NC data generation method, NC data generation device and component installation system

Abstract

The method for generating NC data includes: an LED configuration setting step, in which LED chips installed at a plurality of mounting points arranged in a grid shape on a substrate are set in association with a reel loaded into a tape feeder; an area setting step, in which a plurality of unit areas are set on the substrate; a brightness calculation step, in which an average brightness of the LED chip is calculated for each of the plurality of unit areas; and a configuration adjustment step, in which, when the average brightness of the LED chip exists in a unit area outside a predetermined range, at least one of the LED chips in the area outside the predetermined range is changed, thereby finally determining the LED chip installed at the mounting point. In the LED configuration setting step, the LED chips installed at each mounting point are set in such a way that the LED chips supplied from the same reel are not adjacent in the vertical direction, the horizontal direction, and the diagonal direction. In the configuration adjustment step, at least one of the plurality of LED chips is changed to an LED chip of a reel different from the reel supplying the LED chip.

Description

Technical Field

[0001] The present invention relates to a method for generating NC data suitable for a component mounting device, an NC data generating device for generating the NC data, and a component mounting system. The component mounting device produces an LED substrate on which a plurality of LED (Light Emitting Diode) chips are mounted in a grid pattern. Background Art

[0002] LED mounting substrates are used in various lighting devices. In the LED mounting substrates, a plurality of LED chips are mounted on the substrate in a grid shape and at a high density. The LED mounting substrates can be efficiently produced by a component mounting device. In the component mounting device, the LED chips are supplied by a tape feeder. The mounting head absorbs the LED chips and transports and mounts them on the substrate.

[0003] Even if the LED chips are of the same type, the brightness of each chip will vary. If LED chips of the same brightness are concentrated and mounted in a specific area of ​​the substrate, it will cause uneven brightness and reduce the light quality of the lighting device. Therefore, it is necessary to pay attention to this point.

[0004] For example, a method for mounting LED chips in view of the above problem is disclosed in Patent Document 1. Specifically, Patent Document 1 discloses that LED chips supplied from the same tape feeder (same reel) are mounted so as not to be adjacent to each other in any of the vertical, horizontal, and oblique directions.

[0005] This method focuses on the following reason for the manufacture of the tape: the component supply tape (hereinafter referred to as the tape) wound on the reel usually contains LED chips of the same manufacturing batch, that is, LED chips with substantially the same brightness (same brightness level). In other words, the method focuses on the following point: even if the LED chips are of the same type, the brightness will be different (different brightness levels) if the reels (tapes) are different.

[0006] According to the method of Patent Document 1, when the same type of LED chips are supplied by multiple tape feeders, the LED chips supplied by the same tape feeder will not be installed adjacent to each other in the vertical, horizontal, or diagonal directions, thereby preventing LED chips of the same brightness from being concentrated in a specific area.

[0007] The mounting method disclosed in Patent Document 1 is effective in suppressing uneven brightness of the substrate. However, even if LED chips adjacent in the longitudinal, transverse, and oblique directions are supplied from different tape feeders, if the brightness of the LED chips supplied from a portion of multiple tape feeders is close to each other, when LED chips with similar brightness are concentrated and mounted in a specific area, uneven brightness may still occur. Therefore, there is still room for improvement in this regard.

[0008] Prior art literature

[0009] Patent Literature

[0010] Patent Document 1: Japanese Patent Gazette No. 4607837 Summary of the invention

[0011] An object of the present invention is to provide a technology for suppressing brightness unevenness occurring on an LED mounting substrate at a higher level when an LED mounting substrate having a plurality of LED chips mounted in a grid pattern on a substrate is produced by a component mounting apparatus.

[0012] The NC data generation method involved in the present invention is a method for generating NC data for manufacturing an LED mounting substrate by a component mounting device, wherein the component mounting device includes a plurality of tape feeders that respectively supply the same type of LED chips and at least one mounting head that takes out the LED chips from the plurality of tape feeders and mounts them on the substrate, and a plurality of the same type of LED chips are mounted on the LED mounting substrate in a grid pattern. The NC data generation method includes: an LED configuration setting step, in which the LED chips mounted on each of the plurality of mounting points arranged in a grid pattern on the substrate are set in association with a reel loaded into the tape feeder; an area setting step, in which a plurality of unit areas respectively including the plurality of mounting points are set on the substrate; and a brightness calculation step, in which, based on known information about the brightness of the LED chip, for each of the plurality of unit areas, a brightness calculation step is performed to calculate the brightness of the LED chips mounted on the unit area. The average brightness of the chip; and, a configuration adjustment step, determining whether the average brightness of the LED chips in each unit area is within a predetermined range, and in the case where there is a unit area outside the predetermined range, changing at least one of the LED chips installed in the area outside the predetermined range in a manner that makes the average brightness within the predetermined range, thereby ultimately determining the LED chips installed at each of the multiple mounting points arranged in the grid; wherein, in the LED configuration setting step, the LED chips installed at each of the multiple mounting points arranged in the grid are set in a manner that the LED chips supplied from the same reel are not adjacent in any of the row direction, column direction and oblique direction, and in the configuration adjustment step, at least one of the multiple LED chips installed in the area outside the predetermined range is changed to an LED chip supplied by a reel different from the reel supplying the LED chip.

[0013] In addition, the NC data generating device involved in the present invention is a device for generating NC data for manufacturing an LED mounting substrate by a component mounting device, wherein the component mounting device includes a plurality of tape feeders that respectively supply LED chips of the same type and at least one mounting head that takes out the LED chips from the plurality of tape feeders and mounts them on the substrate, and a plurality of the LED chips of the same type are mounted on the LED mounting substrate in a grid pattern. The NC data generating device includes: an LED configuration setting unit that sets the LED chips mounted to each of the plurality of mounting points arranged in a grid pattern on the substrate in association with a reel loaded into the tape feeder; an area setting unit that sets a plurality of unit areas that respectively include a plurality of mounting points on the substrate; and a brightness calculation unit that calculates, for each of the plurality of unit areas, the brightness of the LED chips mounted to the unit area based on known information about the brightness of the LED chips. the average brightness of the LED chips; and a configuration adjustment unit, which determines whether the average brightness of the LED chips in each unit area is within a predetermined range, and when there is a unit area outside the predetermined range, changes at least one of the LED chips installed in the area outside the predetermined range in a manner that makes the average brightness within the predetermined range, thereby ultimately determining the LED chips installed in each of the multiple mounting points arranged in the grid shape; wherein the LED configuration setting unit sets the LED chips installed in each of the multiple mounting points arranged in the grid shape in a manner that the LED chips supplied from the same reel are not adjacent in any of the row direction, the column direction and the oblique direction, and the configuration adjustment unit changes at least one of the multiple LED chips installed in the area outside the predetermined range to an LED chip supplied by a reel different from the reel that supplies the LED chip.

[0014] In addition, the component mounting system involved in the present invention includes: the above-mentioned NC data generating device; and a component mounting device that produces an LED mounting substrate on which multiple LED chips of the same type are mounted in a grid shape based on the NC data generated by the NC data generating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a diagram showing the overall configuration of a component mounting system according to a first embodiment of the present invention (a component mounting system to which the NC data generating method and the NC data generating apparatus of the present invention are applied).

[0016] Figure 2 It is a block diagram of a control system representing a component mounting system.

[0017] Figure 3 This is a flowchart showing the NC data generation process (NC data generation method).

[0018] Figure 4This is a schematic diagram showing an example of a substrate before LED chips are mounted.

[0019] Figure 5 This is a diagram showing an example of reel information.

[0020] Figure 6 Schematic diagram of a substrate showing an example of the initial arrangement of LED chips.

