Magnetic position sensor devices, methods, and systems with error detection

Abstract

A position sensor device includes: a first magnetic sensor, a second magnetic sensor, and a third magnetic sensor (S1, S2, S3) for measuring a first magnetic field component (Bx) oriented in a first direction (X) and a second magnetic field component (Bz) oriented in a second direction (Y; Z) perpendicular to the first direction; and a processing circuit for determining a first difference and a second difference (ΔBx13, ΔBz13) between the signals provided by the first sensor and the third sensor (S1, S3), and for outputting a first angle (θ) based on these differences. 主要 ); and for determining the third and fourth differences (ΔBx12, ΔBz12) of the signals provided by one of the first and third sensors (S1) and the second sensor (S2); and for determining the second angle (θaux12, θaux3) based on the third and fourth differences, and for outputting the second angle and / or a diagnostic signal based on a comparison between the first angle and the second angle.

Description

Technical Field

[0001] This invention relates generally to the field of magnetic position sensor systems, devices, and methods, and more specifically to linear and / or angular magnetic position sensor systems and devices with error detection capabilities, and methods for determining linear or angular positions and detecting whether an error has occurred. Background Technology

[0002] Magnetic sensor systems, particularly linear or angular position sensor systems, are known in the art. They offer the advantage of measuring linear or angular position without physical contact, thus avoiding problems such as mechanical wear, scratches, and friction.

[0003] There are many variations of position sensor systems that address one or more of the following requirements: using simple or inexpensive magnetic structures, using simple or inexpensive sensor devices, being able to measure over a relatively large area, being able to measure with high accuracy, requiring only simple arithmetic, being able to measure at high speed, being highly robust to installation errors, being highly robust to external interference fields, providing redundancy, being able to detect errors, being able to detect and correct errors, and having a good signal-to-noise ratio (SNR), etc.

[0004] Often, two or more of these needs conflict with each other, thus requiring a trade-off.

[0005] EP3783316(A1) discloses a magnetic position sensor system comprising a magnet or magnetic structure and a sensor device movably mounted relative to said magnet or magnetic structure. However, the system described in this document lacks error detection capability.

[0006] There is always room for improvement or replacement. Summary of the Invention

[0007] The purpose of embodiments of the present invention is to provide a magnetic position sensor system that can determine the position of a sensor device relative to a magnet or magnetic structure and can detect errors (e.g., errors associated with defective sensors or transducers).

[0008] The purpose of embodiments of the present invention is also to provide sensor devices specifically suited for such systems.

[0009] The purpose of embodiments of the present invention is also to provide a method for determining the position of a sensor device relative to a magnet or magnetic structure, and to provide additional information indicating errors, and / or to allow another processor connected to the sensor device to detect errors.

[0010] The purpose of embodiments of the present invention is to provide systems, devices, and methods in which location is determined in a manner highly insensitive to external interference fields (also known as "spurious fields"), and in which error detection is also highly insensitive to external interference fields.

[0011] The object of embodiments of the present invention is to provide an integrated circuit having a reduced area (e.g., a smaller silicon chip) without reducing the accuracy of the measured position.

[0012] These and other objectives are achieved through embodiments of the present invention.

[0013] According to a first aspect, the present invention provides a position sensor device, comprising: a substrate including a first magnetic sensor, a second magnetic sensor, and a third magnetic sensor (e.g., S1, S2, S3) spaced apart in a first direction (e.g., X), each magnetic sensor being capable of measuring at least a first magnetic field component (e.g., Bx) oriented in the first direction (e.g., X) and a second magnetic field component (e.g., Bz) oriented in a second direction perpendicular to the first direction (e.g., Y; Z);

[0014] A processing circuit, connected to the magnetic sensor (e.g., S1, S2, S3), and configured to:

[0015] a) Determine (e.g., calculate) a first difference (e.g., ΔBx13) between a first magnetic field component (e.g., Bx1, Bx3) provided by a first sensor and a third sensor (e.g., S1, S3), and configure it to determine a second difference (e.g., ΔBz13) between a second magnetic field component (e.g., Bz1, Bz3) provided by the first sensor and the third sensor (e.g., S1, S3), and to calculate a first angle (e.g., θ) based on the ratio of the first difference (e.g., ΔBx13) to the second difference (e.g., ΔBz13). 主要 ), and is used to output the first angle (e.g., θ). 主要 );

[0016] b) and used to determine (e.g., calculate) a third difference (e.g., ΔBx12) between a first magnetic field component (e.g., Bx2) provided by a second sensor (e.g., S2) and a first magnetic field component (e.g., Bx1) provided by one of the first and third sensors (e.g., S1).

[0017] c) and for determining (e.g., calculating) a fourth difference (e.g., ΔBz12) between the second magnetic field component (e.g., Bz2) provided by the second sensor (e.g., S2) and the second magnetic field component (e.g., Bz1) provided by one of the first and third sensors (e.g., S1).

[0018] d) and used to determine (e.g., calculate) a second angle (e.g., θaux12; θaux3) based on the third and fourth differences (e.g., ΔBx12, ΔBz12), and used to output the second angle (e.g., θaux12; θaux3) and / or from the first angle (e.g., θ 主要 The diagnostic signal or value derived therefrom is derived by comparing the second angle (e.g., θaux12; θaux3) with the second angle.

[0019] In other words, signals from the first sensor and the third sensor (S1 and S3) are used to calculate the first difference and the second difference; and signals from the second sensor (S2) and the first sensor or the third sensor are used to calculate the third difference and the fourth difference.

[0020] The main advantage of this embodiment is that both the first angle (also referred to herein as the "primary angle") and the second angle (also referred to herein as the "auxiliary angle") are calculated based on the difference signals (or gradients), because these difference signals are highly robust to external magnetic interference fields.

[0021] The main advantage of this embodiment is that the first angle is calculated based on the ratio of two difference signals (or gradients), because this ratio is highly robust to temperature changes, demagnetization effects, and the distance between the magnet and the sensor device.

[0022] The main advantage of this embodiment is that it provides the ability to detect errors without doubling the number of magnetic sensor elements, and thus without doubling the amount of space occupied by these sensor elements.

[0023] The main advantage of embodiments of sensors that include integrated magnetic concentrators is that the space occupied by the IMC is not doubled, but only increased by 50%, because doubling the space could negatively impact the method of producing such equipment, especially the time and / or yield required for electroplating.

[0024] In this embodiment, the first angle can be calculated according to the following formula:

[0025] θ 主要 =atan2(ΔBx13,ΔBz13), where θ 主要 The first angle is ΔBx13, which is the first difference, and ΔBz13 is the second difference.

[0026] In this embodiment, the position sensor device includes only three magnetic sensors: the first magnetic sensor, the second magnetic sensor, and the third magnetic sensor (e.g., S1, S2, S3).

[0027] The advantage of this embodiment is that it requires only three sensor locations, thus requiring a smaller substrate area (e.g., silicon area) compared to sensor devices that include four sensors spaced apart in the X direction.

[0028] In this embodiment, the first sensor, the second sensor, and the third sensor are located in a straight line.

[0029] In this embodiment, the first sensor, the second sensor, and the third sensor are located at the corners of the triangle.

[0030] In an embodiment, the first sensor, the second sensor, and the third sensor are located in a straight line, and the first sensor (e.g., S1) and the third sensor (e.g., S3) are spaced 1.0 mm to 3.0 mm, or 1.25 mm to 2.75 mm, or 1.5 mm to 2.5 mm apart; and the second sensor (e.g., S2) is located between the first sensor (e.g., S1) and the third sensor (e.g., S3).

[0031] The second sensor may be located at a distance of at least 0.3 mm or at least 0.4 mm from the first and third sensors.

[0032] As an example, the first sensor may be located at X1 = 0.0 mm, the second sensor at X2 = 0.4 mm, and the third sensor at X3 = 2.5 mm. Surprisingly, the distance between the locations of the first and second sensors can be as small as 0.3 mm or 0.4 mm, especially if each of these sensors includes an integrated magnetic concentrator with a diameter of approximately 150 to 250 micrometers, which would cause the field lines near the IMC to bend.

[0033] In one embodiment, the first, second, and third sensors are located at the corners of a triangle. In a particular embodiment, the triangle has a base and a height perpendicular to the base, and the height-to-base ratio (H / B) is less than 20%. In another or further embodiment, the base has a length in the range of 1.0 mm to 3.0 mm, or 1.25 mm to 2.75 mm, or 1.5 mm to 2.5 mm; and a height less than 0.5 mm, or less than 0.4 mm, or less than 0.3 mm; and the first and third sensors (S1, S3) are located on the base.

[0034] In this embodiment, the substrate is a semiconductor substrate. Preferably, the first sensor, the second sensor, and the third sensor are integrated in the semiconductor substrate.

[0035] In an embodiment, the processing circuitry is configured to calculate the second angle based on a (second) ratio (e.g., R2) of the third and fourth differences.

[0036] The main advantage of this embodiment is that the first angle and the second angle are calculated based on the ratio of two difference signals (or gradients), because this ratio is highly robust to temperature changes, demagnetization effects, and the distance between the magnet and the sensor device, and thus reduces installation tolerances.

[0037] It should be noted that in this embodiment, it is not absolutely necessary to calculate the second angle and compare the first angle with the second angle; comparing the first ratio with the second ratio is sufficient. The ratio comparison can be performed internally or externally to the sensor device. The first and second ratios can also be output to allow an external processor to perform the comparison.

[0038] In this embodiment, each magnetic sensor is a 2D magnetic pixel, rather than a 3D magnetic pixel. This provides the advantage of each magnetic sensor including fewer magnetically sensitive elements, thereby reducing the risk of defects.

[0039] In this embodiment, each magnetic sensor is a 3D magnetic pixel (in terms of hardware), but the readout circuitry is configured to read out only two magnetic field components. This provides the advantage of being able to reuse existing hardware (e.g., layout). It also provides the advantage of the sensor being read out faster (at a higher frequency).

[0040] In this embodiment, each magnetic sensor is a 3D magnetic pixel (in terms of hardware), and the readout circuitry is configured to read out three magnetic field components. However, the processing software uses only two of these components and ignores one. This provides the advantage of being able to reuse existing hardware (e.g., layout) and readout schemes while taking advantage of the beneficial effects of this invention.

