Wiring sheet and its manufacturing method

Abstract

The present invention provides a wiring sheet (100) having a sheet-like structure (2) formed by a plurality of conductive wires (21) arranged at intervals and a pair of electrodes (4), the sheet-like structure (2) being electrically connected to the electrodes (4), and the conductive wires (21) and the electrodes (4) being fixed by a contact fixing part (5).

Description

Technical Field

[0001] This invention relates to wiring sheets and methods for manufacturing wiring sheets. Background Technology

[0002] A sheet-like conductive component (hereinafter also referred to as "conductive sheet") having multiple conductive linear bodies arranged at intervals in a sheet-like structure may be used as a component for various items such as heating elements of heating devices, heating textile materials, and protective films (shatterproof films) for displays.

[0003] As a sheet used as a heating element, for example, Patent Document 1 describes a conductive sheet having a sheet-like structure in which multiple linear bodies extending in one direction are arranged at intervals. In this sheet, a wiring sheet that can be used as a heating element can be obtained by providing a pair of electrodes at both ends of the multiple linear bodies.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: International Publication No. 2017 / 086395 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, it is known that in the wiring sheet described in Patent Document 1, the resistance value of the wiring sometimes increases. On the other hand, when the electrode and the wire are firmly fixed by using a resin layer or the like, it becomes difficult to extend the wiring sheet along the axial direction of the electrode.

[0009] The purpose of this invention is to provide a wiring sheet capable of stabilizing the resistance value of wiring and having axial flexibility of the electrodes, as well as a method for manufacturing the wiring sheet.

[0010] Methods for solving problems

[0011] According to one aspect of the present invention, a wiring sheet is provided having a pair of electrodes and a sheet-like structure formed by a plurality of conductive wires arranged at intervals, the sheet-like structure being electrically connected to the electrodes, the conductive wires and the electrodes being fixed by a contact fixing part.

[0012] In one embodiment of the wiring patch of the present invention, it is preferable that the contact fixing portions are arranged independently of each other in the cross-sectional view of the wiring patch.

[0013] In one embodiment of the wiring sheet of the present invention, the electrodes are preferably metal wires.

[0014] In one embodiment of the wiring sheet of the present invention, the contact fixing part is preferably selected from at least one of metal, adhesive and riveting.

[0015] In one embodiment of the wiring patch of the present invention, the elastic modulus of the aforementioned contact fixing portion at 25°C is preferably 5.0 × 10⁻⁶. 8 Pa or above.

[0016] In one embodiment of the wiring sheet of the present invention, preferably in a top view of the wiring sheet, the conductive wire and the electrode are formed in a wave shape.

[0017] In one embodiment of the wiring sheet of the present invention, it is preferable to further include a resin layer supporting the aforementioned sheet-like structure, and the resin layer is elastic.

[0018] In one embodiment of the wiring sheet of the present invention, it is preferable to further include a substrate supporting the aforementioned sheet-like structure, and the substrate is a stretchable substrate.

[0019] In one embodiment of the wiring sheet of the present invention, it is preferable that the contact fixing portion is formed at least from the solidified molten resin of the substrate.

[0020] According to one aspect of the present invention, a method for manufacturing a wiring patch is provided, the method comprising: forming the aforementioned contact fixing portion by at least one method selected from hot pressing, high-frequency welding and bonding, hot air welding and bonding, hot plate welding and bonding, and ultrasonic welding and bonding.

[0021] According to one aspect of the present invention, a wiring sheet capable of stabilizing the resistance value of the wiring and having axial flexibility of the electrodes, and a method for manufacturing the wiring sheet, can be provided. Attached Figure Description

[0022] Figure 1 This is a schematic diagram illustrating a wiring patch according to a first embodiment of the present invention.

[0023] Figure 2 It is shown Figure 1 A cross-sectional view of section II-II.

[0024] Figure 3A This is a diagram used to illustrate a method for manufacturing a wiring patch according to the first embodiment of the present invention.

[0025] Figure 3B This is a diagram used to illustrate a method for manufacturing a wiring patch according to the first embodiment of the present invention.

[0026] Figure 3C This is a diagram used to illustrate a method for manufacturing a wiring patch according to the first embodiment of the present invention.

[0027] Figure 3DThis is a diagram used to illustrate a method for manufacturing a wiring patch according to the first embodiment of the present invention.

[0028] Figure 4A This is a diagram illustrating the method of manufacturing the wiring patch according to the second embodiment of the present invention.

[0029] Figure 4B This is a diagram illustrating the method of manufacturing the wiring patch according to the second embodiment of the present invention.

[0030] Figure 4C This is a diagram illustrating the method of manufacturing the wiring patch according to the second embodiment of the present invention.

[0031] Figure 4D This is a diagram illustrating the method of manufacturing the wiring patch according to the second embodiment of the present invention.

[0032] Symbol Explanation

[0033] 1···Substrate

[0034] 2···Imitation sheet-like structure

[0035] 21··· Conductive linear body

[0036] 3··· Resin layer

[0037] 4···Electrode

[0038] 5,5A···Contact fixing part

[0039] 100, 100A... wiring sheet Detailed Implementation

[0040] [First Implementation Method]

[0041] The present invention will be described below with reference to the accompanying drawings, but the present invention is not limited to the contents of the embodiments. It should be noted that some parts in the drawings are enlarged or reduced for ease of explanation.

[0042] (Wirework Piece)

[0043] like Figure 1 and Figure 2 As shown, the wiring sheet 100 of this embodiment includes a sheet-like structure 2 and a pair of electrodes 4. The sheet-like structure 2 is electrically connected to the electrodes 4, and each connection point between the conductive wire 21 and the electrodes 4 is fixed by a contact fixing part 5.

[0044] Since the conductive wire 21 and the electrode 4 can be fixed by multiple contact fixing parts 5, it is possible to prevent the electrode 4 from detaching from the pseudo-plate structure 2. Therefore, the electrical connection between the electrode 4 and the pseudo-plate structure 2 can be stably ensured, and the resistance value of the wiring can be stabilized. On the other hand, as... Figure 1 As shown in the cross-sectional view of the wiring piece 100, the contact fixing part 5 is independently configured. Therefore, when it is desired to extend or retract the wiring piece 100 along the axial direction of the electrode 4, the contact fixing part 5 will not hinder the extension or retraction of the wiring piece 100. Thus, the axial extension and retraction of the wiring piece 100 along the electrode 4 can be ensured.

