Display panel, preparation method thereof and display device

Abstract

The application discloses a display panel and a preparation method thereof and a display device. The display panel comprises a display area and a fan-out wiring area. The display area comprises a plurality of data lines, and the fan-out wiring area comprises a plurality of fan-out wirings. The fan-out wirings are electrically connected with the data lines. The fan-out wirings comprise a plurality of first fan-out wirings and a plurality of second fan-out wirings. The second fan-out wirings are located on the side of the first fan-out wirings away from the substrate. The first fan-out wirings comprise first main body parts and first edge parts. The second fan-out wirings comprise second main body parts and second edge parts. At least one first main body part does not overlap with at least one second main body part. By setting the first main body parts and the second main body parts not to overlap, the parasitic capacitance between the first main body parts and the second main body parts can be avoided, so that the display signals transmitted in the first fan-out wirings and the second fan-out wirings are less disturbed. In addition, the film layer above the fan-out wirings will not be poorly covered due to the protrusion caused by the overlapping of the main body parts, so that the structural stability of the display panel is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] The display resolution of the existing display products is higher and higher, and the display signal lines connected with the light emitting elements are more and more, and the space occupied by the display signal lines at the lower frame position of the display product is larger and larger, which is not consistent with the narrow frame development trend of the display product. SUMMARY

[0003] The present application provides a display panel, a preparation method thereof and a display device, which can solve the narrow frame problem of the display panel, reduce the interference between different signal lines and ensure the display effect.

[0004] According to an aspect of the present application, a display panel is provided, comprising a display area and a fan-out wiring area;

[0005] The display area comprises a plurality of data lines, and the fan-out wiring area comprises a plurality of fan-out wires, the fan-out wires being electrically connected with the data lines;

[0006] The fan-out wires comprise a plurality of first fan-out wires and a plurality of second fan-out wires, and the display panel further comprises a substrate, the second fan-out wires being located on the side of the first fan-out wires away from the substrate;

[0007] The first fan-out wires comprise a first main body part and a first edge part, the first edge part being located at the edge of the first main body part and the thickness of the first edge part being smaller than that of the first main body part; the second fan-out wires comprise a second main body part and a second edge part, the second edge part being located at the edge of the second main body part and the thickness of the second edge part being smaller than that of the second main body part;

[0008] At least one of the first main body parts and at least one of the second main body parts do not overlap in the thickness direction of the display panel.

[0009] According to another aspect of the present application, a preparation method of a display panel is provided, which is used for preparing the display panel of the above aspect, and the preparation method comprises:

[0010] providing a substrate;

[0011] preparing first fan-out wires on one side of the substrate, the first fan-out wires comprising a first main body part and a first edge part, the first edge part being located at the edge of the first main body part and the thickness of the first edge part being smaller than that of the first main body part;

[0012] A second fan-out wire is prepared on a side of the first fan-out wire away from the substrate, the second fan-out wire comprising a second main body portion and a second edge portion, the second edge portion being located at an edge of the second main body portion and the thickness of the first edge portion being less than the thickness of the first main body portion; and along the thickness direction of the display panel, at least one of the first main body portions and at least one of the second main body portions do not overlap.

[0013] According to still another aspect of the present application, there is provided a display device comprising the display panel of the first aspect.

[0014] The display panel of the embodiments of the present application, the fan-out wire comprises a plurality of first fan-out wires and a plurality of second fan-out wires, the second fan-out wire being located on a side of the first fan-out wire away from the substrate, that is, the fan-out wire comprises the first fan-out wire and the second fan-out wire arranged in different layers, so that the space occupied by the fan-out wire in the frame area can be reduced, the lower frame of the display panel can be reduced, and the display panel with narrow frame design can be realized. Further, the first main body portion of the first fan-out wire and the second main body portion of the second fan-out wire do not overlap, which can avoid parasitic capacitance between the first main body portion and the second main body portion, ensure that the display signals transmitted in the first fan-out wire and the second fan-out wire are less disturbed, and ensure the display effect; and the film layer above the fan-out wire will not be poorly covered due to the overlapping protrusion of the main body portion, and the structural stability of the display panel is ensured.

[0015] It should be understood that the content described in this part is not intended to identify key or important features of the embodiments of the present application, nor is it used to limit the scope of the present application. Other features of the present application will become apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0017] Figure 1 is a structural schematic diagram of a display panel provided by the embodiments of the present application;

[0018] Figure 2 is Figure 1 is a sectional structural schematic diagram of the display panel provided along the section line A-A' provided by the present application;

[0019] Figure 3 is Figure 1 is another sectional structural schematic diagram of the display panel along the section line A-A' provided by the present application;

[0020] Figure 4 is a structural schematic diagram of a second fan-out wire provided by an embodiment of the present application;

[0021] Figure 5 is Figure 1 is an enlarged schematic diagram of the display panel in the B region provided by the present application;

[0022] Figure 6 is Figure 5 is a cross-sectional structural schematic diagram along the cross-sectional line C-C' in the enlarged schematic diagram of the B region provided by the present application;

[0023] Figure 7 is Figure 5 is a cross-sectional structural schematic diagram along the cross-sectional line D-D' in the enlarged schematic diagram of the B region provided by the present application;

[0024] Figure 8 is Figure 5 is another cross-sectional structural schematic diagram along the cross-sectional line D-D' in the enlarged schematic diagram of the B region provided by the present application;

[0025] Figure 9 is Figure 5 is another cross-sectional structural schematic diagram along the cross-sectional line D-D' in the enlarged schematic diagram of the B region provided by the present application;

[0026] Figure 10 is Figure 1 is another enlarged schematic diagram of the display panel in the B region provided by the present application;

[0027] Figure 11 is a flow schematic diagram of a preparation method of a display panel provided by an embodiment of the present application;

[0028] Figure 12 is a flow schematic diagram of another preparation method of a display panel provided by an embodiment of the present application;

[0029] Figure 13 is a structural schematic diagram of a second fan-out wire layer prepared on a side of a first fan-out wire provided by an embodiment of the present application;

[0030] Figure 14 is a structural schematic diagram of a photoresist layer prepared on a side of a second fan-out wire layer away from a first fan-out wire provided by an embodiment of the present application;

[0031] Figure 15 is a structural schematic diagram of a mask provided by an embodiment of the present application;

[0032] Figure 16 is a structural schematic diagram of forming an exposed photoresist by a mask provided by an embodiment of the present application;

[0033] Figure 17is a structural schematic diagram of developing and exposing photoresist provided by an embodiment of the present application;

[0034] Figure 18 is a flowchart of another method for manufacturing a display panel provided by an embodiment of the present application;

[0035] Figure 19 is a structural schematic diagram of etching a second fan-out wire layer to manufacture a second fan-out wire matrix provided by an embodiment of the present application;

[0036] Figure 20 is a structural schematic diagram of removing photoresist of a first thickness provided by an embodiment of the present application;

[0037] Figure 21 is a structural schematic diagram of etching a second fan-out wire matrix to manufacture a second fan-out wire provided by an embodiment of the present application;

[0038] Figure 22 is a structural schematic diagram of a display device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0039] In order to make the personnel in the technical field better understand the present application scheme, the technical scheme in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the personnel of ordinary skill in the art without making creative labor should belong to the protection scope of the present application.

