Thermal control system for media streaming devices and associated media streaming devices

Abstract

This document describes a thermal control system integrated into a media streaming device. The thermal control system comprises a heat diffuser and a combination of materials with high thermal conductivity. The thermal control system can diffuse, transfer, and dissipate energy from the thermal loading conditions implemented on the media streaming device to concurrently maintain the temperature of multiple hot zones above or inside the media streaming device at or below multiple corresponding specified temperature thresholds.

Description

[0001] Cross-referencing of related applications

[0002] This application claims the benefit of U.S. Patent Application No. 17 / 035,238, filed on September 28, 2020, which is incorporated herein by reference in its entirety. Background Technology

[0003] Media streaming devices are widely used to wirelessly stream media to auxiliary electronic devices. As an example, a media streaming device can receive data from a media service provider via a wireless local area network (WLAN) and convert that data to stream video and audio content to a television with a display and speakers. In this case, as an example of an early media streaming device, the integrated circuit (IC) components might emit heat loads approaching 2.5 watts (W). To manage these heat loads, the media streaming device may include a thermal control system that keeps the hot zones of the media streaming device at or below a single, predetermined temperature threshold. Such a thermal control system may include a single dedicated heat diffuser made of stainless steel material up to 1.0 millimeter (mm) thick.

[0004] Media streaming devices can include High Definition Multimedia Interface (HDMI) hardware and integrated circuit (IC) devices, which provide more advanced functionality than simply receiving and converting data to stream video and audio content. In this example, a SoC IC device might radiate hot-load conditions approaching 4.0W on a media streaming device.

[0005] A thermal control system, including a single dedicated heat diffuser made of stainless steel, can have several drawbacks in managing such hot-load conditions. As a first example drawback, appropriately sized thick stainless steel heat diffusers to dissipate up to 4.0W of heat could result in the streaming device having suspended weights that could damage the structure used to connect the streaming device to auxiliary electronics (e.g., the streaming device's Universal Serial Bus (USB) port, the streaming device's HDMI connector / structure, and the auxiliary electronics's HDMI port). As a second example drawback, the thermal control system could cause uneven heat diffusion and transfer within the streaming device, resulting in hot spots that could lead to (i) damage to one or more IC devices within the streaming device, and (ii) the surface of one or more housing components of the streaming device exceeding specified ergonomic touch temperature limits. Summary of the Invention

[0006] This paper describes a thermal control system integrated into a media streaming device. The thermal control system comprises a heat diffuser and a combination of materials with high thermal conductivity. The thermal control system can diffuse, transfer, and dissipate energy from the thermal loading conditions implemented on the media streaming device to concurrently maintain the temperature of multiple hot zones above or inside the media streaming device at or below a specified temperature threshold.

[0007] In some aspects, a thermal control system for a media streaming device and an associated media streaming device are described. The thermal control system includes a first thermal control subsystem having a first graphite sheet fixed to a first generally concave inner surface of a first housing assembly and a first heat diffuser separated from the first graphite sheet by a first air gap. The first thermal control subsystem further includes a first thermal interface material (TIM) located between the first heat diffuser and a first IC device mounted to a first generally planar surface of a PCB.

[0008] The thermal control system further includes a second thermal control subsystem having a second graphite sheet fixed to a second generally concave inner surface of the second housing assembly, wherein the second generally concave inner surface of the second housing assembly faces the first generally concave inner surface of the first housing assembly. The second thermal control subsystem further includes a second heat diffuser separated from the second graphite sheet by a second air gap. A second thermal interface material is located between the second heat diffuser and a second IC device, which is mounted to a second surface of the PCB opposite to the first surface of the PCB.

[0009] In other aspects, a media streaming device is described. The media streaming device includes a housing having a first housing assembly coupled to a second housing assembly. The media streaming device also includes a SoC IC device mounted to a first surface of a printed circuit board (PCB) positioned within the housing. A thermal control system, also positioned within the housing, is configured to maintain a temperature throughout the media streaming device during thermal loading conditions. During thermal loading conditions, the thermal control system concurrently maintains (i) a first temperature of a first hot zone including the SoC IC device at or below a first predetermined temperature threshold, (ii) a second temperature of a second hot zone including a second surface of the PCB at or below a second predetermined temperature threshold, (iii) a third temperature of a third hot zone including a first outer surface of the first housing assembly at or below a third predetermined temperature threshold, and (iv) a fourth temperature of a fourth hot zone including a second outer surface of the second housing assembly at or below a fourth predetermined temperature threshold.

[0010] Details of one or more embodiments are set forth in the accompanying drawings and the following description. Other features and advantages will be apparent from the description, drawings, and claims. This summary is provided to introduce the subject matter further described in the detailed embodiments. Therefore, the reader should not regard the summary as a description of essential features or as limiting the scope of the claimed subject matter. Attached Figure Description

[0011] The following describes in detail one or more aspects of a thermal control system for a media streaming device. The same reference numerals are used in different instances in the description and accompanying drawings to indicate similar elements:

[0012] Figure 1 The illustration shows the operating environment of an example media streaming device connected to a television.