[0041] In an embodiment, the second angle is calculated according to the following formula: θaux12=atan2(ΔBx12,ΔBz12), where θaux12 is the second angle, ΔBx12 is the third difference, and ΔBz12 is the fourth difference.

[0042] The advantage of this embodiment is that it only requires calculating two angles, namely θ. 主要 (Based on sensors S1 and S3) and θaux12 (based on sensors S1 and S2).

[0043] In a simple implementation, two angles θ can be compared easily. 主要 The error is detected if the values ​​of θaux12 deviate too much from θaux12.

[0044] In a slightly improved implementation, θ 主要 The angular difference between θaux12 and θaux12 is measured and stored in non-volatile memory and is taken into account in the comparison.

[0045] In this embodiment, the second sensor is preferably not located in the middle between the first sensor and the third sensor, but relatively close to the first sensor or the third sensor, for example, at a distance of 0.4 mm to 0.6 mm from the first sensor or the third sensor.

[0046] In an embodiment, the processing circuit is further configured to calculate a fifth difference (e.g., ΔBx23) between a first magnetic field component (e.g., Bx2) provided by a second sensor (e.g., S2) and a first magnetic field component (e.g., Bx3) provided by another of the first and third sensors (e.g., S3); and wherein the processing circuit is further configured to calculate a sixth difference (e.g., ΔBz23) between a second magnetic field component (e.g., Bz2) provided by the second sensor (e.g., S2) and a second magnetic field component (e.g., Bz3) provided by the other of the first and third sensors (e.g., S3); and wherein the processing circuit is further configured to calculate the second angle (e.g., θaux3) by adapting to the third and fourth differences (e.g., ΔBx12, ΔBz12) and the fifth and sixth differences (e.g., ΔBx23, ΔBz23).

[0047] In this embodiment, the second sensor is preferably located between the first sensor and the third sensor.

[0048] In an embodiment, the second angle can be calculated as a linear combination, such as the average or weighted average of angles θaux12 and θaux23, where θaux12 is calculated as: θaux12=atan2(ΔBx12,ΔBz12), where ΔBx12 is the third difference and ΔBz12 is the fourth difference, and where θaux23=atan2(ΔBx23,ΔBz23), where ΔBx23 is the fifth difference and ΔBz23 is the sixth difference.

[0049] In an embodiment, the second angle can be calculated according to the following formula: θaux3=atan2[(ΔBx23-ΔBx12),(ΔBz23-ΔBz12)], where ΔBx12 is the third difference, ΔBz12 is the fourth difference, ΔBx23 is the fifth difference, and ΔBz23 is the sixth difference.

[0050] In an embodiment, the first sensor, the second sensor, and the third sensor are located in a straight line, and the second sensor (e.g., S2) is located in the middle between the first sensor (e.g., S1) and the third sensor (e.g., S3).

[0051] The advantage of this embodiment is that it provides the same accuracy (for the primary angle) as a position sensor device with only a first and a third sensor and no sensor in between; however, it also provides the benefit of error detection. Specifically, this embodiment allows the three angles to be calculated in an immune stray field manner, and the primary angle (with high accuracy) should be equal to the average of the two other angles (with slightly lower accuracy due to the reduced distance Δx).

[0052] However, it should be noted that the invention will still work if the second sensor is not located exactly in the middle between the first and third sensors, but rather at a distance, for example, approximately 30% to 45% of the distance between the first and third sensors. In this case, the primary angle should still be the value between the first auxiliary angle (derived from the signals obtained from S1 and S2) and the second auxiliary angle (derived from the signals obtained from S2 and S3) (assuming the first and second auxiliary angles are sufficiently accurate), and the primary angle should be equal to the weighted average of the first and second auxiliary angles. The weighting factor depends on the relative position of the second sensor.

[0053] In an embodiment, each of the first, second, and third sensors (e.g., S1, S2, S3) includes an integrated magnetic concentrator (e.g., IMC1, IMC2, IMC3) and two horizontal Hall elements arranged on opposite sides of the IMC.

[0054] In some embodiments of these examples, the position sensor device includes three IMCs, each with only two horizontal Hall elements, thus totaling only six horizontal Hall elements, for example, such as Figure 5 Part (c) Figure 6 Part (c) Figure 7 Part (c) Figure 8 Part (c) Figure 9 (d) part Figure 10B As shown. The advantage of this embodiment is that it requires only six sensor elements. The advantage is that the sensor device includes three identical sensors (with the same layout, only repositioned).

[0055] In an embodiment, each of the first sensor, the second sensor, and the third sensor (e.g., S1, S2, S3) includes a horizontal Hall element and a vertical Hall element.

[0056] In an embodiment, each of the first sensor, the second sensor, and the third sensor (e.g., S1, S2, S3) includes a horizontal Hall element and a pair of vertical Hall elements located on opposite sides of the horizontal Hall element.

[0057] Example in Figure 5(d) part Figure 6 (d) part Figure 7 (d) part Figure 9 part (f), Figure 10C As shown in the figure. The advantage of this embodiment is that it requires only six sensor elements or only nine sensor elements.

[0058] In the case where the sensor includes a pair of vertical Hall elements, the signals from the pair can be compared to see if they match in order to determine the error, and if no error is found, the signals can be added together (summed) to improve the signal-to-noise ratio and thus improve the accuracy.

[0059] In an embodiment, each of the first sensor, the second sensor, and the third sensor (e.g., S1, S2, S3) includes two vertical Hall elements having maximum sensitivity directions perpendicular to each other.

[0060] In an embodiment, each of the first, second, and third sensors (e.g., S1, S2, S3) includes two pairs of vertical Hall elements arranged around a virtual square.

[0061] Preferably, in this case, the position sensor device does not include an integrated magnetic collector.

[0062] Figure 8 part (e) and Figure 9 Section (e) shows an example of a sensor device including sensors, each sensor comprising only two vertical Hall elements. The advantage of this embodiment is that diagnostic functionality is provided by adding only two sensor elements (instead of four).

[0063] In the case where the sensor includes two pairs of vertical Hall elements, signals from the elements within a pair can be compared to see if they match in order to determine the error. If no error is found, the signals can be added (summed) to improve the signal-to-noise ratio (SNR) and thus improve accuracy. The advantage of this embodiment is that it can provide error detection and improve the SNR.

[0064] In an embodiment, each of the first and third sensors (e.g., S1, S3) includes an integrated magnetic concentrator and four horizontal Hall elements spaced apart at multiples of 90° in angle. These four horizontal Hall elements consist of a first Hall element and a second Hall element spaced apart along a first direction (e.g., X), and a third Hall element and a fourth Hall element spaced apart in a direction perpendicular to the first direction; wherein a first angle (e.g., θ) is calculated based on signals obtained from the first and second Hall elements. 主要The sensor device is further configured to determine a first sum (e.g., sum1) as the sum of signals obtained from a first Hall element and a second Hall element, and to calculate a second sum (e.g., sum2) as the sum of signals obtained from a third Hall element and a fourth Hall element, and to take into account the matching of the first sum and the second sum when determining a diagnostic signal.

[0065] Or, to put it simply, in this embodiment, a first sum of signals from the Hall element located on the X-axis is compared with a second sum from the Hall element located on the Y-axis, and a mismatch between the first and second sums is considered an indication of error detection.

[0066] The advantage of this embodiment is that the third and fourth Hall elements are not actually used to determine angular position and do not significantly increase the sensor layout or the readout of the sensor elements, but can still be advantageously used to detect errors or related errors of the first and second Hall elements. In other words, fault coverage is increased.

[0067] In the embodiment, the first sensor and the third sensor each have an IMC and four horizontal Hall elements, while the second sensor has an IMC with only two horizontal Hall elements, and the "test with the first and the second" is performed only on the first and the third sensors.

[0068] In one embodiment, each of the first, second, and third sensors has an IMC and four horizontal Hall elements, and a “test with the first and the second” is performed on all three sensors.

[0069] According to a second aspect, the present invention also provides a magnetic position sensor system, comprising: a magnetic source for generating a magnetic field having at least two magnetic poles; and a position sensor device according to the first aspect, the position sensor device being movable relative to the magnetic source and vice versa.

[0070] In one embodiment, the magnetic source is a permanent magnet that can rotate about a rotation axis; and the position sensor device is mounted at a non-zero radial distance (e.g., Rs) from the rotation axis and oriented such that a first direction (e.g., X) is tangent to an imaginary circle having a center on the rotation axis.

[0071] Such position sensor systems are often referred to as "angular position sensor systems".

[0072] The magnet may be an axially or diametrically or radially magnetized toroidal or disk-shaped magnets, more specifically, an axially or diametrically bipolar toroidal or disk-shaped magnets, or an axially or radially magnetized toroidal or disk-shaped magnets having more than two poles, such as at least four poles, at least six poles, or at least eight poles.

[0073] The magnet can be a bipolar ring or disk magnet that is magnetized axially or diametrically.

[0074] The magnet may be an axially magnetized ring or disk magnet having at least four, six, or eight poles.

[0075] The magnet may be a radially magnetized ring having at least four, at least six, or at least eight poles.

[0076] In an embodiment, the substrate of the sensor device is oriented perpendicular to the rotation axis, and the magnet has an outer radius (e.g., Ro). The geometric center of the sensors (e.g., S1, S2, S3) of the sensor device is located at a radial position (e.g., Rs) of 30% to 95%, 30% to 90%, 30% to 85%, or 30% to 80% of the outer radius (e.g., Ro), and at an axial position above the top surface or below the bottom surface of the magnet, for example, as... Figure 6 As shown in part (a).

[0077] In an embodiment, the substrate of the sensor device is oriented parallel to the axis of rotation, and the magnet has an outer radius (e.g., Ro). The geometric center of the sensors (e.g., S1, S2, S3) of the sensor device is located at a radial position (e.g., Rs) of 30% to 95%, 30% to 90%, 30% to 85%, or 30% to 80% of the outer radius (e.g., Ro), and at an axial position above the top surface or below the bottom surface of the magnet, for example, as... Figure 7 As shown in part (a).

