A wafer cleaning device with multi-channel flow field control

Abstract

The present invention provides a wafer cleaning device with multi-channel flow field control, comprising a wafer carrying platform, a plurality of support assemblies for supporting the wafers arranged at the edge of the wafer carrying platform; a guide plate, a guide groove being provided on the guide plate; a downwardly pressed guide cover covering the guide plate, the gap between the downwardly pressed guide cover and the guide groove forming an airflow path, through which externally input airflow is sprayed toward the edge of the wafer; airflow ducts corresponding to the support assemblies are opened on the guide plate; the air outlets of the airflow ducts are close to the corresponding support assemblies, and the externally input airflow is blown toward the support assemblies through the air outlets of the airflow ducts. Through the multi-channel design, the airflow in the clamping area is enhanced, dirt is blown away, and dirt residue is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and in particular to a wafer cleaning device with multi-channel flow field control. Background Art

[0002] During the wafer cleaning process, the wafer needs to be clamped. Contact clamping of the wafer causes the wafer to contact various components, or unexpected phenomena occur during the contact process, resulting in partial phase difference, levelness imbalance, deflection, misalignment and other problems on the wafer. The speed of the wafer during rotation corresponds to low, medium and high speed configurations. Once the corresponding problem occurs, the wafer will rotate eccentrically and be thrown off. The wet process is a link in the surface treatment process of semiconductor wafers. The wet process includes a special processing link, namely cleaning and etching the side of the wafer, which can correct and adjust the surface morphology and characterization of the side of the wafer. Side cleaning is prone to cause dirty cleaning agent residue in the clamping area. Summary of the Invention

[0003] Based on the above problems, the present invention provides a wafer cleaning device with multi-channel flow field control, which aims to solve technical problems such as dirt residue in the cleaning process in the prior art.

[0004] A wafer cleaning device with multi-channel flow field control, comprising:

[0005] A wafer carrying platform, with several supporting components for supporting the wafers arranged on the edge of the wafer carrying platform;

[0006] A guide plate, wherein a guide groove is provided on the guide plate;

[0007] Press down the guide cover to cover the guide plate. Press down the gap between the guide cover and the guide groove to form an airflow channel. The external airflow is sprayed toward the edge of the wafer through the airflow channel.

[0008] The guide plate is provided with air flow ducts corresponding to the support components one by one;

[0009] The air outlet of the air flow duct is close to the corresponding support assembly, and the air flow input from the outside is blown toward the support assembly through the air outlet of the air flow duct.

[0010] Furthermore, the guide plate is provided with a guide hole;

[0011] The wafer carrying platform is provided with a fixing groove;

[0012] The jet pipe assembly is accommodated in the guide hole and the fixing groove;

[0013] The jet pipe assembly is used to guide the external input air flow into the air flow channel.

[0014] Furthermore, a protrusion surrounding the guide hole is provided at the bottom of the guide groove;

[0015] The lower end surface of the downward pressure guide cover is provided with a first groove corresponding to the upper and lower parts of the protrusion, and a gap exists between the first groove and the protrusion.

[0016] Furthermore, a plurality of connecting grooves are provided at the bottom of the guide groove, and the connecting grooves are used to connect the first supporting top bolts;

[0017] The relative height between the lower end surface of the downward pressure guide cover and the bottom of the guide groove is controlled by adjusting the relative height between the top of the first supporting pin and the bottom of the guide groove.

[0018] Furthermore, the support assembly includes a support body disposed on the wafer carrying platform and a support head located on the upper end surface of the support body;

[0019] The upper end surface of the support body is flush with the upper end surface of the guide plate;

[0020] The air outlet of the air flow duct is directed toward the support head.

[0021] Furthermore, the guide plate is provided with perforations corresponding to the support components one by one. The support components pass through the perforations and form a second annular gap with the guide plate. The lower end of the second annular gap is connected to the airflow duct.

[0022] Furthermore, the supporting assembly is a clamping assembly for limiting the position of the wafer;

[0023] When the support assembly serves as a clamping assembly, the support head includes an inclined surface. When viewed from above, the cross section of the inclined surface of the support head is non-circular.

