A fixture suitable for teaching the position of robotic arms inside semiconductor equipment

Abstract

The present invention provides a cassette jig suitable for teaching the position of a robotic arm inside a semiconductor device. The cassette jig suitable for teaching the position of a robotic arm inside a semiconductor device includes a transparent material jig, a wafer positioning jig, and a cassette jig. The wafer positioning jig is used to position the wafer, the transparent material jig is used to clamp the wafer, and the cassette jig is used to locate the center position of the wafer in the cassette and the position of the infrared sensor. The present invention can greatly improve the teaching accuracy of the operator when teaching different positions, and can also save teaching time to a great extent. In addition to being able to teach the position of the robotic arm, the present invention can also locate the center position of the wafer in the cassette, as well as the distance between the four infrared sensor lights and the wafer in the cassette, greatly improving the teaching efficiency of the robotic arm.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment, and in particular relates to a fixture suitable for teaching the position of a mechanical arm inside a semiconductor device. Background Art

[0002] A robotic arm is a moving robot (or an automated mechanical structure) used to transfer (or move) wafers inside the cavity of a semiconductor device. It can move wafers to different fixed positions within the cavity of the semiconductor device. Each position requires a robotic arm to correspond to a fixed point, and each point requires a point teaching of the robotic arm so that the wafer can be accurately moved to each required fixed position. The accuracy of the point teaching determines the accuracy of the robotic arm in moving the wafer to the specified position each time. If the accuracy of the moving position is not enough, it will affect the production process of the wafer or the wafer will collide and cause fragmentation, and so on.

[0003] Currently, for this type of robotic arm mechanism, there are also corresponding teaching fixtures to help teach different positions, which mainly rely on human observation, etc., so the teaching accuracy of the position is often insufficient, affecting the production process of the wafer or causing wafer collisions and fragmentation, and other problems. Summary of the Invention

[0004] Based on the problems existing in the prior art, the present invention provides a fixture suitable for teaching the position of a robotic arm inside a semiconductor device.

[0005] According to the technical solution of the present invention, the present invention provides a jig suitable for teaching the position of a robotic arm inside a semiconductor device. The jig is suitable for teaching the position of a robotic arm inside a semiconductor device. After effective improvement of the adapted wafer, the accuracy of the taught position of the robotic arm is ensured to meet the operation requirements of the semiconductor device.

[0006] Among them, the fixture suitable for teaching the position of the robotic arm inside the semiconductor equipment includes a transparent wafer fixture, a wafer positioning fixture and a cassette fixture. The wafer positioning fixture is used to position the wafer, the transparent wafer fixture is used to clamp the wafer, and the cassette fixture is used to locate the center position of the wafer in the cassette and the position of the infrared sensor.

[0007] Furthermore, the transparent wafer jig is similar in shape to the wafer, a perfectly circular flat plate with a central hole. This hole is used to locate the transparent wafer jig, and its transparent material facilitates easy identification of the electrostatic chuck jig and the center hole during instruction. The transparent wafer jig has no protrusions on its outer circumference, ensuring it conforms perfectly to the wafer and can be applied to the wafer assembly tray without obstruction.

[0008] Additionally, the wafer positioning jig includes an arc-shaped holding frame. The wafer positioning jig with the arc-shaped holding frame has a triangular plate structure. The first frame of the wafer positioning jig with the arc-shaped holding frame is arc-shaped. The arc of the first frame is directly aligned with the diameter of the transparent wafer jig. During use, the transparent wafer jig rests flatly on the arc edge of the first frame.

[0009] Furthermore, the second frame and the third frame of the wafer positioning jig with an arc-shaped holding frame are straight-sided frames, which are connected to the bottom rectangular portion of the jig with an arc-shaped holding frame, and the second frame and the third frame have the same angle with the short side of the bottom rectangular portion.

[0010] Among them, the inner circle of the cassette fixture is similar to the shape of the wafer. It is a flat plate in the shape of a perfect circle. Its inner arc diameter is 300mm and the arc is 136°; the outer circle is clamped by the steps of each layer in the cassette, thereby fixing the cassette fixture so that it cannot move. Its outer arc diameter is 308.5mm and the arc is 224°; there are four ears around the cassette, and each ear has a 1mm wide slit to allow infrared light to pass through the slit to locate the position of the infrared sensor. The slit is 153.5mm away from the center point of the cassette fixture.

