Semiconductor silicon wafer automatic glue coating device and method

Abstract

The present invention discloses an automatic gluing device and method for semiconductor silicon wafers, comprising a horizontal transmission component and a glue spraying component arranged on the side of the horizontal transmission component, a loading component being provided at the tail end of the horizontal transmission component, the loading component being composed of two U-shaped vertical rails 1 and two U-shaped vertical rails 2 forming a rectangular frame, and the interiors of the U-shaped vertical rails 1 and 2 are both slidably connected with racks, and adjacent racks are connected by connecting bars, and the connecting bars are evenly distributed along the length direction of the racks, and a support plate is fixed on the inner side of each connecting bar to form a semiconductor silicon wafer storage area stacked in the vertical direction; the horizontal transmission component and the loading component are connected by a linkage structure. The linkage structure in the present invention simultaneously realizes the horizontal movement of the horizontal conveyor belt to transmit silicon wafers and the continuous unloading of the support plate onto the horizontal conveyor belt, making the continuity and synchronization of the entire production and processing process higher, and effectively improving production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor silicon wafer processing, in particular to an automatic gluing device and method for semiconductor silicon wafers. Background Art

[0002] As production and technology advance in the semiconductor industry, the demand for automated production equipment is increasing. Automated adhesive coating of silicon wafers is an essential process in the semiconductor industry. Previously, adhesive coating of silicon wafers was mostly done manually, resulting in low efficiency and difficulty in ensuring the thickness and uniformity of the final adhesive film. In recent years, continuous research by technical personnel has led to the widespread use of automatic adhesive coating machines in the semiconductor industry.

[0003] At present, the gluing process of silicon wafers in the semiconductor industry is generally done manually by placing the silicon wafers on the gluing station for gluing operations. After the gluing is completed, the silicon wafers need to be manually taken out of the station and reloaded. The high degree of manual participation and poor continuity of processing and production lead to low production efficiency.

[0004] To this end, we propose a semiconductor silicon wafer automatic glue coating device and method to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide an automatic gluing device and method for semiconductor silicon wafers, so as to solve the problem raised in the above background technology that the current gluing process of silicon wafers is generally carried out manually by placing the silicon wafers on the gluing station for gluing operation. After the gluing is completed, the silicon wafers need to be manually taken out of the station and reloaded, which has a high degree of manual participation, poor continuity of processing and production, and leads to low production efficiency.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A semiconductor silicon wafer automatic gluing device comprises a horizontal transmission assembly for horizontally transmitting semiconductor silicon wafers and a glue spraying assembly arranged on the side of the horizontal transmission assembly, wherein a loading assembly is provided at the tail end of the horizontal transmission assembly, wherein the loading assembly is composed of two U-shaped vertical rails (1) and two U-shaped vertical rails (2) forming a rectangular frame, wherein the interiors of the U-shaped vertical rails (1) and (2) are both slidably connected to racks, and adjacent racks are connected by connecting bars, wherein a plurality of connecting bars are equidistantly distributed along the length direction of the racks, and a support plate is fixed on the inner side of each connecting bar to form a semiconductor silicon wafer storage area stacked in a vertical direction, wherein a notch is provided on the front bottom side of the U-shaped vertical rail (1), and a driving gear is passed through the interior of the notch;

[0008] The horizontal transmission assembly includes a pair of side frames, end shafts rotatably mounted at the front and rear ends of the pair of side frames, a bottom frame fixed to the four corners of the bottom of the pair of side frames, a stepper motor fixed to the outer wall of the side frame, and a horizontal transmission belt sleeved between the two end shafts. The horizontal transmission assembly is connected to the loading assembly through a linkage structure.

[0009] The linkage structure includes a driving wheel coaxially connected to the rear end shaft, a rotating rod rotatably installed between the side frames, a driven wheel coaxially connected to the rotating rod, a conveyor belt sleeved between the driving wheel and the driven wheel, and a driven gear fixed to one end of the rotating rod extending out of the side frame surface, and the driven gear is meshed and connected with the driving gear.

[0010] In a further embodiment, a plurality of suction cups are provided on the surface of the horizontal conveyor belt, and the plurality of suction cups are distributed at equal intervals along the length extension direction of the horizontal conveyor belt.

[0011] In a further embodiment, the suction cup is composed of a hollow suction head fixed on the surface of the horizontal conveyor belt, an air cylinder connected below the hollow suction head, a piston block slidably installed inside the air cylinder, a middle rod fixed at the lower end of the piston block, and a spring sleeved on the outside of one end of the middle rod extending out of the air cylinder.