[0045] (Substrate)

[0046] The substrate 1 can directly or indirectly support the sheet-like structure 2. Examples of substrate 1 include synthetic resin films, paper, metal foil, non-woven fabrics, cloth, and glass films. Furthermore, the substrate 1 is preferably a stretchable substrate. When the substrate 1 is a stretchable substrate, the stretchability of the wiring sheet 100 can be ensured even when the sheet-like structure 2 is placed on the substrate 1.

[0047] Synthetic resin films, nonwoven fabrics, and cloths can be used as stretchable substrates.

[0048] Examples of synthetic resin films include: polyethylene films, polypropylene films, polybutene films, polybutadiene films, polymethylpentene films, polyvinyl chloride films, vinyl chloride copolymer films, polyethylene terephthalate films, polyethylene naphthalate films, polybutylene terephthalate films, polyurethane films, ethylene vinyl acetate copolymer films, ionomer resin films, ethylene-(meth)acrylate copolymer films, ethylene-(meth)acrylate copolymer films, polystyrene films, polycarbonate films, and polyimide films. Furthermore, examples of cross-linked films and laminated films can be used as stretchable substrates.

[0049] In addition, examples of nonwoven fabrics include spunbond nonwoven fabrics, needle-punched nonwoven fabrics, meltblown nonwoven fabrics, and spunlace nonwoven fabrics. Examples of fabrics include woven fabrics and knitted fabrics. Paper, nonwoven fabrics, and fabrics as stretchable substrates are not limited to these.

[0050] The thickness of the stretchable substrate is not particularly limited. Preferably, the thickness of the stretchable substrate is 10 μm or more and 10 mm or less, more preferably 15 μm or more and 3 mm or less, and even more preferably 50 μm or more and 1.5 mm or less.

[0051] (Similar to a sheet-like structure)

[0052] The sheet-like structure 2 is formed by arranging multiple conductive wires 21 spaced apart from each other. That is, the sheet-like structure 2 is a structure formed by arranging multiple conductive wires 21 spaced apart from each other in a way that forms a plane or curved surface. In the top view of the wiring sheet 100, the conductive wires 21 extend in one direction and are formed into a straight line or a wave shape. Furthermore, the sheet-like structure 2 is formed by arranging multiple conductive wires 21 in a direction orthogonal to the axis of the conductive wires 21.

[0053] It should be noted that, in the top view of the wiring sheet 100, the conductive linear body 21 is preferably formed in a wave shape. Examples of wave shapes include sine waves, rectangular waves, triangular waves, and sawtooth waves. As long as the sheet-like structure 2 has such a structure, the breakage of the conductive linear body 21 can be suppressed when the wiring sheet 100 is extended along the axial direction of the conductive linear body 21.

[0054] The volume resistivity of the conductive linear body 21 is preferably 1.0 × 10⁻⁶. -9 Ω·m or more and 1.0×10 -3 Below Ω·m, more preferably 1.0×10 -8 Ω·m or more and 1.0×10 -4 Below Ω·m. When the volume resistivity of the conductive linear body 21 is set within the above range, it is easy to reduce the surface resistivity of the sheet-like structure 2.

[0055] The volume resistivity of the conductive wire 21 was determined as follows. Silver paste was applied to both ends of the conductive wire 21, and the resistance of a portion 40 mm from the end was measured to determine the resistance value of the conductive wire 21. Then, the resistance was calculated using the cross-sectional area of ​​the conductive wire 21 (unit: m²). 2 Multiply the resistance value mentioned above by the value obtained, divide the obtained value by the length measured above (0.04m), and calculate the volume resistivity of the conductive linear body 21.

[0056] The shape of the cross-section of the conductive linear body 21 is not particularly limited, and can be polygonal, flat, elliptical, or circular, etc. However, from the viewpoint of matching with the resin layer 3, an elliptical or circular shape is preferred.

[0057] When the cross-section of the conductive wire 21 is circular, the thickness (diameter) D of the conductive wire 21 (refer to...) Figure 2 The diameter D of the conductive wire 21 is preferably 5 μm or more and 75 μm or less. From the viewpoint of suppressing the rise of the thin-film resistance and improving the heating efficiency and resistance to insulation failure when using the wiring sheet 100 as a heating element, the diameter D of the conductive wire 21 is more preferably 8 μm or more and 60 μm or less, and even more preferably 12 μm or more and 40 μm or less.

[0058] When the cross-section of the conductive linear body 21 is elliptical, it is preferable that the major axis is within the same range as the diameter D mentioned above.

[0059] Regarding the diameter D of the conductive linear body 21, the conductive linear body 21 of the sheet-like structure 2 was observed using a digital microscope, and the diameter of the conductive linear body 21 was measured at 5 randomly selected locations, and the average value was taken.

[0060] The spacing L of the conductive linear body 21 (refer to) Figure 2 Preferably, the thickness is 0.3 mm or more and 50 mm or less, more preferably 0.5 mm or more and 30 mm or less, and even more preferably 0.8 mm or more and 20 mm or less.

[0061] When the spacing between the conductive wires 21 is within the range described above, since the conductive wires are densely packed together to a certain extent, it is possible to improve the function of the wire sheet 100, such as keeping the resistance of the sheet-like structure at a low level and making the distribution of temperature rise more uniform when the wire sheet 100 is used as a heating element.

[0062] Regarding the spacing L of the conductive linear bodies 21, the conductive linear bodies 21 of the sheet-like structure 2 are observed using a digital microscope, and the spacing between two adjacent conductive linear bodies 21 is measured.

[0063] It should be noted that the interval between two adjacent conductive wires 21 refers to the length along the direction in which the conductive wires 21 are arranged, and is the length between the opposite portions of the two conductive wires 21 (see reference). Figure 2 When the conductive linear bodies 21 are arranged at unequal intervals, the interval L is the average value of the intervals between all adjacent conductive linear bodies 21.

[0064] The conductive wire 21 is not particularly limited and can be a wire containing metal wires (hereinafter also referred to as "metal wire wire"). Metal wires have high thermal conductivity, high electrical conductivity, high processability, and versatility. Therefore, when using a metal wire wire as the conductive wire 21, it is possible to reduce the resistance value of the sheet-like structure 2 while improving light transmittance. In addition, when using the wiring sheet 100 (sheet-like structure 2) as the heating element, rapid heating is easily achieved. Furthermore, as described above, it is easy to obtain a wire with a small diameter.

[0065] It should be noted that, in addition to metal wires, conductive wires 21 can also include wires containing carbon nanotubes and wires formed by coating filaments with conductivity.