[0078] In an embodiment, the substrate of the sensor device is oriented perpendicular to the axis of rotation, and the magnet has an outer radius (e.g., Ro). The geometric center of the sensors (e.g., S1, S2, S3) of the sensor device is located at a radial position (e.g., Rs) of 105% to 200%, 105% to 175%, 105% to 150%, or 110% to 150% of the outer radius (e.g., Ro), and is located at an axial position substantially inside the bottom surface or the top surface, or at an axial position between the bottom surface and the top surface (e.g., at an axial position substantially in the middle between the top surface and the bottom surface), for example, as... Figure 8 As shown in part (a).

[0079] In an embodiment, the substrate of the sensor device is oriented parallel to the axis of rotation, and the magnet has an outer radius (e.g., Ro). The geometric center of the sensors (e.g., S1, S2, S3) of the sensor device is located at a radial position (e.g., Rs) of 105% to 200%, 105% to 175%, 105% to 150%, or 110% to 150% of the outer radius (e.g., Ro), and is located at an axial position substantially inside the bottom surface or the top surface, or at an axial position between the bottom surface and the top surface (e.g., at an axial position substantially in the middle between the top surface and the bottom surface), for example, as... Figure 8 As shown in part (a).

[0080] In an embodiment, the substrate of the sensor device is oriented perpendicular to the axis of rotation, and the magnet has an outer radius (e.g., Ro). The geometric center of the sensors (e.g., S1, S2, S3) of the sensor device is located at a radial position (e.g., Rs) of 105% to 200%, or 105% to 175%, or 105% to 150%, or 110% to 150% of the outer radius (e.g., Ro), and at an axial position (not explicitly shown) above the top surface or below the bottom surface of the magnet.

[0081] In an embodiment, the substrate of the sensor device is oriented parallel to the axis of rotation, and the magnet has an outer radius (e.g., Ro). The geometric center of the sensors (e.g., S1, S2, S3) of the sensor device is located at a radial position (e.g., Rs) of 105% to 200%, or 105% to 175%, or 105% to 150%, or 110% to 150% of the outer radius (e.g., Ro), and at an axial position (not explicitly shown) above the top surface or below the bottom surface of the magnet.

[0082] In an embodiment, the magnetic source is a bipolar magnet or an elongated structure extending in the longitudinal direction and comprising a plurality of at least two alternating magnetic pole pairs; and the position sensor device is movable in the longitudinal direction at a non-zero distance from the magnetic source.

[0083] Preferably, the distance is substantially constant. Preferably, the sensor device is oriented such that its first direction (X) is parallel to the longitudinal direction of the magnetic source.

[0084] Such position sensor systems are commonly referred to as "linear position sensor systems". Preferably, in this case, the position sensor device is further configured to convert a first angle θ1 into a first linear position in a manner known in the art.

[0085] In an embodiment, the magnetic structure has a plane of symmetry parallel to the orientation of the residual magnetic field, and the first, second, and third sensors of the sensor device are substantially located in this plane of symmetry.

[0086] In one embodiment, the substrate of the sensor device is oriented orthogonal to the orientation of the residual magnetic field inside the magnetic source, and the second direction is oriented perpendicular to the substrate, for example, as shown in the example. Figures 10A-10C As shown.

[0087] In one embodiment, the substrate of the sensor device is oriented parallel to the orientation of the residual magnetic field inside the magnetic source, and a second direction is oriented parallel to the substrate (not explicitly shown).

[0088] In an embodiment, the magnetic position sensor system further includes a second processor (e.g., an ECU) communicatively connected to the position sensor device and configured to perform one of the following: i) receiving a first angle (e.g., θ). 主要 ), and receive a second angle (e.g., θaux12), and compare the first angle and the second angle to detect an error; ii) receive the first angle (θ 主要 It also receives diagnostic signals indicating errors.

[0089] In this embodiment, the first and second processors can cooperate to detect whether an error has occurred and / or take appropriate action at the system level. The probability of error detection can be further increased by executing certain functions on two different processors.

[0090] According to a third aspect, the present invention also provides a method for determining a linear or angular position based on signals obtained from three magnetic sensors (e.g., S1, S2, S3), the three magnetic sensors (e.g., S1, S2, S3) being spaced apart along a first direction (e.g., X) and capable of measuring at least two orthogonal magnetic field components (e.g., Bx, Bz; e.g., Bx, By); the method includes the following steps:

[0091] a) Determine the first difference and the second difference (e.g., ΔBx13, ΔBz13) of the signals provided by the first sensor and the third sensor (e.g., S1, S3);

[0092] b) Determine and output the first angle (e.g., θ) based on the first difference and the second difference (e.g., based on the first ratio of the first difference to the second difference). 主要 );

[0093] c) Determine the third and fourth differences (e.g., ΔBx12, ΔBz12) of the signals provided by one of the first and third sensors (e.g., S1) and the second sensor (e.g., S2); and

[0094] d) Determine the second angle based on the third and fourth differences (e.g., θaux12; θaux3);

[0095] e) Optionally, the first angle (e.g., θ) 主要 Compare it with a second angle (e.g., θaux12; θaux3);

[0096] f) Output a second angle (e.g., θaux12; θaux3) and / or a diagnostic signal based on a comparison of the first angle and the second angle.

[0097] According to a fourth aspect, the present invention provides a position sensor device, comprising: a substrate including a first magnetic sensor, a second magnetic sensor, and a third magnetic sensor (e.g., S1, S2, S3) spaced apart in a first direction (e.g., X), each magnetic sensor being capable of measuring at least a first magnetic field component (e.g., Bx) oriented in the first direction (e.g., X) and a second magnetic field component (e.g., Bz) oriented in a second direction perpendicular to the first direction (e.g., Y; Z);

[0098] A processing circuit, connected to the magnetic sensor (e.g., S1, S2, S3), and configured to:

[0099] a) Determine a first difference (e.g., ΔBx13) between a first magnetic field component (e.g., Bx1, Bx3) provided by a first sensor and a third sensor (e.g., S1, S3), and be configured to determine a second difference (e.g., ΔBz13) between a second magnetic field component (e.g., Bz1, Bz3) provided by the first sensor and the third sensor (e.g., S1, S3), and to calculate a first ratio (R1) of the first difference (e.g., ΔBx13) to the second difference (e.g., ΔBz13), and to calculate a first angle (e.g., θ) based on the first ratio. 主要 ), and is used to output the first angle (e.g., θ). 主要 );

[0100] b) and used to determine a third difference (e.g., ΔBx12) between the first magnetic field component (e.g., Bx2) provided by the second sensor (e.g., S2) and the first magnetic field component (e.g., Bx1) provided by one of the first and third sensors (e.g., S1).

[0101] c) and for determining a fourth difference (e.g., ΔBz12) between the second magnetic field component (e.g., Bz2) provided by the second sensor (e.g., S2) and the second magnetic field component (e.g., Bz1) provided by one of the first and third sensors (e.g., S1).

[0102] d) and used to calculate the second ratio (e.g., R2) of the third difference to the fourth difference;

[0103] e) and used to optionally determine a second angle (e.g., θaux12; θaux3) based on a second ratio (e.g., R2), optionally using a first angle (e.g., θ... 主要 The first angle (e.g., θaux12; θaux3) is compared with the second angle (e.g., θaux12; θaux3) to produce a first result; optionally, the first ratio (e.g., R1) is compared with the second ratio (e.g., R2) to produce a second result; and at least one of the following is output: the second angle (e.g., θaux12; θaux3), the first ratio and the second ratio (e.g., R1, R2), and a diagnostic signal based on the first result and / or the second result.

[0104] To detect errors, it is not necessary to calculate two angles; instead, errors can be detected by comparing two ratios. This comparison can be performed inside or outside the sensor device (e.g., in the ECU).

[0105] For the sensor device according to the fourth aspect, similar embodiments as described above with respect to the first aspect can also be developed.

[0106] According to a fifth aspect, the present invention provides a system including a sensor device according to a fourth aspect.

[0107] In an embodiment, the magnetic position sensor system further includes a second processor (e.g., an ECU) communicatively connected to the position sensor device and configured to perform one of the following: i) receiving a first angle and a second angle, and comparing the first angle and the second angle to detect an error; ii) receiving the first angle (θ). 主要 ), and receive a diagnostic signal indicating an error; iii) receive a first ratio and a second ratio, and compare the first ratio and the second ratio to detect an error;

[0108] According to a sixth aspect, the present invention also provides a method for determining a linear or angular position based on signals obtained from three magnetic sensors (e.g., S1, S2, S3), the three magnetic sensors (e.g., S1, S2, S3) being spaced apart along a first direction (e.g., X) and capable of measuring at least two orthogonal magnetic field components (e.g., Bx, Bz; e.g., Bx, By); the method includes the following steps:

[0109] a) Determine the first difference and the second difference (e.g., ΔBx13, ΔBz13) of the signals provided by the first sensor and the third sensor (e.g., S1, S3), and determine the first ratio (e.g., R1) of the first difference to the second difference;

[0110] b) Determine and output the first angle (e.g., θ) based on the first ratio (e.g., R1). 主要 );

[0111] c) Determine the third and fourth differences (e.g., ΔBx12, ΔBz12) of the signals provided by one of the first and third sensors (e.g., S1) and the second sensor (e.g., S2); and

[0112] d) Determine the second ratio (e.g., R2) based on the third and fourth differences;

[0113] e) and used to optionally determine a second angle (e.g., θaux12; θaux3) based on a second ratio (e.g., R2), optionally using a first angle (e.g., θ... 主要 The first result is produced by comparing the first ratio (e.g., R1) with the second ratio (e.g., R2).

[0114] And output at least one of the following: a second angle (e.g., θaux12; θaux3), a first ratio and a second ratio (e.g., R1, R2), and a diagnostic signal based on the first result and / or the second result.

[0115] Specific and preferred aspects of the invention are set forth in the appended independent and dependent claims. Features from the dependent claims may be suitably combined with features of the independent claims and other dependent claims, and not merely as expressly set forth in the claims.

[0116] These and other aspects of the invention will become apparent from the embodiments described herein, and are illustrated with reference to these embodiments. Attached Figure Description

[0117] Figure 1 This is a schematic block diagram of a sensor structure similar to the sensor structure that can be used in embodiments of the present invention. The sensor structure includes a first sensor at a first sensor position X1 and a second sensor at a second sensor position X2, the first and second sensors being spaced apart along the X-axis. Each sensor includes an integrated magnetic concentrator (IMC) and a pair of horizontal Hall elements arranged on opposite sides of the IMC. Each sensor is a 2D magnetic pixel capable of measuring a first magnetic field component Bx oriented in the X-direction and a second magnetic field component Bz perpendicular to the X-axis.