[0012] In a further embodiment, an end block is fixed to one end of the middle rod away from the piston block, and a ball is rotatably mounted inside the end block.

[0013] In a further embodiment, a roller is coaxially fixed to the outer wall of the middle section of the end shaft, and the distance between the outer wall of the roller and the inner wall of the horizontal conveyor belt is smaller than the distance between the inner wall of the horizontal conveyor belt and the ball.

[0014] In a further embodiment, the length of the base frame is greater than the length of the rack, and the distance between the left and right racks is greater than the distance between the pair of side frames.

[0015] In a further embodiment, three connecting bars are provided on each layer between the four racks, and the three connecting bars surround the left and right sides and the rear side of the four racks so that the four racks are open toward the horizontal transmission component.

[0016] In a further embodiment, the glue spraying assembly consists of a glue box fixed to the outer wall of the side frame, a spray head installed at the bottom of the glue box, and a feed pipe connected to the side wall of the glue box.

[0017] A method for automatically coating semiconductor silicon wafers with glue comprises the following steps:

[0018] S1. First, guide the rack loaded with silicon wafers in the loading assembly into the U-shaped vertical rails 1 and 2;

[0019] S2, then start the stepper motor in the horizontal transmission component, the stepper motor drives the end shaft to rotate and drives the horizontal transmission belt at the same time, and sets the stepper motor to pause for a period of time after rotating to a certain angle for glue coating and then rotate again, repeating the intermittent transmission;

[0020] S3. When the end shaft rotates, the driving gear of the loading assembly rotates through the linkage structure, driving the rack and the silicon wafer to descend, so that the silicon wafer is close to the suction cup of the horizontal conveyor belt; at the same time, when the suction cup is rotated by the end shaft and the roller rotates, the roller squeezes the suction cup and compresses it, so that the air inside the suction cup is discharged;

[0021] S4, the suction cup resets, the internal pressure decreases, the silicon wafer is sucked, and the silicon wafer is transported to the bottom of the glue spraying assembly along the horizontal conveyor belt and stops to receive glue spraying;

[0022] S5. After the silicon wafer is sprayed with glue, it is transported to the front end of the horizontal transmission component along the horizontal conveyor belt, close to the end shaft. The roller squeezes the suction cup again to compress it, so that the air inside the suction cup is discharged and the silicon wafer is pushed out at the same time, making it easier to remove the silicon wafer.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. The present invention arranges a rack in the loading assembly so that it can be telescopically slid up and down relative to the U-shaped vertical rail 1 and the U-shaped vertical rail 2. Since the tail end portion of the horizontal transmission assembly is inserted into the loading assembly and interlaced with it, when the loading assembly and the horizontal transmission assembly work simultaneously, the silicon wafers stacked on the pallet in the loading assembly can fall onto the horizontal transmission assembly in turn, and then be horizontally transmitted to the gluing station, thereby using a mechanical mechanism to replace manual loading and placement of silicon wafers, greatly saving manual operation.

[0025] 2. The present invention provides a suction cup in the horizontal transmission component, and the suction cup cooperates with the roller to compress and discharge the internal air when passing the rear end shaft position. After contacting the silicon wafer, it passes the rear end shaft position. At this time, the suction cup extends to form a negative pressure state to better absorb the silicon wafer and improve the stability during transmission. At the same time, the air inside the suction cup can be compressed when passing the front end shaft, which facilitates the silicon wafer to detach from the horizontal transmission belt, making the loading and unloading of silicon wafers safer and more convenient.

[0026] 3. The linkage structure in the present invention links the horizontal transmission component and the loading component, so that under the drive of a stepper motor, the horizontal movement of the horizontal transmission belt can be realized simultaneously to transmit silicon wafers and the pallet can be continuously unloaded onto the horizontal transmission belt, making the continuity and synchronization of the entire production and processing flow higher, and effectively improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of the present invention;

[0028] Figure 2 This is a schematic structural diagram of the initial state of the feeding assembly of the present invention;

[0029] Figure 3 This is a schematic structural diagram of the loading assembly of the present invention in the unloading state;

[0030] Figure 4 This is a schematic diagram of the partial cross-sectional structure of the rear end of the horizontal transmission component of the present invention;

[0031] Figure 5 This is a schematic diagram of a partial cross-sectional structure of the horizontal transmission assembly of the present invention as viewed from the left side at the rear end;

[0032] Figure 6 For the present invention Figure 5 Schematic diagram of the locally enlarged structure at point A in the middle.