[0066] A metal wire can be a single metal wire or a wire made by twisting multiple metal wires together.

[0067] Examples of metal wires include those containing metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, and gold, or alloys containing two or more metals (e.g., stainless steel, carbon steel, brass, phosphor bronze, zirconium copper alloy, beryllium copper, iron-nickel, nickel-chromium alloy, nickel-titanium, cantaloupes, Hastelloy, and tungsten-rhenium). Additionally, the metal wire can be plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloys, or solder, or its surface can be coated with carbon materials or polymers as described later. From the viewpoint of producing a thin, high-strength, low-volume-resistivity conductive wire 21, wires containing one or more metals selected from tungsten and molybdenum, and alloys containing them, are particularly preferred.

[0068] Examples of metal wires include those coated with carbon materials. When a metal wire is coated with carbon, its metallic luster is reduced, making it difficult to see. Furthermore, carbon coating can also inhibit metal corrosion.

[0069] Examples of carbon materials used to coat metal wires include amorphous carbon (e.g., carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, and carbon fiber), graphite, fullerene, graphene, and carbon nanotubes.

[0070] A carbon nanotube-containing linear body can be obtained, for example, by drawing carbon nanotubes in sheet form from the end of a carbon nanotube forest (a growth body formed by growing multiple carbon nanotubes on a substrate in a direction perpendicular to the substrate, sometimes also called an "array"), bundling the drawn carbon nanotube sheets, and then twisting the bundle of carbon nanotubes. In such a manufacturing method, a strip-shaped carbon nanotube linear body can be obtained without twisting, and a filament-shaped linear body can be obtained with twisting. The strip-shaped carbon nanotube linear body is a linear body without the structure of twisted carbon nanotubes. In addition, carbon nanotube linear bodies can also be obtained by spinning a dispersion of carbon nanotubes. The manufacture of spun carbon nanotube linear bodies can be carried out, for example, by the method disclosed in U.S. Patent Application Publication No. 2013 / 0251619 (Japanese Patent Application Publication No. 2012-126635). From the viewpoint of achieving uniformity in the diameter of carbon nanotube wires, it is desirable to use filamentous carbon nanotube wires. From the viewpoint of obtaining high-purity carbon nanotube wires, it is preferable to obtain filamentous carbon nanotube wires by twisting carbon nanotube sheets. Carbon nanotube wires can also be wires formed by weaving two or more carbon nanotube wires together. Furthermore, carbon nanotube wires can be wires formed by combining carbon nanotubes with other conductive materials (hereinafter also referred to as "composite wires").

[0071] Examples of composite linear bodies include: (1) carbon nanotubes are drawn out in sheets from the ends of a carbon nanotube forest, and the drawn carbon nanotube sheets are bundled together and twisted to obtain a carbon nanotube linear body. In this process, a metal element or metal alloy is loaded onto the surface of the carbon nanotube forest, sheets, bundles, or twisted linear body by means of vapor deposition, ion plating, sputtering, wet plating, etc.; (2) a composite linear body is formed by twisting a bundle of carbon nanotubes together with a linear body of metal element, a linear body of metal alloy, or a composite linear body; (3) a composite linear body is formed by weaving a linear body of metal element, a linear body of metal alloy, or a composite linear body with a carbon nanotube linear body or a composite linear body; etc. It should be noted that, for the composite linear body of (2), when twisting the bundle of carbon nanotubes, the metal can be loaded onto the carbon nanotubes in the same way as for the composite linear body of (1). In addition, (3) is a composite filament when two filaments are woven together. However, as long as it contains at least one elemental metal filament, metal alloy filament or composite filament, three or more carbon nanotube filaments, elemental metal filaments, metal alloy filaments or composite filaments can be woven together.

[0072] Metals that are composite linear bodies include, for example, elemental metals such as gold, silver, copper, iron, aluminum, nickel, chromium, tin, and zinc, as well as alloys containing at least one of these elemental metals (such as copper-nickel-phosphorus alloys and copper-iron-phosphorus-zinc alloys).

[0073] The conductive linear body 21 can be a linear body obtained by applying a conductive coating to a filament. Examples of filaments include those spun from resins such as nylon and polyester. Examples of conductive coatings include films made of metals, conductive polymers, carbon materials, etc. The conductive coating can be formed by methods such as plating or vapor deposition. Applying a conductive coating to a filament can improve the conductivity of the linear body while maintaining the flexibility of the filament. That is, it is easier to reduce the resistance of the sheet-like structure 2.

[0074] (Resin layer)

[0075] The resin layer 3 is a layer containing resin. This resin layer 3 can directly or indirectly support the sheet-like structure 2. Furthermore, the resin layer 3 is preferably a layer containing an adhesive. When the sheet-like structure 2 is formed on the resin layer 3, the adhesive facilitates the bonding of the conductive wire 21 to the resin layer 3. Additionally, the resin layer 3 preferably has elasticity. In this case, the elasticity of the wiring sheet 100 can be ensured.

[0076] The resin layer 3 can be a layer formed from a drier or curable resin. This allows the resin layer 3 to be endowed with sufficient hardness to protect the sheet-like structure 2, and the resin layer 3 also functions as a protective film. Furthermore, the cured or dried resin layer 3 possesses impact resistance and can suppress deformation of the resin layer 3 caused by impact.

[0077] From the viewpoint that curing can be easily carried out in a short time, resin layer 3 is preferably curable by energy rays such as ultraviolet light, visible energy rays, infrared rays, and electron beams. It should be noted that "energy ray curing" also includes heat curing based on heating using energy rays.

[0078] Examples of adhesives for resin layer 3 include thermosetting adhesives that cure by heat, so-called heat-sealing adhesives that bond by heat, and adhesives that exhibit adhesion upon wetting. Among these, for ease of use, resin layer 3 is preferably energy-curable. Examples of energy-curable resins include compounds having at least one polymerizable double bond within the molecule, preferably acrylate compounds having (meth)acryloyl groups.

[0079] Examples of the aforementioned acrylate compounds include (meth)acrylates containing a chain-like aliphatic backbone, such as trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate, etc. ), (meth)acrylates containing a cyclic aliphatic backbone (dicyclopentyl di(meth)acrylate, dicyclopentadiene di(meth)acrylate, etc.), polyalkylene glycol (meth)acrylates (polyethylene glycol di(meth)acrylate, etc.), low polyester (meth)acrylates, urethane (meth)acrylate oligomers, epoxy modified (meth)acrylates, polyether (meth)acrylates other than the above-mentioned polyalkylene glycol (meth)acrylates, and itaconic acid oligomers, etc.

