In-situ measurement time-controlled grinding device and measurement method thereof

Abstract

The present invention discloses an on-site measurement time-controlled grinding device, comprising a bed, the bed being provided with a workpiece mounting seat that moves along the X-axis and can be rotatably adjusted, a time-controlled grinding processing platform and a measuring platform that move along the Y-axis and the Z-axis, the time-controlled grinding processing platform being provided with a time-controlled grinding processing mechanism, the top of the measuring platform being provided with a first measuring mechanism, and the bottom being provided with a second measuring mechanism. Also disclosed is a measurement method for the on-site measurement time-controlled grinding device, comprising the steps of: shifting; calibrating; forming a grating measurement track for the first time; compensating for errors; forming a grating measurement track for the second time; obtaining accurate surface shape data; and grinding and shaping. The on-site measurement time-controlled grinding device and its measurement method can realize on-site measurement of optical element processing, reduce the influence of handling and repeated clamping on the workpiece processing accuracy and efficiency, improve measurement efficiency and processing granularity, and achieve integrated processing and detection.

Description

Technical Field

[0001] The present invention relates to the technical field of measuring instruments, and in particular to an on-site measurement and time-controlled grinding device and a measuring method thereof. Background Art

[0002] Large-aperture optical systems have a wide range of applications in astronomy and defense. Due to their higher angular resolution and enhanced energy collection capabilities, they are currently a key research focus for optical processing institutions both domestically and internationally. Large-aperture optical mirrors are core components of large-aperture optical systems. For example, the primary mirror of the Hubble Space Telescope, launched in 1990, had a diameter of 2.4 meters. The primary mirror of the US Keyhole-12 reconnaissance satellite has a diameter of 3 meters, capable of achieving a resolution of 0.1 meters on Earth. The Giant Magellan Telescope (GMT), currently under construction, has a single mirror with an aperture of 8.4 meters. In addition to the increasing diameter, the demand for large-aperture optical components is also increasing. For example, the US National Ignition Facility (NIF) requires a total of 7,440 large-aperture precision optical components, while the European Extremely Large Telescope (88LT) uses 798 1.4-meter mirrors. Consequently, the development of these fields places high demands on the manufacturing equipment for large-aperture optical components, demanding both high precision and high efficiency.

[0003] The processing flow for large-aperture optical components generally includes grinding, shaping and polishing, and coating. Shaping and polishing processes primarily include magnetorheological polishing, dual-rotor small-head polishing, and airbag polishing. However, these processes are characterized by low efficiency, and therefore the accuracy of the grinding process directly determines the efficiency of the entire process. The machining accuracy of traditional grinding machines is limited by the accuracy of the machine's own motion. These methods, based on deterministic machining, suffer from low precision. Traditional offline measurement methods require workpiece disassembly and handling, increasing safety risks. This process is particularly time-consuming for large-aperture optical components. In-situ measurement can avoid these issues, saving time and improving production efficiency. However, traditional in-situ measurement methods simply mount sensors on the machine tool to scan and measure the machined part. Limited by the inherent precision of the machine tool, the measurement accuracy of in-situ scanning methods cannot exceed that of the machine itself, significantly limiting accuracy and reducing efficiency. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the existing technology and provide an in-situ measurement and time-controlled grinding device and its measurement method that can realize in-situ measurement of optical component processing, greatly reducing the impact of the handling and repeated clamping process on the workpiece processing accuracy and efficiency, improving measurement efficiency and processing accuracy, achieving integrated processing and detection, and greatly shortening the manufacturing cycle of optical components.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] An on-site measurement time-controlled grinding device includes a bed, on which is provided a workpiece mounting seat that moves along the X-axis and can be rotatably adjusted, a time-controlled grinding processing platform and a measuring platform that move along the Y-axis and the Z-axis, a time-controlled grinding processing mechanism is provided on the time-controlled grinding processing platform, a first measuring mechanism for measuring the displacement change of the time-controlled grinding processing platform in the Z-axis direction is provided on the top of the measuring platform, and a second measuring mechanism for measuring the distance to the workpiece surface 8 is provided on the bottom.