[0033] In the figure: 1. Horizontal transmission assembly; 11. Side frame; 12. End shaft; 13. Base frame; 14. Stepper motor; 15. Horizontal transmission belt; 16. Suction cup; 161. Hollow suction head; 162. Air cylinder; 163. Piston block; 164. Middle rod; 165. Spring; 166. End block; 167. Ball; 2. Glue spraying assembly; 21. Glue tank; 22. Spray head; 23. Feed pipe; 3. Loading assembly; 31. U-shaped vertical rail 1; 311. Notch; 32. U-shaped vertical rail 2; 33. Rack; 34. Connecting strip; 35. Support plate; 36. Driving gear; 4. Driving wheel; 5. Turning rod; 6. Driven wheel; 7. Conveyor belt; 8. Driven gear; 9. Roller. DETAILED DESCRIPTION

[0034] In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0037] See also Figure 1-3 , an automatic gluing device for semiconductor silicon wafers, comprising a horizontal transmission component 1 for horizontally transmitting semiconductor silicon wafers to a gluing station, a glue spraying component 2 for gluing the surface of the silicon wafers, and a loading component 3 for arranging the silicon wafers on the horizontal transmission component 1 at equal intervals. The loading component 3 is arranged at the tail end of the horizontal transmission component 1, and the tail end of the horizontal transmission component 1 is partially inserted into the loading component 3. The loading component 3 is composed of two U-shaped vertical rails 31 and two U-shaped vertical rails 32 to form a rectangular frame. The U-shaped vertical rails are connected and fixed by flat strips, and racks 33 are slidably connected to the inside of the U-shaped vertical rails 1 31 and the U-shaped vertical rails 2 32. Adjacent racks 33 are connected by connecting strips 34, and the connecting strips 34 are arranged along the length of the racks 33. There are several connecting bars 34 distributed equidistantly in the vertical direction, and a support plate 35 is fixed on the inner side of each connecting bar 34 to form a semiconductor silicon wafer storage area stacked in the vertical direction, which is convenient for placing silicon wafers. The fixed position of the support plate 35 is lower than the connecting bar 34, so as to form a step-like shape, so that the connecting bar 34 can form a limiting area for the silicon wafer around it. In order to facilitate the control of the lifting and lowering of the rack 33 relative to the U-shaped vertical rail, a notch 311 is provided on the front side of the bottom of the U-shaped vertical rail 31, and a driving gear 36 is passed through the inside of the notch 311. The driving gear 36 is engaged with the rack 33, and then when the driving gear 36 is rotated, the rack 33 can be driven to rise or fall. At the same time, when the driving gear 36 does not rotate, it can clamp the rack 33 and lock its height.

[0038] See also Figure 2-3In order to facilitate the loading and unloading of silicon wafers on the loading assembly 3, three connecting bars 34 are set on each layer between the four racks 33, and the three connecting bars 34 surround the left and right sides and the rear side of the four racks 33, so that the four racks 33 are open toward the horizontal transmission assembly 1, thereby facilitating the placement or removal of silicon wafers from the front side. Similarly, the front sides of the two U-shaped vertical rails 31 and the two U-shaped vertical rails 32 are also open, and the other three sides are connected and fixed by flat strips.

[0039] See also Figure 1 In order to facilitate the continuous transmission of the silicon wafers unloaded from the loading component 3 to the gluing station, a horizontal transmission component 1 is set up, which includes a pair of side frames 11, end shafts 12 rotatably installed at the front and rear ends of the pair of side frames 11, a base frame 13 fixed at the four corners of the bottom of the pair of side frames 11, a stepper motor 14 fixed on the outer wall of the side frame 11 and a horizontal transmission belt 15 sleeved between the two end shafts 12. The output shaft of the stepper motor 14 is connected to the front end shaft 12, so that when the end shaft 12 is driven to rotate, the horizontal transmission belt 15 and the rear end shaft 12 are driven to rotate, thereby transporting the silicon wafers.

[0040] See also Figure 1 In order to ensure that the rack 33 in the loading assembly 3 can be completely removed from the bottom of the U-shaped vertical rail, and then the rack 33 can be recovered under the U-shaped vertical rail, the length of the base frame 13 is set to be greater than the length of the rack 33, and the distance between the left and right racks 33 is greater than the distance between a pair of side frames 11, so that the rack 33 can be easily removed from the bottom of the loading assembly 3 as a whole.

