Display screen and electronic device

Abstract

The application relates to a display screen and an electronic device. The display screen comprises a driving substrate and a light-emitting device. The driving substrate comprises a substrate, a driving circuit arranged on the substrate, and a plurality of pads electrically connected with the driving circuit. The light-emitting device comprises a plurality of pins for one-to-one connection with the pads. The plurality of pads comprises two first pads, and the two first pads are arranged in central symmetry with a preset axis as an object. The plurality of pins comprises two first pins for one-to-one connection with the first pads, and the two first pins are arranged in central symmetry with the preset axis as an object. The possibility of offset or rotation of the pins relative to the corresponding pads can be reduced, thereby improving the binding yield of the driving substrate and the light-emitting device.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display screen and an electronic device. Background Technology

[0002] The display screen includes a driving substrate and light-emitting devices electrically connected to the driving substrate. The driving substrate is used to control the light-emitting devices, and different image effects can be obtained by controlling the driving mode of different light-emitting devices.

[0003] However, the bonding yield of traditional display screens' driving substrates and light-emitting devices is relatively low. Summary of the Invention

[0004] Therefore, it is necessary to provide a display screen and electronic device to address the problem of low bonding yield of traditional display screen driving substrates and light-emitting devices.

[0005] According to one aspect of this application, a display screen is provided, comprising:

[0006] A driving substrate includes a substrate and a driving circuit disposed on the substrate, as well as a plurality of pads electrically connected to the driving circuit.

[0007] The light-emitting device includes a plurality of solder pads for connection to the pads in a one-to-one correspondence;

[0008] The plurality of pads includes two first pads, which are arranged in a centrally symmetrical manner with respect to a preset axis.

[0009] The plurality of solder pads includes two first solder pads for connecting one-to-one with the first solder pad, and the two first solder pads are arranged in a centrally symmetrical manner with respect to the preset axis.

[0010] In one embodiment, the plurality of pads further includes two second pads;

[0011] Two first pads are arranged opposite each other and spaced apart along a first diagonal direction, and two second pads are arranged opposite each other and spaced apart along a second diagonal direction, and the two second pads are arranged in a centrally symmetrical manner with respect to the preset axis.

[0012] The first diagonal direction is perpendicular to the second diagonal direction;

[0013] The plurality of solder feet also includes two second solder feet for connecting one-to-one with the second solder pad, the two second solder feet being arranged in a centrally symmetrical manner with respect to the preset axis.

[0014] In one embodiment, the first pad has the same construction as the second pad;

[0015] The first solder foot has the same structure as the second solder foot.

[0016] In one embodiment, the plurality of pads further includes a center pad;

[0017] A plane passing through the preset axis and parallel to the first direction is defined as the first plane, and a plane passing through the preset axis and parallel to the second direction is defined as the second plane. The first direction and the second direction are perpendicular to each other and both are parallel to the substrate.

[0018] The central pads are axially symmetric with respect to the first plane and the second plane, respectively, and the center of the central pads coincides with the preset axis.

[0019] The plurality of solder feet also includes a center solder foot for connecting to the center pad. The center solder foot has an axisymmetric structure with respect to the first plane and the second plane, and the center of the center solder foot coincides with the preset axis.

[0020] In one embodiment, the dimension of the central pad along the first direction is X1, and the dimension of the central pad along the second direction is Y1, where X1 = Y1;

[0021] The dimension of the center weld foot along the first direction is X2, and the dimension of the center weld foot along the second direction is Y2, where X2 = Y2.

[0022] In one embodiment, both the center pad and the center solder foot are configured as a cross shape.

[0023] In one embodiment, the area of ​​the central pad is greater than the total area of ​​all the first pads and all the second pads;

[0024] The area of ​​the center weld foot is greater than the total area of ​​all the first weld feet and all the second weld feet.