[0040] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or a chronological sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0041] Figure 1 is a structural schematic diagram of a display panel provided by an embodiment of the present application, Figure 2 is Figure 1 is a cross-sectional structural schematic diagram of a display panel provided by the present application along the cross-sectional line A-A', in combination with Figure 1 and Figure 2As shown, the display panel 10 provided by the embodiment of the present application comprises a display area 11 and a fan-out wiring area 12, the display area 11 comprises a plurality of data lines 111, the fan-out wiring area 12 comprises a plurality of fan-out wirings 121, the fan-out wirings 121 are electrically connected with the data lines 111; the fan-out wirings 121 comprise a plurality of first fan-out wirings 1211 and a plurality of second fan-out wirings 1212, the display panel 10 further comprises a substrate 101, the second fan-out wirings 1212 are located on a side of the first fan-out wirings 1211 away from the substrate 101; the first fan-out wirings 1211 comprise a first main body part 1211a and a first edge part 1211b, the first edge part 1211b is located at an edge of the first main body part 1211a and the thickness of the first edge part 1211b is less than the thickness of the first main body part 1211a; the second fan-out wirings 1212 comprise a second main body part 1212a and a second edge part 1212b, the second edge part 1212b is located at an edge of the second main body part 1212a and the thickness of the second edge part 1212b is less than the thickness of the second main body part 1212a; at least one first main body part 1211a and at least one second main body part 1212a do not overlap along the thickness direction (such as the Z direction) of the display panel. Figure 2 At least one first main body part 1211a and at least one second main body part 1212a do not overlap along the thickness direction (such as the Z direction) of the display panel.

[0042] Specifically, the display panel 10 includes a display area 11 and a fan-out wiring area 12. The display area 11 is provided with sub-pixels 13 and data lines 111 connected to each column of sub-pixels 13. The data lines 111 are used to provide data signals to the sub-pixels 13, so that the sub-pixels 13 emit light display according to the data signals. Further, the sub-pixel 13 can include a light emitting element and a pixel circuit (not shown in the figure). The light emitting element can be an organic light emitting diode (OLED), a MiniLED, a Micro LED, or a quantum dot light emitting diode (QLED), etc. The specific type of light emitting element is not limited in the embodiment of the present application. Further, the light emitting element can include a red light emitting element, a green light emitting element, and a blue light emitting element. Different colors of light emitting elements can have a plurality of different arrangement modes, such as diamond pixel (Dimond Pixel) arrangement, standard RGB arrangement, delta pixel (Delta Pixel) arrangement, pearl pixel (Pearl Pixel) arrangement, or 2in1 pixel (2in1 Pixel) arrangement, etc. The specific arrangement mode of different colors of light emitting elements is also not limited in the embodiment of the present application. Further, the pixel circuit can include a thin film transistor and a capacitor, and the number of thin film transistors and capacitors can be set by those skilled in the art according to actual needs, such as 2T1C circuit, 7T1C circuit, or 7T2C circuit, etc. "2T1C circuit" refers to a pixel circuit including 2 thin film transistors (T) and 1 capacitor (C). Other "7T1C circuit", "7T2C circuit", etc. are similar. In addition, the display panel 10 also includes a non-display area, which is located at least on one side of the display area 11, so as to Figure 1 For example, the non-display area is located on the lower side of the display area 11. The non-display area can include a fan-out wiring area 12 and a binding area 13. The fan-out wiring area 12 is provided with fan-out wires 121, and the binding area 13 is provided with a driving chip 131. The fan-out wires 121 are respectively electrically connected with the data lines 111 and the driving chip 131, and are used to transmit the data signals output by the driving chip to the data lines 111.

[0043] With the gradual increase of display resolution in the display panel, the number of sub-pixel columns contained in the display area 11 gradually increases, and more data lines 111 and fan-out wires 121 are needed to cooperate to realize high resolution. The increase of fan-out wires 121 will inevitably occupy more area of the lower frame position, which is not consistent with the development trend of narrow frame of display panel. Therefore, in the embodiment of the present application, the fan-out wire 121 can be provided to include the first fan-out wire 1211 and the second fan-out wire 1212 arranged in different layers, by arranging the fan-out wire 121 in different two film layers, so that the area of the lower frame occupied by the fan-out wire can be reduced, the lower frame area can be reduced, and the display screen ratio of the display panel can be improved. Specifically, the fan-out wire 121 includes the first fan-out wire 1211 and the second fan-out wire 1212, the first fan-out wire 1211 is located on the side close to the substrate 101, and the second fan-out wire 1212 is located on the side away from the substrate 101 of the first fan-out wire 1211. Since the first fan-out wire 1211 and the second fan-out wire 1212 are not arranged in the same layer, compared with two fan-out wires arranged in the same layer, the gap between the first fan-out wire 1211 and the second fan-out wire 1212 can be adjusted to reduce the occupied space of the fan-out wire, and the purpose of reducing the lower frame area is achieved. Further, the first fan-out wire 1211 and the second fan-out wire 1212 arranged in different layers can be arranged in sequence, that is, any two adjacent data lines 111 are respectively electrically connected to the first fan-out wire 1211 and the second fan-out wire 1212, that is, the two adjacent data lines 111 are respectively electrically connected to the fan-out wires 121 arranged in different layers, so that the signal interference between the two adjacent data lines 111 can be reduced, and the display effect can be ensured.

[0044] Further, with reference to Figure 2As shown, the first outgoing trace 1211 includes a first main body portion 1211a and a first edge portion 1211b. The first main body portion 1211a can be understood as the main structure of the first outgoing trace 1211, where most of the signal is transmitted. The first edge portion 1211b can be understood as a non-main structure of the first outgoing trace 1211, such as an edge portion caused by process reasons. Specifically, the first main body portion 1211a and the first edge portion 1211b can be divided based on their distribution location, for example, the first edge portion 1211b is located at the edge of the first main body portion 1211a; or, the first main body portion 1211a and the first edge portion 1211b can be divided based on the film thickness, where the thickness of the first edge portion 1211b is less than the thickness of the first main body portion 1211a. Furthermore, the second outgoing trace 1212 includes a second main body portion 1212a and a second edge portion 1212b. The second main body portion 1212a can be understood as the main structure of the second outgoing trace 1212, where most of the signal transmission occurs. The second edge portion 1212b can be understood as a non-main structure of the second outgoing trace 1212, such as an edge portion caused by process limitations. Specifically, the second main body portion 1212a and the second edge portion 1212b can be divided based on their distribution location, for example, the second edge portion 1212b is located at the edge of the second main body portion 1212a; or, the second main body portion 1212a and the second edge portion 1212b can be divided based on the film thickness, where the thickness of the second edge portion 1212b is less than the thickness of the second main body portion 1212a.

[0045] Furthermore, along the thickness direction of the display panel (e.g.) Figure 2 As shown in the Z direction, at least one first main body portion 1211a and at least one second main body portion 1212a do not overlap. This avoids the generation of parasitic capacitance between the first main body portion 1211a and the second main body portion 1212a, ensuring that the display signals transmitted in the first fan-out trace and the second fan-out trace are less affected by interference, thus ensuring the display effect. Furthermore, the film layer above the fan-out trace will not have poor coverage due to the overlapping of the main body portions, ensuring the flatness of the film layer above the fan-out trace, thereby ensuring the structural stability of the display panel.

[0046] In summary, the technical solution provided by the embodiments of the present invention, by setting the fan-out traces to include a first fan-out trace and a second fan-out trace arranged in different layers, allows for a smaller trace spacing between the first and second fan-out traces. This reduces the space occupied by the fan-out traces in the bezel area, decreases the bottom bezel of the display panel, and facilitates the realization of a narrow bezel design for the display panel. Furthermore, the fact that the first main body portion of the first fan-out trace and the second main body portion of the second fan-out trace do not overlap avoids the generation of parasitic capacitance between the first and second main body portions, ensuring that the display signals transmitted in the first and second fan-out traces are less affected by interference, thus guaranteeing the display effect. Moreover, the fact that the first main body portion of the first fan-out trace and the second main body portion of the second fan-out trace do not overlap ensures that the film layer above the fan-out trace will not bulge due to the overlapping main body portions, resulting in poor coverage and guaranteeing the structural stability of the display panel.