[0013] Figure 2 An exploded isometric view of an example media streaming device is shown, based on one or more aspects.

[0014] Figure 3 The illustration shows a cross-sectional view of an example media streaming device with a thermal control system.

[0015] Figure 4 The illustration shows a top view of an example graphite sheet fixed to the inner surface of a housing assembly.

[0016] Figure 5 The illustration shows a top view of another example graphite sheet being fixed to the inner surface of another housing assembly.

[0017] Figure 6 The illustration shows a top view of the housing assembly, including an example of the thermal effect of a heat diffuser located near the housing assembly.

[0018] Figure 7 The illustration shows a cross-sectional view of a media streaming device, including an example thermal stack configuration of a thermal control system.

[0019] Figure 8 The illustration shows a cross-sectional view of a media streaming device, including another example of a thermal stack configuration for a thermal control system.

[0020] Figure 9 The illustration shows example details of multiple hot zones on a cross-media streaming device. Detailed Implementation

[0021] This paper describes a thermal control system integrated into a media streaming device. The thermal control system is lightweight and comprises a combination of heat diffusers and low thermal resistance materials. The thermal control system can diffuse, transfer, and dissipate energy from the thermal loading conditions implemented on the media streaming device to concurrently maintain the temperature of multiple hot zones above or inside the media streaming device at or below multiple corresponding specified temperature thresholds.

[0022] Although the features and concepts of the thermal control system described can be implemented in any number of different environments and devices, the aspects are described in the context of the following description and examples.

[0023] Typically, heat transfer is the transfer of energy due to a temperature difference. If there are one or more temperature differences between components across a system—such as a media streaming device—heat (e.g., energy in joules (J)) will be transferred from the higher temperature region to the lower temperature region to reduce the temperature difference. Several mechanisms exist between components across a system for heat transfer to minimize the temperature difference, including convection, radiation, and conduction.

[0024] Convection or heat transfer from a surface due to the movement of molecules within fluids—such as gases and liquids—can be quantified by the following equation (1):

[0025] q conv =hA(T s -T ∞ (1)

[0026] For equation (1), q conv T represents the rate of heat transfer from the surface via convection (e.g., in J or watts (W) per second), h represents the convective heat transfer coefficient (e.g., in W per square meter (W / m²), and T represents the heat transfer rate via convection. s The surface temperature is expressed (e.g., in Kelvin (K) or degrees Celsius (°C), and T ∞ The term A represents the temperature of the fluid to which the surface is exposed (e.g., in Kelvin or °C). Term A represents the area of ​​the surface (e.g., in m²). 2 (Unit: )

[0027] Heat transfer from a surface via radiation or electromagnetic radiation can be quantified by the following equation (2):

[0028]

[0029] For equation (2), q rad ε represents the rate of heat transfer through radiation (e.g., in W), ε represents emissivity (dimensionless), and σ represents the Stefen-Boltzmann constant (e.g., σ = 5.67 x 10⁻⁶). -8W / (m 2 ·K 4 )), T s The temperature of the surface is expressed (e.g., in K or °C), and T surr This indicates the temperature surrounding the surface (e.g., in Kelvin or °C). Term A indicates the area of ​​the surface (e.g., in m²). 2 (Unit: )

[0030] The conduction or heat transfer through solids via atomic and molecular activity can be quantified by the following equation (3):

[0031]

[0032] For equation (3), q cond The term dT / dx represents the rate of heat transfer through conduction in a solid material (e.g., in W), k represents the high thermal conductivity of the solid material (e.g., in W / (m·K)), and dT / dx represents the temperature gradient through the solid material (e.g., in K / m or ℃ / m). The term A represents the cross-sectional area of ​​the solid material (e.g., in m³ / s). 2 (Unit: )

[0033] Media streaming devices may include a thermal control system that uses one or more of the mechanisms described above to transfer heat. Typically, and according to equations (1) and (2), the rate and / or amount of heat transfer can be altered by increasing or decreasing the surface area of ​​convection and / or radiation within the media streaming device (e.g., increasing or decreasing the surface area of ​​heat diffusion mechanisms).

[0034] According to equation (3) and within the thermal control system, the rate and / or amount of heat transfer can also be altered by introducing one or more TIMs with high thermal conductivity between the surfaces. By carefully implementing the heat diffuser and using TIMs with high thermal conductivity, the thermal control system can concurrently maintain the temperature of different thermal zones at or below different specified temperature thresholds during thermal loading conditions.

[0035] As described above, through conduction, convection, and radiation, the thermal control system can transfer heat (e.g., energy) originating from within the media streaming device to the housing assembly (e.g., the outer skin) for dissipation to the external environment via convection and / or radiation. Typically, with improvements in the quality of the thermal control system, the temperature variation across the surface of the housing assembly decreases. This quality is quantified by a dimensionless quantity called the thermal diffusivity (CTS) and can be given by the following equation (4):

[0036]

[0037] For equation (4), CTS is a dimensionless measure ranging from 0 to 1. This equation represents the ratio of the average temperature rise on the surface to the peak temperature rise on the surface, where T can be measured in K or °C. ave (e.g., average temperature across the surface), T max (e.g., the highest temperature at a certain location on a surface) and T ambient (For example, ambient temperature). As the quality of thermal control systems improves, this ratio approaches one.