[0011] In addition, there are three notches on the film cassette fixture, the notch diameter is 13 mm, and the center of the notch is 147.25 mm away from the center point of the film cassette fixture.

[0012] Compared with the prior art, the advantageous technical effects of the fixture suitable for teaching the position of a robotic arm inside a semiconductor device of the present invention are as follows:

[0013] (1) The present invention can greatly improve the operator's teaching accuracy when teaching different positions, and can also save teaching time to a great extent.

[0014] (2) The fixture in position 1 can not only teach the position of the robot arm, but also locate the center position of the wafer in the cassette, as well as the distance between the four infrared sensor lights and the wafer in the cassette, which greatly improves the teaching efficiency of the robot arm. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a first structural diagram of a teaching position cassette according to the present invention.

[0016] Figure 2 It is a schematic cross-sectional view of the second structure of the teaching position cassette according to the present invention.

[0017] Figure 3 It is a structural schematic diagram of a film cassette jig used in the position teaching jig according to the present invention.

[0018] Figure 4This is a schematic diagram of the dimensions of a cassette jig used in the position teaching jig of the present invention, and the view is a front view.

[0019] Figure 5 This is a schematic diagram of the dimensions of a cassette jig used in the position teaching jig of the present invention, and the view is a left view.

[0020] Figure 6 This is a schematic diagram of a film cassette jig used in the position teaching jig of the present invention being placed inside a film cassette.

[0021] Figure 7 It is a cross-sectional schematic diagram of a film cassette jig used in the position teaching jig according to the present invention placed inside a film cassette.

[0022] Figure 8 This is a schematic diagram of a jig for teaching the position of a robotic arm used in accordance with the position teaching jig of the present invention, which is clamped on the robotic arm.

[0023] Figure 9 This is a schematic diagram of a transparent wafer jig used in the position teaching jig of the present invention, which is flat against a robotic arm for position teaching.

[0024] Figure 10 This is a schematic diagram showing a robotic arm carrying a transparent wafer jig used in the position teaching jig of the present invention moving toward a cassette position for position teaching.

[0025] Figure 11 This is a schematic diagram of a position teaching jig according to the present invention, in which a robotic arm carries a transparent wafer jig and moves to the cassette position for position teaching, and the edge of the transparent wafer jig coincides with the inner arc of the static cassette jig (that is, the center point of the transparent wafer jig coincides with the center point of the inner arc of the cassette jig).

[0026] Figure 12 This is a cross-sectional diagram of a position teaching jig according to the present invention, in which a robotic arm carrying a transparent wafer jig moves to a cassette position for position teaching, and the edge of the transparent wafer jig coincides with the inner arc of a stationary cassette jig (that is, the center point of the transparent wafer jig coincides with the center point of the inner arc of the cassette jig).

[0027] Figure 13 A schematic cross-sectional rendering of a position teaching jig according to the present invention is shown in which a robotic arm carrying a transparent wafer jig moves toward a cassette position for position teaching, and the edge of the transparent wafer jig coincides with the inner arc of a stationary cassette jig (that is, the center point of the transparent wafer jig coincides with the center point of the inner arc of the cassette jig).

[0028] Figure 14This is a schematic diagram of a film cassette jig used in the position teaching jig of the present invention, placed approximately in the middle of the film cassette, with four infrared sensor beams passing through the four ear slits of the film cassette jig.

[0029] Description of reference numerals in the accompanying drawings:

[0030] Figure 2 Middle: the first silicone round pad 2-1 on the cassette step, the second silicone round pad 2-2 on the cassette step, the third silicone round pad 2-3 on the cassette step, and the cassette step 2-4.

[0031] Figure 3 Middle: outer arc 3-1 on the film magazine jig, inner arc 3-2 on the film magazine jig, ear 3-3 protruding from the film magazine jig for debugging the infrared sensor, slit 3-4 on the ear through which sensor light can pass, first notch 3-5, second notch 3-6, and third notch 3-7.