[0080] The weight-average molecular weight (Mw) of the energy-curable resin is preferably 100 to 30,000, more preferably 300 to 10,000.

[0081] The adhesive composition may contain only one type of energy-curable resin or two or more types. If two or more types are used, their combination and proportions can be arbitrarily chosen. Alternatively, it may be combined with the thermoplastic resin described later; the combination and proportions can also be arbitrarily chosen.

[0082] The resin layer 3 may also be an adhesive layer formed of an adhesive (pressure-sensitive adhesive). The adhesive used in the adhesive layer is not particularly limited. Examples of adhesives include acrylic adhesives, urethane adhesives, rubber adhesives, polyester adhesives, silicone adhesives, and polyvinyl ether adhesives. Preferably, the adhesive is selected from at least one of acrylic adhesives, urethane adhesives, and rubber adhesives, and more preferably, an acrylic adhesive.

[0083] Examples of acrylic adhesives include polymers comprising structural units derived from alkyl (meth)acrylates having straight-chain or branched alkyl groups (i.e., polymers obtained by polymerizing at least alkyl (meth)acrylates) and acrylic polymers comprising structural units derived from (meth)acrylates having cyclic structures (i.e., polymers obtained by polymerizing at least (meth)acrylates having cyclic structures). Here, "(meth)acrylate" is used as a term to refer to both "acrylate" and "methacrylate," and other similar terms are treated similarly.

[0084] Acrylic copolymers can also be crosslinked using crosslinking agents. Examples of crosslinking agents include known epoxy crosslinking agents, isocyanate crosslinking agents, aziridine crosslinking agents, and metal chelate crosslinking agents. When crosslinking acrylic copolymers, functional groups derived from the monomer components of the acrylic polymer can be introduced into the acrylic copolymer, such as hydroxyl or carboxyl groups that react with these crosslinking agents.

[0085] When resin layer 3 is formed by an adhesive, resin layer 3 may contain the aforementioned energy-curable resin in addition to the adhesive. Furthermore, when using an acrylic adhesive as the adhesive, a compound having both functional groups that react with functional groups from the monomer components of the acrylic copolymer and energy-curable functional groups in one molecule can be used as the energy-curable component. Through the reaction of the functional groups of this compound with the functional groups from the monomer components of the acrylic copolymer, the side chains of the acrylic copolymer can be polymerized by irradiation with energy rays. When the adhesive is not an acrylic adhesive, a component with energy-curable side chains can also be used as the polymer component other than an acrylic polymer.

[0086] The thermosetting resin used for resin layer 3 is not particularly limited, but may include epoxy resin, phenolic resin, melamine resin, urea-formaldehyde resin, polyester resin, urethane resin, acrylic resin, and benzo[a]benzene resin. Azide resins, phenoxy resins, amine compounds, acid anhydride compounds, etc. These can be used individually or in combination of two or more. From the viewpoint of suitability for curing with imidazole-based curing catalysts, epoxy resins, phenolic resins, melamine resins, urea-formaldehyde resins, amine compounds, and acid anhydride compounds are preferred. In particular, from the viewpoint of exhibiting excellent curability, epoxy resins, phenolic resins, mixtures thereof, or mixtures of epoxy resins with at least one selected from phenolic resins, melamine resins, urea-formaldehyde resins, amine compounds, and acid anhydride compounds are preferred.

[0087] The moisture-curing resin used for resin layer 3 is not particularly limited, and examples include urethane resins and modified silicone resins, which are resins that generate isocyanate groups through moisture.

[0088] When using energy-curable resins or thermosetting resins, photopolymerization initiators or thermal polymerization initiators are preferred. By using photopolymerization initiators or thermal polymerization initiators, a cross-linked structure can be formed, which can more strongly protect the sheet-like structure 2.

[0089] Examples of photopolymerization initiators include: benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoate, benzoin dimethyl ether, 2,4-diethylthioxanthone, 1-hydroxycyclohexylphenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, 2-chloroanthraquinone, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, etc.

[0090] Examples of thermal polymerization initiators include: hydrogen peroxide, persulfates (ammonium persulfate, sodium persulfate, potassium persulfate, etc.), azo compounds (2,2'-azobis(2-amidinylpropane) dihydrochloride, 4,4'-azobis(4-cyanopentanoic acid), 2,2'-azobisisobutyronitrile, and 2,2'-azobis(4-methoxy-2,4-dimethylpentanonitrile), etc.), and organic peroxides (benzoyl peroxide, lauroyl peroxide, peracetic acid, peroxysuccinic acid, di-tert-butyl peroxide, tert-butyl hydrogen peroxide, and cumene hydroperoxide, etc.).

[0091] These polymerization initiators can be used alone or in combination of two or more.

[0092] When using these polymerization initiators to form a crosslinked structure, the amount used is preferably 0.1 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of energy-curable resin or thermosetting resin, more preferably 1 part by mass or more and 100 parts by mass or less, and particularly preferably 1 part by mass or more and 10 parts by mass or less.

[0093] The resin layer 3 may not be curable, but may be a layer formed, for example, from a thermoplastic resin composition. Furthermore, by including a solvent in the thermoplastic resin composition, the thermoplastic resin layer can be softened. As a result, when forming the sheet-like structure 2 on the resin layer 3, it becomes easier to attach the conductive wire 21 to the resin layer 3. On the other hand, by evaporating the solvent in the thermoplastic resin composition, the thermoplastic resin can be dried and solidified.

[0094] Examples of thermoplastic resins include: polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, polyurethane, polyether, polyethersulfone, polyimide, and acrylic resins.

[0095] Examples of solvents include: alcohols, ketones, esters, ethers, hydrocarbons, haloalkyls, and water.

[0096] The resin layer 3 may also contain inorganic fillers. By including inorganic fillers, the hardness of the cured resin layer 3 can be further increased. Furthermore, the thermal conductivity of the resin layer 3 can be improved.

[0097] Examples of inorganic filler materials include: inorganic powders (e.g., powders of silica, alumina, talc, calcium carbonate, titanium dioxide, iron oxide red, silicon carbide, metals, and boron nitride), beads obtained by spheroidizing inorganic powders, single-crystal fibers, and glass fibers. Among these, silica fillers and alumina fillers are preferred. One type of inorganic filler material can be used alone, or two or more can be used in combination.

