Flexible Circuit Board Thin Film Material Lamination Device

Abstract

This invention relates to a flexible printed circuit board (PCB) film material lamination device. The device includes a frame, a film conveying device, a PCB conveying device, a film lamination and receiving device, and a controller. The film conveying device includes a film dispensing device, a film cutting device, and a waste recycling device sequentially arranged on the frame. The PCB conveying device includes a PCB dispensing device and a PCB identification and positioning device sequentially arranged on the frame. The film lamination and receiving device includes a film pressing device and a PCB winding device sequentially arranged on the frame, with the film pressing device located between the film cutting device and the PCB identification and positioning device. The controller is located on the frame and connected to each device. This invention solves the problems in related technologies where pre-drilling or cutting is required when laminating flexible printed circuit boards and film materials, resulting in numerous processes, and where automated production is difficult to achieve for large flexible printed circuit boards, leading to low production efficiency and high costs.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a flexible circuit board thin film material bonding device. Background Technology

[0002] In recent years, driven by the growth of smartphones, PCs (Personal Computers), and new energy vehicles, flexible printed circuit boards (FPCs) have maintained a high growth rate every year. The production process of FPCs involves many positioning and bonding processes of film materials, including the positioning and bonding of protective films, electromagnetic shielding films, and adhesive films.

[0003] Currently, there are two main methods for positioning and bonding film materials in FPC production: one is sheet-to-sheet bonding, where both the circuit board and the film material are sheets, with pre-set positioning holes or points. Positioning and bonding are achieved manually using a mold or by a robotic arm identifying these points. The other method involves one of the circuit board and film material being a sheet and the other a roll, both pre-set with positioning holes or points. The roll is fed to the bonding position on the laminating machine and stopped. The sheet and roll are aligned manually using a mold or by a robotic arm identifying the positioning points before being pressed together. The roll then continues to the next position for bonding. Both methods require pre-drilling or cutting the film material, involving numerous steps. When the flexible circuit board is large, it is difficult for the robotic arm to automatically pick it up, and the molds used for positioning are also large, making automation difficult, resulting in low efficiency and high machine investment costs. Summary of the Invention

[0004] This invention provides a flexible circuit board film material bonding device, which can solve the problems in related technologies where bonding flexible circuit boards and film materials requires pre-drilling or cutting, resulting in many processes, and when the flexible circuit boards are large, it is difficult to achieve automated production, resulting in low production efficiency and high cost.

[0005] In a first aspect, the present invention provides a flexible circuit board thin film material bonding device, comprising:

[0006] frame;

[0007] The film conveying equipment includes a film discharging device, a film cutting device, and a waste recycling device, which are sequentially arranged on the frame.

[0008] The circuit board conveying equipment includes a circuit board unloading device and a circuit board identification and positioning device sequentially arranged on the frame;

[0009] A film laminating and take-up device includes a film laminating device and a circuit board take-up device sequentially mounted on the frame. The film laminating device is located after the film cutting device in the forward direction of the film roll and after the circuit board identification and positioning device in the forward direction of the circuit board roll; and...

[0010] The controller is mounted on the frame and is connected to the film feeding device, the film cutting device, the waste recycling device, the circuit board feeding device, the circuit board identification and positioning device, the film pressing device, and the circuit board winding device.

[0011] Optionally, the film cutting equipment includes a film cutting platform and a horizontal plane moving platform mounted on the frame, and a laser cutter mounted on the horizontal plane moving platform. The film cutting platform, the horizontal plane moving platform and the laser cutter are all connected to the controller.

[0012] The laser cutter is located above the thin film cutting platform. The thin film cutting platform is provided with a laser positioning point, which corresponds to and cooperates with the laser cutter to locate the origin position of the laser cutter.

[0013] Optionally, the film cutting platform includes a cutting support table disposed on the frame and a vacuum adsorption device disposed at the bottom of the cutting support table;

[0014] The cutting support platform is arranged vertically and vertically corresponding to the horizontal plane moving platform, the laser positioning point is located on the cutting support platform, and the vacuum adsorption device is connected to the controller.

[0015] Optionally, the horizontal plane moving platform is configured as a linear motor positioning platform, wherein the stroke of the linear motor positioning platform is greater than or equal to 350 mm and the repeatability is less than or equal to 5 μm.

[0016] Optionally, the linear motor positioning platform includes two positioning brackets arranged side by side on the frame, a longitudinal motor moving structure on each of the positioning brackets, and a transverse motor moving structure on the two longitudinal motor moving structures, with the laser cutter located on the transverse motor moving structure.