[0047] Based on the above embodiments, Figure 3 yes Figure 1 The provided schematic diagram shows another cross-sectional structure of the display panel along section line A-A', combined with... Figure 1 , Figure 2 and Figure 3 As shown, along the thickness direction of the display panel, the first edge portion 1211b and the second edge portion 1212b partially overlap; or, along the thickness direction of the display panel, the first edge portion 1211b and the second edge portion 1212b do not overlap, and along the first direction, the minimum distance L between the first edge portion 1211b and the second edge portion 1212b satisfies L≤0.3μm; the first direction is the arrangement direction of multiple fan-out traces.

[0048] Specifically, such as Figure 2 As shown, along the thickness direction of the display panel, specifically the Z direction, the first edge portion 1211b and the second edge portion 1212b partially overlap. The overlapping portion is the edge end, i.e., the part with less thickness. Because the overlap area between the first edge portion 1211b and the second edge portion 1212b is small, and because their thicknesses are also small, the film layer above the fan-out trace 121 will not form a protrusion in the overlapping area of ​​the first edge portion 1211b and the second edge portion 1212b, ensuring good flatness of the film layer above the fan-out trace.

[0049] like Figure 3As shown, along the thickness direction of the display panel, the first edge portion 1211b and the second edge portion 1212b do not overlap, and at this time, there are cases where the orthographic projection of the first edge portion 1211b on the plane of the substrate 101 meets or does not meet the orthographic projection of the second edge portion 1212b on the plane of the substrate 101. When the orthographic projection of the first edge portion 1211b on the plane of the substrate 101 meets the orthographic projection of the second edge portion 1212b on the plane of the substrate 101, the film layer above the fan-out wires 121 will not form a pit at the spacing position between the first edge portion 1211b and the second edge portion 1212b, ensuring that the flatness of the film layer above the fan-out wires is good. When the orthographic projection of the first edge portion 1211b on the plane of the substrate 101 does not meet the orthographic projection of the second edge portion 1212b on the plane of the substrate 101, at this time, the spacing between the first edge portion 1211b and the second edge portion 1212b is small, for example, along the arrangement direction of the plurality of fan-out wires 121, such as the X direction shown in the figure, the minimum spacing L between the first edge portion 1211b and the second edge portion 1212b satisfies L≤0.3μm, so that the film layer above the fan-out wires 121 will not form a pit at the spacing position between the first edge portion 1211b and the second edge portion 1212b, ensuring that the flatness of the film layer above the fan-out wires is good.

[0050] On the basis of the above-mentioned embodiments, further referring to Figure 2 and Figure 3 As shown, along the direction in which the second edge portion 1212b points to the second main body portion 1212a, the thickness of the second edge portion 1212b gradually increases.

[0051] For example, along the direction in which the second edge portion 1212b points to the second main body portion 1212a, such as the X direction shown in the figure, the thickness of the second edge portion 1212b gradually increases, that is, in the second edge portion 1212b, the closer to the position of the second main body portion 1212a, the greater the thickness, and the farther away from the position of the second main body portion 1212a, the smaller the thickness. The structure of the second edge portion 1212b, on the one hand, matches the preparation process of the second edge portion 1212b, ensuring that the preparation process of the second edge portion 1212b is simple, and on the other hand, when the first edge portion 1211b and the second edge portion 1212b overlap, because the edge thickness of the second edge portion 1212b is small, it can avoid a large protrusion existing at the overlapping position of the second edge portion 1212b and the first edge portion 1211b, the film layer above the fan-out wires 121 will not form a protrusion in the area where the first edge portion 1211b and the second edge portion 1212b overlap, ensuring that the flatness of the film layer above the fan-out wires is good.

[0052] On the basis of the above-mentioned embodiments, further referring to Figure 2 and Figure 3As shown, the second main body part 1212a includes a first surface m1 close to the substrate 101 side, and the second edge part 1212b includes a second surface m2 close to the substrate 101 side, the plane where the first surface m1 is located is parallel to the plane where the substrate 101 is located, and the plane where the second surface m2 is located intersects the plane where the substrate 101 is located.

[0053] As an example, the second main body part 1212a includes a first surface m1 close to the substrate 101 side, and the plane where the first surface m1 is located is parallel to the plane where the substrate 101 is located, for example, both are horizontal planes, so that the second main body part 1212a is good in overall flatness, ensuring normal transmission of display signals.

[0054] The second edge part 1212b includes a second surface m2 close to the substrate 101 side, and the plane where the second surface m2 is located intersects the plane where the substrate 101 is located, for example, when the plane where the substrate 101 is located is a horizontal plane, the plane where the second surface m2 is located is an inclined plane. Because there is an insulating layer between the first fan-out wire 1211 and the second fan-out wire 1212, and the insulating layer is provided below the first fan-out wire 1211, there is a slope surface m3 between the region where the first fan-out wire 1211 is provided and the region where the first fan-out wire 1211 is not provided, at this time, the second surface m2 can be parallel to the slope surface m3, for example, the second surface m2 is in contact with the slope surface m3, that is, the second edge part 1212b of the second fan-out wire 1212 includes a part extending along the slope surface m3, so that the spacing between the second edge part 1212b and the first edge part 1211b can be relatively small, on the one hand, it can ensure that more fan-out wires are provided in a limited space, facilitating the realization of high display resolution of the display panel; on the other hand, the film layer above the fan-out wire 121 will not form a depression at the gap position between the first edge part 1211b and the second edge part 1212b, ensuring that the flatness of the film layer above the fan-out wire 121 is good.

[0055] On the basis of the above-mentioned embodiments, further referring to Figure 2 and Figure 3 As shown, the second main body part 1212a includes a third surface m4 away from the substrate 101 side, and the third surface m4 is parallel to the plane where the substrate 101 is located; the second edge part 1212b includes a second surface m2 close to the substrate 101 side and a first side surface m5 connecting the second surface m2 and the third surface m4, and the first side surface m5 includes a curved surface.

[0056] As an example, the second main body part 1212a includes a third surface m4 away from the substrate 101 side, and the plane where the third surface m4 is located is parallel to the plane where the substrate 101 is located, for example, both are horizontal planes, so that the second main body part 1212a is good in overall flatness, ensuring normal transmission of display signals.

[0057] The second edge portion 1212b includes a second surface m2 close to the substrate 101 side and a first side surface m5 connecting the second surface m2 and a third surface m4, the first side surface m5 includes a curved surface, and the shape of the first side surface m5 is related to the forming process of the second edge portion 1212b. Specifically, the second fan-out trace 1212 can be formed by a secondary etching process, for example, the second main body portion 1212a and the second edge portion 1212b are formed in different etching processes, and the second edge portion 1212b can be prepared by an optical proximity correction (OPC) process. Specifically, the OPC process can be understood as using a special-shaped mask to form thick photoresist regions, thin photoresist regions and no photoresist regions in the photoresist above the preparation film layer of the second fan-out trace, wherein the thick photoresist region can correspond to the second main body portion 1212a, and the thin photoresist region can correspond to the second edge portion 1212b. The OPC process is described in detail in subsequent embodiments. Through the OPC process, the distance between the second fan-out trace 1212 and the first fan-out trace 1211 can be ensured to be neither too large to form a recess in the film layer above the fan-out trace, nor too small to form a protrusion in the film layer above the fan-out trace, so as to ensure the flatness of the film layer above the fan-out trace and the stability of the display panel structure.