[0098] The resin layer 3 may also contain other components. Examples of other components include, for instance, well-known additives such as organic solvents, flame retardants, tackifiers, UV absorbers, antioxidants, preservatives, mildew inhibitors, plasticizers, defoamers, and wetting modifiers.

[0099] The thickness of the resin layer 3 can be appropriately determined according to the application of the wiring sheet 100. For example, from the viewpoint of adhesion, the thickness of the resin layer 3 is preferably 3 μm or more and 150 μm or less, more preferably 5 μm or more and 100 μm or less.

[0100] (electrode)

[0101] Electrode 4 is used to supply current to the conductive wire 21. Electrode 4 is in direct contact with the conductive wire 21. Specifically, electrode 4 is electrically connected to both ends of the conductive wire 21.

[0102] Electrode 4 can be formed using known electrode materials. Examples of electrode materials include conductive paste (silver paste, etc.), metal foil (copper foil, etc.), and metal wire. Electrode 4 is preferably a metal wire. When the electrode is a metal wire, it is easy to connect the electrode to the wiring from the power source because it is a connection between metal wires. According to this embodiment, the contact between the conductive wire 21 and the electrode 4 can be stabilized and the resistance value is less likely to increase. Therefore, even when using metal wire or the like instead of conductive paste or metal foil with excellent contact resistance, the contact resistance between the conductive wire 21 and the electrode 4 can be stabilized.

[0103] When the electrode material is a metal wire, there can be one metal wire, but two or more are preferred. Additionally, as... Figure 1 As shown, there can also be four metal wires. Furthermore, in a pair of electrodes, the number of metal wires used in one electrode can differ from the number of metal wires used in the other electrode. Additionally, in the top view of the wiring sheet 100, the metal wires are preferably formed in a wave shape. Examples of wave shapes include sine waves, rectangular waves, triangular waves, and sawtooth waves. With this structure for the electrode 4, wire breakage of the electrode 4 can be suppressed when the wiring sheet 100 extends along the axial direction of the electrode 4.

[0104] Examples of metals that can be used as foils or wires include: copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, and alloys containing two or more metals (e.g., stainless steel, carbon steel, brass, phosphor bronze, zirconium copper alloy, beryllium copper, iron-nickel, nickel-chromium alloy, nickel-titanium, Cantal alloy, Hastelloy, and tungsten-rhenium). Additionally, the foil or wire can be a material plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloy, or solder. Particularly from the viewpoint of metals with low volume resistivity, it is preferable to include one or more metals selected from copper and silver, and alloys containing them.

[0105] In the top view of the sheet-like structure 2, the width of one of the pairs of electrodes 4 is preferably 3000 μm or less, more preferably 2000 μm or less, and even more preferably 1500 μm or less. When two or more metal wires are used in the electrode, the width of the electrode 4 is the sum of the widths of each metal wire. Multiple metal wires can be in direct contact or electrically connected via conductive wire-like bodies 21. It should be noted that when the electrode 4 is a single metal wire, the width of the electrode 4 is the diameter of the metal wire.

[0106] The ratio of the resistance of electrode 4 to that of the imitation sheet structure 2, obtained by calculating "resistance value of electrode 4 / resistance value of imitation sheet structure 2", is preferably 0.0001 or more and 0.3 or less, more preferably 0.0005 or more and 0.1 or less. When using the wiring sheet 100 as the heating element, the imitation sheet structure 2 needs to have a certain degree of resistance in order to heat up; on the other hand, electrode 4 is preferably designed to allow current to flow as easily as possible. Therefore, a difference arises between the resistance value of electrode 4 and the resistance value of the imitation sheet structure 2. For this reason, an increase in the ratio of the resistance values ​​of electrode 4 to that of the imitation sheet structure 2 tends to easily lead to uneven temperature distribution.

[0107] The resistance values ​​of electrode 4 and the imitation sheet structure 2 can be measured using a multimeter. First, the resistance value of electrode 4 is measured, and then the resistance value of the imitation sheet structure 2 after electrode 4 is attached is measured. Then, the resistance values ​​of electrode 4 and imitation sheet structure 2 are calculated by subtracting the measured value of electrode 4 from the resistance value of the imitation sheet structure 2 after electrode 4 is attached. Alternatively, electrode 4 can be removed from the wiring sheet 100 to measure its resistance value as needed.

[0108] (Contact fixing part)

[0109] The contact fixing part 5 is the portion that fixes the conductive wire 21 and the electrode 4 at their contact points. This contact fixing part 5 ensures a stable electrical connection between the electrode 4 and the sheet-like structure 2, thus stabilizing the resistance value of the wiring. Figure 1 As shown, preferably in the cross-sectional view of the wiring sheet 100, the contact fixing portions 5 are arranged independently of each other. With such a structure, when it is desired to extend or retract the wiring sheet 100 along the axial direction of the electrode 4, the contact fixing portions 5 will not hinder the extension or retraction of the wiring sheet 100. Therefore, the axial extensibility of the wiring sheet 100 along the electrode 4 can be ensured. Furthermore, the axial extensibility of the conductive wire 21 can be further improved.

[0110] When multiple metal wires are used for electrode 4 as described above, a contact fixing part 5 can be provided at the contact point between one of the metal wires constituting electrode 4 and the conductive wire 21. By providing this, the elasticity of the wiring sheet 100 can be further improved.

[0111] Independent configuration refers to a configuration where a contact fixing part is provided at the contact point between the metal wire constituting electrode 4 and the conductive linear body 21; or as... Figure 1 As shown, the configuration is done by taking multiple nearby nodes as a unit and configuring each unit accordingly.

[0112] The contact fixing part 5 is preferably selected from at least one of metal, adhesive and riveting.

[0113] Examples of metals include solder. When using solder, the conductive wire 21 can be joined to the electrode 4 by soldering. Known solder alloys can be used as solder alloys; for example, lead-free solder containing tin, silver, and copper can be used.

[0114] As the adhesive, the adhesive used in the resin layer 3 described above can be used. Alternatively, the adhesive can be a conductive adhesive. Furthermore, from the viewpoint of being able to firmly fix the conductive wire 21 and the electrode 4, the adhesive is preferably a curable adhesive. It should be noted that examples of curable adhesives include thermosetting adhesives that cure by heat, and energy-curing adhesives. Examples of energy rays include ultraviolet rays, visible energy rays, infrared rays, and electron beams. It should be noted that "energy-curing" also includes thermal curing using heating with energy rays.