[0021] Figure 7 1 is a schematic diagram of a substrate P showing an example of the relationship between the initial arrangement of LED chips and the unit area.

[0022] Figure 8 This is a schematic diagram of a main part of a substrate showing a modified example of an LED chip set in a region outside a predetermined range.

[0023] Fig. 9 This is a schematic diagram of a main part of a substrate showing a modified example of an LED chip set in a region outside a predetermined range.

[0024] Fig.10 This is a schematic diagram of a main part of a substrate showing a modified example of an LED chip set in a region outside a predetermined range.

[0025] Fig.11 This is a schematic diagram of a substrate showing an example of the final arrangement of LED chips.

[0026] Fig.12 This is a schematic diagram of a substrate showing an example of a combination of five LED chips arranged in series.

[0027] Fig.13 This is a schematic diagram of a component supply unit for explaining the arrangement of reels (tape feeders).

[0028] Fig.14 This is a schematic diagram of a substrate for explaining the arrangement and combination of LED chips.

[0029] Fig.15 This is a schematic diagram of a component supply unit for explaining the arrangement of reels (tape feeders).

[0030] Fig.16 It is a schematic plan view showing a component mounting device applied to the component mounting system according to the second embodiment.

[0031] Fig.17 This is a schematic diagram showing a substrate in which a first mounting area and a second mounting area are set.

[0032] Fig.18 This is a table showing an example of reel information.

[0033] Fig.19It is a schematic diagram of a substrate showing the arrangement of LED chips.

[0034] Fig. 20 This is a schematic diagram of a substrate showing another example of arrangement of LED chips when the first mounting area and the second mounting area are set.

[0035] Fig.21 This is a table showing an example of resistance value information. DETAILED DESCRIPTION

[0036] [Overall structure of component mounting system]

[0037] Figure 1 It is a diagram showing the overall configuration of a component mounting system according to a first embodiment of the present invention (a component mounting system to which the NC data generating method and the NC data generating apparatus of the present invention are applied).

[0038] The component mounting system 1 is a system that manufactures a component mounting substrate (Printed Circuit Board) on which components (SMD) are mounted (loaded) while conveying a substrate P (Printed Wired Board). The components include large package components such as LSI, and small chip components such as IC, transistor, capacitor, LED and resistor.

[0039] The component mounting system 1 includes a plurality of component mounting devices 2 arranged in parallel along a production line, and a management device 4. In this example, two component mounting devices 2 (2A, 2B) are arranged in series. Figure 1 In the figure, only the component mounting device 2A on one side is shown. The component mounting device is a device for mounting components on the substrate P.

[0040] The management device 4 is a device that manages the operation status of the component mounting device 2 and the production status of the substrate P, and is installed, for example, at a position away from the production line. The management device 4 and the component mounting device 2 are connected via a communication line 6, thereby being configured to be able to send and receive various information between the management device 4 and the component mounting device 2.

[0041] The management device 4 includes a database 4a (indicated in Figure 2 ). The management device 4 includes the following functions: based on the information in the database 4a, it generates and transmits NC data for executing component installation operations in the component installation device 2, such as the configuration of the tape feeder 15 and the installation sequence of the components described later. The component installation device 2 executes the component installation operation on the substrate P based on the NC data. That is, in this example, the management device 4 is equivalent to the "NC data generation device" of the present invention.

[0042] [Configuration of component mounting device 2]

[0043] use Figure 1 The structure of the component mounting device 2 (2A, 2B) is described. The basic structure of the two component mounting devices 2A and 2B is the same. Therefore, each component mounting device 2A and 2B is not distinguished and is referred to as "component mounting device 2" to explain its structure. In the figure, XY indicators are shown to clarify the direction relationship. The X direction is the direction along the production line parallel to the horizontal plane, and the Y direction is the direction orthogonal to the X direction on the horizontal plane.

[0044] The component mounting device 2 includes a base 10 having a rectangular shape in a plan view, a substrate conveying mechanism 12 for conveying a substrate P on the base 10 , and a component supply unit 14 .

[0045] The substrate transport mechanism 12 includes a pair of conveyors 12a each consisting of a conveyor belt. Figure 1 The substrate P is received on the right side (-X side) and transported to the working position (the position of the substrate P shown in the figure). After the installation work is completed, the substrate P is moved out from the working position to the left side (+X side) of the figure.

[0046] The component supplying parts 14 are provided on both sides (-Y side and +Y side) of the substrate conveying mechanism 12. A plurality of tape feeders 15 for supplying chip components are arranged in parallel in each component supplying part 14 along the substrate conveying mechanism 12.

[0047] like Figure 1 As shown in the pop-up box in , the tape feeder 15 has a reel 15a wound with a tape for storing and holding chip components at specified intervals, and the chip components are supplied to the component removal position of the mounting head 18 described later while unwinding the tape 15b from the reel 15a.

[0048] The head unit 16 takes out components from the component supply section 14 (tape feeder 15 ) and mounts the components at predetermined mounting points on the substrate P. The head unit 16 is provided to be movable in the X direction and the Y direction by a head unit driving mechanism 20 .

[0049] The head unit driving mechanism 20 is constituted by a so-called XY robot using a motor as a driving source. That is, the head unit driving mechanism 20 is provided with a beam 22 that moves in the Y direction along a pair of guide rails 21 that are respectively fixed to the overhead beams, and is configured to move the head unit 16 in the X direction along the beam 22.

[0050] The head unit 16 includes a plurality of axial mounting heads 18 extending in the vertical direction and a mounting head driving mechanism for driving the mounting heads 18. In this example, the head unit 16 includes five mounting heads 18 arranged side by side at a predetermined interval in the X direction. The mounting head driving mechanism is configured to lift and rotate each mounting head 18 using a motor as a driving source. Each mounting head 18 is configured to be connected to a negative pressure generating device through a switching valve, and can absorb and hold the component based on the negative pressure supplied from the negative pressure generating device.

[0051] The intervals between the five mounting heads 18 are set equal to the intervals between the tape feeders 15 disposed in the component supply section 14. Thus, each mounting head 18 can simultaneously suck and take out components from the five tape feeders 15 of the component supply section 14.

[0052] Figure 2 This is a block diagram showing the control system of the component mounting system 1 (component mounting device 2 and inspection device 4). The component mounting device 2 is provided with a control device 30 as shown in the figure. The control device 30 is configured to have a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory) and peripheral circuits, and includes a main control unit 34, a drive control unit 36, a data storage unit 38 and a communication control unit 32 as its functional structure. The main control unit 34 controls the drive of the substrate conveying mechanism 12, the head unit 16 and the mounting head 18 through the drive control unit 36 ​​based on the installation program (including NC data) and various data stored in the data storage unit 38, thereby uniformly controlling a series of component mounting actions in the component mounting device 2. The communication control unit 32 is a communication interface connected to the communication line 6, and performs various information transmission and reception between it and the management device 4 and other component mounting devices 2.

[0053] Based on the control of the above-mentioned main control unit 34, the following action (component installation action) is performed: while the head unit 16 moves back and forth between the substrate P configured at the working position and the component supply unit 14, the component is taken out from the component supply unit 14 (belt feeder 15) through the installation head 18 and installed at the designated installation point of the substrate P.

[0054] [Configuration of the Management Device 4]

[0055] The management device 4 is based on, for example, a personal computer having an input device such as a keyboard and a display device such as a liquid crystal display. Figure 2 The control device 40 is configured to include a CPU, a ROM, a RAM, and peripheral circuits, and includes an NC data generating unit 44, a data storage unit 46, and a communication control unit 42 as its functional configuration.