[0118] Figure 2AThis is a schematic block diagram of another sensor structure similar to the sensor structure that can be used in embodiments of the present invention.

[0119] Figure 2B This is a schematic block diagram of another sensor structure similar to the sensor structure that can be used in embodiments of the present invention.

[0120] Figure 2C This is a schematic block diagram of another sensor structure similar to the sensor structure that can be used in embodiments of the present invention.

[0121] Figure 3 This is a schematic block diagram of a sensor structure similar to the sensor structure that can be used in embodiments of the present invention.

[0122] Figure 4 This is a schematic block diagram of another sensor structure similar to the sensor structure that can be used in embodiments of the present invention.

[0123] Figure 5 Part (a) and Figure 5 Part (b) shows an angle sensor system including a cylindrical magnet and a magnetic sensor device including a substrate oriented such that the substrate is perpendicular to the axis of rotation of the magnet and mounted in an “off-axis” position. Figure 5 Part (c) to Figure 5 The (h) part shows that it can be generated by Figure 5 The sensor device in part (a) is used to measure angular position and to detect errors. The sensor structure and formula are described.

[0124] Figure 6 part (a) and Figure 6 Part (b) shows an angle sensor system including a cylindrical magnet and a magnetic sensor device including a substrate and oriented such that the substrate is parallel to the axis of rotation of the magnet and mounted in an “off-axis” position. Figure 6 Part (c) to Figure 6 The (g) part shows that it can be made by Figure 6 The sensor device in part (a) is used to measure angular position and to detect errors. The sensor structure and formula are described.

[0125] Figure 7 part (a) and Figure 7 Part (b) illustrates an angle sensor system including a cylindrical magnet and a magnetic sensor device comprising a substrate. The sensor device is mounted "near the equator" and oriented such that the substrate is perpendicular to the axis of rotation of the magnet. Figure 7 Part (c) and Figure 7 Part (d) shows that it can be made by Figure 7The sensor device in part (a) is a sensor structure used to measure angular position and to detect errors.

[0126] Figure 8 Part (a) to Figure 8 Section (c) illustrates an angle sensor system including a cylindrical magnet and a magnetic sensor device comprising a substrate. The sensor device is mounted "near the equator" and oriented such that the substrate is parallel to the axis of rotation of the magnet. Figure 8 part (d) to Figure 8 Part (f) shows that it can be made by Figure 8 The sensor device in part (a) is a sensor structure used to measure angular position and to detect errors.

[0127] Figure 9 Part (a) illustrates a linear sensor system comprising an elongated magnetic structure including multiple alternating magnetic poles and a magnetic sensor device including a substrate movable relative to the magnetic structure. The sensor device has a substrate perpendicular to the residual magnetic field within the magnetic structure. Figure 9 Part (b) to Figure 9 Part (d) shows that it can be made by Figure 9 The sensor device in part (a) is a sensor structure used to measure linear position and to detect errors.

[0128] Figures 10A to 10C It shows Figure 9 A variation of the linear position sensor system in which the magnet is a bipolar magnet, rather than a magnetic structure comprising multiple alternating magnetic poles.

[0129] Figure 11 This invention illustrates a method that can be proposed by... Figure 5 (a) part or Figure 6 (a) part or Figure 7 (a) part or Figure 8 (a) part or Figure 9 (a) part or Figures 10A-10C The flowchart shows the method performed by the sensor device.

[0130] Figure 12 An electrical block diagram of a circuit that can be used in the position sensor device described above is shown.

[0131] These figures are illustrative and not restrictive. In the figures, some elements may be enlarged and not drawn to scale for illustrative purposes. No reference numerals in the claims should be construed as limiting. In different figures, the same reference numerals refer to the same or similar elements. Detailed Implementation

[0132] The invention will be described with reference to specific embodiments and particular drawings, but the invention is not limited thereto but is defined only by the claims.

[0133] The terms "first," "second," etc., used in the specification and claims are used to distinguish between similar elements and are not necessarily used to describe a temporal, spatial, hierarchical, or any other order. It should be understood that such terms are interchangeable where appropriate, and embodiments of the invention described herein can be operated in a different order than that described or illustrated herein.

[0134] The terms top, bottom, etc., used in the specification and claims are for descriptive purposes and are not necessarily used to describe relative positions. It should be understood that the terms used so are interchangeable where appropriate, and the embodiments of the invention described herein can operate in other orientations than those described or illustrated herein.

[0135] It should be noted that the term "comprising" as used in the claims should not be construed as limiting oneself to the means listed thereafter; it does not exclude other elements or steps. Therefore, the term should be interpreted as specifying the presence of the features, integers, steps, or components stated as mentioned, but does not exclude the presence or addition of one or more other features, integers, steps, or components, or groups thereof. Thus, the scope of a "device comprising means A and means B" should not be limited to a device consisting solely of components A and B. This means that, for the purposes of this invention, the only relevant components of the device are A and B.

[0136] Throughout this specification, the reference to "an embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of the invention. Therefore, the phrase "in one embodiment" or "in an embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, but may refer to the same embodiment. Furthermore, in one or more embodiments, as will be obvious to those skilled in the art from this disclosure, particular features, structures, or characteristics can be combined in any suitable manner.

[0137] Similarly, it should be understood that in the description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, drawing, or description for the purpose of streamlining the disclosure and aiding in the understanding of one or more inventive aspects. However, this approach to the disclosure should not be construed as reflecting an intention to claim more features than are expressly recited in each claim. Rather, as reflected in the appended claims, inventive aspects exist in fewer features than all the features of a single foregoing disclosed embodiment. Therefore, the claims appended following the detailed embodiments are thus explicitly incorporated into this detailed embodiment, wherein each claim itself represents a separate embodiment of the invention.

[0138] Furthermore, as will be understood by those skilled in the art, although some embodiments described herein include some features included in other embodiments but not others included in other embodiments, combinations of features from different embodiments are intended to fall within the scope of the invention and form different embodiments. For example, in the appended claims, any claimed embodiment may be used in any combination.

[0139] Numerous specific details are set forth in the description provided herein. However, it should be understood that embodiments of the invention may be practiced without these specific details. In other instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this description.

[0140] In this document, unless otherwise expressly stated, the term "magnetic sensor device" or "sensor device" refers to a device comprising at least one "magnetic sensor" or at least one "magnetic sensor element," which is preferably integrated in a semiconductor substrate. The sensor device may be included in a package (also referred to as a "chip"), but this is not strictly necessary. The sensor device preferably comprises a semiconductor substrate.

[0141] In this document, the terms “sensor element” or “magnetic sensor element” or “magnetic sensor” can refer to a component or group of components or subcircuit or structure capable of measuring magnetic quantities, such as, for example, a magnetoresistive element, a GMR element, an XMR element, a horizontal Hall plate, a vertical Hall plate, a Wheatstone bridge containing at least one (but preferably four) magnetoresistive elements, or combinations thereof.

[0142] In some embodiments of the present invention, the term "magnetic sensor" or "magnetic sensor structure" may refer to an arrangement comprising one or more integrated magnetic concentrators (IMCs) (also called integrated flux concentrators) and one or more horizontal Hall elements arranged near the periphery of the IMC, for example, a disk-shaped IMC having two horizontal Hall elements spaced 180° apart from each other (e.g., such as...). Figure 1 (as shown), or an IMC with four horizontal Hall elements spaced 90° apart (e.g., as shown). Figure 3 (As shown).

[0143] In this document, the terms "in-plane component of the magnetic field vector" and "projection of the magnetic field vector onto the sensor plane" have the same meaning. If the sensor device is or includes a semiconductor substrate, this also means "the magnetic field component is parallel to the semiconductor plane".

[0144] In this document, the terms "out-of-plane component of a vector", "Z-component of a vector", and "projection of a vector onto an axis perpendicular to the sensor plane" have the same meaning.

[0145] Embodiments of the present invention are typically described using an orthogonal coordinate system fixed to the sensor device and having three axes X, Y, and Z, wherein the X and Y axes are parallel to the substrate, and the Z axis is perpendicular to the substrate. Furthermore, in the case of a linear position sensor, the X axis is preferably oriented "parallel to the direction of relative movement," or in the case of a curved movement trajectory, it is preferably oriented "tangent to the movement trajectory," or in the case of an angular position sensor system including a rotatable magnet, it is preferably oriented in a "circumferential direction" (i.e., tangent to an imaginary circle having a center located on the axis of rotation). In the case of an angular position sensor system, one of the other axes (Y or Z) is preferably oriented parallel to the axis of rotation of the magnet.

[0146] In this document, the terms "spatial derivative," "derivative," "spatial gradient," or "gradient" are used as synonyms. In the context of this invention, the gradient is generally defined as the difference between two values ​​measured at two locations spaced apart in the X-direction. Theoretically, the gradient is calculated as the difference between two values ​​divided by the distance "dx" between the sensor locations; however, in practice, the division by "dx" is usually omitted because the measured signal needs to be scaled regardless. Therefore, in the context of this invention, the magnetic field difference (ΔBx) and the magnetic field gradient dBx / dx are used interchangeably.

[0147] In this document, the term "amplitude of the magnetic field component By" means "the maximum absolute value of the By signal over the entire 360° (electric) rotation", and the same applies to Bx and Bz.

[0148] In this application, horizontal Hall plates are typically represented by H1, H2, etc., and signals from these horizontal Hall plates are typically represented by h1, h2, etc.; vertical Hall plates are typically represented by V1, V2, etc.; and signals from these vertical Hall plates are typically represented by v1, v2, etc.

[0149] In the context of this invention, the formulas arctan(x / y), atan2(x,y), and arccot(y / x) are considered equivalent.

[0150] In this application, when referring to "the sensor device is located at axial position z and radial position Rs", it actually means that the center position of the sensor of the device is located at the axial position and radial position.

[0151] This invention generally relates to linear or angular magnetic position sensor systems, which include sensor devices and magnetic sources, such as permanent magnets, such as axially, diametrically, or radially magnetized annular or disk magnets, such as axially or diametrically magnetized bipolar annular or disk magnets, or axially or radially magnetized annular or disk magnets having more than two poles (e.g., at least four, at least six, or at least eight poles). The invention also relates to linear position sensor systems, which include sensor devices and magnetic sources in the form of bipolar magnets or elongated magnetic structures comprising multiple alternating magnetic poles.