[0007] As a further improvement of the above technical solution:

[0008] The first measuring mechanism includes a laser displacement sensor and a reference flat crystal arranged opposite to each other. The laser displacement sensor is provided on the measuring platform, the reference flat crystal is fixed on the bed, and the optical path direction of the laser displacement sensor is parallel to the Z axis.

[0009] A mounting frame is provided on the bed, and the reference flat crystal is fixed on the mounting frame.

[0010] The second measuring mechanism is a spectral confocal displacement sensor, and the optical path direction of the spectral confocal displacement sensor is parallel to the Z axis.

[0011] The optical path of the laser displacement sensor is coaxial with the optical path of the spectral confocal displacement sensor.

[0012] The bed is provided with a Y-axis track parallel to the Y-axis, a first Y-axis movable seat and a second Y-axis movable seat are slidably provided on the Y-axis track, the first Y-axis movable seat is provided with a first Z-axis track parallel to the Z-axis, the time-controlled grinding processing platform is slidably provided on the first Z-axis track, the second Y-axis movable seat is provided with a second Z-axis track parallel to the Z-axis, and the measuring platform is slidably provided on the second Z-axis track.

[0013] The bed is provided with an X-axis track parallel to the X-axis, and the workpiece mounting seat is slidably arranged on the X-axis track.

[0014] The workpiece mounting seat includes an X-axis moving table and a workpiece clamping platform rotating around the Z axis. The X-axis moving table is slidably arranged on the X-axis track, and the workpiece clamping platform is arranged on the X-axis moving table.

[0015] The in-situ measurement and time-controlled grinding device further includes a numerical control module, and both the first measuring mechanism and the second measuring mechanism are connected to the numerical control module by signal.

[0016] A measuring method for an in-situ measurement time-controlled grinding device is performed using the above-mentioned in-situ measurement time-controlled grinding device, comprising the following steps:

[0017] Step S1, shifting: after the grinding process is completed, the grinding mechanism is moved along the Y axis to one side of the time-controlled grinding platform;

[0018] Step S2, calibration: calibrating and calibrating the first measuring mechanism and the second measuring mechanism;

[0019] Step S3, forming a grating measurement trajectory for the first time: the measuring platform moves relative to the workpiece on the workpiece mounting seat along the X, Y, and Z axes, and forms a grating measurement trajectory of the workpiece surface 8 for the first time based on the measurement data of the first and second measuring mechanisms, and extracts the measurement data of the first and second measuring mechanisms and the coordinate data of the bed;

[0020] Step S4, compensating for the error: compensating for the runout error of the workpiece mounting seat in the Z-axis direction according to the measurement data of the first measuring mechanism;

[0021] Step S5, forming a grating measurement track for the second time: rotating the workpiece mounting base by 90°, repeating step S3, forming a grating measurement track of the workpiece surface (8) for the second time, and extracting corresponding measurement data and coordinate data of the bed;

[0022] Step S6, obtaining accurate surface shape data: obtaining accurate surface shape data of the workpiece surface 8 by splicing the data of the first grating measurement track and the second grating measurement track;

[0023] Step S7, grinding and reshaping: Evaluate the surface shape error based on the surface shape data, and feed back to the time-controlled grinding processing platform for grinding and reshaping.

[0024] Compared with the prior art, the advantages of the present invention are:

[0025] The in-situ measurement time-controlled grinding device of the present invention can measure the workpiece surface directly on the workpiece mounting seat after machining is completed, without the need to disassemble the workpiece from the workpiece mounting seat for measurement. It can achieve in-situ measurement of large-aperture optical components, greatly reducing the impact of the handling and repeated clamping process on the workpiece machining accuracy and efficiency. In view of the characteristics of the shape, size, target accuracy and surface quality of the optical components, the present invention greatly improves the measurement efficiency and machining accuracy, reduces the requirements of the measurement process on the environment, equipment, and manpower, achieves integrated machining and detection, and greatly shortens the manufacturing cycle of the optical components. In addition, the time-controlled grinding processing platform and the measuring platform move relatively independently, so that the measuring device is not affected by the time-controlled grinding processing platform, thereby improving the machining accuracy.