[0056] As described above, the management device 4 has a function of generating NC data for the component mounting device 2 to perform the component mounting operation based on the information in the database 4a, and the NC data generating unit 44 assumes this function. In this example, the "NC data" is data that specifies the order (steps) of mounting components on the substrate P, the mounting position coordinates (X, Y, Z, θ data) of each step of the mounting order, and the component number of the mounted component.

[0057] The NC data generation unit 44 has, as one of the NC data generation functions, a function of generating NC data for producing an LED mounting substrate in which a plurality of LED chips of the same type are mounted in a grid shape. The NC data generation unit 44 generates the NC data according to a specified data generation program. In addition, in the following description, when referred to as "NC data", it refers to NC data for producing an LED mounting substrate, except for cases where it is specifically mentioned.

[0058] More specifically, the NC data generating unit 44 includes an LED arrangement setting unit 44 a , an arrangement adjusting unit 44 b , and a feeder arrangement setting unit 44 c .

[0059] The LED configuration setting unit 44a sets the LED chips mounted on each of the plurality of mounting points arranged in a grid pattern on the substrate P in association with the reel 15a for supplying the LED chips, based on the information of the database 4a. That is, the LED configuration setting unit 44a sets the configuration of the LED chips mounted on the substrate P. In addition, as described above, the reel 15a is a component for supplying components, which is wound with a tape 15b storing components (here, LED chips), and is loaded into the tape feeder 15.

[0060] Figure 4 An example of a substrate P before LED chips are mounted is schematically shown. Figure 4 It is a diagram assuming that the substrate P is configured in the working position of the component mounting device 2 (about Figures 6 to 12 , Fig.14 , Fig.17 , Fig.19 , Fig. 20 Same).

[0061] Figure 4 In the example, a total of 40 mounting points Mp are arranged in a grid pattern in 10 rows (coordinates X1 to X10) in the X direction and 4 columns (coordinates Y1 to Y4) in the Y direction on the substrate P. The LED configuration setting unit 44a sets which LED chip of the reel 15a is to be mounted on which mounting point Mp for such a substrate P.

[0062] The configuration adjustment unit 44b adjusts the configuration of the LED chips set by the LED configuration setting unit 44a as needed. Specifically, the configuration adjustment unit 44b changes the LED chips set to one or more mounting points Mp as needed for each of the plurality of pre-set unit areas so that the average brightness of the LED chips in the unit area is within a predetermined range, and determines the final configuration of the LED chips. In addition, in this example, the configuration adjustment unit 44b has a structure that combines the "configuration adjustment unit", "area setting unit" and "brightness calculation unit" of the present invention.

[0063] The feeder configuration setting unit 44c sets the configuration of the reel 15a in the component supply unit 14, that is, the specific configuration of the tape feeder 15 loaded with the reel 15a, according to the final configuration of the LED chip determined by the configuration adjustment unit 44b (equivalent to the "final information" of the present invention).

[0064] The data storage unit 46 stores various data including the NC data generated by the NC data generation unit 44. The communication control unit 42 is a communication interface connected to the communication line 6, and performs transmission and reception of various information between it and the component mounting device 2. For example, when producing an LED mounting substrate, the NC data stored in the data storage unit 46 is sent to the component mounting device 2 according to a request from the component mounting device 2. The component mounting device 2 performs a component mounting operation according to the NC data.

[0065] [NC data generation method]

[0066] Regarding the generation process of NC data by the management device 4 (NC data generation unit 44), Figure 4 The following description will be specifically described using the substrate P shown as an example.

[0067] Before explaining the production process, the relationship between the tape feeder 15 and the LED chip is first explained. A reel 15a on which a tape 15b containing LED chips is wound is loaded into the tape feeder 15. The LED chip is supplied to the mounting head 18 by unwinding the tape 15b from the reel 15a.

[0068] In the case of producing an LED mounting substrate on which a plurality of LED chips of the same type are mounted in a grid pattern, a plurality of tape feeders 15 each loaded with a reel 15a containing the same type of LED chips are provided in the component supply section 14 from the viewpoint of production efficiency. As described above, the material tape 15b wound on the reel 15a contains LED chips of the same manufacturing batch, which means that LED chips of the same brightness (brightness level) are contained in one reel 15a (one material tape 15b). In other words, it can be said that even if the LED chips of the same type are different, if the reels 15a are different, strictly speaking, the brightness (brightness level) is also different (there is a deviation). That is to say, in the case where the same type of LED chips are supplied by a plurality of tape feeders 15, there is a deviation in the brightness (brightness level) of the LED chips between the tape feeders 15.

[0069] The NC data generation process described below is based on the above insights. It assumes that the brightness (brightness level) of the LED chips on each reel 15a is different from each other, and generates NC data for setting the configuration of the LED chips relative to each mounting point Mp and the configuration of the belt feeder 15 in the component supply section 14.

[0070] Figure 3 This is a flowchart showing the NC data generation process (NC data generation method).

[0071] First, the LED arrangement setting unit 44a sets the LED chips to be mounted on each mounting point Mp of the substrate P in association with the reel 15a based on the information in the database 4a. Thus, the initial arrangement of the LED chips is set (step S1).

[0072] In the database 4a, for example, Figure 5 The reel information J1 shown in FIG. 1 is equivalent to the "known information about the brightness of the LED chip" of the present invention. The reel information J1 is information that associates the ID (identification information) of the reel 15a with the characteristic values, manufacturing batch, storage quantity and other detailed data of the LED chips stored in the reel 15a of each ID. Figure 5 In the example of , information of five reels 15a is shown. In this figure, only the corresponding relationship between the ID of the reel 15a and the brightness (brightness information) of one of the detailed data is shown. The reel information J1 is stored in the database 4a when the operator reads a two-dimensional code such as a barcode attached to the reel 15a using a reader at the time of delivery. In addition, in the following description, the reels 15a with IDs "R1" to "R5" may be referred to as reels Re1 to Re5.

[0073] The LED configuration setting unit 44a determines the initial configuration of the LED chips with reference to the above-mentioned reel information J1. Specifically, the LED chips installed at each of the plurality of mounting points Mp arranged in a grid are selected from the LED chips of the reels Re1 to Re5 so that the LED chips of the same reel 15a are not adjacent in any of the vertical (row direction), horizontal (column direction), and diagonal directions.

[0074] Figure 6 1 is a schematic diagram of a substrate P showing an example of the initial arrangement of LED chips. Figure 6 The numbers of the mounting points Mp in the numerals represent the numbers of the ID of the reel 15a. That is, the number "1" of the mounting point Mp at the coordinates (X1, Y1) represents the LED chip mounted on the reel Re1, and the number "4" of the mounting point Mp at the coordinates (X5, Y3) represents the LED chip mounted on the reel Re4.

[0075] like Figure 6 As shown, the LED configuration setting unit 44a sets the LED chips mounted at each mounting point Mp by repeatedly arranging the LED chips of the reels Re1 to Re5 in ascending order from X1 to X10 twice in each column and by regularly offsetting the positions of the LED chips of each reel Re1 to Re5 between the columns by two mounting points in the column direction. Thus, the initial configuration of the LED chips is set so that the LED chips of the same reel 15a are not adjacent in any direction of the longitudinal, lateral, or oblique directions.

[0076] Next, the configuration adjustment unit 44b sets a plurality of unit areas Ar including a plurality of mounting points Mp for the initial configuration of the LED chips, and calculates the average brightness of the LED chips belonging to each unit area Ar based on the reel information J1 (step S3). In this case, the configuration adjustment unit 44b sets a predetermined unit area Ar corresponding to the size of the substrate P and the number of mounting points Mp.