[0025] In one embodiment, a plane passing through the preset axis and parallel to the first direction is defined as a first plane, and a plane passing through the preset axis and parallel to the second direction is defined as a second plane, wherein the first direction and the second direction are perpendicular to each other and both parallel to the substrate;

[0026] The plurality of pads further includes two third pads, which are symmetrically distributed with respect to the first plane and are axially symmetrical with respect to the second plane; the plurality of solder pins further includes two third solder pins for connecting one-to-one with the third pads, which are symmetrically distributed with respect to the first plane and are axially symmetrical with respect to the second plane; and / or

[0027] The plurality of pads further includes two fourth pads, which are symmetrically distributed with respect to the second plane and are axially symmetrical with respect to the first plane; the plurality of solder feet further includes two fourth solder feet for connecting one-to-one with the fourth pads, which are symmetrically distributed with respect to the second plane and are axially symmetrical with respect to the first plane.

[0028] In one embodiment, the area of ​​the pad is larger than the area of ​​the corresponding solder foot.

[0029] In one embodiment, the orthographic projection of the pad on the substrate falls within the range of the orthographic projection of the corresponding solder foot on the substrate.

[0030] In one embodiment, the pads and the corresponding solder feet have the same shape, and the orthographic projection of the pads on the substrate is an axisymmetric or centrally symmetric figure.

[0031] According to another aspect of this application, an electronic device is provided, including the aforementioned display screen.

[0032] In the aforementioned display screen and electronic device, the first solder pins and first pads are arranged in a one-to-one correspondence, with the two first solder pins arranged symmetrically around a preset axis. Therefore, when the first solder pins are soldered to their corresponding first pads, the traction forces exerted by the two first pads on the two first solder pins along the first direction cancel each other out, and the traction forces exerted by the two first pads on the two first solder pins along the second direction also cancel each other out. This facilitates the alignment and bonding of the first solder pins to their corresponding first pads, reduces the possibility of offset or rotation of the solder pins relative to their corresponding pads, and thus improves the bonding yield of the driving substrate and the light-emitting device. Attached Figure Description

[0033] Figure 1 A schematic diagram of the display screen in one embodiment of this application is shown;

[0034] Figure 2 A partial structural schematic diagram of the driving substrate in one embodiment of this application is shown;

[0035] Figure 3A schematic diagram of the structure of a light-emitting device according to an embodiment of this application is shown;

[0036] Figure 4 This illustration shows a schematic diagram of the process of bonding a light-emitting device to a driving substrate in one embodiment of this application;

[0037] Figure 5 A schematic diagram of a light-emitting device bonded to a driving substrate in one embodiment of this application is shown;

[0038] Figure 6 A schematic diagram of the structure of the driving substrate in another embodiment of this application is shown;

[0039] Figure 7 This illustration shows a process of bonding a light-emitting device to a driving substrate in another embodiment of this application;

[0040] Figure 8 This illustration shows a schematic diagram of the process of bonding a light-emitting device to a driving substrate in another embodiment of this application;

[0041] Figure 9 This illustration shows a schematic diagram of the process of bonding a light-emitting device to a driving substrate in another embodiment of the present application;

[0042] Figure 10 A schematic diagram of the structure in one embodiment of this application, showing the center solder foot bound to the center solder pad, is shown.

[0043] Reference numerals: 10, display screen; 110, driving substrate; 111, board body; 112, pad; 1121, first pad; 1122, second pad; 1123, center pad; 1124, third pad; 11231, center portion; 11232, first side portion; 11233, second side portion; 120, light-emitting device; 121, solder foot; 1211, first solder foot; 1212, second solder foot; 1213, center solder foot; 130, first substrate; 140, second substrate; 150, adhesive layer. Detailed Implementation

[0044] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0045] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0047] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0048] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0049] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0050] The reason for the low bonding yield between the driver substrate and the light-emitting device is that in traditional displays, the pads of the driver substrate and the pins of the light-emitting device are usually connected by soldering. Due to the surface tension effect of tin, when the pins of the light-emitting device are attached to the pads of the driver substrate, they will move towards the area with a larger distribution area among the multiple pads, causing the pins to shift relative to the corresponding pads, which in turn leads to a low bonding yield between the driver substrate and the light-emitting device.