[0058] Further, Figure 4 is a structural schematic diagram of a second fan-out trace provided by an embodiment of the present application, as shown in Figure 4As shown, the first side surface m5 has two positions, the included angle between the tangent plane at the position close to the second body part 1212a and the plane where the substrate 101 is located is greater than the included angle between the tangent plane at the position far from the second body part 1212a and the plane where the substrate 101 is located. Specifically, the first side surface m5 has two positions, for example, position A and position B in the figure, wherein the position A is located on the side close to the second body part 1212a of the position B, and the included angle between the tangent plane at the position A and the plane where the substrate 101 is located is a, and the included angle between the tangent plane at the position B and the plane where the substrate 101 is located is β, wherein a > β. That is, in the first side surface m5, the included angle between the tangent plane at the position close to the second body part 1212a and the plane where the substrate 101 is located is greater than the included angle between the tangent plane at the position far from the second body part 1212a and the plane where the substrate 101 is located. In other words, in the second edge part 1212b, the greater the height change rate of the second edge part 1212 on the side close to the second body part 1212a, the smaller the height change rate of the second edge part 1212 on the side far from the second body part 1212a; or in other words, in the second edge part 1212b, the height of the second edge part 1212 on the side close to the second body part 1212a is steeper, and the height of the second edge part 1212 on the side far from the second body part 1212a is gentler. In this way, the thickness of the second edge part 1212 on the side far from the second body part 1212a in the second edge part 1212b can be small and the height change is gentler, that is, the overall thickness of the second edge part 1212b on the side far from the second body part 1212a in the second edge part 1212b is small, so that even if the first fan-out wiring 1211 and the second fan-out wiring 1212 overlap at the position of the second edge part 1212b, the overlapping position of the first fan-out wiring 1211 and the second fan-out wiring 1212 will not form a large protrusion, ensuring that the film layer above the fan-out wiring is flat and ensuring that the display panel structure is stable.

[0059] Optionally, continuing to refer to Figure 2 and Figure 3 As shown, as a possible implementation manner, the first edge part 1211b includes a second side surface m6, and the second edge part 1212b includes a second surface m2 close to the substrate 101, and the second side surface m6 is parallel to the second surface m2.

[0060] Specifically, the first edge part 1211b includes a second side surface m6, and the second edge part 1212b includes a second surface m2 close to the substrate 101. The plane where the second side surface m6 is located is parallel to the plane where the second surface m2 is located, that is, the inclination of the second side surface m6 is the same as that of the second surface m2. In this way, the distance between the second side surface m6 and the second surface m2 can be ensured to be small, and the distance between the second edge part 1212b and the first edge part 1211b can be further ensured to be small. On the one hand, more fan-out wires can be arranged in a limited space, which is convenient for realizing high display resolution of the display panel. On the other hand, the film layer above the fan-out wires 121 will not form a depression at the gap position between the first edge part 1211b and the second edge part 1212b, and the flatness of the film layer above the fan-out wires 121 is good.

[0061] Optionally, continuing to refer to Figure 2 and Figure 3 As a feasible implementation, as shown in the drawings, the width of the second fan-out wire 1212 is greater than the width of the first fan-out wire 1211 along the first direction, that is, the X direction shown in the drawings. The first direction is the arrangement direction of the plurality of fan-out wires.

[0062] Specifically, the second fan-out wire 1212 can be formed by a two-time etching process. For example, the second main body part 1212a and the second edge part 1212b are formed in different etching processes, and the second fan-out wire 1212 can be prepared by an optical proximity correction (OPC) process. Specifically, the OPC process can be understood as using a special-shaped mask to form thick photoresist regions, thin photoresist regions, and no photoresist regions in the photoresist above the preparation film layer of the second fan-out wire. The thick photoresist region can correspond to the second main body part 1212a, and the thin photoresist region can correspond to the second edge part 1212b. Since the second fan-out wire 1212 is obtained by two-time etching by the OPC process, and the first fan-out wire 1211 is obtained by one-time etching, the etching precision of the second fan-out wire 1212 is greater than that of the first fan-out wire 1211. The etching loss of the second fan-out wire 1212 during etching is small, and the reserved part of the second fan-out wire 1212 after the two-time etching process is large. That is, along the arrangement direction of the plurality of fan-out wires, the width of the second fan-out wire 1212 is greater than that of the first fan-out wire 1211. Since the width of the second fan-out wire 1212 is greater than that of the first fan-out wire 1211, the resistance of the second fan-out wire 1212 is smaller than that of the first fan-out wire 1211. Therefore, the loss of the display signal transmitted on the second fan-out wire 1212 is small, and the display effect of the display panel is good.

[0063] Optionally,Figure 5 is Figure 1 An enlarged schematic view of the display panel provided in the B region, in combination with Figure 1 and Figure 5 As shown in the drawings, the display panel 10 further comprises a binding area 13 located on the side of the fan-out wire area 12 away from the display area 11, the binding area 13 comprising a binding pad 132; the second fan-out wire 1212 comprises a first wire branch 12121 and a second wire branch 12122 connected to each other, the first wire branch 12121 being electrically connected to the data line 111, and the second wire branch 12122 being electrically connected to the binding pad 132; and the included angle between the first wire branch 12121 and a preset direction is smaller than the included angle between the second wire branch 12122 and the preset direction, the preset direction being parallel to the direction in which the display area 11 points to the binding area 13; and the line width of the first wire branch 12121 is greater than the line width of the second wire branch 12122.

[0064] Specifically, in combination with Figure 1 and Figure 5As shown, the second fan-out wire 1212 includes a first wire part 12121 and a second wire part 12122 connected to each other, wherein the first wire part 12121 can be understood as a part of the second fan-out wire 1212 connected to the data line 111, the second wire part 12122 can be understood as a part of the second fan-out wire 1212 connected to the bonding pad 132, and the first wire part 12121 and the second wire part 12122 are connected to each other to transmit the display signal output by the bonding pad 132 to the data line 111. In addition, the extension directions of the first wire part 12121 and the second wire part 12122 are different, specifically, the included angle between the first wire part 12121 and a preset direction (for example, the Y direction shown in the figure) is small, and the included angle between the second wire part 12122 and the preset direction (for example, the Y direction shown in the figure) is large, for example, the included angle between the first wire part 12121 and the preset direction is 0°, and the included angle between the second wire part 12122 and the preset direction is 30°, 45°, 60° or 79°. Since the included angle between the first wire part 12121 and the preset direction is smaller than the included angle between the second wire part 12122 and the preset direction, the setting space of the first wire part 12121 is smaller than the setting space of the second wire part 12122. In order to ensure that the layout area of the second wire part 12122 can be provided with a sufficient number of second wire parts to meet the display resolution requirement of the display panel, the line width of the second wire part 12122 can be set to be greater than the line width of the first wire part 12121, that is, the line width of the first wire part 12121 is greater than the line width of the second wire part 12122. In this way, on the one hand, the layout area of the second wire part 12122 can normally be provided with the second wire part 12122, and on the other hand, the first wire part 12121 with a larger line width can reduce the resistance of the first wire part 12121 and reduce the loss of the display signal in the transmission process, thereby ensuring the display effect of the display panel.

[0065] It should be noted that the display panel provided in the embodiments of the present application further includes a driving chip 131 located in the binding area 13, the driving chip 131 is electrically connected with the bonding pad 132, and the driving chip 131 covers the bonding pad 132, so the bonding pad 132 is shown by a dashed line in the figure.