[0077] Figure 7 FIG. 1 is a schematic diagram of a substrate P showing an example of the relationship between the initial configuration of the LED chip and the unit area Ar. Figure 7 As shown, the configuration adjustment unit 44b sets a total of five unit areas Ar1 to Ar5 each including eight adjacent mounting points Mp, and calculates the average brightness L of the LED chips belonging to the unit areas Ar1 to Ar5 based on the reel information J1. A For example, the average brightness L of the unit area Ar1 containing the eight mounting points Mp with coordinates (X1 to X4, Y1 to Y2) is A For: L A=(2×L1+L2+2×L3+2×L4+L5) / 8. In addition, the average brightness L of the unit area Ar2 including the eight mounting points Mp with coordinates (X5 to X8, Y1 to Y2) is A For: L A =(L1+2×L2+2×L3+L4+2×L5) / 8. The arrangement adjustment unit 44b similarly calculates the average brightness L of the other unit areas Ar3 to Ar5. A .

[0078] Next, the arrangement adjustment unit 44b determines whether there is any area in each of the unit areas Ar1 to Ar5 that is not the average brightness L A Here, if the answer is "yes", the configuration adjustment unit 44b changes at least one of the eight LED chips set in the area outside the predetermined range (step S7) so that the average brightness L of the area outside the predetermined range is less than 1. A Within the established range (correspondingly referred to as the "first change requirement").

[0079] In this case, the adjustment section 44b is configured so that the changed LED chip and the LED chips adjacent to the LED chip in the longitudinal, transverse and diagonal directions become LED chips of the reel 15a that are different from each other (correspondingly referred to as the "second change requirement") to change at least one of the LED chips in the area outside the predetermined range.

[0080] exist Figure 7 In the case where the unit area Ar1 is assumed to be outside the predetermined range, the configuration adjustment unit 44b is configured so that the LED chip (LED chip of the reel Re1) set at the coordinates (X1, Y1) is, for example, Figure 8 In this case, the LED chip after the change (the LED chip of the reel Re5) and the LED chips adjacent to the LED chip in the longitudinal, transverse and oblique directions are LED chips of different reels 15a. Therefore, the second change requirement is satisfied.

[0081] Here, when it is impossible to satisfy both the first and second change requirements, the configuration adjustment unit 44b changes at least one of the LED chips set in the area outside the predetermined range so as to satisfy only the first change requirement. Figure 7 In the case where the unit area Ar1 is outside the predetermined range, only the LED chip (LED chip of the reel Re3) set at the coordinate (X3, Y1) is placed. Fig. 9When the LED chip of the reel Re2 is changed as shown and the first change requirement is satisfied, the configuration adjustment unit 44b changes the LED chip set in the unit area Ar1 as described above. In this case, the changed LED chip (the LED chip of the reel Re2) and the LED chip adjacent to the LED chip in the left lateral direction become the LED chips of the same reel 15a.

[0082] Furthermore, when the reel information J1 includes information of a reel Re other than the reels Re1 to Re5 (e.g., reel ReX), the LED configuration setting unit 44a may also change at least one of the LED chips set in the area outside the predetermined range to the LED chip of the reel ReX. Figure 7 In the case where the unit area Ar1 is outside the predetermined range, the LED chip (LED chip of the reel Re1) set at the coordinates (X4, Y2) may be Fig.10 As shown in the figure, the LED chip is changed to the reel ReX. In this case, the first and second change requirements are satisfied.

[0083] The arrangement adjustment unit 44b determines the average brightness L of all the unit areas Ar1 to Ar5 for the initial arrangement of the LED chips set by the LED arrangement setting unit 44a in step S3. A If the LED chips are within the predetermined range ("No" in step S5), the initial configuration is determined as the final configuration of the LED chips mounted on each mounting point Mp of the substrate P (step S9). On the other hand, in step S7, if any of the LED chips set in the area outside the predetermined range is changed, the configuration adjustment unit 44b determines the configuration of the changed LED chips as the final configuration of the LED chips mounted on each mounting point Mp of the substrate P (step S9).

[0084] Next, based on the final arrangement of the LED chips, the feeder arrangement setting unit 44c sets the arrangement of the tape feeder 15 in association with the reel 15a (step S11). That is, the arrangement of the reels Re1 to Re5 in the component supply unit 14 is set when the tape feeders 15 are loaded and arranged in the component supply unit 14.

[0085] As described above, the intervals between the tape feeders 15 arranged in the component supply unit 14 are the same as the intervals between the mounting heads 18 in the head unit 16. Thus, the feeder arrangement setting unit 44c sets the arrangement of the reels Re1 to Re5 so that the LED chips of the reels Re1 to Re5 can be simultaneously adsorbed, specifically, so that the reels Re1 to Re5 are continuously arranged in the X direction (correspondingly referred to as "the first arrangement requirement").

[0086] In addition, the feeder configuration setting unit 44c sets the configuration of each reel Re1 to Re5 (correspondingly referred to as the "second configuration requirement") with reference to the arrangement of the LED chips in each column (columns of coordinates Y1 to Y4) in the final configuration, using the combination of five LED chips arranged continuously in the column direction that appears most frequently. The specific situation is as follows.

[0087] Fig.11 1 is a schematic diagram of a substrate P showing an example of the final arrangement of LED chips. Fig.11 The final configuration shown is in Figure 7 The initial arrangement shown is a change in the arrangement of the LED chip at the coordinate (X3, Y1) (the LED chip of the reel Re3) and the LED chip at the coordinate (X10, Y2) (the LED chip of the reel Re2).

[0088] exist Fig.11 In the case of the final configuration shown in FIG. 1 , there are seven combinations of five LED chips arranged continuously in the column direction: "1, 2, 3, 4, 5", "2, 3, 4, 5, 1", "3, 4, 5, 1, 2", "4, 5, 1, 2, 3", "5, 1, 2, 3, 4", "1, 2, 2, 4, 5" and "3, 4, 5, 1, 3". Among them, "5, 1, 2, 3, 4" appears five times and the most (in Fig.11 The frequencies of "1, 2, 2, 4, 5" and "3, 4, 5, 1, 3" are 1 and 1 respectively, which is the least. In addition, the frequencies of "3, 4, 5, 1, 2" are as follows: Fig.12 As shown, it occurs 3 times, and the frequency of occurrence of other combinations is 4 times each.

[0089] Therefore, the feeder configuration setting unit 44c is as follows Fig.13 As shown in FIG. 1 , the arrangement of the reels Re1 to Re5 is determined by arranging the reels Re1 to Re5 in the order of "5, 1, 2, 3, 4" as the arrangement of the reels Re1 to Re5, that is, the arrangement of the tape feeder 15 loaded with the reels Re1 to Re5, respectively ( Fig.13 The circled number in represents the number of the ID of the reel 15a). In addition, the configuration in the component supply section 14 of a group of tape feeders 15 loaded with reels Re1 to Re5, respectively, takes into account the number and position of components other than LED chips mounted on the substrate P, for example, and is set at an optimal position to shorten the tact time as much as possible.

[0090] According to the generation process described above, the NC data generation unit 44 generates NC data for setting the arrangement of the LED chips mounted on each mounting point Mp of the substrate P and the arrangement of the tape feeders 15 loaded with the reels Re1 to Re5, respectively. The NC data generated by the NC data generation unit 44 is stored in the data storage unit 46 as described above, and is sent to the component mounting device 2 in accordance with a readout request from the component mounting device 2, for example. Based on the NC data, the operator performs the so-called preparation work of assembling the tape feeder 15 to the component supply unit 14. And, by the control of the mounting head 18 and the like performed by the control device 30 based on the NC data, the mounting operation of the component (LED chip) is performed in the component mounting device 2.

