is adjustable. In the example shown, two of the support members 885 are oriented such that the vertical members 891 are positioned radially inward, while the third support member 885 is oriented such that the respective vertical members 891 are positioned radially outward (e.g., 180 degrees relative to each other). It is contemplated that each support member 885 can be rotated about the axis of the opening 899 to position each support member 885 in a desired configuration. When each support member 885 is in the desired position, the support posts 890 can engage the corresponding sockets to prevent further rotational movement of each support member 885.

[0076] Figures 8A-8C One aspect of the disclosure is shown, however, other aspects are contemplated. In an alternative example, the degas chamber 104a can include more than three support structures 885.

[0077] Figure 9 A cassette 902 according to one aspect of the disclosure is disclosed. The cassette 902 is configured to house one or more carriers 213 each having an edge ring 110 thereon (three sets of carriers and edge rings are shown per cassette). Each carrier 213 is positioned on a comb 991 spaced apart from each other by a distance "D". The distance D is selected to be the desired amount of robot clearance within the cassette 902. Each comb 991 includes opposing support structures coupled to an inner surface of a housing 992. Each support structure includes a base 993 coupled to the housing 992 and an extension 994 extending inwardly from the respective base 993 in a stepped configuration.

[0078] The carriers 213 of the disclosure have opposing parallel edges 214a, 214b and are therefore not circular, which precludes support in conventional cassettes. However, the cassette 902 of the disclosure includes extensions 994 extending radially inward to support the respective carriers 213 along the opposing parallel edges 214a, 214b. The stepped surface of each comb 991 prevents interference with the edge rings 110 when supporting the carriers 213 thereon. In one example, the base 993 of the comb 991 can be sized and positioned to allow a substrate, such as a semiconductor wafer, to be supported on the base. Thus, the cassette 902 can be used to introduce both the carriers 213 and edge rings 110 into the processing system 100, as well as to introduce substrates into the processing system 100 for processing. In another example, a conventional cassette can be modified to include the extensions 994.

[0079] Benefits of the present disclosure include having the ability to replace the edge ring without venting and opening the process chamber. Since venting is avoided, chamber uptime is improved and maintenance costs are reduced. Furthermore, replacing the edge ring without opening the process chamber enables the edge ring shape or material to be selected to optimize performance for a particular etch application. Since conventional methods require a significant amount of time to swap edge rings for a particular application, it is impractical to do so using conventional systems. However, since the various aspects described herein can be used to quickly swap or replace the edge ring, it is now feasible to swap the edge ring as indicated by the process parameters.

[0080] Furthermore, process uniformity is also improved by the various aspects described herein. Since conventional methods require a much longer time to replace the edge ring, in conventional systems the time between preventative maintenance of the edge ring is maximized to reduce downtime. However, doing so results in a heavily worn edge ring immediately prior to preventative maintenance. Since the shape and material of the edge ring affects the plasma sheath and chemical concentration near the edge of the substrate being processed, process uniformity can decrease due to the presence of a heavily worn edge ring. However, since the various aspects of the present disclosure allow the edge ring to be quickly replaced when it begins to wear, the edge ring can be replaced more frequently without significant downtime, resulting in greater process uniformity.

[0081] While the various aspects herein are described with respect to a half-circle shaped plate and carrier, it is contemplated that the carrier can be a full circle.

[0082] While the foregoing is directed to various aspects of the present disclosure, other and further aspects of the disclosure can be devised without departing from the basic scope thereof, and the scope of the present disclosure is determined by the claims that follow.

Claims

1. A carrier for supporting an edge ring, comprising: a plate having a perimeter comprising a plurality of curved edges and a plurality of parallel edges; a plurality of sockets disposed in the plate, each socket formed of a polymeric material and configured to engage a support structure; and a plurality of support structures coupled to the plurality of curved edges, each respective support structure extending above a plane of an upper surface of the plate, and each respective support structure comprising: a step formed on a radially outward edge of the respective support structure and disposed above the plane of the upper surface of the plate, the step of each respective support structure comprising: a support surface parallel to the upper surface of the plate, and an arcuate wall positioned radially inward of the support surface of the respective support structure and oriented perpendicular to the upper surface of the plate, the arcuate wall of each respective support structure extending perpendicularly to the support surface of the respective support structure, and a convex extension positioned radially inward of the wall and extending into the plate.