[0152] More specifically, the present invention relates to magnetic sensor devices, methods, and systems that are robust to external disturbance fields and have error detection capabilities.

[0153] Please refer to the attached diagram.

[0154] Figure 1 A sensor structure is shown, comprising a first sensor S1 located at a first position X1 on the X-axis and a second sensor S2 located at a second position X2 on the X-axis, spaced apart from X1. Each of the first sensor S1 and the second sensor S2 includes a disk-shaped integrated magnetic concentrator (IMC) and two horizontal Hall elements arranged on opposite sides of the IMC on the X-axis. The first sensor S1 includes a first horizontal Hall element H1 configured to provide a first signal h1 and a second horizontal Hall element H2 configured to provide a second signal h2. The second sensor S2 includes a third horizontal Hall element H3 configured to provide a third signal h3 and a fourth horizontal Hall element H4 configured to provide a fourth signal h4.

[0155] To understand this invention, it is only necessary to know that signals h1 and h2 of the first sensor S1 can be combined to determine both the in-plane magnetic field component Bx1 (parallel to the sensor substrate) and the out-of-plane magnetic field component Bz1 (perpendicular to the sensor substrate). More specifically, the in-plane magnetic field component Bx1 can be calculated by subtracting the signals, while the out-of-plane magnetic field component Bz1 can be calculated by summing the signals. This can be expressed mathematically as follows:

[0156] Bx1=(h2-h1)[1]

[0157] Bz1=(h2+h1)[2]

[0158] Similarly, the in-plane magnetic field component Bx2 and the out-of-plane magnetic field component Bz2 at the second sensor position X2 can be determined, for example, according to the following formula:

[0159] Bx2=(h4-h3)[3]

[0160] Bz2=(h4+h3)[4]

[0161] Furthermore, these values ​​can be used to determine the in-plane magnetic field gradient ΔBx and the out-of-plane magnetic field gradient ΔBz, for example, according to the following formula:

[0162] ΔBx=Bx2-Bx1[5]

[0163] ΔBz=Bz2-Bz1[6]

[0164] The value ΔBx can also be referred to as dBx / dx, and the value ΔBz can also be referred to as dBz / dx. As mentioned above, the scaling factor "dx" is usually omitted because it is constant and the value obtained from the sensor element needs to be scaled anyway. For this reason, in this application, the terms "magnetic field gradient" and "magnetic field difference" have the same meaning.

[0165] As is well known, gradient signals ΔBx and ΔBz are highly insensitive to external disturbance fields.

[0166] Figure 2A This is a schematic block diagram of another sensor structure similar to the sensor structure that can be used in embodiments of the present invention. The sensor structure includes a first sensor at a first sensor position X1 and a second sensor at a second sensor position X2, the first and second sensors being spaced apart along the X-axis by a distance Δx, for example, in the range of 1.0 mm to 3.0 mm, preferably in the range of 1.5 mm to 2.5 mm. The first sensor S1 includes a horizontal Hall element H1 and a vertical Hall element V1, and is capable of measuring two orthogonal magnetic field components Bx1 and Bz1. The second sensor S2 includes a horizontal Hall element H2 and a vertical Hall element V2, and is capable of measuring two orthogonal magnetic field components Bx2 and Bz2. The vertical Hall elements V1 and V2 have a maximum sensitivity axis oriented in the X-direction. The horizontal Hall elements H1 and H2 have a maximum sensitivity axis oriented in the Z-direction. If the sensor elements are integrated in a semiconductor substrate, the magnetic field components Bx1 and Bx2 are parallel to the substrate, while the magnetic field components Bz1 and Bz2 are perpendicular to the substrate. Two differences or gradients can be derived from these signals, namely ΔBx = Bx2 - Bx1 and ΔBz = Bz2 - Bz1.

[0167] Figure 2BThis is a schematic block diagram of another sensor structure similar to the sensor structure that can be used in embodiments of the present invention. The sensor structure includes a first sensor S1 at a first sensor position X1 and a second sensor S2 at a second sensor position X2, the first sensor S1 and the second sensor S2 being spaced apart along the X-axis by a distance Δx, for example, in the range of 1.0 mm to 3.0 mm, preferably in the range of 1.5 mm to 2.5 mm. The first sensor S1 includes a horizontal Hall element H1 and two vertical Hall elements V1, V2, which are located on opposite sides of the horizontal Hall element H1 and have a maximum sensitivity axis oriented in the X-direction. Similarly, the second sensor S2 includes a horizontal Hall element H2 and two vertical Hall elements V3, V4, which are located on opposite sides of the horizontal Hall element H2 and have a maximum sensitivity axis oriented in the X-direction. The sum or average value of the signals v1 and v2 obtained from the vertical Hall elements V1 and V2 is proportional to the magnetic field component Bx1 at the first sensor position X1. The signal h1 obtained from the horizontal Hall element H1 is proportional to the magnetic field component Bz1 at the position of the first sensor. Similarly, Bx2 = (v3 + v4) and Bz2 = h2. Two differences or gradients can be derived from these signals: ΔBx = Bx2 - Bx1 and ΔBz = Bz2 - Bz1.

[0168] Figure 2C This is a schematic block diagram of another sensor structure similar to the sensor structure that can be used in embodiments of the present invention. The sensor structure includes a first sensor S1 at a first sensor position X1 and a second sensor S2 at a second sensor position X2, the first sensor S1 and the second sensor S2 being spaced apart along the X-axis by a distance Δx, for example, in the range of 1.0 mm to 3.0 mm, preferably in the range of 1.5 mm to 2.5 mm. The first sensor S1 includes a horizontal Hall element H1 and two vertical Hall elements V1, V2, located on opposite sides of the horizontal Hall element H1 and having a maximum sensitivity axis oriented in the Y direction, perpendicular to the X-axis but parallel to the substrate in which the sensor elements are implemented. Similarly, the second sensor S2 includes a horizontal Hall element H2 and two vertical Hall elements V3, V4, located on opposite sides of the horizontal Hall element H2 and having a maximum sensitivity axis oriented in the Y direction. Two magnetic field components By1 and Bz1, namely By1 = (v1 + v2) and Bz1 = h1, can be measured by the first sensor S1. Similarly, By2 = (v3 + v4) and Bz2 = h2. Two differences or gradients can be derived from these signals, namely ΔBy = By2 - By1 and ΔBz = Bz2 - Bz1.

[0169] Figures 1 to 2CEach of the sensors S1 and S2 is called a "2D magnetic pixel" because they are capable of measuring the values ​​of two orthogonal magnetic field components.

[0170] Figure 3 This is a schematic block diagram of a sensor structure similar to the sensor structure that can be used in embodiments of the present invention. The sensor structure includes a first sensor S1 at a first sensor position X1 and a second sensor S2 at a second sensor position X2, the first sensor S1 and the second sensor S2 being spaced apart along the X-axis by a distance Δx, for example, in the range of 1.0 mm to 3.0 mm, preferably in the range of 1.5 mm to 2.5 mm. Each sensor includes an integrated flux concentrator (IMC) and four horizontal Hall elements located near the outer periphery of the IMC and spaced apart by multiples of 90°. Two of these horizontal Hall elements are located on the X-axis. Each sensor is a 3D magnetic pixel capable of measuring three orthogonal magnetic field components Bx, By, and Bz at the corresponding sensor position. Three differences or gradients can be derived from these signals: Bx = Bx2 - Bx1, ΔBy = By2 - By1, and ΔBz = Bz2 - Bz1.

[0171] Figure 4 This is a schematic block diagram of another sensor structure similar to the sensor structure that can be used in embodiments of the present invention. The sensor structure includes a first sensor at a first sensor position X1 and a second sensor at a second sensor position X2, the first and second sensors being spaced apart along the X-axis by a distance Δx, for example, in the range of 1.0 mm to 3.0 mm, preferably in the range of 1.5 mm to 2.5 mm. Each sensor includes a horizontal Hall element H1, H2 and two vertical Hall elements having maximum sensitivity axes oriented in the vertical direction, i.e., one maximum sensitivity axis in the X direction and one maximum sensitivity axis in the Y direction. Each sensor is a 3D magnetic pixel capable of measuring three orthogonal magnetic field components Bx, By, and Bz. Three differences or gradients can be derived from these signals, namely Bx = Bx2 - Bx1, ΔBy = By2 - By1, and ΔBz = Bz2 - Bz1.

[0172] exist Figure 4 In the variant, each sensor has one horizontal Hall element and two pairs of vertical Hall elements, one pair having the following characteristics: Figure 2B The maximum sensitivity axes shown are oriented in the X direction, and a pair of axes with the following characteristics are... Figure 2C The maximum sensitivity axis is shown, oriented in the Y direction. Functionally, this variant also features two 3D magnetic pixels and is capable of measuring the same signal, but the signal-to-noise ratio (SNR) of the Bx and By signals is higher than that of the other two. Figure 4 It has a better signal-to-noise ratio.

[0173] Figure 5 part (a) and Figure 5 Part (b) shows an angular position sensor system 500 including a magnet 501 and a sensor device 502.

[0174] The magnet is a permanent magnet. It has a cylindrical shape with a bottom surface 512 and a top surface 511. The magnet is rotatable about an axis of rotation A. The magnet can be an axially magnetized toroidal or disk-shaped magnet having at least four pole pairs (also called quadrupoles), at least six pole pairs, or at least eight pole pairs. The magnet has an outer diameter Do, an outer radius Ro, and a height H. If the magnet is a toroidal magnet, it also has an inner radius Ri.

[0175] Sensor device 502 has a substrate, such as a semiconductor substrate. An orthogonal coordinate system with three axes X, Y, and Z is fixed to the sensor device. Axes X and Y are parallel to the substrate. Axe Z is perpendicular to the substrate. Direction X is tangent to an imaginary circle having a center located on the rotation axis A.

[0176] The magnet may have an outer diameter of 4.0 mm to 20 mm, for example, about 10 mm or about 12 mm.

[0177] The sensor device 502 is mounted at an "off-axis" position relative to the magnet and is oriented such that the substrate is oriented perpendicular to the rotation axis A of the magnet.