[0032] Figure 8 Middle: Jig 8-1 for teaching the position of the robotic arm. Jig 8-1 is stuck on the robotic arm.

[0033] Figure 9 Middle: Transparent wafer jig 9-1, which is a transparent wafer jig that is flat against the robot arm for position teaching; center hole 9-2 on the transparent wafer jig.

[0034] Figure 14 Middle: Infrared sensor light 14-1. DETAILED DESCRIPTION

[0035] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0036] It should also be noted that, for ease of description, only the parts related to the invention are shown in the drawings. In the absence of conflict, the embodiments and features of the embodiments of the present invention may be combined with each other.

[0037] It should be noted that the concepts of "first" and "second" mentioned in the present invention are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0038] It should be noted that the modifications of "one" and "multiple" mentioned in the present invention are illustrative rather than restrictive. Those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0039] This invention provides a jig suitable for teaching the position of a robotic arm within semiconductor equipment. This jig is suitable for effectively indicating the wafer's position or improving the taught position, ensuring the accuracy of the robotic arm's taught position and meeting the operational requirements of semiconductor equipment. In addition to teaching the robotic arm's position, the invention can also locate the center of the wafer within the cassette and the distance between the four infrared sensor beams and the wafer within the cassette, greatly improving the robotic arm's teaching efficiency.

[0040] The jig suitable for teaching the position of the robotic arm inside the semiconductor equipment of the present invention includes a transparent wafer jig, a wafer positioning jig and a cassette jig. The transparent wafer jig is used to clamp the wafer, the wafer positioning jig is used to position the wafer, and the cassette jig is used to position the center position of the wafer in the cassette and the infrared sensor position. Furthermore, the transparent wafer jig is similar in shape to the wafer, and is a flat plate in the shape of a perfect circle with a center hole at the center. The center hole of the transparent wafer jig is used to position the transparent wafer jig, and the transparent material helps to find the electrostatic suction cup jig and the center hole position during teaching; there are no protrusions on the outer circumference of the transparent wafer jig, and it is completely consistent with the wafer and can be applied to the wafer assembly plate without obstruction. In a preferred embodiment, the wafer size adapted to the transparent wafer jig is: 300mm in diameter and 1mm in center hole diameter. As Figure 4 The wafer dimensions shown are: 300 mm in diameter and 2 mm in thickness.

[0041] The wafer positioning jig includes an arc-shaped holding frame, and the wafer positioning jig with the arc-shaped holding frame has a triangular plate structure. Preferably, the first frame of the wafer positioning jig with the arc-shaped holding frame is arc-shaped, and the arc of the first frame is directly the same as the diameter of the transparent wafer jig. During use, the transparent wafer jig rests flat on the arc edge of the first frame. In a preferred embodiment, the second and third frames of the wafer positioning jig with the arc-shaped holding frame are straight-edge frames, which are connected to the bottom rectangular portion of the jig with the arc-shaped holding frame, and the second and third frames have the same angle with the short side of the bottom rectangular portion.

[0042] The inner circle of the cassette jig is similar in shape to the wafer, a flat, perfectly circular shape. In a preferred embodiment, its inner arc has a diameter of 300mm and an arc of 136°. Its outer arc, which clamps onto the steps on each level of the cassette, immobilizes the cassette jig. Its outer arc has a diameter of 308.5mm and an arc of 224°. The cassette has four ears, each with a 1mm-wide slit that allows infrared light to pass through for locating the infrared sensor. The slits are located 153.5mm from the center of the cassette jig. In a preferred embodiment, the cassette jig has three notches, each 13mm in diameter and 147.25mm from its center.

[0043] The following is a detailed description of the fixture suitable for teaching the position of the robot arm inside the semiconductor device of the present invention with reference to the accompanying drawings. Figure 1-Figure 2 As shown, Figure 1 This is the first structural diagram of the magazine that needs to be taught. Figure 2 This is a schematic diagram of the second structural section of the film cassette that requires teaching position. Figure 2 This is a cross-sectional view where you can directly see the cassette steps and the silicone pad. Figure 1 It's the same film cartridge. Figure 1 The structure of multiple cassettes stacked together is shown. A top plate is provided on the top of the stacked cassettes to protect the multiple wafers placed in the cassettes. Figure 2 The support assembly shown is provided with a cassette step 2-4, which is used to support the wafer. Preferably, a first silicone round pad 2-1, a second silicone round pad 2-2 and a third silicone round pad 2-3 are provided on the cassette step.