[0066] On the basis of the above-mentioned embodiments, Figure 6 is Figure 5 a cross-sectional structure schematic diagram along the cross-sectional line C-C' in the B area enlarged schematic diagram provided by the present application, Figure 7 is Figure 5 a cross-sectional structure schematic diagram along the cross-sectional line D-D' in the B area enlarged schematic diagram provided by the present application, Figure 8 is Figure 5 another cross-sectional structure schematic diagram along the cross-sectional line D-D' in the B area enlarged schematic diagram provided by the present application,Figure 9 is Figure 5 Another cross-sectional structure schematic diagram along the cross-sectional line D-D' in the B area amplification schematic diagram provided is shown in Figures 5-9 As shown, the line width of the second body part 1212a of the first trace part 12121 is greater than the line width of the second body part 1212a of the second trace part 12122, and / or the line width of the second edge part 1212b of the first trace part 12121 is greater than the line width of the second edge part 1212b of the second trace part 12122.

[0067] As shown in Figure 6 and Figure 7 As shown, the line width of the first trace part 12121 is greater than the line width of the second trace part 12122, which can be that the line width of the second body part 1212a of the first trace part 12121 is greater than the line width of the second body part 1212a of the second trace part 12122; or, as shown in Figure 6 and Figure 8 As shown, the line width of the second edge part 1212b of the first trace part 12121 is greater than the line width of the second edge part 1212b of the second trace part 12122; or, as shown in Figure 6 and Figure 9 As shown, the line width of the second body part 1212a of the first trace part 12121 is greater than the line width of the second body part 1212a of the second trace part 12122, and at the same time, the line width of the second edge part 1212b of the first trace part 12121 is greater than the line width of the second edge part 1212b of the second trace part 12122. By reasonably setting the sizes of the second body part 1212a and the second edge part 1212b of the first trace part 12121 and the second trace part 12122, the line width of the first trace part 12121 is greater than the line width of the second trace part 12122, which fully ensures that the layout area of the second trace part 12122 can be normally set, and at the same time, the first trace part 12121 with a larger line width can reduce the resistance of the first trace part 12121, reduce the loss of the display signal in the transmission process, and ensure the display effect of the display panel.

[0068] Optionally, Figure 10 is Figure 1 Another amplification schematic diagram of the display panel in the B area is provided, as shown in Figure 10 As shown, among the two second fan-out traces 1212, the line width of the second fan-out trace 1212 close to the edge side of the display panel along the first direction is greater than the line width of the second fan-out trace close to the center side of the display panel along the first direction; the first direction is the arrangement direction of the second fan-out trace.

[0069] Specifically, as shown in Figure 10As shown, since the binding pads 132 are arranged closely, when the second fan-out wires 1212 are electrically connected with the binding pads 132, the extension length of the second wire part 12122 of the second fan-out wire 1212 on the side close to the edge of the display panel is greater than the extension length of the second wire part 12122 of the second fan-out wire 1212 on the side close to the center of the display panel. In order to ensure that the loss of the display signal on the second fan-out wires 1212 at different positions is the same or similar, the line width of the second fan-out wire 1212 on the side close to the edge of the display panel in the first direction can be greater than the line width of the second fan-out wire on the side close to the center of the display panel in the first direction, so as to reduce the resistance of the second fan-out wire 1212 by the larger line width, compensate for the resistance difference caused by the longer line length of the second fan-out wire 1212 on the side close to the edge of the display panel, and ensure the display balance of the display panel.

[0070] Further, the line width of the second fan-out wire on the side close to the edge of the display panel in the first direction is greater than the line width of the second fan-out wire on the side close to the center of the display panel in the first direction, specifically, the line width of the second main body part of the second fan-out wire on the side close to the edge of the display panel can be greater than the line width of the second main body part of the second fan-out wire on the side close to the center of the display panel, and / or, the line width of the second edge part of the second fan-out wire on the side close to the edge of the display panel is greater than the line width of the second edge part of the second fan-out wire on the side close to the center of the display panel, so as to compensate for the resistance difference caused by the longer line length by the larger line width, ensure the impedance balance of the second fan-out wires at different positions, ensure the loss balance of the signal on the second fan-out wires at different positions, and ensure the display effect balance of the display panel.

[0071] Based on the same inventive concept, the present application also provides a display panel manufacturing method for manufacturing the display panel described in the above embodiments. Figure 11 As shown in the figure, the display panel manufacturing method provided by the embodiments of the present application comprises: Figure 11 As shown in the figure, the display panel manufacturing method provided by the embodiments of the present application comprises:

[0072] S110, providing a substrate.

[0073] Exemplarily, the substrate provided by the embodiments of the present application can be a flexible substrate or a rigid substrate, and the embodiments of the present application do not limit the specific type of the substrate.

[0074] S120, manufacturing a first fan-out wire on one side of the substrate, the first fan-out wire comprising a first main body part and a first edge part, the first edge part being located at the edge of the first main body part and the thickness of the first edge part being less than the thickness of the first main body part.

[0075] Exemplarily, in combination with Figure 2 and Figure 3As shown, the first main body part 1211a can be understood as the main structure of the first fan-out wire 1211, and signals are mainly transmitted in the first main body part 1211a. The first edge part 1211b can be understood as the non-main structure of the first fan-out wire 1211, for example, the edge part caused by process reasons. Specifically, the first main body part 1211a and the first edge part 1211b can be divided based on the distribution position, for example, the first edge part 1211b is located at the edge of the first main body part 1211a. Alternatively, the first main body part 1211a and the first edge part 1211b can be divided based on the film thickness, and the thickness of the first edge part 1211b is less than the thickness of the first main body part 1211a.

[0076] S130, a second fan-out wire is prepared on the side of the first fan-out wire away from the substrate, the second fan-out wire includes a second main body part and a second edge part, the second edge part is located at the edge of the second main body part, and the thickness of the second edge part is less than the thickness of the second main body part; and along the thickness direction of the display panel, at least one first main body part and at least one second main body part do not overlap.

[0077] For example, in combination with Figure 2 and Figure 3 As shown, the second fan-out wire 1212 includes a second main body part 1212a and a second edge part 1212b. The second main body part 1212a can be understood as the main structure of the second fan-out wire 1212, and signals are mainly transmitted in the second main body part 1212a. The second edge part 1212b can be understood as the non-main structure of the second fan-out wire 1212, for example, the edge part caused by process reasons. Specifically, the second main body part 1212a and the second edge part 1212b can be divided based on the distribution position, for example, the second edge part 1212b is located at the edge of the second main body part 1212a. Alternatively, the second main body part 1212a and the second edge part 1212b can be divided based on the film thickness, and the thickness of the second edge part 1212b is less than the thickness of the second main body part 1212a.

[0078] Further, along the thickness direction of the display panel (such as Figure 2 the Z direction as shown), at least one first main body part 1211a and at least one second main body part 1212a do not overlap, so as to avoid parasitic capacitance between the first main body part 1211a and the second main body part 1212a, ensure that the display signals transmitted in the first fan-out wire and the second fan-out wire are less disturbed, and ensure the display effect. In addition, the film layer above the fan-out wire will not be poorly covered due to the protrusion of the overlapping main body part, the flatness of the film layer above the fan-out wire is ensured, and the structural stability of the display panel is ensured.

[0079] To sum up, the preparation method of the display panel provided in the embodiment of the present application can reduce the space occupied by the fan-out wires in the frame area, reduce the lower frame of the display panel, and is conducive to realizing the display panel with a narrow frame. Further, the first main body part of the first fan-out wire and the second main body part of the second fan-out wire are not overlapped, which can avoid the generation of parasitic capacitance between the first main body part and the second main body part, ensure that the display signals transmitted in the first fan-out wire and the second fan-out wire are less disturbed, and ensure the display effect; and the first main body part of the first fan-out wire and the second main body part of the second fan-out wire are not overlapped, which can ensure that the upper film layer of the fan-out wire will not be poorly covered due to the overlapping protrusion of the main body part, and ensure the structural stability of the display panel.

