communication equipment

Abstract

A communication device is disclosed. The communication device includes a heat-dissipating housing, a heat-conducting component, a heat-dissipating base, and a communication module. The heat-conducting component is thermally connected to the heat-dissipating housing; the heat-dissipating base is pivotally connected to the heat-conducting component, and the heat-dissipating base is adapted to pivot relative to the heat-conducting component between a first position and a second position; the communication module is fixedly mounted on the heat-dissipating base. In the communication device of the present invention, the heat-conducting component, the heat-dissipating base, and the communication module are enclosed between an outer cover and the heat-dissipating housing. When the communication device is installed outdoors, the outer cover and the heat-dissipating housing provide good waterproof and dustproof effects, improving the lifespan and reliability of the communication device. The heat generated by the communication module is fully transferred to the heat-dissipating housing by the heat-dissipating base and the heat-conducting component for heat dissipation, thus achieving good heat dissipation. The communication module of the present invention is thermally connected to the heat-conducting component through the heat-dissipating base and is adapted to rotate relative to the heat-conducting component, which can simultaneously meet design requirements such as signal adjustment and heat dissipation.

Description

Technical Field

[0001] Embodiments of the present invention relate to a communication device, and more particularly to a communication device with adjustable signal transmission performance. Background Technology

[0002] In 5G communication systems, the short wavelength of 5G signals leads to problems such as high path loss and high transmission loss. Beamforming technology is used in known technologies to mitigate these issues. However, due to the highly directional transmission characteristics of beamforming, the communication module of the communication device (e.g., a 5G router) must be able to be rotated to achieve optimal communication quality.

[0003] In known technologies, there are designs that allow for manual adjustment of the orientation of communication modules. However, communication modules are often exposed. Since communication devices (e.g., 5G routers) are frequently installed on the exterior of buildings, communication modules are exposed to dust and moisture for extended periods in outdoor environments, which can affect their lifespan and reliability.

[0004] Therefore, a communication device is needed to solve the above problems. Summary of the Invention

[0005] The present invention provides a communication device to address problems in the prior art, comprising a heat-dissipating housing, a heat-conducting element, a heat-dissipating base, and a communication module. The heat-conducting element is thermally connected to the heat-dissipating housing. The heat-dissipating base is pivotally connected to the heat-conducting element, and is adapted to pivot relative to the heat-conducting element between a first orientation and a second orientation. The communication module is fixedly attached to the heat-dissipating base.

[0006] In one embodiment, the heat dissipation base includes a first base surface, a second base surface, and a pivot groove. The first base surface is opposite to the second base surface. The communication module is disposed on the first base surface, the pivot groove is formed on the second base surface, and the heat-conducting component includes a connecting rod, which is at least partially disposed within the pivot groove.

[0007] In one embodiment, the communication device further includes a limiting cover fixed to the heat dissipation base to cover the pivot groove and limit the connecting rod within the pivot groove.

[0008] In one embodiment, the communication device further includes a heat-conducting material, a first O-ring, a second O-ring, a first seal, and a second seal. The first O-ring, the second O-ring, the first seal, and the second seal are sleeved on the connecting rod. The first O-ring and the first seal are located at one end of the pivot groove, and the second O-ring and the second seal are located at the other end of the pivot groove. The heat-conducting material is filled into the pivot groove and located between the first seal and the second seal.

[0009] In one embodiment, the heat dissipation base includes a first abutting portion and a second abutting portion, the first abutting portion abutting a first O-ring and the second abutting portion abutting a second O-ring.

[0010] In one embodiment, the communication device further includes an electric motor, wherein the heat dissipation base includes a connecting groove, the electric motor includes a rotating shaft, the rotating shaft is inserted into and fixed to the connecting groove, and the rotating shaft and the connecting rod are located on the same axis.

[0011] In one embodiment, the heat dissipation base includes a plurality of first heat dissipation fins formed on the surface of the second base.