[0024] Furthermore, the supporting assembly is an aerodynamic assembly having an internal channel. The airflow input from the outside passes through the internal channel and is ejected from the upper end of the aerodynamic assembly in a predetermined direction, so that the wafer is in a suspended state.

[0025] Furthermore, the air outlet of the internal channel supports the head.

[0026] Furthermore, an internal air chamber is formed inside the wafer carrying platform; the internal channel of each aerodynamic component is connected to the internal air chamber, and the airflow input from the outside enters the internal channel through the internal air chamber.

[0027] The beneficial technical effect of the present invention is that, through the multi-channel design, the airflow in the clamping area is enhanced, dirt is blown away, and dirt residue is avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the exploded structure of a wafer cleaning device with multi-channel flow field control according to the present invention;

[0029] Figure 2-3A schematic diagram of different heights of a downward pressure guide cover of a wafer cleaning device with multi-channel flow field control according to the present invention;

[0030] Figure 4-6 This is a schematic diagram of a wafer cleaning device with multi-channel flow field control according to the present invention, in which the support head faces the wafer at different inclinations;

[0031] Figure 7 A schematic diagram of the distribution of an aerodynamic component-type support assembly of a wafer cleaning device with multi-channel flow field control according to the present invention;

[0032] Figure 8 A schematic diagram of a wafer cleaning device for cleaning the lower surface of a wafer according to the present invention;

[0033] Figure 9 This is a schematic structural diagram of a wafer carrying platform of a wafer cleaning device with multi-channel flow field control according to the present invention;

[0034] Figure 10 This is a schematic structural diagram of a support head of a clamping assembly of a wafer cleaning device with multi-channel flow field control according to the present invention;

[0035] in,

[0036] 1-Wafer carrying platform;

[0037] 101-support assembly;

[0038] 101a-Aerodynamic components;

[0039] 1011-support body;

[0040] 1012-support the head;

[0041] 102-fixing slot;

[0042] 103-internal air chamber;

[0043] 2- deflector;

[0044] 201- diversion trough;

[0045] 2011-convex;

[0046] 2012-connection slot;

[0047] 2013-First support bolt;

[0048] 202-airflow walkway;

[0049] 2021-air diffusion channel;

[0050] 2022-first annular gap;

[0051] 203-airflow duct;

[0052] 204- diversion hole;

[0053] 205-perforation;

[0054] 3-Press down the guide cover;

[0055] 301-first groove;

[0056] 302-second groove.

[0057] 4-jet pipe assembly;

[0058] 401-second supporting top bolt;

[0059] 5- Clean the pipes. DETAILED DESCRIPTION

[0060] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0061] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0062] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0063] See also Figure 1 、 4 The present invention provides a wafer cleaning device with multi-channel flow field control, comprising:

[0064] A wafer carrying platform (1), with a plurality of supporting components (101) for supporting wafers arranged on the edge of the wafer carrying platform (1);

[0065] A guide plate (2), wherein a guide groove (201) is provided on the guide plate (2);

[0066] The guide cover (3) is pressed downward to cover the guide plate (2), and the gap between the guide cover (3) and the guide groove (201) is formed into an airflow passage (202), and the airflow input from the outside is sprayed toward the edge of the wafer through the airflow passage (202);

[0067] The guide plate (2) is provided with air flow ducts (203) corresponding one to one with the support components (101);

[0068] The air outlet of the air flow duct (203) is close to the corresponding support assembly (101), and the air flow input from the outside is blown toward the support assembly (101) through the air outlet of the air flow duct (203).

[0069] The present invention forms an airflow passage (202) by adding a guide plate (2) and a downward-pressing guide cover (3). An externally input airflow is sprayed toward the lower surface of the wafer through the airflow passage (202). During cleaning, cleaning agent and dirt are blown away, preventing the cleaning agent and dirt from flowing to the lower surface of the wafer and contaminating the lower surface of the wafer. The invention can be used for etching and cleaning the edge of the wafer. An airflow duct (203) is added to the guide plate (2), and part of the airflow of the airflow passage (202) is introduced into the airflow duct (203) and blown toward the support assembly (101). An enhanced airflow is formed around the support assembly (101), further preventing the cleaning agent and dirt from remaining in the area near the support assembly (101) and the portion where the wafer and the support assembly (101) are close to each other, thereby ensuring the cleanliness of the wafer.