[0038] As a comparative example, a thermal control system for a media streaming device (as previously described) can result in a CTS of approximately 0.50. However, as discussed herein, a thermal control system can result in a CTS closer to approximately 0.90.

[0039] Figure 1 The illustration depicts an operating environment 100 with an example media streaming device 102 connected to a television 104. Although illustrated as connected to a television 104, the media streaming device 102 can be connected to other types of devices with display and / or audio capabilities (e.g., tablets, laptops, laptops, computing devices, projectors).

[0040] In operating environment 100, multiple IC devices are generating internal heat load 106 (e.g., q) within media streaming device 102. i As an example, the internal heat load 106 can be generated at a rate of up to 4W within a media streaming device.

[0041] In addition to the SoC IC device, the multiple IC devices may also include memory IC devices and / or wireless communication IC devices (e.g., wireless communication IC devices for wireless communication according to the IEEE 802.11 wireless communication protocol (Wi-Fi), 5G New Radio (5GNR) protocol, etc.). The combination of multiple IC devices can be HDMI hardware as part of the media streaming device 102, supporting interaction with multiple streaming applications, supporting wireless connectivity across different wireless communication protocols, interacting with remote controls, and executing an operating system to control digital media players, set-top boxes, soundbars, and / or televisions.

[0042] The media streaming device 102 includes a thermal control system 108. The thermal control system 108 includes a SoC IC device thermal control subsystem 110 and other IC device thermal control subsystems 112. The SoC IC device thermal control subsystem 110 may be a first thermal control subsystem that is in thermal contact with the SoC IC device of the media streaming device 102. The other IC device thermal control subsystem 110 may be a second thermal control subsystem that is in thermal contact with other IC devices (e.g., memory IC devices, wireless communication IC devices, etc.) of the media streaming device 102.

[0043] Typically, the thermal control system 108 (e.g., a SoC IC device thermal control subsystem 110 combined with other IC device thermal control subsystems 112) can diffuse and transfer energy from thermal loading conditions (e.g., internal heat load 106) implemented on the media streaming device 102 to concurrently maintain the temperature of multiple hot zones within the media streaming device 102 at or below multiple corresponding temperature thresholds. The thermal control system 108 can transfer heat through multiple surfaces of the media streaming device 102 for external dissipation. For example, and in some instances, the heat 114 dissipated externally through two surfaces of the media streaming device can be equal to the internal head load (e.g., q). ds1 +q ds2 =q i ).

[0044] Figure 2 The diagram shows... Figure 1 An exploded isometric view 200 of a media streaming device 102. The media streaming device 102 includes a SoC IC device 202 mounted to a first surface 204 of a PCB 206. The SoC IC device 202 may include processing data to render video and / or audio content for streaming to a television (e.g., Figure 1 The SoC IC device 202 may contribute to internal heat load 106 as part of processing data to render video and / or audio content. The PCB 206 includes a second surface 208, one or more other IC devices (e.g., in the television 104). Figure 2 Wireless communication IC devices, memory IC devices, passive resistors and / or capacitor IC devices (not visible in the image) are mounted on the second surface 208.

[0045] The media streaming device 102 further includes a first housing assembly 210 and a second housing assembly 212. The second housing assembly 212 is generally complementary to the first housing assembly 210. Typically, the first housing assembly 210 and the second housing assembly 212 can be joined to form an assembly housing for the media streaming device 102. The shape of the media streaming device 102 (e.g., when the first housing assembly 210 and the second housing assembly 212 are joined to form the assembly housing) can be an oblate spheroid.

[0046] Media streaming device 102 includes a thermal control system 108 having two thermal control subsystems (e.g., a SoC IC device thermal control subsystem 110 and a other IC device thermal control subsystem 112). The SoC IC device thermal control subsystem 110 may include a combination of heat diffusers and low thermal resistance materials for concurrently diffused and transferred energy (e.g., heat) throughout the media streaming device 102 for eventual dissipation. Figure 2 As shown, the SoC IC device thermal control subsystem 110 includes a first graphite sheet 214 adhered to a first generally concave inner surface 216 of the first housing assembly 210. The SoC IC device thermal control subsystem 110 also includes a first heat diffuser 218 and one or more first TIMs 220. In some instances, at least one of the first TIMs 220 may be located between and in thermal contact with the SoC IC device 202 and the first heat diffuser 218. Furthermore, and in some instances, the first heat diffuser 218 may include flanges, holes, and / or pins to align the first heat diffuser 218 with the PCB 206. Additionally, the first heat diffuser 218 may include one or more sub-assemblies (e.g., multiple conductive elements combined to render the first heat diffuser 218).