[0091] In addition, in this example, Figure 3 The processing of step S1 is equivalent to the "LED configuration setting step" of the present invention, the processing of step S3 is equivalent to the "area setting step" and "brightness calculation step" of the present invention, the processing of steps S5 to S9 is equivalent to the "configuration adjustment step" of the present invention, and the processing of step S11 is equivalent to the "feeder configuration setting step" of the present invention.

[0092] [Effects, etc.]

[0093] According to the above-mentioned component mounting system 1, when producing an LED mounting substrate in which a plurality of LED chips are arranged in a grid shape, the management device 4 (NC data generating unit 44) generates NC data for setting the configuration of the LED chips to be mounted at each mounting point Mp of the substrate P, and the configuration of the reels Re1 to Re5 (tape feeder 15), and the mounting action of the component mounting device 2 is controlled based on the NC data.

[0094] In this case, after the initial arrangement of the LED chips is set so that the LED chips of the same reel 15a are not adjacent to each other in any of the vertical, horizontal, and diagonal directions, the average brightness L of the LED chips in each unit area Ar1 to Ar5 is further calculated. A In order to keep the LED chips within a predetermined range, the LED chips in the initial arrangement are partially changed as needed. Thus, the final arrangement of the LED chips mounted on the substrate P is set.

[0095] According to the LED mounting substrate produced based on such NC data, even if the brightness of the LED chips of some of the plurality of reels 15a is close to each other, the average brightness L of the LED chips per unit area is set to AThe final configuration of the LED chip is set in such a way that it is within a predetermined range, so it is difficult for the LED mounting substrate to have uneven brightness. Therefore, compared with the conventional LED mounting substrate that is only configured to prevent the LED chips supplied from the same reel from being adjacent in the longitudinal, lateral, and diagonal directions, the uneven brightness generated on the LED mounting substrate can be suppressed at a higher level.

[0096] In addition, since the configurations of the respective reels Re1 to Re5 (tape feeders 15) in the component supply unit 14 are set in such a way as to satisfy the above-described first and second setting requirements, it is possible to efficiently produce the LED mounting substrate that is less likely to have uneven brightness as described above. That is, based on the above NC data, it is possible to increase as much as possible the number of times the 5 mounting heads 18 simultaneously adsorb (pick up) the LED chips. In addition, it is also possible to suppress the movement amount of the head unit 16 above the substrate when each mounting head 18 mounts the adsorbed LED chip on the substrate P to be small. Thereby, it helps to shorten the cycle time. Therefore, it is possible to efficiently produce the LED mounting substrate that is less likely to have uneven brightness.

[0097] In addition, in the above-described embodiment, with reference to the arrangement of the LED chips in each column (each column of coordinates Y1 to Y4) in the final configuration of the LED chips, the configurations of the respective reels Re1 to Re5 are set with the combination having the highest frequency of occurrence in the combination of 5 LED chips arranged continuously in the column direction. However, the configurations of the respective reels Re1 to Re5 may be set as follows in consideration of the interval between the mounting heads 18 and the interval between the adjacent mounting points Mp on the substrate P.

[0098] For example, as Fig.14 shown, when the interval Inh between the mounting heads 18 is different from the interval InM between the mounting points Mp (InM < Inh), the configurations of the respective reels Re1 to Re5 are set with the combination that minimizes the movement amount of the head unit 16 above the substrate when each mounting head 18 mounts the adsorbed LED chip on the substrate P (correspondingly referred to as the "third configuration requirement") and the combination having the highest frequency of occurrence in the 4 columns of coordinates Y1 to Y4 (correspondingly referred to as the "fourth configuration requirement"). That is, the feeder configuration setting unit 44c may also set the configurations of the respective reels Re1 to Re5 in such a way as to satisfy the above-described first configuration requirement and the third and fourth configuration requirements.

[0099] Specifically, for example, as Fig.14As shown, in the case where the interval Inh of the mounting heads 18 is close to approximately twice the interval InM of the mounting points Mp, it can be said that the third configuration requirement is satisfied as long as the combination of LED chips arranged one by one in the LED chips set as one column is used. Here, in the four columns Y1 to Y4, the combination of LED chips arranged one by one is "1, 3, 5, 2, 4", "2, 4, 1, 3, 5", "3, 5, 2, 4, 1", "4, 1, 3, 5, 2" and "5, 2, 4, 1, 3". Among them, the frequencies of "1, 3, 5, 2, 4", "2, 4, 1, 3, 5" and "3, 5, 2, 4, 1" are respectively 2 times, and the rest are respectively 1 time. The three types that satisfy the fourth configuration requirement are "1, 3, 5, 2, 4", "2, 4, 1, 3, 5" and "3, 5, 2, 4, 1".

[0100] Therefore, the arrangement of the reels Re1 to Re5 is set as the arrangement of the reels Re1 to Re5, that is, the arrangement of the tape feeders 15 loaded with the reels Re1 to Re5, in which the reels Re1 to Re5 are arranged in a row in any order of "1, 3, 5, 2, 4", "2, 4, 1, 3, 5" and "3, 5, 2, 4, 1". Fig.15 As shown, a configuration in which "1, 3, 5, 2, 4" are arranged continuously in the order can be set as the configurations Re1 to Re5 (the circled numbers in the figure represent the numbers of the ID of the reel 15a).

[0101] According to such NC data, it is possible to ensure the opportunity for the five mounting heads 18 to simultaneously adsorb (take out) the LED chips, and it is also possible to suppress the amount of movement of the head unit 16 on the substrate when each mounting head 18 mounts the adsorbed LED chips on the substrate P. Therefore, it can be said that it helps to shorten the tact time even in this case.

[0102] [Second Embodiment of Component Mounting System 1]

[0103] Next, a second embodiment of the component mounting system 1 is described. The basic structure of the component mounting system 1 of the second embodiment is the same as that of the first embodiment. Therefore, in the following description, the same symbols are attached to the structures common to the first embodiment, and the description thereof is omitted or simplified, and the differences from the first embodiment are mainly described in detail.

[0104] Fig.16The component mounting device 2 included in the component mounting system 1 according to the second embodiment is schematically shown. The component mounting device 2 includes a first and a second head unit 16A and 16B, and a head unit driving mechanism 20 is configured to enable the first and second head units 16A and 16B to move independently in the X direction and the Y direction. That is, the head unit driving mechanism 20 includes a first and a second beam 22A and 22B that move in the Y direction respectively along a pair of guide rails 21, and is configured to move the first head unit 16A in the X direction along the first beam 22A, and to move the second head unit 16B in the X direction along the second beam 22B. Each of the first and second head units 16A and 16B includes five mounting heads 18 arranged side by side at a predetermined interval along the X direction.

[0105] In the component mounting device 2, based on the control of the main control unit 34, the first head unit 16A reciprocates between the substrate P at the working position and the component supply unit 14 on one side (+Y side) (referred to as the first component supply unit 14A), and performs the action of taking out components from the first component supply unit 14A and mounting them on the substrate P by the mounting head 18, and the second head unit 16B reciprocates between the substrate P at the working position and the component supply unit 14 on the other side (-Y side) (the second component supply unit 14B), and performs the action of taking out components from the second component supply unit 14B and mounting them on the substrate P by the mounting head 18. That is, the first and second head units 16A and 16B cooperate to mount components on one substrate P.

[0106] The process of generating NC data by the management device 4 (NC data generating unit 44) is basically the same as Figure 3 The generation process (steps S1 to S11) of the first embodiment shown is the same. However, the generation process of the second embodiment is different from that of the first embodiment in the following points.

[0107] In step S1, the NC data generating unit 44 (LED configuration setting unit 44a) first sets the first mounting area Mr1 where the first head unit 16A operates and the second mounting area Mr2 where the second head unit 16B operates for the substrate P. The first mounting area Mr1 and the second mounting area Mr2 are independent areas and are predetermined areas defined according to the size of the substrate P and the number of mounting points Mp.