[0017] Optionally, the circuit board identification and positioning device includes a circuit board positioning platform and a circuit board identification camera mounted on the rack, with the circuit board identification camera located above the circuit board positioning platform;

[0018] The circuit board recognition camera is connected to the controller and is used to identify circuit board marking information on the circuit board roll passing through the circuit board positioning platform.

[0019] Optionally, when the circuit board recognition camera identifies the flexible circuit board on the circuit board positioning platform, the first distance between the location of the circuit board recognition camera and the film laminating device is L1.

[0020] The second distance between the location of the laser positioning point and the film lamination device is L2;

[0021] The first distance L1 and the second distance L2 have the following relationship: 300mm≤L1≤2000mm, and L1-50mm≤L2≤L1+50mm.

[0022] Optionally, the film pressing equipment includes a pressure roller lifting drive structure mounted on the frame, a lower pressing roller rotatably connected to the pressure roller lifting drive structure, and an upper pressing roller corresponding to the lower pressing roller, wherein the upper pressing roller is rotatably mounted on the frame.

[0023] Both the lower pressing roller and the upper pressing roller are equipped with heaters, and the heating temperature range of the heaters is 50℃-150℃.

[0024] Optionally, both the lower pressing roller and the upper pressing roller include a main roller body and a silicone rubber layer, a stainless steel layer, or a ceramic layer covering the main roller body.

[0025] Optionally, the film feeding device includes a film roll feeding roller, a film roll alignment device, a film roll receiving platform, and a film roll tensioning roller at each end of the film cutting device, which are sequentially arranged on the frame.

[0026] The circuit board unloading equipment includes a circuit board roll unloading roller, a circuit board roll correction device, a circuit board roll receiving platform, and a circuit board roll tensioning roller at each end of the circuit board identification and positioning device, which are sequentially arranged on the frame.

[0027] The circuit board winding equipment includes a first finished circuit board tensioning roller, a finished circuit board correction device, a second finished circuit board tensioning roller, a finished circuit board receiving platform, and a finished circuit board winding roller, all sequentially arranged on the frame.

[0028] The beneficial effects of the technical solution provided by this invention include:

[0029] The flexible circuit board film material laminating device provided by this invention, under the control of a controller, can discharge film rolls through the film discharging device of a film conveying equipment, and then transport the film rolls to a film cutting device to cut them into film rolls with windows. The film waste generated during cutting can be recovered through a waste recycling device. Simultaneously, the circuit board discharging device of the circuit board conveying equipment can discharge the circuit board rolls and transport them to a circuit board identification and positioning device, which can identify and position the circuit board rolls. The equipment obtains information such as the model, location, shape, and size of the circuit board segment to be bonded on the circuit board roll. The film cutting equipment can also cut the film roll according to the model, location, shape, and size of the circuit board segment to be bonded, so as to obtain a windowed film roll to be bonded to the circuit board segment. Then, the identified and positioned circuit board roll and the cut windowed film roll can be conveyed to the film pressing equipment for hot pressing and bonding, and the bonded circuit board roll can be wound up by the circuit board winding equipment.

[0030] This allows for continuous roll-to-roll bonding of circuit board rolls and film rolls, eliminating the need for pre-drilling or cutting the film materials, thus reducing production steps. Furthermore, when the flexible circuit board is large, it can be automatically transported in roll form without the need for large-sized molds for positioning. This facilitates the automation of flexible circuit board film bonding and is suitable for bonding flexible circuit boards and film materials of different sizes. It offers high production efficiency, wide adaptability, and reduced production costs. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a simplified structural diagram of the flexible circuit board thin film material bonding device according to an embodiment of the present invention;

[0033] Figure 2 This is a simplified schematic diagram of the structure of the film cutting platform of the film cutting equipment described in an embodiment of the present invention;

[0034] Figure 3 This is a simplified structural diagram of the horizontal plane moving platform and laser cutter of the film cutting equipment described in this embodiment of the invention.