[0047] Other IC device thermal control subsystem 112 may include another combination of a heat diffuser and a low thermal resistance material for concurrently diffusing and transferring energy (e.g., heat) throughout the media streaming device 102 for eventual dissipation. Other IC device thermal control subsystem 112 may include a second graphite sheet 222 adhered to a second generally concave inner surface 224 of the second housing assembly 212. Other IC device thermal control subsystem 112 also includes a second heat diffuser 226 and one or more second TIMs 228. In some instances, at least one of the second TIMs 228 may be located within the IC device (…). Figure 1(Not shown in the image) and the second heat diffuser 226. Additionally, and in some instances, the second heat diffuser 226 may include flanges, holes, and / or pins to align the second heat diffuser 226 with the PCB 206. Furthermore, in some instances, the second heat diffuser 226 may include one or more sub-assemblies (e.g., multiple conductive elements combined to render the second heat diffuser 226).

[0048] Typically, the thermal control system 108 dissipates energy (e.g., from convective and radiative heat transfer modes) throughout the media streaming device 102. Figure 1 The heat of the internal heat load 106 is eventually dissipated into the surrounding environment. Dissipation can occur through the first outer surface 230 of the first housing assembly 210 or through the second outer surface 232 of the second housing assembly 212 or through both the first outer surface 230 of the first housing assembly 210 and the second outer surface 232 of the second housing assembly 212.

[0049] Figure 3 The illustration shows a cross-sectional view 300 of an example media streaming device including components of a thermal control system. The media streaming device can be... Figure 1 Media streaming device 102.

[0050] The thermal control system includes a first air gap 302 and a second air gap 304. Typically, the first air gap 302 and the second air gap 304 contribute to the thermal resistance within the thermal control system.

[0051] exist Figure 3 In this configuration, a first graphite sheet 214 is attached to a first generally concave inner surface 216 of a first housing assembly 210. The first housing assembly 210 may include a plastic material. In some instances, the first graphite sheet 214 may be a hybrid graphite sheet comprising a stack of one or more films, each film comprising a graphite material, a pressure-sensitive adhesive (PSA) material, or a polyethylene terephthalate (PET) material.

[0052] As shown in the figure, a first air gap 302 is located between the first graphite sheet 214 and the first heat diffuser 218. Furthermore, as shown, a first thermally conductive membrane (TIM) 220 is located between and in thermal contact with the first heat diffuser 218 and the SoC IC device 202. By reducing the air gap and / or bond line gap at the respective surfaces of the SoC IC device 202 and the first heat diffuser 218, the first TIM 220 improves thermal conductivity and enhances the efficiency and effectiveness of heat exchange between the SoC IC device 202 and the first heat diffuser 218.

[0053] In some instances, the first TIM 220 may include a first thermal gel material (e.g., a thermally conductive gel material) comprising a silicone rubber material infused with nanoparticles such as aluminum nanoparticles. In other instances, the first TIM 220 may include a thermally conductive pad material comprising a pre-formed solid material based on silicone or paraffin.

[0054] In some instances, the first heat diffuser 218 may be enhanced using one or more first recesses 306 that can mitigate hot spots. In some instances, the first heat diffuser 218 may be formed of aluminum material with a thickness of less than or equal to 0.20 mm.

[0055] like Figure 3 As shown, the first heat diffuser 218 includes a first recess 306 on one surface (e.g., the surface facing the first graphite sheet 214) and a corresponding first protrusion 308 formed on the opposite surface (e.g., the surface facing the PCB 206). When the first protrusion 308 comes into thermal contact with the first TIM 220, the first recess 306 forms a cavity with an opening exposed to (and facing) the first graphite sheet 214. The area of ​​the first protrusion 308 in thermal contact with the first TIM 220 may be approximately equal to or larger than another area corresponding to the surface area of ​​the first TIM 220.

[0056] If the first heat diffuser 218 includes a first recess 306, the origin of heat convection and / or radiation from the first heat diffuser 218 to the first graphite sheet 214 can be changed from a focal region (e.g., a “hot spot” corresponding to a surface area of ​​the SoC IC device 202) to an annular ring (e.g., a “thermal ring”) having an area larger than the focal region area. In some instances, this can improve heat transfer to and through the first graphite sheet 214 to improve the efficiency of heat transfer from the first graphite sheet 214 to the first housing assembly 210.

[0057] In some instances, the first heat diffuser 218 may be integrated as part of a first electromagnetic interference (EMI) shielding structure 310 located within the media streaming device 102. In such an instance, a first thermally conductive foam material 312 may be located between and in thermal contact with another part of the first heat diffuser 218 and the first EMI shielding structure 310. Furthermore, the first heat diffuser 218 may also perform EMI shielding (complementing the heat diffuser function). Typically, by integrating the first heat diffuser 218 as part of the first EMI shielding structure 310, the suspended weight of the media streaming device 102 can be reduced.

[0058] Figure 3A second graphite sheet 222 is also shown attached to a second generally concave inner surface 224 of the second housing assembly 212. The second housing assembly 212 may include a plastic material. In some instances, the second graphite sheet 222 may be a hybrid graphite sheet comprising a stack of one or more films, said one or more films comprising a graphite material, a PSA material, or a PET material.