[0178] According to the principles of the present invention, the sensor device includes three magnetic sensors: a first sensor S1, a second sensor S2, and a third sensor S3. The three sensors S1, S2, and S3 may be located on a straight line, but this is not absolutely necessary, and alternatively (not shown), the sensors may be located on a triangle. The sensors may be equidistant from each other, but this is not absolutely necessary.

[0179] Sensor device 502 is positioned relative to magnet 501 such that the second sensor S2 is located at a radial distance Rs from the rotation axis A and an axial distance “g” from the magnet (in this example, above the top surface 511). The radial distance Rs can be 20% to 80%, 30% to 70%, or 40% to 60% of the outer radius Ro of the magnet. The axial distance “g” can be 0.5 mm to 5.0 mm, for example, about 2.0 mm, but the invention is not limited thereto, and other values ​​may also be used.

[0180] Figure 5 Part (c) Figure 5 part (d) and Figure 5 Section (g) shows three illustrative sensor structures that can be implemented in sensor device 502, but the invention is not limited thereto, and other sensor elements, such as MR (magnetoresistive) elements, may also be used.

[0181] Importantly, each magnetic sensor S1, S2, S3 is capable of measuring at least a first magnetic field component Bx oriented in a first direction X and a second magnetic field component Bz oriented in a second direction Z perpendicular to the first direction X.

[0182] exist Figure 5 In part (c), the six magnetic field components can be determined as follows:

[0183] Using signals from S1: Bx1 = (h2 - h1); Bz1 = (h2 + h1);

[0184] Using the signal from S2: Bx2 = (h4 - h2); Bz2 = (h4 + h2);

[0185] Using signals from S3: Bx3 = (h6 - h5); Bz3 = (h6 + h5);

[0186] In embodiments of the present invention, the sensor device further includes processing circuitry configured to:

[0187] a) Determine the first difference ΔBx13 between the first magnetic field components Bx1 and Bx3 provided by the first sensor S1 and the third sensor S3; and use it for

[0188] - Determine the second difference ΔBz13 between the second magnetic field components Bz1 and Bz3 provided by the first sensor S1 and the third sensor S3; and use it for

[0189] - The first angle θ is calculated based on the ratio of the first difference ΔBx13 to the second difference ΔBz13. 主要 And used to output the first angle θ 主要 ; and used for

[0190] b) Determine the third difference ΔBx12 between the first magnetic field component Bx2 provided by the second sensor S2 and the first magnetic field component Bx1 provided by the first sensor S1; and use it for

[0191] c) Determine the fourth difference ΔBz12 between the second magnetic field component Bz2 provided by the second sensor S2 and the second magnetic field component Bz1 provided by the first sensor S1; and use it for

[0192] d) Determine the second angle θaux12 based on the third difference ΔBx12 and the fourth difference ΔBz12; and use it for

[0193] e) Output the second angle θaux12 and / or output from the first angle θ 主要 The diagnostic signal is derived by comparing it with the second angle θaux12.

[0194] The angle can be calculated based on the ratio of the first difference to the second difference (e.g., using the arctangent function of that ratio). Alternatively, the angle can be determined using interpolation, a lookup table, or any other suitable method.

[0195] Steps (a) to (d) can be summarized as: "Calculate the first angle θ based on ΔBx13 and ΔBz13". 主要 And the second angle θaux12 is calculated based on ΔBx12 and ΔBz12. The first angle (also known as the "primary angle") is the angle to be measured; the second angle (also known as the "auxiliary angle") can be used to detect errors. Error detection can be performed by the sensor device itself or externally to the sensor device (e.g., in the ECU).

[0196] In fact, angle θ 主要 The angle θaux12 deviates slightly from the constant angle ε12, depending on the size of the sensor device and the magnet, as well as their relative positions. This value can be determined through simulation or calibration and is stored in the sensor device's non-volatile memory. Testing for error may include testing the angle θ. 主要 Whether it matches the angle (θaux12+ε12) within a certain tolerance range. Alternatively, the offset can be simply ignored, and θ... 主要 Compare θaux12 with a slightly larger tolerance margin.

[0197] In one embodiment, the sensor device may determine and output a diagnostic signal, and optionally also determine and output a second angle. In another embodiment, the sensor device itself does not perform error detection and only outputs a first angle and a second angle.

[0198] It is important to note that both angles are calculated based on the magnetic field difference (or gradient), and therefore are highly insensitive to external disturbance fields.

[0199] The first angle is generally more accurate (in terms of SNR) because the distance d13 between sensors S1 and S3 is greater than the distance d12 between sensors S1 and S2, but the second angle θaux12 is found to be accurate enough to detect the error.

[0200] In a preferred embodiment, the distance d13 between the external sensors S1 and S3 is in the range of 1.0 mm to 3.0 mm, or in the range of 1.5 mm to 2.5 mm, for example, equal to about 2.2 mm. This means that preferably, a substrate with three sensors (e.g., such as...) Figure 5 The size of (e) shown does not need to be larger than that of a device with only two sensors (e.g., as shown in section (e)). Figure 1 The size of the substrate (as shown).

[0201] The first sensor S2 can be located midway between S1 and S3, but this is not absolutely necessary, and S2 can be positioned closer to S3, for example, at a distance d23 of approximately 0.4 mm from S3. The closer S2 is to S3, and therefore the farther S1 is from S2, the larger the amplitudes of signals ΔBx12 and ΔBz12 will be, and therefore the better the accuracy of the second angle will be. Positioning the second sensor S2 at a distance d23 of only 0.4 mm from S3 is not trivial, because it is known that IMCs bend magnetic field lines, and the typical diameter of an IMC is approximately 150 μm to 250 μm. Those skilled in the art cannot predict that two IMC disks so close to each other will not interfere.

[0202] In the example above, the first angle θ 主要 It is calculated based on ΔBx13 and ΔBz13 (obtained from S1 and S3), and the second angle θaux12 is calculated based on ΔBx12 and ΔBz12 (obtained from S1 and S2).

[0203] In the variation, the first angle θ 主要 The second angle θaux23 is calculated based on ΔBx13 and ΔBz13 (obtained from S1 and S3), and is also calculated based on ΔBx23 and ΔBz23 (obtained from S2 and S3). This is possible, and the second angle will also have a small (fixed) offset from the primary angle. Diagnostic tests may include testing θ (using predefined standards). 主要 Whether (θaux23+ε23) is a sufficient match.

[0204] In the variation, the first angle θ 主要 The angle θaux12 is calculated based on ΔBx13 and ΔBz13 (obtained from S1 and S3), and the angle θaux23 is calculated based on ΔBx12 and ΔBz12 (obtained from S1 and S2). The latter two angles are averaged, and the average value (θaux12 + θaux23) / 2 is considered the second angle. If the second sensor is located between S1 and S3, this second angle has no offset relative to the primary angle; therefore, diagnostic testing may include testing θ (using predefined standards). 主要 Whether (θaux12+θaux23) / 2 is a sufficient match.

[0205] In another variation or further variation, the second sensor S2 is located midway between S1 and S3, and in addition to the principal angle, four differences are calculated: ΔBx12, ΔBz12, ΔBx23, and ΔBz23, and the angle θaux3 is calculated using the following formula: θaux3=atan2[(ΔBx23-ΔBx12),(ΔBz23-ΔBz12)]. This angle θaux3 should be relative to the principal angle θ. 主要 Phase shift 90°.

[0206] These variations are from Figure 5 part (e) and Figure 5 Formula references in part (f).

[0207] So far, the main descriptions have included features such as Figure 5 The invention relates to embodiments of sensor devices with the sensor structure described in section (c), but is not limited thereto, and devices having such sensor structures can also be used. Figure 5 The sensor device with the sensor structure shown in section (d) above. The above concerns sensor devices with the sensor structure shown in section (d). Figure 5 Anything mentioned in the embodiment of the sensor structure shown in section (c) also applies here, the only difference being that the magnetic field components are measured in a different manner. Figure 5 In part (d), the six magnetic field components can be determined as follows:

[0208] Using signals from S1: Bx1 = v1; Bz1 = h1;

[0209] Using signals from S2: Bx2 = v2; Bz2 = h2;

[0210] Using signals from S3: Bx3 = v3; Bz3 = h3;

[0211] However, the same formula used for the difference as described above can be used here. For example:

[0212] ΔBx12=Bx2-Bx1; ΔBz12=Bz2-Bz1;

[0213] ΔBx13=Bx3-Bx1; ΔBz13=Bz3-Bz1;

[0214] ΔBx23=Bx3-Bx2; ΔBz23=Bz3-Bz2;

[0215] Furthermore, the same formulas used for primary angles and secondary angles as described above also apply. Figure 5 The sensor structure of part (d).

[0216] Will understand, Figure 5 Part (c) and Figure 5The sensor structure in part (d) includes three "2D magnetic pixels," each capable of measuring a magnetic field component Bx parallel to the substrate and a magnetic field component Bz perpendicular to the substrate. However, the invention is not limited to this, and other sensor structures can also be used, such as... Figure 5 The sensor structure shown in section (g) comprises three sensors S1, S2, and S3, each capable of measuring three magnetic field components. Regarding... Figure 5 The same formula described in part (c) also applies, where only the Bx and Bz components are used, and the By component is ignored. However, Figure 5 The sensor structure in section (g) offers additional advantages, comprising three IMC disks, each with four horizontal Hall plates. Despite the fact that... Figure 5 The By component is not used in the arrangement of part (a), but additional tests can be performed, thereby increasing the probability of detecting errors. In fact, component Bz1 can be calculated as (h1+h2) or (h3+h4), which should (under normal circumstances) provide approximately the same result. This test is referred to herein as the "Bz test". Therefore, when a mismatch between (h1+h2) and (h3+h4) is detected, an error is detected, which can be an error related to Hall element H1 or H2. A similar test can be performed by sensor S2 or sensor S3. Therefore, Figure 5 The structure of part (g) is used in Figure 5 The sensor device 502 in part (a) provides when providing with Figure 5 The sensor structure in part (c) has the same function as the sensor in part (c), plus three additional tests to indicate potential errors.