2. The carrier of claim 1, wherein the arcuate wall of each respective support structure has a radius of curvature that is less than an inner radius of the edge ring.

3. The carrier of claim 2, wherein the arcuate wall of each respective support structure is disposed at a radius relative to a center of the plate, and the radius is equal to or less than the inner radius of the edge ring.

4. The carrier of claim 1, wherein the plate is a semi-circular plate.

5. The carrier of claim 1, wherein at least some of the plurality of sockets are positioned radially inward of the plurality of support structures.

6. The carrier of claim 1, wherein each socket comprises a body disposed in an opening formed in the plate.

7. The carrier of claim 6, wherein the body of each socket comprises a flared portion having an outer diameter that is greater than a cylindrical portion of the body.

8. The carrier of claim 7, wherein the body of each socket further comprises a hole formed through the body.

9. The carrier of claim 1, wherein the plate comprises one or more openings formed therein.

10. The carrier of claim 9, wherein the one or more openings comprise a plurality of openings, and at least one of the plurality of sockets is positioned between two of the plurality of openings.

11. A carrier for supporting an edge ring, comprising: a plate having a perimeter comprising a plurality of curved edges and a plurality of parallel edges; a plurality of sockets disposed in the plate, each socket formed of a polymeric material and configured to engage a support structure; and a plurality of support structures coupled to the plurality of curved edges, each respective support structure comprising: a step formed on a radially outward edge of the respective support structure, the step of each respective support structure comprising: a support surface, and an arcuate wall positioned radially inward of the support surface of the respective support structure and extending perpendicularly to the support surface of the respective support structure.

12. The carrier of claim 11, wherein the arcuate wall of each respective support structure has a radius of curvature that is less than an inner radius of the edge ring.

13. The carrier of claim 12, wherein the arcuate wall of each respective support structure is disposed at a radius relative to a center of the plate, and the radius is equal to or less than the inner radius of the edge ring.

14. The carrier of claim 11, wherein the plate is a semi-circular plate.

15. The carrier of claim 11, wherein each socket includes a body disposed in an opening formed in the plate, and the body of each socket includes a flared portion having an outer diameter that is greater than a cylindrical portion of the body.

16. The carrier of claim 15, wherein the body of each socket further includes a hole formed through the body.

17. A method of transferring an edge ring, comprising: inserting a mechanical blade into a chamber through a slit valve, the mechanical blade having a carrier on the mechanical blade and an edge ring supported on the carrier; positioning the carrier and the edge ring on the carrier over a substrate support; actuating a substrate lift pin to lift the edge ring from the carrier; and retracting the mechanical blade and the carrier from the chamber; wherein the carrier includes: a plate having a perimeter, the perimeter including a plurality of curved edges and a plurality of parallel edges; a plurality of sockets disposed in the plate, each socket formed of a polymeric material and configured to engage a support structure; and a plurality of support structures coupled to the plurality of curved edges, each respective support structure including: a step formed on a radially outward edge of the respective support structure, the step of each respective support structure including: a support surface, and an arcuate wall positioned radially inward of the support surface of the respective support structure and extending perpendicularly to the support surface of the respective support structure.

18. The method of claim 17, further comprising: lowering the edge ring into contact with the substrate support. positioning the edge ring in a non-parallel configuration relative to an upper surface of the substrate support to adjust a position of a plasma sheath during processing.

19. The method of claim 18, wherein lowering the edge ring into contact with the substrate support comprises:

20. The method of claim 17, wherein the sockets of the carrier engage the mechanical blade during insertion of the mechanical blade into the chamber and retraction of the mechanical blade and the carrier from the chamber. ​

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