[0059] As shown in the figure, a second air gap 304 is located between the second graphite sheet 222 and the second heat diffuser 226. Further, a second TIM 228 is located between and in thermal contact with the second heat diffuser 226 and the IC device 314 (e.g., an IC device other than the SoC IC device 202, such as a memory IC device, a wireless communication IC device, etc.). By reducing the air gap and / or bond line gap at the respective surfaces of the IC device 314 and the second heat diffuser 226, the second TIM 228 improves thermal conductivity and enhances the efficiency and effectiveness of heat exchange between the IC device 314 and the second heat diffuser 226. In some instances, the second TIM 228 may comprise a thermal gel material (e.g., a thermally conductive gel material) comprising a silicone rubber material infused with nanoparticles such as aluminum nanoparticles. In other instances, the second TIM 228 may be a thermally conductive pad comprising a pre-formed solid material based on silicone or paraffin.

[0060] In some instances, the second heat diffuser 226 may be enhanced using one or more second recesses 316, which can transform a "hot spot" into a "heat ring". In some instances, the second heat diffuser 226 may be formed of aluminum material with a thickness of less than or equal to 0.20 mm.

[0061] like Figure 3 As shown, the second heat diffuser 226 includes a second recess 316 on one surface (e.g., the surface facing the second graphite sheet 222) and a corresponding second protrusion 318 formed on the opposite surface (e.g., the surface facing the PCB 206). The second recess 316 forms a cavity with an opening exposed to (and facing) the second graphite sheet 222, while the second protrusion 318 is in thermal contact with the second TIM 228. The area of ​​the second protrusion 318 in thermal contact with the second TIM 228 may be approximately equal to or larger than another area corresponding to the surface area of ​​the second TIM 228.

[0062] If the second heat diffuser 226 includes a second recess 316, the origin of heat convection and / or radiation from the second heat diffuser 226 to the second graphite sheet 222 can be changed from a focal region (e.g., a hot spot corresponding to the surface area of ​​the IC device 314) to an annular ring (e.g., a thermal ring) having an area larger than the focal region area. In some instances, this can improve heat transfer to and through the second graphite sheet 222, thereby improving the efficiency of heat transfer from the second graphite sheet 222 to the second housing assembly 212.

[0063] In some instances, the second heat diffuser 226 can be integrated as part of a second EMI shielding structure 320 located within the media streaming device 102. In such instances, a second thermally conductive foam material 222 can be located between and in thermal contact with another part of the second heat diffuser 226 and the second EMI shielding structure 320. Furthermore, the second heat diffuser 226 can also perform EMI shielding (complementing the heat diffuser function). Typically, by integrating the second heat diffuser 226 as part of the second EMI shielding structure 320, the suspended weight of the media streaming device 102 can be reduced.

[0064] For example Figure 3 The image shows the USB port 322 and the HDMI connector / cable structure 324. Damage to the USB port 322 and / or the HDMI connector / cable structure 324 can be avoided by reducing the suspended weight of the media streaming device 102 (e.g., by integrating the first heat diffuser 218 as part of the first EMI shielding structure 310 and the second heat diffuser 226 as part of the second EMI structure 320).

[0065] Figure 4 The illustration shows a top view 400 of an example graphite sheet being fixed to a housing assembly. The graphite sheet may be a first graphite sheet 214 and may be fixed to... Figure 1 and Figure 2 The inner surface of the first housing assembly 210 (e.g., as Figure 1 and 2 As shown, it is fixed to the first generally concave inner surface 216.

[0066] like Figure 4 As shown, the first graphite sheet 214 may have a first coverage area 402 that does not include the first antenna region 404 of the first housing assembly 210. The first antenna region 404 allows electromagnetic waves (e.g., wireless communication) to be transmitted or received by the antenna of a wireless streaming device without interference from the first graphite sheet 214. Moreover, as... Figure 3As shown, the first coverage area 402 of the first graphite sheet 214 does not include the first structural region 406 of the first housing assembly 210. The first structural region 406 enables the first housing assembly 210 to be fitted to another housing assembly without interference from hardware (screws, fasteners, etc.).

[0067] Figure 5 The illustration shows a top view 500 of another example graphite sheet being fixed to the housing assembly. The graphite sheet may be a second graphite sheet 222 and may be fixed to... Figure 1 and 2 The inner surface of the second housing assembly 212 (e.g., as Figure 1 and 2 As shown, it is fixed to the second generally concave inner surface 224.

[0068] like Figure 5 As shown, the second graphite sheet 222 may have a second coverage area 502 that does not include the second antenna region 504 of the second housing assembly 212. The second antenna region 504 allows electromagnetic waves (e.g., wireless communication) to be transmitted or received by the antenna of a wireless streaming device without interference from the second graphite sheet 222. Moreover, as Figure 5 As shown, the second coverage area 502 of the second graphite sheet 222 does not include the second structural region 506 of the second housing assembly 212. The second structural region 506 enables the second housing assembly to be fitted to another housing assembly without interference from hardware (screws, fasteners, etc.).