[0070] Furthermore, the air inlet of the airflow duct (203) is connected to the airflow passage (202).

[0071] The air inlet of each airflow duct (203) is directly connected to the airflow passage (202), and part of the airflow input from the outside enters the airflow duct (203), eliminating the need for additional gas input ducts, simplifying the device and reducing costs.

[0072] Furthermore, the lower end surface of the downward pressure guide cover (3) and the bottom of the guide groove (201) form an airflow diffusion channel (2021), and the outer side surface of the downward pressure guide cover (3) and the side wall of the guide groove (201) form a first annular gap (2022).

[0073] Furthermore, the first annular gap (2022) is inclined along the edge portion of the wafer.

[0074] Furthermore, the gap size of the first annular gap (2022) gradually decreases along the edge direction of the wafer.

[0075] Furthermore, the airflow duct (203) is connected to the airflow diffusion channel (2021).

[0076] Furthermore, the airflow duct (203) includes a first section and a second section in sequence, the first section is connected to the second section, the first section is connected to the airflow walkway (202), and the second section is inclined toward the corresponding support assembly (101).

[0077] Furthermore, the guide plate (2) is provided with a guide hole (204);

[0078] The wafer carrying platform (1) is provided with a fixing groove (102);

[0079] The jet pipe assembly (4) is accommodated in the guide hole (204) and the fixing groove (102); the jet pipe assembly (4) is used to guide the airflow input from the outside into the airflow passage (202).

[0080] Furthermore, a protrusion (2011) is provided at the bottom of the guide groove (201) and is arranged around the guide hole (204);

[0081] The lower end surface of the downward pressure guide cover (3) is provided with a first groove (301) corresponding to the protrusion (2011) above and below, and a gap exists between the first groove (301) and the protrusion (2011).

[0082] Furthermore, the protrusion (2011) is an annular protrusion, and the first groove (301) is an annular groove.

[0083] Furthermore, both the inner and outer sides of the protrusion (2011) are inclined surfaces.

[0084] Furthermore, the inner sidewall and the outer sidewall of the first groove (301) are both inclined surfaces.

[0085] See also Figure 2-3 Furthermore, a plurality of connecting grooves (2012) are provided at the bottom of the guide groove (201), and the connecting grooves (2012) are used to connect the first supporting top bolts (2013);

[0086] The relative height of the lower end surface of the downward pressure guide cover (3) and the bottom of the guide groove (201) is controlled by adjusting the relative height of the top of the first supporting top bolt (2013) and the bottom of the guide groove (201).

[0087] The first supporting pin (2013) is used to support the lower end surface of the downward-pressing guide cover (3).

[0088] Furthermore, the connecting groove (2012) includes an upper receiving groove and a lower threaded groove, the screwing portion of the first supporting top bolt (2013) faces upward and the threaded portion faces downward, and the screwing portion can be used to support the downward pressure of the deflector cover (3). The relative height of the top of the first supporting top bolt (2013) and the bottom of the deflector groove (201) can be adjusted by adjusting the degree of connection between the threaded groove and the threaded portion of the first supporting top bolt (2013).

[0089] Furthermore, the diameter of the accommodating groove is larger than the diameter of the screwing portion of the first supporting top bolt (2013).

[0090] The diameter of the receiving groove is larger than the screwing portion of the first supporting top bolt (2013), and can accommodate the screwing portion. When at least part of the screwing portion is accommodated in the receiving groove, the gap size between the lower end surface of the downward pressure guide cover (3) and the bottom of the guide groove (201) can be smaller than the thickness of the screwing portion.

[0091] Furthermore, the connection groove (2012) is provided on the protrusion (2011).

[0092] Furthermore, the jet pipe assembly (4) is also provided with a plurality of connection holes, and the lower end surface of the downward pressure guide cover (3) is also provided with connection grooves corresponding to the connection holes. The second support top bolt (401) passes through the connection hole and is threadedly connected to the corresponding connection groove of the downward pressure guide cover, thereby fixing the downward pressure guide cover (3) and the jet pipe assembly (4) relative to each other, and thus fixing the guide plate (2) and the wafer supporting platform (1).