[0035] Reference numerals: 100, frame; 200, film output device; 210, film roll output roller; 220, film roll receiving platform; 230, film roll guide; 240, film roll tensioning roller; 300, film cutting device; 310, film cutting platform; 312, cutting support table; 3122, laser positioning point; 3124, adsorption hole; 316, vacuum adsorption device; 320, horizontal plane moving platform; 322, positioning bracket; 324, longitudinal motor moving structure; 3242, longitudinal moving bracket; 3244, longitudinal moving guide rail; 3246, longitudinal linear drive motor; 3248, longitudinal moving slider; 326, transverse motor moving structure; 3262, transverse moving bracket; 3264, transverse moving guide rail; 3266, transverse linear drive motor; 3268, transverse moving... 330. Moving slider; 400. Laser cutter; 410. Waste recycling equipment; 420. Waste winding roller; 500. Circuit board unloading equipment; 510. Circuit board roll unloading roller; 520. Circuit board roll receiving platform; 530. Circuit board roll alignment device; 540. Circuit board roll tension roller; 600. Circuit board identification and positioning equipment; 610. Circuit board positioning platform; 620. Circuit board identification camera; 700. Film pressing equipment; 710. Upper pressing roller; 720. Lower pressing roller; 730. Pressure roller lifting drive structure; 800. Circuit board winding equipment; 810. Circuit board finished product winding roller; 820. Circuit board finished product receiving platform; 830. Circuit board finished product alignment device; 840. First circuit board finished product tension roller; 850. Second circuit board finished product tension roller; 900. Controller. Detailed Implementation

[0036] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The present invention will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0037] In traditional technologies, the film material needs to be pre-drilled or cut during the positioning and bonding process of flexible printed circuit boards (PCBs), which involves numerous steps. When the PCB is large, it is difficult for a robotic arm to pick it up automatically, and the molds used for positioning are also large, making automation difficult, resulting in low efficiency and high machine investment costs. To solve the above technical problems, this invention proposes a PCB film material bonding device, method, and system.

[0038] like Figure 1As shown, this embodiment provides a flexible circuit board film material lamination device, including a frame 100, a film conveying device, a circuit board conveying device, and a film lamination and receiving device disposed on the frame 100, and a controller 900 connected to the film conveying device, the circuit board conveying device, and the film lamination and receiving device. Under the control of the controller 900, the film conveying device can convey the film material to the film lamination and receiving device, and the circuit board conveying device can convey the circuit board material to the film lamination and receiving device. The film lamination and receiving device can then laminate the film material and the circuit board material to obtain a circuit board product.

[0039] Specifically, the film conveying equipment may include a film dispensing device 200, a film cutting device 300, and a waste recycling device 400, sequentially mounted on the frame 100. A controller 900 is mounted on the frame 100 and connected to the film dispensing device 200, the film cutting device 300, and the waste recycling device 400. Under the control of the controller 900, the film dispensing device 200 can dispense the film roll, which is then conveyed to the film cutting device 300 for cutting into windowed film rolls. The waste film generated during cutting can be collected via the waste recycling device 400.

[0040] Furthermore, the circuit board conveying equipment may include a circuit board unloading device 500 and a circuit board identification and positioning device 600 sequentially mounted on the frame 100. The controller 900 is connected to both the circuit board unloading device 500 and the circuit board identification and positioning device 600. Simultaneously, under the control of the controller 900, the circuit board unloading device 500 of the circuit board conveying equipment can unload the circuit board roll and convey it to the circuit board identification and positioning device 600. The circuit board identification and positioning device 600 can identify and position the circuit board roll, obtaining information such as the model, position, shape, and size of the circuit board segment to be bonded on the circuit board roll. The film cutting device 300 can also cut the film roll according to the model, position, shape, and size information of the circuit board segment to be bonded, thereby obtaining a windowed film roll corresponding to the circuit board segment to be bonded.

[0041] Furthermore, the film lamination and take-up equipment may include a film pressing device 700 and a circuit board winding device 800 sequentially mounted on the frame 100. The film pressing device 700 may be located after the film cutting device in the forward direction of the film roll and after the circuit board identification and positioning device 600 in the forward direction of the circuit board roll. The circuit board winding device 800 may be located after the film pressing device 700. The controller 900 is connected to both the film pressing device 700 and the circuit board winding device 800. Under the control of the controller 900, the identified and positioned circuit board roll and the cut film roll with windows can be simultaneously conveyed to the film pressing device 700 for hot pressing and lamination, and the laminated circuit board roll can be wound up by the circuit board winding device 800.

[0042] This allows for continuous roll-to-roll bonding of circuit board rolls and film rolls, eliminating the need for pre-drilling or cutting the film materials, thus reducing production steps. Furthermore, when the flexible circuit board is large, it can be automatically transported in roll form without the need for large-sized molds for positioning. This facilitates the automation of flexible circuit board film bonding and is suitable for bonding flexible circuit boards and film materials of different sizes. It offers high production efficiency, wide adaptability, and reduced production costs.