[0012] In one embodiment, the communication device further includes a thermal pad, wherein the thermal pad is disposed on an inner surface of the heat dissipation housing component, and the thermal conductive component contacts the thermal pad.

[0013] In one embodiment, the heat dissipation housing includes a plurality of second heat dissipation fins formed on an outer surface of the heat dissipation housing, the outer surface being opposite to the inner surface.

[0014] In one embodiment, the heat-conducting element includes a heat pipe, and the communication module includes a millimeter-wave (mmWave) array antenna module.

[0015] In one embodiment, the communication device further includes a circuit board, a limiting plate, and a frame. The circuit board is fixed to the frame, the limiting plate is fixed to the circuit board, and the limiting plate pushes against the heat-conducting component to ensure that the heat-conducting component fully contacts the heat-conducting pad.

[0016] In one embodiment, the frame defines a first accommodating space and a second accommodating space, with the heat dissipation base and communication module disposed in the first accommodating space, and the circuit board corresponding to the second accommodating space.

[0017] In one embodiment, the communication device further includes a plurality of first antennas disposed on the frame and corresponding to the first accommodating space.

[0018] In one embodiment, the communication device further includes a plurality of second antennas disposed on the frame and corresponding to the second receiving space.

[0019] In one embodiment, the communication device further includes an outer cover connected to a heat dissipation housing component, with the heat-conducting component, heat dissipation base, and communication module enclosed between the outer cover and the heat dissipation housing component.

[0020] In the communication device of this embodiment, a heat-conducting element, a heat-dissipating base, and a communication module are enclosed between an outer casing and a heat-dissipating housing. Therefore, when the communication device is installed outdoors, the outer casing and heat-dissipating housing provide excellent waterproof and dustproof performance, improving the lifespan and reliability of the communication device. Furthermore, the heat generated by the communication module is effectively transferred to the heat-dissipating housing by the heat-dissipating base and the heat-conducting element, and then dissipated by the heat-dissipating housing, resulting in excellent heat dissipation. In this embodiment, the communication module is thermally connected to the heat-conducting element via the heat-dissipating base and is adapted to rotate relative to the heat-conducting element, thus simultaneously meeting design requirements such as signal adjustment and heat dissipation. Attached Figure Description

[0021] Figure 1 A perspective view of a communication device according to an embodiment of the present invention is shown.

[0022] Figure 2 This invention illustrates a portion of the internal structure of a communication device according to an embodiment of the invention.

[0023] Figure 3 This diagram shows an exploded view of some components of the communication device according to an embodiment of the present invention.

[0024] Figure 4 This invention illustrates the detailed structure of a heat dissipation base according to an embodiment of the present invention.

[0025] Figure 5 This illustrates a thermally conductive material according to an embodiment of the present invention.

[0026] Figure 6A This invention illustrates an electric motor according to an embodiment of the present invention.

[0027] Figure 6B This invention illustrates a motor mounting bracket according to an embodiment of the present invention.

[0028] Figure 7 This illustrates a thermal pad according to an embodiment of the present invention.

[0029] Explanation of key component symbols:

[0030] C Communication Device

[0031] 11. Outer Cover

[0032] 12 Heat dissipation housing components

[0033] 121 Inner Surface

[0034] 122 Outer surface

[0035] 123 Second heat dissipation fin

[0036] 3 Thermal conductive components

[0037] 31 Connecting rod

[0038] 32 heat pipes

[0039] 4 Heat dissipation base

[0040] 401 First base surface

[0041] 402 Second base surface

[0042] 41 Pivot groove

[0043] 421 First O-ring

[0044] 422 Second O-ring

[0045] 431 First Seal

[0046] 432 Second seal

[0047] 44 Thermal conductive materials

[0048] 451 First landing section

[0049] 452 Second landing section

[0050] 46 Connecting slots

[0051] 47 First heat dissipation fin

[0052] 49 Limiting cover

[0053] 51 Communication Module

[0054] 52 Circuit Board

[0055] 53 Limiting plate

[0056] 61 Electric motor

[0057] 611 Shaft

[0058] 62 Thermal pad

[0059] 63 First Antenna

[0060] 64 Second Antenna

[0061] 68 screws

[0062] 69 Motor mounting bracket

[0063] 7 Frame

[0064] 71 First Accommodation Space

[0065] 72 Second Accommodation Space

[0066] Z-axis Detailed Implementation

[0067] Figure 1 A perspective view of a communication device according to an embodiment of the present invention is shown. Figure 2 This invention illustrates a portion of the internal structure of a communication device according to an embodiment of the invention. Figure 3 This shows an exploded view of some components of a communication device according to an embodiment of the present invention. (See also: [Reference Material]) Figure 1 , Figure 2 , Figure 3 The communication device C of this embodiment includes an outer cover 11, a heat dissipation housing 12, a heat-conducting element 3, a heat dissipation base 4, and a communication module 51. The heat-conducting element 3 is thermally connected to the heat dissipation housing 12. The heat dissipation base 4 is pivotally connected to the heat-conducting element 3. The heat dissipation base 4 is thermally connected to the heat-conducting element 3 and is adapted to pivot relative to the heat-conducting element 3 between a first orientation and a second orientation. The communication module 51 is fixedly attached to the heat dissipation base 4. The outer cover 11 is connected to the heat dissipation housing 12, and the heat-conducting element 3, the heat dissipation base 4, and the communication module 51 are enclosed between the outer cover 11 and the heat dissipation housing 12.

[0068] In one embodiment, the heat dissipation housing may be made of aluminum or other thermally conductive metals, and the above disclosure does not limit the present invention.

[0069] Figure 4 This illustrates the detailed structure of the heat dissipation base according to an embodiment of the present invention. See reference. Figure 2 , Figure 4 In one embodiment, the heat dissipation base 4 includes a first base surface 401, a second base surface 402, and a pivot groove 41. The first base surface 401 is opposite to the second base surface 402. The communication module 51 is disposed on the first base surface 401, and the pivot groove 41 is formed on the second base surface 402. The heat conduction element 3 includes a connecting rod 31, which is at least partially disposed within the pivot groove 41.

[0070] Matching reference Figure 3 , Figure 4 In one embodiment, the communication device further includes a limiting cover 49, which is fixed to the heat dissipation base 4 to cover the pivot groove 41 and limit the connecting rod 31 within the pivot groove 41.

[0071] Matching reference Figure 3 , Figure 4In one embodiment, the communication device further includes a heat-conducting material (not shown), a first O-ring 421, a second O-ring 422, a first seal 431, and a second seal 432. The first O-ring 421, the second O-ring 422, the first seal 431, and the second seal 432 are sleeved on the connecting rod 31. The first O-ring 421 and the first seal 431 are located at one end of the pivot groove 41, and the second O-ring 422 and the second seal 432 are located at the other end of the pivot groove 41. The heat-conducting material (not shown) is filled into the pivot groove 41 and located between the first seal 431 and the second seal 432.

[0072] In one embodiment, the O-ring and seal can also be replaced by a ball bearing, and the above disclosure does not limit the invention.

[0073] Figure 5 This illustrates a thermally conductive material according to an embodiment of the present invention. (Refer to...) Figure 5 In this embodiment of the invention, the thermally conductive material 44 is a soft material, such as thermal paste, which is filled in the pivot groove 41 and surrounds the connecting rod 31 to provide a thermal conductivity effect. The first O-ring 421, the second O-ring 422, the first seal 431, and the second seal 432 provide a sealing effect to prevent the thermally conductive material 44 from overflowing.

[0074] Reference Figure 5 In one embodiment, the heat dissipation base 4 includes a first abutting portion 451 and a second abutting portion 452. The first abutting portion 451 abuts against a first O-ring 421, and the second abutting portion 452 abuts against a second O-ring 422.