[0093] Furthermore, the support assembly (101) comprises a support body (1011) arranged on the wafer carrying platform (1) and a support head (1012) located on the upper end surface of the support body (1011);

[0094] The upper end surface of the support body (1011) is flush with the upper end surface of the guide plate (2). In this way, only the support head (1012) is exposed, so that the area of ​​the support component (101) close to the wafer becomes smaller, which can reduce dirt residue.

[0095] The air outlet of the air flow duct (203) is directed toward the support head (1012).

[0096] Furthermore, the guide plate (2) is provided with perforations (205) corresponding one-to-one to the support components (101), the support components (101) pass through the perforations (205), and form a second annular gap between the support components (101) and the guide plate (2), and the lower end of the second annular gap is connected to the airflow duct (203).

[0097] Part of the air flow is diverted from the air flow duct (203) and ejected from the second annular gap from bottom to top, thereby enhancing the air flow around the support assembly (101) and blowing away the cleaning agent and dirt around the support assembly (101) to avoid residue.

[0098] Furthermore, the support assembly (101) is a clamping assembly for limiting the position of the wafer.

[0099] When the clamping assembly clamps the wafer, contact clamping of the wafer is achieved while cleaning the wafer at the same time.

[0100] When the clamping assembly is not clamping the wafer, the airflow diffused to the edge of the wafer by the airflow channel (202) can put the wafer in a suspended state, thereby performing non-contact clamping on the wafer. In the non-contact clamping, the airflow duct (203) is also used to enhance the airflow around the clamping assembly. The clamping assembly is evenly arranged on the edge circumference, which can stabilize the stability of the wafer in the suspended state and avoid wafer misalignment. In particular, when cleaning the edge of the wafer, the cleaning nozzle generally sprays cleaning agent on the edge of the wafer to increase local downward pressure on the wafer. The stable and enhanced airflow can avoid the instability of the wafer. The clamping assembly can play a role in limiting the wafer at the periphery of the wafer.

[0101] See also Figure 4-6 Furthermore, when the support assembly (101) serves as a clamping assembly, the support head (1012) includes an inclined surface, and when viewed from above, the cross-section of the inclined surface of the support head (1012) is non-circular.

[0102] The inclined surface of the support head (1012) is used to limit the position of the wafer. This is beneficial for the airflow to flow through the clamping head.

[0103] Since the cross section is non-arc-shaped, the slopes of the inclined surfaces are different, so that the inclined line with a larger slope on the inclined surface contacts the wafer, clamps the wafer, and the distance between the wafer and the upper end face of the guide plate (2) is higher, and the inclined line with a smaller slope on the inclined surface contacts the wafer, and the distance between the wafer and the upper end face of the guide plate (2) is lower, and the slope of the inclined surface is further reduced to align the wafer, so that the wafer does not contact the clamping component.

[0104] See also Figure 10 Furthermore, when viewed from above, the overall cross-section of the support head (1012) is in the shape of a water drop.

[0105] See also Figure 7 Furthermore, the supporting component (101) is an aerodynamic component (101a), and the aerodynamic component (101a) has an internal channel. The airflow input from the outside passes through the internal channel and is ejected from the upper end of the aerodynamic component (101a) in a predetermined direction, so that the wafer is in a suspended state.

[0106] The non-contact clamping of the wafer is achieved by the air power component. The airflow of the airflow walkway (202) enhances the airflow, blows away dirt, prevents the dirt from remaining on the lower surface of the wafer, and stabilizes the suspended state of the wafer.

[0107] Furthermore, the support assembly (101) serves as an aerodynamic assembly (101a), and the air outlet of the internal channel is at the support head (1012).

[0108] See also Figure 8-Figure 9Furthermore, an internal air chamber (103) is formed inside the wafer carrying platform (1); the internal channel of each aerodynamic component (101a) is connected to the internal air chamber (103), and the airflow input from the outside enters the internal channel through the internal air chamber (103).

[0109] The internal air chamber (103) supplies airflow to each aerodynamic component (101a) at the same time, so that the airflow ejected by each aerodynamic component is relatively balanced, thereby maintaining the stability of the wafer suspension.