[0043] Furthermore, the film feeding device 200 may include a film roll feeding roller 210, a film roll alignment device 230, a film roll receiving platform 220, and a film roll tensioning roller 240 at each end of the film cutting device 300, all sequentially arranged on the frame 100. Under the control of the controller 900, the film roll feeding roller 210 can convey the rolled film roll towards the film cutting device 300; and during the conveying process, the film roll alignment device 230 can correct the film roll, ensuring that the film roll is conveyed in the correct posture without deflection, facilitating subsequent alignment and bonding with the flexible circuit board; when a roll of film roll is used up, a new roll of film roll needs to be output through the film roll feeding roller 210, and in order to ensure continuous bonding between the flexible circuit board and the film material, the film roll receiving platform 220 needs to connect the new film roll and the original film roll to achieve continuous production. Furthermore, by setting the film roll tensioning roller 240, the film roll can be tensioned, which is more conducive to the conveying of the film roll and also facilitates the cutting of the film roll by the film cutting equipment 300. In addition, the film roll discharge roller 210 can be driven by a motor to achieve automatic feeding, or it can be passively fed under the feeding pull of the circuit board winding equipment 800.

[0044] In addition, such as Figure 2 and Figure 3As shown, the film cutting equipment 300 may include a film cutting platform 310 and a horizontal plane moving platform 320 mounted on the frame 100, and a laser cutter 330 mounted on the horizontal plane moving platform 320. The film cutting platform 310, the horizontal plane moving platform 320, and the laser cutter 330 are all connected to the controller 900, with the laser cutter 330 positioned above the film cutting platform 310. After the film roll is conveyed to the film cutting platform 310 of the film cutting equipment 300 by the film roll feed roller 210, the film cutting platform 310 can adsorb the film roll located on it under the action of the controller 900. Then, the laser cutter 330 on the horizontal plane moving platform 320 cuts the adsorbed film roll to obtain a film roll with windows to be laminated. During the process of cutting the film roll material by the laser cutter 330, the position of the laser cutter 330 can be adjusted by the horizontal plane moving platform 320, so as to cut out the film roll material with windows of the corresponding shape and size according to the shape and size of the flexible circuit board to be bonded.

[0045] Furthermore, film materials are typically placed on release film, meaning the film roll is also placed on the release film roll. When cutting the film roll with laser cutter 330, the laser cutter 330 faces away from the release film side. When cutting the film roll with release film, the laser cutter 330 needs to cut the film roll into individual film rolls with openings while maintaining the continuity of the release film roll. Different materials require different laser cutting energies, which can be adjusted before use. When bonding the film roll with openings to the circuit board roll, the film roll with openings can first be peeled off from the release film roll, and then the individual film roll with openings can be conveyed to the film laminating equipment 700 for pressing and bonding with the corresponding circuit board segment on the circuit board roll.

[0046] Furthermore, the film cutting platform 310 is equipped with a laser positioning point 3122, which corresponds to and cooperates with the laser cutter 330 to position the origin of the laser cutter 330. By setting the laser positioning point 3122 on the film cutting platform 310, the laser cutter 330 can move to the laser positioning point 3122 for positioning before cutting the film roll, and use the laser positioning point 3122 as the origin of the laser cutter 330 for cutting the film roll.

[0047] Furthermore, the film cutting platform 310 may include a cutting support table 312 mounted on the frame 100, and a vacuum adsorption device 316 mounted at the bottom of the cutting support table 312. The cutting support table 312 is vertically aligned with the horizontal planar moving platform 320, the laser positioning point 3122 is located on the cutting support table 312, and the vacuum adsorption device 316 is connected to the controller 900. The two film roll tensioning rollers 240 of the film feeding device 200 may be respectively mounted at both ends of the cutting support table 312, and can tension the film rolls located on the cutting support table 312 from both ends. Then, the vacuum adsorption device 316 can be used to adsorb the film rolls on the cutting support table 312, facilitating the laser cutter to cut the film rolls.

[0048] Furthermore, the cutting support table 312 may include two platform support brackets arranged side by side on the frame 100, and a cutting support plate provided on the two platform support brackets. The cutting support plate is provided with multiple suction holes 3124, and the laser positioning point 3122 is also provided at one corner of the cutting support plate. The vacuum suction device 316 may include a vacuum suction tube provided below the cutting support plate, and a vacuum pumping device connected to the vacuum suction tube. The vacuum suction tube is connected to the multiple suction holes 3124 on the cutting support plate. When the film roll is conveyed to the cutting support plate, the vacuum suction tube can be suctioned by the vacuum pumping device, so that the multiple suction holes 3124 on the cutting support plate position the film roll on the cutting support plate, preventing the film roll from moving during the cutting process and affecting the cutting accuracy, thereby facilitating the laser cutter above the cutting support table to cut the film roll.