[0080] On the basis of the above-mentioned embodiment, Figure 12 is a flowchart of another preparation method of a display panel provided in the embodiment of the present application, Figure 12 The preparation method shown in the above-mentioned embodiment is based on the above-mentioned embodiment, and details how to prepare the second fan-out wire. As shown in Figure 12 The preparation method provided in the embodiment of the present application comprises:

[0081] S210, providing a substrate.

[0082] S220, preparing a first fan-out wire on one side of the substrate, the first fan-out wire comprising a first main body part and a first edge part, the first edge part being located at the edge of the first main body part and the thickness of the first edge part being less than the thickness of the first main body part.

[0083] S230, preparing a second fan-out wire layer on one side of the first fan-out wire.

[0084] Specifically, Figure 13 is a structure diagram of preparing a second fan-out wire layer on one side of the first fan-out wire provided in the embodiment of the present application, as shown in Figure 13 First, the second fan-out wire layer 20 is prepared.

[0085] S240, preparing a photoresist layer on the side of the second fan-out wire layer away from the first fan-out wire.

[0086] Specifically, Figure 14 is a structure diagram of preparing a photoresist layer on the side of the second fan-out wire layer away from the first fan-out wire provided in the embodiment of the present application, as shown in Figure 14 The photoresist 21 is prepared on the side of the second fan-out wire layer 20 away from the first fan-out wire 1211.

[0087] S250, exposing the photoresist layer using the mask to form exposed photoresist on one side of the second fan-out wiring.

[0088] Specifically, Figure 15 is a structural schematic diagram of a mask provided by an embodiment of the present application, Figure 16 is a structural schematic diagram of forming exposed photoresist by a mask provided by an embodiment of the present application, as Figure 15 and Figure 16 shown, the mask 22 includes a mask body part 221 and a mask edge part 222 connected to each other, the mask edge part 222 includes a plurality of mask protrusions 2221, and a hollow area 223 is arranged between two adjacent mask protrusions 2221 along the arrangement direction of the plurality of mask protrusions. The exposed photoresist 23 includes a first area 231, a second area 232 and a third area 233; along the thickness direction of the display panel (such as the Z direction shown in the figure), the second area 232 overlaps with the mask edge part 222, the third area 233 overlaps with the mask body part 221, and the first area 231 overlaps with the area between two adjacent mask edge parts 222 and does not overlap with the mask.

[0089] For example, as Figure 15 and Figure 16 shown, the mask 22 includes a mask body part 221 and a mask edge part 222 connected to each other, the mask body part 221 can completely or approximately completely block the exposure light, that is, the exposure light cannot be irradiated into the photoresist 21 through the mask body part 221, so that the photoresist in the third area 233 below the mask body part 221 is not exposed or has very little exposure. The mask edge part 222 includes a plurality of mask protrusions 2221, and a hollow area 223 is arranged between two adjacent mask protrusions 2221, that is, part of the exposure light can be irradiated into the photoresist 21 through the hollow area, so that the photoresist in the second area 232 below the mask edge part 222 is partially exposed, and the exposure amount is greater than that of the photoresist in the third area 233. There is no mask pattern between two adjacent mask edge parts 222, that is, the area between two adjacent mask edge parts 222 does not completely block the exposure light, that is, the exposure light is completely irradiated into the photoresist 21 through the area between two adjacent mask edge parts 222, so that the photoresist in the first area 231 between two adjacent mask edge parts 222 is completely and fully exposed, and the exposure amount is greater than that of the photoresist in the second area 232. In this way, three exposure areas with different exposure amounts are formed in the exposed photoresist, that is, the first area 231, the second area 232 and the third area 233. The photoresist in the first area 231 is fully exposed due to the absence of a mask, and has the largest exposure amount; the photoresist in the second area 232 is partially exposed due to the presence of a mask and the hollow area, and has a middle exposure amount; and the photoresist in the third area 233 is not exposed or has a very small amount of exposure due to the complete mask, and has the smallest exposure amount.

[0090] S260, developing the first area of the exposed photoresist forms a photoresist-free area, and the second fan-out wire layer is exposed in the photoresist-free area.

[0091] Figure 17 is a structural schematic diagram of developing and exposing photoresist provided by an embodiment of the present application, as shown in Figure 17 the first area 231 of the exposed photoresist 23 is developed by a developing solution. Since the area is fully exposed, the first area 231 of the exposed photoresist 23 forms a photoresist-free area after development, and the second fan-out wire layer 20 in the area is exposed after the photoresist is removed.

[0092] S270, developing the second area of the exposed photoresist forms a first-thickness photoresist.

[0093] Referring back to Figure 17 the second area 232 of the exposed photoresist 23 is developed by a developing solution. Since the area is partially exposed, a part of the thickness of the photoresist remains after development of the second area 232 of the exposed photoresist 23 because it is not exposed. Therefore, a certain thickness of photoresist, for example, a first-thickness photoresist 234, remains after development of the second area 232 of the exposed photoresist, and the thickness of the first-thickness photoresist 234 is less than the thickness of the photoresist before exposure and development.

[0094] Furthermore, along the direction from the mask main body portion to the mask edge portion, the width of the mask edge portion is positively correlated with the width of the first-thickness photoresist.

[0095] For example, in combination with Figure 15 and Figure 17 along the direction from the mask main body portion 221 to the mask edge portion 222 (for example, the X direction shown in the figure), when the width of the mask edge portion 222 is greater, the light-blocking area of the mask plate 22 is greater along the X direction, and therefore the area of the photoresist blocked is greater, and the width of the first-thickness photoresist formed subsequently is also greater. The first-thickness photoresist corresponds to the size of the second edge portion in the second fan-out wire, and therefore the width of the first-thickness photoresist can be adjusted by adjusting the width of the mask edge portion, and the size of the second edge portion in the second fan-out wire can be adjusted in turn.

[0096] S280, developing the third area of the exposed photoresist forms a second-thickness photoresist, and the thickness of the second-thickness photoresist is greater than the thickness of the first-thickness photoresist.

[0097] Referring back to Figure 17As shown, the third area 233 of the exposed photoresist 23 is developed by the developing solution. Since the third area 233 is not exposed or is exposed by a very small amount, a photoresist of a considerable thickness remains in the third area 233 after the development of the exposed photoresist 23. Therefore, the third area 233 of the exposed photoresist 23 remains a photoresist of a second thickness, for example, the second thickness of the photoresist 235, which is equal to or approximately equal to the thickness of the unexposed photoresist before development.

[0098] S290, etching the second fan-out wire layer to prepare the second fan-out wire; along the thickness direction of the display panel, the second main body portion overlaps the third area, the second edge portion overlaps the second area, and the gap between the two adjacent second fan-out wires overlaps the first area.

[0099] Specifically, in combination with Figure 17 and Figure 2 As shown, the second fan-out wire layer is etched by the above-mentioned exposure mask to prepare the second fan-out wire. The second main body portion 1212a overlaps the third area 233, and the second fan-out wire layer in the third area 233 is reserved to form the second main body portion 1212a. The second edge portion 1212b overlaps the second area 232, and the second fan-out wire layer in the second area 232 is etched to form the second edge portion 1212b. The second fan-out wire layer 20 exposed by the first area 231 is completely etched to form the gap between the two adjacent second fan-out wires 1212, that is, the gap between the two adjacent second fan-out wires 1212 overlaps the first area 231. Finally, a plurality of independently arranged second fan-out wires 1212 are obtained, each of which includes a second main body portion 1212a and a second edge portion 1212b.