[0110] Specifically, the wafer carrying platform (1) can be a universal carrying platform, and the guide plate (2), the downward pressure guide cover (3) and the jet pipe assembly (4) are detachably fixed on the wafer carrying platform (1). The guide plate (2), the downward pressure guide cover (3) and the jet pipe assembly (4) are removed, and a cleaning pipe (5) for cleaning the lower surface of the wafer is fixed on the fixing groove (104). The cleaning pipe (5), the wafer carrying platform (1) and the aerodynamic assembly can form a cleaning device for cleaning the upper surface or the lower surface of the wafer. The aerodynamic assembly sprays airflow, and based on the Bernoulli principle, the wafer is suspended in the air, thereby realizing non-contact cleaning of the wafer and ensuring the quality of the wafer.

[0111] Furthermore, a second groove (302) is provided in the middle of the upper end surface of the downward pressure guide cover (3). The design of the second groove (302) can reduce the contact area between the lower surface of the wafer and the downward pressure guide cover (3) when the wafer accidentally slips, thereby reducing contamination and damage.

[0112] The above are only preferred embodiments of the present invention and do not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer cleaning device with multi-channel flow field control, characterized in that: include: A wafer carrying platform, with a plurality of supporting components for supporting wafers arranged on the edge of the wafer carrying platform; A guide plate, wherein a guide groove is provided on the guide plate; A downward-pressing guide cover covers the guide plate, wherein a gap between the downward-pressing guide cover and the guide groove forms an airflow passage, and an externally input airflow is sprayed toward the edge of the wafer through the airflow passage; The guide plate is provided with air flow ducts corresponding to the support components one by one; The air outlet of the air flow duct is close to the corresponding support assembly, and the air flow input from the outside is blown toward the support assembly through the air outlet of the air flow duct; The support assembly is an aerodynamic assembly having an internal channel, and an airflow input from the outside passes through the internal channel and is ejected from the upper end of the aerodynamic assembly in a predetermined direction, so that the wafer is in a suspended state; An internal air chamber is formed inside the wafer carrying platform; an internal channel of each aerodynamic component is connected to the internal air chamber, and an airflow input from the outside enters the internal channel through the internal air chamber; The guide plate and the downward-pressing guide cover are detachably fixed on the wafer carrying platform.

2. The wafer cleaning device with multi-channel flow field control according to claim 1, characterized in that: The guide plate is provided with a guide hole; The wafer carrying platform is provided with a fixing groove; The jet pipe assembly is accommodated in the guide hole and the fixing groove; The jet pipe assembly is used to guide the airflow input from the outside into the airflow passage.

3. The multi-channel flow field controlled wafer cleaning device according to claim 2, characterized in that: The bottom of the guide groove is provided with a protrusion arranged around the guide hole; The lower end surface of the downward pressure guide cover is provided with a first groove corresponding to the upper and lower parts of the protrusion, and there is a gap between the first groove and the protrusion.

4. The multi-channel flow field controlled wafer cleaning device according to claim 1, characterized in that: The bottom of the guide groove is also provided with a plurality of connecting grooves, and the connecting grooves are used to connect the first supporting top bolts; The relative height between the lower end surface of the downward-pressing guide cover and the bottom of the guide groove is controlled by adjusting the relative height between the top of the first supporting pin and the bottom of the guide groove.

5. The multi-channel flow field controlled wafer cleaning device according to claim 1, characterized in that: The support assembly includes a support body arranged on the wafer carrying platform and a support head located on the upper end surface of the support body; The upper end surface of the support body is flush with the upper end surface of the guide plate; An air outlet of the air flow duct points toward the supporting head.

6. The wafer cleaning device with multi-channel flow field control according to claim 1, characterized in that: The guide plate is provided with through-holes corresponding to the support components one by one. The support components pass through the through-holes and form a second annular gap with the guide plate. The lower end of the second annular gap is connected to the airflow duct.

7. The wafer cleaning device with multi-channel flow field control according to claim 5, characterized in that: The support assembly is a clamping assembly used to limit the position of the wafer; When the support assembly serves as the clamping assembly, the support head includes an inclined surface, and when viewed from above, the cross section of the inclined surface of the support head is non-circular.

8. The wafer cleaning device with multi-channel flow field control according to claim 5, characterized in that: The air outlet of the internal channel is located at the support head.

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