[0041] See also Figure 5 In order to improve the stability of silicon wafers in transmission on the surface of the horizontal conveyor belt 15, reduce their position deviation, and thus more accurately position the spray glue, a plurality of suction cups 16 are provided on the surface of the horizontal conveyor belt 15. The suction cups 16 are evenly spaced along the length extension direction of the horizontal conveyor belt 15. When a silicon wafer falls from the loading assembly 3, it contacts the suction cup 16, and the suction cup 16 sucks the silicon wafer, which not only drives the silicon wafer to fall off the support plate 35, but also enhances the stability of the silicon wafer during transmission.

[0042] See also Figure 6In order to further enhance the firmness of the suction cup 16 in adsorbing the silicon wafer, the suction cup 16 is provided with a hollow suction head 161 fixed on the surface of the horizontal conveyor belt 15, an air cylinder 162 connected below the hollow suction head 161, a piston block 163 slidably mounted inside the air cylinder 162, a middle rod 164 fixed to the lower end of the piston block 163, and a spring 165 sleeved on the outer side of the end of the middle rod 164 extending out of the air cylinder 162. An end block 166 is fixed to the end of the middle rod 164 away from the piston block 163, and both ends of the spring 165 are fixed to the end block 166 and the air cylinder 162 respectively. The air cylinder 162, the middle rod 164 and the end block 166 are all arranged inside the horizontal transmission component 1, and the hollow suction head 161 is connected to the inside of the air cylinder 162. When the middle rod 164 pushes the piston block 163 to move toward the hollow suction head 161 inside the air cylinder 162, the air inside the air cylinder 162 will be compressed and discharged, and at the same time, the spring 165 will be extended. When the thrust is lost, the middle rod 164 rebounds under the elastic force of the spring 165, and then drives the piston block 163 to move back, so that suction is formed at the end of the hollow suction head 161 to suck the silicon wafer.

[0043] See also Figure 6 In order to facilitate the automatic absorption of silicon wafers by the suction cup 16 at the rear end of the horizontal transmission component 1 and the automatic detachment of silicon wafers at the front end of the horizontal transmission component 1, a ball 167 is installed for rotation inside the end block 166, and a roller 9 is coaxially fixed to the outer wall of the middle section of the end shaft 12. Since the distance between the outer wall of the roller 9 and the inner wall of the horizontal transmission belt 15 is smaller than the distance between the inner wall of the horizontal transmission belt 15 and the ball 167, when the end block 166 rotates to the position of the end shaft 12, the contact between the ball 167 and the roller 9 can squeeze the end block 166 and apply thrust to the end block 166.

[0044] See also Figure 4 The gear 36 is connected to the upper and lower frames 11 by the transmission gear 36, and the transmission gear 36 is connected to the lower frame 11 by the transmission gear 36.

[0045] See also Figure 1 In order to facilitate and quickly apply glue to the surface of the silicon wafer, a glue spraying assembly 2 is set up, which consists of a glue box 21 fixed to the outer wall of the side frame 11, a nozzle 22 installed at the bottom of the glue box 21, and a feeding pipe 23 connected to the side wall of the glue box 21. The feeding pipe 23 is used to replenish glue into the glue box 21. The glue inside the glue box 21 is sprayed out through the nozzle 22 and can be sprinkled on the surface of the silicon wafer.

[0046] See also Figure 1-6 , a method for automatically coating semiconductor silicon wafers, comprising the following steps:

[0047] S1. First, guide the rack 33 loaded with stacked silicon wafers in the loading assembly 3 into the U-shaped vertical rail 1 31 and the U-shaped vertical rail 2 32;

[0048] S2, then start the stepper motor 14 in the horizontal transmission component 1, the stepper motor 14 drives the end shaft 12 to rotate and drives the horizontal transmission belt 15 to transmit. The stepper motor 14 is set to pause for a period of time after rotating to a certain angle for glue coating and then rotate again, repeating the intermittent transmission;

[0049] S3. When the end shaft 12 rotates, the driving gear 36 of the loading assembly 3 rotates through the linkage structure, driving the rack 33 and the silicon wafer to descend, so that the silicon wafer is close to the suction cup 16 of the horizontal conveyor belt 15; at the same time, when the end shaft 12 rotates and the roller 9 rotates, the roller 9 squeezes the suction cup 16 and compresses it, so that the air inside the suction cup 16 is discharged;

[0050] S4, the suction cup 16 is reset, the internal pressure becomes smaller, the silicon wafer is sucked, and the silicon wafer is transported to the bottom of the glue spraying assembly 2 along the horizontal conveyor belt 15 and stops to receive glue spraying;

[0051] S5. The silicon wafer sprayed with glue is transported to the front end of the horizontal transmission component 1 along the horizontal conveyor belt 15 and comes out near the end shaft 12. The roller 9 squeezes the suction cup 16 again to compress it, so that the air inside the suction cup 16 is discharged and the silicon wafer is ejected at the same time, which facilitates the removal of the silicon wafer.