[0108] Fig.17 Expressed Figure 4 The substrate P shown in the figure is an example in which a first mounting area Mr1 and a second mounting area Mr2 are set. Fig.17 In the figure, the left half (+X side) of the substrate P is the first mounting region Mr1, and the right half (-X side) is the second mounting region Mr2.

[0109] Furthermore, the LED configuration setting unit 44a and the configuration adjustment unit 44b perform the processing of steps S2 to S9 for the first mounting area Mr1, and perform the processing of steps S2 to S9 for the second mounting area Mr2. Thus, the LED configuration setting unit 44a and the configuration adjustment unit 44b respectively set the final configuration of the LED chips mounted at each mounting point Mp of the first mounting area Mr1 and the final configuration of the LED chips mounted at each mounting point Mp of the second mounting area Mr2.

[0110] In this case, the LED arrangement setting unit 44a sets the first mounting area Mr1 according to, for example, Figure 5 The reel information J1 (reels Re1 to Re5) shown in FIG. 1 sets the arrangement of LED chips. For the second mounting area Mr2, for example, Fig.18 The reel information J2 (reels Re6 to Re10) as shown in FIG. Figure 5 and Fig.18 As shown, the reels Re1 to Re5 of the reel information J1 and the reels Re6 to Re10 of the reel information J2 are different reels from each other.

[0111] Fig.19 4 is a schematic diagram of the substrate P showing the final arrangement of the LED chips set by the arrangement adjustment unit 44b in the process of step S9. Fig.19 In this example, the left half (+X side) of the substrate P is used as the first mounting area Mr1 and the right half (-X side) is used as the second mounting area Mr2. However, for example, Fig. 20 As shown, the lower half (+Y side) of the substrate P is defined as the first mounting region Mr1, and the upper half (-Y side) is defined as the second mounting region Mr2.

[0112] In the process of step S11, the feeder configuration setting unit 44c sets the configuration of the reels Re1 to Re10 in such a manner that the reels Re1 to Re5 storing the LED chips mounted to the first mounting area Mr1 are arranged in the first component supply unit 14A, and the reels Re6 to Re10 storing the LED chips mounted to the second mounting area Mr2 are arranged in the second component supply unit 14B. In addition, the feeder configuration setting unit 44c sets the configuration of the reels Re1 to Re5 in the first component supply unit 14A and sets the configuration of the reels Re6 to Re10 in the second component supply unit 14B in such a manner that the first configuration condition and the second configuration condition are satisfied.

[0113] In the component mounting system 1 of the second embodiment, as described above, the component mounting device 2 includes the first and second head units 16A and 16B that operate independently, and the first and second head units 16A and 16B mount the LED chips on the substrate P in cooperation with each other.

[0114] Furthermore, as described above, the management device 4 (NC data generation unit 44) generates NC programs for the first mounting area Mr1 that the first head unit 16A is responsible for, and the second mounting area Mr2 that the second head unit 16B is responsible for, according to the same generation process as the first embodiment. That is, NC data is generated to set the arrangement of the LED chips installed at each mounting point Mp of the first mounting area Mr1, and the arrangement of the reels Re1 to Re5, and the arrangement of the LED chips installed at each mounting point Mp of the second mounting area Mr2, and the arrangement of the reels Re6 to Re10.

[0115] Therefore, according to the component mounting system 1 of the second embodiment, in the component mounting apparatus 2 including the two head units 16A and 16B, it is possible to efficiently produce LED mounted substrates in which uneven brightness is less likely to occur.

[0116] In addition, as an LED chip mounting substrate, the following structure may be considered: for example, resistors for adjusting brightness are respectively provided in the first mounting area Mr1 and the second mounting area Mr2, and the current flowing in the LED chip is limited by the resistors, thereby obtaining a brightness balance between the first mounting area Mr1 and the second mounting area Mr2. In this case, a resistance value setting function (resistance value setting unit) may be provided in the NC data generating unit 44, and the resistance values ​​of the resistors respectively installed in the first mounting area Mr1 and the second mounting area Mr2 may be set together in the above-mentioned generating process. In other words, the NC data may include the resistance values ​​of the resistors corresponding to the first mounting area Mr1 and the second mounting area Mr2.

[0117] Specifically, the resistance value setting unit calculates the average brightness L of the LED chips mounted in the first mounting area Mr1 based on the reel information J1. B , and calculates the average brightness L of the LED chips installed in the second installation area Mr2 based on the reel information J2 B Moreover, the resistance value setting unit is based on Fig.21 The average brightness L B The predetermined resistance value information J3 associated with the resistance value of the resistor sets the resistance value of the resistor mounted in the first mounting area Mr1 and sets the resistance value of the resistor mounted in the second mounting area Mr2. The resistance value information J3 determines the average brightness L of the LED chip. B In order to set the average brightness L B Information on the relationship between the resistance values ​​required to achieve a specified target brightness.

[0118] Based on such NC data, Fig.19 or Fig. 20When the LED mounting board as shown is produced, the brightness balance between the first mounting area Mr1 and the second mounting area Mr2 can be ensured at a high level. Therefore, an LED mounting board in which brightness unevenness is less likely to occur can be produced.

[0119] In addition, the resistance value setting process performed by the resistance value setting unit as described above is Figure 3 The process of step S9 of the NC data generation process shown is executed thereafter. In this example, the resistance value setting process performed by such a resistance value setting unit corresponds to the "resistance value setting step" of the present invention.

[0120] [Modifications, etc.]

[0121] The component mounting system 1 of the first and second embodiments is an illustration of a preferred embodiment of the component mounting system involved in the present invention (a component mounting system to which the NC data generating method and NC data generating device of the present invention are applied), and its specific structure or specific NC data generating method can be changed accordingly without departing from the scope of the present invention. For example, the following structure and method can also be adopted.

[0122] (1) Figure 6 In the example shown, the LED configuration setting unit 44a sets the LED chips installed at each mounting point Mp in such a way that the LED chips of the reels Re1 to Re5 are repeatedly arranged in ascending order from X1 to X10 twice by column and the positions of the LED chips of each reel Re1 to Re5 between columns are regularly offset by two mounting points in the column direction. However, this is only an example of the initial configuration of the LED chips. As long as the LED chips of the same reel 15a can be arranged in a manner that is not adjacent to each other in any direction of the longitudinal, lateral, and oblique directions, the initial configuration method may also be a method other than the embodiment. The corresponding method can be selected according to the number of mounting points Mp and the number of types of LED chips distinguished by brightness.

[0123] (2) In the second embodiment, the LED chips installed in the first mounting area Mr1 and the LED chips installed in each mounting point Mp of the second mounting area Mr2 are different from each other, but they can also be the same LED chips. That is, the LED chips installed in both the first mounting area Mr1 and the second mounting area Mr2 can be set according to the reel information J1 (or reel information J2). In this case, the configuration of the LED chips between the LED chips installed in the first mounting area Mr1 and the LED chips installed in the second mounting area Mr2 is also set in a manner that the LED chips on the same reel 15a are not adjacent in any direction of the longitudinal, lateral, or oblique directions.

[0124] (3) In the second embodiment, the generation of NC data when producing an LED chip mounting substrate having resistors for brightness adjustment in the first mounting area Mr1 and the second mounting area Mr2 is mentioned, that is, the setting process of the resistance value by the resistance value setting unit is mentioned. The setting process of the resistance value by such a resistance value setting unit can also be applied to the first embodiment. That is, in, for example, Figure 7 In the substrate P shown, when resistors for brightness adjustment are provided corresponding to the respective unit areas Ar1 to Ar5, the resistance values ​​of the resistors belonging to the respective unit areas Ar1 to Ar5 can be set by executing the resistance value setting processing performed by the resistance value setting unit in the same manner as in the second embodiment.