[0026] In the in-situ measurement time-controlled grinding device of the present invention, the first measuring mechanism and the second measuring mechanism can compensate for the motion error of the time-controlled grinding processing platform on the Z axis in real time, further improving the measurement accuracy.

[0027] In the in-situ measurement and time-controlled grinding device of the present invention, the optical path of the laser displacement sensor is coaxial with the optical path of the spectral confocal displacement sensor, thereby minimizing the measured Abbe arm length and improving measurement certainty.

[0028] This in-situ measurement method for a time-controlled grinding device allows the workpiece surface to be measured directly on the workpiece mounting seat after machining is completed, without the need to disassemble the workpiece from the mounting seat for measurement. This allows in-situ measurement of large-aperture optical components, significantly reducing the impact of handling and repeated clamping processes on the workpiece machining accuracy and efficiency. In view of the characteristics of the shape, size, target accuracy, and surface quality of optical components, the present invention significantly improves measurement efficiency and machining accuracy, reduces the requirements of the measurement process for the environment, equipment, and manpower, achieves integrated machining and detection, and significantly shortens the manufacturing cycle of optical components. Furthermore, by splicing the data from the two grating measurement trajectories, accurate surface shape data can be obtained. After data processing, the surface shape error is evaluated and fed back to the grinding and reshaping process, thereby improving machining accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the three-dimensional structure of the in-situ measurement and time-controlled grinding device of the present invention.

[0030] Figure 2 It is a schematic diagram of the centering of the second measuring device of the in-situ measurement and time-controlled grinding device of the present invention.

[0031] Figure 3 This is a schematic diagram of the grating measurement trajectory formed for the first time by the in-situ measurement and time-controlled grinding device of the present invention.

[0032] Figure 4 This is a schematic diagram of the grating measurement trajectory formed for the second time by the in-situ measurement and time-controlled grinding device of the present invention.

[0033] Figure 5 It is a schematic diagram of the splicing of two grating measurement tracks of the in-situ measurement and time-controlled grinding device of the present invention.

[0034] Figure 6 It is a measurement schematic diagram of the first measuring mechanism of the in-situ measurement and time-controlled grinding device of the present invention.

[0035] Figure 7 It is a measurement schematic diagram of the second measuring mechanism of the in-situ measurement and time-controlled grinding device of the present invention.

[0036] Figure 8 It is a flow chart of the measuring method of the in-situ measurement time-controlled grinding device of the present invention.

[0037] The numbers in the figure represent:

[0038] 1. Workpiece mounting seat; 11. X-axis moving table; 12. Workpiece fixture platform; 2. Time-controlled grinding platform; 3. Grinding mechanism; 4. First measuring mechanism; 41. Laser displacement sensor; 42. Reference flat crystal; 5. Second measuring mechanism; 6. Bed; 61. Mounting frame; 62. Y-axis track; 63. First Y-axis moving seat; 64. First Z-axis track; 65. X-axis track; 66. Second Y-axis moving seat; 67. Second Z-axis track; 7. Measuring platform; 8. Workpiece surface. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] Example 1:

[0041] Figures 1 to 7 An embodiment of the in-situ measurement and time-controlled grinding device of the present invention is shown. The in-situ measurement and time-controlled grinding device includes a bed 6, on which is provided a workpiece mounting seat 1 that moves along the X-axis and can be rotatably adjusted, a time-controlled grinding platform 2 that moves along the Y-axis and the Z-axis, and a measuring platform 7. The time-controlled grinding platform 2 is provided with a time-controlled grinding mechanism 3. The top of the measuring platform 7 is provided with a first measuring mechanism 4 for measuring the displacement change of the time-controlled grinding platform 2 in the Z-axis direction, and the bottom is provided with a second measuring mechanism 5 for measuring the distance from the workpiece surface 8. The workpiece mounting seat 1 is used to mount a workpiece (optical element); the X-axis, Y-axis and Z-axis are perpendicular to each other and are the three axes of the coordinate system. Generally, the X-axis and Y-axis are the horizontal axis and the vertical axis on the horizontal plane, and the Z-axis is the vertical axis.