[0075] Figure 6A An electric motor according to an embodiment of the present invention is shown. (Refer to...) Figure 6A In one embodiment, the communication device further includes an electric motor 61, wherein the heat dissipation base 4 includes a connecting groove 46, and the electric motor 61 includes a rotating shaft 611, which is inserted into and fixed to the connecting groove 46. The rotating shaft 611 and the connecting rod 31 are located on the same axis Z. In one embodiment, the rotating shaft 611 is fixed to the connecting groove 46 by an adhesive material. Thus, the electric motor 61 can rotate the heat dissipation base 4. Figure 6B This illustrates a motor mounting bracket according to an embodiment of the present invention. See also: [Reference Material] Figure 6A , Figure 6B In one embodiment, the electric motor 61 is secured to the motor mounting bracket 69 by screws 68. The motor mounting bracket 69 is secured to the frame 7 by screws. Thus, the electric motor 61 is fixed while the heat sink base 4 can rotate, causing the heat sink base 4 to rotate relative to the frame 7.

[0076] In embodiments of the present invention, the electric motor rotates the heat dissipation base, thereby adjusting the orientation of the communication module to improve signal transmission performance. In one embodiment, the communication device may be equipped with computing software and a processor, the processor controlling the rotation of the electric motor to automatically adjust the transmission performance of the communication module to the optimal state. In another embodiment, the electric motor may be omitted, and the user manually adjusts the orientation of the communication module. The above disclosure does not limit the present invention.

[0077] Reference Figure 3 In one embodiment, the heat dissipation base 4 includes a plurality of first heat dissipation fins 47 formed on the surface 402 of the second base.

[0078] Figure 7 This illustrates a thermal pad according to an embodiment of the present invention. See also: [Matching Reference] Figure 4 , Figure 7 In one embodiment, the communication device further includes a thermal pad 62, wherein the thermal conductive element 3 includes a heat pipe 32, the thermal pad 62 is disposed on an inner surface 121 of the heat dissipation housing 12, and the heat pipe 32 of the thermal conductive element 3 contacts the thermal pad 62.

[0079] Reference Figure 3 In one embodiment, the heat dissipation housing 12 includes a plurality of second heat dissipation fins 123 formed on an outer surface 122 of the heat dissipation housing 12, which is opposite to the inner surface 121.

[0080] Matching reference Figure 2 , Figure 3 , Figure 4 In one embodiment, the communication device C further includes a circuit board 52, a limiting plate 53, and the aforementioned frame 7. The circuit board 52 is fixed to the frame 7, and the limiting plate 53 is fixed to the circuit board 52. The limiting plate 53 pushes against the heat-conducting component 3 so that the heat-conducting component 3 fully contacts the aforementioned heat-conducting pad. The frame 7 can be fixed to the aforementioned outer cover 11 or heat dissipation housing 12. The above disclosure does not limit the present invention.

[0081] Reference Figure 2 In one embodiment, the frame 7 defines a first accommodating space 71 and a second accommodating space 72, the heat dissipation base 4 and the communication module 51 are disposed in the first accommodating space 71, and the circuit board 52 corresponds to the second accommodating space 72.

[0082] Reference Figure 2 In one embodiment, the communication device C further includes a plurality of first antennas 63, which are disposed on the frame 7 and correspond to the first accommodating space 71.

[0083] In one embodiment, the communication device further includes a plurality of second antennas 64 disposed on the frame 7 and corresponding to the second accommodating space 72. In one embodiment, the transmission frequency bands of the first antennas 63 and the second antennas 64 are different from the transmission frequency band of the communication module. For example, the communication module can be used to transmit 5G signals (e.g., mmWave signals, Sub-6 signals), while the first antennas 63 and the second antennas 64 can be used to transmit 4G signals (e.g., LTE signals). The above disclosure does not limit the invention.