[0049] Furthermore, the horizontal plane moving platform 320 of the film cutting equipment 300 can be configured as a linear motor positioning platform. The stroke of the linear motor positioning platform is greater than or equal to 350 mm, and the repeatability is less than or equal to 5 μm. The linear motor positioning platform is a precision moving platform with high moving accuracy, ensuring the accuracy of the laser cutter 330 in cutting the film roll.

[0050] Furthermore, the linear motor positioning platform may include two positioning brackets 322 arranged side by side on the frame 100, a longitudinal motor moving structure 324 on each positioning bracket 322, and a transverse motor moving structure 326 on the two longitudinal motor moving structures 324. The laser cutter 330 may be mounted on the transverse motor moving structure 326. Both positioning brackets 322 may be located outside the cutting support table 312, allowing the laser cutter 330 on the linear motor positioning platform to move within the entire cutting support table 312, thus enabling the cutting of the film roll within the entire cutting support table 312 area. The longitudinal motor moving structure 324 on each positioning bracket 322 can drive the transverse motor moving structure 326 and the laser cutter 330 to move horizontally longitudinally; while the transverse motor moving structure 326 on the two longitudinal motor moving structures 324 can drive the laser cutter 330 to move horizontally transversely, thereby allowing the laser cutter 330 to move arbitrarily in the horizontal plane for cutting the film roll.

[0051] Furthermore, each longitudinal motor moving structure 324 may include a longitudinal moving bracket 3242 disposed on the positioning bracket 322, a longitudinal linear drive motor 3246 and a longitudinal moving guide rail 3244 disposed on the longitudinal moving bracket 3242, and a longitudinal moving slider 3248 slidably disposed on the longitudinal moving guide rail 3244. The longitudinal linear drive motor 3246 is connected to the longitudinal moving slider 3248 and is used to drive the longitudinal moving slider 3248 to reciprocate along the longitudinal moving guide rail 3244.

[0052] The transverse motor moving structure 326 may include a transverse moving bracket 3262 mounted on the longitudinal moving slider 3248 of the two longitudinal motor moving structures 324, a transverse linear drive motor 3266 and a transverse moving guide rail 3264 mounted on the transverse moving bracket 3262, and a transverse moving slider 3268 slidably mounted on the transverse moving guide rail 3264. The transverse linear drive motor 3266 is connected to the transverse moving slider 3268 and is used to drive the transverse moving slider 3268 to reciprocate along the transverse moving guide rail 3264. The laser cutter 330 is mounted on the transverse moving slider 3268 and can move together with the transverse moving slider 3268.

[0053] In addition, such as Figure 1As shown, the waste recycling equipment 400 may include a recycling tension roller 420 and a waste take-up roller 410 sequentially arranged on the frame 100. Both the recycling tension roller 420 and the waste take-up roller 410 are located between the film cutting equipment 300 and the film pressing equipment 700. When the film cutting equipment 300 cuts a windowed film roll from the film roll and conveys the windowed film roll to the film pressing equipment 700, it is necessary to peel the windowed film roll from the release film roll and recycle the release film roll and the film waste generated during cutting. At this time, the waste take-up roller 410 can be used to take up the release film roll and the film waste. Moreover, before taking up the film roll, the recycling tension roller 420 can be used to tension it, which is more conducive to the separation of the windowed film roll and the release film roll. In addition, the waste take-up roller 410 can be driven to rotate by a motor.

[0054] In addition, the circuit board unloading device 500 may include a circuit board roll unloading roller 510, a circuit board roll correction device 530, a circuit board roll receiving platform 520, and a circuit board roll tensioning roller 540 located at each end of the circuit board identification and positioning device 600, which are sequentially arranged on the frame 100. Similarly, under the control of the controller 900, the circuit board roll feed roller 510 can convey the wound circuit board roll towards the circuit board identification and positioning device 600. During the conveying process, the circuit board roll guide 530 can correct the circuit board roll's deviation, ensuring it is conveyed in the correct posture without deflection, facilitating subsequent alignment and bonding with the film material (a film roll with windows). When a roll of circuit board roll is used up, a new roll needs to be output through the circuit board roll feed roller 510. To ensure continuous bonding between the flexible circuit board and the film material, the circuit board roll receiving platform 520 needs to connect the new roll with the original roll for continuous production. Furthermore, by setting up the circuit board roll tension roller 540, the circuit board roll can be tensioned, which is more conducive to the conveying of the circuit board roll and also facilitates the identification and positioning of the circuit board roll by the circuit board identification and positioning device 600.