[0042] In-situ measurement process of the time-controlled grinding device: the first step is to mount the workpiece on the workpiece mounting seat 1. After the grinding is completed, the grinding mechanism 3 is moved along the Y axis to one side of the time-controlled grinding platform 2. The time-controlled grinding platform 2 moves the grinding mechanism 3 to the far left (one side of the time-controlled grinding platform 2). The measuring platform 7 moves the first measuring mechanism 4 and the second measuring mechanism 5 to the workpiece area for measurement; the second step is to calibrate and calibrate the first measuring mechanism 4 and the second measuring mechanism 5; the third step is to form a grating measurement trajectory of the workpiece surface 8 for the first time (such as) according to the measurement data of the first measuring mechanism 4 and the second measuring mechanism 5 relative to the workpiece on the workpiece mounting seat 1 along the X, Y, and Z axes. Figure 3 The track on the ABCD surface shown in FIG3 is obtained, and the measurement data of the first measuring mechanism 4 and the second measuring mechanism 5 and the coordinate data of the bed 6 are extracted; the fourth step is to compensate the runout error of the workpiece mounting seat 1 in the Z-axis direction according to the measurement data of the first measuring mechanism 4; the fifth step is to rotate the workpiece mounting seat 1 90° and repeat the third step to form the grating measurement track of the workpiece surface 8 for the second time (as shown in FIG3 ). Figure 4The trajectory on the BCDA surface shown in FIG), and extract the corresponding measurement data and the coordinate data of the bed 6; the sixth step is to splice the data of the first grating measurement trajectory and the second grating measurement trajectory (as shown in FIG). Figure 5 As shown, accurate surface shape data of the workpiece surface 8 is obtained. In the seventh step, the surface shape error is evaluated and fed back to the time-controlled grinding platform 2 for grinding and reshaping. After the measurement process is completed, the measurement results can be evaluated to obtain the surface shape error. Based on the surface shape error results, the in-situ measurement time-controlled grinding device continues to reshape the processed component. The above process is repeated to ultimately obtain a high-precision optical component.

[0043] The measuring platform 7 moves at a constant speed along the Y-axis and simultaneously moves up and down along the Z-axis, ensuring that the measuring device is always within the measuring range. The movement of the measuring platform 7 relative to the workpiece on the workpiece mounting base 1 along the X, Y, and Z axes forms a grating measurement trajectory. The Y-direction trajectory extracts measurement data from the first and second measuring mechanisms 4 and 5, as well as the coordinate data of the bed 6. The measurement data from the first measuring mechanism 4 can be used to compensate for errors in the Z-axis direction (compensating for runout errors in the Z-axis direction of the workpiece mounting base 1). Furthermore, the time-controlled grinding platform 2 and the measuring platform 7 move relatively independently, freeing the measuring device from the influence of the time-controlled grinding platform 2 and improving machining accuracy.

[0044] This in-situ measurement and time-controlled grinding device measures the workpiece surface 8 directly on the workpiece mounting seat 1 after machining is completed, without the need to disassemble the workpiece mounting seat 1 for measurement. This device can achieve in-situ measurement of large-aperture optical components, significantly reducing the impact of handling and repeated clamping processes on the workpiece machining accuracy and efficiency. In view of the characteristics of the shape, size, target accuracy, and surface quality of optical components, the present invention significantly improves measurement efficiency and machining accuracy, reduces the requirements of the measurement process for the environment, equipment, and manpower, achieves integrated machining and detection, and significantly shortens the manufacturing cycle of optical components. In addition, by splicing the data of the two grating measurement trajectories, accurate surface shape data can be obtained. After data processing, the surface shape error is evaluated and fed back to the grinding and shaping process, thereby improving machining accuracy.