[0069] Figure 6 The illustration shows a top view 600 of the first housing assembly 210, including an example thermal effect of a first heat diffuser 218 located near the second housing assembly 212. The first heat diffuser 218 is located within the first housing assembly 210 (e.g., facing the first graphite sheet 214 and the first generally concave inner surface 216 of the first housing assembly 210, as shown). Figure 2 and Figure 3 (As shown).

[0070] As shown in the figure, the first recess 306 (indicated by a hidden dashed line) corresponds to the hot spot 602. Without the first recess 306 being incorporated as part of the first heat diffuser 218, the temperature of the hot spot 602 might exceed a predetermined temperature threshold (e.g., the permissible ergonomic touch temperature) of the first housing assembly 210. However, in some instances, the recess 306 may increase the air gap (e.g., Figure 3 The size of the first air gap 302 is increased to increase thermal resistance and transfer heat from within the recess 306. This can result in an annular region 604 (e.g., a "ring"), which implements a larger heat distribution across the housing assembly 210 to reduce temperature.

[0071] Figure 7 A cross-sectional view 700 of a media streaming device 102 is illustrated, including an example thermal stack configuration of a thermal control system. Typically, the internal thermal stack configuration (e.g., the specific arrangement of energy transfer mechanisms, such as heat diffusers, graphite sheets, TIMS, and / or air gaps) can affect how heat is transferred to the surfaces of the media streaming device 102 (e.g., the first outer surface 230 of the first housing assembly 210 and the second outer surface 232 of the second housing assembly 212) for dissipation to the surrounding environment. Without a proper internal thermal stack configuration, and due to the high power dissipation of some components (e.g., the SoC IC device 202), the temperature of portions of the media streaming device 102 may operate at temperatures higher than other portions of the media streaming device 102 during hot-load conditions. Typically, a symmetrical internal thermal stack configuration within the media streaming device 102 can result in ineffective and inefficient heat transfer from the media streaming device 102.

[0072] As described in equation (4) above, reducing the temperature difference across the outer surface of the media streaming device 102 can improve the efficiency and effectiveness of heat transfer from the media streaming device 102 to the surrounding environment. Reducing the temperature difference across the outer surface improves the CTS of the media streaming device and the heat transfer from the media streaming device.

[0073] like Figure 7 As shown, the internal thermal stack configuration is asymmetrical. A first air gap 302 separates the first heat diffuser 218 and the first graphite sheet 214 by a first distance 702. A second air gap 304 separates the second heat diffuser 226 and the second graphite sheet 222 by a second distance 704. In this example, the first distance 702 may be greater than the second distance 704 to effectively increase the thermal resistance of the heat flow path between the SoC IC device 202 and the first outer surface 230 of the first housing assembly 210. In some instances, this can reduce the heat transfer rate from the SoC IC device 202 to the first housing assembly 210 and increase another heat transfer rate from the SoC IC device 202 to the second housing assembly 212, balancing the temperatures of the outer surfaces of the first housing assembly 210 and the second housing assembly 212 (e.g., the first outer surfaces 230 and 232, respectively).

[0074] Figure 8 A cross-sectional view 800 of a media streaming device 102 is illustrated, including another example thermal stack configuration of a thermal control system. (See diagram 800.) Figure 8 As shown, part of the internal thermal stack configuration includes a first TIM 220, a first heat diffuser 218, and a first graphite sheet 214, which can transfer a certain amount of heat from the SoC IC device 202 to the first outer surface 230 of the first housing assembly 210 for dissipation.

[0075] Figure 8 Another portion of the internal thermal stack configuration is also shown, which includes a second TIM 228, a second heat diffuser 226, a second graphite sheet 222, and one or more third TIMs 802. The one or more third TIMs 802 located between the second heat diffuser 226 and the second graphite sheet 222 can provide a thermal path between the second heat diffuser 226 and the second graphite sheet 222 to effectively reduce the thermal resistance of the heat flow path between the IC device 314 and the second outer surface 232 of the second housing assembly 212. In some instances, this can increase the rate of heat transfer from the SoC IC device 202 to the second housing assembly 212 and reduce the rate of heat transfer from the IC device 314 to the first housing assembly 210, substantially balancing the temperatures of the outer surfaces of the first housing assembly 210 and the second housing assembly 212 (e.g., the first outer surfaces 230 and 232, respectively).

[0076] Figure 9 Example details 900 of multiple hot zones of cross-media streaming device 102 are illustrated. Figure 9 A schematic diagram of a thermal control system 108 is included. Also known as a thermal circuit diagram, this diagram depicts the heat load sources and heat transfer paths within the media streaming device 102. Typically, the thermal control system 108 can diffuse and transfer energy from heat load conditions (e.g., internal heat load 106) implemented on the media streaming device 102 to concurrently maintain the temperature of multiple hot zones within the media streaming device 102 at or below multiple corresponding temperature thresholds.