[0055] In addition, the circuit board identification and positioning device 600 may include a circuit board positioning platform 610 and a circuit board identification camera 620 mounted on the rack 100, with the circuit board identification camera 620 located above the circuit board positioning platform 610. The circuit board identification camera 620 is connected to the controller 900 and is used to identify circuit board marking information on the circuit board roll passing through the circuit board positioning platform 610. When the circuit board roll is conveyed to the circuit board positioning platform 610, the circuit board roll tensioning rollers 540 at both ends of the circuit board positioning platform 610 can tension the circuit board roll from both ends, so that the circuit board roll is flat and unfolded on the circuit board positioning platform 610. This makes it easy for the circuit board recognition camera 620 above the circuit board positioning platform 610 to identify and locate the circuit board segments of the circuit board roll on the circuit board positioning platform 610, and obtain information such as the shape, size, model, and position of the circuit board segments. This information can be transmitted to the laser cutter 330 of the film cutting equipment 300. The laser cutter 330 can cut the film roll according to the obtained information of the circuit board segments to obtain a film roll with windows that completely corresponds to the circuit board segments, which facilitates precise bonding of the two.

[0056] Furthermore, when the circuit board recognition camera 620 identifies the flexible circuit board on the circuit board positioning platform 610, the first distance between the location of the circuit board recognition camera 620 and the thin film laminating device 700 is L1, and the second distance between the location of the laser positioning point 3122 and the thin film laminating device 700 is L2. The first distance L1 and the second distance L2 have the following relationship: 300mm ≤ L1 ≤ 2000mm, and L1 - 50mm ≤ L2 ≤ L1 + 50mm.

[0057] If the first distance L1 is too small, the length of the film cutting platform 310 will be too small, resulting in a small cutting range for each film roll. Conversely, if the first distance L1 is too large, the distance between the cut film material (the windowed film roll) and the pressing point (film pressing device 700) will be too long. Moreover, due to the difference in Young's modulus between the film material and the flexible circuit board, the longer the first distance L1 is, the greater the bonding deviation will be when tension is present. Therefore, by controlling the range of the first distance L1 between the circuit board recognition camera 620 and the film pressing device 700 to 300mm-2000mm, the length of the film cutting platform 310 can be made suitable to provide a sufficient cutting range for cutting the film roll, and the distance between the cut windowed film roll and the film pressing device 700 can be made appropriate, facilitating the alignment and bonding of the windowed film roll with the circuit board segment, and also minimizing the bonding deviation. Furthermore, by ensuring the following relationship exists between the first distance L1 and the second distance L2: L1-50mm≤L2≤L1+50mm, the first distance L1 and the second distance L2 are made relatively close, facilitating the setting of the coordinate position for cutting the windowed film roll based on the coordinate position of the circuit board segment of the circuit board roll. Further, it is preferable that L1-5mm≤L2≤L1+5mm, meaning the closer L1 and L2 are, the better.

[0058] In addition, such as Figure 1 As shown, the film laminating equipment 700 may include a pressure roller lifting drive structure 730 mounted on a frame 100, a lower laminating roller 720 rotatably connected to the pressure roller lifting drive structure 730, and an upper laminating roller 710 corresponding to the lower laminating roller 720. The upper laminating roller 710 is rotatably mounted on the frame 100. A laminating gap exists between the lower laminating roller 720 and the upper laminating roller 710. When the circuit board roll and the cut film roll with windows are conveyed to the laminating gap between the lower laminating roller 720 and the upper laminating roller 710, the pressure roller lifting drive structure 730 can lift the lower laminating roller 720, bringing it closer to the upper laminating roller 710, so as to press the circuit board roll and the film roll with windows in the laminating gap together, tightly bonding them together.

[0059] Furthermore, both the lower pressing roller 720 and the upper pressing roller 710 are equipped with heaters, with a heating temperature range of 50℃-150℃. This allows the lower pressing roller 720 and the upper pressing roller 710 to heat both the circuit board roll and the windowed film roll during the pressing process, promoting better fusion and a more thorough, firm, and reliable bond. Specifically, the heating temperature for the circuit board roll and the windowed film roll can be 50℃-150℃ to ensure that the adhesive layer of the windowed film roll fully fills and adheres to the surface of the circuit board roll. In this embodiment, the heating temperature range of the heaters is preferably 80℃-130℃.