[0044] Figure 3 This is a schematic diagram of the structure of the cassette jig used in the position teaching jig. Figure 4 This is a front view showing the dimensions of the cassette jig used in the position teaching jig. Figure 5 This is a schematic diagram of the dimensions of the film cassette jig used in the position teaching jig, and the view is the left view. Figure 3-Figure 5As shown, the present invention is suitable for teaching the position of a wafer cassette from a robotic arm within semiconductor equipment. This jig, referred to as a cassette jig, has an outer arc 3-1 and an inner arc 3-2. The transparent wafer jig locates the inner arc 3-2 during teaching. The outer arc 3-1 engages the cassette step to secure the cassette, while the inner arc 3-2 positions the transparent wafer in the center of the cassette. The transparent wafer jig has no protrusions on its outer circumference, allowing it to completely conform to the wafer and be applied to the wafer stack without obstruction. In a preferred embodiment, ears 3-3 are provided on the wafer cassette, and the ears 3-3 protruding from the wafer cassette fixture are used to debug the infrared sensor, and the sensor light is transmitted through the slit 3-4 on the ears 3-3; a first notch 3-5, a second notch 3-6 and a third notch 3-7 are provided on the wafer cassette, and these three notches (the first notch 3-5, the second notch 3-6 and the third notch 3-7) are symmetrically arranged along the central axis for clamping wafer components; preferably, the first notch 3-5, the second notch 3-6 and the third notch 3-7 are evenly distributed on the circular arc of the wafer cassette plane and do not overlap with the ears 3-3; further, the angle between the first notch 3-5, the second notch 3-6 and the third notch 3-7 and the center point (center point of the wafer cassette) is 120°; the first notch 3-5, the second notch 3-6 and the third notch 3-7 are mainly to avoid the silicone round pad on the wafer cassette step. As Figure 3-Figure 5 As shown, the inner circle of the cassette jig is similar in shape to the wafer, a flat plate with a perfect circular shape. In a preferred embodiment, its inner arc diameter is 300mm and its arc is 136°. The outer circle clamps against the steps of each layer in the cassette, thereby fixing the cassette jig so that it cannot move. Its outer arc diameter is 308.5mm and its arc is 224°. The cassette has four ears around its perimeter, each with a 1mm-wide slit that allows infrared light to pass through for locating the infrared sensor. The slit is 153.5mm from the center of the cassette jig. In a preferred embodiment, the cassette jig has three notches, each with a diameter of 13mm and a center distance of 147.25mm from the center of the cassette jig.

[0045] Furthermore, as attached Figure 4 As shown, the radius of the outer arc 3-1 of the film holder is 154.25mm, the radius of the inner arc 3-2 is 150mm, the arc is 136°, and it is concentric with the outer arc 3-1; the outer arc radius of the ear 3-3 is 162.5mm, the length of the ear 3-3 is 30mm, the width of the slit 3-4 on the ear is 1mm, the inner arc radius of the slit 3-4 is 153.5mm, the arc radius of the first notch 3-5, the second notch 3-6 and the third notch 3-7 is 6.5mm, and the distance between the center point of the arc and the center of the inner arc 3-2 is 147.25mm. Figure 5 This is the left view size of the film cassette fixture. The thickness of the film cassette fixture is 1.5mm.

[0046] like Figure 6and Figure 7 As shown, attached Figure 6 This is a schematic diagram of the film cassette fixture placed inside the film cassette, attached Figure 7 This is a cross-sectional view of a wafer jig placed inside a wafer cassette. The present jig, suitable for teaching the position of a robotic arm within semiconductor equipment, is secured to the wafer cassette's stepped structure via an outer arc 3-1. Furthermore, an inner arc 3-2 is concentric with the outer arc 3-1, resulting in the position of the transparent wafer jig at the center of the wafer cassette. The robotic arm, carrying the transparent wafer jig, moves toward the wafer cassette until the edge of the transparent wafer jig aligns with the inner arc 3-2 on the wafer cassette, completing the teaching of the robotic arm to the wafer cassette position. (The wafer cassette jig can be placed on any layer within the cassette, except the bottom layer.)