[0125] The present invention described above is summarized as follows.

[0126] An aspect of the present invention relates to an NC data generation method for manufacturing an LED mounting substrate by a component mounting device, wherein the component mounting device includes a plurality of tape feeders that respectively supply LED chips of the same type and at least one mounting head that takes out LED chips from the plurality of tape feeders and mounts them on the substrate, and a plurality of LED chips of the same type are mounted on the LED mounting substrate in a grid pattern, the NC data generation method comprising: an LED configuration setting step, in which the LED chips mounted to each of a plurality of mounting points arranged in a grid pattern on the substrate are set in association with a reel loaded into the tape feeder; an area setting step, in which a plurality of unit areas each including a plurality of mounting points are set on the substrate; and a brightness calculation step, in which, based on known information about the brightness of the LED chip, for each of the plurality of unit areas, an LED chip mounted to the unit area is calculated. The average brightness of the ED chip; and, a configuration adjustment step, determining whether the average brightness of the LED chips in each unit area is within a predetermined range, and in the case where there is a unit area outside the predetermined range, changing at least one of the LED chips installed in the area outside the predetermined range in a manner that makes the average brightness within the predetermined range, thereby ultimately determining the LED chip installed at each of the multiple mounting points arranged in the grid; wherein, in the LED configuration setting step, the LED chips installed at each of the multiple mounting points arranged in the grid are set in a manner that the LED chips supplied from the same reel are not adjacent in any of the row direction, column direction and oblique direction, and in the configuration adjustment step, at least one of the multiple LED chips installed in the area outside the predetermined range is changed to an LED chip supplied by a reel different from the reel supplying the LED chip.

[0127] According to this method, it is possible to generate NC data that can produce an LED mounting substrate that can suppress the occurrence of uneven brightness at a higher level. That is, in the above method, the configuration of the LED chips is set in such a way that the LED chips supplied from the same reel are not adjacent in any direction of the row direction, the column direction and the oblique direction. Moreover, it is determined whether the average brightness of the LED chips is within a predetermined range for each unit area. In the case where there is an area outside the predetermined range, at least one of the LED chips installed in the area outside the predetermined range is changed to an LED chip supplied by a reel different from the reel that supplies the LED chip, so that the average brightness is within the predetermined range. Thus, the LED chips installed at each of the multiple mounting points arranged in the grid shape are finally determined. That is to say, even in the case where the brightness of the LED chips of a part of the multiple reels is close to each other, since the final configuration of the LED chips is set in such a way that the average brightness of the LED chips in each unit area is within the predetermined range, it is more difficult for the LED mounting substrate to have uneven brightness.

[0128] Therefore, according to the LED mounting substrate produced based on the NC data generated by this method, the occurrence of brightness unevenness can be suppressed to a higher level compared to an LED mounting substrate that is configured only so that LED chips supplied from the same reel are non-adjacent in the row direction (vertical direction), column direction (horizontal direction) and diagonal direction.

[0129] In this method, it is preferred that: in the configuration adjustment step, at least one of the multiple LED chips installed in the area outside the predetermined range is changed in such a way that the changed LED chip and the LED chips adjacent to the LED chip in the row direction, column direction and diagonal direction are LED chips supplied from different reels.

[0130] According to the NC data generated by this method, the brightness of the LED chip after the change is unlikely to be the same as that of the LED chips adjacent to it, so that the occurrence of uneven brightness of the LED mounting substrate can be suppressed at a higher level.

[0131] In each of the above-mentioned methods, when the component mounting device comprises a first head unit and a second head unit each having the mounting head and moving independently, and the first head unit mounts the component on a predetermined first mounting area in the substrate, and the second head unit mounts the component on a second mounting area that does not overlap with the first mounting area, it is preferred that: for each of the first mounting area and the second mounting area, each of the processing of the LED configuration setting step, the area setting step, the brightness calculation step and the configuration adjustment step is performed, so as to set the LED chip mounted to each of the plurality of mounting points arranged in the grid shape.

[0132] According to this method, NC data of a component mounting device of a type in which two head units cooperate to mount components on a substrate can be generated, and the NC data can produce an LED mounting substrate capable of suppressing the occurrence of brightness unevenness at a higher level.

[0133] In this method, the LED chips installed at each of the multiple mounting points arranged in the grid can be set in such a way that the LED chips installed at the mounting points belonging to the first mounting area and the LED chips installed at the mounting points belonging to the second mounting area are LED chips supplied from different reels.

[0134] According to this method, it is possible to generate NC data capable of producing an LED mounting substrate capable of effectively suppressing the occurrence of uneven brightness.

[0135] In this method, when the LED mounting substrate has resistors for brightness adjustment in the first mounting area and the second mounting area respectively, it is preferred that: the NC data generation method also includes: a resistance value setting step, setting the resistance values ​​of the resistors corresponding to the first mounting area and the second mounting area respectively, based on the known information about the brightness of the LED chip and the information of the LED chips installed to each of the multiple mounting points arranged in a grid and the final information finally set after the configuration adjustment step.

[0136] According to this method, it is possible to generate NC data capable of producing an LED mounting substrate with less luminance deviation between the first mounting region and the second mounting region.

[0137] In each of the above-mentioned methods, the component mounting device may include a movable head unit and a plurality of tape feeders, the head unit including a plurality of mounting heads arranged in a row at a prescribed interval, and the plurality of tape feeders are arranged at the prescribed interval along the arrangement direction of the plurality of mounting heads. The NC data generating method may also include: a feeder configuration setting step, setting the configuration of the plurality of tape feeders in association with the reel according to information of LED chips set to be mounted to each of the plurality of mounting points arranged in the grid shape and final information finally determined after the configuration adjustment step; wherein, in the feeder configuration setting step, the configuration of the plurality of tape feeders is set in the final information with a configuration corresponding to a combination of the plurality of LED chips arranged in the column direction and capable of being simultaneously taken out by the plurality of mounting heads.

[0138] According to this method, it is possible to generate NC data that enables LED chips supplied from a plurality of tape feeders (reels) to be simultaneously taken out by a plurality of mounting heads and mounted on a substrate efficiently.

[0139] In this method, the combination that can be taken out simultaneously by the plurality of mounting heads can be a combination of LED chips arranged continuously in the column direction and a combination that appears most frequently in the final information. In addition, the combination that can be taken out simultaneously by the plurality of mounting heads can be a combination that minimizes the amount of movement of the head unit relative to the substrate in the column direction when the LED chips taken out simultaneously by the plurality of mounting heads are mounted on the substrate.

[0140] According to these methods, it is possible to generate NC data that can efficiently mount LED chips taken out by a plurality of mounting heads at the same time on mounting points on a substrate.

[0141] On the other hand, an NC data generating device involved in one aspect of the present invention is a device for generating NC data for manufacturing an LED mounting substrate by a component mounting device, wherein the component mounting device includes a plurality of tape feeders that respectively supply LED chips of the same type and at least one mounting head that takes out LED chips from the plurality of tape feeders and mounts them on the substrate, and a plurality of LED chips of the same type are mounted on the LED mounting substrate in a grid pattern, and the NC data generating device includes: an LED configuration setting unit that sets the LED chips mounted to each of a plurality of mounting points arranged in a grid pattern on the substrate in association with a reel loaded into the tape feeder; an area setting unit that sets a plurality of unit areas that respectively include a plurality of mounting points on the substrate; and a brightness calculation unit that calculates, for each of the plurality of unit areas, a brightness of the LED chips mounted to the reel based on known information about the brightness of the LED chips. The average brightness of the LED chips in the unit area; and a configuration adjustment unit, which determines whether the average brightness of the LED chips in each unit area is within a predetermined range, and in the case where there is a unit area outside the predetermined range, changes at least one of the LED chips installed in the area outside the predetermined range in a manner that makes the average brightness within the predetermined range, thereby ultimately determining the LED chips installed in each of the multiple mounting points arranged in the grid shape; wherein the LED configuration setting unit sets the LED chips installed in each of the multiple mounting points arranged in the grid shape in a manner that the LED chips supplied from the same reel are not adjacent in any of the row direction, column direction and oblique direction, and the configuration adjustment unit changes at least one of the multiple LED chips installed in the area outside the predetermined range to an LED chip supplied by a reel different from the reel that supplies the LED chip.