[0045] In this embodiment, the first measuring mechanism 4 includes a laser displacement sensor 41 and a reference flat crystal 42 arranged relatively to each other. The laser displacement sensor 41 is provided on the measuring platform 7, and the reference flat crystal 42 is fixed on the bed 6. The optical path direction of the laser displacement sensor 41 is parallel to the Z axis.

[0046] The laser displacement sensor 41 is mounted on the measuring platform 7 and can move along the Z-axis and Y-axis directions with the measuring platform 7. Figure 6As shown, the optical path direction of the laser displacement sensor 41 is parallel to the Z-axis direction. The outgoing light is emitted along the positive direction of the Z-axis, reflected by the high reference flat crystal 42, and the reflected light returns to the laser displacement sensor 41 along the negative direction of the Z-axis. The interference fringes generated by the emitted and reflected lasers can accurately measure the displacement change of the grinding platform 2 in the Z-axis direction during control, and the displacement resolution can reach the pm level.

[0047] In this embodiment, a mounting frame 61 is provided on the bed 6, and the reference flat crystal 42 is fixed on the mounting frame 61. The mounting frame 61 is installed on the bed 6 and does not contact moving parts such as the time-controlled grinding platform 2 and the workpiece mounting seat 1. The mounting frame 61 is preferably made of Invar alloy (Invar steel) with an extremely low linear expansion coefficient. The design of isolation from the moving parts ensures that during the measurement process, the mounting frame 61 will not be affected by coupling factors such as vibration, temperature rise, motion error, etc. caused by the operation of other moving parts on the bed 6, thereby maintaining extremely high measurement stability. The mounting frame 61 of the in-situ measurement time-controlled grinding device is separated from other moving parts, so that it is not affected by the coupling of factors such as motion error, thermal deformation and vibration of other moving parts during the measurement process, thereby greatly improving the measurement stability.

[0048] In this embodiment, the reference flat crystal 42 is made with the help of wavefront interference measurement method and deterministic processing methods such as magnetorheological fluid and ion beam. The flatness of its reference surface can reach λ / 30-λ / 10 (λ=632.8nm). Compared with the sub-μm measurement accuracy requirement required by the time-controlled grinding processing method, the reference flat crystal 42 can be used as a measurement benchmark.

[0049] The first measuring mechanism 4 and the second measuring mechanism 5 can compensate for the runout error of the workpiece mounting seat 1 in the Z-axis direction in real time, thereby further improving the measurement accuracy.

[0050] In this embodiment, the second measuring mechanism 5 is a spectral confocal displacement sensor, and the optical path direction of the spectral confocal displacement sensor is parallel to the Z axis.

[0051] The spectral confocal displacement sensor is mounted on the measuring platform 7 and moves along the Z-axis and Y-axis directions with the measuring platform 7. Figure 7 As shown, the optical path of the spectral confocal displacement sensor is parallel to the Z-axis. The outgoing light from the spectral confocal displacement sensor is emitted along the negative Z-axis, reflected by workpiece surface 8, and then returned to the spectral confocal displacement sensor along the positive Z-axis. Based on the difference in the focal point position of light of different wavelengths, the distance between the spectral confocal displacement sensor and workpiece surface 8 can be calculated with a resolution of up to 80 nm. The spectral confocal displacement sensor has better adaptability to measurement surfaces than the laser displacement sensor 41 and can measure rough surfaces and surfaces with high steepness.