[0217] also, Figure 5 The structure of part (g) not only allows for the detection of errors but also allows for the correction of certain errors. In fact, assuming the "Bz test" passes for sensors S1 and S2 but fails for sensor S3, this could mean that one of the Hall elements H9 to H12 is defective, potentially H9. Then, the output angle θaux12 (based on signals obtained from S1 and S2, but not S3) instead of the output θ 主要 (Based on the signals obtained from S1 and S3) it might be better. In such an embodiment, the second sensor is preferably located in the middle between S1 and S3, such that the signal-to-noise ratio of the angle derived from the signals obtained from S1 and S2 is the same as the signal-to-noise ratio of the angle derived from the signals obtained from S1 and S3.

[0218] Alternatively, if the Bz test fails for S2 but passes for S1 and S3, this could mean that one of the sensor elements H5 through H8 is likely defective, and the main angle θ is... 主要(Based on S1 and S3 instead of S2) is correct, although in fact the angle θ 主要 It does not match either θaux12 (based on signals obtained from S1 and S2) or θaux23 (based on signals obtained from S2 and S2).

[0219] Figure 6 part (a) and Figure 6 Part (b) illustrates an angle sensor system 600 including a cylindrical magnet 601 and a magnetic sensor device 602, the magnetic sensor device 602 including a substrate and oriented such that the substrate is parallel to the rotation axis A of the magnet. This sensor system can be considered as... Figure 5 part (a) and Figure 5 The sensor system 500 in part (b) is a variation thereto, and many of the same principles apply as well, such as using, for example, three sensors S1, S2, and S3 spaced apart along the X-axis, each capable of measuring two orthogonal magnetic field components, and calculating the principal angle θ based on signals obtained from the first sensor S1 and the third sensor S3. 主要 And calculate one or more auxiliary angles, such as θaux12 (based on signals obtained from S1 and S2) or θaux23 (based on signals obtained from S2 and S3) or θaux3 (based on signals obtained from S1, S2, and S3), and test whether the primary angle matches one or more of these auxiliary angles. The sensor elements S1 to S3 of the sensor device 602 must also be able to measure a first magnetic field component Bx in the X direction tangent to an imaginary circle centered on the rotation axis A, but they need to be able to measure a second magnetic field component oriented in the Y direction parallel to the rotation axis of the magnet and parallel to the substrate of the sensor device. This is used in... Figure 5 Part (c) or Figure 5 It is impossible to use the sensor structure shown in section (d), but it is not possible when using Figure 6 Part (c) or Figure 6 The sensor structure shown in section (d) is possible. It should be noted that a sensor structure with an MR element can also be used, which is also capable of measuring Bx and By parallel to the substrate.

[0220] Figure 6 Section (c) shows how the magnetic field components Bx and By can be derived from the signal provided by the horizontal Hall element.

[0221] Figure 6 Section (d) illustrates how the magnetic field components Bx and By can be derived from the signal provided by the vertical Hall element.

[0222] All other things described above also apply here after the necessary modifications (meaning especially after replacing Bz with By and ΔBz with ΔBy).

[0223] Figure 6 The formula for part (g) is applicable Figure 6 The sensor structure of part (c) can be used as an additional test if needed.

[0224] Figure 7 part (a) and Figure 7 Part (b) illustrates an angle sensor system 700 including a cylindrical magnet 701 and a magnetic sensor device 702 comprising a substrate. The sensor device 702 is mounted "on or near the equator" and oriented such that the substrate is perpendicular to the axis of rotation of the magnet 701. The radial position Rs of the sensor device can be 105% to 200%, or 105% to 175%, or 105% to 150%, or 110% to 150% of the outer radius Ro of the cylindrical magnet. The magnet is preferably a radially magnetized toroidal magnet having a plurality of pole pairs, for example, at least four, at least six, or at least eight pole pairs.

[0225] Figure 7 Part (c) and Figure 7 Part (d) shows that it can be made by Figure 7 The sensor device 702 in part (a) is used to measure the angular position of the sensor device relative to the magnet and to detect error in the sensor structure. Figure 6 Part (c) to Figure 6 The exact same formula provided in section (g) also applies here.

[0226] The sensor device 702 is preferably located at a substantially midway axial position between the top surface 711 and the bottom surface 712, but this position is not critical.

[0227] Figure 8 Part (a) to Figure 8 Section (c) illustrates an angle sensor system 800 including a cylindrical magnet and a magnetic sensor device 802, which includes a substrate. The sensor device 802 is mounted "on or near the equator" and oriented such that the substrate is parallel to the axis of rotation of the magnet. The radial position Rs of the sensor device can be 105% to 200%, or 105% to 175%, or 105% to 150%, or 110% to 150% of the outer radius Ro of the cylindrical magnet. The magnet is preferably a radially magnetized toroidal magnet having a plurality of pole pairs, for example, at least four, at least six, or at least eight pole pairs.

[0228] Figure 8 part (d) to Figure 8 Part (f) shows that it can be made by Figure 8 The sensor device 802 in part (a) is a sensor structure used to measure the angular position of the sensor device relative to the magnet and to detect errors. Figure 5 Part (c) to Figure 5 The sensor structure and formula provided in section (h) are exactly the same as those provided here.

[0229] The sensor device 802 is preferably located at a substantially midway axial position between the top surface 811 and the bottom surface 812, but this position is not critical.

[0230] Figure 9 Part (a) illustrates a linear sensor system 900 including an elongated magnetic structure 901 and a magnetic sensor device 902. The elongated magnetic structure 901 includes a plurality of alternating magnetic poles, and the magnetic sensor device 902 includes a substrate movable relative to the magnetic structure. The sensor device 902 has a substrate perpendicular to the residual magnetic field inside the magnetic structure. Figure 9 Part (b) to Figure 9 Part (d) shows that it can be made by Figure 9 The sensor device in part (a) is a sensor structure used to measure linear position and detect errors. (and) Figure 5 Part (c) to Figure 5 The sensor structure and formulas provided in section (h) are identical to those provided here. In addition to determining the angle, the processing circuitry of sensor device 902 can be further configured to convert the angle value into a linear value in a known manner. Sensor device 902 is preferably located at a lateral position (Y direction) substantially in the middle of the magnetic structure, but this position is not critical.

[0231] Figure 10A A linear position sensor system 1000 is shown, which can be considered as... Figure 9 A special case or variant of the linear position sensor system 900, wherein the magnet 1001 is a bipolar magnet, rather than a magnetic structure comprising multiple alternating magnetic poles.

[0232] Figure 10B A linear position sensor system 1020 is shown, which can be considered as... Figure 9 Another variation of the linear position sensor system 900 in part (a).

[0233] Figure 10C A linear position sensor system 1040 is shown, which can be considered as... Figure 9Another variation of the linear position sensor system 900 in part (a).

[0234] exist Figures 10A to 10C In all embodiments, the sensor device may be movable relative to the magnet in the X direction, or the magnet may be movable relative to the sensor device in the X direction.

[0235] Figure 11 It shows that it can be made by Figure 5 (a) part or Figure 6 (a) part or Figure 7 (a) part or Figure 8 (a) part or Figure 9 (a) part or Figures 10A-10C A flowchart illustrating a method performed by a position sensor device in a position sensor system. The method includes the following steps:

[0236] i) Measure (1101) a first magnetic field component Bx1, Bx2, Bx3 oriented in a first direction X at three sensor locations; and a second magnetic field component (e.g., Bz1, Bz2, Bz3 or By1, By2, By3 or both) oriented in a second direction (Z or Y) perpendicular to the first direction X.

[0237] ii) Determine (1102) the first difference ΔBx13 between the first magnetic field components Bx1 and Bx3 obtained from the first sensor S1 and the third sensor S3; and

[0238] iii) Determine the second difference ΔBz13 between the second magnetic field components Bz1 and Bz3 obtained from these sensors; and

[0239] iv) Determine the first angle θ based on the first difference ΔBx13 and the second difference ΔBz13 主要 (For example, the arctangent as the ratio of these differences), and output the first angle θ. 主要 ;

[0240] v) Determine (1103) the third difference ΔBx12 between the first magnetic field components Bx1 and Bx2 obtained from the first sensor S1 and the second sensor S2; and

[0241] vi) Determine the fourth difference ΔBz12 between the second magnetic field components Bz1 and Bz2 obtained from these sensors; and

[0242] vii) Determine the second angle θaux12 based on the third difference ΔBx12 and the fourth difference ΔBz12 (e.g., the arctangent of the ratio of these differences);

[0243] viii) Optionally, the first angle θ 主要Compare with the second angle θaux12 (1104); and output the second angle θaux12 and / or a diagnostic signal based on the comparison result.

[0244] This method describes only one of the possible second angles, namely θ. 主要 =atan2(ΔBx13,ΔBz13) and θaux12 =atan2(ΔBx12,ΔBz12), but the present invention is not limited thereto, and many variations are possible.

[0245] For example, in a variant, steps i) to iv) further involve determining a principal angle based on the Bx and Bz signals obtained from the first and third sensors, but steps v) to ix) involve determining an auxiliary angle θaux23 = atan2(ΔBx23, ΔBz23) based on the signals obtained from the second and third sensors; comparing the principal angle with the auxiliary angle θaux23, thereby optionally taking into account a small offset ε12; and outputting the angle or the result of the comparison.

[0246] For example, in the variant, auxiliary angles θaux12 = atan2(ΔBx12, ΔBz12) and θaux23 = atan2(ΔBx23, ΔBz23) are determined, their average value is calculated, and this average value is compared with the principal angle.

[0247] In another variation, the auxiliary angle is calculated based on the following formula: θaux3=atan2[(ΔBx23-ΔBx12),(ΔBz23-ΔBz12)], and the principal angle is compared with this auxiliary angle θaux3 to account for an offset of approximately 90°.

[0248] Figure 12 An electrical block diagram of a circuit that can be used in the above-described position sensor device is shown, but the invention is not limited thereto, and other block diagrams may also be used.

[0249] Circuit 1210 includes multiple magnetic sensor elements, a processing unit 1230, and a non-volatile memory 1231. This block diagram can be used, for example, with a similar... Figure 5 In the sensor device with the sensor structure of part (c), the sensor device includes six horizontal Hall elements, but the invention is not limited thereto. For example, in a sensor device having a similar... Figure 5 In the case of the sensor structure in part (d), the sensor device includes three horizontal Hall elements and three vertical Hall elements. The sensor device has a similar... Figure 5 In the case of the sensor structure in part (e), the sensor device will include twelve horizontal Hall elements. When the sensor device has a similar... Figure 6In the case of the sensor structure in part (e), the sensor device includes six vertical Hall elements. And as mentioned above, magnetoresistive (MR) elements can also be used instead of vertical Hall elements.