[0100] In summary, the photoresist layer arranged in the whole layer is exposed to form the exposed photoresist layer by using the mask plate including the mask body part and the mask edge part, so that the first area, the second area and the third area with different exposure degrees are obtained, that is, the photoresist layer with different exposure degrees is obtained by the OPC process, and then different structures of the second fan-out wire are obtained by using the photoresist layer with different exposure degrees. In this way, the problem that the distance between the first fan-out wire and the second fan-out wire is too large due to over-etching in the existing preparation process of the second fan-out wire, and the upper film layer is recessed to cause the subsequent process to be poor can be avoided, or the problem that the overlapping area between the first fan-out wire and the second fan-out wire is too large due to under-etching in the existing preparation process of the second fan-out wire, and the upper film layer is protruded to cause the subsequent process to be poor can be avoided. The OPC process can ensure that the distance between the second fan-out wire and the first fan-out wire is neither too large nor too small, ensure that the first fan-out wire and the second fan-out wire are neither too overlapped nor too far away, ensure the normal wiring density of the first fan-out wire and the second fan-out wire and the interference on the display signal transmitted by the first fan-out wire and the second fan-out wire is small, ensure the display effect, and the first fan-out wire and the second fan-out wire will not be too far away or too overlapped to cause the upper film layer to be uneven, and ensure the structural stability of the display panel.

[0101] On the basis of the above-mentioned embodiments, Figure 18 is a flowchart of another preparation method of a display panel provided by the embodiments of the present application, Figure 18 The preparation method is described in detail on the basis of the above-mentioned embodiments on how to prepare the second fan-out wire by the secondary etching process. As shown in Figure 18 The preparation method provided by the embodiments of the present application includes:

[0102] S310, providing a substrate.

[0103] S320, preparing a first fan-out wire on one side of the substrate, the first fan-out wire including a first body part and a first edge part, the first edge part being located at the edge of the first body part and the thickness of the first edge part being smaller than the thickness of the first body part.

[0104] S330, preparing a second fan-out wire layer on one side of the first fan-out wire.

[0105] S340, preparing a photoresist layer on one side of the second fan-out wire layer away from the first fan-out wire.

[0106] S350, exposing the photoresist layer to form an exposed photoresist layer on one side of the second fan-out wire by using a mask plate.

[0107] S360, developing the first area of the exposed photoresist layer to form a photoresist-free area, and the photoresist-free area exposes the second fan-out wire layer.

[0108] S370, developing the second region of the exposed photoresist forms a first thickness photoresist.

[0109] S380, developing the third region of the exposed photoresist forms a second thickness photoresist, the second thickness photoresist has a thickness greater than the thickness of the first thickness photoresist.

[0110] S390, etching the second fan-out routing layer to prepare a second fan-out routing master.

[0111] Specifically, Figure 19 is a structural schematic diagram of etching the second fan-out routing layer to prepare a second fan-out routing master provided by the embodiment of the present application, which is combined with Figure 17 and Figure 19 As shown in the figures, the photoresist in the first region 231 is completely removed by developing to form a region without photoresist, so the second fan-out routing layer 20 corresponding to the first region is completely exposed, at this time, the first etching medium can be used to etch the second fan-out routing layer exposed in the region without photoresist. The first etching medium can be understood as an etching medium that reacts with the second fan-out routing layer, for example, etching gas. That is, the second fan-out routing layer exposed in the region without photoresist can be etched and removed by the first etching medium, and the first region of the second fan-out routing is removed by the first etching medium to obtain the second fan-out routing master 24.

[0112] S3100, using a developing etching medium to etch the first thickness photoresist to remove the first thickness photoresist.

[0113] Specifically, Figure 20 is a structural schematic diagram of removing the first thickness photoresist provided by the embodiment of the present application, which is combined with Figure 19 and Figure 20 After obtaining the second fan-out routing master 24, the first thickness photoresist 234 is continuously etched by the developing etching medium, for example, developing solution, until the first thickness photoresist is completely etched and removed, at this time, at least part of the second fan-out routing master originally covered by the first thickness photoresist is exposed.

[0114] It should be noted that, as Figure 20As shown, since the first-thickness photoresist 234 and the second-thickness photoresist 235 are photoresists of the same material type, the second-thickness photoresist is etched by the developing etching medium when the first-thickness photoresist is removed by the developing etching medium. Since the thickness of the second-thickness photoresist is greater than that of the first-thickness photoresist, after the first-thickness photoresist is completely etched and removed, some photoresist remains in the area originally covered by the second-thickness photoresist, as shown by the thinned photoresist 25 in the figure, and this part of the photoresist continues to cover the second-fan-out wire precursor 24. That is, while the first-thickness photoresist is removed by the developing etching medium, the second-thickness photoresist is thinned, but some photoresist remains in the area originally covered by the second-thickness photoresist, as shown by the thinned photoresist 25 in the figure, and this part of the photoresist continues to cover the second-fan-out wire precursor 24.

[0115] S3110, etching the second-fan-out wire precursor to prepare a second-fan-out wire.

[0116] Specifically, Figure 21 is a structural schematic diagram of etching a second-fan-out wire precursor to prepare a second-fan-out wire provided by an embodiment of the present application, which is combined with Figure 20 and Figure 21 As shown, the second-fan-out wire precursor 24 exposed by the first-thickness photoresist is etched by a second etching medium, wherein the second etching medium reacts with the second-fan-out wire precursor 24, and the second-fan-out wire precursor 24 can be etched and removed by the second etching medium to obtain the second-fan-out wire 1212.

[0117] The second etching medium can be understood as an etching medium, such as an etching gas, which reacts with the material of the second-fan-out wire precursor. The edge part of the second-fan-out wire precursor 24 is removed by the reaction of the second etching medium to obtain the second edge part 1212b of the second-fan-out wire 1212, and the remaining part of the second-fan-out wire precursor 24 is covered by the thinned photoresist 25, which is not reacted with the second etching medium and remains to form the second main part 1212a of the second-fan-out wire 1212.

[0118] In summary, the preparation method provided by the embodiment of the present application obtains a photoresist-free area through first photoresist etching, obtains a second fan-out wire mother body through first etching of the second fan-out wire layer in the photoresist-free area, removes the first-thickness photoresist through second photoresist etching, and obtains a second fan-out wire through second etching of the second fan-out wire mother body exposed by the first-thickness photoresist. That is, the second fan-out wire including a second main body and a second edge portion is prepared through twice photoresist etching and twice etching of the second fan-out wire layer. The size of the photoresist-free area in the photoresist and the size of the first-thickness photoresist can be accurately controlled by reasonably controlling the size of the mask main body and the size of the mask edge portion in the mask plate, so that the size of the second fan-out wire can be accurately controlled, the distance between the second fan-out wire and the first fan-out wire can be neither too large nor too small, the first fan-out wire and the second fan-out wire can be neither too overlapped nor too far away, the normal wiring density of the first fan-out wire and the second fan-out wire and the interference on the display signal transmitted in the first fan-out wire and the second fan-out wire can be small, the display effect can be ensured, and the first fan-out wire and the second fan-out wire can not cause the upper film layer to be uneven due to being too far away or too overlapped, so that the structural stability of the display panel can be ensured.