[0047] The slits on the four ears are at the same position from the center point of the inner arc 3-2 on the cassette fixture. The slit is 1mm wide, and its inner edge is 3.5mm away from the inner arc 3-2 on the cassette fixture, that is, the transparent wafer fixture. This means that if the position of the wafer in the cassette is offset by more than 3.5mm, it may block the sensor light and trigger the sensor alarm.

[0048] Figure 8 This is a fixture used by the wafer adjuster fixture to teach the position of the robotic arm, specifically the wafer positioning fixture 8-1, and a schematic diagram of it being clamped on the robotic arm. Figure 9 This is a schematic diagram of a transparent wafer jig used in a wafer adjuster jig, which is flat against a robotic arm position for teaching. The transparent wafer jig 9-1 is a transparent wafer jig that is flat against a robotic arm position for teaching. The transparent wafer jig is provided with a center hole 9-2. Figure 8 As shown, the wafer positioning jig 8-1 includes an arc-shaped holding frame, and the wafer positioning jig with the arc-shaped holding frame has a triangular plate structure. Preferably, the first frame of the wafer positioning jig with the arc-shaped holding frame is arc-shaped, and the arc of the first frame is directly the same as the straight diameter of the transparent wafer jig. During use, the transparent wafer jig rests flat on the arc edge of the first frame. The second and third frames of the wafer positioning jig with the arc-shaped holding frame are straight-edge frames, which are connected to the bottom rectangular portion of the jig with the arc-shaped holding frame, and the second and third frames have the same angle with the short side of the bottom rectangular portion. The jig with the arc-shaped holding frame has an arc-shaped frame, and its arc diameter is 300mm; the first short hypotenuse and the second short hypotenuse connecting the arc-shaped frame are the same size, and their length is 5mm. The long hypotenuse connecting the first short hypotenuse and the second short hypotenuse are respectively the first long hypotenuse and the second long hypotenuse, and their long hypotenuses are the same size, and their length is 78.71mm. The vertical frames connecting the first long oblique side and the second long oblique side are the first vertical frame and the second vertical frame respectively, and the vertical frames have the same size and a length of 23 mm; the connecting vertical frame is the bottom short side, and its length is 60 mm.

[0049] like Figure 9 As shown, the transparent wafer fixture 9-1 is flat against the robotic arm position teaching fixture, and the robotic arm carries the transparent wafer fixture to move the wafer adjuster fixture position until the center hole 9-2 on the transparent wafer fixture is concentric with the center hole on the wafer adjuster fixture, thus completing the teaching of the robotic arm to the wafer adjuster fixture position.

[0050] Attachment Figure 10 As shown, the robotic arm used in the position teaching fixture of the present invention carries the transparent wafer fixture and moves to the cassette position to perform position teaching.

[0051] Figure 11 This is a diagram of the position teaching jig used by the robotic arm carrying the transparent wafer jig, moving it toward the cassette position for position teaching. The edge of the transparent wafer jig overlaps with the inner arc of the stationary cassette jig (that is, the center of the transparent wafer jig overlaps with the center of the inner arc of the cassette jig). The robotic arm is taught to the cassette position by moving the transparent wafer jig toward the cassette position until the edge of the transparent wafer jig overlaps with the inner arc 3-2 of the cassette jig (the cassette jig can be placed on any layer within the cassette, except the bottom layer).

[0052] Figure 12 This is a schematic cross-sectional view of the position teaching jig according to the present invention, in which a robotic arm carrying a transparent wafer jig moves toward the cassette position for position teaching, showing the edge of the transparent wafer jig coinciding with the inner arc of the stationary cassette jig (that is, the center point of the transparent wafer jig coincides with the center point of the inner arc of the cassette jig). The robotic arm carrying the transparent wafer jig is moved toward the cassette position until the edge of the transparent wafer jig coincides with the upper and lower positions of the inner arc 3-2 of the cassette jig, completing the teaching of the robotic arm to the cassette position (the cassette jig can be placed on any layer within the cassette, except the bottom layer).