[0051] To address the issue of low bonding yield between the driving substrate and the light-emitting device, this application designs a display screen that rationally distributes multiple pads. This reduces the likelihood of misalignment between the pads and the corresponding pads when the light-emitting device's solder joints with the pads of the driving substrate, thereby improving the bonding yield between the driving substrate and the light-emitting device.

[0052] Figure 1 A schematic diagram of the display screen in one embodiment of this application is shown. Figure 2 A partial structural schematic diagram of the driving substrate in one embodiment of this application is shown.

[0053] Please see Figure 1 An embodiment of this application provides a display screen 10, which includes a driving substrate 110 and a light-emitting device 120.

[0054] Please see Figure 2 and Figure 3 The driving substrate 110 includes a board body 111 and a driving circuit disposed on the board body 111, as well as a plurality of pads 112 electrically connected to the driving circuit. The light-emitting device 120 includes a plurality of solder feet 121 for connecting one-to-one with the pads 112.

[0055] The board body 111 can be made of a highly transparent electrical insulation material, for example, the material of the board body 111 is polyester resin (PET).

[0056] The light-emitting device 120 is a device capable of emitting light, such as an LED. The display screen 10 includes multiple light-emitting devices 120. The driving circuit is used to control the multiple light-emitting devices 120 by means of corresponding pads 112 and solder pins 121. By controlling the driving mode of different light-emitting devices 120, the display screen 10 can display images with different effects.

[0057] Among them, the multiple pads 112 include two first pads 1121, which are arranged in a centrally symmetrical manner with a preset axis as the object.

[0058] A plane passing through a preset axis and parallel to the first direction F1 is defined as the first plane S1, and a plane passing through a preset axis and parallel to the second direction F2 is defined as the second plane S2. The first direction F1 and the second direction F2 are perpendicular to each other and both are parallel to the plate 111.

[0059] It is understandable that the preset axis is located at the intersection of the first plane S1 and the second plane S2. Since the two first pads 1121 are arranged in a centrally symmetrical manner with respect to the preset axis, if the orthographic projections of the two first pads 1121 on the board 111 are the first projection and the second projection, respectively, then the symmetrical figure of the first projection with respect to the first plane S1 and the symmetrical figure of the second projection with respect to the second plane S2 completely coincide with each other.

[0060] The plurality of solder pads 121 include two first solder pads 1211 for connecting one-to-one with the first solder pads 1121, and the two first solder pads 1211 are arranged in a centrally symmetrical manner with respect to a preset axis.

[0061] It is understandable that before the first solder pad 1211 is soldered to the corresponding first solder pad 1121, if the orthographic projections on the board 111 of the two first solder pads 1211 are the third projection and the fourth projection respectively, then the symmetrical figure of the third projection relative to the first plane S1 and the symmetrical figure of the fourth projection relative to the second plane S2 can completely coincide with each other.

[0062] Since the symmetrical pattern of the first projection relative to the first plane S1 and the symmetrical pattern of the second projection relative to the second plane S2 completely coincide, and considering the one-to-one correspondence between the first solder pin 1211 and the first solder pad 1121, and the two first solder pins 1211 are arranged centrally symmetrically with respect to a preset axis, when the first solder pin 1211 is soldered to the corresponding first solder pad 1121, the traction force along the first direction F1 formed by the two first solder pads 1121 on the two first solder pins 1211 cancels each other out, and the traction force along the second direction F2 formed by the two first solder pads 1121 on the two first solder pins 1211 also cancels each other out. This facilitates the alignment and bonding of the first solder pin 1211 to the corresponding first solder pad 1121 (e.g., ...). Figure 4As shown, this reduces the possibility of the solder pad 121 shifting or rotating relative to the corresponding pad 112, thereby improving the bonding yield of the driving substrate 110 and the light-emitting device 120.