[0119] Based on the same inventive concept, the embodiment of the present application also provides a display device, in particular, Figure 22 is a structural schematic diagram of a display device provided by the embodiment of the present application, as Figure 22 shown, the display device 100 includes the display panel 10 described in any of the above embodiments, therefore, the display device 100 provided by the embodiment of the present application has the corresponding beneficial effects in the above embodiments, which will not be described here. For example, the display device 100 can be a mobile phone, a computer, a smart wearable device (for example, a smart watch), a vehicle-mounted display device, and the like, and the embodiment of the present application is not limited thereto.

[0120] The above specific embodiments do not constitute a limitation on the protection scope of the present application. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent replacement and improvement made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized by, The display area and the fan-out wire area are arranged on the display panel. The display area includes a plurality of data lines, and the fan-out wire area includes a plurality of fan-out wires electrically connected with the data lines. The fan-out wires include a plurality of first fan-out wires and a plurality of second fan-out wires, and the display panel further includes a substrate, the second fan-out wires being located on a side of the first fan-out wires away from the substrate. The first fan-out wires include first body portions and first edge portions, the first edge portions being located at edges of the first body portions and having a thickness smaller than that of the first body portions; the second fan-out wires include second body portions and second edge portions, the second edge portions being located at edges of the second body portions and having a thickness smaller than that of the second body portions. Along a thickness direction of the display panel, at least one of the first body portions and at least one of the second body portions do not overlap. Along a direction of the second edge portion pointing to the second body portion, the thickness of the second edge portion gradually increases. The display area is further provided with sub-pixels connected with the data lines, the data lines being used to provide data signals to the sub-pixels so that the sub-pixels emit light according to the data signals.

2. The display panel of claim 1, wherein, Along the thickness direction of the display panel, the first edge portions and the second edge portions partially overlap. Alternatively, along the thickness direction of the display panel, the first edge portions and the second edge portions do not overlap, and along a first direction, a minimum distance L between the first edge portions and the second edge portions satisfies L≤0.3µm; the first direction is an arrangement direction of the plurality of fan-out wires.

3. The display panel of claim 1, wherein, The second body portions include first surfaces close to the substrate, and the second edge portions include second surfaces close to the substrate, a plane where the first surfaces are located is parallel to a plane where the substrate is located, and a plane where the second surfaces are located intersects the plane where the substrate is located.

4. The display panel of claim 1, wherein, The second body portions include third surfaces away from the substrate, and the third surfaces are parallel to the plane where the substrate is located. The second edge portions include second surfaces close to the substrate and first side surfaces connecting the second surfaces and the third surfaces, and the first side surfaces include curved surfaces.

5. The display panel of claim 4, wherein, The first side surfaces have two positions, an included angle between a tangent plane at a position close to the second body portions and the plane where the substrate is located is greater than an included angle between a tangent plane at a position away from the second body portions and the plane where the substrate is located.

6. The display panel of claim 1, wherein, The first edge portions include second side surfaces, and the second edge portions include second surfaces close to the substrate, the second side surfaces being parallel to the second surfaces.

7. The display panel of claim 1, wherein, Along a first direction, a width of the second fan-out wires is greater than a width of the first fan-out wires; the first direction is an arrangement direction of the plurality of fan-out wires.

8. The display panel of claim 1, wherein, The display panel further includes a binding area located on a side of the fan-out wire area away from the display area, and the binding area includes binding pads. The second fan-out wire includes a first wire section and a second wire section connected to each other, the first wire section is electrically connected to the data line, and the second wire section is electrically connected to the bonding pad; and an included angle between the first wire section and a preset direction is smaller than an included angle between the second wire section and the preset direction, the preset direction is parallel to a direction in which the display area points to the bonding area. A line width of the first wire section is greater than a line width of the second wire section.

9. The display panel of claim 8, wherein, A line width of the second main section of the first wire section is greater than a line width of the second main section of the second wire section, and / or a line width of the second edge section of the first wire section is greater than a line width of the second edge section of the second wire section.

10. The display panel of claim 1, wherein, In the two second fan-out wires, a line width of the second fan-out wire close to a side of the display panel edge along a first direction is greater than a line width of the second fan-out wire close to a side of the display panel center along the first direction; and the first direction is an arrangement direction of the second fan-out wire.

11. A method for manufacturing a display panel according to any one of claims 1 to 10, characterized in that The preparation method includes: providing a substrate; preparing a first fan-out wire on one side of the substrate, the first fan-out wire including a first main section and a first edge section, the first edge section being located at an edge of the first main section and having a thickness smaller than that of the first main section; preparing a second fan-out wire on a side of the first fan-out wire away from the substrate, the second fan-out wire including a second main section and a second edge section, the second edge section being located at an edge of the second main section and having a thickness smaller than that of the second main section; and along a thickness direction of the display panel, at least one first main section and at least one second main section do not overlap.

12. The method of claim 11, wherein, Preparation of the second fan-out wire on the side of the first fan-out wire away from the substrate includes: preparing a second fan-out wire layer on one side of the first fan-out wire; preparing a photoresist layer on a side of the second fan-out wire layer away from the first fan-out wire; exposing the photoresist layer to light using a mask to form an exposed photoresist on one side of the second fan-out wire; the mask includes a mask main section and a mask edge section connected to each other, the mask edge section including a plurality of mask protrusions, and along an arrangement direction of the plurality of mask protrusions, a hollow area is arranged between two adjacent mask protrusions; the exposed photoresist includes a first area, a second area, and a third area; along the thickness direction of the display panel, the second area overlaps the mask edge section, the third area overlaps the mask main section, and the first area overlaps a region between two adjacent mask edge sections and does not overlap the mask; etching the second fan-out wire layer to prepare a second fan-out wire; along the thickness direction of the display panel, the second main section overlaps the third area, the second edge section overlaps the second area, and a gap between two adjacent second fan-out wires overlaps the first area.

13. The method of claim 12, wherein, After exposing the photoresist layer using a mask to form exposed photoresist on one side of the second fan-out wire layer, the method further comprises: developing the first area of the exposed photoresist to form a photoresist-free area, the photoresist-free area exposing the second fan-out wire layer; developing the second area of the exposed photoresist to form a first thickness photoresist; developing the third area of the exposed photoresist to form a second thickness photoresist, the second thickness photoresist having a thickness greater than the thickness of the first thickness photoresist.

14. The method of claim 13, wherein, etching the second fan-out wire layer to produce a second fan-out wire, comprising: etching the second fan-out wire layer to produce a second fan-out wire precursor; etching the second fan-out wire precursor to produce a second fan-out wire.

15. The preparation method according to claim 14, characterized in that, etching the second fan-out wire layer to produce a second fan-out wire precursor, comprising: using a first etching medium to etch the second fan-out wire layer exposed by the photoresist-free area; the first etching medium reacting with the second fan-out wire layer, and removing a first area of the second fan-out wire layer by etching with the first etching medium to obtain a second fan-out wire precursor.

16. The method of claim 15, wherein, after etching the second fan-out wire layer to produce a second fan-out wire precursor, comprising: using a developing etching medium to etch the first thickness photoresist, and removing the first thickness photoresist the first thickness photoresist exposing at least part of the second fan-out wire precursor.

17. The method of claim 16, wherein the method further comprises, etching the second fan-out wire precursor to produce a second fan-out wire, comprising: using a second etching medium to etch the second fan-out wire precursor exposed by the first thickness photoresist; the second etching medium reacting with the second fan-out wire precursor, and removing a second area of the second fan-out wire precursor by etching with the second etching medium to obtain the second fan-out wire.

18. The method of claim 13, in a direction from the mask body portion to the mask edge portion, a width of the mask edge portion is positively correlated with a width of the first thickness photoresist.

19. A display device comprising: The display panel of any one of claims 1-10. The display panel of any one of claims 1-10.

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