[0052] In this embodiment, the optical path of the laser displacement sensor 41 is coaxial with the optical path of the spectral confocal displacement sensor. The coaxiality of the optical paths of the laser displacement sensor 41 and the spectral confocal displacement sensor minimizes the measured Abbe arm length and improves measurement certainty. Furthermore, the optical paths of the laser displacement sensor 41 and the spectral confocal displacement sensor are positioned vertically opposite each other, respectively measuring the reference flat crystal 42 and the workpiece being measured. This arrangement can separate the geometric errors caused by machine tool movement. The coaxiality of the optical paths of the laser displacement sensor 41 and the spectral confocal displacement sensor minimizes the measured Abbe arm length and improves measurement certainty.

[0053] In this embodiment, a Y-axis track 62 parallel to the Y-axis is provided on the bed 6, a first Y-axis moving seat 63 and a second Y-axis moving seat 66 are slidably provided on the Y-axis track 62, the first Y-axis moving seat 63 is provided with a first Z-axis track 64 parallel to the Z-axis, the time-controlled grinding processing platform 2 is slidably provided on the first Z-axis track 64, the second Y-axis moving seat 66 is provided with a second Z-axis track 67 parallel to the Z-axis, and the measuring platform 7 is slidably provided on the second Z-axis track 67.

[0054] The first Y-axis movable base 63 is connected to a Y-axis servo mechanism (not shown in the figure) for driving the first Y-axis movable base 63 to translate along the Y-axis track 62. The time-controlled grinding platform 2 is connected to a Z-axis servo mechanism (not shown in the figure) for driving the time-controlled grinding platform 2 to translate along the first Z-axis track 64. The measuring platform 7 is connected to a Z-axis servo mechanism (not shown in the figure) for driving the measuring platform 7 to translate along the second Z-axis track 67.

[0055] In this embodiment, the bed 6 is provided with an X-axis track 65 parallel to the X-axis, and the workpiece mounting seat 1 is slidably mounted on the X-axis track 65. The workpiece mounting seat 1 is connected to an X-axis servo mechanism (not shown) for driving the workpiece mounting seat 1 to translate along the X-axis track 65.

[0056] In this embodiment, the workpiece mounting base 1 includes an X-axis movable table 11 and a workpiece clamping platform 12 that rotates about the Z-axis. The X-axis movable table 11 is slidably mounted on the X-axis rail 65, and the workpiece clamping platform 12 is mounted on the X-axis movable table 11. The workpiece clamping platform 12 is connected to a rotary servo mechanism (not shown) for driving the X-axis movable table 11 to rotate about the Z-axis.

[0057] In this embodiment, the in-situ measurement-controlled grinding device further includes a numerical control module, to which both the first measuring mechanism 4 and the second measuring mechanism 5 are signal-connected. The numerical control module receives external instructions and / or signal data from the first measuring mechanism 4 and the second measuring mechanism 5 to perform numerical control on the various moving parts.

[0058] The sensor used to measure the workpiece is a focusing displacement sensor with high precision and wide angle adaptability, such as a spectral confocal displacement sensor. The sensor used to measure the reference flat crystal 42 is a collimating displacement sensor with high precision and a large range, such as a laser displacement sensor 41. The reference flat crystal 42 is mounted on the bed 6 via a mounting bracket 61 and is located directly above the laser displacement sensor 41.

[0059] Example 2:

[0060] Figure 8 The present invention shows a measuring method for an in-situ measurement and time-controlled grinding device. The measuring method for an in-situ measurement and time-controlled grinding device is performed using the above-mentioned in-situ measurement and time-controlled grinding device, and includes the following steps:

[0061] Step S1, shifting: after the grinding process is completed, the grinding mechanism 3 is moved along the Y axis to one side of the time-controlled grinding platform 2;

[0062] Step S2, calibration: calibrating and calibrating the first measuring mechanism 4 and the second measuring mechanism 5;