[0077] Multiple hot zones include a first hot zone 902, which includes a SoC IC device 202. The first hot zone 902 may have a first predetermined temperature threshold corresponding to the permissible junction temperature of a diode within the SoC IC device 202 under thermal loading conditions (e.g., internal heat load 106 dissipates heat at a rate of up to 4W on the media streaming device 102). As an example, the first predetermined temperature threshold may be approximately 95°C. In such an example, a thermal control system 108 may diffuse and transfer energy (e.g., heat) across the media streaming device 102 to maintain the first hot zone 902 at or below the first predetermined temperature threshold (e.g., the junction temperature of the diode within the SoC IC device 202 may be maintained at or below 95°C under thermal loading conditions).

[0078] The multiple hot zones also include a second hot zone 904 having a second surface 208 of the PCB 206. The second hot zone 904 may have a second predetermined temperature threshold, which may be approximately 85°C. In this example, the thermal control system 108 may diffuse and transfer energy (e.g., heat) throughout the media streaming device 102 to maintain the second hot zone 904 at or below the second predetermined temperature threshold (e.g., maintaining the permissible surface temperature of the second surface 208 of the PCB 206 at or below 85°C).

[0079] The third hot zone 906, including the first housing assembly 210, is also part of a plurality of hot zones. The third hot zone 906 may have a third predetermined temperature threshold corresponding to a first permissible ergonomic touch temperature of the first outer surface 230 of the first housing assembly 210. As an example, the third predetermined temperature threshold may be approximately 72°C. In such an example, the thermal control system 108 may concurrently diffuse and transfer energy (e.g., heat) throughout the media streaming device 102 to maintain the third hot zone 906 at or below the third predetermined temperature threshold (e.g., the first permissible ergonomic touch temperature of the first outer surface 230 of the first housing assembly 210 may be maintained at or below 72°C under high heat loading conditions).

[0080] The fourth hot zone 908, including the second housing assembly 212, is also part of a plurality of hot zones. The fourth hot zone 908 may have a fourth predetermined temperature threshold corresponding to a second permissible ergonomic touch temperature of the second outer surface 232 of the second housing assembly 212. As an example, the fourth predetermined temperature threshold may be approximately 72°C. In such an example, the thermal control system 108 may diffuse and transfer energy (e.g., heat) throughout the media streaming device 102 to maintain the fourth hot zone 908 at or below the fourth predetermined temperature threshold (e.g., the second permissible ergonomic touch temperature of the second outer surface 232 of the second housing assembly 212 may be maintained at or below 72°C under high heat loading conditions).

[0081] The thermal control system 108 can simultaneously transfer and diffuse energy (e.g., heat from the internal heat load 106) throughout the media streaming device using convective and radiative heat transfer. Heat can then be dissipated via the first outer surface 230 of the first housing assembly 210 and the second outer surface 232 of the second housing assembly 212. Typically, the thermal control system 108 can simultaneously maintain the temperature of four heat zones (902, 904, 906, 908) at or below corresponding predetermined temperature thresholds. Furthermore, the thermal control system 108 can be a passive thermal control system (e.g., without fans, pumps, or other active heat transfer mechanisms).

[0082] In some instances, and as quantified by equation (4) described above, the effective CTS of the thermal control system 108 can balance the rate of heat dissipation from the first surface (e.g., q). ds1 912) and the rate at which heat dissipates from the second surface (e.g., q) ds2 910), so that the temperature difference between the third hot zone 906 and the fourth hot zone 908 (e.g., the temperature difference between the first outer surface 230 of the first housing assembly 210 and the second outer surface 232 of the second housing assembly 212) can be less than 2°C.

[0083] In some instances, the thermal control system 108 may include elements of the SoC IC device thermal control subsystem 110. For example, the thermal control system 108 may include one or more of a first graphite sheet 214, a first heat diffuser 218, or a first TIM 220.

[0084] In addition, and in some other instances, the thermal control system 108 may include elements of the thermal control subsystem 112 of other IC devices. For example, the thermal control system 108 may include one or more of the following: a second graphite sheet 222, a second heat diffuser 226, or a second TIM 228.

[0085] Although techniques and apparatus for thermal control systems of media streaming devices have been described, it should be understood that the subject matter of the appended claims is not necessarily limited to the specific features or methods described. Rather, specific features and methods are disclosed by way of examples of how thermal control systems for media streaming devices can be implemented.

Claims

1. A media streaming device, comprising: Thermal control system; Printed circuit boards; A first integrated circuit device is mounted on a first surface of the printed circuit board; A second integrated circuit device is mounted on a second surface of the printed circuit board, the second surface of the printed circuit board being opposite to the first surface; as well as The housing includes a first housing assembly and a second housing assembly joined together. The thermal control system includes: The first thermal control subsystem includes: A first graphite sheet is fixed to the first concave inner surface of the first housing assembly; A first heat diffuser, the first heat diffuser being separated from the first graphite sheet by a first air gap; and A first thermal interface material is located between the first heat diffuser and the first integrated circuit device mounted on the first surface of the printed circuit board; and The second thermal control subsystem includes: The second graphite sheet is fixed to the second concave inner surface of the second housing assembly, and the second concave inner surface of the second housing assembly faces the first concave inner surface of the first housing assembly. A second heat diffuser, which is separated from the second graphite sheet by a second air gap; and A second thermal interface material is located between the second heat diffuser and the second integrated circuit device mounted on the second surface of the printed circuit board.