[0053] Figure 13 The position teaching jig according to the present invention is used in a robotic arm carrying a transparent wafer jig, which is moved to the cassette position for position teaching. The cross-sectional rendering diagram shows the edge of the transparent wafer jig coinciding with the inner arc of the stationary cassette jig (that is, the center point of the transparent wafer jig coincides with the center point of the inner arc of the cassette jig). The robotic arm carrying the transparent wafer jig is moved to the cassette position until the edge of the transparent wafer jig coincides with the upper and lower positions of the inner arc 3-2 of the cassette jig. The teaching of the robotic arm to the cassette position is completed, showing the cassette cross-sectional rendering diagram (the cassette jig can be placed on any layer in the cassette, except the bottom layer).

[0054] Figure 14The film cassette jig used in the position teaching jig is placed approximately in the middle of the cassette, with its four infrared sensor beams passing through the four slits in the cassette jig's ears. By adjusting the infrared sensor's position, the sensor beam 14-1 passes through the slit 3-4 in the cassette jig's ear 3-3, thus completing the infrared sensor's position adjustment.

[0055] The present invention mainly aims to effectively improve the technical pain points of the above-mentioned problems, thereby ensuring the accuracy of the teaching position of the robot arm and meeting the operation requirements of semiconductor equipment.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate from the essence of the corresponding technical solutions.

Claims

1. A fixture suitable for teaching the position of a robotic arm inside a semiconductor device, characterized in that: The effective improvement of the wafer adaptation ensures the accuracy of the robot arm's teaching position and meets the operation requirements of semiconductor equipment. The fixture suitable for teaching the position of the robot arm inside the semiconductor equipment includes a transparent wafer fixture, a wafer positioning fixture and a cassette fixture. The wafer positioning fixture is used to position the wafer, and the cassette fixture is used to locate the center position of the wafer in the cassette and the position of the infrared sensor. The inner circle of the cassette fixture is similar to the shape of the wafer. It is a flat plate in the shape of a perfect circle. Its inner arc diameter is 300mm and the arc is 136°. The outer circle is clamped by the steps of each layer in the cassette, thereby fixing the cassette fixture so that it cannot move. Its outer arc diameter is 308.5mm and the arc is 224°. There are four ears around the cassette, and each ear has a 1mm wide slit to allow infrared light to pass through the slit to locate the position of the infrared sensor. The slit is 153.5mm away from the center point of the cassette fixture.

2. The jig suitable for teaching the position of a robot arm inside a semiconductor device according to claim 1, wherein: The transparent wafer fixture is similar in shape to the wafer, and is a flat plate in a perfect circular shape with a center hole at the center.

3. The jig suitable for teaching the position of a robot arm inside a semiconductor device according to claim 2, wherein: The center hole of the transparent wafer fixture is used to position the transparent wafer fixture, and the transparent material helps to find the electrostatic chuck fixture and the center hole easily during teaching. There are no protrusions on the outer circumference of the transparent wafer fixture, which is completely consistent with the wafer and can be applied to the wafer assembly tray without obstruction.

4. The jig suitable for teaching the position of a robot arm inside a semiconductor device according to any one of claims 1 to 3, wherein: The wafer positioning jig includes an arc-shaped holding frame. The wafer positioning jig with an arc-shaped holding frame has a triangular plate structure. The first frame of the wafer positioning jig with an arc-shaped holding frame is an arc. The arc of the first frame is directly the same as the straight diameter of the transparent wafer jig. During use, the transparent wafer jig is flat against the arc edge of the first frame.

5. The jig suitable for teaching the position of a robot arm inside a semiconductor device according to claim 4, wherein: The second and third frames of the wafer positioning jig with an arc-shaped holding frame are straight-side frames, which are connected to the bottom rectangular portion of the jig with an arc-shaped holding frame, and the second and third frames form the same angle with the short side of the bottom rectangular portion.

6. The jig suitable for teaching the position of a robot arm inside a semiconductor device according to claim 5, wherein: There are three notches on the film magazine fixture, the notch diameter is 13mm, and the center of the notch is 147.25mm away from the center point of the film magazine fixture.

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