[0084] In the communication device of this embodiment, a heat-conducting element, a heat-dissipating base, and a communication module are enclosed between an outer casing and a heat-dissipating housing. Therefore, when the communication device is installed outdoors, the outer casing and heat-dissipating housing provide excellent waterproof and dustproof performance, improving the lifespan and reliability of the communication device. Furthermore, the heat generated by the communication module is effectively transferred to the heat-dissipating housing by the heat-dissipating base and the heat-conducting element, and then dissipated by the heat-dissipating housing, resulting in excellent heat dissipation. In this embodiment, the communication module is thermally connected to the heat-conducting element via the heat-dissipating base and is adapted to rotate relative to the heat-conducting element, thus simultaneously meeting design requirements such as signal adjustment and heat dissipation.

[0085] Although the present invention has been disclosed above with reference to specific preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the appended claims.

Claims

1. A communication device, the communication device comprising: A heat dissipation housing component; A heat-conducting component that is thermally connected to the heat dissipation housing component; A heat dissipation base is pivotally connected to the heat-conducting component, wherein the heat dissipation base is thermally connected to the heat-conducting component, and the heat dissipation base is adapted to pivot relative to the heat-conducting component between a first orientation and a second orientation; A communication module is fixedly attached to the heat dissipation base; The heat dissipation base includes a first base surface, a second base surface, and a pivot groove. The first base surface is opposite to the second base surface. The communication module is disposed on the first base surface, and the pivot groove is formed on the second base surface. The heat-conducting component includes a connecting rod, which is at least partially disposed within the pivot groove.

2. The communication device as claimed in claim 1, further comprising a limiting cover fixed to the heat dissipation base to cover the pivot groove and limit the connecting rod within the pivot groove.

3. The communication device as claimed in claim 2, further comprising a thermally conductive material, a first O-ring, a second O-ring, a first seal, and a second seal, wherein the first O-ring, the second O-ring, the first seal, and the second seal are sleeved on the connecting rod, the first O-ring and the first seal are disposed at one end of the pivot groove, the second O-ring and the second seal are disposed at the other end of the pivot groove, and the thermally conductive material is filled into the pivot groove and located between the first seal and the second seal.

4. The communication device as claimed in claim 3, wherein, The heat dissipation base includes a first abutting portion and a second abutting portion, the first abutting portion abutting against the first O-ring, and the second abutting portion abutting against the second O-ring.

5. The communication device as claimed in claim 1, further comprising an electric motor, wherein, The heat dissipation base includes a connecting groove, and the electric motor includes a rotating shaft that is inserted into and fixed to the connecting groove. The rotating shaft and the connecting rod are located on the same axis.

6. The communication device as claimed in claim 1, wherein, The heat dissipation base includes a plurality of first heat dissipation fins formed on the surface of the second base.

7. The communication device as claimed in claim 1, further comprising a thermally conductive pad, wherein, The thermal pad is disposed on an inner surface of the heat dissipation housing, and the thermal conductive element contacts the thermal pad.

8. The communication device as claimed in claim 7, wherein, The heat dissipation housing includes a plurality of second heat dissipation fins formed on an outer surface of the heat dissipation housing, which is opposite to the inner surface.

9. The communication device as claimed in claim 1, wherein, The heat-conducting component includes a heat pipe, and the communication module includes a millimeter-wave array antenna module.

10. The communication device of claim 7, further comprising a circuit board, a limiting plate, and a frame, wherein the circuit board is fixed to the frame, the limiting plate is fixed to the circuit board, and the limiting plate pushes against the heat-conducting element to ensure that the heat-conducting element fully contacts the heat-conducting pad.

11. The communication device as claimed in claim 10, wherein, The frame defines a first accommodating space and a second accommodating space, with the heat dissipation base and the communication module disposed in the first accommodating space, and the circuit board corresponding to the second accommodating space.

12. The communication device of claim 11, further comprising a plurality of first antennas disposed on the frame and corresponding to the first accommodating space.

13. The communication device of claim 12, further comprising a plurality of second antennas disposed on the frame and corresponding to the second receiving space.

14. The communication device of claim 1, further comprising an outer cover connected to the heat dissipation housing, wherein the heat-conducting element, the heat dissipation base, and the communication module are enclosed between the outer cover and the heat dissipation housing.

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