[0063] In some embodiments, please refer to Figure 2 and Figure 3 The plurality of pads 112 further includes two second pads 1122. The two first pads 1121 are arranged opposite each other and spaced apart along a first diagonal direction F3, and the two second pads 1122 are arranged opposite each other and spaced apart along a second diagonal direction F4. The two second pads 1122 are arranged in a centrally symmetrical manner with respect to a preset axis. The plurality of solder pins 121 further includes two second solder pins 1212 for connecting one-to-one with the second pads 1122. The two second solder pins 1212 are arranged in a centrally symmetrical manner with respect to a preset axis.

[0064] The first diagonal direction F3 and the second diagonal direction F4 are perpendicular to each other and are both set at an angle to the first direction and the second direction, respectively; the first diagonal direction F3 and the second diagonal direction F4 are both parallel to the plate 111. Specifically, the first diagonal direction F3 and the second diagonal direction F4 are both set at a 45° angle to the first direction and the second direction, respectively.

[0065] It is understood that the symmetrical structure of one second pad 1122 relative to the first plane S1 and the symmetrical structure of the other second pad 1122 relative to the second plane S2 completely coincide with each other, and the symmetrical structure of one second solder foot 1212 relative to the first plane S1 and the symmetrical structure of the other second solder foot 1212 relative to the second plane S2 completely coincide with each other. Thus, when the solder foot 121 is soldered to the corresponding pad 112, the pulling force along the first direction F1 formed by the two second pads 1122 on the two second solder feet 1212 cancels each other out, and the pulling force along the second direction F2 formed by the two second pads 1122 on the two second solder feet 1212 also cancels each other out. This is beneficial for the first solder foot 1211 to be aligned and bonded to the corresponding first pad 1121, and also beneficial for the second solder foot 1212 to be aligned and bonded to the corresponding second pad 1122 (in conjunction with...). Figure 4 and Figure 5 (To understand), further reduce the possibility of offset and rotation of solder pad 121 relative to the corresponding pad 112, thereby improving the bonding yield of drive substrate 110 and light-emitting device 120.

[0066] In some embodiments, the distance between the center of the pad 112 and the preset axis is equal to the distance between the center of the corresponding solder foot 121 and the preset axis. That is, a cylindrical surface with a preset radius centered on the preset axis passes through the center of the pad 112 and the center of the corresponding solder foot 121, which is more conducive to the first solder foot 1211 being aligned and bound to the corresponding first pad 1121, and also more conducive to the second solder foot 1212 being aligned and bound to the corresponding second pad 1122.

[0067] In some embodiments, the first pad 1121 has the same structure as the second pad 1122, and the first solder foot 1211 has the same structure as the second solder foot 1212.

[0068] With this configuration, the four pads 112 are evenly distributed around the preset axis, and the four solder feet 121 are also evenly distributed around the preset axis. This is more conducive to the first solder foot 1211 being aligned and bonded to the corresponding first pad 1121, and also to the second solder foot 1212 being aligned and bonded to the corresponding second pad 1122. This can effectively improve the bonding yield of the driving substrate 110 and the light-emitting device 120.

[0069] In some embodiments, please refer to Figure 2 and Figure 3 The plurality of pads 112 further includes a center pad 1123, which is axially symmetric about the first plane S1 and the second plane S2, and the center of the center pad 1123 coincides with a preset axis. The plurality of leads 121 further includes a center lead 1213 for connecting to the center pad 1123, which is axially symmetric about the first plane S1 and the second plane S2, and the center of the center lead 1213 coincides with a preset axis.