[0115] As a riveting method, the contact fixing part 5 can be provided by riveting the contact point between the conductive wire 21 and the electrode 4.

[0116] The elastic modulus of the contact fixing part 5 at 25°C is preferably 5.0 × 10⁻⁶. 8 Pa or higher. Elastic modulus is 5.0 × 10⁻⁶. 6 When the resistance is above Pa, the resistance value of the wiring can be stabilized more reliably. Furthermore, considering the above points, the elastic modulus of the contact fixing part 5 at 25°C is more preferably 8.0 × 10⁻⁶. 9 Pa or higher, particularly preferably 1.0 × 10 Pa. 9 Pa or higher and 1.0 × 10 11 Below Pa.

[0117] (Manufacturing method of wiring sheet)

[0118] The manufacturing method of the wiring patch 100 in this embodiment is not particularly limited. The wiring patch 100 can be manufactured, for example, through the following process.

[0119] First, such as Figure 3A As shown, an adhesive for forming resin layer 3 is applied to substrate 1 to form a coating film. The coating film is then dried to form resin layer 3. Next, as... Figure 3BAs shown, conductive wires 21 are arranged and disposed on a resin layer 3 to form a sheet-like structure 2. For example, with the resin layer 3 containing the substrate 1 disposed on the outer circumferential surface of the roller member, the conductive wires 21 are wound in a spiral shape onto the resin layer 3 while the roller member is rotated. Then, the bundle of conductive wires 21 wound in a spiral shape is cut along the axial direction of the roller member. Thus, a sheet-like structure 2 is formed and disposed on the resin layer 3. Then, the resin layer 3 containing the substrate 1 with the sheet-like structure 2 is removed from the roller member to obtain a sheet-like conductive member. According to this method, for example, by rotating the roller member while moving the continuous feed portion of the conductive wires 21 in a direction parallel to the axis of the roller member, the spacing L of adjacent conductive wires 21 in the sheet-like structure 2 can be easily adjusted.

[0120] Next, as Figure 3C As shown, electrodes 4 are attached to both ends of the conductive wire 21 in the sheet-like structure 2 of the sheet-like conductive member. Then, as... Figure 3D As shown, multiple contact fixing portions 5 are provided at the junction of the conductive wire 21 and the electrode 4. The contact fixing portions 5 can be formed, for example, by forming a coating film of a curable adhesive at the junction of the conductive wire 21 and the electrode 4 and then curing the curable adhesive. This allows the fabrication of the wiring sheet 100.

[0121] (Effects of the first embodiment)

[0122] According to this embodiment, the following effects can be achieved.

[0123] (1) According to this embodiment, the conductive wire 21 can be fixed to the electrode 4 by means of multiple contact fixing parts 5, thus preventing the electrode 4 from detaching from the imitation sheet structure 2. Furthermore, the electrical connection between the electrode 4 and the imitation sheet structure 2 can be stably ensured, and the resistance value of the wiring can be stabilized.

[0124] (2) According to this embodiment, in the cross-sectional view of the wiring sheet 100, the contact fixing portion 5 is independently arranged. Therefore, when it is desired to extend or retract the wiring sheet 100 along the axial direction of the electrode 4, the contact fixing portion 5 will not hinder the extension or retraction of the wiring sheet 100. Furthermore, the axial extensibility of the wiring sheet 100 along the electrode 4 can be ensured. In addition, the axial extensibility of the conductive wire 21 can be further improved.

[0125] (3) According to this embodiment, in the top view of the wiring sheet 100, the conductive wire 21 and the electrode 4 are respectively formed in a wave shape. Therefore, when the wiring sheet 100 is extended along the axial direction of the conductive wire 21, the breakage of the conductive wire 21 can be suppressed. In addition, when the wiring sheet 100 is extended along the axial direction of the electrode 4, the breakage of the electrode 4 can be suppressed.

[0126] (4) According to this embodiment, the substrate 1 and the resin layer 3 are elastic, so the support of the wiring sheet 100 can be improved, thereby obtaining a wiring sheet 100 with elasticity.

[0127] [Second Implementation]

[0128] Next, a second embodiment of the present invention will be described based on the accompanying drawings. The present invention is not limited to the content of this embodiment. It should be noted that some parts in the drawings have been enlarged or reduced for ease of explanation.

[0129] The second embodiment differs from the first embodiment in that the contact fixing part 5A is formed from the solidified molten resin of the substrate 1.

[0130] In the following description, the parts that differ from the first embodiment will be described primarily, and repeated descriptions will be omitted or simplified. For configurations that are the same as those in the first embodiment, the same reference numerals will be used and descriptions will be omitted or simplified.

[0131] like Figure 4D As shown, the wiring sheet 100A of this embodiment includes a substrate 1, a sheet-like structure 2, a resin layer 3, and a pair of electrodes 4. The sheet-like structure 2 is electrically connected to the electrodes 4, and each connection point between the conductive wire 21 and the electrodes 4 is fixed by a contact fixing part 5A. Furthermore, the contact fixing part 5A is formed from a solidified product of the molten resin of the substrate 1.

[0132] (Manufacturing method of wiring sheet)

[0133] Regarding the manufacturing method of the wiring sheet 100A in this embodiment, except that the contact fixing part 5A is formed from the molten resin of the substrate 1, it can be manufactured by the same method as the wiring sheet 100 in the first embodiment described above.

[0134] First, such as Figure 4A As shown, an adhesive for forming resin layer 3 is applied to substrate 1 to form a coating film. The coating film is then dried to form resin layer 3. Next, as... Figure 4B As shown, conductive linear bodies 21 are arranged and disposed on the resin layer 3 to form a sheet-like structure 2. Next, as... Figure 4CAs shown, the electrode 4 is attached to both ends of the conductive wire 21 in the sheet-like structure 2 of the sheet-like conductive member.

[0135] It should be noted that, in this embodiment, from the viewpoint of being able to melt the resin constituting the substrate 1, the substrate 1 is preferably selected from at least one of synthetic resin films, nonwoven fabrics, and cloths. Furthermore, examples of materials that can be used as synthetic resins or fibers constituting the cloth include: polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyurethane, ethylene vinyl acetate copolymer, ionomer resin, ethylene-(meth)acrylate copolymer, ethylene-(meth)acrylate copolymer, polystyrene, and polycarbonate. Additionally, a modulus of elasticity of 5.0 × 10⁻⁶ at 25°C is preferably preferred as the material for the synthetic resin or fibers constituting the cloth. 8 Materials with a Pa or higher.