[0060] Furthermore, both the lower pressing roller 720 and the upper pressing roller 710 may include a main roller body and a silicone rubber layer, a stainless steel layer, or a ceramic layer covering the main roller body. A heater may be disposed on the main roller body to heat the covering layer (i.e., the silicone rubber layer, stainless steel layer, or ceramic layer) outside the main roller body, so that the covering layer is also heated during the pressing of the circuit board roll and the windowed film roll. The materials of the covering layers of the two pressing rollers may be the same or different; preferably, the covering layers of both pressing rollers are made of silicone rubber. In addition, the roller lifting drive structure may be a cylinder-driven structure.

[0061] Furthermore, the circuit board winding equipment 800 may include a first circuit board finished product tensioning roller 840, a circuit board finished product alignment device 830, a second circuit board finished product tensioning roller 850, a circuit board finished product receiving platform 820, and a circuit board finished product winding roller 810, all sequentially arranged on the frame 100. The circuit board finished product winding roller 810 can wind up the bonded circuit board roll and the windowed film roll. The first circuit board finished product tensioning roller 840 can cooperate with the film roll tensioning roller 240 to tension the circuit board roll and the windowed film roll pressed by the film pressing device 700 from both ends, resulting in a better pressing effect. The second circuit board finished product tensioning roller 850 can tension the circuit board finished product before winding, facilitating winding. The circuit board finished product alignment device 830 can correct the deviation of the circuit board finished product before winding, ensuring that the circuit board finished product is aligned for winding. The finished circuit board receiving platform 820 can connect two circuit board rolls, enabling continuous winding of the circuit board rolls. In addition, the finished circuit board winding roller 810 can be driven by a motor to achieve automatic winding.

[0062] Furthermore, the film roll guide, the circuit board roll guide, and the finished circuit board guide can all be EPC automatic guide systems (i.e., edge-alignment automatic guide systems) or CPC automatic guide systems (i.e., center-alignment automatic guide systems). In this embodiment, the film roll guide, the circuit board roll guide, and the finished circuit board guide can preferably be EPC automatic guide systems.

[0063] The flexible circuit board film material bonding device provided in this embodiment can achieve continuous roll-to-roll precise positioning and bonding of film rolls and circuit board rolls. It can complete the positioning and bonding of film rolls from their original, unperforated feeding state using a single device, resulting in fewer processes, simpler procedures, and reduced equipment investment. The production process requires no molds or auxiliary films, resulting in low production costs, high roll-to-roll efficiency, and easy automation. It can be used to produce flexible circuit boards of any length, and multiple models of flexible circuit boards can be produced using a single device, offering extremely high flexibility.

[0064] In addition, the present invention also proposes a circuit board product, which is manufactured using the flexible circuit board film material bonding device described above.

[0065] In the description of this invention, it should be noted that the terms "upper," "lower," "top," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself. Similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself, and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0066] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0067] Obviously, the embodiments described above are merely some, not all, embodiments of the present invention. Based on the embodiments of the present invention, those skilled in the art can make other variations or modifications without creative effort, and all such variations or modifications should fall within the scope of protection of the present invention.

Claims

1. A flexible circuit board thin film material bonding device, characterized in that, include: frame; The film conveying equipment includes a film discharging device, a film cutting device, and a waste recycling device, which are sequentially arranged on the frame. The circuit board conveying equipment includes a circuit board unloading device and a circuit board identification and positioning device sequentially arranged on the frame; A film laminating and take-up device includes a film laminating device and a circuit board take-up device sequentially mounted on the frame. The film laminating device is located after the film cutting device in the forward direction of the film roll and after the circuit board identification and positioning device in the forward direction of the circuit board roll; and... The controller is mounted on the frame and is connected to the film feeding device, the film cutting device, the waste recycling device, the circuit board feeding device, the circuit board identification and positioning device, the film pressing device, and the circuit board winding device. The film cutting equipment includes a film cutting platform and a horizontal plane moving platform mounted on the frame, and a laser cutter mounted on the horizontal plane moving platform. The film cutting platform, the horizontal plane moving platform, and the laser cutter are all connected to the controller. The laser cutter is located above the film cutting platform. The film cutting platform is provided with a laser positioning point, which corresponds to and cooperates with the laser cutter to locate the origin position of the laser cutter. The circuit board identification and positioning device includes a circuit board positioning platform and a circuit board identification camera mounted on the frame. The circuit board identification camera is located above the circuit board positioning platform. The circuit board identification camera is connected to the controller and is used to identify circuit board marking information on the circuit board roll passing through the circuit board positioning platform. When the circuit board recognition camera identifies the flexible circuit board on the circuit board positioning platform, the first distance between the location of the circuit board recognition camera and the film laminating device is L1; the second distance between the location of the laser positioning point and the film laminating device is L2; ​​wherein, the first distance L1 and the second distance L2 have the following relationship: 300mm≤L1≤2000mm, and L1-50mm≤L2≤L1+50mm.