[0070] It is understandable that the center pad 1123 and the center pin 1213 are centered relative to the preset axis. Thus, when the pin 121 is soldered to the corresponding pad 112, the arrangement of the center pad 1123 and the center pin 1213 facilitates the alignment and bonding of the center pin 1213 to the center pad 1123. Furthermore, with the center pin 1213 aligned and bonded to the center pad 1123, the first pin 1211 can also be better aligned and bonded to the corresponding first pad 1121, and the second pin 1212 can also be better aligned and bonded to the corresponding second pad 1122 (e.g., ...). Figure 4 As shown, this can effectively improve the bonding yield of the driving substrate 110 and the light-emitting device 120.

[0071] In some embodiments, such as Figure 6As shown, the dimension of the center pad 1123 along the first direction F1 is X1, and the dimension of the center pad 1123 along the second direction F2 is Y1, X1 = Y1; the dimension of the center solder foot 1213 along the first direction F1 is X2, and the dimension of the center solder foot 1213 along the second direction F2 is Y2, X2 = Y2.

[0072] Since X1 = Y1 and X2 = Y2, the binding force formed by the central pad 1123 on the central solder foot 1213 can be evenly distributed along the circumferential direction around the preset axis, reducing the possibility of the central solder foot 1213 rotating relative to the central pad 1123 and improving the alignment and binding effect between the central solder foot 1213 and the central pad 1123.

[0073] In some embodiments, both the center pad 1123 and the center pad 1213 are configured as a cross shape. Specifically, the center pad 1123 includes a central portion 11231 whose center falls on a predetermined axis, two first side portions 11232 connected to opposite sides of the central portion 11231 along a first direction F1, and two second side portions 11233 (e.g., ...) connected to opposite sides of the central portion 11231 along a second direction F2. Figure 2 As shown, when the solder foot 121 is soldered to the corresponding solder pad 112, the traction force formed by the two first side portions 11232 on the center solder foot 1213 along the first direction F1 cancels each other out, and the traction force formed by the two second side portions 11233 on the center solder foot 1213 along the second direction F2 also cancels each other out, which is beneficial to improving the alignment and bonding effect between the center solder foot 1213 and the center solder pad 1123.

[0074] Of course, this application is not limited to this, and the center pad 1123 and the center pad 1213 can also be axisymmetric structures other than the cross-shaped structure.

[0075] In some embodiments, the area of ​​the center pad 1123 is greater than the total area of ​​all the first pads 1121 and all the second pads 1122, and the area of ​​the center pad 1213 is greater than the total area of ​​all the first pads 1211 and all the second pads 1212.

[0076] Since the center solder pad 1213 and the center pad 1123 have larger areas, when the center solder pad 1213 is aligned and bonded to the center pad 1123, the first solder pad 1211 can be better aligned and bonded to the corresponding first pad 1121, and the second solder pad 1212 can also be better aligned and bonded to the corresponding second pad 1122, which can effectively improve the bonding yield of the driving substrate 110 and the light-emitting device 120.

[0077] In some embodiments, such as Figure 7As shown, the plurality of pads 112 also include two third pads 1124, which are symmetrically distributed with respect to the first plane S1 and have an axisymmetric structure with respect to the second plane S2; the plurality of solder feet also include two third solder feet for connecting one-to-one with the third pads 1124, which are symmetrically distributed with respect to the first plane S1 and have an axisymmetric structure with respect to the second plane S2.

[0078] By using two third pads 1124 and two third pins, it is beneficial for the first pin 1211 to be better aligned and bonded to the corresponding first pad 1121, and it is also beneficial for the second pin 1212 to be better aligned and bonded to the corresponding second pad 1122, thereby improving the bonding yield of the driving substrate 110 and the light-emitting device 120.

[0079] In other embodiments, the plurality of pads 112 further include two fourth pads, which are symmetrically distributed with respect to the second plane S2 and are axially symmetrical with respect to the first plane S1; the plurality of solder feet 121 further include two fourth solder feet for connecting one-to-one with the fourth pads, which are symmetrically distributed with respect to the second plane S2 and are axially symmetrical with respect to the first plane S1.