[0250] Processing unit 1230 can be configured to perform Figure 11 Any of the methods described above. Sensor device 1210 may be connected to second processor 1240, such as electronic control unit 1240, by means of one or more wired or wireless means (e.g., via radio frequency link RF or infrared link IR).

[0251] The sensor device outputs at least one principal angle θ 主要 Depending on the implementation method, as described above, sensor device 1210 may also output one or more of the following values: θaux12; θaux23; the average of θaux12 and θaux23; θaux3. The sensor device may perform matching or consistency checks internally and provide test results as diagnostic signals, but this is not strictly necessary, and comparisons or consistency checks may also be performed by an external processor.

[0252] Processing unit 1230 may include a digital processor, which may optionally include or be connected to non-volatile memory 1231. The memory may be configured to store one or more constants (e.g., one or more of offset values ​​ε12, ε23) for determining whether the angle matches or deviates excessively. Digital processor 1230 may be, for example, an 8-bit processor or a 16-bit processor.

[0253] Although not explicitly shown, circuit 1210 may further include one or more components or sub-circuits selected from the group consisting of: bias sources (e.g., current sources, voltage sources), amplifiers, differential amplifiers, analog-to-digital converters (ADCs), etc. The ADC may have a resolution of at least 8 bits, at least 10 bits, at least 12 bits, at least 14 bits, or at least 16 bits.

Claims

1. A position sensor device, comprising: A substrate, the substrate including a first magnetic sensor, a second magnetic sensor and a third magnetic sensor spaced apart in a first direction, each magnetic sensor being capable of measuring at least a first magnetic field component oriented in the first direction and a second magnetic field component oriented in a second direction perpendicular to the first direction; A processing circuit, connected to the magnetic sensor, and configured to: a) Determine a first difference between the first magnetic field components provided by the first magnetic sensor and the third magnetic sensor, and be configured to determine a second difference between the second magnetic field components provided by the first magnetic sensor and the third magnetic sensor, and to calculate a first angle based on the ratio of the first difference to the second difference, and to output the first angle; b) and used to determine a third difference between the first magnetic field component provided by the second magnetic sensor and the first magnetic field component provided by one of the first magnetic sensor and the third magnetic sensor; c) and for determining a fourth difference between the second magnetic field component provided by the second magnetic sensor and the second magnetic field component provided by one of the first magnetic sensor and the third magnetic sensor; d) and is used to determine a second angle based on the third difference and the fourth difference, and is used to output the second angle and / or a diagnostic signal derived from the comparison of the first angle and the second angle or a value derived therefrom.

2. The position sensor device as described in claim 1, characterized in that, The first magnetic sensor, the second magnetic sensor, and the third magnetic sensor are located in a straight line; Alternatively, the first magnetic sensor, the second magnetic sensor, or the third magnetic sensor may be located at the corner of the triangle.

3. The position sensor device as described in any one of the preceding claims, characterized in that, The second angle is calculated according to the following formula: θaux12=atan2(∆Bx12, ∆Bz12), where θaux12 is the second angle, ∆Bx12 is the third difference, and ∆Bz12 is the fourth difference.

4. The position sensor device as described in claim 1, characterized in that, The processing circuit is further configured to calculate a fifth difference between the first magnetic field component provided by the second magnetic sensor and the first magnetic field component provided by the other of the first magnetic sensor and the third magnetic sensor. Furthermore, the processing circuit is configured to calculate a sixth difference between the second magnetic field component provided by the second magnetic sensor and the second magnetic field component provided by the other of the first magnetic sensor and the third magnetic sensor; Furthermore, the processing circuit is configured to calculate the second angle based on the third difference and the fourth difference, as well as the fifth difference and the sixth difference.

5. The position sensor device as described in claim 1, characterized in that, The first magnetic sensor, the second magnetic sensor, and the third magnetic sensor are located in a straight line. And the second magnetic sensor is located between the first magnetic sensor and the third magnetic sensor.

6. The position sensor device as described in claim 1, characterized in that, Each of the first magnetic sensor, the second magnetic sensor, and the third magnetic sensor includes an integrated magnetic concentrator (IMC) and two horizontal Hall elements arranged on opposite sides of the IMC.

7. The position sensor device as described in claim 1, characterized in that, Each of the first magnetic sensor, the second magnetic sensor, and the third magnetic sensor includes a horizontal Hall element and a vertical Hall element; Alternatively, each of the first, second, and third magnetic sensors may include a horizontal Hall element and a pair of vertical Hall elements located on opposite sides of the horizontal Hall element.

8. The position sensor device as described in claim 1, characterized in that, Each of the first magnetic sensor, the second magnetic sensor, and the third magnetic sensor includes two vertical Hall elements having maximum sensitivity directions perpendicular to each other; Alternatively, each of the first, second, and third magnetic sensors may include two pairs of vertical Hall elements arranged around a virtual square.

9. The position sensor device as described in claim 1, characterized in that, Each of the first magnetic sensor and the third magnetic sensor includes an integrated magnetic concentrator and four horizontal Hall elements spaced apart at multiples of 90° in angle, the four horizontal Hall elements consisting of a first Hall element and a second Hall element spaced apart along the first direction, and a third Hall element and a fourth Hall element spaced apart in a direction perpendicular to the first direction. The first angle is calculated based on signals obtained from the first Hall element and the second Hall element; Furthermore, the sensor device is configured to determine a first sum as the sum of signals obtained from the first Hall element and the second Hall element, and to calculate a second sum as the sum of signals obtained from the third Hall element and the fourth Hall element, and to take into account the matching of the first sum and the second sum when determining the diagnostic signal.

10. A magnetic position sensor system, comprising: A magnetic source, said magnetic source being used to generate a magnetic field having at least two magnetic poles; The position sensor device as described in any of the preceding claims is movable relative to the magnetic source and vice versa.

11. The magnetic position sensor system as described in claim 10, characterized in that, The magnetic source is a permanent magnet that can rotate around the rotation axis; Furthermore, the position sensor device is mounted at a non-zero radial distance from the rotation axis and is oriented such that the first direction is tangent to an imaginary circle having a center on the rotation axis.

12. The magnetic position sensor system as described in claim 11, characterized in that, The sensor device is arranged in one of the following ways: i) wherein the substrate of the sensor device is oriented perpendicular to the rotation axis, and the magnet has an outer radius, and the geometric center of the magnetic sensor of the sensor device is located at a radial position of 30% to 95% of the outer radius, and at an axial position above the top surface or below the bottom surface of the magnet; ii) wherein the substrate of the sensor device is oriented parallel to the rotation axis, and the magnet has an outer radius, and the geometric center of the magnetic sensor of the sensor device is located at a radial position of 30% to 95% of the outer radius, and at an axial position above the top surface or below the bottom surface of the magnet; iii) wherein the substrate of the sensor device is oriented perpendicular to the rotation axis, and the magnet has an outer radius, and the geometric center of the magnetic sensor of the sensor device is located at a radial position of 105% to 200% of the outer radius, and at an axial position substantially inside the bottom surface or the top surface, or at an axial position between the bottom surface and the top surface. iv) wherein the substrate of the sensor device is oriented parallel to the rotation axis, and the magnet has an outer radius, and the geometric center of the magnetic sensor of the sensor device is located at a radial position of 105% to 200% of the outer radius, and at an axial position substantially inside the bottom surface or the top surface, or at an axial position between the bottom surface and the top surface. v) wherein the substrate of the sensor device is oriented perpendicular to the rotation axis, and the magnet has an outer radius, and the geometric center of the magnetic sensor of the sensor device is located at a radial position of 105% to 200% of the outer radius, and at an axial position above the top surface or below the bottom surface of the magnet. vi) wherein the substrate of the sensor device is oriented parallel to the rotation axis, and the magnet has an outer radius, and the geometric center of the magnetic sensor of the sensor device is located at a radial position of 105% to 200% of the outer radius, and at an axial position above the top surface or below the bottom surface of the magnet.

13. The magnetic position sensor system as described in claim 10, characterized in that, The magnetic source is a bipolar magnet, or an elongated structure extending in the longitudinal direction and comprising a plurality of at least two alternating magnetic pole pairs; and The position sensor device is movable in the longitudinal direction at a non-zero distance from the magnetic source.

14. The magnetic position sensor system as described in claim 13, characterized in that, The substrate of the sensor device is oriented orthogonal to the orientation of the residual magnetic field inside the magnetic source, and the second direction is oriented perpendicular to the substrate; Alternatively, the substrate of the sensor device may be oriented parallel to the orientation of the residual magnetic field inside the magnetic source, and the second direction may be oriented parallel to the substrate.

15. The magnetic position sensor system as described in any one of claims 10 to 14, The device further includes a second processor, which is communicatively connected to the position sensor device and configured to perform one of the following operations: i) Receive the first angle, and receive the second angle, and compare the first angle and the second angle to detect an error; ii) Receive the first angle and receive a diagnostic signal indicating the error.

16. A method for determining a linear or angular position based on signals obtained from a first magnetic sensor, a second magnetic sensor, and a third magnetic sensor, the first, second, and third magnetic sensors being spaced apart along a first direction, and each of the first, second, and third magnetic sensors being capable of measuring at least two orthogonal magnetic field components; the method comprising the steps of: a) Determine a first difference and a second difference between the signals provided by the first magnetic sensor and the third magnetic sensor; b) Determine and output the first angle based on the first difference and the second difference; c) Determine the third difference and the fourth difference between the signals provided by one of the first magnetic sensor and the third magnetic sensor and the second magnetic sensor; as well as d) Determine the second angle based on the third difference and the fourth difference; e) Output the second angle and / or a diagnostic signal based on the comparison between the first angle and the second angle.

17. The method of claim 16, wherein, When step e) includes outputting a diagnostic signal based on a comparison between the first angle and the second angle, or includes outputting the second angle and a diagnostic signal based on a comparison between the first angle and the second angle, the method further includes the following steps: f) Compare the first angle with the second angle.

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