2. The media streaming device according to claim 1, wherein: The first heat diffuser includes a first recess forming a first cavity, the first cavity having a first opening facing the first graphite sheet; as well as The second heat diffuser includes a second recess forming a second cavity, the second cavity having a second opening facing the second graphite sheet.

3. The media streaming device according to claim 2, wherein... The first heat diffuser includes a first recess on one surface facing the first graphite sheet and a corresponding first protrusion formed on the opposite surface facing the printed circuit board and in thermal contact with the first thermal interface material; and The second heat diffuser includes a second recess on one surface facing the second graphite sheet and a corresponding second protrusion formed on the opposite surface facing the printed circuit board and in thermal contact with the second thermal interface material.

4. The media streaming device according to claim 1, wherein, The first graphite sheet or the second graphite sheet includes one or more layers of film, the one or more films including graphite material, pressure-sensitive adhesive material or polyethylene terephthalate material.

5. The media streaming device according to claim 1, wherein, The first graphite sheet is formed around the antenna region of the media streaming device, which allows electromagnetic waves to be transmitted or received by the antenna of the media streaming device without interference from the first graphite sheet.

6. The media streaming device according to claim 1, wherein: The first heat diffuser is integrated as part of a first electromagnetic interference shielding structure surrounding the first integrated circuit device; and The first integrated circuit device is a system-on-a-chip integrated circuit device.

7. The media streaming device according to claim 6, wherein, The first thermally conductive foam is located between the first heat diffuser and the first electromagnetic interference shielding structure.

8. The media streaming device according to claim 6, wherein, The second heat diffuser is integrated as part of the second electromagnetic interference shielding structure.

9. The media streaming device according to claim 6, wherein, The second heat diffuser comprises aluminum material approximately 0.20 mm thick.

10. The media streaming device according to claim 1, wherein, The second graphite sheet has a coverage area that does not include the structural area of ​​the media streaming device and enables the second housing assembly to be assembled to the first housing assembly without interference from the hardware.

11. The media streaming device according to claim 1, wherein, The second graphite sheet includes the latter of one or more films, said one or more films including graphite material, pressure-sensitive adhesive material or polyethylene terephthalate material.

12. The media streaming device according to claim 1, wherein, The first air gap and the second air gap are asymmetrical because the first air gap separates the first heat diffuser and the first graphite sheet by a first distance, while the second air gap separates the second heat diffuser and the second graphite sheet by a second distance different from the first distance.

13. The media streaming device according to claim 1, wherein, The third thermal interface material is located between the first heat diffuser and the first graphite sheet.

14. The media streaming device according to claim 1, wherein, The third thermal interface material is located between the second heat diffuser and the second graphite sheet.

15. The media streaming device according to claim 1, in, The thermal control system is configured to concurrently maintain the temperature throughout the media streaming device during thermal loading conditions, and the thermal control system is located within the housing and configured to concurrently maintain: The first temperature of the first hot zone is at or below a first predetermined temperature threshold, and the first hot zone includes the first integrated circuit device; The second temperature of the second hot zone is at or below a second predetermined temperature threshold, and the second hot zone includes a second surface of the printed circuit board opposite to the first surface of the printed circuit board. The third temperature of the third hot zone is at or below a third predetermined temperature threshold, and the third hot zone includes the first outer surface of the first housing assembly; as well as The fourth temperature of the fourth hot zone is at or below a fourth predetermined temperature threshold, and the fourth hot zone includes the second outer surface of the second housing assembly.

16. The media streaming device according to claim 15, wherein, The media streaming device is an oblate spheroid.

17. The media streaming device according to claim 16, wherein, The first specified temperature threshold corresponds to the allowable junction temperature of the system-on-chip integrated circuit device, wherein the allowable junction temperature of the system-on-chip integrated circuit device is at or below 95°C.

18. The media streaming device according to claim 16, wherein, The second specified temperature threshold corresponds to the allowable surface temperature of the second surface of the printed circuit board opposite to the first surface, wherein the allowable surface temperature of the second surface of the printed circuit board is at or below 85°C.

19. The media streaming device according to claim 16, wherein, The third specified temperature threshold corresponds to the first permissible ergonomic touch temperature of the first outer surface of the first housing assembly, wherein the first permissible ergonomic touch temperature is at or below 72°C.

20. The media streaming device according to claim 16, wherein, The fourth specified temperature threshold corresponds to the second permissible ergonomic touch temperature of the second outer surface of the second housing assembly, which is at or below 72°C.

21. The media streaming device according to claim 16, wherein, The media streaming device further includes a High Definition Multimedia Interface (HDMI) connector and a Universal Serial Bus (USB) connector.

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