[0080] By using two fourth pads and two fourth pins, it is beneficial for the first pin 1211 to be better aligned and bonded to the corresponding first pad 1121, and it is also beneficial for the second pin 1212 to be better aligned and bonded to the corresponding second pad 1122, thereby improving the bonding yield of the driving substrate 110 and the light-emitting device 120.

[0081] In some embodiments, the plurality of pads 112 further include two third pads 1124 and two fourth pads, and the plurality of leads 121 further include two third leads and two fourth leads.

[0082] In some embodiments, the area of ​​the pad 112 is larger than the area of ​​the corresponding solder foot 121.

[0083] In other words, the area of ​​the first pad 1121 is larger than the area of ​​the corresponding first solder foot 1211, the area of ​​the second pad 1122 is larger than the area of ​​the corresponding second solder foot 1212, the area of ​​the center pad 1123 is larger than the area of ​​the center solder foot 1213, the area of ​​the third pad 1124 is larger than the area of ​​the corresponding third solder foot, and the area of ​​the fourth pad is larger than the area of ​​the corresponding fourth solder foot.

[0084] In this way, the driving substrate 110 can be laid out according to the preset axis first, and then the light-emitting device 120 can be laid out according to the preset axis. Since the area of ​​the pad 112 is large, it is beneficial for the solder feet of the light-emitting device 120 to be finely adjusted according to the large area of ​​the pad 112 during the soldering process. This improves the convenience of bonding the driving substrate 110 and the light-emitting device 120, and also improves the bonding effect.

[0085] In some embodiments, the orthographic projection of the pad 112 on the board 111 falls within the range of the orthographic projection of the corresponding solder pad 121 on the board 111.

[0086] Understandably, during the soldering process, the solder feet 121 of the light-emitting device 120 are adjusted to a small extent relative to the corresponding pads 112, so that the solder feet 121 can be aligned and bonded to the corresponding pads 112.

[0087] In some embodiments, the pads 112 and the corresponding solder feet 121 have the same shape, and the orthographic projection of the pads 112 onto the board 111 is an axisymmetric or centrally symmetric figure.

[0088] It is understandable that, such as Figure 8-10 As shown, the shapes of the pads 112 and the corresponding pads 121 can be triangles, isosceles trapezoids, parallelograms, squares or rectangles, or other axisymmetric or centrally symmetric structures.

[0089] This facilitates the arrangement of the two first pads 1121 in a centrally symmetrical manner with respect to the preset axis, and also facilitates the arrangement of the two second pads 1122 in a centrally symmetrical manner with respect to the preset axis. This improves the convenience of bonding the driving substrate 110 and the light-emitting device 120, while also enhancing the bonding effect.

[0090] In some embodiments, the display screen 10 further includes a first substrate 130 and a second substrate 140, a driving substrate 110 and a light-emitting device 120 disposed between the first substrate 130 and the second substrate 140, both of which are transparent substrates, for example, the first substrate 130 and the second substrate 140 can be glass plates, and the plate body 111 of the driving substrate 110 can also be a transparent substrate, such as a PET substrate, which can improve the light transmittance of the display screen 10.

[0091] The display screen 10 also includes two adhesive layers 150 respectively disposed between the first substrate 130 and the plate body 111, and between the second substrate 140 and the plate body 111. The adhesive layers 150 can be transparent adhesive layers.

[0092] An embodiment of this application provides an electronic device including the aforementioned display screen 10.