[0136] Next, as Figure 4D As shown, a plurality of contact fixing portions 5A are provided at the contact point between the conductive wire 21 and the electrode 4. The contact fixing portions 5A can be formed by melting and solidifying the resin constituting the substrate 1. More specifically, the contact fixing portions 5A can be formed by at least one method selected from hot pressing, high-frequency welding and bonding, hot air welding and bonding, hot plate welding and bonding, and ultrasonic welding and bonding. Among these methods, ultrasonic welding and bonding is preferred from the viewpoint of being able to melt in a short time.

[0137] Therefore, wiring sheet 100A can be manufactured.

[0138] (Effects of the second embodiment)

[0139] According to this embodiment, the same effects (1) to (4) as those in the first embodiment described above, as well as the following effects (5), can be achieved.

[0140] (5) In this embodiment, the contact fixing part 5A can be formed by melting and solidifying the resin constituting the substrate 1. Therefore, the contact fixing part 5A can be easily formed without using adhesives or solders.

[0141] [Variations on the implementation method]

[0142] This invention is not limited to the embodiments described above. Modifications and improvements made within the scope of achieving the purpose of this invention are included within the scope of this invention.

[0143] For example, in the above embodiment, the wiring sheet 100 includes a substrate 1, but is not limited to this. For example, the wiring sheet 100 may not include a substrate 1. In such cases, the wiring sheet 100 can be used by adhering it to the substrate using the resin layer 3.

[0144] In the above-described embodiment, the wiring sheet 100 includes a resin layer 3, but is not limited thereto. For example, the wiring sheet 100 may not include a resin layer 3. In such a case, a sheet-like structure 2 can be formed by using a braided material as the substrate 1 and weaving the conductive wires 21 into the substrate 1.

[0145] Furthermore, in the second embodiment, the contact fixing part 5A is formed by melting and solidifying the resin constituting the substrate 1, but it is not limited to this. For example, the substrate 1 and the resin layer 3 can be melted, and the mixture of the substrate 1 and the resin layer 3 can be solidified, with the resulting solidified product serving as the contact fixing part 5A. Alternatively, the solidified product obtained by melting and solidifying the resin layer 3 can also serve as the contact fixing part 5A.

[0146] Example

[0147] The present invention will be described in more detail below with reference to specific embodiments. However, the present invention is not limited to these embodiments.

[0148] [Preparation Example 1]

[0149] An adhesive was obtained by combining 0.74 parts by weight (solid content ratio) of an aluminum chelate crosslinking agent (manufactured by Soken Chemical Co., Ltd., product name "M-5A", solid content concentration = 4.95% by weight) as a crosslinking agent (100 parts by weight of an acrylic copolymer (an acrylic copolymer having structural units derived from raw material monomers composed of n-butyl acrylate (BA) / acrylic acid (AAc) = 90.0 / 10.0 (mass ratio) and toluene as a diluent) as a diluent.

[0150] [Preparation Example 2]

[0151] A curable adhesive was obtained by combining 100 parts by weight of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name "YX7200B35"), 170 parts by weight of polyfunctional epoxy compound (manufactured by Mitsubishi Chemical Corporation, trade name "YX8000"), 0.2 parts by weight of silane coupling agent (manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name "KBM-4803"), 2 parts by weight of thermal cationic polymerization initiator (manufactured by Sanshin Chemical Industry Co., Ltd., trade name "SAN-AID SI-B3"), and 2 parts by weight of thermal cationic polymerization initiator (manufactured by Sanshin Chemical Industry Co., Ltd., trade name "SAN-AID SI-B7").

[0152] [Example 1]

[0153] (Fabrication of sheet-like conductive components)

[0154] The adhesive obtained in Preparation Example 1 was coated onto a release film (manufactured by Lintec Corporation, trade name "SP-381130") and dried to form a resin layer with a thickness of 22 μm after drying. A binder with a unit area weight of 40 g / m² was then bonded onto the formed resin layer. 2 The adhesive sheet was obtained by using a polyester thermal bonding nonwoven fabric as a substrate.

[0155] As the conductive wire, a gold-plated tungsten wire (25 μm diameter, manufacturer: TOKUSAI Co., Ltd., product name: Au(0.1)-TWG, hereinafter also referred to as "wire") was prepared. Next, the release film of the adhesive sheet (manufactured by Lintec Co., Ltd., trade name "SP-PET381130") was peeled off, and the adhesive sheet was wound without wrinkles onto a roller member with the resin layer surface facing outwards. The two ends of the adhesive sheet in the circumferential direction were fixed with double-sided tape. While rotating the roller member, the conductive wire was wound into the resin layer in a spiral shape. At this time, the roller member was rotated while vibrating along the roller axis, so that the wound wire traced a wave shape. Ten wires were evenly spaced, with a spacing of 20 mm. Then, the bundle of conductive wire wound into a spiral shape was cut along the axis of the roller member. Thus, a sheet-like structure was formed and disposed in the resin layer. Then, the adhesive sheet with the sheet-like structure is removed from the roller component, resulting in a sheet-like conductive component. It should be noted that the sheet-like conductive component is cut into a 300mm × 300mm square.

[0156] (Electrode formation)

[0157] As electrodes, gold-plated copper wire (150 μm diameter, manufacturer: TOKUSAI Co., Ltd., product name: C1100-H AuP) was prepared. Next, a 300 mm × 300 mm sheet-shaped conductive member was wound onto a roller member with a rubber outer circumference, ensuring no wrinkles and that the conductive wire was parallel to the roller. Double-sided tape was used to secure both ends of the circumferentially bonded sheet. The gold-plated copper wire wound on the winding tube was adhered to the surface of the resin layer. Then, while continuously feeding the gold-plated copper wire, it was wound onto the roller member, and the roller member was moved little by little in a direction parallel to the roller axis, causing the gold-plated copper wire to spiral at equal intervals and be wound onto the roller member. At this time, the roller member was vibrated and rotated along the roller axis, causing the wound gold-plated copper wire to trace a wave shape. Thus, an electrode sheet structure with gold-plated copper wires spaced at 2.5 mm intervals was formed on the surface of the adhesive sheet. Next, the gold-plated copper wire is attached to the surface of the adhesive layer at a distance of 200 mm from the inner side. Then, while continuously feeding the gold-plated copper wire, it is wound onto the surface using a roller member, which moves gradually in a direction parallel to the roller axis, causing the gold-plated copper wire to form spirals at equal intervals and wind around the roller member. This creates a sheet-like conductive member with electrodes on the surface of the adhesive sheet. Each sheet-like conductive member has a pair of electrode sheet structures formed at 200 mm intervals, and gold-plated copper wire is arranged at equal intervals of 2.5 mm on each electrode sheet structure. Then, the sheet-like conductive member with electrodes is cut parallel to the roller axis. The sheet-like conductive member with electrodes is cut into a rectangle of 200 mm × 250 mm.