[0063] Step S3, forming a grating measurement trajectory for the first time: the measuring platform 7 moves relative to the workpiece on the workpiece mounting seat 1 along the X, Y, and Z axes, and forms a grating measurement trajectory of the workpiece surface 8 for the first time based on the measurement data of the first measuring mechanism 4 and the second measuring mechanism 5, and extracts the measurement data of the first measuring mechanism 4 and the second measuring mechanism 5 as well as the coordinate data of the bed 6;

[0064] Step S4, compensating for the error: compensating for the runout error of the workpiece mounting seat 1 in the Z-axis direction according to the measurement data of the first measuring mechanism 4;

[0065] Step S5, forming a grating measurement track for the second time: rotating the workpiece mounting base 1 by 90°, repeating step S3, forming a grating measurement track of the workpiece surface 8 for the second time, and extracting corresponding measurement data and coordinate data of the bed 6;

[0066] Step S6, obtaining accurate surface shape data: obtaining accurate surface shape data of the workpiece surface 8 by splicing the data of the first grating measurement track and the second grating measurement track;

[0067] Step S7, grinding and reshaping: Evaluate the surface shape error and feed it back to the time-controlled grinding processing platform 2 for grinding and reshaping.

[0068] In this in-situ measurement method for a time-controlled grinding device, the workpiece surface 8 is measured directly on the workpiece mounting seat 1 after machining is completed, without the need to disassemble the workpiece mounting seat 1 for measurement. This enables in-situ measurement of large-aperture optical components, significantly reducing the impact of handling and repeated clamping processes on the workpiece machining accuracy and efficiency. In view of the characteristics of the shape, size, target accuracy, and surface quality of optical components, the present invention significantly improves measurement efficiency and machining accuracy, reduces the requirements of the measurement process for the environment, equipment, and manpower, achieves integrated machining and detection, and significantly shortens the manufacturing cycle of optical components. Furthermore, by splicing the data of the two grating measurement trajectories, accurate surface shape data can be obtained. After data processing, the surface shape error is evaluated and fed back to the grinding and shaping process, thereby improving machining accuracy.

[0069] Although the present invention has been disclosed above with reference to preferred embodiments, this is not intended to limit the present invention. Any person skilled in the art can, without departing from the scope of the technical solution of the present invention, utilize the technical content disclosed above to make many possible changes and modifications to the technical solution of the present invention, or modify it into an equivalent embodiment with equivalent changes. Therefore, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the scope of protection of the technical solution of the present invention.

Claims

1. A method for measuring an in-situ time-controlled grinding device, characterized in that: The in-situ measurement time-controlled grinding device comprises a bed (6), the bed (6) is provided with a workpiece mounting seat (1) that moves along the X-axis and can be rotatably adjusted, a time-controlled grinding platform (2) that moves along the Y-axis and the Z-axis, and a measuring platform (7), the time-controlled grinding platform (2) is provided with a time-controlled grinding mechanism (3), the top of the measuring platform (7) is provided with a first measuring mechanism (4) for measuring the displacement change of the time-controlled grinding platform (2) in the Z-axis direction, and the bottom is provided with a second measuring mechanism (5) for measuring the distance from the workpiece surface (8), and the measuring method of the in-situ measurement time-controlled grinding device comprises the following steps: Step S1, shifting: after the grinding process is completed, the grinding mechanism (3) is moved along the Y axis to one side of the time-controlled grinding platform (2); Step S2, calibration: calibrating and calibrating the first measuring mechanism (4) and the second measuring mechanism (5); Step S3, forming a grating measurement trajectory for the first time: the measuring platform (7) moves relative to the workpiece on the workpiece mounting seat (1) along the X, Y, and Z axes, and forms a grating measurement trajectory of the workpiece surface (8) for the first time based on the measurement data of the first measuring mechanism (4) and the second measuring mechanism (5), and extracts the measurement data of the first measuring mechanism (4) and the second measuring mechanism (5) and the coordinate data of the bed (6); Step S4, compensating for errors: compensating for the runout error of the workpiece mounting seat (1) in the Z-axis direction according to the measurement data of the first measuring mechanism (4); Step S5, forming a grating measurement track for the second time: rotating the workpiece mounting seat (1) by 90 degrees, repeating step S3, forming a grating measurement track of the workpiece surface (8) for the second time, and extracting corresponding measurement data and coordinate data of the bed (6); Step S6, obtaining accurate surface shape data: obtaining accurate surface shape data of the workpiece surface (8) by splicing the data of the first grating measurement track and the second grating measurement track; Step S7, grinding and reshaping: Evaluate the surface shape error and feed it back to the time-controlled grinding processing platform (2) for grinding and reshaping.