[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display screen, characterized in that, include: A driving substrate includes a substrate and a driving circuit disposed on the substrate, as well as a plurality of pads electrically connected to the driving circuit. The light-emitting device includes a plurality of solder pads for connection to the pads in a one-to-one correspondence; The plurality of pads includes two first pads, which are arranged in a centrally symmetrical manner with respect to a preset axis. The plurality of solder pads includes two first solder pads for connecting one-to-one with the first solder pads, and the two first solder pads are arranged in a centrally symmetrical manner with respect to the preset axis. The plurality of pads also includes a center pad; A plane passing through the preset axis and parallel to the first direction is defined as the first plane, and a plane passing through the preset axis and parallel to the second direction is defined as the second plane. The first direction and the second direction are perpendicular to each other and both are parallel to the substrate. The central pads are axially symmetric with respect to the first plane and the second plane, respectively, and the center of the central pads coincides with the preset axis. The plurality of solder pads also include a central solder pad for connecting to the central solder pad. The central solder pads are axially symmetric about the first plane and the second plane, respectively, and the center of the central solder pads coincides with the preset axis. The dimension of the central pad along the first direction is X1, and the dimension of the central pad along the second direction is Y1, where X1 = Y1; The dimension of the center weld leg along the first direction is X2, and the dimension of the center weld leg along the second direction is Y2, where X2 = Y2; The center pad includes a center portion whose center falls on a preset axis, two first side portions connected to opposite sides of the center portion along a first direction, and two second side portions connected to opposite sides of the center portion along a second direction.

2. The display screen according to claim 1, characterized in that, The plurality of pads also includes two second pads; Two first pads are arranged opposite each other and spaced apart along a first diagonal direction, and two second pads are arranged opposite each other and spaced apart along a second diagonal direction, and the two second pads are arranged in a centrally symmetrical manner with respect to the preset axis. The first diagonal direction is perpendicular to the second diagonal direction; The plurality of solder feet also includes two second solder feet for connecting one-to-one with the second solder pad, the two second solder feet being arranged in a centrally symmetrical manner with respect to the preset axis.

3. The display screen according to claim 2, characterized in that, The first pad has the same structure as the second pad; The first solder foot has the same structure as the second solder foot.

4. The display screen according to claim 2 or 3, characterized in that, The distance between the center of the pad and the preset axis is equal to the distance between the center of the corresponding solder foot and the preset axis.

5. The display screen according to claim 4, characterized in that, The display screen also includes a first substrate and a second substrate, with a driving substrate and a light-emitting device disposed between the first substrate and the second substrate. Both the first substrate and the second substrate are transparent substrates.

6. The display screen according to claim 4, characterized in that, Both the center pad and the center solder foot are constructed in a cross shape.

7. The display screen according to claim 4, characterized in that, The area of ​​the central pad is greater than the total area of ​​all the first pads and all the second pads; The area of ​​the center weld foot is greater than the total area of ​​all the first weld feet and all the second weld feet.

8. The display screen according to any one of claims 1-3, characterized in that, A plane passing through the preset axis and parallel to the first direction is defined as the first plane, and a plane passing through the preset axis and parallel to the second direction is defined as the second plane. The first direction and the second direction are perpendicular to each other and both are parallel to the substrate. The plurality of pads further includes two third pads, which are symmetrically distributed with respect to the first plane and are axially symmetrical with respect to the second plane; the plurality of solder pins further includes two third solder pins for connecting one-to-one with the third pads, which are symmetrically distributed with respect to the first plane and are axially symmetrical with respect to the second plane; and / or The plurality of pads further includes two fourth pads, which are symmetrically distributed with respect to the second plane and are axially symmetrical with respect to the first plane; the plurality of solder feet further includes two fourth solder feet for connecting one-to-one with the fourth pads, which are symmetrically distributed with respect to the second plane and are axially symmetrical with respect to the first plane.

9. The display screen according to any one of claims 1-3, characterized in that, The area of ​​the pad is larger than the area of ​​the corresponding solder foot.

10. The display screen according to claim 9, characterized in that, The orthographic projection of the pad on the substrate falls within the range of the orthographic projection of the corresponding solder foot on the substrate.

11. The display screen according to any one of claims 1-3, characterized in that, The pads and the corresponding solder feet have the same shape, and the orthographic projection of the pads on the substrate is an axisymmetric or centrally symmetric figure.

12. An electronic device, characterized in that, Includes the display screen as described in any one of claims 1-11.

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