[0158] (Form of the contact fixing part)

[0159] Next, the curable adhesive obtained in Preparation Example 2 was coated onto the release film (manufactured by Lintec Corporation, trade name "SP-382150") and dried to form a cured adhesive layer with a thickness of 50 μm after drying. A release film (manufactured by Lintec Corporation, trade name "SP-PET381130") was then attached to the formed cured adhesive layer to obtain a laminate. It should be noted that two laminates were prepared. Then, the release film (manufactured by Lintec Corporation, trade name "SP-PET381130") was peeled off from these laminates, allowing the cured adhesive layers to adhere to each other, forming a cured adhesive layer with a thickness of 100 μm. Cut a 7mm x 10mm section from the cured adhesive layer. Peel off the release film (trade name: SP-382150 (manufactured by Lintec Corporation)) and apply it to each contact point between the conductive wire and the gold-plated copper wire of the sheet-like conductive component with electrodes. Peel off any remaining release film (manufactured by Lintec Corporation, trade name "SP-PET381130"). Adhere a 40g / m² adhesive sheet to the side with the cured adhesive layer. 2 The wiring sheet was made from a substrate formed by thermally bonded nonwoven polyester.

[0160] Then, a vacuum laminator (Nikko-Materials, product name: V130) was used to pressurize the adhesive layer at 110°C, 0.5MPa and for 50 minutes to form the joint fixing part.

[0161] [Example 2]

[0162] In forming the contact fixing part, solder paste (manufactured by Harima Chemicals Group, trade name "PS48BR-600-LSP") was applied instead of a curable adhesive layer, and heating was performed at 240°C. This bonded the conductive wire of the sheet-like conductive member with electrodes to each contact of the gold-plated copper wire. Otherwise, the wiring sheet was fabricated in the same manner as in Example 1. It should be noted that the solder alloy used for soldering has the composition Sn-3.2Ag-0.5Cu-4.0Bi-3.5Sb-Ni-Co, and the elastic modulus of this solder alloy is 53 GPa.

[0163] [Resistance Value Evaluation]

[0164] A DC power supply was used to apply a voltage of 3.0V to the wiring sheet, and the resistance value was calculated based on the current value. Then, the wiring sheet was stored under humid and hot conditions of 85°C and 85% humidity for 250 hours, and the resistance value was calculated in the same way. The change in resistance value before and after storage (unit: %) was calculated according to the following formula. The results are shown in Table 1.

[0165] Change in resistance value = [(Resistance value after storage - Resistance value before storage) / Resistance value before storage] × 100 (%)

[0166] [Determination of Elastic Modulus]

[0167] For the contact fixing part manufactured in the embodiment, the elastic modulus (GPa) at 25°C was measured using a micro surface hardness tester (Shimadzu Corporation, W201S ultramicro dynamic hardness tester). The results are shown in Table 1.

[0168] [Scalability Evaluation]

[0169] For the wiring sheet in this embodiment, the electrode portion was used as the bare end. A tensile test was performed on a tensile testing machine (manufactured by Shimadzu Corporation, product name "Autograph AG-IS500N") with a chuck spacing of 200 mm and a speed of 10 mm / min. The axial elongation of the conductive wire and the axial elongation of the electrode were measured. At this time, the resistance value between a pair of electrodes was measured using a digital multimeter. A change in resistance value of 10% was considered a breakage of the wiring sheet. Until the wiring sheet broke, an elongation of 15% or more was marked as "○", and an elongation of less than 15% and breakage was marked as "×". The results are shown in Table 1.

[0170] [Table 1]

[0171]

[0172] [Example 3]

[0173] When forming the contact fixing part, no curable adhesive layer was provided. Instead, an ultrasonic welding device was used to melt and solidify the substrate, thereby joining the conductive wire of the sheet-like conductive member with electrodes to each contact of the gold-plated copper wire. Otherwise, the wiring sheet was fabricated in the same manner as in Example 1. It should be noted that the conditions in the ultrasonic welding fusion bonding method are as follows.

[0174] Welded section: 8×8mm

[0175] Oscillation frequency: 39kHz

[0176] Pressure: 0.5 MPa

[0177] Application time: 0.5 seconds

[0178] In addition, the resistance value and elastic modulus of the obtained wiring sheet were evaluated as described above. The results showed a resistance value of 0.2% and an elastic modulus of 0.67 Pa.

Claims

1. A wiring sheet comprising: a sheet-like structure formed of a plurality of electrically conductive linear bodies arranged at a regular interval, and a pair of electrodes, the electrodes being two or more metal wires, the sheet-like structure and the electrodes being electrically connected, in a plan view of the wiring sheet, the electrically conductive linear bodies and the electrodes being formed in a wave shape, the electrically conductive linear bodies and the electrodes being fixed by a contact point fixing portion, the contact point fixing portion being at least one selected from a metal, an adhesive, and a rivet.

2. The wiring sheet according to claim 1, wherein in a cross-sectional view of the wiring sheet, the contact point fixing portions are independently arranged.

3. The wiring sheet according to claim 1 or 2, wherein the contact point fixing portion is a rivet.

4. The wiring sheet according to claim 1 or 2, further comprising a resin layer supporting the sheet-like structure, the resin layer having an elasticity.

5. The wiring sheet according to claim 1 or 2, further comprising a substrate supporting the sheet-like structure, the substrate being an elastic substrate.

6. The wiring sheet according to claim 5, wherein the contact point fixing portion is formed of at least a solidified product of a molten resin of the substrate.

7. A method of manufacturing a wiring sheet according to claim 6, the method comprising: forming the contact point fixing portion by at least one method selected from a hot press method, a high-frequency welding and fusion bonding method, a hot air fusion bonding method, a hot plate fusion bonding method, and an ultrasonic welding and fusion bonding method. ​ ​ ​ ​ The elastic modulus of the contact point fixing portion at 25°C is 5.0 x 10 8 Pa or more. ​ ​ ​ ​ ​ ​ ​ ​

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