[0142] According to this configuration, by following the process of the above-mentioned NC data generation method, it is possible to generate NC data capable of producing an LED mounting substrate capable of suppressing the occurrence of brightness unevenness at a higher level.

[0143] In addition, a component mounting system according to one aspect of the present invention includes: the above-mentioned NC data generating device; and a component mounting device that produces an LED mounting substrate on which multiple LED chips of the same type are mounted in a grid pattern based on the NC data generated by the NC data generating device.

[0144] According to this configuration, one component mounting system can generate the NC data as described above and produce an LED mounting substrate using the NC data, that is, produce an LED mounting substrate in which the occurrence of brightness unevenness is suppressed at a higher level.

Claims

1. A method for generating NC data for manufacturing an LED mounting substrate by a component mounting device, wherein the component mounting device comprises a plurality of tape feeders for respectively supplying LED chips of the same type and at least one mounting head for taking out LED chips from the plurality of tape feeders and mounting them on the substrate, and mounting a plurality of the same type of LED chips on the LED mounting substrate in a grid pattern, wherein the NC data generating method comprises: An LED arrangement setting step of setting the LED chips mounted on each of a plurality of mounting points arranged in a grid pattern on the substrate in association with the reels loaded into the tape feeder; An area setting step of setting a plurality of unit areas including a plurality of mounting points respectively on the substrate; a brightness calculation step of calculating, for each of the plurality of unit areas, an average brightness of the LED chips mounted in the unit area based on known information about the brightness of the LED chips; as well as, The configuration adjustment step determines whether the average brightness of the LED chips in each unit area is within a predetermined range. If there is a unit area outside the predetermined range, at least one of the LED chips installed in the area outside the predetermined range is changed so that the average brightness is within the predetermined range, thereby finally determining the LED chips installed in each of the plurality of mounting points arranged in the grid shape; wherein, In the LED arrangement setting step, the LED chips to be mounted on each of the plurality of mounting points arranged in the grid are set so that the LED chips supplied from the same reel are not adjacent to each other in any of the row direction, the column direction and the diagonal direction. In the arrangement adjustment step, at least one of the plurality of LED chips mounted in the area outside the predetermined range is changed to an LED chip supplied from a reel different from a reel supplying the LED chip.

2. The NC data generation method according to claim 1, characterized in that: In the configuration adjustment step, at least one of the multiple LED chips installed in the area outside the predetermined range is changed in such a way that the changed LED chip and the LED chips adjacent to the LED chip in the row direction, column direction and diagonal direction are supplied from different reels.

3. The NC data generating method according to claim 1 or 2, characterized in that: The component mounting device comprises a first head unit and a second head unit each having the mounting head and independently moving, wherein the first head unit mounts the component on a predetermined first mounting area in the substrate, and the second head unit mounts the component on a second mounting area that does not overlap with the first mounting area. For each of the first mounting area and the second mounting area, the LED configuration setting step, the area setting step, the brightness calculation step and the configuration adjustment step are executed to set the LED chips installed at each of the plurality of mounting points arranged in the grid shape.

4. The NC data generating method according to claim 3, characterized in that: The LED chips mounted on each of the plurality of mounting points arranged in the grid are set so that the LED chips mounted on the mounting points belonging to the first mounting area and the LED chips mounted on the mounting points belonging to the second mounting area are supplied from different reels.

5. The NC data generating method according to claim 3 or 4, characterized in that: On the LED mounting substrate, resistors for adjusting brightness are provided in the first mounting area and the second mounting area, respectively. The NC data generating method also includes: a resistance value setting step, setting the resistance values ​​of the resistors corresponding to the first mounting area and the second mounting area respectively according to the known information about the brightness of the LED chip and the information of the LED chips installed to each of the multiple mounting points arranged in a grid shape and the final information finally set after the configuration adjustment step.

6. The NC data generating method according to any one of claims 1 to 5, characterized in that: The component mounting device comprises a movable head unit and a plurality of tape feeders, wherein the head unit comprises a plurality of mounting heads arranged in a row at a predetermined interval, and the plurality of tape feeders are arranged at the predetermined interval along the arrangement direction of the plurality of mounting heads. The NC data generation method further comprises: a feeder configuration setting step, wherein the configuration of the plurality of tape feeders is set in association with the reel according to information of LED chips installed at each of the plurality of mounting points arranged in the grid shape and final information finally determined after the configuration adjustment step; wherein, In the feeder arrangement setting step, the arrangement of the plurality of tape feeders is set in the final information in an arrangement corresponding to a combination of the plurality of LED chips arranged in a column direction and capable of being simultaneously taken out by the plurality of mounting heads.

7. The NC data generating method according to claim 6, characterized in that: The combination that can be simultaneously taken out by the plurality of mounting heads is a combination of LED chips that are continuously arranged in a column direction and is a combination that appears most frequently in the final information.

8. The NC data generating method according to claim 6, characterized in that: The combination that can be simultaneously taken out by the plurality of mounting heads is a combination that minimizes the amount of movement of the head unit in the column direction relative to the substrate when the LED chips simultaneously taken out by the plurality of mounting heads are mounted on the substrate.

9. An NC data generating device, which generates NC data for manufacturing an LED mounting substrate by a component mounting device, wherein the component mounting device comprises a plurality of tape feeders for respectively supplying LED chips of the same type and at least one mounting head for taking out LED chips from the plurality of tape feeders and mounting them on the substrate, and wherein a plurality of the same type of LED chips are mounted on the LED mounting substrate in a grid pattern, the NC data generating device comprising: An LED arrangement setting section that sets LED chips mounted on each of a plurality of mounting points arranged in a grid pattern on the substrate in association with the reels loaded into the tape feeder; An area setting unit sets a plurality of unit areas including a plurality of mounting points respectively on the substrate; a brightness calculation unit that calculates, for each of the plurality of unit areas, an average brightness of the LED chips mounted in the unit area based on known information about the brightness of the LED chips; as well as, An adjustment unit is configured to determine whether the average brightness of the LED chips in each unit area is within a predetermined range, and if there is a unit area outside the predetermined range, at least one of the LED chips installed in the area outside the predetermined range is changed in such a way that the average brightness is within the predetermined range, thereby finally determining the LED chips installed in each of the plurality of mounting points arranged in the grid shape; wherein, The LED arrangement setting unit sets the LED chips to be mounted on each of the plurality of mounting points arranged in the grid so that the LED chips supplied from the same reel are not adjacent in any of the row direction, the column direction and the diagonal direction. The arrangement adjustment unit changes at least one of the plurality of LED chips mounted in the area outside the predetermined range to an LED chip supplied from a reel different from a reel that supplies the LED chip.

10. A component mounting system, characterized in that include: The NC data generating device according to claim 9; as well as, The component mounting device produces an LED mounting substrate on which a plurality of LED chips of the same type are mounted in a grid pattern, based on the NC data generated by the NC data generating device.

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