2. The flexible circuit board thin film material bonding device according to claim 1, characterized in that, The film cutting platform includes a cutting support table mounted on the frame and a vacuum adsorption device mounted at the bottom of the cutting support table. The cutting support platform is arranged vertically and vertically corresponding to the horizontal plane moving platform, the laser positioning point is located on the cutting support platform, and the vacuum adsorption device is connected to the controller.

3. The flexible circuit board thin film material bonding device according to claim 2, characterized in that, The cutting support table includes two platform support brackets arranged side by side on the frame, and a cutting support plate provided on the two platform support brackets. The cutting support plate is provided with a plurality of adsorption holes, and the laser positioning point is located at one corner of the cutting support plate. The vacuum adsorption device includes a vacuum suction tube disposed below the cutting support plate, and a vacuum pumping device connected to the vacuum suction tube. The vacuum suction tube communicates with a plurality of adsorption holes on the cutting support plate.

4. The flexible circuit board thin film material bonding device according to claim 1, characterized in that, The horizontal plane moving platform is set as a linear motor positioning platform, the stroke of the linear motor positioning platform is greater than or equal to 350mm, and the repeatability positioning accuracy is less than or equal to 5um.

5. The flexible circuit board thin film material bonding device according to claim 4, characterized in that, The linear motor positioning platform includes two positioning brackets arranged side by side on the frame, a longitudinal motor moving structure on each of the positioning brackets, and a transverse motor moving structure on the two longitudinal motor moving structures. The laser cutter is located on the transverse motor moving structure.

6. The flexible circuit board thin film material bonding device according to claim 5, characterized in that, Each of the longitudinal motor moving structures includes a longitudinal moving bracket mounted on the positioning bracket, a longitudinal linear drive motor and a longitudinal moving guide rail mounted on the longitudinal moving bracket, and a longitudinal moving slider slidably mounted on the longitudinal moving guide rail, wherein the longitudinal linear drive motor is connected to the longitudinal moving slider; The transverse motor moving structure includes a transverse moving bracket disposed on the longitudinal moving slider of the two longitudinal motor moving structures, a transverse linear drive motor and a transverse moving guide rail disposed on the transverse moving bracket, and a transverse moving slider slidably disposed on the transverse moving guide rail. The transverse linear drive motor is connected to the transverse moving slider, and the laser cutter is disposed on the transverse moving slider.

7. The flexible circuit board thin film material bonding device according to any one of claims 1 to 6, characterized in that, The waste recycling equipment includes a recycling tension roller and a waste winding roller arranged sequentially on the frame. Both the recycling tension roller and the waste winding roller are located between the film cutting equipment and the film pressing equipment.

8. The flexible circuit board thin film material bonding device according to any one of claims 1 to 6, characterized in that, The film pressing equipment includes a pressure roller lifting drive structure mounted on the frame, a lower pressing roller rotatably connected to the pressure roller lifting drive structure, and an upper pressing roller corresponding to the lower pressing roller, wherein the upper pressing roller is rotatably mounted on the frame. Both the lower pressing roller and the upper pressing roller are equipped with heaters, and the heating temperature range of the heaters is 50℃-150℃.

9. The flexible circuit board thin film material bonding device according to claim 8, characterized in that, Both the lower pressing roller and the upper pressing roller include a main roller body and a silicone rubber layer, a stainless steel layer, or a ceramic layer covering the main roller body.

10. The flexible circuit board thin film material bonding apparatus according to any one of claims 1 to 6, characterized in that, The film feeding device includes a film roll feeding roller, a film roll correction device, a film roll receiving platform, and a film roll tensioning roller at each end of the film cutting device, which are sequentially arranged on the frame. The circuit board unloading equipment includes a circuit board roll unloading roller, a circuit board roll correction device, a circuit board roll receiving platform, and a circuit board roll tensioning roller at each end of the circuit board identification and positioning device, which are sequentially arranged on the frame. The circuit board winding equipment includes a first circuit board finished product tensioning roller, a circuit board finished product correction device, a second circuit board finished product tensioning roller, a circuit board finished product receiving platform, and a circuit board finished product winding roller, which are sequentially arranged on the frame.

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