[0052] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0053] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An automatic gluing device for semiconductor silicon wafers, comprising a horizontal transmission component (1) for horizontally transmitting semiconductor silicon wafers and a glue spraying component (2) arranged on the side of the horizontal transmission component (1), characterized in that: A loading assembly (3) is provided at the tail end of the horizontal transmission assembly (1), and the loading assembly (3) is composed of two U-shaped vertical rails (31) and two U-shaped vertical rails (32) to form a rectangular frame, and the interiors of the U-shaped vertical rails (31) and the U-shaped vertical rails (32) are both slidably connected with racks (33), and adjacent racks (33) are connected by connecting bars (34), and a plurality of connecting bars (34) are evenly distributed along the length direction of the racks (33), and a support plate (35) is fixed on the inner side of each connecting bar (34) to form a semiconductor silicon wafer storage area stacked in a vertical direction, and a notch (311) is provided on the front side of the bottom of the U-shaped vertical rail (31), and a driving gear (36) is passed through the interior of the notch (311); The horizontal transmission assembly (1) comprises a pair of side frames (11), end shafts (12) rotatably mounted at the front and rear ends of the pair of side frames (11), a bottom frame (13) fixed at the four corners of the bottom of the pair of side frames (11), a stepping motor (14) fixed to the outer wall of the side frames (11), and a horizontal transmission belt (15) sleeved between the two end shafts (12). The horizontal transmission assembly (1) is connected to the loading assembly (3) via a linkage structure. The linkage structure comprises a driving wheel (4) coaxially connected to the rear end shaft (12), a rotating rod (5) rotatably mounted between the side frames (11), a driven wheel (6) coaxially connected to the rotating rod (5), a conveyor belt (7) sleeved between the driving wheel (4) and the driven wheel (6), and a driven gear (8) fixed to one end of the rotating rod (5) extending from the surface of the side frame (11), wherein the driven gear (8) is meshed and connected with a driving gear (36).

2. The automatic gluing device for semiconductor silicon wafers according to claim 1, characterized in that: A plurality of suction cups (16) are provided on the surface of the horizontal conveyor belt (15), and the plurality of suction cups (16) are distributed at equal intervals along the length extension direction of the horizontal conveyor belt (15).

3. The automatic gluing device for semiconductor silicon wafers according to claim 2, characterized in that: The suction cup (16) is composed of a hollow suction head (161) fixed on the surface of the horizontal conveyor belt (15), an air cylinder (162) connected below the hollow suction head (161), a piston block (163) slidably mounted inside the air cylinder (162), a middle rod (164) fixed at the lower end of the piston block (163), and a spring (165) sleeved on the outside of one end of the middle rod (164) extending out of the air cylinder (162).

4. The automatic gluing device for semiconductor silicon wafers according to claim 3, characterized in that: An end block (166) is fixed to one end of the middle rod (164) away from the piston block (163), and a ball (167) is rotatably mounted inside the end block (166).

5. The automatic gluing device for semiconductor silicon wafers according to claim 4, characterized in that: A roller (9) is coaxially fixed to the outer wall of the middle section of the end shaft (12), and the distance between the outer wall of the roller (9) and the inner wall of the horizontal conveyor belt (15) is smaller than the distance between the inner wall of the horizontal conveyor belt (15) and the ball (167).

6. The automatic gluing device for semiconductor silicon wafers according to claim 1, characterized in that: The length of the base frame (13) is greater than the length of the rack (33), and the distance between the left and right racks (33) is greater than the distance between the pair of side frames (11).

7. The automatic gluing device for semiconductor silicon wafers according to claim 1, characterized in that: Three connecting bars (34) are provided on each layer between the four racks (33), and the three connecting bars (34) enclose the left and right sides and the rear side of the four racks (33), so that the four racks (33) are open toward the horizontal transmission component (1).

8. The automatic gluing device for semiconductor silicon wafers according to claim 1, characterized in that: The glue spraying assembly (2) is composed of a glue box (21) fixed to the outer wall of the side frame (11), a spray head (22) installed at the bottom of the glue box (21), and a feed pipe (23) connected to the side wall of the glue box (21).

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