2. An in-situ measurement and time-controlled grinding device, characterized in that: A measuring method for realizing the in-situ measurement of a time-controlled grinding device as claimed in claim 1, comprising a bed (6), wherein the bed (6) is provided with a workpiece mounting seat (1) which moves along the X-axis and can be rotatably adjusted, a time-controlled grinding platform (2) which moves along the Y-axis and the Z-axis, and a measuring platform (7), wherein the time-controlled grinding platform (2) is provided with a time-controlled grinding mechanism (3), the top of the measuring platform (7) is provided with a first measuring mechanism (4) for measuring the displacement change of the time-controlled grinding platform (2) in the Z-axis direction, and the bottom is provided with a second measuring mechanism (5) for measuring the distance to the workpiece surface (8).

3. The in-situ measurement and time-controlled grinding device according to claim 2, characterized in that: The first measuring mechanism (4) comprises a laser displacement sensor (41) and a reference flat crystal (42) arranged relative to each other, the laser displacement sensor (41) being arranged on a measuring platform (7), the reference flat crystal (42) being fixed on a bed (6), and the optical path direction of the laser displacement sensor (41) being parallel to the Z axis.

4. The in-situ measurement and time-controlled grinding device according to claim 3, characterized in that: A mounting frame (61) is provided on the bed (6), and the reference flat crystal (42) is fixed on the mounting frame (61).

5. The on-site measurement and time-controlled grinding device according to claim 3, characterized in that: The second measuring mechanism (5) is a spectral confocal displacement sensor, and the optical path direction of the spectral confocal displacement sensor is parallel to the Z axis.

6. The in-situ measurement and time-controlled grinding device according to claim 5, characterized in that: The optical path of the laser displacement sensor (41) is coaxial with the optical path of the spectral confocal displacement sensor.

7. The in-situ measurement and time-controlled grinding device according to any one of claims 2 to 6, characterized in that: The bed (6) is provided with a Y-axis track (62) parallel to the Y-axis, a first Y-axis movable seat (63) and a second Y-axis movable seat (66) are slidably provided on the Y-axis track (62), the first Y-axis movable seat (63) is provided with a first Z-axis track (64) parallel to the Z-axis, the time-controlled grinding platform (2) is slidably provided on the first Z-axis track (64), the second Y-axis movable seat (66) is provided with a second Z-axis track (67) parallel to the Z-axis, and the measuring platform (7) is slidably provided on the second Z-axis track (67).

8. The in-situ measurement and time-controlled grinding device according to any one of claims 2 to 6, characterized in that: An X-axis track (65) parallel to the X-axis is provided on the bed (6), and the workpiece mounting seat (1) is slidably arranged on the X-axis track (65).

9. The in-situ measurement and time-controlled grinding device according to claim 8, characterized in that: The workpiece mounting seat (1) comprises an X-axis moving table (11) and a workpiece fixture platform (12) rotating about a Z axis, wherein the X-axis moving table (11) is slidably mounted on an X-axis track (65), and the workpiece fixture platform (12) is mounted on the X-axis moving table (11).

10. The on-site measurement and time-controlled grinding device according to any one of claims 2 to 6, characterized in that: The in-situ measurement and time-controlled grinding device further comprises a numerical control module, and both the first measuring mechanism (4) and the second measuring mechanism (5) are connected to the numerical control module by signal.

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